반도체산업의 기초분석 - kiet 캐시(cache), 전자오락기 등에 사용 v램...

<30393131323020B9DDB5B5C3BCBBEABEF72DB1E2C3CABAD0BCAE2830393131292D4850BFEB2E687770>( ) ( )
.
, ,
, .
,
. ,
, , , ,
.
(Si),(Ge) ,
.
,

.
.
,
.
, (eleven nine),
99.999999999% .
- 2 -
, 1959
. 1958
(TI) (J. S. Kilby) 1
, 3, 1 5
(IC : Integrated Circuit)
.
100 (SSI : Small
Scale Integrated circuit), 1001000 (LSI
: Large Scale Integrated circuit), 1
(VLSI : Very LSI), 10
(ULSI : Ultra LSI) . 1G DRAM 1
11 7,000 .
< 1>
()
. , , ,
- 3 -
.
.

(RAM : random access memory)
(ROM : read only
memory) .
.
S D , D
,
PC . S
. S

, ,
, , .
- 4 -
SD, D, DDR,
DDR2
(cache),

(ROM)
EP
EEP ROM RAM

Flash

HDD
NOR( ) NAND( )




IC

Unit, Micro Controller Unit, Digital Signal Processor
Logic
IC
Analog
IC
IC Audio/Video, ,

LDI LCD driver IC IC

(discrete)
IC
: .
(flash memory) D S
.
,
.
- 5 -
.
(Logic IC), IC, (discrete),
.
,
.

,

.




,
.
PC TV, DVD
, , , ,
. ,
.
-
, 30
, 80 .
, ,
.
(IDM : Integrated Device Manufacturer),
(Fabless), (Foundry), IP(Chipless)
.
. IP (Chipless
) ,
, ,
IP R&D .
- (Fabless) ,
IC
.
- 7 -
.
, , ,
.

, .
< 3>


-
-
Intel, ,
- ,



,

ASE Test, Amkor,
Physical IP, System IP, IP
ARM, Rambus,
Artisan, TTCom,
- 8 -
, , DSP,
, ASSP, ASIC, IC
, ,
< 4>



(IDM)
, ,
.
< 5>
(90 ) ⇒ IC (21)
PC ,
0.5∼0.18 0.15∼Nano
2∼3
(IDM) (, , , )
: .
SoC ,
,
. SoC
, , .
SoC
, , ,
,
, .
,
.
SoC
.
SoC
. SoC
, SoC
.
< 6>

SoC
( )→
()
,
( )
,
PC
.
.
, , ,
.
90nm (2003)→60nm(2005) .
160(92) → 200 (95)→ 300(2002)
.
,
D .


. (SoC)
.
() ,
.
, 1980 D
, 1990
. 2000
.
1980 1990 2000


DB

(1)
()
(81.4%) , .
< 2 > (2008)
(2,486 )
- 12 -
,

.
.
, PC, TV
.
- , ,
.
,
.
< 8>
: %
4.5 2.3 -22.0 7.0 8.9
-1.1 -19.9 -20.3 9.8 8.6
D -7.4 -23.2 -26.9 11.9 12.0
26.0 -15.4 -2.1 13.7 9.5
: WSTS (2009. 5).
2009
, 22% 1,947
. D 27% 176
, 2% 120
.
. (MS) 7

.

. SSD(Solid State Disk)
, 2010
.
2010 ,
.
2010

.
.
2010 .

, 2010 .
- 19801990 ,
2010 . 2010
, ,
.
- 14 -

.
(2)

. ,

.
,
. 2009 1
,
. 32,500
(5,700) , .
· · 2009 9
100% ,
.
Co(TMC) . 6
, · 1
2 .
, TMC
. ,
.
, , , TMC
D , , , .
- 15 -

D , TMC
.
D , ,
-TMC , -- 4
.
,
, 1 ,
.

. 2008
, (OKI)
2008 10 .
2009 , LSI , NEC

.
.

,
. 2009 6 “
()” 400
- 16 -
, .
, 2009 7 DRAM
.
DRAM 4
TMC . 4 Rexchip
Electronics Corp., Powerchip Semiconductor Corp., ProMOS
Technologies, Winbond Electronics Corp..
'(TMC)'
. 9( 1)
.
TMC 2009 7
10 , TMC
. 2009
,

.
. 2, 3 NEC
3 .
2010 4
- 17 -
, 16,000 ( 20) .
< 9>


2009. 4

2009. 6 1,600
.
2009. 7 2 ,
.
2009. 10 R&D , TMC 200
2003 4
LSI 7.
,
.

30%
3 .
- 18 -
1965
,
.

1982
(19828
6) .
1983
DRAM
.
DRAM 10
. 90

.
- 19 -












1984 64K DRAM, 1985 256K, 1986 1M, 1988 4M, 1989
16M, 1992 64M, 1994 256M DRAM .
64K 4 ,
256K 3, 1M 2, 4M 6 , 16M
, 64M 256M 10
.

4 . ,
,
.
- 20 -

.
, . 1986
3 ,
3
.


.
,
.


.

.

. 2009 2,3(LED ), 10
(200mm→300mm ), LED,
. M7 3 ,
,
.

.
, .
LG DTV
90% .


.
. 90 ,
,
,
.
, , PC
. , USB
. 2009
10 7 PC
.
. ,
, TV ,
.
- 22 -
: , %
14,259
(4)
,
. 2009 2 D 56%,
52.6% , .
.
PC
. PC
.
< 12>
Q2-2008 Q3-2008 Q4-2008 Q1-2009 Q2-2009

(%)
47.4 47.6 48.8 51.2 49.2 23.0 23.5 24.4 21.2 21.6 10.0 9.0 7.9 8.8 10.1
0.4 0.4 0.4 0.4 0.3 4.5 4.6 3.6 4.2 4.8
DRAM
(%)
11.4 10.6 14.2 13.3 14.4 15.6 16.0 15.7 14.9 16.6 50.0 49.5 50.9 55.2 56.0
14.1 14.2 9.8 10. 11.9

(%)
14.1 11.7 15.9 15.5 15.4 28.0 30.8 34.5 32.3 29.5 55.7 55.0 47.3 49.9 52.6
: iSuppli.
, 2
2009 2 2008 2 18.5%
. 2009 2 27%
, 8 .
- 13.1%
,
.

. DRAM
,
.
: , %
2 2 4,756 2,920 3,876 -18.5 7.3
4 3 Toshiba 2,790 2,009 2,310 -17.2 4.4
3 4 TI 2,895 1,975 2,251 -22.2 4.3
5 5 STMicro 2,721 1,660 1,993 -26.8 3.8
8 6 Qualcomm 1,762 1,316 1,786 1.4 3.4
6 7 Renesas 1,986 1,207 1,351 -32.0 2.6
7 8 Hynix 1,774 898 1,295 -27.0 2.5
9 9 Infineon 1,600 975 1,150 -28.1 2.2
12 10 AMD 1,336 1,135 1,133 -15.2 2.1
: iSuppli, 2009. 8.
.

- 24 -
(5)
,
1, 2 .
IDM ,
185 . 1, 2 83,
25, 37, 10, EDA IP
10 165 .
1
0.1% , 1 1 50
,
. , ,
, , .
- 25 -


, LG ,
, , , MCS
, , , ,
, , , , e-MDT
, LG , , ,
,
, ,
, , , ,
, I&C, ,


IGBT/
,
, LG, , ,
KEC, TLI, , , ,
PCB/

, ,
: KSIA.
1, 2 , 1
() 2
.
- 26 -
, .
M&A
.
< 15> 1, 2

, KCTech, HIT,
, , , ,

, , ,
, MK ,
, ISC, SMD,
, LCD
: KSIA.
(1)
,
.
-
, .
IP , IP
.
)
)

BRICs )

)
(, ,
)
,

( )

: .
- 28 -
,
,
. IP ,
,
.
, ,
.

, .


,
.

.

3D .

.

.
.
- ,
, ,
. ,
- 29 -
,
. , , ,
, .
(2)
2 .


- ,
.
,
,
- D, ,
, D
,

-

.


- 30 -


-
,
,

-
,
(MPW)
-




-
.
, , ,


.
- 31 -
-
,
.

.
- ,
,












R&D







. ,

.
- ,
.
.


.

. .
, , ,
.
- ,

.
. , , ,
5
.
- , .
.
- 34 -

.

,
.