lts company profile
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Company Profile
Company Profile
COMPANY
PRESIDENT
FOUNDATION
ADDRESS
EMPLOYEE
SCALE
QUALITY MANAGEMENT SYSTEM
CERTIFICATION
LTS Co., Ltd. (Laser Total Solution)
Ph. D. Hongjin Park
2003. Feb. 14th
38-13, Ojeon-dong, Uiwang-si, Gyeonggi-do, Korea
214 (standard 2013. January. 7th)
Total 4,500㎡ (Factory 2,500㎡/ Office 2,000㎡
ISO 9001: 2008/ISO 14001:2004
Ventures, INNI-Biz, Main-Biz, CE Certified
Revenue : 63.3 billion (74.2%
growth)
- AMOLED Cell Sealing System
- LGP Laser Engraving System
- Solar-Cell Selective Emitter
Technology Available : Patent Application 52 cases
Has Laser Source Manufacturing Technology
R&D Center : 61 people
2
World Class 300 (Ministry of Knowledge Economy)
Organization
CEO
DISPLAY STRATEG Y
LED/BLU SEMICONDUCTO
R
N E W TECHNOL O G Y
MANAGEMENT
On the Fly T/F
COO
Software
Hardware
Mechanical Design
Optics Design
17%
12%
21%
15%
Customer Service
Management
Sales
20%
8%
7%
Doctor Master B.A. College TOTAL
10 14 142 48 214
3
‘13. 01. 07
R & D CENTER
Cutting T / F
Planning Marketin
g L a s e r Q .A.
T E A M S / W H / W SALES
Company History
Establishment Steps
(‘03∼’05)
Customer and Market
Application Discovery
- 2003. 02. LTS established
- 2003. 05. BLU Laser Engraver developed
- 2004. 07. UV Laser Dry Etcher developed : Touch Screen用
- 2005. 01. High Speed CMP Pad用 Laser Driller
Market Entry Steps
(‘06∼’07)
Reference Ensure Specialty
Products
- 2006. 02. PDP Glass用 Laser Driller
- 2006. 05. Laser Sealing System Developed : AMOLED用
- 2007. 06. Solar cell Edge Isolation
- 2007. 08. Relocated Office to Gyeonggi-do, Uiwang-si
Growth Steps
(‘08∼’09)
Business Capacity and
Growth Engine
- 2008. 03. Laser ITO Section Etching Machine
- 2008. 03. DSSC Scribing & Sealing System
- 2008. 06. Laser Ablation Layer System
- 2008. 07. Laser BLU Mold Pattering System
- 2008. 10. Laser Area Dry Etching System
- 2009. 02. Laser Polarizing Film Cutter
- 2009. 03. AMOLED In-Glass Marker(Galaxy S)
Stabilization Steps
(‘10∼’Present)
M/S and Expanding
New Business Areas
Prepared Based on
Global Business
- 2010. 02. Pico Second Laser Drilling
- 2010. 04. High Speed Laser Engraver (LGP用)
- 2010. 10. Ochang Ofiice produce LGP
- 2011. 03. Solar cell Laser Selective Emitter Doping System
- 2011. 06. Registered on KOSDAQ
- 2011. 09. 2ND Battery Foil Cutting & Welding System
- 2011. 10. OLED Lighting Laser Sealing System
- 2011. 12. Ceramic Laser Drilling / Full Cutting System
- 2012. 02. Jang Youngsil Prize
4
Flagship Product Configuration
Laser Cell Sealing M/C
Laser Repair M/C
Laser Cutting M/C LGP Engraving M/C
LGP Cutting M/C
LGP Laser Serration M/C
Selective Emitter Laser Doping M/C
Solar Cell Scribing M/C
Solar Cell Drilling M/C
AMOLED LED TV
Film Laser Cutter
Display Energy
Battery Foil Cutting
Lift-Off M/C
Flexible (Marking)
Battery Welding
Flexible M/C
Solar Cell Battery
5
Laser Frit Cell Sealing System for AM-OLED
AMOLED Sealing Process Equipment - SMD Exclusive Supply
- SMART Phone, Tablet PC for AMOLED Equipment Supply in Priority
- Exclusive Supply for S company AMOLED Sealing Equipment (in 2011)
S Company AMOLED M/S – More than 98%.
- Completed the Development of Large AMOLED (8.5G)
- Features
High Throughput
High Accuracy Stage
High Resolution
Fine Align Function
Frit
GLASS 접착제
Laser sealing
합착 및 Sealing Cutting
6
Laser OLED Thin Film Layer Isolation & In-Glass Marking Laser Cutting System For Glass (LCD, AMOLED)
Laser Cutting Edge Grinding
- Mass Production & Engineering Work : 3G ~ 8G AMOLED & TFT LCD. Solar Cell
- Pssible to the Tempered Glass (Max DOL 20um)
- Clean/Fine Images of the Cutting Edges (No Particle)
Laser OLED Thin Film Layer Isolation & In-Glass Marking
Laser Cutting System For Glass (LCD, AMOLED)
7
Laser Cutting System for Glass (Tempered Glass)
[Gorilla Tempered Galss Cutting (DOL 40um)]
[Straight Line] [Round Line] [Circle Line]
① ② ③
General Specification
- Laser : Picosecond Laser
- Cutting speed : min 200mm/sec (外形 ) - Chipping : ±50μm - Burr : ±50μm
Feature
- Mass Production & Engineering Work
: AMOLED. TFT LCD. Tempered Glass DOL 40um - Easy & Low Maintenance Cost - Eco_Friendly : Dry Process (no Particle)
8
Laser Lift-Off System for Flexible Display Excimer Laser Application
Flexible Display Laser Lift-Off (OLED,LCD, E-Paper)
Excimer Laser Application
Lift-Off by Laser Absorption
DPSS SHG Green Laser
LED Laser Lift-Off Laser Cutting of Wafer
Fine Control : Ultra Narrow Width
Lowest Thermal Damage
Dry Process / Edge Sintering
9
Laser Engraver of the LGP for LED TV
The World First Laser LGP Engraver for LED TV
Max 100” Inch
· LGP Laser Patterning for LED TV M/S 90% (in 2011)
- Supply of New Production Equipment in Companies Affiliate
S Company (150 Units)
- Production for the TV LGP To SONY and GA (in 2011 - 350K)
: Has Production Capacity
- Complete the LGP Development for Monitor (0.8T) and Lighting
- New Equipment Supply Related Display Company
: LGP Cutting System, Serration System Developing Supply
- Feature
Engraving speed : 4,000 mm/sec
High Brightness (Best Light Efficiency)
High Throughput & Performance
Flexibility : Variable Size
User Friendly & Editing Software
Easy & Low Maintenance Cost
Eco-Friendly : Dry Process (no Chemicals)
Multi Line
The World First Laser LGP Cutter for LED TV
Max 63” Inch
10
POL Film Laser Cutting System for LCD TV / Monitor
Narrow Bezel · L Company Bezel-Less Process Equipment
- Cutting POL Film accurately by Laser
- Released in LGD CES1212 (Bezel 1mm)
- Work size : Min7”~ Max 23”
- Work Process :
LD→ POL Pick Up → POL Stage Loading → Vision Align
→ Laser Cutting → Pickup /ULD
- Feature
High throughput
High Accuracy Stage
High Cutting Quality
(minimize the yellow band & burr)
Easy operation & maintenance
11
Laser ITO Patterning, Film Cutting and Ag paste Direct Patterning for Touch Screen Panel
Capacitive Touch Screen
Resistive Touch Screen
Laser Bonding System Laser Film Cutting System
The World First Area Laser Patterning for Touch Panel
12
Laser Repair System for AM-OLED Laser System for Dye Sensitized Solar Cells
Working Table
Coaxial Type Light
Laser SourceMotorized
Slit
Linear Motor
Lens
Granite Base
Vision
illuminationAttenuator
Main X, Y Table
Isolator System
- Cutting
- Firing
- Welding / Bonding
- Deposition
Glass Cutting TCO Isolation Hole Drilling Catalyst
Deposition Interconnect & 1st Seal Attachment
Hole Sealing
Residual Dye Removal
Dye Application Cohesion Tio2 Deposition
2nd Sealing Wire
Connection Electrolyte Injection
Sintering
TCO Isolation Hole Drilling
Laser Sintering Laser Frit Sealing
Laser Repair System for AM-OLED Laser System for Dye Sensitized Solar Cells
13
Laser System for CIGS Solar Cells
Inner Glass Marker
P1,P2,P3 Laser Scriber
Laser Edge Deletion
14
P2 (left) P3(right) Pico-second laser scribing
(Reference from Industrial Laser Solutions)
Pico-second laser (F = 0.72 J/cm2, v = 20 mm/s).
P1 Pico-second laser scribing
Laser Selective Emitter for Bulk Type Si Solar Cells
Damage Free
UPH World Record : Max 3,600!!
· Entry Japanese Solar Cell Market
- Exclusive supply to Japan K company,
Selective Emitter one of the Laser Doping process equipment.
Evaluation : Increase Solar cell efficiency
/ Saving investment costs
LTS Laser Doping M/C Available apply in Existing line
Solar Cell Efficiency 1% Synergy
3~4% overall equipment investment cost savings
15
Laser Tabbing Machine for Si Wafer Solar Cells Laser Edge Isolation System for Bulk Type Si Solar Cells
전극
LaserHead
LaserHead
Up/Down Jig
고정용 Pin
Work (Wafer)
Heater
Main X Axis Table
Working Table &
Clamping JigLaser #1
Laser #2Focusing Head #2
Fiber
Fiber
Focusing Head #1
Mono or Polycrystalline Silicon
Isolation Cut (Reduction of Recombination Losses)
Front Contact
n
Si (p)
Rear Side Contact
Laser Tabbing Machine
Laser Edge Isolation System
16
Rechargeable Battery Cutting System
Roll to Roll Type Roll to Cell Type
Roll to Roll System : Max speed 30m/min
Scanner speed : 1,000mm/s
Max Capability : 30매/min (300×300)
Roll to Cell System : Max speed 20m/min
Scanner speed : 1,000mm/s
Max Capability : 20매/min (350×350)
- Cell unit Loading of Electrode
Inspection 기능 추가 가능(Option)
2 Moving Stage 적용 시 Max 35매 생산가능
17
Rechargeable Battery Welding System
Multi-Cell Foil Welding
Pack (Between dissimilar metals Welding) Features : Welding between electrode parts and Tab
- Improve the internal resistance
- Improve the upper and lower bonding strength
Use Scanners : High Speed Welding Implementation
Spatter Protection : sealed Chamber + Suction
Inert Gas Blowing
Available 60 sheets electrode Tab welding
Important Component
- Laser : According to customer spec.
- Expression Jig Unit
- Isolated 2 Chamber
- 3 Axis Motion Unit
Related Patent Applications : 2 cases
Features : Between dissimilar metals Welding
(Anode-Cathode/ Cell- Busbar)
- Reduce contact electrical resistance
Improved heat issues
- Minimize Intermetallic Compound
Spatter Suction
Inert Gas Blowing
Use welding parts vision checker(Option)
3 Axis Motion Unit (z axis Focusing Unit)
Package Jig + Expression Jig
18
ETC Machine System
Laser Driller For the CMP Pad Dejunk System
Laser Deflasher
<60㎛>
Laser Marker
Fiber Laser Marker CO2 Laser Marker
19
High Power Green Laser
High Power DPSS Green 100w Laser
20
100W at 532nm 2% rms 240hours
Long term stability measurement
Specification GREEN 100 Watts
Wavelength 532 nm
Average Power 100 Watt
Repetition Rate 10 kHz
Polarization Linear
Beam Mode Multi-Mode
Beam Size 4.0 mm
Beam Divergence 4 mr
Pulse-to-Pulse Stability
5 %
Power Stability < 3 % @ 24 hrs
Controller Electrical Power
220/8A AC, Single Phase, 60 Hz
Chiller Electrical Power
220/11.4A AC, Single Phase, 60 Hz
Cooling Method Closed-Loop Water Cooling
Thank You !
21
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