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Reference Number: 323342-002
Intel® Xeon® Processor7500 Series Intel® Xeon® Processor E7-8800/4800/2800 Product FamiliesThermal and Mechanical Design Guide
April 2011
2 Thermal Mechanical Design Guide
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.The Intel Xeon Processor 7500 Series, Intel® Xeon® processor E7-8800/4800/2800 product families and LGA1567 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software and overall system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology.For more information, see http://www.intel.com/technology/turboboost.Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.Intel, Xeon, and the Intel logo are trademarks of Intel Corporation in the U.S and other countries.* Other brands and names may be claimed as the property of others.Copyright © 2007-2011, Intel Corporation.
Thermal Mechanical Design Guide 3
Contents
1 Introduction ..............................................................................................................91.1 References ....................................................................................................... 101.2 Definition of Terms ............................................................................................ 10
2 LGA1567 Socket ...................................................................................................... 132.1 Mechanical Requirements ................................................................................... 13
2.1.1 Attachment to Printed Circuit Board (PCB) ................................................. 132.1.2 Pad Dimensions ..................................................................................... 142.1.3 LGA1567 Socket NCTF Solder Joints.......................................................... 142.1.4 Socket Loading and Deflection Specifications.............................................. 152.1.5 Clarification of Static Compressive Load Values .......................................... 162.1.6 Critical-to-Function Interfaces .................................................................. 162.1.7 Pick-and-Place and Handling Cover ........................................................... 172.1.8 Socket Housing Material .......................................................................... 182.1.9 Socket Markings..................................................................................... 182.1.10 Solder Ball Characteristics ....................................................................... 18
2.2 Maximum Socket Temperature............................................................................ 192.3 Electrical Requirements...................................................................................... 19
3 Independent Loading Mechanism (ILM)................................................................... 213.1 Allowable Board Thickness.................................................................................. 213.2 Description of ILM Versions................................................................................. 213.3 ILM Assembly ................................................................................................... 223.4 ILM Back Plate Assembly .................................................................................... 233.5 ILM Load Specifications ...................................................................................... 243.6 ILM Cover ........................................................................................................ 24
3.6.1 HL-ILM Cover ........................................................................................ 253.6.2 LP-ILM Cover ......................................................................................... 25
3.7 Components Assembly ....................................................................................... 26
4 Processor Thermal Solutions ................................................................................... 294.1 Processor Thermal Targets ................................................................................. 294.2 Mechanical Targets ............................................................................................ 29
4.2.1 Package/Socket Stackup Height ............................................................... 304.2.2 Mechanical Parameters ........................................................................... 30
4.3 Intel Reference Design Heat Sink ........................................................................ 314.3.1 Allowable Board Thickness....................................................................... 314.3.2 Tower Heatsink Performance.................................................................... 314.3.3 Tower Heatsink Load Range..................................................................... 314.3.4 Thermal Interface Material (TIM) .............................................................. 31
4.4 Heatsink Design Considerations........................................................................... 324.5 Thermal Interface Material (TIM) Considerations.................................................... 334.6 Mechanical Considerations .................................................................................. 334.7 Structural Considerations ................................................................................... 344.8 Thermal Design Guidelines ................................................................................. 34
4.8.1 Intel® Turbo Boost Technology ................................................................ 344.8.2 Absolute Processor Temperature .............................................................. 354.8.3 Thermal Characterization Parameter ......................................................... 354.8.4 Fan Speed Control .................................................................................. 36
5 Quality, Reliability and Ecological Requirements...................................................... 395.1 Intel Reference Component Validation.................................................................. 39
5.1.1 Board Functional Test Sequence ............................................................... 39
4 Thermal Mechanical Design Guide
5.1.2 Post-Test Pass Criteria.............................................................................395.1.3 Recommended BIOS/Processor/Memory Test Procedures .............................39
5.2 Heatsink Test Conditions.....................................................................................405.3 LGA1567 Socket Reliability Testing and Results......................................................425.4 Socket Durability Test ........................................................................................425.5 Ecological Requirement.......................................................................................42
A Supplier Information................................................................................................43A.1 Intel Enabling Component Suppliers .....................................................................43
B LGA 1567 Socket Mechanical Drawings ....................................................................45
C Independent Loading Assembly (ILM)Drawings and Backplate Assembly Drawings ...........................................................51
D Tower Heatsink Drawings ........................................................................................73
E Enabled Component Board Keepout Drawings ..........................................................89
F Electrical Methodology .............................................................................................97F.1 Measuring Electrical Resistance of the Jumper .......................................................97F.2 Determining Maximum Electrical Resistance ..........................................................97F.3 Inductance .......................................................................................................98
F.3.1 Design Procedure for Inductance Measurements .........................................99F.3.2 Correlation of Measurement and Model Data Inductance ............................100
F.4 Dielectric Withstand Voltage..............................................................................101F.5 Insulation Resistance .......................................................................................101F.6 Contact Current Rating .....................................................................................101
Figures
1-1 Socket Stack for the Intel® Xeon® Processor 7500 Series Platform .................................. 92-1 LGA1567 Socket with Pick and Place Cover Removed ....................................................132-2 Corner Pad Definition on board corresponding to nTCF Solder Balls .................................142-3 LGA1567 Socket Contact Numbering and NCTF Solder Joints (Shown in Gray) ..................152-4 Pick-and-Place Cover (PnP Cap)..................................................................................172-5 Recommended vias for Socket temperature measurement (shown in red) ........................193-1 High Load ILM (HL-ILM) Assembly (shown with PCB and Processor).................................233-2 Low Profile ILM (LP-ILM) Assembly (shown with PCB and Processor)................................233-3 Back Plate Assembly .................................................................................................243-4 HL-ILM Cover assembly onto HL-ILM...........................................................................253-5 LP-ILM Cover Assembly onto LP-ILM ...........................................................................263-6 Socket and Backer Plate Assembly..............................................................................273-7 ILM and Processor Assembly ......................................................................................274-1 Tower Heatsink Performance Curves for 130W..............................................................314-2 Processor Thermal Characterization Parameter Relationships ..........................................364-3 TCONTROL and Fan Speed Control .............................................................................375-1 Example Thermal Cycle - Actual Profile Will Vary...........................................................41B-1 LGA 1567 Socket Mechanical Drawing – Sheet 1 of 4.....................................................46B-2 LGA 1567 Socket Mechanical Drawing – Sheet 2 of 4.....................................................47B-3 LGA 1567 Socket Mechanical Drawing – Sheet 3 of 4.....................................................48B-4 LGA 1567 Socket Mechanical Drawing – Sheet 4 of 4.....................................................49C-1 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 1 of 7.....52C-2 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 2 of 7.....53C-3 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 3 of 7.....54C-4 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 4 of 7.....55C-5 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 5 of 7.....56
Thermal Mechanical Design Guide 5
C-6 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 6 of 7 .... 57C-7 High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 7 of 7 .... 58C-8 Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 1 of 8 ... 59C-9 Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 2 of 8 ... 60C-10Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 3 of 8 ... 61C-11Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 4 of 8 ... 62C-12Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 5 of 8 ... 63C-13Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 6 of 8 ... 64C-14Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 7 of 8 ... 65C-15Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 8 of 8 ... 66C-16Backplate Assembly Drawing – Sheet 1 of 5 ................................................................ 67C-17Backplate Assembly Drawing – Sheet 2 of 5 ................................................................ 68C-18Backplate Assembly Drawing – Sheet 3 of 5 ................................................................ 69C-19Backplate Assembly Drawing – Sheet 4 of 5 ................................................................ 70C-20Backplate Assembly Drawing – Sheet 5 of 5 ................................................................ 71D-1 Tower Heatsink Drawing – Sheet 1 of 14..................................................................... 74D-2 Tower Heatsink Drawing – Sheet 2 of 14..................................................................... 75D-3 Tower Heatsink Drawing – Sheet 3 of 14..................................................................... 76D-4 Tower Heatsink Drawing – Sheet 4 of 14..................................................................... 77D-5 Tower Heatsink Drawing – Sheet 5 of 14..................................................................... 78D-6 Tower Heatsink Drawing – Sheet 6 of 14..................................................................... 79D-7 Tower Heatsink Drawing – Sheet 7 of 14..................................................................... 80D-8 Tower Heatsink Drawing – Sheet 8 of 14..................................................................... 81D-9 Tower Heatsink Drawing – Sheet 9 of 14..................................................................... 82D-10Tower Heatsink Drawing – Sheet 10 of 14................................................................... 83D-11Tower Heatsink Drawing – Sheet 11 of 14................................................................... 84D-12Tower Heatsink Drawing – Sheet 12 of 14................................................................... 85D-13Tower Heatsink Drawing – Sheet 13 of 14................................................................... 86D-14Tower Heatsink Drawing – Sheet 14 of 14................................................................... 87E-1 Enabled Component Board Keepout Mechanical Drawing –
Sheet 1 of 7 ............................................................................................................ 90E-2 Enabled Component Board Keepout Mechanical Drawing –
Sheet 2 of 7 ............................................................................................................ 91E-3 Enabled Component Board Keepout Mechanical Drawing –
Sheet 3 of 7 ............................................................................................................ 92E-4 Enabled Component Board Keepout Mechanical Drawing –
Sheet 4 of 7 ............................................................................................................ 93E-5 Enabled Component Board Keepout Mechanical Drawing –
Sheet 5 of 7 ............................................................................................................ 94E-6 Enabled Component Board Keepout Mechanical Drawing –
Sheet 6 of 7 ............................................................................................................ 95E-7 Enabled Component Board Keepout Mechanical Drawing –
Sheet 7of 7 ............................................................................................................. 96F-1 Methodology for Measuring Total Electrical Resistance................................................... 97F-2 Methodology for Measuring Electrical Resistance of the Jumper ...................................... 97F-3 Inductance Measurement Fixture Cross-Section ........................................................... 99F-4 Measurement Fixture Cross-Section.......................................................................... 100
Tables1-1 Reference Documents............................................................................................... 101-2 Terms and Descriptions ............................................................................................ 102-1 Socket Loading and Deflection Specifications ............................................................... 152-2 Critical-to-Function Interface Dimensions .................................................................... 172-3 LGA1567 Electrical Requirements ............................................................................... 19
6 Thermal Mechanical Design Guide
3-1 ILM Comparison Summary.........................................................................................213-2 ILM Load Specifications .............................................................................................244-1 Processor Boundary Conditions and Performance Targets...............................................294-2 Processor and LGA1567 Socket Stackup Height ............................................................304-3 Mechanical Parameters..............................................................................................304-4 TIM Specification ......................................................................................................324-5 Fan Speed Control, TCONTROL and DTS Relationship ...................................................375-1 Tower Heatsink Test Conditions and Qualification Criteria...............................................40A-1 Suppliers for the Processor Heatsink ...........................................................................43A-2 LGA1567 Socket and ILM Part Number and Supplier Contact Information .........................43A-3 Alternate Suppliers with Thermal Solutions Designed for the
Intel Xeon Processor 7500 Series................................................................................44B-1 Mechanical Drawing List ............................................................................................45C-1 Mechanical Drawing List ............................................................................................51D-1 Mechanical Drawing List ............................................................................................73E-1 Mechanical Drawing List ............................................................................................89
Thermal Mechanical Design Guide 7
Revision History
§
Document Number
Revision Number Description Revision Date
323342 001 • Public release March 2010
323342 002 • Update Intel® Xeon® processor E7-8800/4800/2800 product families April 2011
8 Thermal Mechanical Design Guide
Thermal Mechanical Design Guide 9
Introduction
1 Introduction
This document provides guidelines for the design of thermal and mechanical solutions for the Intel® Xeon® processor 7500 series and the Intel® Xeon® processor E7-8800/4800/2800 product families. Both processors are compatible with the LGA1567 Socket (Chapter 2) and the ILM (Chapter 3). Both processors adhere to the same thermal specifications found in the Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 and Intel® Xeon® Processor 7500 Series Datasheet, Volume 1 (see Table 1-1, “Reference Documents”). Thermal solutions designed for the Intel Xeon processor 7500 series will also be compatible with Intel Xeon processor E7-8800/4800/2800 product families (Chapter 4). The components described in this document include:
• The processor thermal solution (heatsink) and associated retention hardware
• The LGA1567 socket, Independent Loading Mechanism (ILM) and back plate
The goals of this document are:
• To assist board and system thermal mechanical designers
Figure 1-1. Socket Stack for the Intel® Xeon® Processor 7500 Series Platform
Introduction
10 Thermal Mechanical Design Guide
• To assist designers and suppliers of processor heatsinks
Thermal profiles and other processor specifications are provided in Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 and Intel® Xeon® Processor 7500 Series Datasheet, Volume 1.
1.1 ReferencesMaterial and concepts available in the following documents may be beneficial when reading this document.
Notes:1. Document numbers indicated in Location column are subject to change. See IBP [http://tigris.intel.com/
scripts-edk/viewer/UI_UpdateDesignKits.asp?edkID=7281&ProdID=21201&CatID=0] for the most up-to-date collateral list.
1.2 Definition of Terms
Table 1-1. Reference Documents
Document Doc# Notes
Intel® Xeon® Processor 7500 Series Datasheet, Volume 1 323340-001 1
Intel® Xeon® Processor 7500 Series Mechanical Model 323530-001 1
Intel® Xeon® Processor 7500 Series Thermal Model 323531-001 1
Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 of 2
325119-001 1
Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 2 of 2
325120-001 1
Intel® 7500, 7510, and 7512 Scalable Memory Buffer Thermal/Mechanical Design Guidelines
322828-002 1
Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct. For this example, it can be expressed as a dimension away from the outside dimension of the fins to the nearest surface.
DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC activation temperature.
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the thermal performance of the package. Component thermal solutions interface with the processor at the IHS surface.
ILM Independent Loading Mechanism provides the force needed to seat the 1567-LGA land package onto the socket contacts.
LGA1567 socket The processor mates with the system board through this surface mount, 1567-land socket.
PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a communication channel between Intel processor and chipset components to external monitoring devices.
ΨCA Case-to-ambient thermal resistance parameter (psi). A measure of thermal solution performance using total package power. Defined as (TCASE – TLA) / Total Package Power. Heat source should always be specified for Ψ measurements.
ΨCS Case-to-sink thermal characterization parameter. A measure of thermal interface material performance using total package power. Defined as (TCASE – TS) / Total Package Power.
Thermal Mechanical Design Guide 11
Introduction
§
ΨSA Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using total package power. Defined as (TS – TLA) / Total Package Power.
TCASE The case temperature of the processor, measured at the geometric center of the package substrate (not the IHS).
TCASE_MAX The maximum case temperature as specified in a component specification.
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by using clock modulation and/or operating frequency and input voltage adjustment when the die temperature is very near its operating limits.
TCONTROL Tcontrol is a static value below TCC activation used as a trigger point for fan speed control.
TDP Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate.
Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature.
Thermal Profile Line that defines case temperature specification of a processor at a given power level.
TIM Thermal Interface Material: The thermally conductive compound between the heatsink and the processor case. This material fills the air gaps and voids, and enhances the transfer of the heat from the processor case to the heatsink.
TLA The measured ambient temperature locally surrounding the processor. The ambient temperature should be measured just upstream of a passive heatsink or at the fan inlet for an active heatsink.
TSA The system ambient air temperature external to a system chassis. This temperature is usually measured at the chassis air inlets.
U A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, and so forth.
Table 1-2. Terms and Descriptions (Sheet 2 of 2)
Term Description
Introduction
12 Thermal Mechanical Design Guide
Thermal Mechanical Design Guide 13
LGA1567 Socket
2 LGA1567 Socket
This section describes a surface mount, LGA (Land Grid Array) socket intended for Intel Xeon Processor 7500 Series and Intel Xeon processor E7-8800/4800/2800 product families. The socket provides I/O, power and ground contacts. The socket contains 1567contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard.
The socket has 1567 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a 52x46 grid with 32x24 grid depopulation in the center of the array and selective depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent Loading Mechanism (ILM). The design includes a back plate which is integral to having a uniform load on the socket solder joints. Socket loading specifications are listed in Section 2-1.
See Appendix A for LGA1567 Socket supplier information and part numbers.
2.1 Mechanical Requirements
2.1.1 Attachment to Printed Circuit Board (PCB)The socket will be attached to the motherboard via its 1567 contact solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket to the motherboard.
Figure 2-1. LGA1567 Socket with Pick and Place Cover Removed
LGA1567 Socket
14 Thermal Mechanical Design Guide
In installed condition, the socket is sandwiched between the processor package and the system board. An independent loading mechanism (ILM) will apply a static compression load, as described in this chapter.
2.1.2 Pad DimensionsThe system board must have a solder pad array matching socket BGA. Recommended solder pads are circular with a diameter of 0.45 mm (18 mils). They can be a combination of metal defined (MD) and solder mask defined (SMD).
Intel recommends that pads under the nCTF joints be solder mask defined (SMD). These are shown as the 8 corner pads at each of the 4 corners (marked in green in Figure 2-2) and should have a 26 mil Cu pad size.
Also see Section 2.1.3.
2.1.3 LGA1567 Socket NCTF Solder JointsIntel has defined selected solder joints of the socket as non-critical to function (NCTF) when evaluating package solder joints post environmental testing. The signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. Figure 2-3 identifies the NCTF solder joints.
Figure 2-2. Corner Pad Definition on board corresponding to nTCF Solder Balls
Thermal Mechanical Design Guide 15
LGA1567 Socket
2.1.4 Socket Loading and Deflection SpecificationsTable 2-1 provides load and board deflection specifications for the LGA1567 Socket. These mechanical limits should not be exceeded during component assembly, mechanical stress testing, or standard drop and shipping conditions. All dynamic requirements are under room temperature conditions while all static requirements are under 100 °C conditions.
Figure 2-3. LGA1567 Socket Contact Numbering and NCTF Solder Joints (Shown in Gray)
BMBLBKBJBHBGBFBEBDBCBBBAAYAWAVAUATARAPANAMALAKAJAHAGAFAEADACABAAYWVUTRPNMLKJHGFEDCBA
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46
Table 2-1. Socket Loading and Deflection Specifications (Sheet 1 of 2)
ParameterSI Units English Units
NotesMin Max Unit Min Max Unit
Static Compressive per Contact 15 38 gf 0.53 1.34 ozf 1
Static Pre-Load Compressive 289 623 N 60 140 lbf 2
Static Total Compressive 578 934 N 110 210 lbf 3
Dynamic Compressive 588 N 132 lbf 4
LGA1567 Socket
16 Thermal Mechanical Design Guide
Notes:1. The compressive load applied by the package on the LGA contacts to meet electrical performance. This
condition must be satisfied throughout the life of the product.2. The load applied by the ILM onto the socket through the processor package.3. The total load applied by both the ILM and the heatsink onto the socket through the processor package.4. Quasi-static equivalent compressive load applied during the mechanical shock from heatsink, calculated
using a reference 600g heatsink with a 25G shock input and an amplification factor of 3 (600g x 25G x 3 = 99 lbf). This specification can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this value. Intel reference system shock requirement for this product family is 25G input as measured at the chassis mounting location.
5. Maximum allowable strain below socket BGA corners during transient loading events (i.e., slow displacement events) which might occur during board manufacturing, assembly or testing. See the LGA1567 BFI Strain Guidance Sheet. Contact your CQE for this datasheet.
6. See Section 2.3 for more details. Reference Table 4-3, “Mechanical Parameters”.
2.1.5 Clarification of Static Compressive Load ValuesThe minimum Static Pre-Load Compressive value listed in Table 2-1, “Socket Loading and Deflection Specifications” is the force provided by the ILM and should be sufficient for rudimentary continuity testing of the socket and/or board. This load value will not ensure normal operation throughout the life of the product. Please see Table 3-2, “ILM Load Specifications”.
The minimum Static Total Compressive value listed in Table 2-1, “Socket Loading and Deflection Specifications” will ensure socket reliability over the life of the product and that the contact resistance between the processor and the socket contacts meets the values outlined in Table 2-3, “LGA1567 Electrical Requirements”.
Please refer to Section 4.2 for a more thorough description of load distribution for the various ILMs and heatsinks.
2.1.6 Critical-to-Function InterfacesCritical-to-function (CTF) dimensions for motherboard layout and assembled components’ interface to the socket are identified in Table 2-2. The CTF values are detailed on the socket drawing, which is provided in Appendix B. All sockets manufactured must meet the specified CTF dimensions. These dimensions will be verified as part of the validation process.
Note: Unless otherwise specified, interpret dimensions and tolerances in accordance with ASME Y14.5M-1994. Dimensions are in millimeters.
Board Transient Strain 5
Board Deflection under socket solder ball array under Maximum Static Compressive Load
62 mil boards
0.30 mm 0.012 in. 6
70 mil to 120 mil boards
0.25 mm 0.010 in.
Table 2-1. Socket Loading and Deflection Specifications (Sheet 2 of 2)
ParameterSI Units English Units
NotesMin Max Unit Min Max Unit
Thermal Mechanical Design Guide 17
LGA1567 Socket
Note: *Dimensions are to be measured post SMT.
2.1.7 Pick-and-Place and Handling CoverTo facilitate high-volume manufacturing, the socket shall have a detachable cover to support the vacuum type Pick and Place system. The cover could also be used as a protective device to prevent damage to the contact field during motherboard assembly and handling. The cover design shall meet or exceed the applicable requirements of SEMI S8-0999, Safety Guidelines for Ergonomics/Human Factors Engineering of Semiconductor Manufacturing Equipment. The removal and replacement of the cover shall not cause any possible damage to the socket body, contact pins or the cover itself.
Table 2-2. Critical-to-Function Interface Dimensions
Description Sheet/Zone
Socket Package Alignment Cavity Length * D91065 rev 2, Sheet 2, Zone G6 and G7
Socket Package Alignment Cavity Width * D91065 rev 2, Sheet 2, Zone F5
Socket Height (from Package Seating Plane to MB after Reflow) *
D91065 rev 2, Sheet 2, Zone A3
Seating Plane Co-planarity * D91065 rev 2, Sheet 2, Zone C4
Through Cavity Length D91065 rev 2, Sheet 2, Zone D6 and D7
Through Cavity Width D91065 rev 2, Sheet 2, Zone E8
Through Cavity X-Position D91065 rev 2, Sheet 2, Zone D6 and D7
Through Cavity Y-Position D91065 rev 2, Sheet 2, Zone E8
Stand-Off Gap (Solder Ball to Stand-Off) D91065 rev 2, Sheet 2, Zone C4
Solder Ball Feature Relating True Position D91065 rev 2, Sheet 2, Zone C1
Solder Ball Co-planarity D91065 rev 2, Sheet 2, Zone B3
Contact Height Above Seating Plane * D91065 rev 2, Sheet 2, Zone A4 and A5
Contact True Position * D91065 rev 2, Sheet 2, Zone C5
Contact Co-Planarity* D91065 rev 2, Sheet 2, Zone B4 and B5
Figure 2-4. Pick-and-Place Cover (PnP Cap)
LGA1567 Socket
18 Thermal Mechanical Design Guide
2.1.8 Socket Housing MaterialThe socket housing material should be of thermoplastic or equivalent, UL 94 V-0 flame rating, temperature rating, and design capable of maintaining structural integrity following a temperature of 260°C for 40 seconds, which is typical of a reflow/rework profile for solder material used on the socket. The material must have a thermal coefficient of expansion in the XY plane capable of passing reliability tests rated for an expected high-operating temperature, mounted on HTg FR4-type motherboard material. The creep properties of the material must be such that the mechanical integrity of the socket is maintained for the use condition outlined in Chapter 5.
2.1.9 Socket MarkingsAll markings required in this section must withstand a temperature of 260°C for 40 seconds, which is typical of a reflow/rework profile for solder material used on the socket, as well as any environmental test procedure outlined in Chapter 5, without degrading.
2.1.9.1 Name
LF-LGA1567 (Font type is Helvetica Bold – minimum 6 point (or 2.125 mm)).
Note: This mark shall be stamped or laser marked into the sidewall of the stiffener plate on the actuation lever side.
Manufacturer’s insignia (font size at supplier’s discretion).This mark will be molded or laser marked into the top side of the socket housing.
Both socket name and manufacturer’s insignia will be visible when first seated on the motherboard.
2.1.9.2 Lot Traceability
Each socket will be marked with a lot identification code to allow traceability of all components, date of manufacture (year and week), and assembly location. The mark must be placed on a surface that is visible after the socket is mounted on the motherboard. In addition, this identification code must be marked on the exterior of the box in which the unit is shipped.
2.1.9.3 Pin 1 Identification
The socket will have markings identifying Pin 1. This marking will be represented by a clearly visible triangular symbol in the location specified.
2.1.10 Solder Ball Characteristics
2.1.10.1 Number of Solder Balls
Total number of solder balls: 1567.
2.1.10.2 Material
Lead free solder alloy having a melting point temperature of 217°C maximum (for example, SnAgCu) and be compatible with Immersions silver surface finish with SnAg/SnAgCu solder paste.
Thermal Mechanical Design Guide 19
LGA1567 Socket
2.2 Maximum Socket TemperatureThe power dissipated within the socket is a function of the current at the pin level and the effective pin resistance. To ensure socket long term reliability, Intel defines socket maximum temperature using a via on the underside of the motherboard. Exceeding the temperature guidance may result in socket body deformation, or increases in thermal and electrical resistance which can cause a thermal runaway and eventual electrical failure. The guidance for socket maximum temperature is listed below:
• Via temperature under socket < 96 °C
The recommend via used for temperature measurement is defined by K22 - H25. See Figure 2-5.
The socket maximum temperature is defined at Thermal Design Current (TDC). In addition, the heatsink performance targets and boundary conditions of Table 4-1 and Table 4-2 must be met to limit power dissipation through the socket. To measure via temperature:
1. Drill a hole through the back plate at the specific via defined above. 2. Thread a T-type thermocouple (36 - 40 gauge) through the hole and glue it into the
specific via on the underside of the motherboard.
3. Once the glue dries, reinstall the back plate and measure the temperature.
2.3 Electrical RequirementsLGA1567 electrical requirements (see Table 2-3) are measured from the socket-seating plane of the processor (end of the contacts) to the socket solder ball attach at the motherboard. All specifications are maximum values (unless otherwise stated) for a single socket contact, but includes effects of adjacent contacts where indicated. Socket inductance includes exposed metal from mated contact to the PCB land array.
Reference Appendix F for the methodology used to determine these values.
Figure 2-5. Recommended vias for Socket temperature measurement (shown in red)
Table 2-3. LGA1567 Electrical Requirements (Sheet 1 of 2)
Parameter Value Notes
Maximum Mutual Capacitance, C <0.33 pF The capacitance between two contacts
Dielectric Withstand Voltage > 360 Volts RMS
Insulation Resistance > 800 mΩ
LGA1567 Socket
20 Thermal Mechanical Design Guide
§
Contact Resistance, total at End of Life (EOL), 26 °C.
≤ 15.2 mΩ The socket contact resistance target is derived from the resistance of each chain minus resistance of shorting bars divided by number contacts within the daisy chain. The bulk resistance of the contact metal body, and interface resistance to the package LGA lands are included.This LLCR target applies with 1% failure rate at 60% confidence interval among all measured chains of the whole population being tested.
Contact Bulk Resistance, at 26 °C ≤ 9.5 mΩ Resistance of each contact as measured from tip to tip. Interface resistances are excluded. FEA model using minimum conductivity value can be used in lieu of measurement.
Contact Bulk Resistance Increase ≤ 3 mΩ The bulk resistance increase per contact from 24°C to 100°C
Total Loop Inductance, Loop <3.9 nH The inductance calculated or measured for a pair of two adjacent contacts, considering one forward conductor and one return conductor.These values must be satisfied at the worst-case socket contact height (that is, minimum deflection) in assembled configuration
Mated partial mutual inductance, L < 0.95 nH The inductance on a contact due to any single neighboring contact.
Differential return loss < -13 dB Measurements/simulations conditions:1. Termination impedance: 90 Ohm, differential2. Test structure overview will be provided later3. All details of Frequency domain S parameters specs will be provided in later revision
Differential Insertion loss < |-0.6 dB|
Cross-talk < -25 dB
Measurement frequency(s) for Contact-to-Contact inductance.
1 GHz Linear region (usually found at higher frequency ranges)
Measurement frequency(s) for Contact-to-Contact capacitance.
400 MHz Capacitively dominated region (usually the lowest measurable frequency)
Table 2-3. LGA1567 Electrical Requirements (Sheet 2 of 2)
Parameter Value Notes
Therrmal Mechanical Design Guide 21
Independent Loading Mechanism (ILM)
3 Independent Loading Mechanism (ILM)
The Independent Loading Mechanism (ILM) provides the force needed to seat the 1567-Land LGA package (i.e., processor) onto the socket contacts. The ILM is physically separate from the socket body. The ILM consists of two major components, the ILM cover and the back plate, that will be procured as a set from the enabled vendors. The assembly of the ILM is expected to occur after the socket is surface mounted. The exact assembly location is dependent on manufacturing preference and test flow. See the Manufacturing Advantage Service collateral for this platform for additional guidance.
The ILM has two critical functions:
• Deliver the force to seat the processor onto the socket contacts
• Distribute the resulting load evenly through the socket solder balls
3.1 Allowable Board ThicknessThe components described in this document (namely ILM, back plate and heatsink) will support board thickness in the range of 1.8 - 3.0 mm (0.072" - 0.118"). Boards (PCBs) not within this range may require modifications to the back plate and heatsink retention. Please contact the component suppliers for modifications (see Appendix A, “Intel Enabling Component Suppliers”).
3.2 Description of ILM VersionsThere are two versions (SKUs) of ILM for the Nehalem-EX processor. The first version (as described in Rev 1.0 and previous) has been renamed to High-Load ILM (HL-ILM). The second version of the ILM, called the Low Profile ILM (LP-ILM), has important differences. The Low Profile ILM was developed to eliminate the need for a pedestal on the processor heatsink. An unavoidable trade-off is a reduction in the applied load by the Low Profile ILM. This requires that heatsink solutions implementing the LP-ILM will need to increase the load applied to the top of the IHS. Another requirement for heatsinks implementing the LP-ILM will be two small pockets in the heatsink bottom to clear the fingers which touch the top of the IHS. A summary of these differences is articulated in the following table.
Table 3-1. ILM Comparison Summary (Sheet 1 of 2)
High Load ILM (HL-ILM)
Low Profile ILM(LP-ILM)
ILM Applied LoadFILM
Min. 80 lbf / 400 N 60 lbf / 289 N
Max 140 lbf / 623 N 105 lbf / 467 N
Heatsink Applied Load 1
FHEATSINK Min. 30 lbf / 178 N 50 lbf / 289 N
Max 70 lbf / 311 N 105 lbf / 467 N
Independent Loading Mechanism (ILM)
22 Therrmal Mechanical Design Guide
Notes:1. See Table 4-3, “Mechanical Parameters”, for more information on heatsink applied loads for each ILM
implementation.2. See Table 2-1, “Socket Loading and Deflection Specifications”, for Static Total Compressive Load values.
Socket load is the addition of the ILM and Heatsink applied load according to the equation: FILM + FHEATSINK = FSOCKET
A picture of each ILM version is shown in Figure 3-1 and Figure 3-2.
Both ILM versions will be “build to print” from Intel controlled drawings. See Appendix C for drawings.
See Appendix A, “Intel Enabling Component Suppliers” for ILM supplier information and part numbers.
3.3 ILM AssemblyThe ILM is an assembly of a load plate, a frame, and a lever. Four fasteners secure the ILM frame to the backer plate.
All pieces in the ILM assembly, except the frame and fasteners, are fabricated from stainless steel and plated where appropriate. The frame is made from high-strength steel. The fasteners are fabricated from a high-carbon steel. The frame provides the hinge locations for the load lever and load plate.
The ILM design ensures that once installed onto the baseboard and secured to the backer plate, the only features touching the board are the captive fasteners. The nominal gap of the frame to the board is ~1 mm.
When the load plate is closed, compressive load is applied onto the processor package from the top of the IHS at two points. See load plate “dimpled” features shown in Figure 3-1. The reaction force from closing the load plate is transmitted to the frame and through the captive fasteners to the backer plate. Some of the load is passed through the socket body to the board, inducing a slight compression on the solder joints.
Socket Static Total Compressive Load 2FSOCKET
Min. 110 lbf / 578 N
Max 210 lbf / 934 N
Thermal resistance impact (C/W) 0.022 0 (baseline)
Heatsink required features 2.5mm pedestal 2 pockets (~14x12x2.5mm)
Table 3-1. ILM Comparison Summary (Sheet 2 of 2)
High Load ILM (HL-ILM)
Low Profile ILM(LP-ILM)
Therrmal Mechanical Design Guide 23
Independent Loading Mechanism (ILM)
3.4 ILM Back Plate AssemblyThe back plate consists of a flat steel back plate with four internally threaded inserts for ILM attach, and two inserts for heatsink attach. The inserts are press fit into the back plate. A cavity is located at the center of the plate to allow access to the baseboard test points and backside capacitors. An insulator is pre-applied to prevent shorting the board.
Figure 3-1. High Load ILM (HL-ILM) Assembly (shown with PCB and Processor)
Figure 3-2. Low Profile ILM (LP-ILM) Assembly (shown with PCB and Processor)
Independent Loading Mechanism (ILM)
24 Therrmal Mechanical Design Guide
Both versions of the ILM (the LP-ILM and the HL-ILM) are compatible with this back plate.
3.5 ILM Load SpecificationsThe HL-ILM is designed to achieve the minimum Socket Static Pre-Load Compressive load specification. The thermal solution (heatsink) should apply additional load to achieve the Socket Static Total Compressive load (see Table 2-1, “Socket Loading and Deflection Specifications”). The heatsink load will be applied to the IHS (Integrated Heat Spreader). The dual-loading approach is represented by the following equation:
FILM + FHEATSINK = FSOCKET
The ILM static load targets are given in Table 3-2.
3.6 ILM CoverTo provide additional protection to during manufacturing and handling, an ILM Cover is available to help mitigate damaging socket contacts. The ILM cover provides protection until a processor is installed.
Figure 3-3. Back Plate Assembly
Insulator
Heatsink attach points (x2)
ILM attach points (x4)
Cavity
Table 3-2. ILM Load Specifications
ParameterSI Units (N) English Units (lbf)
NotesMin Max Min Max
HL-ILM Static Compressive Load 356 623 80 140 Nominal load = 467 N / 105 lbf
LP-ILM Static Compressive Load 267 467 60 105 Nominal load = 334 N / 75 lbf
Therrmal Mechanical Design Guide 25
Independent Loading Mechanism (ILM)
There are several versions developed that snap into the ILM. Please see Table A-2, “LGA1567 Socket and ILM Part Number and Supplier Contact Information” for ordering information.
There is an ILM Cover for each version of ILM.
3.6.1 HL-ILM CoverThe HL-ILM Cover cannot coexist with the LGA1567 Pick and Place Cover as shown in Figure 3-4. Meaning that the operator will need to remove the Socket Cap in order to install the ILM Cover. Please see Table A-2, “LGA1567 Socket and ILM Part Number and Supplier Contact Information”.
3.6.2 LP-ILM CoverThe LP-ILM Cover cannot coexist with the LGA1567 Pick and Place Cover as shown in Figure 3-5. In fact, the LGA1567 Pick and Place Cover (Socket Cover) will not physically fit under the LP-ILM load plate once closed. Please see Table A-2, “LGA1567 Socket and ILM Part Number and Supplier Contact Information”.
Figure 3-4. HL-ILM Cover assembly onto HL-ILM
Independent Loading Mechanism (ILM)
26 Therrmal Mechanical Design Guide
3.7 Components Assembly The Intel Xeon processor 7500 series thermal mechanical solution assembly begins with surface mounting the LGA1567 socket onto the baseboard. The remaining steps assume the socket is already surface-mounted:
1. Back Plate and ILM Installation:
The standoff pattern on the backer plate also acts as a key-in feature. Align the backer plate standoff pattern to the baseboard’s hole pattern before mating the backer plate to the baseboard.
Before installing the ILM, be sure that it is already assembled with the lever and the fasteners. The ILM fastener pattern also acts as a key-in feature. Align the ILM fastener pattern to the baseboard hole pattern. Tighten the fasteners with the matching torque driver set to ~8 in-lbf [0.9 N.m]. Verify that the ILM and the backer plate are properly installed. There should be a uniform gap between the ILM and the base board, and virtually no gap between the backer plate and the baseboard.
2. Processor Installation:
Release the ILM lever to access the LGA1567 socket. Carefully remove the socket cover to avoid damaging the socket contacts. Inspect the socket for contact damage or foreign materials. Orient the processor such that the processor pin1 faces the same direction as the socket pin1. Carefully place the processor on the socket and verify that it is seated properly. Two side protrusions on the socket will prevent the package from resting flat on the socket if the processor is not properly aligned to the socket. Close the ILM cover and secure the lever.
For more detailed installation instructions as well as recommendations on board manufacturing, please download the Intel® Xeon® Processor 7500 Series-based Platform Manufacturing Advantage Service document found on http://learn.intel.com (please input code: ME709).
Figure 3-5. LP-ILM Cover Assembly onto LP-ILM
Therrmal Mechanical Design Guide 27
Independent Loading Mechanism (ILM)
.
§
Figure 3-6. Socket and Backer Plate Assembly
Figure 3-7. ILM and Processor Assembly
Independent Loading Mechanism (ILM)
28 Therrmal Mechanical Design Guide
Therrmal Mechanical Design Guide 29
Processor Thermal Solutions
4 Processor Thermal Solutions
This section describes the design guidelines for Intel® Xeon® processor 7500 Series thermal solutions. Also included are the Intel reference heatsink design specifications.
Intel’s reference thermal solutions which were designed for the Intel® Xeon® Processor 7500 series will also be compatible with Intel® Xeon® processor E7-8800/4800/2800 product families thermal specifications.
4.1 Processor Thermal TargetsTable 4-1 provides thermal boundary conditions and performance targets for both the Intel Xeon Processor 7500 series and the Intel Xeon processor E7-8800/4800/2800 product families. These values should guide thermal solution design.
Notes:1. Local ambient temperature of the air entering the heatsink.2. Estimated performance for each heatsink based on the form factor, technology, material, and boundary
conditions. These estimates are not necessarily the thermal performance targets needed to meet processor thermal specifications. Please see Intel® Xeon® Processor 7500 Series Datasheet, Volume 1 and Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1 for processor thermal specifications.
3. Defined as (TCASE_MAX - TLA) / TDP4. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (ΔP) measured in inches H2O.5. Reference system configuration. 1U = 1.75”.6. Dimensions of heatsink do not include socket or processor. 7. Passive heatsinks with Honeywell* PCM45F
4.2 Mechanical Targets Thermal solutions should be designed to meet the mechanical requirements described in this section.
Keep in mind that the heatsink retention will need to apply additional load in order to achieve the minimum Socket Static Total Compressive load (see Table 2-1, “Socket Loading and Deflection Specifications”). This load should be distributed over the IHS (Integrated Heat Spreader). The dual-loading approach is represented by the following equation.
Table 4-1. Processor Boundary Conditions and Performance Targets
Parameter Value
Altitude, system ambient temp
Sea level, 35oC
TDP 95W 105W 130W
TLA1 42oC 42oC 45oC
ΨCA2 0.255 oC/W 0.206 oC/W 0.185 oC/W
ΨCA_MAX3 0.295 oC/W 0.210 oC/W 0.185 oC/W
Airflow4 12.6 CFM @ 0.34” ΔP 28 CFM @ 0.25” ΔP 36 CFM @ 0.20” ΔP
System height (form factor)5
1U 2U 4U
Heatsink volumetric6 90 x 90 x 26.5mm 90 x 90 x 51mm 100 x 70 x 102.5mm
Heatsink technology7 Cu base, Al fins Cu base, Al fins Cu/Al base / Al fins / heatpipes
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30 Therrmal Mechanical Design Guide
FILM + FHEATSINK = FSOCKET
Values for the Heatsink applied loads are given in Table 4-3.
4.2.1 Package/Socket Stackup HeightTable 4-2 provides the stackup height of a processor and LGA1567 socket with processor fully seated on the socket seating plane.
Notes:1. This data is provided for information only, and should be derived from: (a) the height of the socket seating
plane above the motherboard after reflow, given in Appendix B, “LGA 1567 Socket Mechanical Drawings”, (b) the height of the package, from the package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that are given in Intel® Xeon® Processor 7500 Series Datasheet, Volume 1 and Intel® Xeon® Processor E7-8800/4800/2800 Product Families Datasheet, Volume 1.
4.2.2 Mechanical Parameters
Notes:1. In the case of a discrepancy, the most recent datasheets supersede targets listed in the above table.2. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.3. This is the minimum and maximum static force that can be applied by the heatsink and retention solution to maintain the
heatsink and processor interface.4. This specification applies for either thermal retention solutions that prevent baseboard deflection or for the Intel reference
thermal solution.5. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load requirement.6. An experimentally validated test condition used a heatsink mass of acceleration measured on a shock table with a dynamic
amplification factor of 3. This specification can have flexibility in specific values, but the ultimate product of mass times acceleration should not exceed this validated dynamic load.
Table 4-2. Processor and LGA1567 Socket Stackup Height
Integrated Stackup Height (mm)From Top of Board to Top of IHS
7.599 ± 0.50 mm
Table 4-3. Mechanical Parameters
ParameterSI Units English Units
NotesMin Max Unit Min Max Unit
Thermal Solution Mass (includes retention) g 1.32 lbm 4
Heatsink Applied Static Compressive Load (High Load ILM implementation)
133 311 N 30 70 lbf 2,3
Heatsink Applied Static Compressive Load (Low Profile ILM implementation)
222 467 N 50 105 lbf 2,3
Heatsink Applied Dynamic only Compressive load 445 N 100 lbf 2,5,6
Processor Static Compressive Load N 210 lbf 1
Processor Tensile Load 155 N 35 lbf 1
Processor Torque Load 7.9 N-m 70 lbf-in 1
Processor Shear Load 356 N 80 lbf 1
Therrmal Mechanical Design Guide 31
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4.3 Intel Reference Design Heat Sink
4.3.1 Allowable Board ThicknessThe Tower heat sink described in Section 4.3 will support board thickness in the range of 1.8 - 3.0 mm (0.072" - 0.118"). Boards (PCBs) not within this range may require modifications to the back plate and heatsink retention. Please contact suppliers for modifications (see Appendix A, “Intel Enabling Component Suppliers”).
4.3.2 Tower Heatsink PerformanceSee Appendix D for detailed drawings of the Tower (4U) reference heatsink. Figure 4-1 shows thermal resistance (ΨCA) and pressure drop (ΔP) for the 4U heatsink versus the airflow provided. Best-fit equations are provided to prevent errors associated with reading the graph. They are:
• ΔP = (2.407 x 10-05) * CFM2 + (4.526 x 10-03) * CFM
• ΨCA NU = 0.1431 + 1.9451*CFM-1.0719
4.3.3 Tower Heatsink Load RangeThe Tower Heatsink was thermally validated for the load range of 40 lbf to 70 lbf. This is different than the Heatsink Applied Static Compressive Load range listed in Table 4-3, “Mechanical Parameters” (that is, 30 lbf to 70 lbf) and may have a small effect on the heatsink performance.
4.3.4 Thermal Interface Material (TIM)Honeywell PCM45F material was chosen for the Intel reference design. This material will be pre-applied onto the Tower heatsink pedestal.
Figure 4-1. Tower Heatsink Performance Curves for 130W
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32 Therrmal Mechanical Design Guide
The recommended size ensures adequate coverage at the interface between the processor IHS and heatsink pedestal.
Refer to the TIM manufacturer’s guidelines for specifications and handling instructions.
4.4 Heatsink Design ConsiderationsTo remove the heat from the processor, three basic parameters should be considered:
• The area of the surface on which the heat transfer takes place – Without any enhancements, this is the surface of the processor package IHS. One method used to improve thermal performance is to attach a heatsink to the IHS. A heatsink can increase the effective heat transfer surface area by conducting heat out of the IHS and into the surrounding air through fins attached to the heatsink base.
• The conduction path from the heat source to the heatsink fins – Providing a direct conduction path from the heat source to the heatsink fins and selecting materials with higher thermal conductivity typically improves heatsink performance. The length, thickness, and conductivity of the conduction path from the heat source to the fins directly impact the thermal performance of the heatsink. In particular, the quality of the contact between the package IHS and the heatsink base has a higher impact on the overall thermal solution performance as processor cooling requirements become strict. Thermal interface material (TIM) is used to fill in the gap between the IHS and the bottom surface of the heatsink, and thereby improves the overall performance of the thermal stackup (IHS-TIM-Heatsink). With extremely poor heatsink interface flatness or roughness, TIM may not adequately fill the gap. The TIM thermal performance depends on its thermal conductivity as well as the pressure load applied to it. Refer to Section 4.5 for further information on the TIM between the IHS and the heatsink base.
• The heat transfer conditions on the surface upon which heat transfer takes place – Convective heat transfer occurs between the airflow and the surface exposed to the flow. It is characterized by the local ambient temperature of the air, TLA, and the local air velocity over the surface. The higher the air velocity over the surface, the more efficient the resulting cooling. The nature of the airflow can also enhance heat transfer via convection. Turbulent flow can provide improvement over laminar flow. In the case of a heatsink, the surface exposed to the flow includes the fin faces and the heatsink base.
An active heatsink typically incorporates a fan that helps manage the airflow through the heatsink.
Passive heatsink solutions require in-depth knowledge of the airflow in the chassis. Typically, passive heatsinks see slower air speed. Therefore, these heatsinks are typically larger (and heavier) than active heatsinks due to the increase in fin surface necessary to meet a required performance. As the heatsink fin density (the number of fins in a given cross-section) increases, the resistance to the airflow increases; it is
Table 4-4. TIM Specification
ParameterSI Units English Units
NotesMin Max Unit Min Max Unit
TIM Size 24 x 33 by
0.43 thick
mm 0.94 x 1.30 by
0.017 thick
in. Dimensions applies to Honeywell* PCM45F p/n: 95367
PCM45F Activation Load N 28 lbf Load required to meet min. TIM pressure (15 psi)
Therrmal Mechanical Design Guide 33
Processor Thermal Solutions
more likely that the air will travel around the heatsink instead of through it, unless air bypass is carefully managed. Using air-ducting techniques to manage bypass area is an effective method for maximizing airflow through the heatsink fins.
4.5 Thermal Interface Material (TIM) ConsiderationsThermal Interface Material between the processor IHS and the heatsink base is necessary to improve thermal conduction from the IHS to the heatsink. Many thermal interface materials can be pre-applied to the heatsink base prior to shipment from the heatsink supplier without the need for a separate TIM dispense or attachment process in the final assembly factory.
All thermal interface materials should be sized and positioned on the heatsink base in a way that ensures that the entire area is covered. It is important to compensate for heatsink-to-processor positional alignment when selecting the proper TIM size.
When pre-applied material is used, it is recommended to have a protective cover. Protective tape is not recommended as the TIM could be damaged during its removal step.
Thermal performance usually degrades over the life of the assembly and this degradation needs to be accounted for in the thermal performance. Degradation can be caused by shipping and handling, environmental temperature, humidity conditions, load relaxation over time, temperature cycling or material changes (most notably in the TIM) over time. For this reason, the measured TCASE value of a given processor may increase over time, depending on the type of TIM material.
4.6 Mechanical ConsiderationsNote: Determining the performance for any thermal/mechanical solution is the responsibility
of the customer.
An attachment mechanism must be designed to support the heatsink because there are no features on the LGA1567 socket on which to directly attach a heatsink. In addition to holding the heatsink in place on top of the IHS, this mechanism plays a significant role in the performance of the system, in particular:
• Ensuring thermal performance of the TIM applied between the IHS and the heatsink. TIMs, especially those based on phase change materials, are very sensitive to applied pressure: the higher the pressure, the better the initial performance. TIMs such as thermal greases are not as sensitive to applied pressure. Refer to Section 4.2.2 for information on trade-offs made with TIM selection. Designs should consider the possible decrease in applied pressure over time due to potential structural relaxation in enabled components.
• Ensuring system electrical, thermal, and structural integrity under shock and vibration events. The mechanical requirements of the attachment mechanism depend on the weight of the heatsink and the level of shock and vibration that the system must support. The overall structural design of the baseboard and system must be considered when designing the heatsink attachment mechanism. Their design should provide a means for protecting LGA1567 socket solder joints, as well as preventing package pullout from the socket.
Note: The load applied by the attachment mechanism must comply with the package specifications, along with the dynamic load added by the mechanical shock and vibration requirements, as identified in Table 4-3.
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34 Therrmal Mechanical Design Guide
A potential mechanical solution for heavy heatsinks is the use of a supporting mechanism such as a backer plate or the utilization of a direct attachment of the heatsink to the chassis pan. In these cases, the strength of the supporting component can be utilized rather than solely relying on the baseboard strength. In addition to the general guidelines given above, contact with the baseboard surfaces should be minimized during installation in order to avoid any damage to the baseboard.
The Intel reference design for the Intel Xeon processor 7500 series uses such a heatsink attachment scheme. Refer to Section 4.4 for further information regarding the Intel reference mechanical solution.
4.7 Structural ConsiderationsThe mass of the tower heatsinks should not exceed 600 g.
From Table 4-3, the Dynamic Compressive Load of 100 lbf max allows for designs that exceed 600 g as long as the mathematical product does not exceed 100 lbf. Example: A heatsink of 1.5 lbm (680 g) x 35G (acceleration) x 1.9 Dynamic Amplification Factor = 100 lbf.
The heatsink limit of 600g and the use of a back plate have eliminated the need for Direct Chassis Attach retention (as used with the previous Intel® Xeon® Processor 5000 Sequence). Direct contact between back plate and chassis pan will help minimize board deflection during shock.
Placement of board-to-chassis mounting holes also impacts board deflection and resultant socket solder ball stress. Customers need to assess the shock for their designs as heatsink retention (back plate), heatsink mass and chassis mounting holes may vary.
4.8 Thermal Design Guidelines
4.8.1 Intel® Turbo Boost TechnologyIntel® Turbo Boost Technology is a new feature available on certain processor SKUs that opportunistically, and automatically allow the processor to run faster than the marked frequency if all of the following conditions are met:
1. Processor operating at Base Frequency (that is, P1 P-state) 2. Power management not active (i.e., not throttling)
3. Processor operating below its temperature limit (that is, DTS < 0)
4. Processor operating below its power and current limits (that is, < TDP and <ICC_MAX).
Heatsink performance (lower ΨCA as described in Section 4.8) is one of several factors that can impact the amount of Turbo Mode benefit. Other factors are operating environment, workload and system design.
With Turbo Mode enabled, the processor may run more consistently at higher power levels (but still within TDP), and be more likely to operate above TCONTROL, as compared to when Turbo Mode is disabled. This may result in higher acoustics.
Therrmal Mechanical Design Guide 35
Processor Thermal Solutions
Increased IMON accuracy may provide more Turbo Boost benefit on TDP limited applications, as compared to lower ΨCA, as temperature is not typically the limiter for these workloads. See Voltage Regulator Module (VRM) and Enterprise Voltage Regulator-Down (EVRD) 11.1 Design Guidelines (DocID: 397898) for more information regarding IMON accuracy.
4.8.2 Absolute Processor TemperatureIntel does not test any third party software that reports absolute processor temperature. As such, Intel cannot recommend the use of software that claims this capability. Since there is part-to-part variation in the TCC (thermal control circuit) activation temperature, use of software that reports absolute temperature can be misleading.
4.8.3 Thermal Characterization ParameterThe case-to-local ambient Thermal Characterization Parameter (ΨCA) is defined by:
Equation 4-1.ΨCA = (TCASE - TLA) / TDP
Where:TCASE = Processor case temperature (°C). For TCASE specification see Intel®
Xeon® Processor E7- 8800/4800/2800 Product Families Datasheet Volume 1of 2.
TLA = Local ambient temperature in chassis at processor (°C).TDP = TDP (W) assumes all power dissipates through the integrated heat
spreader. This inexact assumption is convenient for heatsink design. TTVs are often used to dissipate TDP. Correction offsets account for differences in temperature distribution between processor and TTV.
Equation 4-2.ΨCA = ΨCS + ΨSA
Where:ΨCS = Thermal characterization parameter of the TIM (°C/W) is dependent
on the thermal conductivity and thickness of the TIM.ΨSA = Thermal characterization parameter from heatsink-to-local ambient
(°C/W) is dependent on the thermal conductivity and geometry of the heatsink and dependent on the air velocity through the heatsink fins.
Figure 4-2 illustrates the thermal characterization parameters.
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36 Therrmal Mechanical Design Guide
4.8.4 Fan Speed ControlFan speed control (FSC) techniques to reduce system-level acoustic noise are a common practice in server designs. The fan speed is one of the parameters that determines the amount of airflow provided to the thermal solution. Additionally, airflow is proportional to a thermal solution’s performance, which consequently determines the TCASE of the processor at a given power level. Because the TCASE of a processor is an important parameter in determining the long-term reliability of a processor, the FSC implemented in a system directly correlates to the processor’s ability to meet the Thermal Profile. For this purpose, the parameter called TCONTROL, as explained in the applicable datasheet, is to be used in FSC designs to ensure that the long-term reliability of the processor is met while keeping the system-level acoustic noise down. Figure 4-3 depicts the relationship between TCONTROL and FSC methodology.
Figure 4-2. Processor Thermal Characterization Parameter Relationships
Therrmal Mechanical Design Guide 37
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The PECI temperature reading from the processor can be compared to this TCONTROL value. A fan speed control scheme can be implemented as described in Table 4-5 without compromising the long-term reliability of the processor.
There are many different ways of implementing fan speed control, including FSC-based on processor ambient temperature, FSC based on processor Digital Thermal Sensor (DTS) temperature, or a combination of the two. If FSC is based only on the processor ambient temperature, low acoustic targets can be achieved under low ambient temperature conditions. However, the acoustics cannot be optimized based on the behavior of the processor temperature. If FSC is based only on the Digital Thermal Sensor, sustained temperatures above TCONTROL drive fans to maximum RPM. If FSC is based both on the ambient and Digital Thermal Sensor, ambient temperature can be used to scale the fan RPM controlled by the Digital Thermal Sensor. This would result in an optimal acoustic performance. Regardless of which scheme is employed, system designers must ensure that the Thermal Profile specification is met when the processor Digital Thermal Sensor temperature exceeds the TCONTOL value for a given processor.
§
Figure 4-3. TCONTROL and Fan Speed Control
Thermal Profile
Tca
se
Power
TDP
Tcase_Max
Tcase @ Tcontrol
Pcontrol
Thermal Profile
Tca
se
Power
TDP
Tcase_Max
Tcase @ Tcontrol
Pcontrol
Table 4-5. Fan Speed Control, TCONTROL and DTS Relationship
Condition FSC Scheme
DTS ≤ TCONTROL FSC can adjust fan speed to maintain DTS ≤ TCONTROL (low acoustic region).
DTS >TCONTROL FSC should adjust fan speed to keep TCASE at or below the Thermal Profile specification (increased acoustic region).
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38 Therrmal Mechanical Design Guide
Therrmal Mechanical Design Guide 39
Quality, Reliability and Ecological Requirements
5 Quality, Reliability and Ecological Requirements
5.1 Intel Reference Component ValidationIntel tests reference components both individually and as an assembly on mechanical test boards, and assesses performance to the envelopes specified in previous sections by varying boundary conditions.
While component validation shows that a reference design is tenable for a limited range of conditions, customers need to assess their specific boundary conditions and perform reliability testing based on their use conditions.
Intel reference components are also used in board functional tests to assess performance for specific conditions.
5.1.1 Board Functional Test SequenceEach test sequence should start with components (baseboard, heatsink assembly, and so on) that have not been previously submitted to any reliability testing.
The test sequence should always start with a visual inspection after assembly and BIOS/Processor/memory test. The stress test should then be followed by a visual inspection and then by a BIOS/processor/memory test.
5.1.2 Post-Test Pass CriteriaThe post-test pass criteria are:1. No significant physical damage to the heatsink and retention hardware. 2. Heatsink remains seated and its bottom remains mated flat against the IHS
surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware.
3. No signs of physical damage on baseboard surface due to impact of heatsink.4. No visible physical damage to the processor package.5. Successful BIOS/processor/memory test.6. Thermal compliance testing to demonstrate that the case temperature specification
can be met.
5.1.3 Recommended BIOS/Processor/Memory Test ProceduresThis test is to ensure proper operation of the product before and after environmental stresses, with the thermal mechanical enabling components assembled. The test shall be conducted on a fully operational baseboard that has not been exposed to any battery of tests prior to the test being considered.
The testing setup should include the following components, properly assembled and/or connected:
• Appropriate system baseboard• Processor and memory
Quality, Reliability and Ecological Requirements
40 Therrmal Mechanical Design Guide
• All enabling components, including socket and thermal solution parts
The pass criterion is that the system under test shall successfully complete the checking of BIOS, basic processor functions and memory, without any errors.
5.2 Heatsink Test ConditionsThe Test Conditions provided in Table 5-1 address processor heatsink failure mechanisms only. Test Conditions, Qualification and Visual Criteria vary by customer; Table 5-1 reflects Intel requirements.
Table 5-1. Tower Heatsink Test Conditions and Qualification Criteria (Sheet 1 of 2)
Assessment Test Condition Qualification CriteriaMin
Sample Size
1) Humidity Non-operating, 500 hours, +85C and 85% R.H.
168 hours. 50% to 85% non-condensing at temperatures of 25C to 70C. Ramp rate Humidity ≤ 18% per hour; Temp. ≤ 23C per hour.
No visual defects.As verified in wind tunnel: Mean ΨCA + 3σ + offset not to exceed value in Table 4-1Pressure drop not to exceed value in Table 4-1.
12
2) Board-Level UnPackaged Shock
50G±10%; 170±10% in/sec; 3 drops per face, 6 faces.
No damage to heatsink base or pipe.No visual defects.As verified in wind tunnel:Mean ΨCA + 3σ + offset not to exceed value in Table 4-1. Pressure drop not to exceed value in Table 4-1.
12
3) Board-Level UnPackaged Vibration
5 Hz @ 0.01 g2/Hz to 20 Hz @ 0.02 g2/Hz (slope up).20 Hz to 500 Hz @ 0.02 g2/Hz (flat).Input acceleration is 3.13 g RMS.10 minutes/axis for all 3 axes on all samples.Random control limit tolerance is ±3 dB.
No damage to heatsink base or pipe.No visual defects.As verified in wind tunnel:Mean ΨCA + 3σ + offset not to exceed value in Table 4-1 Pressure drop not to exceed value in Table 4-1
12
4) First Article Inspection
Not Applicable Meet all dimensions on 5 samples.Meet all CTF dimensions on 32 additional samples with 1.33 Cpk (mean + 4σ). If samples are soft-tooled, a hard tool plan must be defined.
37
5) Shipping Media: Packaged Shock
Drop height determined by weight and may vary by customer; Intel requirement in General Supplier Packaging Spec.10 drops (6 sides, 3 edges, 1 corner)
No visual defects 1 box
6) Shipping Media: Packaged Vibration
0.015 g2/Hz @ 10-40 Hz, sloping to 0.0015 g2/Hz @ 500 Hz, 1.03 gRMS, 1 hour/axis for 3 axes
No visual defects 1 box
7) Thermal Performance
Using Tower heatsink and Tower airflow from Table 4-1 with Thermal Test Vehicle (TTV) set to 130-W output
As verified in wind tunnel:Mean ΨCA + 3σ + offset not to exceed value in Table 4-1 Pressure drop not to exceed value in Table 4-1
30 heatsinks
Therrmal Mechanical Design Guide 41
Quality, Reliability and Ecological Requirements
8) Bake Non-Operating, 110C, 1000 hours
Note: Increased duration recommended if using alternative, unqualified TIM.
No visual defects.As verified in wind tunnel: Mean ΨCA + 3σ + offset not to exceed value in Table 4-1Pressure drop not to exceed value in Table 4-1.
12
9) Thermal Cycling
Required for heatpipe designs.Temperature range at pipe in heatsink assembly: -25C to +100C for 500 cycles.Cycle time is 30 minutes per full cycle, divided into half cycle in hot zone and half in cold zone, with minimum 1-min soak at each temperature extreme for each cycle.See Figure 5-1 for example profile.
No visual defects.As verified in wind tunnel: Mean ΨCA + 3σ + offset not to exceed value in Table 4-1Pressure drop not to exceed value in Table 4-1.
15
10) Heat Pipe Burst
Continuously raise heat pipe temperature and record the burst/leak temperatures of final formed/shaped/flattened heatpipe, 12 heatpipes minimum.
No failures at minimum of 300C @ 20 minutes
12 pipes
11) Heatsink Mass
Design Target < 500 g Avg + 3 sigma heatsink mass < 600 g 12
12) Heatsink Load Design Targets:0.080" board = 54.3 ± 3.2lbf (Fmin = 51.1 lbf)0.118" board = 61.5 ± 4.1 lbf (Fmax = 65.6lbf)
Heatsink Load Design Targets:1.8mm (0.072") board > 40 lbf3.0mm (0.118") board < 70 lbf
12
Figure 5-1. Example Thermal Cycle - Actual Profile Will Vary
Table 5-1. Tower Heatsink Test Conditions and Qualification Criteria (Sheet 2 of 2)
Assessment Test Condition Qualification CriteriaMin
Sample Size
Quality, Reliability and Ecological Requirements
42 Therrmal Mechanical Design Guide
5.3 LGA1567 Socket Reliability Testing and ResultsIntel has conducted extensive reliability tests on the LGA1567 socket. Test conditions and results are provided in the LGA1567 Socket Validation Report. Contact Intel’s enabled socket suppliers, listed in Table A.1, “Intel Enabling Component Suppliers” on page 43, for a copy of these reports.
5.4 Socket Durability TestThe socket must withstand 30 mating cycles. Test per EIA-364, test procedure 09. Measure contact resistance when mated in 1st and 30th cycles. The package must be removed at the end of each de-actuation cycle and reinserted into the socket.
5.5 Ecological RequirementGeneral requirements: Materials used in this product must comply with customers’ Environmental Product Content Specification. The Intel specification is available at:
http://supplier2.intel.com/EHS/Environmental_Product_Content_Specification_9-16-03.doc
Material shall be resistant to fungal growth. Examples of non-resistant materials include cellulose materials, animal and vegetable based adhesives, grease, oils, and many hydrocarbons. Synthetic materials such as PVC formulations, certain polyurethane compositions (for example, polyester and some polyethers), plastics which contain organic fillers of laminating materials, paints, and varnishes also are susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-STD-810E, Method 508.4 must be performed to determine material performance.
Any plastic component exceeding 25 grams must be recyclable per the European Blue Angel recycling standards.
Particular requirements: Cadmium shall not be used in painting or plating. No Quaternary salt electrolytic capacitors shall be used. Examples of prohibited caps are United Chemi-Con type: LXF, LXY, LXZ. No brominated plastics shall be used. Also, plastics heavier then 25 g must be labeled per ISO 10469 and may not contain halogenated flame retardant compounds.
Chemical Restrictions:
All components (for example: socket, TIM, heatsink) must be 'halogen-free'; that is, they are assembled without the intentional use of halogen in the raw materials and these elements are not intentionally present in the end product.
• IEC 61249-2-21
— 900 ppm maximum chlorine — 900 ppm maximum bromine — 1500 ppm maximum total halogens
• IPC-4101B
— 900 ppm maximum chlorine — 900 ppm maximum bromine — 1500 ppm maximum total halogens
§
Therrmal Mechanical Design Guide 43
Supplier Information
A Supplier Information
A.1 Intel Enabling Component SuppliersCustomers can purchase Intel reference thermal solution components from the suppliers listed in Table A-1.
See Appendix D for drawings.
The Intel reference thermal solution has been validated per the criteria outlined in Chapter 5.
Customers can purchase the LGA1567 Socket and ILM components from suppliers listed in Table A-2.
See Appendix B for LGA1567 Socket drawings. See Appendix C for ILM drawings.
Table A-1. Suppliers for the Processor Heatsink
Component Description/Part Number
Development Suppliers Supplier Contact Info
Thermal Interface Material
PCM45F / 95367 Honeywell Judy Oles (Customer Service)Judy.Oles@Honeywell.com 509-252-8605Andrew S.K. Ho (APAC)andrew.ho@honeywell.com (852) 9095-4593Andy Delano (Technical)Andrew.Delano@Honeywell.com 509-252-2224
Processor Heatsink - HL-ILM implementation
Tower Heatsink (with PCM45F)Intel P/N: E45309-007 CCI P/N: 0008053206
Chaun-Choung Technology Corp. (CCI)
Monica Chih12F, No.123-1, Hsing-De Rd., Sanchung, Taipei, Taiwan, R.O.C. Tel. +886 (2) 2995-2666 x1131Fax: +886 (2) 2995-8258monica_chih@ccic.com.tw
Sean Wusean_wu@ccic.com.tw(408) 768-7629
Table A-2. LGA1567 Socket and ILM Part Number and Supplier Contact Information (Sheet 1 of 2)
Item Intel Foxconn Lotes Tyco
High Load ILM (HL-ILM)
E42426-001 PT44L11-4301 ACA-ZIF-084-K01
High Load ILM Cover (HL-ILM) only
G12449-001 012-1000-5838 ACA-ZIF-103-P01
High Load ILM Assembly (HL-ILM)(includes E42426-001 and G12449-001)
G14941-001 PT44L21-4311 ACA-ZIF-126-Y01
Supplier Information
44 Therrmal Mechanical Design Guide
The Alternate Processor Heatsink Solutions listed in Table A-3 have been verified to meet Intel’s requirements except as noted. Customers must evaluate performance against their own product requirements.
§
Low Profile ILM Assembly (LP-ILM)
E56700-001 PT44L12-4301
Back Plate E42477-001 PT44P11-4301 DCA-HSK-149-K01
LGA1567 Socket E34291-001 PE156727-5241-01F 2040636-1
Contact Info
Julia Jiangjuliaj@usa.foxconn.comTel. (408) 919-61781688 Richard Ave.Santa Clara, CA 95050USA
Cathy Yangcathy@lotes.com.cnTel. 86-20-84686519No.15, Wusyun StreetAnle DistrictKeelung City, 20446Taiwan
Gretchen Troutman gltroutm@tycoelectronics.comTel. 717-986-5241PO Box 3608 Harrisburg, PA 17105-3608 USA
Table A-3. Alternate Suppliers with Thermal Solutions Designed for the Intel Xeon Processor 7500 Series
Component Description/Part Number Development Suppliers Supplier Contact Info
Processor Heatsink - LP-ILM implementation
1.5U Aluminum embedded heatpipe Part number: 321879(Verified to meet load targets in Table 4-1)
Aavid Thermalloy Chris Chapman (USA)70 Commercial St. Suite 200Concord, NH 03301603 223-1728chapman@aavid.com
George Lee (Taiwan)14F-4, No 79, Hsin Tai Wu Rd., Sec, 1Hsichin, Taipei Hsien, Taiwan ROC+886 (2) 2698-9888 ext. 603George.lee@aavid.com.tw
Processor Heatsink - HL-ILM implementation
1U Copper skived Part number Q129(Verified to meet load targets in Table 4-1 and thermal targets in Table 4-3)
Dynatron Corporation (Top Motor/Dynaeon)
Ian Lee 41458 Christy Street Fremont, CA 94538 510-498-8888 x137 ian@dynatron-corp.com
Lang Pai510-498-8888 x138Lang@dynatron-corp.com
Processor Heatsink - HL-ILM implementation
Tower Heatsink050234 Rev05(Verified to meet load targets in Table 4-1 and thermal targets in Table 4-3)
Aavid Thermalloy Chris Chapman (USA)70 Commercial St. Suite 200Concord, NH 03301603 223-1728chapman@aavid.com
George Lee (Taiwan)14F-4, No 79, Hsin Tai Wu Rd., Sec, 1Hsichin, Taipei Hsien, Taiwan ROC+886 (2) 2698-9888 ext. 603George.lee@aavid.com.tw
Table A-2. LGA1567 Socket and ILM Part Number and Supplier Contact Information (Sheet 2 of 2)
Item Intel Foxconn Lotes Tyco
Therrmal Mechanical Design Guide 45
LGA 1567 Socket Mechanical Drawings
B LGA 1567 Socket Mechanical Drawings
Table B-1 lists the mechanical drawings included in this appendix.
Table B-1. Mechanical Drawing List
Drawing Description Figure Number
“LGA 1567 Socket Mechanical Drawing – Sheet 1 of 4” Figure B-1
“LGA 1567 Socket Mechanical Drawing – Sheet 2 of 4” Figure B-2
“LGA 1567 Socket Mechanical Drawing – Sheet 3 of 4” Figure B-3
“LGA 1567 Socket Mechanical Drawing – Sheet 4 of 4” Figure B-4
LGA 1567 Socket Mechanical Drawings
46 Therrmal Mechanical Design Guide
Figure B-1. LGA 1567 Socket Mechanical Drawing – Sheet 1 of 4
Therrmal Mechanical Design Guide 47
LGA 1567 Socket Mechanical Drawings
Figure B-2. LGA 1567 Socket Mechanical Drawing – Sheet 2 of 4
LGA 1567 Socket Mechanical Drawings
48 Therrmal Mechanical Design Guide
Figure B-3. LGA 1567 Socket Mechanical Drawing – Sheet 3 of 4
Therrmal Mechanical Design Guide 49
LGA 1567 Socket Mechanical Drawings
Figure B-4. LGA 1567 Socket Mechanical Drawing – Sheet 4 of 4
LGA 1567 Socket Mechanical Drawings
50 Therrmal Mechanical Design Guide
§
Therrmal Mechanical Design Guide 51
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
C Independent Loading Assembly (ILM)Drawings and Backplate Assembly Drawings
Table C-1 lists the mechanical drawings included in this appendix.
Table C-1. Mechanical Drawing List
Drawing Description Figure Number
“High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 1 of 7”
Figure C-1
“High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 2 of 7”
Figure C-2
“High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 3 of 7”
Figure C-3
“High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 4 of 7”
Figure C-4
“High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 5 of 7”
Figure C-5
“High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 6 of 7”
Figure C-6
“High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 7 of 7”
Figure C-7
“Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 1 of 8”
Figure C-8
“Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 2 of 8”
Figure C-9
“Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 3 of 8”
Figure C-10
“Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 4 of 8”
Figure C-11
“Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 5 of 8”
Figure C-12
“Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 6 of 8”
Figure C-13
“Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 7 of 8”
Figure C-14
“Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 8 of 8”
Figure C-15
“Backplate Assembly Drawing – Sheet 1 of 5” Figure C-16
“Backplate Assembly Drawing – Sheet 2 of 5” Figure C-17
“Backplate Assembly Drawing – Sheet 3 of 5” Figure C-18
“Backplate Assembly Drawing – Sheet 4 of 5” Figure C-19
“Backplate Assembly Drawing – Sheet 5 of 5” Figure C-20
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
52 Therrmal Mechanical Design Guide
Figure C-1. High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 1 of 7
8 7 6 5
4 3 2
H G F E D C B A
8 7 6 5
4 3 2 1
H G F E D C B A
CC
4X
PRESS COLLAR NUT
FLUSH TO ILM FASTENER
7.6 0-0.1
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPROVED
-A
PRELIMINARY RELEASE
07/18/07
DL
01
INITIAL RELEASE
04/21/08
DL
E6
02
UPDATED CAD MODELS, ADDED NUT HEIGHT DIMENSION
07/28/09
DL
03
CHANGED PART NUMBER TO E42426-002
12/22/09
JK
04
ADDED INTEL PART MARKING LOCATION
12/22/09
JK
05
ADDED 6 TO FASTENER HEIGHT DIMENSION
01/05/10
JK
E42426
105
DWG. NO
SHT.
REV
DEPARTMENT
R2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
PTMI
TITLE
NEHALEM EX ILM FRAME
ASSEMBLY
SIZE
DRAWING NUMBER
REV
A1
E42426
05
SCALE: 2
DO NOT SCALE DRAWING
SHEET 1 OF 1
SEE NOTES
SEE NOTES
FINISH
MATERIAL
DATE
APPROVED BY
07/18/07
J KALISZEWSKID
ATE
CHECKED BY
07/18/07
D. LLAPITAN
DATE
DRAWN BY
07/18/07
D. LLAPITAN
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
ALL UNTOLERANCED LINEAR
DIMENSIONS ±.25
ANGLES ±0.5
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY
ILM TOP ASSEMBLY
E42426-002
TOP
SOCKET-B,FASTENER,COLLAR
D80118-004
14
NEHALEM EX ILM FRAME
E42420-002
21
NEHALEM EX ILM LOAD PLATE
E42422-001
32
NEHALEM EX ILM LOAD LEVER
E42423-001
41
NEHALEM EX ILM FASTENER
E42424-002
54
NOTES; UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
164997 - INTEL MARKING STANDARD
99-0007-001 - INTEL WORKMANSHIP STANDARD
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD
DATABASE.
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENTS.
ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL
PRODUCT SPECIFICATION (BS-MTN-0001).
4. ASSEMBLY MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001).
ASSEMBLY SHALL BE FREE OF OIL AND DEBRIS.
5 MARK INTEL ASSEMBLY PART NUMBER APPROXIMATELY WHERE SHOWN PER
INTEL MARKING STANDARD (164997) WITH THE FOLLOWING INFORMATION.
A) PART NUMBER E42426-002
6 INDICATES CRITICAL TO FUNCTIOIN DIMENSION (CTF)
7 MARK VENDOR ASSEMBLY INFORMATION APPROXIMATELY WHERE SHOWN PER
INTEL MARKING STANDARD (164997) WITH THE FOLLOWING INFORMATION.
A) ASSEMBLY VENDOR ID
B) DATE CODE
5
6
SCALE 2
SCALE 2
SEE DETAIL A
HINGE ATTACHMENT
12
34
5
7
DETAIL A
SCALE 4
SECTION C-C
Therrmal Mechanical Design Guide 53
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
Figure C-2. High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 2 of 7
8 7 6 5
4 3 2
H G F E D C B A
8 7 6 5
4 3 2 1
H G F E D C B A
AA
BB
R CORP.
2X 11.95�#0.25
63.2�#0.25
2X
5.29�#0.2
2X85�$
75.68�#0.01
2�
#0
31.83
31.83
71.67
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPROVED
-A
PRELIMINARY RELEASE
07/18/07
DL
BINCREASED BEND REDIUS FOR VERTICAL WALLS.
09/13/07
DL
PG2,
C3
01
INITIAL RELEASE- REDUCED FORM
DEPTH TO 2.0MM
04/21/08
DL
02
MODIFIED DATUM PLANES, ADDED DATUM POINTS
WIDENED HINGE FEATURES
07/01/09
DL
03
MOVED DATUM A
08/04/09
DL
04
ADDED PAGE 3.
09/23/09
DL
05
REVISED INSPECTION DIMENSIONING
12/08/09
JK
06
5.29 �# 0.2 WAS 5.29 �# 0.25, ADDED 6
3 PLACES
12/17/09
JK
E42422
106
DWG. NO
SHT.
REV
DEPARTMENT
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
TMI
TITLE NEHALEM EX ILM LOAD PLATE
SIZE
DRAWING NUMBER
REV
A1
E42422
06
SCALE: 2.5
DO NOT SCALE DRAWING
SHEET 1 OF 3
SEE NOTES
SEE NOTES
FINISH
MATERIAL
DATE
APPROVED BY
07/18/07
J KALISZEWSKI
DATE
CHECKED BY
07/18/07
D. LLAPITAN
DATE
DRAWN BY
07/18/08
D. LLAPITAN
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES AS SPECIFIED
THIRD ANGLE PROJECTION
9
NOTES; UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
UL1439 - UL SHARP EDGE TESTING
164997 - INTEL MARKING STANDARD
A29419 - INTEL TOLERANCE STANDARD FOR SHEETMETAL
C25432 - INTEL COSMETIC SPEC FOR SHEETMETAL.
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED
TOLERANCE SHALL BE CONTROLLED BY 3D CAD DATABASE, AND SHALL
CONFORM TO SHEETMETAL TOLERANCE STANDARD (A29419).
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.
ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL
PRODUCT SPECIFICATION (BS-MTN-0001).
A) TYPE:301 STAINLESS STEEL 1.5MM �#.08
B) CRITICAL MECHANICAL PROPERTIES:
TENSILE YIELD STRENGTH (ASTM D638) >= 758 MPa
MODULUS OF ELASTICITY (ASTM D638) >= 193 GPa
C) PLATING: NONE.
4. THIS PART HAS CLASS U COSMETIC REQUIREMENTS UNLESS OTHERWISE
NOTED. SPECIFIED SURFACES MUST COMPLY WITH COSMETIC REQUIREMENTS
PER INTEL INTEL COSMETIC SPEC FOR SHEETMETAL (C25432).
PART SHALL BE FREE OF OIL AND DEBRIS.
5. BAG AND TAG WITH THE FOLLOWING INFORMATION.
(NOTE PRIORITY IN ORDER LISTED)
A) SUPPLIER PART NUMBER
B) INTEL PART NUMBER E42422-001
c) DATE CODE
6 CRITICAL TO FUNCTION DIMENSION (CTF).
7. BURR HEIGHTS SHALL NOT EXCEED 10% OF MATERIAL THICKNESS PER
UL1439 AND 99-0007-001 - INTEL WORKMANSHIP STANDARD.
8. SHARP CORNERS MUST BE CHAMFERED, OR ROUNDED TO 0.25MM (.010") RADIUS.
9 PUNCH DIRECTION.
10 COINING REQUIRED ON SPECIFIED EDGES.
6
6
6
2X 1.70
10
SECTION A-A
SECTION B-B
SEE DETAIL A
A
SEE DETAIL B
SEE DETAIL C
SEE DETAIL A
SEE DETAIL B
SEE DETAIL C
A1
A2
A3
A1A2
A3
C1
B
A
B
A
A
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
54 Therrmal Mechanical Design Guide
Figure C-3. High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 3 of 7
H G F E D C B A
H G F E D C B A
8 7 6 5
4 3 2
8 7 6 5
4 3 2 1
0.59
5�$
1.515
0.75 MIN X 45�$
0.71�#0.1
2.32
1.21�#0.1
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
E42422
206
DWG. NO
SHT.
REV
DEPARTMENT
R2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
-
SIZE
DRAWING NUMBER
REV
A1
E42422
06
SCALE: 6
DO NOT SCALE DRAWING
SHEET 2 OF 3
6
6
DETAIL A
SCALE 20
DETAIL B
SCALE 15
DETAIL C
SCALE 12
A3
C1
A1
A2
0.1
ABC
A
A
A
Therrmal Mechanical Design Guide 55
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
Figure C-4. High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 4 of 7
H G F E D C B A
H G F E D C B A
8 7 6 5
4 3 2
8 7 6 5
4 3 2 1
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
E42422
306
DWG. NO
SHT.
REV
DEPARTMENT
R2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
-
SIZE
DRAWING NUMBER
REV
A1
E42422
06
SCALE: 5
DO NOT SCALE DRAWING
SHEET 3 OF 3
A
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
56 Therrmal Mechanical Design Guide
L
Figure C-5. High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 5 of 7
8 7 6 5
4 3 2
H G F E D C B A
8 7 6 5
4 3 2 1
H G F E D C B A
R CORP.
42
2X 70
4X
5.5�#0.1
48
6.6�#0.12
2X 6.25
82�#0.25
1.15�#0.25
0.842�#0.25
66.8�#0.25
16�#0.12
26�#0.12
C
B
A
A
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPROVED
APRELIMINARY RELEASE
07/18/07
D.L.
BINCREASED BEND RADIUS FOR MAJOR
VERTICAL WALLS. REMOVED SEMI
SHERICAL FORMS.
09/13/07
D.L.
C4,E4
01
INITIAL RELEASE- THRU HOLE FOR
LEVER DECREASED. LOADPLATE
CATCH TAB RADIUS DECREASED.
04/21/08
DL
G5
02
CHANGED HOLE DIAMETER TO 5.5MM.
06/06/08
D.L.
E4
F4
03
MODIFIED LEVER OPENING WIDTH AND STOP TAB.
MODIFIED LEVER HOLE OPENING AND LEVER CATCH TAB.
08/19/08
D.L.
E4,F1
E2
D8
B4
04
MODIFIED DATUMN SCHEME, NOTE 8, AND 16, 66.8
TOLERANCES.MODIFIED HINGE HOLE LOCATION. ADDED
COSMETIC MARKING
10. ADDED CHAMFERS TO
TOP EDGES. ADDED LEVER RETENTION CUTOUT
04/13/09
D.L.
C3
05
MOVED BOTTOM TAB
12/08/09
JK
C3
06
CREATED -002 PART, SHORTENED LEVER CATCH TAB.
12/22/09
JK
E42420
106
DWG. NO
SHT.
REV
DEPARTMENT
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
TMI
TITLE
NEHALEM EX ILM FRAME
SIZE
DRAWING NUMBER
REV
A1
E42420
06
SCALE: 2.5
DO NOT SCALE DRAWING
SHEET 1 OF 1
SEE NOTES
SEE NOTES
FINISH
MATERIAL
DATE
APPROVED BY
07/18/07
J KALISZEWSKI
DATE
CHECKED BY
07/18/07
D. LLAPITAN
DATE
DRAWN BY
07/18/07
D. LLAPITAN
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES AS SPECIFIED
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY
LS ILM FRAME
E42420-002
TOP
9
NOTES; UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
UL1439 - UL SHARP EDGE TESTING
164997 - INTEL MARKING STANDARD
A29419 - INTEL TOLERANCE STANDARD FOR SHEETMETAL
C25432 - INTEL COSMETIC SPEC FOR SHEETMETAL
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED
TOLERANCE SHALL BE CONTROLLED BY 3D CAD DATABASE, AND SHALL
CONFORM TO SHEETMETAL TOLERANCE STANDARD (A29419).
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.
ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL
PRODUCT SPECIFICATION (BS-MTN-0001).
A) TYPE: SK7, 1065, S50C, OR CHSP60PC 1.2MM+/- 0.05 THK.
B) CRITICAL MECHANICAL PROPERTIES:
TENSILE YIELD STRENGTH (ASTM D638) >= 489 MPa
MODULUS OF ELASTICITY (ASTM D638) >= 190 GPa
C) PLATING: ELECTROLYTIC NICKEL PLATED.
D) HEAT TREATING: NONE
4. THIS PART HAS CLASS U COSMETIC REQUIREMENTS UNLESS OTHERWISE
NOTED. SPECIFIED SURFACES MUST COMPLY WITH COSMETIC REQUIREMENTS
PER INTEL INTEL COSMETIC SPEC FOR SHEETMETAL (C25432).
PART SHALL BE FREE OF OIL AND DEBRIS.
5. BAG AND TAG WITH THE FOLLOWING INFORMATION.
(NOTE PRIORITY IN ORDER LISTED)
A) SUPPLIER PART NUMBER
B) INTEL PART NUMBER (E42420-002)
c) DATE CODE
6 CRITICAL TO FUNCTION DIMENSION (CTF).
7. BURR HEIGHTS SHALL NOT EXCEED 10% OF MATERIAL THICKNESS PER
UL1439 AND 99-0007-001 - INTEL WORKMANSHIP STANDARD.
8. SHARP CORNERS AND EDGESMUST BE ROUNDED OR CHAMFERED TO 0.25MM MAX,
9 PUNCH DIRECTION.
10 APPLY PIN 1 INDICATOR IN THIS AREA.
6
10
6
6
6
SCALE 3
SCALE 2
0.15
ABC
Therrmal Mechanical Design Guide 57
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
Figure C-6. High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 6 of 7
13
45
67
8
BCD A
12
34
56
78
BCD A2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
5
1.57
7.6 0
-0.1
1.5 MAX
E42424
103
DWG. NO
SHT.
REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 12:1
03
E42424
DREV
DRAWING NUMBER
SIZE
NEHALEM EX ILM FASTENER
TITLE
-
DEPARTMENT
SEE NOTES
SEE NOTES
FINISH
MATERIAL
--
DATE
APPROVED BY
--
04/21/08
J. KALISZEWSKI
DATE
CHECKED BY
04/21/08
D. LLAPITAN
DATE
DRAWN BY
04/21/08
D. LLAPITAN
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES AS SPECIFIED
THIRD ANGLE PROJECTION
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPR
-01
INITIAL RELEASE
04/21/08
D.L.
C3
02
CHANGED HUT HEIGHT TO 7.6MM.
07/28/09
D.L.
03
CHANGED PART NUMBER TO E42424-002
12/22/09
JK
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
NOTES; UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
UL1439 - UL SHARP EDGE TESTING
164997 - INTEL MARKING STANDARD
99-0007-001 - INTEL WORKMANSHIP STANDARD
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. INTERPRET DIMENSIONS PER ASME Y14.5M-1994.
FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD
DATABASE, AND SHALL CONFORM TO A TOLERANCE OF +/- 0.375MM (.015").
IF PROVIDED, MEASUREMENTS SHOULD REFERENCE DATUM
-A- PRIMARY,
DATUM -B- SECONDARY, AND
-C- TERTIARY.
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.
ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL
PRODUCT SPECIFICATION (BS-MTN-0001).
A) TYPE: LOW CARBON STEEL
B) CRITICAL MECHANICAL PROPERTIES
�HARDEN AND TEMPER IF USING INTERFERENCE FIT ASSEMBLY DESIGN.
�FINISH: ZINC PLUS CLEAR CHROMATE PER (ASTM B633) COLORLESS.
4. PART MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001).
PART SHALL BE FREE OF OIL AND DEBRIS.
5. BAG AND TAG WITH THE FOLLOWING INFORMATION.
(NOTE PRIORITY IN ORDER LISTED)
A) PART NUMBER E42424-002
B) DATE CODE
C) MATERIAL TYPE
6 CRITICAL TO FUNCTION DIMENSION (CTF).
7. SHARP CORNERS MAY BE CHAMFERED, OR ROUNDED TO 0.25MM (.010") RADIUS.
8. DEBURR ALL SHARP EDGES.
9 ASSEMBLY FEATURES DEFINED BY VENDOR. MATES WITH COLLAR (P/N D80118)
6
6
6
6 POINT T-20 DRIVE
HEAD DEPTH 2MM MIN
PARTIAL THREAD TAP IN TOOL RECESS OK
R 0.25 MAX
9
INTERNAL THREAD
NO. 6-32 UNC
6MM DEEP MIN
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
58 Therrmal Mechanical Design Guide
Figure C-7. High-Load Independent Loading Assembly (HL-ILM) Mechanical Drawing – Sheet 7 of 7
8 7 6 5
4 3 2
H G F E D C B A
8 7 6 5
4 3 2 1
H G F E D C B A
R CORP.
72.8�#0.25
3.75�#0.05
R TYP
1.29�#0.2
75.35�#0.25
()
31.5�$
4.46�#0.1
4.1�#0.35
15.5�#0.5
5.2�#0.2
29.98�#0.2
14.44�#0.2
10.56�#0.2
90�$+1�$
-3�$
(2.5) 0.1
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPROVED
-A
PRELIMINARY RELEASE
07/18/07
DL
G5,G201
INITIAL RELEASE -WIRE DIAMETER
AND CAM ANGLE FINALIZED.
04/21/08
D.L.
C5
G8 02
MODIFIED NOTE 2
REMOVED DATUMN REFERENCES
CHANGED CAM DIMENSION TO 10.56
04/13/09
D.L.
E42423
102
DWG. NO
SHT.
REV
DEPARTMENT
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
TMI
TITLE NEHALEM EX ILM LOAD LEVER
SIZE
DRAWING NUMBER
REV
A1
E42423
02
SCALE: 3
DO NOT SCALE DRAWING
SHEET 1 OF 1
SEE NOTES
SEE NOTES
FINISH
MATERIAL
DATE
APPROVED BY
07/18/07
J KALISZEWSKID
ATE
CHECKED BY
07/18/07
D. LLAPITAN
DATE
DRAWN BY
07/18/07
D. LLAPITAN
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
THIRD ANGLE PROJECTION
NOTES; UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
UL1439 - UL SHARP EDGE TESTING
164997 - INTEL MARKING STANDARD
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD
DATABASE, AND SHALL CONFORM TO A TOLERANCE OF +/- 0.375MM (.015").
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.
ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL
PRODUCT SPECIFICATION (BS-MTN-0001).
A) TYPE:
2.5 SUS 304
B) CRITICAL MECHANICAL PROPERTIES
�TENSILE YIELD STRENGTH (ASTM D638) >= 1.3 GPa
�ULTIMATE YIELD STRENGTH (ASTM D638) >= 1.6 GPa
�MODULUS OF ELASTICITY (ASTM d638) = 193 GPa
�FINISH: NONE
4. THIS PART HAS CLASS U COSMETIC REQUIREMENTS UNLESS OTHERWISE
NOTED. PART SHALL BE FREE OF OIL AND DEBRIS.
5. BAG AND TAG WITH THE FOLLOWING INFORMATION.
(NOTE PRIORITY IN ORDER LISTED)
A) PART NUMBER E42423-001
B) DATE CODE
C) MATERIAL TYPE
6 CRITICAL TO FUNCTION DIMENSION (CTF).
7. SHARP CORNERS MUST BE CHAMFERED, OR ROUNDED TO 0.25MM (.010") RADIUS.
8 FEATURE TO BE DEFINED BY MANUFACTURER AS EITHER TWO 90
�$ BENDS OR FULL RADIUS.
6
6
6
6
8
Therrmal Mechanical Design Guide 59
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
Figure C-8. Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 1 of 8
13
45
67
8
BCD A
12
34
56
78
BCD A2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
02
PRELIMINARY RELEASE FOR TOOLING
01/16/09
03
RELEASE FOR TOOLING
02/13/09
C HANES
E56700
104
DWG. NO
SHT.
REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 1
04
E56700
DREV
DRAWING NUMBER
SIZE
LGA1567 LOW PROFILE ILM ASSY
TITLE
-
DEPARTMENT
SEE NOTES
SEE NOTES
FINISH
MATERIAL
11/17/08
CHRIS HANES
DATE
APPROVED BY
-DAVID LLAPITAN
11/17/08
NEAL ULEN
DATE
CHECKED BY
11/17
J KALISZEWSKI
DATE
DRAWN BY
11/17/08
J KALISZEWSKI
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
.X �# 0.5
.XX �# 0.25
.XXX �# 0.125
ANGLES ± 1.0
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY
ILM TOP ASSEMBLY
E56700-001
TOP
SOCKET-B,FASTENER,COLLAR
D80118-004
14
LGA1567 LOW PROFILE ILM FRAME
E56107-001
21
LGA1567 LOW PROFILE ILM LOAD LEVER
E56145-001
31
LGA1567 LOW PROFILE ILM DUST COVER
E56700-002
41
LGA1567 LOW PROFILE ILM LOAD PLATE
E58504-001
51
LGA1567 LOW PROFILE ILM FASTENER
E60232-001
64
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPR
-01
PROTOTYPE RELEASE
11/17/08
C HANES
04
ADDED -002 DUST COVER
08/25/09
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
NOTES; UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
164997 - INTEL MARKING STANDARD
99-0007-001 - INTEL WORKMANSHIP STANDARD
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. INTERPRET DIMENSIONS PER ASME Y14.5M-1994.
FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD
DATABASE.
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENTS.
ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL
PRODUCT SPECIFICATION (BS-MTN-0001).
4. ASSEMBLY MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001).
ASSEMBLY SHALL BE FREE OF OIL AND DEBRIS.
5 MARK ASSEMBLY PART APPROXIMATELY WHERE SHOWN PER
INTEL MARKING STANDARD (164997) WITH THE FOLLOWING INFORMATION.
A) PART NUMBER E56700-001
B) ASSEMBLY VENDOR ID
C) DATE CODE
6 CRITICAL TO FUNCTION DIMENSION (CTF).
4X
4X
6
SCALE 2
SCALE 2
SEE DETAIL HINGE ATTACHMENT
SCALE 2
4
5
3
1
2
DETAIL HINGE ATTACHMENT
SCALE 4
4X ASSEMBLE COLLAR NUT FLUSH TO ILM FASTENER
FINISHED HEIGHT OF 5.755mm TO BOTTOM OF FASTENER HEAD
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
60 Therrmal Mechanical Design Guide
Figure C-9. Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 2 of 8
8 7 6
5
4
3
2
H G F E D C B A
8 7 6
5
4
3
2
1
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NS
PE
CIF
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R 2
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Therrmal Mechanical Design Guide 61
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
Figure C-10. Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 3 of 8
8 7 6 5
4 3 2
H G F E D C B A
8 7 6 5
4 3 2 1
H G F E D C B A
F
F
AA
DD
E
E
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
E58504
105
DWG. NO
SHT.
REV
DEPARTMENT
R2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
PTMI
TITLE
LGA1567 LOW PROFILE LOAD PLATE
SIZE
DRAWING NUMBER
REV
A1
E58504
05
SCALE: 2.000
DO NOT SCALE DRAWING
SHEET 1 OF 4
SEE NOTES
SEE NOTES
FINISH
MATERIAL
11/17/08
CHRIS HANES
DATE
APPROVED BY
11/17/08
D LLAPITAN
11/17/08
NEAL ULEN
DATE
CHECKED BY
11/17/08
J KALISZEWSKI
DATE
DRAWN BY
11/17/08
J KALISZEWSKI
DATE
DESIGNED BY
THIRD ANGLE PROJECTION
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPR
-01
PROTOTYPE RELEASE
11/14/08
C HANES
4F/2
02
ADDED ROUND TO BOTTOM OF REACTION FLANGE
11/26/08
C HANES
03
SEVERAL CHANGES TO CTFs - PRELIMINARY TOOLING RELEASE
01/16/09
F7/2
04
ADDED 3.14 DIM AND CTF - PRELIMINARY TOOLING RELEASE
01/19/09
05
TOOLING RELEASE
02/27/09
C HANES
H
H GG
CC
C
31.58
69.97
31.58
80�$ 0-5�$
2X
6�#0.3
B63.6�#0.1
11.33�#0.25
A
A
A
NOTES; UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
UL1439 - UL SHARP EDGE TESTING
164997 - INTEL MARKING STANDARD
A29419 - INTEL TOLERANCE STANDARD FOR SHEETMETAL
C25432 - INTEL COSMETIC SPEC FOR SHEETMETAL.
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. FEATURES NOT SPECIFIED ON DRAWING AND FEATURES WITHOUT SPECIFIED
TOLERANCE SHALL BE CONTROLLED BY 3D CAD DATABASE, AND SHALL
CONFORM TO SHEETMETAL TOLERANCE STANDARD (A29419).
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.
ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL
PRODUCT SPECIFICATION (BS-MTN-0001).
A) TYPE:301 STAINLESS STEEL 1.5MM �#.08 6
B) CRITICAL MECHANICAL PROPERTIES:
TENSILE YIELD STRENGTH (ASTM D638) >= 758 MPa
MODULUS OF ELASTICITY (ASTM D638) >= 193 GPa
C) PLATING: NONE.
4. THIS PART HAS CLASS U COSMETIC REQUIREMENTS UNLESS OTHERWISE
NOTED. SPECIFIED SURFACES MUST COMPLY WITH COSMETIC REQUIREMENTS
PER INTEL INTEL COSMETIC SPEC FOR SHEETMETAL (C25432).
PART SHALL BE FREE OF OIL AND DEBRIS.
5. BAG AND TAG WITH THE FOLLOWING INFORMATION.
(NOTE PRIORITY IN ORDER LISTED)
A) SUPPLIER PART NUMBER
B) INTEL PART NUMBER E58504-001
c) DATE CODE
6 CRITICAL TO FUNCTION DIMENSION (CTF).
7. BURR HEIGHTS SHALL NOT EXCEED 10% OF MATERIAL THICKNESS PER
UL1439 AND 99-0007-001 - INTEL WORKMANSHIP STANDARD.
8. BREAK ALL SHARP CORNERS, EDGES AND BURRS TO 0.1mm MAX.
9 PUNCH DIRECTION.
10. UNSPECIFIED SURFACES TO BE FLAT WITHIN 0.125MM PER 25.4MM (.005"/INCH).
11 COINING REQUIRED ON ENTIRE INSIDE EDGE.
11
9
6
SCALE 3.000
SECTION F-F
SEE DETAIL A
SHT 3
SEE DETAIL B
SHT 3
SECTION A-A
SEE DETAIL C
SHT 3
SEE DETAIL A
SHT 3
SEE DETAIL B
SHT 3
SEE DETAIL C
SHT 3
C1
A1
A2
A3
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
62 Therrmal Mechanical Design Guide
Figure C-11. Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 4 of 8
H G F E D C B A
H G F E D C B A
8 7 6 5
4 3 2
8 7 6 5
4 3 2 1
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
E58504
205
DWG. NO
SHT.
REV
DEPARTMENT
R2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
PTMI
SIZE
DRAWING NUMBER
REV
A1
E58504
05
SCALE: 2.000
DO NOT SCALE DRAWING
SHEET 2 OF 4
0.13
ABC
0.1
A
C
C
1.05
1.25�$
1.05
20.58
64.53
24.36�#0.1
A
A
6
6
SECTION D-D
SCALE 8.000
SECTION E-E
SCALE 8.000
Therrmal Mechanical Design Guide 63
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
Figure C-12. Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 5 of 8
H G F E D C B A
H G F E D C B A
8 7 6 5
4 3 2
87
65
43
21
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
E58504
305
DWG. NO
SHT.
REV
DEPARTMENT
R2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
PTMI
SIZE
DRAWING NUMBER
REV
A1
E58504
05
SCALE: 2.000
DO NOT SCALE DRAWING
SHEET 3 OF 4
0.13
AB
2.4�$
C
0.41
0.82
33.3
4.16
0.5�#0.1
0.5�#0.1
13.58�#0.05
11.33�#0.13
2.58
A
A
A
6
DETAIL A
SCALE 12.000
DETAIL B
SCALE 12.000
DETAIL C
SCALE 12.000
2X
C1
A1
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
64 Therrmal Mechanical Design Guide
Figure C-13. Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 6 of 8
H G F E D C B A
H G F E D C B A
8 7 6 5
4 3 2
87
65
43
21
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
E58504
405
DWG. NO
SHT.
REV
DEPARTMENT
R2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
PTMI
SIZE
DRAWING NUMBER
REV
A1
E58504
05
SCALE: 2.000
DO NOT SCALE DRAWING
SHEET 4 OF 4
REQUIRED BOW IN INDICATED DIRECTION
0.3
0.1
REQUIRED BOW IN INDICATED DIRECTION
0.2
0.0
A
A
SECTION H-H
SCALE 8.000
SECTION G-G
SCALE 8.000
Therrmal Mechanical Design Guide 65
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
Figure C-14. Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 7 of 8
8 7 6 5
4 3 2
H G F E D C B A
8 7 6 5
4 3 2 1
H G F E D C B A
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
E56145
103
DWG. NO
SHT.
REV
DEPARTMENT
R2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
PTMI
TITLE
LGA1567 LOW PROFILE LOAD LEVER
SIZE
DRAWING NUMBER
REV
A1
E56145
03
SCALE: 1.000
DO NOT SCALE DRAWING
SHEET 1 OF 1
SEE NOTES
SEE NOTES
FINISH
MATERIAL
11/17/08
CHRIS HANES
DATE
APPROVED BY
11/17/08
D LLAPITAN
11/17/08
NEAL ULEN
DATE
CHECKED BY
11/17/08
J KALISZEWSKI
DATE
DRAWN BY
11/17/08
J KALISZEWSKI
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
.X �# 0.5
.XX �# 0.25
.XXX �# 0.125
ANGLES ± 1.0
THIRD ANGLE PROJECTION
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPR
-01
PROTOTYPE RELEASE
11/14/08
C HANES
02
20�$ WAS 6�$ - PRELIMINARY TOOLING RELEASE
01/15/09
03
CLEANED UP DIMENSIONS - RELEASE FOR TOOLING
01/27/09
C HANES
13.87�#0.5
15.01+0.5
0
30.26�#0.5
R MAX TYP
1.29
6.5�#0.05
72.8�#0.5
10.03�#0.5
0.1
()
2.5
65.92�#0.5
10.4�#0.5
4.72�#0.1
()
20�$
NOTES; UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
UL1439 - UL SHARP EDGE TESTING
164997 - INTEL MARKING STANDARD
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. INTERPRET DIMENSIONS PER ASME Y14.5M-1994.
FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD
DATABASE, AND SHALL CONFORM TO A TOLERANCE OF +/- 0.375MM (.015").
IF PROVIDED, MEASUREMENTS SHOULD REFERENCE DATUM
-A- PRIMARY,
DATUM -B- SECONDARY, AND
-C- TERTIARY.
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.
ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL
PRODUCT SPECIFICATION (BS-MTN-0001).
A) TYPE:
2.5 �# 0.08 SUS 304
6
B) CRITICAL MECHANICAL PROPERTIES
�TENSILE YIELD STRENGTH (ASTM D638) >= 1.3 GPa
�ULTIMATE YIELD STRENGTH (ASTM D638) >= 1.6 GPa
�MODULUS OF ELASTICITY (ASTM d638) = 193 GPa
�FINISH: NONE
4. THIS PART HAS CLASS U COSMETIC REQUIREMENTS UNLESS OTHERWISE
NOTED. PART SHALL BE FREE OF OIL AND DEBRIS.
5. BAG AND TAG WITH THE FOLLOWING INFORMATION.
(NOTE PRIORITY IN ORDER LISTED)
A) PART NUMBER E56145-001
B) DATE CODE
C) MATERIAL TYPE
6 CRITICAL TO FUNCTION DIMENSION (CTF).
7. SHARP CORNERS MAY BE CHAMFERED, OR ROUNDED TO 0.25MM (.010") RADIUS.
8. DEBURR ALL SHARP EDGES.
9 FEATURE TO BE DEFINED BY MANUFACTURER AS EITHER TWO 90
�$ BENDS OR FULL RADIUS.
6
6
6
SCALE 2.000
SCALE 2.000
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
66 Therrmal Mechanical Design Guide
Figure C-15. Low-Profile Independent Loading Assembly (LP-ILM) Mechanical Drawing – Sheet 8 of 8
A
4
B
3
CD
43
21
A
2
C
1
D
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
01/16/09
03
REDIMSIONED FOR RELEASE FOR TOOLING
02/13/09
1�#0.1
1.5 MIN
5.755�#0.05
9
5�#0.1
7�#0.1
E60232 1 03DWG. NO SHT. REV
THIS DRAWING CONTAINS INTEL CORPORAT
ION CONFIDENTIAL INFORMATION. IT IS
DISCLOSED IN CONFIDENCE AND ITS CONT
ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI
SPLAYED OR MODIFIED, WITHOUT THE PRI
OR WRITTEN CONSENT OF INTEL CORPORAT
ION.
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 10.000
03
E60232
CREV
DRAWING NUMBER
SIZELGA1567 LOW PROFILE ILM FASTENER
TITLE
PTMI
DEPARTMENT
SEE NOTES
SEE NOTES
FINISH
MATERIAL
11/17/08
CHRIS HANES
DATE
APPROVED BY
11/17/08
D LLAPITAN
11/17/08
NEAL ULEN
DATE
CHECKED BY
09/09/08
J KALISZEWSKI
DATE
DRAWN BY
09/09/08
J KALISZEWSKI
DATE
DESIGNED BY
THIRD ANGLE PROJECTION
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPR
-01
PROTOTYPE RELEASE
11/17/08
C HANES
02
PRELIMINARY RELEASE FOR TOOLING
C HANES
NOTES; UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
UL1439 - UL SHARP EDGE TESTING
164997 - INTEL MARKING STANDARD
99-0007-001 - INTEL WORKMANSHIP STANDARD
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD
DATABASE, AND SHALL CONFORM TO A TOLERANCE OF +/- 0.375MM (.015").
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.
ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL
PRODUCT SPECIFICATION (BS-MTN-0001).
A) TYPE: LOW CARBON STEEL
B) CRITICAL MECHANICAL PROPERTIES
�HARDEN AND TEMPER IF USING INTERFERENCE FIT ASSEMBLY DESIGN.
�FINISH: ZINC PLUS CLEAR CHROMATE PER (ASTM B633) COLORLESS.
4. PART MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001).
PART SHALL BE FREE OF OIL AND DEBRIS.
5. BAG AND TAG WITH THE FOLLOWING INFORMATION.
(NOTE PRIORITY IN ORDER LISTED)
A) PART NUMBER E60232-001
B) DATE CODE
C) MATERIAL TYPE
6 CRITICAL TO FUNCTION DIMENSION (CTF).
7. SHARP CORNERS MAY BE CHAMFERED, OR ROUNDED TO 0.25MM (.010") RADIUS.
8. DEBURR ALL SHARP EDGES.
9 ASSEMBLY FEATURES DEFINED BY VENDOR. MATES WITH COLLAR (P/N D80118-004)
6 POINT T-20 DRIVE
HEAD DEPTH 2MM MIN
PARTIAL THREAD TAP IN TOOL RECESS OK
6
9
INTERNAL THREAD
NO. 6-32 UNC
4 MM DEEP MIN
Therrmal Mechanical Design Guide 67
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
Figure C-16. Backplate Assembly Drawing – Sheet 1 of 5
13
45
67
8
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12
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Therrmal Mechanical Design Guide 69
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
Figure C-18. Backplate Assembly Drawing – Sheet 3 of 51
34
56
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Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
70 Therrmal Mechanical Design Guide
5
Figure C-19. Backplate Assembly Drawing – Sheet 4 of 58
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Therrmal Mechanical Design Guide 71
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
Figure C-20. Backplate Assembly Drawing – Sheet 5 of 51
34
56
78
BCD A
12
34
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6
Independent Loading Assembly (ILM) Drawings and Backplate Assembly Drawings
72 Therrmal Mechanical Design Guide
§
Therrmal Mechanical Design Guide 73
Tower Heatsink Drawings
D Tower Heatsink Drawings
Table D-1 lists the mechanical drawings included in this appendix.
Table D-1. Mechanical Drawing List
Drawing Description Figure Number
“Tower Heatsink Drawing – Sheet 1 of 14” Figure D-1
“Tower Heatsink Drawing – Sheet 2 of 14” Figure D-2
“Tower Heatsink Drawing – Sheet 3 of 14” Figure D-3
“Tower Heatsink Drawing – Sheet 4 of 14” Figure D-4
“Tower Heatsink Drawing – Sheet 5 of 14” Figure D-5
“Tower Heatsink Drawing – Sheet 6 of 14” Figure D-6
“Tower Heatsink Drawing – Sheet 7 of 14” Figure D-7
“Tower Heatsink Drawing – Sheet 8 of 14” Figure D-8
“Tower Heatsink Drawing – Sheet 9 of 14” Figure D-9
“Tower Heatsink Drawing – Sheet 10 of 14” Figure D-10
“Tower Heatsink Drawing – Sheet 11 of 14” Figure D-11
“Tower Heatsink Drawing – Sheet 12 of 14” Figure D-12
“Tower Heatsink Drawing – Sheet 13 of 14” Figure D-13
“Tower Heatsink Drawing – Sheet 14 of 14” Figure D-14
Tower Heatsink Drawings
74 Therrmal Mechanical Design Guide
4
Figure D-1. Tower Heatsink Drawing – Sheet 1 of 14
A
4
B
3
CD
43
21
A
2
C
1
D
2200 M
ISS
ION
CO
LLE
GE
BLV
D.
R
P.O
. B
OX
58119
SA
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39
[]
10
10
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00
MA
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5]
(26
.80
5)
[1.0
55
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(19
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6)
[.7
64
]
10
50
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0[1
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9]
MA
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10
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0[1
.96
9]
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00 [.0
98
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6.5
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56
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16
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63
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5
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GP
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TE
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OR
PO
RA
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ON
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EN
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L IN
FO
RM
AT
ION
. IT
IS
DIS
CLO
SE
D IN
CO
NF
IDE
NC
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ND
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ON
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AY
NO
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D, R
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OR
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6
6
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6
6
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6 66
6
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13
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CT
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11
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RF
AC
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HO
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IN
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SU
RF
AC
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2
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ST
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10
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9
11
1
2 1
0
11
12
9
1
1
1
1
2
.10
0 [
.00
3]
Tower Heatsink Drawings
76 Therrmal Mechanical Design Guide
Figure D-3. Tower Heatsink Drawing – Sheet 3 of 141
34
56
78
BCD A
12
34
56
78
BCD A
E42889
13
DWG. NO
SHT.
REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 1:1
3E42889
DREV
DRAWING NUMBER
SIZENEHALEM-EX HEAT SINK: AL FIN (TOP)
TITLE
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
PTMI
DEPARTMENT
SEE NOTES
SEE NOTES
FINISH
MATERIAL
mm/dd/yy
X
DATE
APPROVED BY
mm/dd/yy
X
mm/dd/yy
X
DATE
CHECKED BY
05/17/07
C. BEALL
DATE
DRAWN BY
8/21/07
C. BEALL
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MM
TOLERANCES:
.X
0.5 Angles
0.5
.XX
0.25
.XXX
0.125
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY
NEHALEM-EX HEAT SINK: AL FIN (TOP)
E42889-001
TOP
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPROVED
-01
RELEASE FOR TOOLING
4/24/08
JK
C3
02
.963 was 1.00
05/16/08
JK
C3
03
.963 was 1.00 (OTHER SIDE OF FIN)
05/21/08
JK
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
1
A
A
BC
80.000
3.150
[]
12 100.000
3.937
[]
.300
.012
[]
12 70.000
2.756
[]
4X .963
.038
[]
6X .963
.038
[]
10.000
.394
[]
35.000
1.378
[]
2X
5.200
.205
[]
11 MAX
50.000
1.969
[]
11 2X MAX50.000
1.969
[]
11
MINIMUM
16.000
.630
[]
TYP
8.00
.32
[]
TYP
12.00
.47
[]
NOTES: UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
UL 94 - UL FLAMABILITY TESTING
99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. 3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT
ON THE
DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE
SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT
DEFINED
ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B
(SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT.
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT
A) TYPE: ALUMINUM ALLOY (REPORT ALLOY IN FAI STUDY)
B) THICKNESS: 0.3MM (.012") THICK
C) MINIMUM THERMAL CONDUCTIVITY: 205 W/mK
4. BURR HEIGHTS SHALL NOT EXCEED 10% OF MATERIAL THICKNESS.
5. THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE.
ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER
SUPPLIED FILE.
6. PART TO BE FLAT WITHIN 0.15mm.
7. BEND RADII 0.125mm (.005") MINIMUM.
8. CRITICAL TO FUNCTION DIMENSION (CTF)
MEASURED
9. BREAK ALL SHARP EDGES
10. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT
SPECIFICATION BS-MTN-0001.
11 HEAT PIPE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER, AND SHOULD
FIT IN SPECIFIED REGION.
12 INDICATED DIMENSION DESCRIBES MAXIMUM SIZE. SUPPLIER MAY REDUCE FIN
WEIGHT BY REMOVING MATERIAL FROM CORNERS OF THE FIN.
2
1
3
Therrmal Mechanical Design Guide 77
Tower Heatsink Drawings
Figure D-4. Tower Heatsink Drawing – Sheet 4 of 141
34
56
78
BCD A
12
34
56
78
BCD A
E42888
12
DWG. NO
SHT.
REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 1:1
2E42888
DREV
DRAWING NUMBER
SIZENEHALEM-EX HEAT SINK: AL FIN (MID)
TITLE
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
PTMI
DEPARTMENT
SEE NOTES
SEE NOTES
FINISH
MATERIAL
mm/dd/yy
X
DATE
APPROVED BY
mm/dd/yy
X
mm/dd/yy
X
DATE
CHECKED BY
05/17/07
C. BEALL
DATE
DRAWN BY
8/21/07
C. BEALL
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MM
TOLERANCES:
.X
0.5 Angles
0.5
.XX
0.25
.XXX
0.125
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY
NEHALEM-EX HEAT SINK: AL FIN (MID)
E42888-001
TOP
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPROVED
-1
RELEASE FOR TOOLING
4/23/08
JK
2.963 WAS 1.00 (2X)
05/20/08
JK
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
1
RIGHT
FRONT
TOP
FRONT
A
RIGHT
TOP
A
BC
80.000
3.150
[]
12 100.000
3.937
[]
.300
.012
[]
12 70.000
2.756
[]
4X .963
.038
[]
4X .963
.038
[]
10.000
.394
[]
35.000
1.378
[]
11 2X
MAX
50.000
1.969
[]
11
MAX
50.000
1.969
[]
11
MINIMUM
16.000
.630
[]
TYP
8.00
.32
[]
TYP
12.00
.47
[]
NOTES: UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
UL 94 - UL FLAMABILITY TESTING
99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. 3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT
ON THE
DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE
SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT
DEFINED
ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B
(SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT.
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT
A) TYPE: ALUMINUM ALLOY (REPORT ALLOY IN FAI STUDY)
B) THICKNESS: 0.3MM (.012") THICK
C) MINIMUM THERMAL CONDUCTIVITY: 205 W/mK
4. BURR HEIGHTS SHALL NOT EXCEED 10% OF MATERIAL THICKNESS.
5. THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE.
ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER
SUPPLIED FILE.
6. PART TO BE FLAT WITHIN 0.15mm.
7. BEND RADII 0.125mm (.005") MINIMUM.
8. CRITICAL TO FUNCTION DIMENSION (CTF)
MEASURED
9. BREAK ALL SHARP EDGES
10. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT
SPECIFICATION BS-MTN-0001.
11 HEAT PIPE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER, AND SHOULD
FIT IN SPECIFIED REGION.
12 INDICATED DIMENSION DESCRIBES MAXIMUM SIZE. SUPPLIER MAY REDUCE FIN
WEIGHT BY REMOVING MATERIAL FROM CORNERS OF THE FIN.
1
2
3
4
5
Tower Heatsink Drawings
78 Therrmal Mechanical Design Guide
Figure D-5. Tower Heatsink Drawing – Sheet 5 of 141
34
56
78
BCD A
12
34
56
78
BCD A
E42887
12
DWG. NO
SHT.
REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 1:1
2E42887
DREV
DRAWING NUMBER
SIZE
NEHALEM-EX HS: AL FIN (BOTTOM)
TITLE
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
PTMI
DEPARTMENT
SEE NOTES
SEE NOTES
FINISH
MATERIAL
mm/dd/yy
X
DATE
APPROVED BY
mm/dd/yy
X
mm/dd/yy
X
DATE
CHECKED BY
8/20/07
C. BEALL
DATE
DRAWN BY
8/22/07
C. BEALL
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MM
TOLERANCES:
.X
0.5 Angles
0.5
.XX
0.25
.XXX
0.125
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY
NEHALEM-EX HEAT SINK: AL FIN (BASE)
E42887-001
TOP
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPROVED
-1
RELEASE FOR TOOLING
4/23/08
JK
2.963 WAS 1.00 (2X)
05/20/08
JK
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
X
RIGHT
FRONT
TOP
FRONT
A
RIGHT
TOP
A
CB
12 70.000
2.756
[]
12 100.000
3.937
[]
13.000
.512
[]
80.000
3.150
[]
THICK
.300
.012
[]
4X .963
.038
[]
4X .963
.038
[]
10.000
.394
[]
35.000
1.378
[]
11 50.000
1.969
[]
11 50.000
1.969
[]
TYP
8.00
.32
[]
TYP
12.00
.47
[]
NOTES: UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
UL 94 - UL FLAMABILITY TESTING
99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. 3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT
ON THE
DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE
SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT
DEFINED
ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B
(SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT.
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT
A) TYPE: ALUMINUM ALLOY (REPORT ALLOY IN FAI STUDY)
B) THICKNESS: 0.3MM (.012") THICK
C) MINIMUM THERMAL CONDUCTIVITY: 205 W/mK
4. BURR HEIGHTS SHALL NOT EXCEED 10% OF MATERIAL THICKNESS.
5. THIS DRAWING TO BE USED IN CORRELATION WITH SUPPLIED 3D DATABASE FILE.
ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER
SUPPLIED FILE.
6. PART TO BE FLAT WITHIN 0.15mm.
7. BEND RADII 0.125mm (.005") MINIMUM.
8. CRITICAL TO FUNCTION DIMENSION (CTF)
MEASURED
9. BREAK ALL SHARP EDGES
10. ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL PRODUCT
SPECIFICATION BS-MTN-0001.
11 HEAT PIPE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER, AND SHOULD
FIT IN SPECIFIED REGION.
12 INDICATED DIMENSION DESCRIBES MAXIMUM SIZE. SUPPLIER MAY REDUCE FIN
WEIGHT BY REMOVING MATERIAL FROM CORNERS OF THE FIN.
1
2
3
4
Therrmal Mechanical Design Guide 79
Tower Heatsink Drawings
Figure D-6. Tower Heatsink Drawing – Sheet 6 of 141
34
56
78
BCD A
12
34
56
78
BCD A
AA
E42883
11
DWG. NO
SHT.
REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 1:1
1E42883
DREV
DRAWING NUMBER
SIZE
NEHALEM-EX HEAT SINK: CU HEAT PIPE
TITLE
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
PTMI
DEPARTMENT
SEE NOTES
SEE NOTES
FINISH
MATERIAL
mm/dd/yy
X
DATE
APPROVED BY
mm/dd/yy
X
mm/dd/yy
X
DATE
CHECKED BY
05/17/07
C. BEALL
DATE
DRAWN BY
8/21/07
C. BEALL
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MM
TOLERANCES:
.X
0.5 Angles
0.5
.XX
0.25
.XXX
0.125
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY
NEHALEM-EX HEAT SINK: CU HEAT PIPE
E42883-001
TOP
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPROVED
-1
RELEASED FOR TOOLING
4/23/08
JK
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
NOTES UNLESS OTHERWISE SPECIFIED:
1. HEAT PIPE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER.
2. HEAT PIPE GEOMETRY TO BE CONTROLLED BY SUPPLIER TO MEET ASSEMBLY PRINT
REQUIREMENTS.
3. HEAT PIPE BASE MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT
A) TYPE: COPPER ALLOY (REPORT ALLOY IN FAI STUDY)
B) MINIMUM THERMAL CONDUCTIVITY: 390 W/mK
C) WICK: SINTERED POWDER
SECTION A-A
Tower Heatsink Drawings
80 Therrmal Mechanical Design Guide
Figure D-7. Tower Heatsink Drawing – Sheet 7 of 14
13
45
67
8
BCD A
12
34
56
78
BCD A
E42882
12
DWG. NO
SHT.
REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 1:1
2E42882
DREV
DRAWING NUMBER
SIZE
NEHALEM-EX HEAT SINK: CU BASE
TITLE
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
PTMI
DEPARTMENT
SEE NOTES
SEE NOTES
FINISH
MATERIAL
mm/dd/yy
X
DATE
APPROVED BY
mm/dd/yy
X
mm/dd/yy
X
DATE
CHECKED BY
05/17/07
C. BEALL
DATE
DRAWN BY
8/21/07
C. BEALL
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MM
TOLERANCES:
.X
0.5 Angles
0.5
.XX
0.25
.XXX
0.125
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY
NEHALEM-EX HEAT SINK: CU BASE
E42882-001
TOP
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPROVED
-1
RELEASE FOR TOOLING
4/23/08
JK
2PEDESTAL CORNER RADIUS IS 0.5MM WAS 4MM
6/13/08
JK
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
X
.100 [.003]
B
C
A
B
A
C
B
C
2.500
.098
[]
26.000
1.024
[]
35.000
1.378
[]
R.50.02
[]
()
2.500
.098
[]
NOTES UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
UL 94 - UL FLAMABILITY TESTING
99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
07-070-SHS - ADDENDUM FOR SOLDER ON HEATSINKS
2. 3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT
ON THE
DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE
SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT
DEFINED
ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B
(SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT.
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT
A) TYPE: COPPER ALLOY (REPORT ALLOY IN FAI STUDY)
B) MINIMUM THERMAL CONDUCTIVITY: 390 W/mK
4. PART TO BE CAST, EXTRUDED, MACHINED, OR A COMBINATION.
IF PART IS CAST, REFER TO THE FOLLOWING REQUIREMENTS:
A) DEGATE: .13 MM [.005 IN] MAXIMUM
B) FLASH & MISMATCH .13 MM [.005 IN] MAXIMUM
C) SINK .13 MM [.005 IN] MAXIMUM
D) EJECTOR MARKS: FLUSH TO MINUS .00 MM/-.25 MM [.000 IN/-.010 IN]
5. CRITICAL TO FUNCTION DIMENSION (CTF)
MEASURED
6 FINISH: MAY USE ENGINEERING APPROVED EQUIVALENT.
A) INDICATED SURFACES PER INTEL 99-0007-001, CLASS A.
B) INDICATED SURFACES PER INTEL 99-0007-001, CLASS B.
C) UNSPECIFIED SURFACES PER INTEL 99-0007-001, CLASS C.
D) TEXTURE INDICATED SURFACES PER MT-11020.
E) FINISH INDICATED SURFACES PER SPI D-2.
F) SURFACES WITH NO TEXTURE TO BE IN THE RANGE OF SPI B-2 TO SPI C-2.
G) NO TEXTURE.
7 HEAT PIPE AND ALUMINUM BASE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER.
7
7
N6 SURFACE FINISH
ON ENTIRE INDICATED
SURFACE
3
1
2
Therrmal Mechanical Design Guide 81
Tower Heatsink Drawings
Figure D-8. Tower Heatsink Drawing – Sheet 8 of 141
34
56
78
BCD A
12
34
56
78
BCD A2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
3/25/09
311.5 WAS 10.5, ADD SURFACE FINISH TO BOTTOM OF C'BORE
04/22/09
X
80.000
[3.150]
9 90.500
[3.563]
9 70.000
[2.756]
57.000
[2.244]
10.100
[.398]
4.000
[.157]
B
4.500
.177
[]
C
4.500
.177
[]
A
A
2X (
X 0.500 DEEP)
N7 SURFACE FINISH ON BOTTOM OF RECESS
11.50
.45
[]
E42881
15
DWG. NO
SHT.
REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 2:1
5E42881
DREV
DRAWING NUMBER
SIZE
NEHALEM-EX HEAT SINK: AL BASE
TITLE
PTMI
DEPARTMENT
SEE NOTES
SEE NOTES
FINISH
MATERIAL
mm/dd/yy
X
DATE
APPROVED BY
mm/dd/yy
X
08/20/07
KALISZEWSKI
DATE
CHECKED BY
8/20/07
C. BEALL
DATE
DRAWN BY
8/20/07
C. BEALL
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5-1994
DIMENSIONS ARE IN MM
TOLERANCES:
.X �# 0.5 Angles �# 0.5�$
.XX �# 0.25
.XXX �# 0.125
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY
NEHALEM-EX HEAT SINK: AL BASE
E42881-002
TOP
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPROVED
-1
RELEASE FOR TOOLING
04/23/08
JK
2ADDED
10.5MM X 0.5MM DEEP C'BORE ON BOTTOM OF PART
B4
4N7 FINISH WAS N6
08/10/09
5ON NOTE 3 ADDED "ADC10".
MINIMUM THERMAL CONDUCTIVITY WAS 205 W/mK
MINIMUM THERMAL CONDUCTIVITY IS 100W/mK
12/1/9
GPG
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
NOTES UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
ASME Y14.5M-1994 - STANDARD DIMENSION AND TOLERANCES
UL 94 - UL FLAMABILITY TESTING
99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. 3D PART MODEL IS PER ENGINEERING BILL OF MATERIAL. DIMENSIONS CALLED OUT
ON THE
DRAWING SHALL CONFORM TO THE DEFAULT TOLERANCE BLOCK UNLESS OTHERISE
SPECIFIED. THE 3D MODEL SHALL CONTROL ALL FEATURES OF THIS PART NOT
DEFINED
ON THE DRAWING. MODEL TO BE INTERPRETED USING DATUM A (PRIMARY), DATUM B
(SECONDARY), AND DATUM C (TERTIARY) PER THE DRAWING CALLOUT.
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT
A) TYPE: ALUMINUM ALLOY: ADC10 (REPORT ALLOY IN FAI STUDY)
B) MINIMUM THERMAL CONDUCTIVITY: 100 W/mK
4. PART TO BE CAST, EXTRUDED, MACHINED, OR A COMBINATION.
IF PART IS CAST, REFER TO THE FOLLOWING REQUIREMENTS:
A) DEGATE: .13 MM [.005 IN] MAXIMUM
B) FLASH & MISMATCH .13 MM [.005 IN] MAXIMUM
C) SINK .13 MM [.005 IN] MAXIMUM
D) EJECTOR MARKS: FLUSH TO MINUS .00 MM/-.25 MM [.000 IN/-.010 IN]
5. CRITICAL TO FUNCTION DIMENSION (CTF)
MEASURED
6 FINISH: MAY USE ENGINEERING APPROVED EQUIVALENT.
A) INDICATED SURFACES PER INTEL 99-0007-001, CLASS A.
B) INDICATED SURFACES PER INTEL 99-0007-001, CLASS B.
C) UNSPECIFIED SURFACES PER INTEL 99-0007-001, CLASS C.
D) TEXTURE INDICATED SURFACES PER MT-11020.
E) FINISH INDICATED SURFACES PER SPI D-2.
F) SURFACES WITH NO TEXTURE TO BE IN THE RANGE OF SPI B-2 TO SPI C-2.
G) NO TEXTURE.
7. ROUNDS REQUIRED FOR FINAL PRODUCTION CAST PART.
NOT REQUIRED FOR PROTOTYPE ORDER
8 HEAT PIPE AND CU CORE INTERFACE FEATURES TO BE CONTROLLED BY SUPPLIER.
9 INDICATED DIMENSION DESCRIBES MAXIMUM VOLUME. SUPPLIER MAY
REMOVE MATERIAL FROM BASE TO REDUCE WEIGHT
10 INDICATED POCKET FEATURE IS FOR WEIGHT REDUCTION. THESE FEATURES ARE
A SUGGESTION ONLY. SUPPLIER MAY CHANGE POCKETS WITH INTEL PTMI APPROVAL.
8
8
10
1
2 3
Tower Heatsink Drawings
82 Therrmal Mechanical Design Guide
4
Figure D-9. Tower Heatsink Drawing – Sheet 9 of 14
Therrmal Mechanical Design Guide 83
Tower Heatsink Drawings
Figure D-10. Tower Heatsink Drawing – Sheet 10 of 14
A
4
B
3
CD
43
21
A
2
C
1
D E41829 1 2DWG. NO SHT. REV
THIS DRAWING CONTAINS INTEL CORPORAT
ION CONFIDENTIAL INFORMATION. IT IS
DISCLOSED IN CONFIDENCE AND ITS CONT
ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI
SPLAYED OR MODIFIED, WITHOUT THE PRI
OR WRITTEN CONSENT OF INTEL CORPORAT
ION.
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 3.000
2E41829
CREV
DRAWING NUMBER
SIZE
NEHALEM EX LOAD SPRING
TITLE
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
PTMI
DEPARTMENT
SEE NOTES
SEE NOTES
FINISH
MATERIAL
04/11/08
JK
DATE
APPROVED BY
--
DATE
CHECKED BY
04/11/08
JK
DATE
DRAWN BY
-
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
.X
0.3 Angles
0.5
.XX
0.20
.XXX
0.127
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY
MUST BE LEFT HAND WOUND
E41829-001
TOP
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPR
-1
RELEASE FOR TOOLING
04/23/08
JK
2CHANGED SPRING ID AND OD TO AGREE WITH LEE SPRING
05/21/08
JK
PITCH2.503
0.0985
[]
1.473
0.0580
[]
25.400
1.0000
[]
8.563
0.200
0.3371
0.0078
[]
5.777
0.2274
[]
NOTES:
1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED
3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS
DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE.
2. PRIMARY DIMENSIONS STATED IN MILLIMETERS.
[BRACKETED] DIMENSIONS STATED IN INCHES.
3. LEE SPRING P/N: LHL 375b-01 OR EQUIVALENT
SPRING RATE: K=15.8 +/- 0.87 N/MM [K = 90.0 +/- 5.0 LBF/IN]
4 SOLID HEIGHT: 14.98 MM [0.59 IN]
WIRE DIAMETER: 1.473 MM [0.058 IN]
TOTAL COILS: 10
ACTIVE COILS: 8.1
ENDS: GROUND & CLOSED
TURN: LEFT HAND (AS SHOWN IN VIEWS)
MATERIAL: MUSIC WIRE, ASTM A228 OR JIS-G-3522
FINISH: ZINC PLATED
OTHER GEOMETRY: PER THIS DRAWING
4 CRITICAL TO FUNCTION DIMENSION
4
4
4 4
Tower Heatsink Drawings
84 Therrmal Mechanical Design Guide
Figure D-11. Tower Heatsink Drawing – Sheet 11 of 14
13
45
67
8
BCD A
12
34
56
78
BCD A2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
2X 3.226
[0.1270]
33.700
[1.3268] 6.797
[0.2676]
2X 0.740
[0.0291]
5.50
[0.217]
4.20
[0.165]
3.50
[0.138]
2.00
[0.079]
R0.20
0.008
[]
7.00
[0.276]
6.00
[0.236]
102.00
[4.016]
E41616
15
DWG. NO
SHT.
REV
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 1.000
5E41616
DREV
DRAWING NUMBER
SIZE
NEHALEM EX HS SCREW
TITLE
-
DEPARTMENT
SEE NOTES
SEE NOTES
FINISH
MATERIAL
DATE
APPROVED BY
--
04/08/08
C. BEALL
DATE
CHECKED BY
04/08/08
KALISZEWSKI
DATE
DRAWN BY
04/08/08
C. BEALL
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES:
.X �#0.5 Angles �# 1.0�$
.XX �# 0.25
.XXX �# 0.127
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY
SCREW
E41616-003
TOP
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPR
-1
RELEASE FOR TOOLING
04/23/08
JK
2ADDED CALLOUT FOR #2 PHILLIPS RECESS
05/29/08
JK
3REVISED SLOT DIMENSIONS (2X)
09/04/08
JK
4CHANGED LOWER SLOT FORM 3.23mm TO 3.30mm.
KEPT UPPER SLOT 3.23mm.
10-30-09
GPG
5CHANGED LOWER SLOT FROM 3.30mm TO 3.226mm
12-1-09
GPG
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
NOTES; UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. INTERPRET DIMENSIONS PER ASME Y14.5M-1994.
FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD
DATABASE, AND SHALL CONFORM TO A TOLERANCE OF +/- 0.375MM (.015").
IF PROVIDED, MEASUREMENTS SHOULD REFERENCE DATUM
-A- PRIMARY,
DATUM -B- SECONDARY, AND
-C- TERTIARY.
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.
ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL
PRODUCT SPECIFICATION (BS-MTN-0001).
A) TYPE:18-8 STAINLESS STEEL; AISI 303, 304, 305; JIS SUS304;
B) PLATING: NONE
C) HEAT TREATING: MINIMUM TENSILE STRENGTH 60,000 PSI;
TORQUE TO FAILURE SHALL BE NO LESS THAN 20 IN-LBF.
4. PART MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001).
PART SHALL BE FREE OF OIL AND DEBRIS.
FINISH: UNSPECIFIED SURFACES MUST CONFORM WITH CLASS C REQUIREMENTS.
5 CRITICAL TO FUNCTION DIMENSION (CTF).
6. SHARP CORNERS MAY BE CHAMFERED, OR ROUNDED TO 0.25MM (.010") RADIUS.
7. DEBURR ALL SHARP EDGES.
5
5
5
5
5
SCALE 2.000
SCALE 2.000
SEE DETAIL A
#2 PHILLIPS
RECESS
SECTION A-A
SEE DETAIL B
DETAIL A
SCALE 4.000
M3 x 0.5
THREAD
DETAIL B
SCALE 4.000
4
4
Therrmal Mechanical Design Guide 85
Tower Heatsink Drawings
Figure D-12. Tower Heatsink Drawing – Sheet 12 of 14
A
4
B
3
CD
43
21
A
2
C
1
D
AA
2200 M
ISS
ION
CO
LLE
GE
BLV
D.
R
P.O
. B
OX
58119
SA
NT
A C
LA
RA
, C
A 9
5052-8
119
4.5
3
10
.25
8.2
5
1.0
0
1.0
0
X 4
5°
.50
0
E85612 1 3DWG. NO SHT. REV
TH
IS D
RA
WIN
G C
ON
TA
INS
IN
TE
L C
OR
PO
RA
TIO
N C
ON
FID
EN
TIA
L IN
FO
RM
AT
ION
. IT
IS
DIS
CLO
SE
D IN
CO
NF
IDE
NC
E A
ND
IT
S C
ON
TE
NT
S M
AY
NO
T B
E D
ISC
LO
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D, R
EP
RO
DU
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D, D
ISP
LA
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D O
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OD
IFIE
D, W
ITH
OU
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HE
PR
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WR
ITT
EN
CO
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EN
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TE
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OR
PO
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SH
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O N
OT
SC
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DR
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SC
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00
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85612
CR
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DR
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NU
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NR
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SE
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FIN
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MA
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AP
PR
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--
DA
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EC
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D B
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11-4
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DA
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DR
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11-4
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G.G
OR
DO
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D B
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RW
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SP
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RP
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S A
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TO
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IN
AC
CO
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WIT
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SM
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14.5
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994
D
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NS
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S A
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MM
T
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: .X
± .25 A
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s
±
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.X
X ±
.20
.X
XX
± .125
TH
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PA
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9 G
PG
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99
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Tower Heatsink Drawings
86 Therrmal Mechanical Design Guide
Figure D-13. Tower Heatsink Drawing – Sheet 13 of 14
ABCD
43
A
2
C
1
D
AA
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
4.53
10.25
8.25
1.00
1.00
X 45�$
.500
E85130 1 1DWG. NO SHT. REV
THIS DRAWING CONTAINS INTEL CORPORAT
ION CONFIDENTIAL INFORMATION. IT IS
DISCLOSED IN CONFIDENCE AND ITS CONT
ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI
SPLAYED OR MODIFIED, WITHOUT THE PRI
OR WRITTEN CONSENT OF INTEL CORPORAT
ION.
SHEET
1OF
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1E85130
CREV
DRAWING NUMBER
SIZE
RTNR, E-RING, NEHALEM EX
TITLE
-
DEPARTMENT
SEENOTES
SEENOTES
FINISH
MATERIAL
DATE
APPROVED BY
--
DATE
CHECKED BY
10-30-09
G.GORDON
DATE
DRAWN BY
10-30-09
G.GORDON
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MM
TOLERANCES:
.X �# .25 Angles �# .5�$
.XX �# .20
.XXX �# .125
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY
RTNR, E-RING, NEHALEM EX
E85130-001
TOP
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPR
-1
RELEASE FOR SILVER PRODUCTION BUILD.
10-30-09
GPG
NOTES; UNLESS OTHERWISE SPECIFIED:
1. REFERENCE DOCUMENTS
99-0007-001 - INTEL WORKMANSHIP STANDARD - SYSTEMS MANUFACTURING
18-1201 - INTEL ENVIRONMENTAL PRODUCT CONTENT SPECIFICATION FOR
SUPPLIERS & OUTSOURCED MANUFACTURERS (FOUND ON
EHS WEBSITE - https://supplier.intel.com/static/EHS/)
2. INTERPRET DIMENSIONS PER ASME Y14.5M-1994.
FEATURES NOT SPECIFIED ON DRAWING SHALL BE CONTROLLED BY 3D CAD
DATABASE. IF PROVIDED, MEASUREMENTS SHOULD REFERENCE DATUM
-A- PRIMARY, DATUM
-B- SECONDARY, AND
-C- TERTIARY.
3. MATERIAL: MAY USE INTEL ENGINEERING APPROVED EQUIVALENT.
ALL SUBSTANCES IN THIS PART MUST CONFORM TO INTEL ENVIRONMENTAL
PRODUCT SPECIFICATION (BS-MTN-0001).
A) TYPE 303S OR 303Se STAINLESS STEEL (CONDITION B)
B) PLATING: NONE
4. PART MUST COMPLY WITH INTEL WORKMANSHIP STANDARD (99-0007-001).
PART SHALL BE FREE OF OIL AND DEBRIS.
FINISH: UNSPECIFIED SURFACES MUST CONFORM WITH CLASS C REQUIREMENTS.
5 CRITICAL TO FUNCTION DIMENSION (CTF).
6. DEBURR ALL SHARP EDGES.
5
5
5
SECTION A-A
Therrmal Mechanical Design Guide 87
Tower Heatsink Drawings
Figure D-14. Tower Heatsink Drawing – Sheet 14 of 14
A
4
B
3
CD
43
21
A
2
C
1
D
2200 MISSION COLLEGE BLVD.
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
R
0.635�#0.051
.0250�#.0020
[]
7.92
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[]
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[]
E53884 1 3DWG. NO SHT. REV
THIS DRAWING CONTAINS INTEL CORPORAT
ION CONFIDENTIAL INFORMATION. IT IS
DISCLOSED IN CONFIDENCE AND ITS CONT
ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI
SPLAYED OR MODIFIED, WITHOUT THE PRI
OR WRITTEN CONSENT OF INTEL CORPORAT
ION.
SHEET 1 OF 1
DO NOT SCALE DRAWING
SCALE: 12
3E53884
CREV
DRAWING NUMBER
SIZE
E-RING
TITLE
PTMI
DEPARTMENT
SEE NOTES
SEE NOTES
FINISH
MATERIAL
DATE
APPROVED BY
--
09/04/08
C. BEALL
DATE
CHECKED BY
09/04/08
JK
DATE
DRAWN BY
09/04/08
C. BEALL
DATE
DESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN INCHES
TOLERANCES:
.X �# 0.50 Angles �# 0.5�$
.XX �# 0.25
.XXX �# 0.10
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTION
PART NUMBER
ITEM NO
QTY
E-RING
E53884-002
TOP
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPR
-01
INITIAL RELEASE
09/04/08
JK
02
ADDED OPTIONAL NICKEL PLATING FINISH
07/27/09
03
REMOVED OIL DIP AS AN OPTION. NICKEL PLATING ONLY.
REMOVED NOTE 4. ADDED SK7 IN MATERIAL CALLOUT.
11-3-09
GPG
NOTES:
1. THIS DRAWING TO BE USED IN CONJUNCTION WITH SUPPLIED
3D DATABASE. ALL DIMENSIONS AND TOLERANCES ON THIS
DRAWING TAKE PRECEDENCE OVER SUPPLIED DATABASE.
2. PRIMARY DIMENSIONS STATED IN MILLIMETERS.
[BRACKETED] DIMENSIONS STATED IN INCHES.
3. MATERIAL: SK7 COLD ROLED HIGH CARBON STEEL. MUST MEET 84 KSI MIN TENSILE
STRENGTH.
FINISH - NICKEL PLATED.
4. REMOVED.
5 CRITICAL TO FUNCTION DIMENSION
5
5
Tower Heatsink Drawings
88 Therrmal Mechanical Design Guide
§
Therrmal Mechanical Design Guide 89
Enabled Component Board Keepout Drawings
E Enabled Component Board Keepout Drawings
Table E-1 lists the mechanical drawings included in this appendix.
Table E-1. Mechanical Drawing List
Drawing Description Figure Number
“Enabled Component Board Keepout Mechanical Drawing – Sheet 1 of 7”
Figure E-1
“Enabled Component Board Keepout Mechanical Drawing – Sheet 2 of 7”
Figure E-2
“Enabled Component Board Keepout Mechanical Drawing – Sheet 3 of 7”
Figure E-3
“Enabled Component Board Keepout Mechanical Drawing – Sheet 4 of 7”
Figure E-4
“Enabled Component Board Keepout Mechanical Drawing – Sheet 5 of 7”
Figure E-5
“Enabled Component Board Keepout Mechanical Drawing – Sheet 6 of 7”
Figure E-6
“Enabled Component Board Keepout Mechanical Drawing – Sheet 7of 7”
Figure E-7
Enabled Component Board Keepout Drawings
90 Therrmal Mechanical Design Guide
Figure E-1. Enabled Component Board Keepout Mechanical Drawing – Sheet 1 of 7
13
45
67
8
BCD A
12
34
56
78
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Therrmal Mechanical Design Guide 91
Enabled Component Board Keepout Drawings
Figure E-2. Enabled Component Board Keepout Mechanical Drawing – Sheet 2 of 7
13
45
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8
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12
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IS D
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WIN
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TA
INS
IN
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OR
PO
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FID
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RM
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. IT
IS
DIS
CLO
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ND
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ON
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AY
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D, W
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TE
L C
OR
PO
RA
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SH
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T 2
OF
7D
O N
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SC
ALE
DR
AW
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SC
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2:1
PT
MI
01
E36581
DR
EV
DR
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NU
MB
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EP
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TM
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GA
1567_3_40M
A_N
HM
NE
HA
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M-E
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NA
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D H
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PA
TT
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N
TO
P S
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TS
(AS
VIE
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D F
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M P
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OF
TH
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RB
OA
RD
)
SC
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4:1
4
SO
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TL
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SH
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NF
OR
RE
FE
RE
NC
E O
NL
Y!!
!S
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PIN
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UM
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91
06
5 O
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51
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MA
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AN
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(D
91
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24
51
0).
TH
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PO
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IS
SH
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N F
OR
RE
FE
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NC
E O
NL
Y!
Enabled Component Board Keepout Drawings
92 Therrmal Mechanical Design Guide
Figure E-3. Enabled Component Board Keepout Mechanical Drawing – Sheet 3 of 7
13
45
67
8
BCD A
12
34
56
78
BCD A
22
00
MIS
SIO
N C
OL
LE
GE
BL
VD
.R
P.O
. B
OX
58
11
9S
AN
TA
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AR
A, C
A 9
50
52
-81
19
SOCKETCENTER
26.9241.060 []
SO
CK
ET
CE
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ER
22
.35
2.8
80
[]
.00
0.0
00
[]
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22.076.869 []
2X 7.076.279 []
2X 60.9242.399 []
75.9242.989 []
13.076.515 []
66.9242.635 []
41.8241.647 []
12.024.473 []
19
.90
8.7
84
[]
11
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2.4
71
[]
32
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21
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9[
]
68
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]
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SOCKETCENTER
26.9241.060 []
SO
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80
[]
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00
[]
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2X 8.676.342 []
14.426.568 []
4.501.177 []
12.924.509 []
40.9241.611 []
62.5242.462 []
58.3492.297 []
40.4241.592 []
13.424.529 []
23.576.928 []
19
.37
8.7
63
[]
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1
2.1
48
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SH
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OF
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SC
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DR
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SC
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01
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65
81
DR
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DR
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TM
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NH
M_E
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KP
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IEW
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)
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2:1
6X
HO
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S S
HO
WN
FO
RR
EF
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EN
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ON
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!!!
4X
ILM
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VIT
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3.5
MM
HE
IGH
T
RE
ST
RIC
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ILM
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EP
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0.0
MM
HE
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TR
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TR
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4
SC
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2:1
6X
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HO
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RR
EF
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!!!
BA
CK
PLA
TE
CA
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MM
H
EIG
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RE
ST
RIC
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BA
CK
PLA
TE
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EP
OU
T:
0.0
MM
HE
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TR
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TR
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ION
4
Therrmal Mechanical Design Guide 93
Enabled Component Board Keepout Drawings
Figure E-4. Enabled Component Board Keepout Mechanical Drawing – Sheet 4 of 7
13
45
67
8
BCD A
12
34
56
78
BCD A
22
00
MIS
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N C
OL
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GE
BL
VD
.R
P.O
. B
OX
58
11
9S
AN
TA
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A,
CA
95
05
2-8
11
9
SOCKETCENTER
26.9241.060 []
SO
CK
ET
CE
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ER
22
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2.8
80
[]
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0.0
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[]
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4.501.177 []
23.576.928 []
58.3492.297 []
77.4243.048 []
13
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8.5
18
[]
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48
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SH
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OF
7D
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SC
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DR
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SC
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PT
MI
01
E36581
DR
EV
DR
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NU
MB
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EP
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SIN
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HE
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TR
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4
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HO
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Enabled Component Board Keepout Drawings
94 Therrmal Mechanical Design Guide
Figure E-5. Enabled Component Board Keepout Mechanical Drawing – Sheet 5 of 7
13
45
67
8
BCD A
12
34
56
78
BCD A
22
00
MIS
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N C
OL
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GE
BL
VD
.R
P.O
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OX
58
11
9S
AN
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SH
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OF
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RB
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Therrmal Mechanical Design Guide 95
Enabled Component Board Keepout Drawings
Figure E-6. Enabled Component Board Keepout Mechanical Drawing – Sheet 6 of 7
13
45
67
8
BCD A
12
34
56
78
BCD A
22
00
MIS
SIO
N C
OL
LE
GE
BL
VD
.R
P.O
. B
OX
58
11
9S
AN
TA
CL
AR
A,
CA
95
05
2-8
11
9
A
B
(93
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5 M
AX
)[3
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0]
(10
2.5
00
MA
X)
[4.0
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]
()
7.5
99
±.5
00
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]
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±.1
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DW
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SH
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OF
7D
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SC
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DR
AW
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SC
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PT
MI
01
E36581
DR
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Enabled Component Board Keepout Drawings
96 Therrmal Mechanical Design Guide
Figure E-7. Enabled Component Board Keepout Mechanical Drawing – Sheet 7of 7
13
45
67
8
BCD A
12
34
56
78
BCD A
22
00
MIS
SIO
N C
OL
LE
GE
BL
VD
.R
P.O
. B
OX
58
11
9S
AN
TA
CL
AR
A,
CA
95
05
2-8
11
9
80
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[3.1
5]
80
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[3.1
7]
26
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[1.0
3]
10
3.9
1[4
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]
33
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3]
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[1.7
8]
E36581
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RE
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TH
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WIN
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INS
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OR
PO
RA
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ON
FID
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RM
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. IT
IS
DIS
CLO
SE
D IN
CO
NF
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NC
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ND
IT
S C
ON
TE
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S M
AY
NO
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LO
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D, R
EP
RO
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D, D
ISP
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D O
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D, W
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PR
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WR
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CO
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EN
T O
F IN
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L C
OR
PO
RA
TIO
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SH
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OF
7D
O N
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SC
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DR
AW
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SC
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PT
MI
01
E36581
DR
EV
DR
AW
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NU
MB
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EP
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OF
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EN
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LY
Therrmal Mechanical Design Guide 97
Electrical Methodology
F Electrical Methodology
F.1 Measuring Electrical Resistance of the JumperFigure F-1 and Figure F-2 show the proposed methodology for measuring the final electrical resistance. The methodology requires measuring LGA TV flush-mounted directly to the motherboard fixtures, so that the Land shoulder is flush with the motherboard to get the averaged jumper resistance, Rjumper. The Rjumper should come from a good statistical average of 30 package fixtures flush mounted to a motherboard fixture. The same measurements are then made with a package fixture mounted on a supplier’s socket, and both are mounted on a motherboard fixture; this provides the RTotal. The resistance requirement, RReq, can be calculated for each chain, as explained later.
Figure F-3 shows the resistance test fixtures separately and superimposed. The upper figures show the daisy chain pattern of the package and the baseboard. The bottom figure shows the two parts superimposed. There are TBD daisy chain configurations on the resistance test board. Figure F-3 shows these configurations with the number of lands per each chain and netlist. All figures are shown with the view from the top of the package.
F.2 Determining Maximum Electrical ResistanceThis section provides a guideline for the instruments used to take the measurements.
Note: The instrument selection should consider the guidelines in EIA 364-23A.
Figure F-1. Methodology for Measuring Total Electrical Resistance
Figure F-2. Methodology for Measuring Electrical Resistance of the Jumper
LGA Testboard
LGA pad
Solder resist
Shorting bar on internal routing layer
LGA Package
LGA SocketSocket contact
Socket housing
Package dielectric
+V
+I -V
-IShorting bar on
test board
LGA TV
LGA Testboard+V
+I -V
-I
Electrical Methodology
98 Therrmal Mechanical Design Guide
• These measurements use a 4-wire technique, where the instruments provide two separate circuits. One is a precision current source to deliver the test current. The other is a precision voltmeter circuit to measure the voltage drop between the desired points.
• These separate circuits can be contained within one instrument, such as a high-quality micro-ohmmeter, a stand-alone current source and voltmeter, or the circuits of a data acquisition system.
• Measurement accuracy in Ω is specified as ± 0.1% of reading, or ±0.1 mΩ, whichever is greater. The vendor is responsible for demonstrating that their instrument(s) can meet this accuracy.
• Automation of the measurements can be implemented by scanning the chains through the edge or cable test socket using a switch matrix. The matrix can be operated by hand, or through software.
• Measure RTotal for each daisy chain of “package + socket + motherboard” unit.
• Measure Rjumper for each daisy chain of 30 “package + socket + motherboard” units. Calculate Rjumper for each daisy change (there are 303 data for each daisy chain).
• For each socket unit, calculate:
RReq is the average contact resistance for socket pin.
F.3 InductanceThe inductance measurement is completed in two steps. First, the socket is measured in an assembled configuration. A second measurement is made to subtract the fixture contribution. Figure F-3 shows a cross-section of the retention, LGA Adapter, socket, test board, and backing plate assembly. A circuit board, referred to as the LGA adapter, is used to compress the LGA socket leads during test. During test in the assembled configuration, the probes contact the surface of the LGA adapter. The test board contains a ground plane under the shorting bar. The second figure shows the measurement of the unassembled adapter. The measurement of the adapter alone is used to calibrate out the fixture contribution.
N
RRR
jumperTotalReq
−=
Therrmal Mechanical Design Guide 99
Electrical Methodology
F.3.1 Design Procedure for Inductance MeasurementsThe measurement equipment required to perform the validation is:
• HP8753D Vector Network Analyzer* or equivalent.
• Robust Probe Station (GTL4040)* or equivalent.
• Probes: GS1250 and GSG1250 Air-Co-Planar* or equivalent.
• Calibration: Cascade Calibration Substrates* or equivalent.
• Measurement objects: Sockets, motherboards.
F.3.1.1 Measurement Steps
1. Equipment setup:a. Cables should be connected to the network analyzer and to the probes using the
appropriate torque wrench to ensure consistent data collection every time the measurement is performed.
2. Set VNA:
a. Bandwidth = 300 KHz – 3 GHz with 801 points.
b. Averaging Factor = 16.
3. Perform Open/Short/Load calibration:
a. Calibration should be performed at the start of any measurement session.
b. Create Calibration Kit if necessary for 1st time.
c. Do not perform port extension after calibration.
Figure F-3. Inductance Measurement Fixture Cross-Section
Probe
LGA Testboard
LGA SocketSocket contact
Shorting bar on test board
Solder resist
Retention
Probe
Backing Plate
LGA Adapter
Retention
ProbeProbe
LGA Adapter
Sandwich (Fixture Contribution)
Socket
Electrical Methodology
100 Therrmal Mechanical Design Guide
4. Check to ensure calibration successfully performed.
5. Measure the inductance of the socket mounted to the motherboard fixture by probing the locations on the LGA Adapter and socket assembly.
a. Call this Lsocket assembly
b. Export data into MDS/ADS or (capture data at frequency specified in item 6 of Table 4-1).
6. Measure the inductance of the motherboard fixture by probing on the pads.
a. Call this Lsandwich
b. Measure 30 units.
c. The test board for 30 units must be chosen from different lots. Use five different lots, six units from each lot.
d. Export data into MDS/ADS or (capture data at frequency specified in item 6 of Table 4-1).
e. Calculate Lsandwich
f. For each socket unit, calculate:Lsocket = Lsocket assembly - Lsandwich
It means Lsandwich will be subtracted from each Lsocket assembly and the result will be compared with spec value for each individual socket unit.
F.3.2 Correlation of Measurement and Model Data InductanceTo correlate the measurement and model data for loop inductance, one unit of measured socket assembly (socket and shorted test fixture) and one unit of measured sandwich (shorted test fixture) will be chosen for cross-sectioning. Both units will be modeled based on data from cross sectioning using Ansoft 3D*. The sandwich inductance will be subtracted from socket assembly inductance for both measured and modeled data. This procedure results in loop inductance for socket contact. This final result can be compared with the loop inductance from the supplier model for the socket. If there is any difference between them, it will be called the de-embedded correction factor. Adding the test board to the socket and then eliminating the contribution of the fixture creates this correction factor because inductance is not linear.
Figure F-4. Measurement Fixture Cross-Section
ProbeSocket contact
Plastic Housing
Therrmal Mechanical Design Guide 101
Electrical Methodology
F.4 Dielectric Withstand VoltageNo disruptive discharge or leakage greater than 0.5 mA is allowed when subjected to 360 V RMS. The sockets shall be tested according to EIA-364, Test Procedure 20A, Method 1. The sockets shall be tested in fully mated condition. Barometric pressure shall be equivalent to Sea Level. The sample size is 25 contact-to-contact pairs on each of four sockets. The contacts shall be randomly chosen.
F.5 Insulation ResistanceThe Insulation Resistance shall be greater than 800 MΩ when subjected to 500 V DC. The sockets shall be tested according to EIA-364, Test Procedure 21. The sockets shall be tested in fully mated condition. The sample size is 25 contact-to-contact pairs on each of 4 sockets. The contacts shall be randomly chosen.
F.6 Contact Current RatingMeasure and record the temperature rise when the socket is subjected to rate current of 0.8 A. The sockets shall be tested according to EIA-364, Test Procedure 70 A, Test Method 1.
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Electrical Methodology
102 Therrmal Mechanical Design Guide
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