flexible circuit simple design guide -...
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Flexible Circuit Simple Design Guide Flexible Circuit Simple Design Guide
• Flexible Circuit Board Types and Definitions • Design Guides and Rules • Process Flow • Raw Material
INDEXINDEX
Single Side Flexible PCBSingle Side Flexible PCB Single Side Flexible PCB (Cover layer type)
Cover layCover layCover layCover lay
Copper FoilCopper FoilCopper FoilCopper Foil
PolyimidePolyimidePolyimidePolyimide
AdhesiveAdhesiveAdhesiveAdhesive
StiffenerStiffenerStiffenerStiffener
{{{{ BaseBaseBaseBase
Stiffener
Double Side Tape
FCCL
Cover Lay
Epoxy, Kapton, Polyester 100 Epoxy
Adh: 50~55㎛ 50 Adhesive
25 Polyimide
10 Adhesive 1Mil ½ oz, RA or ED S/S
( Adh: 10~15㎛)
18 Copper
22.5 Adhesive 1/2Mil (Adh: 22.5~25㎛)
12.5 Polyimide
F
P
C
1 Layer
Remark SPEC ( Unit:㎛ ) Layer Structure
Single Side Flexible PCBSingle Side Flexible PCB Single Side Flexible PCB (Solder resist type)
Stiffener
Double Side Tape
FCCL
Solder Resist
Epoxy, Kapton, Polyester 100 Epoxy
Adh: 50~55㎛ 50 Adhesive
25 Polyimide
10 Adhesive 1Mil ½ oz, ED or RA S/S
( Adh: 10~15㎛)
18 Copper
15~20㎛ 17 UV curable ink
F
P
C
1 Layer
Remark SPEC ( Unit:㎛ ) Layer Structure
Solder ResistSolder ResistSolder ResistSolder Resist
Copper FoilCopper FoilCopper FoilCopper Foil
PolyimidePolyimidePolyimidePolyimide
AdhesiveAdhesiveAdhesiveAdhesive
Stiffener Stiffener Stiffener Stiffener ((((optionaloptionaloptionaloptional))))
{{{{ BaseBaseBaseBase
Double Side Flexible PCBDouble Side Flexible PCB Double ( Folder ) side with Air Gap
Copper FoilCopper FoilCopper FoilCopper Foil PolyimidePolyimidePolyimidePolyimide Through HoleThrough HoleThrough HoleThrough Hole
Cover layCover layCover layCover lay
Bonding sheetBonding sheetBonding sheetBonding sheet
1Mil 1/2 oz RA, S/S
( Adh: 10~15㎛)
25 Polyimide
FCCL
Epoxy/Acrylic 25 Epoxy ADHESIVE
18 Copper 10 Adhesive
1/2Mil (Adh: 22.5~25㎛ ) 22.5 Adhesive Cover Lay
12.5 Polyimide
Total Thickness
FCCL
Cover Lay
201
25 Polyimide 10 Adhesive
1Mil 1/2 oz RA, S/S
( Adh: 10~15㎛)
18 Copper 22.5 Adhesive
1/2Mil (Adh: 22.5~25㎛ ) 12.5 Polyimide
F
P
C
2 Layer
Remark SPEC (Unit:㎛) Layer Structure
Double Side Flexible PCBDouble Side Flexible PCB Double sided flexible PCB
Through HoleThrough HoleThrough HoleThrough Hole
Copper FoilCopper FoilCopper FoilCopper Foil PolyimidePolyimidePolyimidePolyimide
Cover layCover layCover layCover lay
Total Thickness
F
P
C
2 Layer
1/2Mil (Adh: 22.5~25㎛ ) 22.5 Adhesive
Cover Lay
10 Adhesive
18 Copper
12.5 Polyimide
151
FCCL
Cover Lay
25 Polyimide
10 Adhesive 1Mil 1/2 oz ED or RA, D/S ( Adh: 10~15㎛)
18 Copper 22.5 Adhesive
1/2Mil (Adh: 22.5~25㎛ ) 12.5 Polyimide
Remark SPEC (Unit:㎛) Layer Structure
Multilayer Flexible PCB with Air GapMultilayer Flexible PCB with Air Gap
Bonding sheetBonding sheetBonding sheetBonding sheet
Air Gap Air Gap Air Gap Air Gap ((((No BondingNo BondingNo BondingNo Bonding))))
Copper FoilCopper FoilCopper FoilCopper Foil PolyimidePolyimidePolyimidePolyimide Through HoleThrough HoleThrough HoleThrough Hole
Cover layCover layCover layCover lay
See next page for details
Multilayer Flexible PCB with Air GapMultilayer Flexible PCB with Air Gap
Epoxy/Acrylic 12.5 Epoxy Bonding Sheet
1/2Mil 1/2 oz RA, S/S ( Adh: 10~15㎛)
25 Polyimide
FCCL 18 Copper
10 Adhesive
12.5 Polyimide 1/2Mil (Adh: 22.5~25㎛ )
22.5 Adhesive Cover Lay
22.5 Adhesive 1/2Mil (Adh: 22.5~25㎛ )
12.5 Polyimide Cover Lay
Epoxy/Acrylic 25 Epoxy Bonding Sheet
12.5 Polyimide
10 Adhesive 1/2Mil 1/2 oz RA, S/S
( Adh: 10~15㎛)
18 Copper
FCCL
22.5 Adhesive 1/2Mil (Adh: 22.5~25㎛ )
12.5 Polyimide Cover Lay
1/2Mil 1/2 oz RA, S/S ( Adh: 10~15㎛)
12.5 Polyimide
FCCL
Epoxy/Acrylic 25 Epoxy Bonding Sheet
18 Copper
10 Adhesive
1/2Mil (Adh: 22.5~25㎛ ) 22.5 Adhesive
Cover Lay 12.5 Polyimide
Total Thickness
FCCL
Plating (20㎛) 377-407
12.5 Polyimide
10 Adhesive 1/2Mil 1/2 oz
RA, S/S ( Adh: 10~15㎛)
18 Copper
F
P
C
4 Layer
Remark SPEC (Unit:㎛) Layer Structure
Rigid Flex PCB with Air GapRigid Flex PCB with Air Gap See next page for details...
Bonding sheetBonding sheetBonding sheetBonding sheet
Air Gap Air Gap Air Gap Air Gap ((((No BondingNo BondingNo BondingNo Bonding))))
Copper FoilCopper FoilCopper FoilCopper Foil
PolyimidePolyimidePolyimidePolyimide Through HoleThrough HoleThrough HoleThrough Hole
Cover layCover layCover layCover lay
FRFRFRFR----4444
PSRPSRPSRPSR
Rigid Flex PCB with Air GapRigid Flex PCB with Air Gap
Epoxy/Acrylic 12.5 Epoxy Bonding Sheet
0.1mm 1/2oz S/S 100 Epoxy
FR-4 18 Copper
12.5 Polyimide 1/2Mil (Adh: 22.5~25㎛ )
22.5 Adhesive Cover Lay
22.5 Adhesive 1/2Mil (Adh: 22.5~25㎛ )
12.5 Polyimide Cover Lay
Epoxy/Acrylic 25 Epoxy Bonding Sheet
100 Epoxy 0.1mm 1/2oz S/S
18 Copper FR-4
20 Green Green/Black ( UV ) Solder Resist ink
1/2Mil 1/2 oz
RA, S/S
( Adh: 10~15㎛)
12.5 Polyimide
FCCL
Epoxy/Acrylic 25 Epoxy Bonding Sheet
18 Copper
10 Adhesive
Green/Black ( UV cured ) 20 Green Solder Resist ink
Thickness
FCCL
Plating (25㎛)
12.5 Polyimide
10 Adhesive
1/2Mil 1/2 oz
RA, S/S
( Adh: 10~15㎛)
18 Copper
4 Layer
Remark SPEC (Unit:㎛) Layer Structure
>= 490
Design Guides and RulesDesign Guides and Rules Bonding Sheet Design (Folder area)
NO Adhesive Area
NO Adhesive Area
45O
B/S Design By Drawing
For prevention of defect B/S Design
●● If the border line type of NO ADHESIVE AREA part is vertical, it can cause SHORT or OPEN circuit problem.
●●●●●●●● We prefer to design the Bonding Sheet in the manner that gives a slope of 45 degrees to one of the border lines of LCD mounting area or TAIL part.
(Exception: Single sided type may not be affected)
Design Guides and RulesDesign Guides and Rules Pattern design of Folder Area
1L PATTERN
2L PATTERN
NO Adhesive Area
OUTLINE
1) Purpose : To retain the maximum flexibility by staggering the pattern lines. 2) Method : ① Pattern lines on each layer will be staggered (as much as possible). ② Pattern lines on 1st and 2nd layer are staggered (Refer to diagram beside). ③ Pattern lines on 3rd and 4th layer are staggered (Refer to diagram beside). ④ As result, pattern lines on each layer can be staggered with each other. ⑤ This is to be considered for signal pattern line. 3) Reason : If the pattern of every Layer is located above the same line, it causes decrease of flexibility.
Design Guides and RulesDesign Guides and Rules Silk Screen Specification
1111
2222
3333 4444
5555
1) Purpose : To avoid possible default by understanding silk screen production condition. 2) Method : -1 Text Mark : Customer’s mark, Symbol, Date code; => SIZE 2mm -2 Component Text Mark : Min. 0.7mm, Max. 1.5mm → We may shift the marking position depending on the situation (After discussion with the customer) -3 Insulation Line : ① Line for preventing short circuit between the lands. ② Line thickness : 0.15mm (Standard) ③ Distance between line & land : 0.2mm -4 Land Out-Line : ① Silk screening on the outer line of the land is of no use. ② Prefer to remove unless it is an insulation line (After discussion with the customer). -5 Alignment Line : Follow the customer’s request. -6 Space : Min. 0.2mm between the lines. If it is beyond specification, it will be shifted after approval from customer.
Design Guides and RulesDesign Guides and Rules Pattern line thickness & tolerance of raw material
0.2 0.3 0.09
0.095 (±10%)
1 oz
0.2 0.3 0.075 0.075
(±10%) 1/2 oz
R
(Min. Radius Value)
A
(Space-Pattern/Border)
S (Space-
Pattern/Pattern)
L
(Min. Line) Two layer
type
((((Unit Unit Unit Unit : : : : mmmmmmmm))))
OUTLINEOUTLINEOUTLINEOUTLINE
RRRR
L S A
PATTERNPATTERNPATTERNPATTERN
Design Guides and RulesDesign Guides and Rules Through hole / Pad (Inside )
0.10 0.10 C
0.30 0.45 B
0.10 0.15 A
Laser N.C Mechanical
CNC
±0.15 ±0.3 ±0.3 Tolerance
JIG type Universal
(Manually)
Stiffener
Adhesive
Type
((((Unit Unit Unit Unit : : : : mmmmmmmm))))
teardrop C
B
A
((((Unit Unit Unit Unit : : : : mmmmmmmm))))
Stiffener / Tape Area Tolerance
Design Guides and RulesDesign Guides and Rules Tear-drop design
Silk Screen Tolerance
1) Purpose : Prevention of open circuits caused by cracks or disconnections between PAD and pattern. 2) Type : 1. Between Through-Hole PAD and pattern 2. Between lands and pattern 3) Method : Use tear-drop tool editor, input R (size). In the case of impossibility of inputting R, it should be input made manually 4) Exception : Area that can not be input as R will be worked manually (R value disregarded).
Min. 0.2 mm
Min. 0.15 mm
Dimension
A (Min. Width Of Marking)
B (Min. Distance from Land)
Item
A
A
B B
Design Guides and RulesDesign Guides and Rules Cover lay & Solder Resist Formative Dimension
Cover lay Open Area Stiffener Specification
((((Unit Unit Unit Unit : : : : mmmmmmmm))))
D (Min. Dia. of Circle)
C (Min.Space between Openings)
B (Min.Size of Rectangle)
A (Min.Size of Rectangle)
0.2
0.1
0.2
0.2
0.5
0.5
(within1/3 of ‘B’)
0.5
0.5
Cover lay Solder Resist Item
A
BBBB
DDDD
CCCC
Not PreferredNot PreferredNot PreferredNot Preferred PreferredPreferredPreferredPreferred
Overlap Distance (Minimum 0.15mm)
Design Guides and RulesDesign Guides and Rules Gap from stiffener edge to Hole
Adhesive Specification
AAAA
STIFFENER BBBB
Φ A ≥ Stiffener Thickness A
(Hole Size)
B ≥ Stiffener Thickness (For prevention of cracks)
B
(Distance between hole and edge)
Min. Size Item
OUTLINE
Adhesive Adhesive
OUTLINEOUTLINEOUTLINEOUTLINE
GuidelineGuidelineGuidelineGuideline
Not PreferredNot PreferredNot PreferredNot Preferred PreferredPreferredPreferredPreferred
Design Guides and RulesDesign Guides and Rules Goldfingers design
Stiffener and Pattern Design
± 0.03 “ C “ Dimension Tolerance
(Tolerance of Accumulated Pattern Pitch)
± 0.1 “ A “ Dimension Tolerance
(Misalignment of Punching to Pattern)
± 0.02 “ B “ Dimension Tolerance
(Tolerance of Pattern Pitch)
± 0.05 “ D “ Dimension Tolerance
(Tolerance of Connector Width)
Tolerance Item
stiffener stiffener Not preferredNot preferredNot preferredNot preferred PreferredPreferredPreferredPreferred
Pattern line should be Pattern line should be Pattern line should be Pattern line should be 0.50.50.50.5mm mm mm mm longer than the stiffenerlonger than the stiffenerlonger than the stiffenerlonger than the stiffener’’’’s size s size s size s size to prevent cracksto prevent cracksto prevent cracksto prevent cracks. . . .
((((Unit Unit Unit Unit : : : : mmmmmmmm))))
Design Guides and RulesDesign Guides and Rules Pattern Cover lay Open Area Specification
MinMinMinMin....0.20.20.20.2mmmmmmmm LAND Cover lay Cover lay Cover lay Cover lay OpeningOpeningOpeningOpening
MinMinMinMin....0.20.20.20.2mmmmmmmm LAND
Cover lay Cover lay Cover lay Cover lay OpeningOpeningOpeningOpening
holeholeholehole Cover lay Cover lay Cover lay Cover lay OpeningOpeningOpeningOpening
MinMinMinMin....0.20.20.20.2mmmmmmmm MinMinMinMin....0.30.30.30.3mmmmmmmm
MinMinMinMin....0.20.20.20.2mmmmmmmm
holeholeholehole
MinMinMinMin....0.20.20.20.2mmmmmmmm Cover lay Cover lay Cover lay Cover lay OpeningOpeningOpeningOpening
Production ProcessProduction Process Single side
Etching (Outer) Etching (Outer)
Positioning (C/L)
Positioning (C/L)
HOT PRESS (Vacuum)
HOT PRESS (Vacuum)
Finish Finish
Post treatment Post treatment
PSR & Silkscreen
PSR & Silkscreen
Press cutting (Body)
Press cutting (Body)
Cutting (base) Cutting (base)
BBT BBT
Final Inspection Final Inspection
Dry film Image
Dry film Image
Shipment Shipment
Cutting Cutting
Cover Lay Cover Lay
Press cutting (Mask open) Press cutting (Mask open)
Single Side StructureSingle Side StructureSingle Side StructureSingle Side Structure
POLYIMID + COPPER
COVERY LAY
Production ProcessProduction Process Double side
Shipment Shipment
BBT BBT
Post treatment Post treatment
Final Inspection Final Inspection
Finish Finish
STF&D/T STF&D/T
Covey Lay Covey Lay
Cutting (C/S, S/S)
Cutting (C/S, S/S)
Positioning (C/L) Positioning (C/L)
Drilling Drilling
Copper plating Copper plating
D/F( Image) D/F( Image)
Etching Etching
Cutting (base )
Cutting (base )
Press cutting (Body)
Press cutting (Body)
BBT BBT
Hot Press (Vacuum) Hot Press (Vacuum)
PSR & Silkscreen
PSR & Silkscreen
Press cutting (mask open) Press cutting (mask open)
Stiffener Stiffener
Double Side StructureDouble Side StructureDouble Side StructureDouble Side Structure
COVERY LAY
stiffener
POLYIMID + COPPER
COVERY LAY
Raw MaterialRaw Material CCL (Copper Clad Lamination)
Cover Lay
1/2mil (12.5㎛)
1mil (25㎛)
Rolled Annealed(RA) or Electro Deposit(ED)
1/3 oz (12㎛),1/2oz.(18㎛), 1oz. (35㎛) Double Sided CCL
1/2mil (12.5㎛)
1mil (25㎛)
Rolled Annealed(RA) or Electro Deposit(ED)
1/3 oz (12㎛),1/2 oz(18㎛), 1oz(35㎛) Single Sided CCL
Base Film (Polyimide) Conductor (Copper) Item
30㎛, 35㎛ 1mil (25㎛)
15㎛, 22.5㎛ 1/2mil (12.5㎛)
Adhesive Polyimide
●●●● Photo Solder Resist Photo Solder Resist Photo Solder Resist Photo Solder Resist ( ( ( ( PI ink PI ink PI ink PI ink ) ) ) ) Thickness Thickness Thickness Thickness 15 15 15 15 ~ ~ ~ ~ 20202020㎛㎛㎛㎛
Solder Resist
Raw MaterialRaw Material Surface Finish
Stiffener
0.6±0.2 ㎛ Tin Plating (Pure Sn)
Ni 2~6 ㎛, Au .0.5㎛ Electro Gold Plating
Ni 1.5~5㎛, Au 0.05㎛ (according to flexibility) Electro-less Gold Plating
0.3±0.1 ㎛ Pre-flux (OSP)
3~10 ㎛ HASL
Thickness Surface Finish TypesSurface Finish TypesSurface Finish TypesSurface Finish Types
50 ~ 188 ㎛ Polyester (Natural, White)
0.2 ~ 1.6 mm FR-4 (Glass Epoxy)
0.5 ~ 1.6 mm XPC-1 (Phenolic Paper)
Aluminum, Stainless Steel... Etc.
25 ~ 225 ㎛ Polyimide
Thickness Stiffener Types
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