kaiam introduction - 7 pennies · technology differentiation • multi-lane single-mode (wdm 4x10...
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KAIAM introduction�March 2015
3/19/15 KAIAM Corporation Confidential 1
Who is Kaiam?�
3/19/15 KAIAM Corporation Confidential 2
2 main product lines �• 40G and 100G transceivers for modern datacenters�• PLC chips and modules for transport and broadband networks ��
Technology differentiation�• Multi-lane single-mode (WDM 4x10 Gbps, 4x25 Gbps) �• High-density and athermalized PLC �
Vertically integrated volume manufacturing�• PLCs into Tier 1 OEMS for over a decade�• 40G and 100G to leading OEM and large datacenter customers�
Private Silicon Valley company �• 5 years old �• Latest funding September 2014 $35M from strategic investors �
�
Vertically integrated & volume�
3/19/15 KAIAM Corporation Confidential 3
§ 2 locations: § HQ in Silicon Valley: corporate, R&D, transceiver production
§ Manufacturing in Scotland: Chips (PLC, MEMS), actives subassembly
§ originally Kymata, owned by Alcatel and Gemfire, acquired by Kaiam in 2013
§ 57 k sq ft total; 33 k sq. ft manufacturing; 10 k sq ft fab Class 100 silicon fab, 20 k sq ft Class 10,000 assembly and test
Technology is based on Silicon ecosystem�
3/19/15 KAIAM Corporation Confidential 4
4. In volume production with this approach
§ QSFP+ 40G LR4
1. Start with a “PCB” • In this case, silicon MEMS breadboard • Simple low-‐cost process, can be done at
many foundries 2. Die-‐bond components onto the “PCB”
• Standard die-‐bonding tools used for electronics
3. Additional connections by wirebonding • Optical Wirebond is quick process with cheap
tools, because tolerant of mechanical positioning errors and shifts
100 Gb/s Silicon version �§ Target is to make a 4 channel TOSA in Silicon § Decided to use MPW run for initial trials
CH1 CH2 CH3 CH4 Layout in maskengineer
Functional diagram
Following IMEC technology handbook and use of IMEC-PDK�
IMEC process Modules pre-defined in Layout software
Standard cells and components can be included from IMEC-PDK Advanced cells, like bright AWG, from design houses can readily be included
Fab foundry: IMEC support �
§ Transfer of modulator design&technology from 1550 nm to 1310 nm
§ Transfer of grating coupler designs from 1550 nm to 1310 nm telecom window.
§ Photonic Design Kit made available through Phoenix BV.
§ Design rule checking done by IMEC, this includes the check on acute-‐angles which can delay design significantly when not taken into account early!
§ Fabrication of chips on MPW run
Packaging foundry: Tyndall �
§ Testing of grating couplers
§ Testing of AWG in Silicon
§ Packaging of modulators
Lessons learned�
§ Think about testing configuration
§ Plan on using packaging (foundry) and involve back-‐end early on in design stage
§ Check for and eliminate acute angles in design
§ Packaging and fabrication foundries as well as the software supplier were happy to help with custom requests outside the standard set of cells available.
Aligned to your vision�
3/19/15 KAIAM Corporation Confidential 10
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