glast lat projectgasu trr, july, 2005 4.1.7 daq & fswv1 1 glast large area telescope: presented...

GLAST LAT Project GASU TRR, July, 2005

4.1.7 DAQ & FSW V1 1

GLAST Large Area Telescope:GLAST Large Area Telescope:

Presented by G. HallerSLAC

haller@slac.stanford.edu(650) 926-4257

Gamma-ray Large Gamma-ray Large Area Space Area Space TelescopeTelescope

GASU TRRGASU TRR

GLAST LAT Project GASU TRR, July, 2005

4.1.7 DAQ & FSW V1 2

ContentsContents

• Introduction– Overview– Significant Changes since CDR– Objectives– Status

• Requirements/Verification• EGSE and Test-Procedures• Verification Test Plan and Flow

– At Assembly Vendor• Test-plan and Flow• Facility• Man-Power• Quality Assurance• Vibration

– At SLAC• Test-plan and Flow• Thermal Vacuum Test• Mass Property• EMI/EMC (at sub-contractor)• Man-Power• Quality Assurance

• Equipment Calibration/Safety• Risk Assessment• Schedule• Status of Procedures• Issues and Concerns

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LAT ElectronicsLAT Electronics

3 Event-Processor Units (EPU) (2 + 1 spare)

– Event processing CPU– LAT Communication Board– SIB

ACD

empty

EPU-3

EPU-2EPU-1

empty empty

Power Dist. Unit*

GASU*

empty

empty

SIU*SIU*

Spacecraft Interface Units (SIU)*

– Storage Interface Board (SIB): Spacecraft interface, control & telemetry

– LAT control CPU– LAT Communication

Board (LCB): LAT command and data interface

16 Tower Electronics Modules & Tower Power Supplies

* Primary & Secondary Units shown in one chassis

Power-Distribution Unit (PDU)*

– Spacecraft interface, power

– LAT power distribution

– LAT health monitoring

Global-Trigger/ACD-EM/Signal-Distribution Unit*

(GASU)

TKR

CAL

TKR Front-End Electronics (MCM)ACD Front-End Electronics (FREE)

CAL Front-End Electronics (AFEE)

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EGSE GASU Mounted on LAT EGSE GASU Mounted on LAT

GASU

PDU

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Flight GASUFlight GASU

Primary and Redundant GASU DAQ Module in same enclosure, separated by metal

To follow

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Boards in Flight GASUBoards in Flight GASU

• Enclosure contains primary and redundant GASU Power-Supply Boards and DAQ Boards

GASU PS Board

GASU DAQ Board

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4.1.7 DAQ & FSW V1 7

• One enclosure houses primary and redundant GASU Power-Supply and GASU DAQ Circuit Card Assemblies

– Separated by aluminum wall

• GASU Power Supply

– Receives 28-V supply voltages for

• Primary and redundant DAQ board, – Generates 3.3V and 2.5v

• ACD FREE cards– Filtering for 28-V– 3.3V regulation

• GASU DAQ Board

– Contains 9 FPGA’s

– Includes Command Response Unit, fan-out and fan-in of commanding to 16 TEMs, PDU, EPU’s, ACD

– Includes Global Trigger Logic

– Includes LAT Event-Builder Logic

– Includes command/control/read-back for ACD sub-system

– Includes power-control for ACD FREE Boards

GASU ModuleGASU Module

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Changes since LAT CDRChanges since LAT CDR

• Code in 9 FPGA’s were modified/finalized and bugs fixed• ACD power-on low-frequency system clock selection added• ACD power circuits replaced with circuit to protect for over-

current and updated ICD interface voltage/current requirements

• Some resistor/capacitor values have changed to optimize monitoring ranges

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ObjectivesObjectives

• Demonstrate that hardware, software, procedures, and support equipment are prepared to support system environmental test

• Demonstrate that planned and completed testing meets performance and interface requirements

• Identify and understand all the risks and limitations• TRR is not intended to

– Review GASU design– Review flight readiness– Buy-off hardware or software

• RFA’s should only be of sufficient concern to stop test– Prior to start of an given test, any applicable TRR RFAs

must be closed

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4.1.7 DAQ & FSW V1 10

Test Entrance / Exit CriteriaTest Entrance / Exit Criteria

• Entrance– All required paperwork released and in place

• Procedures, drawings, etc– Test configuration verified and approved– Essential personnel in place– Pre-test GASU functional successfully passed

• Exit– As-run procedures completed– Correct and accurate application of test environment– Test data acquired and archived– No damage to GASU– GASU performance within specification limits– Post-test GASU functional successful

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StatusStatus

• First GASU (to be proto-flight tested)

– Assembled

– Pre-conformal coat GASU with enclosure-internal EGSE harness tested, tests to verify that ACTEL performs over temperature performed (was prerequisite to programming FPGA’s for second GASU box)

– Conformal coated, integrated in enclosure with flight harness

– Final GASUto be delivered to SLAC week of Oct 3, 2005

• Second GASU (to be flight acceptance tested)

– Will be spare or primary flight GASU, depending on schedule

– Board went thru reflow surface-mount assembly step

– ACTEL FPGA’s were programmed and are being assembled on boards

– Remaining are staking, integration of boards into enclosure, integration of EGSE harness, testing at SLAC, conformal coating, integration of flight harness, testing

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Tests To-DateTests To-Date

• GASU engineering modules were extensively tested– As EGSE in DAQ/I&T

• Testbed includes GASU for > 1 year• I&T uses EGSE GASU during integration of towers in

LAT for several months• Main difference to flight GASU: ACD power-switch

circuit and monitoring was modified– Two flight boards of each type were assembled with mostly

flight parts and tested in one enclosure– Additional GASU tests

• Informal thermal test -40C to 55C• Informal EMI test on EGSE station sent to Lockheed for

thermal test

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RequirementsRequirements

• LAT-SS-00285 Specifications, Level 4 LAT Dataflow System• LAT-SS-00019 Specifications, Level 3 T&DF Subsystem Specification• LAT-SS-00136 Specifications, Level 3 Power Supply System • LAT-SS-00183 Specifications, Level 4 Power Supply System• LAT-SS-07287 Specifications, Level 5 GASU Specification ( to be released)

• LAT-TD-00606 LAT Inter-Module Communications• LAT-TD-0xxxx GASU ICD Specification & Conceptual Design (needs to be

updated)• LAT-TD-00639 AEM, Programming ICD• LAT-TD-01545 GEM, Programming ICD • LAT-TD-01546 EBM, Programming ICD • LAT-TD-01547 CRU, Programming ICD

• LAT-SS-00778 LAT Environmental Specification

• LAT-SS-07287 GASU lists requirements• LAT-TD-04381 contains Verification Matrix which gives approach to verify each

requirement– Lists verification method used

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4.1.7 DAQ & FSW V1 14

System PerformanceSystem Performance

• Level 3 and level 4 DAQ and TRG and power-system requirements are met with a combination of DAQ modules (TEM/TPS, GASU, SIU, PDU, etc), since the DAQ and trigger and power system is comprised of several sub-system module types– Level 5 GASU requirements which are verified are derived

from Level 3 and Level 4 DAQ and Trigger and Power system specifications (as noted in the L5 requirements doc)

– Level 5 requirement doc includes derived requirement addressing

• Functionality/performance• Power• Mass/C.G.• EMI/EMC• Environmental incl temperature and vibration

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Verification StatusVerification Status

• Engineering Module GASU– EM completed full functional test program with exception of

thermal-vacuum, EMI/EMC, mass, and C.G.– Demonstrated compliance with specifications

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EGSE and Test-ProceduresEGSE and Test-Procedures

• EGSE for Functional/Performance Tests– Test-Stand documented in LAT-DS-01717

• Test-Procedures– LAT-TD-04260 Electrical Interface Continuity and Isolation

Test procedure and LAT-TD-06610 Automated Electrical Interface Continuity and Isolation Test procedure

• Power-off impedance tests of I/O– LAT-TD-04382 Stray-Voltage-Test Procedure

• Power-on voltage test of I/O– LAT-TD-01717 Comprehensive Test Procedure

• Functionality and Performance test • (not signed of as of Sept 30, 05)

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Test-ConfigurationTest-Configuration

VME Crate

Slot 0SBC MVME 2304 Card

LCB Mezzanine CardLAT-TD-00860

GASU(Unit Under Test)

JL-45SIU 72104

J5

JP1

P1

P2

JL-40JL-41

DC Power Supply #1 BK 1697Set to 28 V

(-)

(+)

FREEJL-156-179

JS1

JP2

JS2

FREE Board

FREE Board

FREE Boards (Multiple)

Even-numbered GASU connectors to any JP.

Odd-numbered GASU connectors to any JS.

2092

Connector Savers

Connector Saver

3611P3

• LAT-TD-01717 shows several test-configurations, below the AEM functionality test configuration is shown

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Verification Level – Module DetailVerification Level – Module Detail

• Breakout of verification at GASU Module Level• Tests to be conducted after successful TRR (order may change

depending on availability of resourced (TV/EMI)• EICIT & SVT• Functional test• Vibration (Wyle)• Functional test• Thermal cycle• Functional test• Mass properties including CG• Thermal vacuum (in-situ testing)• EMI/EMC (at CKC-lab for proto-flight, at SLAC for flight

acceptance)• Functional test • Review• Deliver to I&T

– DAQ (out-going) / I&T (incoming) test combined

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VerificationVerification

• Test-Stand– Supplied by SLAC– Operated by SLAC engineers

• Vibration facility at Wyle– LAT-TD-03634 Vibration test-procedure – SLAC engineers present for vibration tests

• Thermal Cycle in thermal chamber in SLAC clean-room

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4.1.7 DAQ & FSW V1 20

TC and Vibration RequirementsTC and Vibration Requirements

Parameter Required Characteristic Thermal Cycling (4 cycles) -40 to +55 °C (Qualification and

Proto-flight) Thermal Cycling (4 cycles) -35 to +50 °C (Acceptance) Random Vibration See Figure 1. Sinusoidal Vibration 0.5g rms, 20 to 2000Hz

Figure 1. Vibration Levels, Duration, and Spectra

Electronics Module (Special Boxes)Random Vibration Spectra

ASD Level (G2/Hz)Freq (Hz) Accept Qual20 0.010 0.01075 0.037 0.03880 0.040 0.055115 0.180 0.360160 0.180 0.360325 0.040 0.060350 0.040 0.050500 0.040 0.0502000 0.025 0.050Overall 8.91 Grms 11.51 GrmsDuration 60s/axis AT, PT

120s/axis QT

0.001

0.010

0.100

1.000

10 100 1000 10000Freq. (Hz)

AS

D L

evel

(G

^2/H

z)

Accept

Qual

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4.1.7 DAQ & FSW V1 21

Mass PropertyMass Property

• Mass properties checked at SLAC – Procedure LAT-TD-07037-01 (performed at SLAC

Metrology)– Expected: (ref LAT-TD-00564)

• Total 13.9 kg• Allocation 12% above = 16.7 kg

– C.G. to be measured for the proto-flight unit only

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Thermal Vacuum TestThermal Vacuum Test

• Thermal Vacuum facility in Building 33 at SLAC– Thermal Vacuum Chamber Operating Procedure LAT-TD-

02541 – GASU Thermal Vacuum Test-Procedure LAT-TD-03635 (not

released as of 9-30-05)– First GASU tested to proto-flight specifications (same

Temperatures as qualification, but 4 TV cycles versus 12 cycles)

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Proto-Flight and Flight Acceptance Thermal Proto-Flight and Flight Acceptance Thermal Vacuum TestVacuum Test

• See GASU Thermal Vacuum Test-Procedure LAT-TD-03635

+55C +2/-2C

PROTO-FLIGHT THERMAL VACUUM CYCLE TIMELINE

Hot Qualification Limit

4 Cycles Total

Open Chamber

CloseChamber

Start Pump Down

Chamber

Vent ChamberSetup Flight Unit

CPT

Start of Cycle 1

End of Cycle 12

Hot Survival Limit+60C +2/-2C

-40C +2/-2C Cold Survival/Cold Qualification Limit

EGSE Unit

Start Bake Out/Outgas

CPT

Open Chamber

Turn OFF+30C +2/-2C

CPTFlight Unit

Turn OFF

Verify End Bake Out O

N-O

FF

-ON

4Hrs

4Hrs

OF

FC

PT

LP

T

ON

-OF

F-O

N

CP

T

LP

T

4Hrs 4Hrs

4Hrs

4Hrs

OF

F-O

N

OF

F-O

N

OF

F-O

N

OF

F-O

N

ContinuePeriodic

LPT

CP

T

Continue Periodic

LPT

4Hrs

Cycles 2-3

CP

T

ContinuePeriodic

LPT

OF

F

CP

TO

FF

OF

F-O

N

Start Periodic

LPT

ContinuePeriodic

LPTOF

F-O

N

At < 10-5 Torr

X 4

+50C +2/-2C

ACCEPTANCE THERMAL VACUUM CYCLE TIMELINE

Hot Acceptance Limit

4 Cycles Total

Open Chamber

CloseChamber

Start Pump Down

Chamber

Vent ChamberSetup Flight Unit

CPT

Start of Cycle 1

End of Cycle 4

Hot Survival Limit+60C +2/-2C

-35C +2/-2CCold Acceptance Limit

EGSE Unit

Start Bake Out/Outgas

CPT

Open Chamber

Turn OFF+30C +2/-2C

CPTFlight Unit

Turn OFF

Verify End Bake Out O

N-O

FF-

ON

4Hrs

4Hrs

OF

FC

PT

LPT

ON-OFF-ON

CPT

LPT

4Hrs 4Hrs

4Hrs

4Hrs

OF

F-O

N

OF

F-O

N

OF

F-O

N

OF

F-O

N

ContinuePeriodic

LPTC

PT

Continue Periodic

LPT

4Hrs

Cycles 2-3

CPT

ContinuePeriodic

LPT

OF

F

CPT OF

F

OF

F-O

N

Start Periodic

LPT

ContinuePeriodic

LPT

-40C +2/-2CCold Survival Limit4Hrs

OF

F-O

N

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EMI/EMC TestEMI/EMC Test

• Proto-Flight = Qualification Test (Conductive & Radiative)

– Sub-contracted to CK Labs

– Statement of Work: LAT-PS- 04568

• CE102, CECN, CS102, CSCM, CS06, RE101, RE102, RS101, RS103

– Detailed EMI/EMC procedure provided by CKC lab (to be provided)

– SLAC engineers present at vendor for tests

– Vendor supplies test-report

– LAT QA at SLAC present for tests

• Flight Acceptance Test (Conductive)

– Performed at SLAC

– LAT-TD-03633

• Only CE102, CS102

– SLAC supplies test-report

– LAT QA at SLAC present for tests

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Manpower & Quality AssuranceManpower & Quality Assurance

• Test man-power – GASU: L. Sapozhnikov/ J. Thayer– Test Support: J. Ludvik– Thermal Cycle and TV support: R. Williams, P. Hart– TV shift support: 2 contractors– EMI support: D. Nelson – Vibration support: D. Tarkington

• Quality assurance: Joe Cullinan– QA representative (Y.C. Liew) present during tests, review

of test-procedure and results– Required changes to documentation are red-lined and

included in new revisions– NCR are created for non-conformance (e.g. exceeding of

min/max test limits) and submitted for disposition

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Problem Failure Report/ Configuration Problem Failure Report/ Configuration ManagementManagement

• Problem Failure Reporting– Via standard SLAC LAT Non-Conformance Reporting (NCR)

System• NCR is entered• Reviewed/accepted/resolved

– LAT engineering

– LAT QC

• Already exercised during pre-conformal coat GASU assembly

• Configuration Management– Via standard LATDOC system

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Planned TestsPlanned Tests

• Function/Performance Tests (LAT-TD-01717)– Verifies all requirements in LAT-SS-07287 except below

• Thermal Vacuum Tests– Verifies performance/function over temperature

• Mass/C.G.– Verifies/measures mass and C.G.

• Vibrations test– Verifies vibration performance requirements

• EMI/EMC– Verifies EMI/EMC performance

• Note to margin testing– External Voltage margin testing is performed at all stages (28V +/-1V)– Internal Voltage margin testing (3.3V/2.5V) is only performed at pre-

conformal coat stage while using internal EGSE harness– No internal voltage margin testing once flight harness is used. Respective

tests in TD-01717 are omitted at that stage as will be documented in work-order

– Frequency margin tested pre-conformal coat as well as on final GASU– Temperature testing performed during TV testing

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Equipment CalibrationEquipment Calibration

• EMI/EMC Test Equipment– Quantitative measurement equipment (sensors, antennas,

etc) calibrated to NIST standards– Calibration performed annually

• All item are (will be) within calibration at time of testing• Vibration Test Equipment

– Accelerometers calibrated against a standard accelerometer traceable to NIST

– Signal conditioners calibrated annually• TVAC Equipment

– Thermocouples calibrated against standard temperature; calibrated prior to test

– Thermocouple reader calibrated very 2 years

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Sub-System SafetySub-System Safety

• EGSE– Safe-to-mate– Configuration control– Calibration verification– Functionality verification with “golden” EGSE GASU prior

to test with flight hardware• MGSE

– No custom MGSE• Environment

– Temperature controlled in all test-facilities– Cleanliness actively controlled in clean-room; hardware

bagged and purged when required• Training

– ESD training completed– Clean room training completed

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Risk AssessmentRisk Assessment

• Schedule– Pressure to deliver flight hardware could force less than

complete characterization and analysis of modules, could result in replicating a problem in the second module

• Performance– None known

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Test-ScheduleTest-Schedule

• Estimated as follows, order subject to EMI/TV availability• First GASU

– 10/5: functional test – 10/13: TC– 10/14: functional test – 10/17: vibration test – 10/18: functional test– 10/24: TV start– 10/31: TV end– 11/1: mass, c.g. property – 11/2: EMI start – 11/16: EMI end

• 2nd GASU– Lags first GASU by about 8 weeks

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Status of Main Test ProceduresStatus of Main Test Procedures

• All procedures must be released before respective test• Procedures to be released

– EMI vendor procedure to be released– CPT and TV modified, revisions are in review

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Issue & ConcernsIssue & Concerns

• Schedule– Tight

• Vibration test– Concern that harness/connectors pass vibration tests

• (should be ok, but is concern)