high-end solutions for high-tech industries meyer burger · 2018-11-27 · short history slicing...

High-end solutions for high-tech industries – Meyer Burger

Annegret Lewak, Head of Sales MNS

We are a leading technology

company for innovative and cost

efficient solutions based on semi-

conductor technologies and with

a focus on photovoltaics.

We decisively shape the future

energy mix to the advantage to

our customers by combining our

technologies with the infinite power

of the sun.

Meyer Burger Vision

Corporate Presentation April 20182

▪ the pioneering project, Solar Impulse, relied on PV technology from Meyer Burger?

▪ functional inkjet printingtechnology was revolutionisedby Meyer Burger?

▪ cutting technologies from Meyer Burger set quality standards atthe core of computer chips?

Did you know that

Corporate Presentation April 20183

Technology competence centers

Hig

h-e

nd s

olu

tio

ns for

hig

h-t

ech in

dustr

ies

4

MB (Netherlands) B.V.▪ Printing (Inkjet)

MB (Germany) AG (former R&R)

▪ Plasma coating

▪ Vacuum components

MB (Switzerland) AG▪ Machining and handling of

hard and brittle materials

MB others▪ Muegge (Vacuum

components)

▪ Hennecke Systems and

Pasan (inspection systems)

At a glance

Corporate Presentation April 2018 Source: annual report 20175

Diamond Wire slicing

Short HistorySlicing & Wafering Equipment

7

Slicing hard- & Brittle Materials

History

▪ 1953 Foundation by Mr. Meyer and Mr. Burger

▪ 1973 ID Blade saw TS23

▪ 1991 First multi wire saw

▪ 2003 Intro first diamond wire saw

▪ 2006 Stock Listing (MBTN)

▪ 2012 DW288 Diamond Wire Platform

▪ 2016 DWMS Wire Management System

▪ 2018 DW291 Platform Introduced

Technologies

▪ ID Saws (~1000 units installed)

▪ Multi wire saws (>3000 units installed)

▪ Bricking / Cropping (~ 100 units installed)

8

Slurry / Loose abbrasive

▪ A mixture of silicon carbide and

glycol is used as an abrasive that

erodes rather than cuts the ingot

▪ 3 body erosion

▪ Grits roll between wire and material

▪ Grits speed max ½ of the wire

▪ Slurry: Carrier (Glycol or Oil) +

Grid (SiC or Diamonds)

Diamond wire / Fixed abbrasive

▪ Diamonds are coated on the wire

to generate a true cutting action

▪ 2 body erosion

▪ Grits slide over silicon

▪ Grits speed equal to wire speed

▪ Theoretically doubling of removal

rate compared to slurry process

▪ Cutting fluid, coolant: Water +

Additive (<10%)

Moving wire

Silicon

Fracturezone

Moving wire

Silicon

Cuttingzone

Diamond based slicing

DS261 Series 6Defining Quality

• Multi wire saw for 300mm

• Qualified at TIER-1 Front-end companies

• Fast cutting times and highest precision wafers

9

Specification

Work piece Ø 300mm or 450mm version available

Load length 400 mm

Wire speed 15m/s

Wire acceleration 2.5 m/s²

Wire thickness 120-175 µm

Technology Slurry

DW 288S SemiconductorThe new area begins

• Qualified Diamond Wire process for 8” Semiconductor Wafers

• Semiconductor Version of the Reliable DW288S

• Includes the patented DWMS for optimized wire handling

1

0

Specification

Work piece Ø 8”/200mm

Load length 420mm

Wire speed 25m/s

Wire acceleration 8 m/s²

Rocking 12°

Technology Diamond Wire

MB Global footprint

• Total > 80 tools used for Semi application

• 80% of tools used outside of China

MB Core Competences

11

EXELENCE IN

WAFERING

DW

Knowledge

Innovative

ConceptsMaterial

KnowledgeSlicing

Fundamentals

Machine

Design

Software

Expertise

Inkjet printing

Focus applications for Inkjet printing

Engineering

Versatile

Pilot Production

Flexible

\

Mass Production

Efficient rQFNSemiconductor

Printed Circuit Boards

\

Printed Electronics

Soldermask

AdhesiveDamsPhotoresist

BarriersPVFlexible Hybrid PE

14

Inkjet well positioned for (Semiconductor) special applications

To

ol C

ost

€ M

IO

Feature size (µm)

>500 100 10 1

2

20+

0.2

Low Resolution

(>50 µm)

Medium Resolution

( 50 - 10 µm)

High Resolution

(< 10 µm)

Screen printing

Shadow Masking

Lithography

Ink Jet Printing

Positive features Negative features

Inkjet printing feature size

Cost reduction via reductionof process steps

Cost benefits of moving from subtractive to additive process:

• less process steps, less equipment, less chemical waste, less material consumption

• optimal use of precious materials

• better economies-of-scale in small production runs

50 µm

Inkjet printing opens broad process window

Application Process Material

Masking Etching or galvanic bath Wax based or polymer

Conductive lines Direct contact printing Metal nano-particles

Dielectric material Isolation layers Polymers

Encapsulation Protection Polymers

Doping Emitter forming Dopant source

Aggressive Inks Direct Etching Etchant

Source: Infineon Multilayer printed polyimide

topview

Typical feature size 20 – 50 µm

Example: printed interconnects(dieelectric insulator)

To protect the wafer from non-uniform processing steps that lead to particles generated at the edge.

Example: Wafer edge protection

With edge clearance

Partial edge

coverage

Full edge coverage

Angled view

Edge protection

Load

cassette

Inkjet print first

sideDrying Flip

Inkjet print

second side

DryingUnload

cassette

To protect the wafer from non-uniform processing steps that lead to particles generated at the edge.

Example: Wafer edge protection

With edge clearance

Partial edge

coverage

Full edge coverage

Angled view

Edge protection

Load

cassette

Inkjet print first

sideDrying Flip

Inkjet print

second side

DryingUnload

cassette

Meyer Burger product portfolio

Displays

PCB

Photovoltaics

Semiconductors

Printed Electronics

IP410

Engineering

&

Pilot line

JETx

Mass

production

LP50

R&D

Welcome to our booth at A4-225