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2018 Microchip Technology Inc. DS50002832A
Low-VoltagePower Factor Correction
Development KitUser’s Guide
DS50002832A-page 2 2018 Microchip Technology Inc.
Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights unless otherwise stated.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV
== ISO/TS 16949 ==
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4435-0
LOW-VOLTAGEPOWER FACTOR CORRECTION
DEVELOPMENT KIT USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 5
Chapter 1. Overview....................................................................................................... 91.1 Introduction ..................................................................................................... 91.2 Low-Voltage Power Factor Correction Development Kit .............................. 10
1.2.1 LVPFC Development Board ...................................................................... 101.2.2 Digital Power Plug-In Module (DP PIM) Board .......................................... 12
1.3 System Setup ............................................................................................... 131.4 Test Points ................................................................................................... 141.5 Electrical Characteristics .............................................................................. 151.6 Mating Socket Pinout ................................................................................... 151.7 Measurement Results .................................................................................. 16
Appendix A. Board Layout and Schematics.............................................................. 23A.1 LVPFC Development Board Schematics ..................................................... 24A.2 LVPFC Development Board PCB Layout .................................................... 26A.3 Auxiliary Power Supply Module Schematics ................................................ 28A.4 Auxiliary Power Supply Module PCB Layout ............................................... 29
Appendix B. Bill of Materials (BOM)........................................................................... 31B.1 Bill of Materials – LVPFC Development Board ............................................ 31B.2 Bill of Materials – Auxiliary Power Supply Module ....................................... 34
Appendix C. Example Algorithm ................................................................................ 37C.1 Interleaved PFC Boost Converter in Transition Mode ................................. 37C.2 Interleaved PFC Boost Converter in Continuous
Conduction Mode ................................................................................... 39
Appendix D. Optional Supporting Equipment........................................................... 41D.1 Introduction .................................................................................................. 41D.2 Isolation Transformer ................................................................................... 41D.3 Active Load 50W .......................................................................................... 42
Worldwide Sales and Service .................................................................................... 44
2018 Microchip Technology Inc. DS50002832A-page 3
Low-Voltage Power Factor Correction Development Kit User’s Guide
NOTES:
DS50002832A-page 4 2018 Microchip Technology Inc.
LOW-VOLTAGEPOWER FACTOR CORRECTION
DEVELOPMENT KIT USER’S GUIDE
Preface
INTRODUCTION
This chapter contains general information that will be useful to know before using the Low-Voltage Power Factor Correction (LVPFC) Development Kit. Items discussed in this chapter include:
• Document Layout
• Conventions Used in this Guide
• Recommended Reading
• The Microchip Website
• Product Change Notification Service
• Customer Support
• Document Revision History
DOCUMENT LAYOUT
This document describes how to use the LVPFC Development Kit to ensure safe voltage levels at moderate power. The document is organized as follows:
• Chapter 1. “Overview” — This chapter introduces the LVPFC Development Kit and provides a brief overview of its various features.
• Appendix A. “Board Layout and Schematics” — This appendix presents the schematics and board layouts for the LVPFC Development Kit and the Auxiliary Power Supply module.
• Appendix B. “Bill of Materials (BOM)” — This appendix presents the Bill of Materials for the LVPFC Development Kit and the Auxiliary Power Supply module.
• Appendix C. “Example Algorithm” — This appendix provides algorithm examples for the LVPFC Development Board.
• Appendix D. “Optional Supporting Equipment” — This appendix presents the recommended supporting equipment to be used with the LVPFC Development Board.
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our website (www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document.
For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics to open a list of available online help files.
2018 Microchip Technology Inc. DS50002832A-page 5
Low-Voltage Power Factor Correction Development Kit User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description Represents Examples
Arial font:Italic characters Referenced books MPLAB® IDE User’s Guide
Emphasized text ...is the only compiler...
Initial caps A window the Output window
A dialog the Settings dialog
A menu selection select Enable Programmer
Quotes A field name in a window or dialog
“Save project before build”
Underlined, italic text with right angle bracket
A menu path File>Save
Bold characters A dialog button Click OK
A tab Click the Power tab
N‘Rnnnn A number in verilog format, where N is the total number of digits, R is the radix and n is a digit.
4‘b0010, 2‘hF1
Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>
Courier New font:
Plain Courier New Sample source code #define START
Filenames autoexec.bat
File paths c:\mcc18\h
Keywords _asm, _endasm, static
Command-line options -Opa+, -Opa-
Bit values 0, 1
Constants 0xFF, ‘A’
Italic Courier New A variable argument file.o, where file can be any valid filename
Square brackets [ ] Optional arguments mcc18 [options] file [options]
Curly brackets and pipe character: { | }
Choice of mutually exclusive arguments; an OR selection
errorlevel {0|1}
Ellipses... Replaces repeated text var_name [, var_name...]
Represents code supplied by user
void main (void){ ...}
DS50002832A-page 6 2018 Microchip Technology Inc.
Preface
RECOMMENDED READING
This user’s guide describes how to use LVPFC Development Kit. Other useful document(s) are listed below. The following Microchip document(s) are recommended as supplemental reference resources.
• “Digital Power Development Board User’s Guide” (www.microchip.com/DS50002814); available for download from the Microchip website.
THE MICROCHIP WEBSITE
Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information:
• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events; and listings of Microchip sales offices, distributors and factory representatives
PRODUCT CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.
To register, access the Microchip website at www.microchip.com, click on Product Change Notification and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Corporate Application Engineer (CAE)
• Embedded Solutions Engineer (ESE)
Customers should contact their distributor, representative or Embedded Solutions Engineer (ESE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.
Technical support is available through the website at:
http://www.microchip.com/support.
DOCUMENT REVISION HISTORY
Revision A (April 2019)
This is the initial version of this document.
2018 Microchip Technology Inc. DS50002832A-page 7
Low-Voltage Power Factor Correction Development Kit User’s Guide
NOTES:
DS50002832A-page 8 2018 Microchip Technology Inc.
LOW-VOLTAGEPOWER FACTOR CORRECTION
DEVELOPMENT KIT USER’S GUIDE
Chapter 1. Overview
1.1 INTRODUCTION
When developing high-voltage applications, especially offline Power Factor Correction (PFC) applications, engineers face safety concerns with high-voltage and high-energy electronic devices. The purpose of the Low-Voltage Power Factor Correction (LVPFC) Development Kit is to offer safe voltage levels at moderate power, while designing algorithms for a boost Power Factor Correction topology. These algorithms can be applied on real systems under development with minimal effort. The LVPFC Development Kit utilizes Microchip’s latest Digital Power Plug-In Module (DP PIM) with the dsPIC33EP128GS806 device, supporting fully digital and advanced power control algorithm schemes. However, the pinout is standardized and the kit supports all currently available DP PIMs, thus allowing users to evaluate different devices under the same conditions. For more information on the available DP PIMs, visit: https://www.microchip.com.
Figure 1-1 shows the high-level block diagram.
FIGURE 1-1: HIGH-LEVEL BLOCK DIAGRAM
The topics covered in this chapter include:
• Low-Voltage Power Factor Correction Development Kit
• System Setup
• Test Points
• Electrical Characteristics
• Mating Socket Pinout
• Measurement Results
LVPFC Development
Board
V C/ V C
V C/ V C
VDC
Note: Please note that the Isolation Transformer has 10:1 turns ratio. Therefore, every voltage at the primary side will be scaled down by a factor of 10.For documentation simplicity, further on we will talk about 24 VAC input voltage.
2018 Microchip Technology Inc. DS50002832A-page 9
Low-Voltage Power Factor Correction Development Kit User’s Guide
1.2 LOW-VOLTAGE POWER FACTOR CORRECTION DEVELOPMENT KIT
The LVPFC Development Kit consists of:
1. LVPFC Development Board.
2. Digital Power Plug-In Module (DP PIM) Board.
Optional supporting equipment:
3. Isolation Transformer.
4. Active Load 50W.
1.2.1 LVPFC Development Board
The LVPFC Development Board is based on conventional Interleaved Boost Power Factor Correction (PFC) topology. The converter supports a 24 VAC input, but the PCB is designed following high-voltage design rules. With some modifications, the board can support a universal offline voltage range of 80 VAC to 260 VAC, and up to 200W output power at 400 VDC output voltage. Figure 1-2 shows the high-level overview.
FIGURE 1-2: LVPFC DEVELOPMENT BOARD
The main blocks of the LVPFC Development Board are:
• EMI/EMC Filter at the Input (capable of high voltage)
• Bridge Rectifier (3 AMAX, capable of high voltage)
• Phase 1 (MOSFET, Current Transformer, diode rectifier)
• Phase 2 (MOSFET, Current Transformer, diode rectifier)
• Ultra-Wide Voltage Range (UWVR) 5W Flyback (capable of low and high voltage); provides a 12V primary, non-galvanic isolated and 12V secondary, 4 kV galvanic isolated voltage
• Switch Mode Step-Down Regulator, 5V/400 mA, Pin-to-Pin Compatible with theLAN780X Family of Linear Regulators
EMI Filter Phase 1
Phase 2
Current Sense (CS) Gate Drive
and ZCD
Input Voltage 12 VAC to 24 VAC
3 ARMS_MAX
Output Voltage 36 V to 42 V
50 W
DP PIM Board dsPIC33EPXX
UWVR 5W Flyback
12V Primary
Bridge Rec er
Bulk Capacitors
UART (I2C)
GPIOProgramming
PWM1 and 2 CS1 and 2 ZCD1 and 2
V V
DC-DC 5V Regulator
Current Sense Gate Drive
and ZCD
Legend:
PFC Development Board
5W Flyback Board
DC-DC Regulator
Digital Power PIM Board
12V Secondary4 kV Isolated
DS50002832A-page 10 2018 Microchip Technology Inc.
Overview
The LVPFC Development Board supports:
• Single-Phase or Dual Phase Operation Mode
• Discontinuous, Transition, Continuous Current Mode of Operation
• Input AC Voltage, Output DC Voltage: Resistive Voltage Divider Sense
• Current Sense in Each Power Switch Leg: Current Transformers
• Zero-Cross Detection (ZCD): Auxiliary Winding Placed at Storage Chokes
• Inrush Current Limiter: Negative Temperature Coefficient (NTC) Resistor and Relay
• Output Overvoltage Protection (OVP): Analog Comparator with Hysteresis and Disabling Gate Drivers; power Reset (unplug the power) is needed to reset the comparator
• Mating Socket for DP PIM Board
The LVPFC Development Board has the following features, as shown in Figure 1-3:
FIGURE 1-3: LVPFC DEVELOPMENT BOARD
1. Socket for Digital Power Plug-In Module (DP PIM) boards. Socket type is Samtec, Inc. (Part #: MECF-30-01-L-DV-WT).
2. Auxiliary Power Supply module.
3. Input power connector.
4. Output power connector.
5. Input EMI filter.
6. PFC storage chokes.
7. Current Transformers.
8. Output bulk capacitors.
9. Input rectifier, power MOSFETs with their heat sink.
10. Inrush current limiter (NTC resistor and relay).
11. DC-DC 5V regulator.
Board dimensions are: 160 mm (length) x 100 mm (height).
2018 Microchip Technology Inc. DS50002832A-page 11
Low-Voltage Power Factor Correction Development Kit User’s Guide
1.2.2 Digital Power Plug-In Module (DP PIM) Board
The dsPIC33EP128GS806 Digital Power Plug-In Module (DP PIM) is a demonstration board that showcases the Microchip dsPIC33EP128GS806 16-Bit Digital Signal Controller (DSC) features. The DP PIM provides access to the dsPIC33EP128GS806 analog inputs, the Digital-to-Analog Converter (DAC) outputs, the Pulse-Width Modulation (PWM) outputs and the General Purpose Input and Output (GPIO) ports. The Microchip series of DP PIMs for digital power share the same pinout at the mating socket. However, these DP PIMs show slightly different performing characteristics.
Figure 1-4 shows the features of the dsPIC33EP128GS806 DP PIM Board.
FIGURE 1-4: dsPIC33EP128GS806 DP PIM BOARD
1. Microchip dsPIC33EP128GS806 16-bit Digital Signal Controller (64-pin TQFP package).
2. ICSP™ programming header (6-pin, 2.54 mm header).
3. On-board LDO (3.6 VDC to 6.3 VDC) with Power Good (PG) function.
4. Solder pad for ground connection.
5. Micro-USB connector. (Please note that there is no galvanic isolation provided at this point.)
6. MCP2221A USB to UART/I2C serial converter.
7. Power indicator LED (green).
8. User LED (red).
9. Board edge connection interface for analog inputs/outputs, PWM outputs and GPIO ports.
10. Analog input with op amp buffer via test point loop connector; can be used for Bode plot measurements.
11. Test point loops for DAC outputs.
Board dimensions are: 51 mm (length) x 38.5 mm (width).
For more information on the DP PIM Board, refer to the “dsPIC33EP128GS806 Digital Power Plug-In Module (PIM) User’s Guide” (www.microchip.com/DS50002761).
1.2.2.1 SOCKET FOR DP PIM BOARDS
Insert the DP PIM Board under test into the socket located at the end of the board. This socket has a slot that defines the DP PIM Board direction. Be careful not to break the slot when inserting the DP PIM Board into the socket.
The DP PIM Board has a micro-USB connector that can be used for communication with the dsPIC® device. The UART protocol and Graphical User Interface (GUI) are used to establish communication. For more information, please visit: www.microchip.com.
1
2
3
4
5 6
7
8
9
10
11
10
A D D A
4
9
PCB Top View PCB Bottom View
DS50002832A-page 12 2018 Microchip Technology Inc.
Overview
1.3 SYSTEM SETUP
Figure 1-5 shows the standard test setup. For more information on the isolation transformer and the active load, refer to Appendix D. “Optional Supporting Equipment”.
FIGURE 1-5: STANDARD SYSTEM SETUP
Isolation Transformer: Be careful to position the input voltage selector into the proper place (120V or 230V) before plugging into mains. The Protective Earthing (PE) connection between the transformer and the LVPFC Development Board is not mandatory. Use the switch at the front panel to provide or cut off the power to the LVPFC Development Board.
The isolation transformer can be coupled with an adjustable AC source to support a wider AC input voltage range. Output impedance of the transformer should be very close to the Line Insertion Stabilization Network (LISN), which is used for EMI measurements. It allows a certain grade of impedance matching and interference to bring the LVPFC Development Board closer to real-world applications. If using a different type of transformer, please take care that the leakage inductance is in the range of 50 µH (±20%). Also, if using an active AC source only, the usage of differential voltage probes is mandatory.
Active Load: Please read the user manual of the device before operating. Incorrect setup can damage the LVPFC Development Board. The purpose of the PFC stage is to source loads, such as a DC/DC downstream converter, which is acting as a constant power system. Therefore, all measurements must be done under this condition. The active load, prepared for this development kit, can act as a downstream converter with the following features: constant power, constant current, Undervoltage Lockout (UVLO), load step of 100 Hz and 50% duty cycle (pulse). If different equipment is used, please note that some functions on the supplementary equipment may not be available and special care must be taken during start-up, light or no load conditions.
DP PIM Board USB Connection: Use the micro-USB cable to connect the DP PIM Board with the host PC and run the dSMPS GUI to communicate with the dsPIC device; it is allowed only if the board is galvanically isolated (isolation transformer is used). For more information, refer to the user’s guide of the specific DP PIM Board that is used.
Isola onTransformer 10:1 50W A ve Load
Constant PowerConstant Current
120 V /230 V
24 VUVLO = 36V
Po = 45W
0 V
ACPower Meter
I V
+
12 V WallAdapter
120 V ...230 V
DPPI
MBo
ard
L N GND
LVPFC Development
Board
GUI
!
!
V = 12VI = 200 mA
+
GND +V
12V AuxiliaryPower Supply
Firmware DebuggingPurpose Only
J1 J2
J9
J3
2018 Microchip Technology Inc. DS50002832A-page 13
Low-Voltage Power Factor Correction Development Kit User’s Guide
12V Auxiliary Power Supply: Connecting this voltage source to the board provides a permanent 12V. It is useful for debugging purposes, where powering a main power train is not needed.
Test Points: Use an oscilloscope to access the test points at the edge of the board. For reference potential, use GND_P or GND_A; this is allowed only if the board is galvanically isolated (isolation transformer is used).
AC Power Meter: Use the AC power meter for algorithm optimizations at the AC line (power factor, THD, efficiency, etc.); it is not mandatory for basic algorithm development.
1.4 TEST POINTS
Test loop points are placed mostly on the LVPFC Development Board. They can be used to access analog and PWM signals coming from or to the DP PIM Board. Table 1-1 lists the test points on the LVPFC Development Board.
TABLE 1-1: TEST POINTS
Test Point Name Function/Description
TP1, TP2 GND_P (power reference GND)
TP3 Switching Node, Phase 1
TP4 Power GND Reference Potential
AGND Analog GND Reference Potential
TP6 Switching Node, Phase 2
CH2 Output PFC Voltage, Spectrum Analyzer Injection Point
CH1 Spectrum Analyzer Injection Point
VAC Rectified Input AC Voltage
ZCD1 Zero-Cross Detection, Phase 1
ZCD2 Zero-Cross Detection, Phase 2
PFC-PWM1 dsPIC® DSC PWM Output, Phase 1
PFC-PWM2 dsPIC DSC PWM Output, Phase 2
CS1 Current Transformer – Current Sense, Phase 1
CS1 Current Transformer – Current Sense, Phase 2
Relay dsPIC DSC Output Control – Relay On/Off
VAC_SENSE Input AC Voltage Sense Line
VPFC_SENSE PFC Voltage Sense Line
5V System VDD Rail
DS50002832A-page 14 2018 Microchip Technology Inc.
Overview
1.5 ELECTRICAL CHARACTERISTICS
Table 1-2 shows the electrical characteristics of the LVPFC Development Board.
1.6 MATING SOCKET PINOUT
The pinout is shown in Table 1-3.
TABLE 1-2: ELECTRICAL CHARACTERISTICS
Parameter Low-Voltage Solution High-Voltage Solution
Input Voltage Range (VAC) 8 to 26 80 to 260
Output Power (WMAX) 50 200
Output Load Current (AMAX) 1.28 0.51
Input Current (AMAX) 3
Efficiency (%) ~90 ~96
Operating Temperature Range 0°C to +40°C
TABLE 1-3: MATING SOCKET PINOUT
Name Mating Socket Pin Function/Description
GND_A 1, 2 Analog Ground
CS2 6 Current Sense, Phase 2
ZCD2 8 Zero-Cross Detection, Phase 2
Temp 9 Temperature Sense
VPFC_SENSE 10 Output PFC Voltage Sense
CS1 12 Current Sense, Phase 1
VAC_SENSE 14 Input AC Voltage Sense
ZCD1 18 Zero-Cross Detection, Phase 1
PFC-PWM2 42 PWM Output, Phase 2
PFC-PWM1 45 PWM Output, Phase 1
Relay 46 Inrush Control – Relay On/Off
+5V 57, 59 VDD Rail
GND_D 58, 60 Digital Ground
2018 Microchip Technology Inc. DS50002832A-page 15
Low-Voltage Power Factor Correction Development Kit User’s Guide
1.7 MEASUREMENT RESULTS
If not otherwise stated, all measurements were done at 24 VAC input voltage and 50W output load, using the setup shown in Figure 1-5. The algorithm used was supporting the interleaved Transition Mode (TM) regulation technique. The regulated output voltage was 40 VDC. Distortion in the input AC signal is coming from the mains voltage. The input current distortion close to zero cross is due to the fact that the voltage below 1.2V cannot cross the bridge rectifier at the input. This 1.2V is approximately 4% of the input voltage. In case of full voltage scale at the mains, this error would be one decade below, that is, 0.4%.
Figure 1-6 through Figure 1-12 show the oscilloscope measurements.
FIGURE 1-6: SWITCHING NODES
Legend:
C1 (yellow): Gate Voltage
C2 (red): Drain Voltage
C4 (green): Input Current
Time Base: 10 µs/div
DS50002832A-page 16 2018 Microchip Technology Inc.
Overview
FIGURE 1-7: 100 Hz OUTPUT RIPPLE VOLTAGE
Legend:
C1 (yellow): VOUT (AC coupled)
C4 (green): Input Current
Time Base: 5 ms/div
2018 Microchip Technology Inc. DS50002832A-page 17
Low-Voltage Power Factor Correction Development Kit User’s Guide
FIGURE 1-8: VPFC_SENSE, VAC_IN TEST POINTS
Legend:
C1 (yellow): VPFC_SENSE
C2 (red): VAC_IN
C4 (green): Input Current
Time Base: 5 ms/div
DS50002832A-page 18 2018 Microchip Technology Inc.
Overview
FIGURE 1-9: ZERO-CROSS DETECTION (ZCD), PWM TEST POINTS
Legend:
C1 (yellow): ZCD Test Point
C2 (red): PWM Test Point
C4 (green): Input Current
Time Base: 5 µs/div
Condition: Input current close to minimum.
2018 Microchip Technology Inc. DS50002832A-page 19
Low-Voltage Power Factor Correction Development Kit User’s Guide
FIGURE 1-10: ZERO-CROSS DETECTION (ZCD), PWM TEST POINTS
Legend:
C1 (yellow): ZCD Test Point
C2 (red): PWM Test Point
C4 (green): Input Current
Time Base: 10 µs/div
Condition: Input current at the peak.
DS50002832A-page 20 2018 Microchip Technology Inc.
Overview
FIGURE 1-11: CURRENT TRANSFORMER (CT), PWM TEST POINTS
Legend:
C1 (yellow): CT Test Point
C2 (red): PWM Test Point
C4 (green): Input Current
Time Base: 10 µs/div
Condition: Input current close/around zero cross.
2018 Microchip Technology Inc. DS50002832A-page 21
Low-Voltage Power Factor Correction Development Kit User’s Guide
FIGURE 1-12: CURRENT TRANSFORMER (CT), PWM TEST POINTS
Legend:
C1 (yellow): CT Test Point
C2 (red): PWM Test Point
C4 (green): Input Current
Time Base: 10 µs/div
Condition: Input current at the peak.
DS50002832A-page 22 2018 Microchip Technology Inc.
LOW-VOLTAGEPOWER FACTOR CORRECTION
DEVELOPMENT KIT USER’S GUIDE
Appendix A. Board Layout and Schematics
This appendix contains the schematics and board layouts for the LVPFC Development Board. The topics covered in this appendix include:
• LVPFC Development Board Schematics
• LVPFC Development Board PCB Layout
• Auxiliary Power Supply Module Schematics
• Auxiliary Power Supply Module PCB Layout
2018 Microchip Technology Inc. DS50002832A-page 23
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Altium.com
ND_P
1N4148D11
GND_AGND_A
CS2
VPFC
Ptot = 1W
UPFC = 36V ...42 VMAXIOUT_MAX = 1.3APMAX = 50W
10k12061%
R16
10k12061%
R15
10k12061%
R14Vpfc_sense
GND_P
2
3 4
1
CS4100V-01L
T2
ES3B
D3
50V1500 μFC4
50V1500 μFC5
GND_P GND_P
GND_P
VPFC
10k12061%
R21
TP2
GND_P
51R06031%
R8CH2
CH1
120R06031%
R22120R06031%
R23
GND_A
3V @ 5A peak current
IRMS_MAX = 2AIPEAK_MAX = 5APD_MAX = 300 mW
2.20k06031%
R4
GND_A
VSENSE = 0,06832 x VPFCVSENSE = 2,12V @ 31VVSENSE = 2.73V @ 40V
TP1
GND_P
47 μF63V
C19
GND_PGND
VPFC
0.1 μF500V1210
C20
GND_P
15R12061%
R9
GND_P
4.7 μH
L4
330 μF450VP10D35H35
DNPC1
CAP1931
33 μF450VP5D12.5H27
DNPC18
2
3 IPP126N10N3GQ4
12
TERMINAL 1x2
J2
12
TERMINAL 1x2
J3
6800 pF50V0603
C23
GND_A
680 pF100V0805
C22
CH2 and CH1 for BODEvoltage loop measurment only
A.1 LVPFC DEVELOPMENT BOARD SCHEMATICS
Figure A-1 and Figure A-2 show the board schematics.
FIGURE A-1: LOW-VOLTAGE POWER FACTOR CORRECTION DEVELOPMENT BOARD SCHEMA
PFC-PWM2
GND_P
G
1N4148D8 CS1
GND_A GND_A10R1206
R17
10R1206
R24
VAC
Ptot = 1W
3V @ 5A peak currentGND_P
275V
Disc 10 mm
MOV1
IRMS_MAX = 2AIPEAK_MAX = 5APD_MAX = 300 mW
IRMS_MAX = 1.3AIPEAK_MAX = 5AIAV = 0.63APD_MAX = 450 mW
10k12061%
R5
10k12061%
R6
10k12061%
R7Vac_sense
US1JD6
US1JD7
2
3 4
1
CS4100V-01L
T1
2 mH
2 3
41 1
2
L2ES3B
D2
PFC-PWM1
31
22N7002-7-FQ3
10k06031%
R20
Relay
1N4148D10
PFC Power Stage12V<Uinac<26V30V<UPFC<42V0W<POUT<50WEta>90%Ploss<6W
3 1276
12
50 μHL1
PE
VIN =12 VAC...26 VAC3 AMAX
PEPE
0.33 μFAC 275V
C3
10k12061%
R11
1 μF16V
C12
1 μF16V
C13
Vac
10R1206
R18
10R1206
R25
3.3k06031%
R19
3.3k06031%
R26
120R06031%
R12120R06031%
R13
GND_A
GND_A
GND_A
1k06031%
R10
1k06031%
R1
ZCD2
ZCD1
GND_A
GND_A
0.47 μF310V
C80.47 μF310V
C9
1N4148D1
1N4148D9
+5V
+12V_P
TP3
TP6
GND_P GND_P
2.20k06031%
R30
GND_A
GND_P
VDD1
IN2
EN3
GND 4
GND 5
OUT 6OUT 7
VDD8
MCP14A0452
U1
10R
R31
GND_P
GND_P
VDD1
IN2
EN3
GND 4
GND 5
OUT 6OUT 7
VDD8
MCP14A0452
U2
GND_P
10R
R32+12V_P
GND_P
GND_P
Drive_Enable
VSENSE = 0,06832 x VPFCVSENSE = 2,12V @ 31VVSENSE = 1.16V @ 17V
100R06031%
R39
15R12061%
R2
GND_P
F2395-NDFuse has to be added
5A 250 VAC
F2
-t10R
TH1
3 1276 2
50 μHL3
P1 P2
P3 P4
123
TERMINAL 1x3J1
Fuse Holder 5x20 mm
F1
0.68 μF310VRadial
C7
4700 pF300VP7.5D8H11
C104700 pF300VP7.5D8H11
C11
RS3J
D12
1
2
3
4
G6C-1114P-US-DC5
RL1
2
13 IPP126N10N3G
Q2
1
6800pF50V0603
C24
GND_A
3.3VD16
GND_A
3.3VD14
GND_A
1N4148D15
1N4148D13
3 1
42
~
~
+
-600V/3AKBP306GTB
D5
680 pF100V0805
C21
1
Bo
ard
La
yo
ut a
nd
Sc
he
ma
tics
2
01
8 M
icroch
ip T
ech
no
log
y Inc.
DS
50
00
28
32
A-p
ag
e 2
5
FIG S (PAGE 2 OF 2)
Designed with
Altium.com
Temp100R06031%
R27
1 μF16V
C6
GND_P
PFC-PWM1
Temp
ZCD1
PFC-PWM2
PFC-PWM1
CS2
VPFC_SENSE
ZCD2
CS1
VAC_IN
ZCD2
ZCD1
PFC-PWM2
PFC-PWM1
CS1
CS2
Vpfc_sense
Vac_sense
135791113151719
23252729313335373941434547495153555759
GE 60P FemaleCF-30-01-L-DV-WT
UT2
+5V
URE A-2: LOW-VOLTAGE POWER FACTOR CORRECTION DEVELOPMENT BOARD SCHEMATIC
10R
R33
GND_P GND_P
1 μF16V
C16
+5V
Temp = 10 mV/°CUTEMP = 500 mV + Temp * 10 mV/°C
VPFC
GND_P
External Supply10V..12V-500 mA
For development purpose only
35V47 μFC25
CS1
TP4
PFC-PWM2
CS2
Vac_sense
Vpfc_sense
ZCD1
ZCD2
Relay
GND_A
GND_P
+12V_P +12V_S
GND
4 kV Isolation Barrier
AGND
GND_P
2468
101214161820
24262830323436384042444648505254565860
EDME
J4
GND3
VDD1
VO
MCP9700
U3
12
TERMINAL 1x2
J8+12V_S
35V47 μFC15
IN+3
IN-4
OUT 1V-
2
V+
5+
T
MIC6270U4
GND_P
+5V+12V_P
10R0603
R28
1 μF16V0603
C2
+5V
10k06031%
R35
7.5k06031%
R36
10k06031%
R37
+5V
Vpfc_sense10k06031%
R38
100 pF50V0603
C17
Drive_Enable
6.2k06031%
R34
3.73Vhysteresis = 2V
VSENSE = 0,06832 x VPFCVSENSE = 2,12V @ 31VVSENSE = 2.73V @ 40V
3.75V @ 55 VPFC
GND_P
Overvoltage ProtectionVENABLE = 24VVDISABLE = 55VThe comparator will disable gate driversas soon as the PFC Voltage hits 55V
GND_P
GND_P
GND_P
Drive Enable
5V
GND_P
GND2
VIN1 VOUT
3MCHP-10751 7805 Replacement
MOD11
1
22
33
44
55
66
HV9123
Isol
atio
n B
arrie
r 4kV
InOut Out
MCHP-10749 UWVR_5W_FlybackMOD2
0R1206
R29
GND_AGND_P
GND_A
GND_P
+12V_P
+VGnd STPS1150A
D4
GND_P
12
TERMINAL 1x2
J9
Low-Voltage Power Factor Correction Development Kit User’s Guide
A.2 LVPFC DEVELOPMENT BOARD PCB LAYOUT
The LVPFC Development Board is a two-layer FR4, 1.55 mm, Plated-Through-Hole (PTH) PCB construction with a copper thickness of 70 µm. Figure A-3 and Figure A-4 show the top and bottom assembly of the LVPFC Development Board.
FIGURE A-3: LOW-VOLTAGE POWER FACTOR CORRECTION DEVELOPMENT BOARD TOP ASSEMBLY
3 3
1
2
6
4
1
6
4
2
1
1
1
5
1 1
2 2
10 10
1
2
1
1
1
2
1
2
1
2
1
4
1
2
2
1
4 3
13
1
2
1
7
9
11
4
3
3
14
1
2
2
1
13
4
3
2
1
7
9
11
1
14
2
1
2
43
2
2 1
2
2
1
21
6
1
1
0
2 2
1
2
8
12
5 8
12
2 1
1 2
1
1
1
1 3
2
3
4
1
3
22
1
1
2
3
1
1
1
0
1
1
1
1
1
0
5
2
1
2
1 211
1
2
3
1
0
1
1
2
4
10
14
16
20
26
30
32
36
42
46
48
52
58
3
9
13
15
19
25
29
31
35
41
45
47
51
57
2
6
8
12
18
24
28
34
38
40
44
50
54
56
60
1
5
7
11
17
23
27
33
37
39
43
49
53
55
59
1
1
1
1
DS50002832A-page 26 2018 Microchip Technology Inc.
Board Layout and Schematics
FIGURE A-4: LOW-VOLTAGE POWER FACTOR CORRECTION DEVELOPMENT BOARD BOTTOM ASSEMBLY
33
1
2
6
4
1
6
4
2
1
1
1
5
11
22
1010
1
2
1
1
1
2
2
1
1
2
1
4
1
2
2
1
3 4
13
1
2
1
7
9
11
4
3
3
14
1
2
1
2
13
4
3
2
1
7
9
11
1
14
2
1
2
34
2
2
1 2
1
2
12
6
1
1
0
22
1
2
8
12
58
12
21
2 1
1
1
1
3 1
2
3
1
4
3
22
1
1
2
3
1
1
0
1
1
1
1
1
1
0
5
2
1
2
1112
2
1
3
0
1
1
1
2
1
1
3
2
2
2
1
2
1
2
1
2
2
1
1
1
2
1
1
1
11
32
1
1
2
1
1
2
11
2
1
3
2
1
7
2
6
3
21
1
8
1
6
3
5
4
1
2
2
2
1
2
1
2
22
2
1
2
2
2
2
2
2
21
1
1
1
2
2 2
12
2
2
2
2
2
2
3
12
2
1 2
2
2
1
2
21
1
2
1
2
2
1
1 1
85
14
1
1
7
2
2
1
1
2
1
2
1
12
12
1
2
2
12
1
45
2
1
21
1
12
12
1
1
1
2 1
1
12
1 2
1 3
12
2
1
1
2
2
2018 Microchip Technology Inc. DS50002832A-page 27
Lo
w-V
oltag
e Po
wer F
actor C
orrectio
n D
evelop
men
t Kit U
ser’s Gu
ide
DS
50
00
28
32
A-p
ag
e 2
8
20
18
Micro
chip
Te
chn
olo
gy In
c.
e 1-3).
Designed with
Altium.com
12V_S
VOUT = 11V...13V, 250 mA max
TP3
X = 0.8A = 400 mAX = 2.5A
ND
GND
GND
GND
1 μF16V
C916V100 μF
C7
GND
12V_IN
5.6k06031%
R4
TP11
ND
16V220 μF
C6
1 μH
L2
RED0805
LD1
REDRAD_1.8 mm
LD2
12
HDR-2.54 Male 1x2
J2
Loop ements only
A.3 AUXILIARY POWER SUPPLY MODULE SCHEMATICS
Figure A-5 shows the Auxiliary Power Supply module schematics (refer to Figur
FIGURE A-5: AUXILIARY POWER SUPPLY MODULE SCHEMATIC
PGND PGND
VINTP1
IRMS_MAX = 300 mAIPEAK_MAX = 380 mAPDCOND_MAX = 100 mW
D1:IRMS_MAIAV_MAXIPEAK_MA
PGND
GND G
GND
Isolation Barrier 4 kV
US1KD4
PGND
47 pF200V0805
C1
470R0805
R2
PGND
PGND
10kR23
BAT54HT1GD5
10R12061%
R5
FOD817A3SD
23
14
U3
VIN_MIN = 25VVIN_MAX = 450V
100 μHRadial
L1
1.5 μF450VP7.5L17.5W9.3H17.5
C2
16V100 μF
C12
8.66k06031%
R25
15k06031%
R29 TP13
TP6
TP10
TP8
G
TP2
PGND
100 pF50V0603
C23
12V_S
150R06031%
R9
4
1
5
8
2
3
*
*
*
063092-bTR1
VIN
1k06031%
R16PGND
220k0603
1%
R71 μF16V
C13
PGND
20k06031%
R18
VDD
4.3k06031%
R27
0.1 μF16V
C21
FMMT2222AQ2
MMBT2907AQ4
VDD
100R
R8
TP7
BAT54HT1GD10
18k06031%
R15
4.7 μF25V0805
C8
PGND
TP4
6.2k06031%
R13
PGND
VIN
1
SEN
SE4
OUTPUT 5
Vss
6V
DD
7
OSC
OU
T8
OSC
IN9
DIS
CH
RG
10
VR
EF11
SHD
WN
12
RES
ET13
COMP14
FB15
BIA
S16
HV9123U1
PGND
0.022 μF50V0603
C28
2200 pF300VY2
C10
562k06031%
R12
FSW = 130 kHzDCMAX = 85%PWMIN = 100 ns
22R1206
R1
MM3Z12VST1GD9
0R0603
R24
GND
10R06031%
R26
1000 pF50V0603
C22
12V_P
PGND
12V_P
TP9
TP14
GND
12V_P
TP12
10R06031%
R32
VDD
4.3k06031%
R33
Isolation Barrier 4 kV
VOUT = 12V @ 3 WMAX
DFLS1150-7
D1
DFLS1150-7
D2
100RR6
Us = 1V @ 400 mA
UREF = 4V
PGND
1000 pF250V0805
C41000 pF250V0805
C5
1000 pF50V0603
C17
27kP15L11.5D4.55%
R3
3.3R12061%
R193.3R12061%
R20
3.3 μF450VP3.5D8H13
C3
2
13
IPA60R950C6XKSA1Q3
12
HDR-2.54 Male 1x2J3
12
HDR-2.54 Male 1x2J4
VDD = 8V...11V
FSW 135 kHz
R26 formeasurpurpose
R32 for Loop measurementspurpose only
Board Layout and Schematics
A.4 AUXILIARY POWER SUPPLY MODULE PCB LAYOUT
The Auxiliary Power Supply module is a two-layer FR4, 1.55 mm, Plated-Through-Hole PCB construction. Figure A-6 and Figure A-7 show the top and bottom assembly of the Auxiliary Power Supply module.
FIGURE A-6: AUXILIARY POWER SUPPLY MODULE TOP ASSEMBLY
1
1
1
1
1
2
1
5
2
1
21
2
1
2
2
2
1
1
2
2 1
1
3
2
1
1
2
4
3
1
1
1
8
1
2
1
1
1
1
1
1
1
1
2
2
2018 Microchip Technology Inc. DS50002832A-page 29
Low-Voltage Power Factor Correction Development Kit User’s Guide
FIGURE A-7: AUXILIARY POWER SUPPLY MODULE BOTTOM ASSEMBLY
1
1
1
1
1
2
1
5
2
1
2 1
2
1
2
2
2
1
1
2
21
1
3
2
1
1
2
4
3
1
1
1
8
1
2
1
1
1
1
1
1
1
1
2
2
1
1
1
2
2
2
1
2
2
2
2
2
3
2
1
1
2
1
2
1
2
1
1
2
2
12
2
1
2
1
1
2
1
1
3
1
1
2
2
2
1
2
10
11
13
15
16
1
2
1
1
1
1
2
11
1
2
2
2
11
1
1
9
2
14
12
2
1
1
2
2
2
22
1
12
1 2
1 2
12
12 1
2 1
1
1
2
2
7
6
4
1 1
4
8
2
5
2
2
1
3
DS50002832A-page 30 2018 Microchip Technology Inc.
LOW-VOLTAGEPOWER FACTOR CORRECTION
DEVELOPMENT KIT USER’S GUIDE
Appendix B. Bill of Materials (BOM)
This appendix contains the Bill of Materials (BOMs) for the LVPFC Development Board and for the Auxiliary Power Supply module.
• Bill of Materials – LVPFC Development Board
• Bill of Materials – Auxiliary Power Supply Module
B.1 BILL OF MATERIALS – LVPFC DEVELOPMENT BOARD
Table B-1 shows the Bill of Materials for the LVPFC Development Board.
TABLE B-1: BILL OF MATERIALS (BOM) – LVPFC DEVELOPMENT BOARD
Qty Designator Description ManufacturerManufacturer Part
Number
4 AGND, TP1, TP2, TP4 Connector Test Point, Loop, Black, Through-Hole (TH)
Keystone Electronics Corp. 5011
5 C2, C6, C12, C13, C16 Capacitor, Ceramic, 0.1 µF, 16V, 10%, X7R, SMD, 0603
Taiyo Yuden Co., Ltd. EMK107B7105KA-T
1 C3 Capacitor, Film, 0.33 µF, 10%, 275 VAC, Radial
Wurth Elecktronic 890324025034CS
2 C4, C5 Capacitor, 1500 µF, 20%, 50V Wurth Elecktronic 860010680026
1 C7 Capacitor, Film, 0.68 µF, 10%, 310 VAC, Radial
Wurth Elecktronic 890334025045
2 C8, C9 Capacitor, Film, 0.47 µF, 10%, 310 VAC, Radial
Wurth Elecktronic 890334024005CS
2 C10, C11 Capacitor, Ceramic, 4700 pF, 300V, 20%, Radial, P7.5D8H11
Murata Electronics® DE2E3KY472MN3AU02F
1 C14 Capacitor, Ceramic, 0.022 µF, 500V, 10%, X7R, SMD, 1206
Johanson Dielectrics 501R18W223KV4E
2 C15, C25 Capacitor, Aluminum, 47 µF, 35V, 20%, Radial, P2D5H12.5
Wurth Elecktronic 860010572005
1 C17 Capacitor, Ceramic, 100 pF, 50V, 10%, X7R, SMD, 0603
Vishay Intertechnology, Inc. VJ0603Y101KXACW1BC
1 C19 Capacitor, Aluminum, 47 µF, 20%, 63V, Through-Hole
Wurth Elecktronic 860080774008
1 C20 Capacitor, Ceramic, 0.1 µF, 500V, 10%, X7R, SMD, 1210
KEMET C1210C104KCRACTU
2 C21, C22 Capacitor, Ceramic, 680 pF, 100V, X7R, 0805
Yageo Corporation CC0805KRX7R0BB681
2 C23, C24 Capacitor, Ceramic, 6800 pF, 50V, 10%, X7R, SMD, 0603
KEMET C0603C682K5RACTU
3 CH1, CH2, VAC Connector Test Point, Loop, Red, TH
Keystone Electronics Corp. 5010
2018 Microchip Technology Inc. DS50002832A-page 31
Low-Voltage Power Factor Correction Development Kit User’s Guide
8 CS1, CS2, PFC-PWM1, PFC-PWM2, Vac_in, Vpfc_sense, ZCD1, ZCD2
Misc., Test Point PC Mini,0.040", D, Yellow
Keystone Electronics Corp. 5004
7 D1, D8, D9, D10, D11, D13, D15
Diode, Rectifier, 1N4148, 1.25V, 150 mA, 100V, SOD-123
Micro Commercial Components
1N4148W-TP
2 D2, D3 Diode, Rectifier, ES3B, 900 mV, 3A, 100V, DO-214AB_SMC
Vishay Intertechnology, Inc. ES3B-E3/57T
1 D4 Diode, Schottky, STPS1150A, 790 mV, 1A, 150V, DO-214AC_SMA
STMicroelectronics STPS1150A
1 D5 Diode, Rectifier Bridge, 600V, 3A, TH, SIP-4
SMC Diode Solutions Co. LTD
KBP306GTB
2 D6, D7 Diode, Rectifier, US1J 1.7V, 1A, 600V, DO-214AC_SMA
Micro Commercial Components
US1J-TP
1 D12 Diode, Rectifier, RS3J, 1.3V, 3A, 600V, DO-214AB_SMC
Vishay Intertechnology, Inc. RS3J-E3/57T
2 D14, D16 Diode, Zener, BZX84-C3V3, 3.3V, 250 mW, SOT-23-3
NXP Semiconductors BZX84-C3V3,215
2 F1 Fuse Holder, 5 mm, TH Littelfuse® 01110501Z
1 F2 Fuse, Glass, 5A, 250 VAC, 5x20 mm
Littelfuse 0217005.HXP
1 J1 Connector, Terminal, 5 mm, 1x3, Female, 12-28AWG, 16A, TH, R/A
On-Shore Technology, Inc. OSTVI030152
2 J2, J3 Connector, Terminal, 5.08 mm, 1x2 Female, 12-28AWG, 16A, TH, R/A
On-Shore Technology, Inc. OSTVI022152
1 J4 Connector, Edge, MECF, 1.27 mm, 60P, Female, SMD, Vertical
Samtec, Inc. MECF-30-01-L-DV-WT
2 J8, J9 Connector, Terminal, 2.54 mm, 1x2, Female, 20-30AWG, 6A, TH, R/A
PHOENIX CONTACT 1725656
2 L1, L3 Inductor, Customized Part, 11.5A, T/H, PFC
Wurth Elecktronic 750316197
1 L2 Common-mode Choke, 2 mH, 10A, 2 LN, TH
Wurth Elecktronic 7448031002
1 L4 Inductor, Fixed, 4.7 µH, 6.5A, 12.5 mOhm, TH
Wurth Elecktronic 744750230047
1 MOV1 Varistor, MO, 420V, 45J, Disc, 10 mm
TDK Corporation S10K420
2 Q2, Q4 N-FET, IPP126N10N3G, 100V, 58A, 0.0123R, 94W, TO-220-3
Infineon Technologies AG IPP126N10N3GXKSA1
1 Q3 N-FET, 2N7002-7-F, 60V, 170 mA, 370 mW, SOT-23-3
Diodes Incorporated® 2N7002-7-F
2 R1, R10 Resistor, TKF, 1k, 1%, 1/10W, SMD, 0603
Panasonic® - ECG ERJ-3EKF1001V
TABLE B-1: BILL OF MATERIALS (BOM) – LVPFC DEVELOPMENT BOARD (CONTINUED)
Qty Designator Description ManufacturerManufacturer Part
Number
DS50002832A-page 32 2018 Microchip Technology Inc.
Bill of Materials (BOM)
2 R2, R9 Resistor, TKF, 15R, 1%, 1/4W, SMD, 1206
Panasonic® - ECG ERJ-8ENF15R0V
2 R4, R30 Resistor, TF, 2.20k, 1%, 1/8W, SMD, 0603
Vishay Intertechnology, Inc. MCT06030C2201FP500
8 R5, R6, R7, R11, R14, R15, R16, R21
Resistor, TKF, 10k, 1%, 1/4W, SMD, 1206
Vishay Intertechnology, Inc. CRCW120610K0FKEA
1 R8 Resistor, TKF, 51R, 1%, 1/10W, SMD, 0603
Yageo Corporation RC0603FR-0751RL
4 R12, R13, R22, R23 Resistor, TKF, 120R, 1%, 1/10W, SMD, 0603
Stackpole Electronics, Inc. RMCF0603FT120R
4 R17, R18, R24, R25 Resistor, TKF, 10R, 1%, 1/4W, SMD, 1206
Panasonic - ECG ERJ-8ENF10R0V
2 R19, R26 Resistor, TKF, 3.3k, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF3301V
4 R20, R35, R37, R38 Resistor, TKF, 10k, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF1002V
2 R27, R39 Resistor, TKF, 100R, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF1000V
4 R28, R31, R32, R33 Resistor, TKF, 10R, 1%, 1/10W, SMD, 0603
Stackpole Electronics, Inc. RMCF0603FT10R0
1 R29 Resistor, TKF, 0R, SMD, 1206 Panasonic - ECG ERJ-8GEY0R00V
1 R34 Resistor, TKF, 6.2k, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF6201V
1 R36 Resistor, TKF, 7.5k, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF7501V
1 RL1 Relay Power, SPST-NO, 5V, 10A, 250 VAC, TH
Omron Electronics LLC – EMC Division
G6C-1114P-US-DC5
2 SCR1, SCR2 Machine Screw Pan, Phillips, M3
B&F™ Fasteners Supply MPMS 003 0008 PH
2 T1, T2 Transformer, Current, 1:100, 1 MHz, 24A, TH
Coilcraft CS4100V-01L
1 TH1 Resistor, Thermistor, NTC, 10R, 3A, Radial
TDK Corporation B57235S100M54
2 WASHER1, WASHER2 Washer Flat, M3, Nylon Essentra Components MFW030A
1 MOD1 Microchip Module, MCHP-10751 7805, Replacement
Microchip Technology Inc. 04-10751
1 MOD2 Microchip Module, MCHP-10749, UWVR, 5W, Flyback
Microchip Technology Inc. 04-10749
2 U1, U2 Microchip Analog FET Driver, MCP14A0452-E/SN, SOIC-8
Microchip Technology Inc. MCP14A0452-E/SN
1 U3 Microchip Analog Temperature Sensor, -40C to +150°C, MCP9700T-E/TT, SOT-23-3
Microchip Technology Inc. MCP9700T-E/TT
1 U4 IC Comparator, Precision, 2-36V, SOT23-5
Microchip Technology Inc. MIC6270YM5-TR
TABLE B-1: BILL OF MATERIALS (BOM) – LVPFC DEVELOPMENT BOARD (CONTINUED)
Qty Designator Description ManufacturerManufacturer Part
Number
2018 Microchip Technology Inc. DS50002832A-page 33
Low-Voltage Power Factor Correction Development Kit User’s Guide
B.2 BILL OF MATERIALS – AUXILIARY POWER SUPPLY MODULE
Table B-2 shows the Bill of Materials for the Auxiliary Power Supply module.
TABLE B-2: BILL OF MATERIALS (BOM) – AUXILIARY POWER SUPPLY MODULE
Qty Designator Description ManufacturerManufacturer Part
Number
1 C1 Capacitor, Ceramic, 47 pF, 200V, 5%, C0G, NP0, SMD, 0805
KEMET C0805C470J2GACTU
1 C2 Capacitor, Film 1.5 µF, 450V, 5%, RAD, P7.5L17.5W9.3H17.5
Panasonic® - ECG ECW-FD2W155JB
1 C3 Capacitor, Aluminum, 3.3 µF, 450V, 20%, RAD_P3.5D8H13
Rubycon Corporation 450PK3R3MEFC8X11.5
2 C4, C5 Capacitor, Ceramic, 1000 pF, 250V, 10%, X7R, SMD, 0805
Murata Electronics® GRM21AR72E102KW01D
1 C6 Capacitor, Aluminum, 220 µF, 16V, 20%, 0.015R, RAD_P3.5D8H8
Wurth Elecktronic 870025374003
2 C7, C12 Capacitor, 100 µF, 20%, 16V Wurth Elecktronic 860010372006
1 C8 Capacitor, Ceramic, 4.7 µF, 25V, 20%, X5R, SMD, 0805
TDK Corporation C2012X5R1E475M125AB
2 C9, C13 Capacitor, Ceramic, 1 µF, 16V, 10%, X7R, SMD, 0603
Taiyo Yuden Co., Ltd. EMK107B7105KA-T
1 C10 Capacitor, Ceramic, 2200 pF, 300V, 20%, RAD_P7.5D8H11
Murata Electronics DE2E3KY222MN3AU02F
2 C17, C22 Capacitor, Ceramic, 1000 pF, 50V, 5%, C0G, SMD, 0603
AVX Corporation 06035A102JAT2A
1 C21 Capacitor, Ceramic, 0.1 µF, 16V, 10%, X7R, SMD, 0603
AVX Corporation 0603YC104KAT2A
1 C23 Capacitor, Ceramic, 100 pF, 50V, 5%, NP0, SMD, 0603
Cal-Chip Electronics Inc. GMC10CG101J50NTLF
1 C28 Capacitor, Ceramic, 0.022 µF, 50V, 5%, X7R, SMD, 0603
AVX Corporation 06035C223JAT2A
2 D1, D2 1.0A High-Voltage Schottky Barrier Rectifier
Diodes Incorporated® DFLS1150
1 D4 Diode, Rectifier, US1K, 1.7V, 1A, 800V, DO-214AC_SMA
Diodes Incorporated US1K-13
2 D5, D10 Diode, Schottky, BAT54HT1G, 30V, 200 mA, 40V, SOD-323
ON Semiconductor® BAT54HT1G
1 D9 Diode, Zener, 12V, 200 mW, SOD-323
ON Semiconductor MM3Z12VST1G
3 J2, J3, J4 Connector Header, 2.54 Male, 1x2, Gold, 6.75 mm, TH, R/A
Molex® 0901210762
1 L1 Inductor, Fixed, 100 µH, 900 mA, 190 mOhm
Wurth Elecktronic 744772101
1 L2 Inductor, Fixed, 1 µH, 2.7A, 47 mOhm, SMD
Wurth Elecktronic 74438335010
1 LD1 Diode, LED, Red, 2V, 20 mA, 104 mcd, Diffuse, SMD, 0805
OSRAM Opto Semiconductors GmbH.
LS R976-NR-1
1 LD2 Diode, LED, Red, 1.85V, 30 mA, 200 mcd, Diffuse, RAD, 1.8 mm
Kingbright Electronic Co., Ltd.
WP4060SRD
1 Q2 Transistor, BJT, NPN, FMMT2222A, 40V, 600 mA, 330 mW, SOT-23-3
Diodes Incorporated MMBT2222A-7-F
DS50002832A-page 34 2018 Microchip Technology Inc.
Bill of Materials (BOM)
1 Q3 Transistor, FET N-CH, IPA60R950C6XKSA1, 600V, 4.4A, 0.95R, 26W, TO-220-3
Infineon Technologies AG IPA60R950C6XKSA1
1 Q4 Transistor, BJT, PNP, MMBT2907A, 60V, 800 mA, 350 mW, SOT-23-3
ON Semiconductor® MMBT2907A
1 R1 Resistor, 22R, 1/4W, 1%, 1206, SMD Panasonic® - ECG ERJ-8ENF22R0V
1 R2 Resistor, TKF, 470R, 1%, 1/16W, SMD, 0805
Panasonic - ECG ERJ-6ENF4700V
1 R3 Resistor, MO, 27k, 5%, 1W, AX, P15L11.5D4.5
Yageo Corporation RSF100JB-73-27K
1 R4 Resistor, TKF, 5.6k, 1%, 1/10W, SMD, 0603
Yageo Corporation RC0603FR-075K6L
1 R5 Resistor, TKF, 10R, 1%, 1/4W, SMD, 1206
Panasonic - ECG ERJ-8ENF10R0V
2 R6, R8 Resistor, TKF, 100R, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF1000V
1 R7 Resistor, TKF, 220k, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF2203V
1 R9 Resistor, TKF, 150R, 1%, 1/10W, SMD, 0603
Stackpole Electronics, Inc. RMCF0603FT150R
1 R12 Resistor, TKF, 562k, 1%, 1/10W, SMD, 0603
Stackpole Electronics, Inc. RMCF0603FT562K
1 R13 Resistor, TKF, 6.2k, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF6201V
1 R15 Resistor, TKF, 18k, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF1802V
1 R16 Resistor, TKF, 1k, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF1001V
1 R18 Resistor, TKF, 20k, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF2002V
2 R19, R20 Resistor, TKF, 3.3R, 1%, 1/2W, SMD, 1206
Susumu Co., LTD. RL1632R-3R30-F
1 R23 Resistor, TKF, 10k, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF1002V
1 R24 Resistor, TKF, 0R, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3GSY0R00V
1 R25 Resistor, TKF, 8.66k, 1%, 1/10W, SMD, 0603
Yageo Corporation RC0603FR-078K66L
2 R26, R32 Resistor, TKF, 10R, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF10R0V
2 R27, R33 Resistor, TKF, 4.3k, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF4301V
1 R29 Resistor, TKF, 15k, 1%, 1/10W, SMD, 0603
Panasonic - ECG ERJ-3EKF1502V
1 TR1 Transformer, SMPS, Flyback 6:1:1, 20V-375V, 5.5W, TH
Kaschke Components GmbH
063092-a
1 U3 Optoisolator, FOD817A3SD, SMD-4 ON Semiconductor FOD817A3SD
1 U1 Microchip Analog, PWM Controller, 3 MHz, HV9123NG-G, SOIC-16
Microchip Technology Inc. HV9123NG-G
TABLE B-2: BILL OF MATERIALS (BOM) – AUXILIARY POWER SUPPLY MODULE (CONTINUED)
Qty Designator Description ManufacturerManufacturer Part
Number
2018 Microchip Technology Inc. DS50002832A-page 35
Low-Voltage Power Factor Correction Development Kit User’s Guide
NOTES:
DS50002832A-page 36 2018 Microchip Technology Inc.
LOW-VOLTAGEPOWER FACTOR CORRECTION
DEVELOPMENT KIT USER’S GUIDE
Appendix C. Example Algorithm
This appendix provides algorithm examples for the LVPFC Development Board.
Examples presented are:
• Interleaved PFC Boost Converter in Transition Mode
• Interleaved PFC Boost Converter in Continuous Conduction Mode
C.1 INTERLEAVED PFC BOOST CONVERTER IN TRANSITION MODE
Figure C-1 shows a standard representation of a high-level block diagram of the implementation of an algorithm example of the interleaved PFC boost converter control system working in Transition mode. The exact implementation is subject to change with alternative control schemes and algorithms, and will be documented in subsequent code examples.
Black building blocks represents hardware blocks, while blue building blocks represent software blocks.
Software blocks have the following functions:
• INT1:
- Calculates VIN average and VOUT average every half of AC cycle (for instance, 10 ms for 50 Hz, 8.33 ms for 60 Hz)
- Voltage compensator on VOUT average
• ADCAN0 Interrupt:
- Verifies VIN zero crossing
- Accumulates VIN and VOUT
- Stores current in IPH1
• IC1 Interrupt:
- Measures PWM1 period of time
- Calculates delay at which to trigger the PWM2 TON pulse and to set OC1
• OC1:
- Programmed to generate the trigger for the PWM2 TON pulse
• ADCAN2 Interrupt:
- Stores current in IPH2
- Filters temperature
Note: In order to maintain interleaved operation, the Slave phase must have the same switching frequency as the Master phase.
2018 Microchip Technology Inc. DS50002832A-page 37
Low-Voltage Power Factor Correction Development Kit User’s Guide
FIGURE C-1: INTERLEAVED PFC BOOST CONVERTER IN TRANSITION MODE
Legend: ADC: Analog-to-Digital ConverterCMP: ComparatorIC: Input Capture to measure the PWM period of frequencyPWM: Pulse-Width ModulatorZCD: Zero-Cross Detection
INT1
REF FB
ADCBUF3
ADCBUF1
ADCBUF0ADCAN0 Interrupt
PWM GENERATOR_1
IC1 Interrupt
OC1
ADCAN2 Interrupt
PWM TON
When VIN Zero Crossing, it Generates INT1 Interrupt
PWM1RA4_PWM1H Power Stage
Phase I
CMP1A
RA0_CMP1ACS1
DAC(3V)
CMP3A
ZCD1DAC
(0.3V)
ADC CORE_3AN3-RB0
BoostVOUTADC_TRIG Every
Other Cycle
IC1BUF
ADCBUF2
ADCBUF11
ADC CORE_1
ADC CORE_0
IC1
VAC_SENSE
AN1-RA1
CS1
CMP2A
Power StagePhase II
PWM2 RB13_PWM2H
ADC CORE_2
PWM GENERATOR_2
DAC(3V)
ADC SharedCore
CS2
Temperature AN11
Timer1 Interrupt Every 10 msec
Faultcheck()Faulthandler()
Scheduler Called Every 1 msec (Timer2)UART_RXUART_TXP Protocol 0001UART_TX Protocol 0000Converter State_Machine
CMP3_out
OC1_out – FLT1Current Reset
ADC_TRIG
CMP3_out
RA0_CMP1A
CMP1_outCurrent Limitfor Overcurrent
ProtectionCMP3_outUsed to Trigger Next
PWM1 Cycle
Current Limit forOvercurrent Protection
VOUT
DS50002832A-page 38 2018 Microchip Technology Inc.
Example Algorithm
C.2 INTERLEAVED PFC BOOST CONVERTER IN CONTINUOUS CONDUCTION MODE
Figure C-2 shows a standard representation of a high-level block diagram of the implementation of an algorithm example of the interleaved PFC boost converter control system working in Continuous Conduction mode. The exact implementation is subject to change with alternative control schemes and algorithms, and will be documented in subsequent code examples.
Black building blocks represent hardware blocks, while blue building blocks represent software blocks.
Software blocks have the following functions:
• ADCAN0 Interrupt:
- Calculates the current reference:
c2P2Z_compensator_out_V * ADCBUF1/VINAVG2
- Samples IPH1 and executes PH1 current loop
- Accumulates VIN and VOUT
- Verifies zero crossing on VIN
- Triggers INT1 if zero crossing is ‘True’
• ADCAN2 Interrupt:
- Samples IPH2 and executes PH2 current controller
• INT1: Interrupts every 10 msec (VIN zero crossing)
- Calculates VIN average and squares it (VINAVG2)
- Calculates VOUT average
- Runs voltage compensator on VOUT average that calculates the DC current reference for the current loops
Note: ADCBUF1 is proportional to the rectified input AC voltage. VINAVG2 is proportional to the square of the rectified average value of the input VAC voltage. The “c2P2Z_compensator_out” is the output of the voltage loop.
2018 Microchip Technology Inc. DS50002832A-page 39
Low-Voltage Power Factor Correction Development Kit User’s Guide
FIGURE C-2: INTERLEAVED PFC BOOST CONVERTER IN CONTINUOUS CONDUCTION MODE
CMP1A
CMP2A
Boost VOUT
VAC_SENSE
PWMGENERATOR_1
PWM I/OControl
DACMAX_CURRENT
PowerStage
Phase I
VOUT
CS1
ADC CORE_0
ADC CORE_3
ADC CORE_1
Duty Cycle
ADCAN0 Interrupt
PWMGENERATOR_2
Duty Cycle
PWM2 I/OControl
Current Limit for Overcurrent Protection
DACMAX_CURRENT
RA2_CMP2A
ADC CORE_2ADCBUF2
ADC Core 2 Triggered byPWM2 at TON/2
ADCAN2 Interrupt
INT1
RA0_CMP1A
Current Limit for Overcurrent Protection
RA4_PWM1H
AN3-RB0
AN3-RB0
AN1-RA1
ADCBUF0
ADCBUF3
ADCBUF1
Triggered by PWM1 at TON/2
ADC Cores 0, 1 and 3 Triggered byPWM1 at TON/2
RB13_PWM2H PowerStage
Phase II
CS2
c2P2Z_compensator_out_V
Scheduler Called Every 1 msec (Timer2)UART_RXUART_TX Protocol 0001UART_TX Protocol 0000Converter State_Machine
Timer1 Interrupt Every 10 msec
Faultcheck()Faulthandler()
Legend: ADC: Analog-to-Digital ConverterDAC: Digital-to-Analog ConverterCMP: ComparatorIC: Input Capture to measure the PWM period of frequencyPWM: Pulse-Width Modulator
DS50002832A-page 40 2018 Microchip Technology Inc.
LOW-VOLTAGEPOWER FACTOR CORRECTION
DEVELOPMENT KIT USER’S GUIDE
Appendix D. Optional Supporting Equipment
D.1 INTRODUCTION
This appendix provides information on the following equipment, which is recommended for use to improve the functionality of the LVPFC Development Kit:
• Isolation Transformer• Active Load 50W
D.2 ISOLATION TRANSFORMER
The Isolation Transformer 10:1 has the following features, as shown in Figure D-1 and Figure D-2.
FIGURE D-1: ISOLATION TRANSFORMER – FRONT PANEL
1. Illuminated mains power switch.2. Four 4 mm banana plugs (0 VAC, 12 VAC, 24 Vac, PE connections).
FIGURE D-2: ISOLATION TRANSFORMER – BACK PANEL
1. Slide switch for input voltage selection (120 VAC/230 VAC).2. Fuse socket.3. IEC plug for mains connection.
1 2
1 2 3
Note: The product number is ASC-70 and the manufacturer is ASCALAB d.o.o. (www.ascalab.com).
2018 Microchip Technology Inc. DS50002832A-page 41
Low-Voltage Power Factor Correction Development Kit User’s Guide
D.3 ACTIVE LOAD 50W
The Active Load has the following features, as shown in Figure D-3.
FIGURE D-3: ACTIVE LOAD 50W(1,2)
10
4
1
3 2
7 6 5
9 8
1
2
Front Back
Front Side Back Side
1. Display2. On/Off Push Button3. Pulse Push Button4. Preset Push Button5. I/P Push Button6. Coarse Potentiometer7. Fine Potentiometer8. UVLO Potentiometer9. Pulse Potentiometer10. Preset LED (green)
Pulse LED (yellow)On/Off LED (red)
1. 4 mm Banana Plugs(red for positive and blue for return line)
2. Plug for External 12 VDC Supply
Note 1: The ASC-50W device’s standard delivery includes an external AC/DC wall plug adapter. All various AC input plugs are included. Manufacturer: XP Power.Type: VER12US120-JA.
2: The product number is ASC-50W and the manufacturer is ASCALAB d.o.o. (www.ascalab.com).
DS50002832A-page 42 2018 Microchip Technology Inc.
Optional Supporting Equipment
NOTES:
2018 Microchip Technology Inc. DS50002832A-page 43
DS50002832A-page 44 2018 Microchip Technology Inc.
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