interconnect and packaging chapter 2: transmission line parameters

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Interconnect and Packaging Chapter 2: Transmission Line Parameters. Chung-Kuan Cheng UC San Diego. Outline. Causality Transmission Lines for Digital Applications Transmission Line Structures Time Domain Reflectometer LC Measurement Internal RL Analysis Proximity Effect PCB Properties - PowerPoint PPT Presentation

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Interconnect and PackagingChapter 2: Transmission Line Parameters

Chung-Kuan ChengUC San Diego

Outline• Causality• Transmission Lines for Digital Applications• Transmission Line Structures• Time Domain Reflectometer • LC Measurement• Internal RL Analysis• Proximity Effect• PCB Properties• Slow Waves

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Causality

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Transmission Lines for Digital Systems

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Transmission Line Structures

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Time Domain Reflectometer TDR

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Wave Propagation

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Wave Propagation

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LC Measurement

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Round-Wire Internal RL

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Internal Impedance of Round-Wire

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Proximity Effect

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Proximity Effect via Eddy Current

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Properties of PCB Materials

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Slow Wave Mode

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