dek pro and dek pro xf - asm assembly...

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DEK Pro and DEK Pro XF ADVANCED UNDERSTENCIL CLEANING CHEMISTRIES

Designed specifically for understencil cleaning, DEK Pro and DEK Pro XF improve process performance and reduce print defects.

They are safer, cleaner and more environmentally friendly than IPA and traditional solvent cleaners and are compliant with all industry standards and environmental regulations.

Health, Safety and the Environmentn DEKProXFhasnoflashpointn DEKProhasahighflashpointof67ºC (IPA12ºC)

n Safertouse,transport,storeanddisposeofn Manufacturedusingbiodegradablematerialsn DEKProXFislowVOC

Reduce Print Defectsn Noimpactonthixotropicpropertiesofthesolderpaste

n Reduceriskofsolderslumpandsolderballing

n Residue-freeafterevaporation

Compliant and Compatiblen CompatiblewithallSolderPasteMaterialsn RoHsandReachcompliant

Part number Description Volume Available for431513 DEKProXFCleaningAgent 1litre VacuumPrinters431514 DEKProXFCleaningAgent 5litres VacuumPrinters

DEKPROXFPRODUCTRANGE

Property ValueFormulation SolventBasedApplication Pure(notdiluted)FlashPoint 67°CVapourPressure 3mbar@20°CBoilingRange 100–170°CpHValue NeutralHMISRatingHealth– 1–2-0Flammability–ReactivityWorkingTemperature WorkroomTemperatureStorageandTransport NoSpecialRequirements

DEKPROTECHNICALSPECIFICATIONS

Compatiblewithallsolderpastes–leaded

andlead-freeIndustryCompliantEffectiveandthoroughcleaningagentsthatcleanwithoutaffectingsolderpastefluxchemistry

DEK Pro and DEK Pro XF UNDERSTENCIL CLEANING AGENTS

DEKProXFislowVOC,makingitmore

environmentallyfriendly

Part number Description Volume Available for173483 DEKProCleaningAgent 1litre VacuumandNonVacuumPrintersandManualCleaning173485 DEKProCleaningAgent 5litres VacuumandNonVacuumPrintersandManualCleaning431093 DEKProCleaningAgent 20litres VacuumandNonVacuumPrintersandManualCleaning

DEKPROPRODUCTRANGE

Property ValueFormulation WaterBasedApplication Pure(notdiluted)FlashPoint NoneVapourPressure 20mbar@20°CBoilingRange 80–200°CpHValue NeutralHMISRatingHealth– 0–0-0Flammability–ReactivityWorkingTemperature WorkroomTemperatureStorageandTransport NoSpecialRequirements

DEKPROXFTECHNICALSPECIFICATIONS

UsingIPAinscreenprinterscancausedefects!Chemistryeffectonsolderpasteprintedoncoppersubstratewetwithcleaningagent

IPArelatedpastecollapse DEK Pro XF

Americas:ASM Assembly Systems USA Inc.Tel+8473681155Email:ussales@asmpt.com

Europe:ASM Assembly Systems Northern EuropeTel+44(0)1305208328Email:sales@asmpt.com

Asia:ASM Assembly Systems Singapore PTE LTDTel+6564195867Email:asiaspares@asmpt.com

www.dek.com