high density design component solutions. technology challenges market drivers: make it smaller ...
Post on 23-Dec-2015
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Technology Challenges
Market Drivers: Make it smaller
Make it operate faster
Make it more efficient
Make it cheaper
Smaller Circuits Design:
1. Higher levels of circuit integration on silicon
2. Use of smaller foot print components
+ Components can be placed closer together
- Closer the components get to each other, the more unwanted signal noise coupling occurs SMT 0603 – 0402
CERAMIC CHIP CAPACITORS CHIP RESISTORS FERRITE CHIP BEADS INDUCTORS
Technology Challenge
Faster Speed of Operation:
1. More done in shorter amount of time
2. Higher complexity of functions & display
+ Smaller SMT Components Can Function at Higher Speeds.
- Distances between components and traces become significant factors in limiting performance and creates need for control of signal integrity.
MHz1200800600400
Technology Challenge
SMT 0603 – 0402 CERAMIC CHIP CAPACITORS CHIP RESISTORS FERRITE CHIP BEADS INDUCTORS
Less Power Consumed:
1. More features using less power
2. Thinner barrier silicon IC chips = lower voltage operation = less energy needed.
+ SMT Passive Components can function at lower voltages
- Lower voltage IC have reduced tolerance to spikes – transients. Higher level of transient and noise control is required = more passive components needed (capacitors and TVS devices)
- Lower ESR (lower loss) components needed CERAMIC CHIP CAPACITORS MLV – VARISTORS LOW ESR ALUMINUM & TANTALUM CAPACITORS
Technology Challenge
Reduced Cost of Products:1. Reduce size of PCB = less cost2. Use SMT = faster production and reduced cost
to build3. Reduce component count by component
integration4. Use smaller size components (less raw material =
less $$$)
+ Many SMT Passive Components cost less than leaded equivalents
+ Integrated (multiple element passives) reduce board space and place costs
CERAMIC CHIP CAPACITORS & ARRAYS CHIP RESISTORS & ARRAYS FERRITE CHIP BEADS / INDUCTORS PASSIVE ARRAYS (IPC)
Technology Challenge
SMT Component
Size
080506030402
0201
12mm3mm
NACxx SERIES SMT ALUMINUM ELECTROLYTIC CAPACITORS
NRC SERIES CHIP RESISTORS
NMC SERIESCERAMIC
CHIP CAPACITORS
0201 •
02
01
•
NIN/NIS SERIES CHIP INDUCTORS
Component Solution: Component Size Reduction
Get More ComponentsIn Less Space
High Density Design Solutions: Component Size Reduction and Integration
10 PIN 8 ELEMENTS
4 PIN2 ELEMENTS
NRSN SERIES RESISTOR ARAYSREPLACE WITH
2 OR 4 OR 8 ELEMENTSCHIP RESISTORS
Integrated Component Solution: Resistor Arrays
0.5mm (0.20”) ”) ~ 1.27mm (0.39”) pitch
103 103 103 103 Four ‘0603’ resistors (1.6mm X 0.6mm each)Typically 0.2~0.5mm space between parts (3.0mm X1.6mm total)Component size, spacing, land patterns and connection layout takes up valuable board space! Placing four components = $$$$
0.5mm (0.20”) ~ 1.27mm (0.39”) pitch
Quad flat pack or PLCC package IC
103
0.5mm (0.20”) pitch (Same or less pitch as IC!)
‘0804’ resistor arrays (2.0mm X 1.0mm total) NIC P/N: NRSNA4I4Far less board space used and short connection layout frees up valuable board space! Placing one component = ¼ the placement cost = $$$ saved!
Quad flat pack or PLCC package IC
NRSNA4I2
NRSNA4I4
SUPERIOR PERFORMANCE IN HIGH SPEED
CIRCUITS!
High Density Design Solutions: Component Size Reduction and Integration
Thick Film Resistor Arrays
Get More ComponentsIn Less Space
NCA SERIES CAPACITOR ARRAY
1 PART: 4 ELEMENTS1206 SIZE
4 ELEMENTSCERAMIC
CAPACITORS
REPLACE WITH
High Density Design Solutions: Component Size Reduction and Integration
Integrated Component Solution: Capacitor Arrays
1.6mm
4.7mm
C1
C2 C3
C4
C1 C2
C3 C4
3.2mm
1.6mm
4 Element capacitor array = ~$40/1000 = 4.0¢ each… 1 part = 4.0¢ total. Placement cost = 0.5¢ ~ 5¢ each (industry estimates) lets say it's 2¢ per part = 2¢ for 1
part.Total cost of 4 ceramic chip capacitor elements = 6.0¢ (42% savings)
Total board area = 1.6mm X 3.2mm = 5.12mm² (32% smaller) Capacitor Array Benefits = Lower total cost and less board space used!
0603 Ceramic chip capacitor = ~$6/1000 = 0.6¢ each… 4 parts = 2.4¢ total. Placement cost = 0.5¢ ~ 5¢ each (industry estimates)
lets say it's 2¢ per part = 8¢ for 4 parts.
Total cost of 4 ceramic chip capacitor elements = 10.4¢
Total board area = 1.6mm X 4.7mm = 7.52mm²
High Density Design Solutions: Component Size Reduction and Integration
Integrated Component Solution: Capacitor Arrays
Get More ComponentsIn Less Space
NPA SERIES PASSIVE ARRAY
1 PART: 8 ELEMENTS1608 SIZE
8 ELEMENTS4 CAPACITORS 4 RESISTORS
REPLACE WITH
SUPERIOR PERFORMANCE IN HIGH SPEED
CIRCUITS!
High Density Design Solutions: Component Size Reduction and Integration
Integrated Component Solution: Passive Component Arrays
NPA SERIES - Four element R•C network array in EIA 1608 size package
Capacitance values from 10 ~ 180pF Resistive element values from 10 ohm ~ 1K-ohm.
R R R R
C C C C
CR
1608 size :0.16” long X 0.08” wide
4.0mm long X 2.1mm wide
High Density Design Solutions: Component Size Reduction and Integration
Integrated Component Solution: Passive Component Arrays
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