manual de serviço tv lcd 22lh20r lg
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LCD TVSERVICE MANUAL
CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP91A
MODEL : 22LH20R 22LH20R-MA
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Internal Use Only
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION................................................................11
TROUBLE SHOOTING ............................................................................16
BLOCK DIAGRAM...................................................................................19
EXPLODED VIEW .................................................................................. 20
SVC. SHEET ...............................................................................................
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’sexposed METALLIC PARTS
Good Earth Groundsuch as WATER PIPE,CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Groundfor 1 second, Resistance must be less than 0.1*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
Ω
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 4 -
CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.
2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of itsassemblies.
4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.
7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the
unit under test.2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.
4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).
7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within therange or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 5 -
IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the soldermelts.
2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as
possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as
possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.3. Solder the connections.
CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).
1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 6 -
SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.
4. Electrical specification4.1 General Specification
1. Application rangeThis spec sheet is applied to LCD TV used LP91A chassis.
2. SpecificationEach part is tested as below without special appointment.
1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC2) Relative Humidity : 65±10%3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.4) Specification and performance of each parts are followed
each drawing and specif ication by part number inaccordance with BOM.
5) The receiver must be operated for about 5 minutes prior tothe adjustment.
3. Test method1) Performance: LGE TV test method followed 2) Demanded other specification
- Safety: CE, IEC specification- EMC : CE, IEC
No Item Specification Measurement Remark
1 Screen Size 22” wide Color Display Module Resolution: 1366*768
2 Aspect Ratio 16:9
3 LCD Module 22” TFT WXGA LCD
4 Operating Environment Temp.: 0 ~ 40 deg
Humidity : 0 ~ 80 %
5 Storage Environment Temp.: -20 ~ 60 deg
Humidity : 0~ 85 %
6 Input Voltage AC100-240V~, 50/60Hz
≤ 65 W 22” HD
7 LDC Module HD 626 x 373 x 44.1 with inverter
(Maker : LGD) 0.1405 x 0.4215
12 EEFL
Coating 3H
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
No. Item Min. Typ. Max. Unit Maker Remark
1. Luminance 280 350 cd/m2
(W/O PC mode)
2. VIew angle (R/L, U/D) 178 / 178 degree CR > 10
3. Color Coordinates White Wx Typ 0.285 Typ LGD 22”(HD)
Wy -0.03 0.293 +0.03 LC220WXE-TBA1
RED Xr 0.642
Yr 0.333
Green Xg 0.295
Yg 0.608
Blue Xb 0.147
Yb 0.063
4. Contrast ratio 700:1 1000:1 LGD 22”(HD)
5. Luminance Variation 1.3
- 7 - LGE Internal Use Only
5. Chroma& Brightness (Optical)5.1. LCD Module
the Color Coordinates check condition - 50cm from the surface, Full White Pattern- Picture mode Vivid
8. Component Video Input (Y, PB, PR)
NoSpecification
RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P
14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
- 8 - LGE Internal Use Only
NoSpecification
RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model
9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model
9. RGB 9.1 Analog PC, RGB- DTV –NOT SUPPORT
10. HDMI Input 10.1 PC –Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA)
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA
10.2 DTV Mode
NoSpecification
RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) Spec. out
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz but display.
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P
1) Gap between Front Frame /Back cover and Middle Cabinet2) Gap between Front Frame /Middle Cabinet
- 9 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
Top View
Back Cover
Front Frame
Middle Cabinet
"b
"b
Gap b between Front Frame (Back cover) and Middle Cabinet-> 0 † b † B (Side gap)
Gap a between Front Frame and Middle Cabine-> 0 † a † A (Side gap)
"b
"a
Gap a between Front Frame and Middle Cabine-> 0 † a † A (Left/ Right gap)
3) Gap between Back Cover and Side AV
Back ViewSide View
Side AV
Back Cover
Gap f between Back Cover and Side AV-> 0 † f † 1.0Gap g between Back Cover and Side AV-> 0 † g † 1.0
11. Mechical spec. No Item Min Typ Max Unit
1. C/ A + B/ C top gap 0.5 1 1.5 mm
2. C/ A + B/ C side gap 0.5 1 1.5 mm
3. C/ A + Deco Front gap( ONE SIDE). 0.8 1 1.2 mm
*Active area1. Active area of LCD PANEL is in bezel of cabinet2. Interval between active area and bezel
|A-B|< 2.0 mm ,|C-D|< 2.0 mmA:Interval between left of active area and bezelB:Interval between right of active area and bezelC:Interval between top of active area and bezelD:Interval between bottom of active area and beze
4)Gap between Back Cover and Side AV
- 10 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
Side View "h"
Control Braket
Back Cover
Gap h between Back Cover and Control Bracket-> 0 † h † 0.8
C
B
D
AActive Area
Bezel
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 11 -
ADJUSTMENT INSTRUCTION
1. Application RangeThis specification sheet is applied to all of the LCD TV,LP91A/B/C/D chassis.
2. Specification1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolationtransformer will help protect test instrument.
2) Adjustment must be done in the correct order.3) The adjustment must be performed in the circumstance of
25 ±5 °C of temperature and 65±10% of relative humidity ifthere is no specific designation.
4) The input voltage of the receiver must keep 100~220V,50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RFno signal.
3. Adjustment items3.1. PCB assembly adjustment items
(1) Download the MSTAR main software(IC800, Mstar ISP Utility)1) Using D/L Jig2) Using USB Memory Stick.
(2) ADC Calibration – RGB / Component(3) Input Tool-Option/Area option.(4) Check SW Version.
4. PCB assembly adjustment method4.1. Mstar Main S/W program download4.1.1. Using D/L Jig
(1) Preliminary steps1) Connect the download jig to D-sub(RGB) jack
(2) Download steps1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened2) Click the “Connect” button and confirm “Dialog Box”
3) Click the “Config.” button and Change speed I2C Speedsetting : 350Khz~400Khz
4) Read and write bin file.Click “(1)Read” tab, and then load downloadfile(XXXX.bin) by clicking “Read”.
- LH20/ LH30
1
Filexxx.bin
1
Filexxx.bin
5) Click “(2)Auto” tab and set as below6) Click “(3)Run”.7) After downloading, you can see the “(4)Pass” message.
4.1.2. Using the Memory Stick* USB download : Service Mode1) Insert the USB memory stick to the ISB port.2) Automatically detect the SW Version.
-> S/W download process is executed automatically.3) Show the message “Copy the file from the Memory”
4) After Finished the Download, Automatically DC Off -> On
5) Check The update SW Version.
4.2. Adjust tool/area option.Adjust tool/area option refer to the BOM.
4.3. Adjust tool/area option.Adjust tool/area option refer to the BOM.
4.4. EDID D/L methodRecommend that don’t connect HDMI and RGB(D-SUB) cablewhen downloading the EDID.If not possible, recommend that connect the MSPG equipment.There are two methods of downloading the edid data
4.4.1. 1st MethodEDID datas are automatically downloaded when adjusting theTool Option2.Automatically downloaded when pushing the enter key afteradjusting the tool option2.It takes about 2seconds.
4.4.2. 2nd Method* Caution :
Must be checked that the tool option is right or not. If tool option is wrong, hdmi edid data could not bedownloaded well.
1) Press the ADJ key2) Move to the EDID D/L and Press the right direction key(G)3) Press the right direction key(G) at Start.4) After about a few seconds, appear “OK”, then compele.
4.4.3. RS-232C command Method(1) Command : AE 00 10
* Caution Don’t connect HDMI and RGB(D-SUB) cable whendownloading the EDID.If the cables are connected, Downloading of edid could befailed.
- 12 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
1
Filexxx.bin
4.4.4. EDID data(1) HD MODEL
<Analog(RGB): 128bytes>
<HDMI 1 : 256Bytes>
<HDMI 2 : 256Bytes>
4.5. ADC Calibration4.5.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments- Remote controller for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process1) Change the Input to Component1 or 2 mode.2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.(MSPG-925F Model: 209 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is “0 0 0 0”.5) Select “0. ADC calibration : Component” by using D/E
(CH +/-) and press ENTER(A).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear
4.5.2. ADC Calibration - RGB (Using External pattern)(1) Required Equipments
- Remote controller for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process1) Change the Input to RGB mode..2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.(MSPG-925F Model: 60 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is “0 0 0 0”.5) Select “0. ADC calibration : RGB” by using D/E(CH +/-)
and press ENTER(A).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear
- 13 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
OK
OK
4.6. Input Tool-Option, Area Option.## TOOL Option, Area Option change and AC offBefore PCBA check, you have to change the Tool option,Area option and have to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)
4.6.1. Profile: Must be changed the option value because being differentwith some setting value depend on module maker, inch andmarket
4.6.2. Equipment : adjustment remote control.
4.6.3. Adjustment methodThe input methods are same as other chassis.(Use IN-STARTKey on the Adjust Remocon.)(If not changed the option, the input menu can differ themodel spec.)* Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value * Never push the IN-STOP KEY after completing the functioninspection.
4.7. Check SW Version(1) Method
1) Push In-star key on Adjust remote-controller.2) SW Version check
Check “SW VER : V3.xx” – LH20
5. White Balance adjstment5.1. Overview
(1) Purpose : Adjust the color temperature to reduce thedeviation of the module color temperature.
(2) Principle : To adjust the white balance without thesaturation, Fix the one of R/G/B gain to 192 (default data)and decrease the others.
(3) Adjustment mode : Three modes – Cool / Medium / Warm
5.2. Required Equipment(1) Remote controller for adjustment (2) Color Analyzer : CA100+ or CA-210 or same product -
LCD TV (ch:9)(should be used in the calibrated ch by CS-1000)
(3) Auto W/B adjustment instrument(only for Auto adjustment)
5.3. Connecting diagram of equipment formeasuring (For automatic adjustment)
* LP91A~D Support RS-232C & I2C DDC Communication-WhiteBalance Mode.
(1) Enter the adjustment mode of DDC- Set command delay time : 50ms- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-run pattern display)
(2) Release the DDC adjustment mode- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.- Need to transmit the aging off command to TV set after
finishing the adjustment.- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance)- Enter the white balance adjustment mode with aging
command (F3, 00, FF)* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
5.3. Adjustment of White Balance (for Manualadjustment)
(1) Color analyzer(CA100+, CA210) should be used in thecalibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the followingsequence.1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)
2) Push “Exit” key.3) Change to the AV mode by remote control.4) Input external pattern (85% white pattern)5) Push the ADJ key -> Enter “0000” (Password)6) Select “3. W/B ADJUST”7) Enter the W/B ADJUST Mode8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) usingD/E(CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.10) Adjust three modes all (Cool / Medium / Warm) : Fix
the one of R/G/B gain and change the others11) When adjustment is completed, Enter “COPY ALL”.12) Exit adjustment mode using EXIT key on R/C.
- 14 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
* CASEFirst adjust the coordinate far away from the target value(x, y).1. x, y > target
i) Decrease the R, G. 2. x, y < target
i) First decrease the B gain, ii) Decrease the one of the others.
3. x > target, y < targeti) First decrease B, so make y a little more than the target.ii) Adjust x value by decreasing the R
4. x < target, y > targeti) First decrease B, so make x a little more than the target.ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using theCA100+ or CA210 equipment
To check the Coordinates of White Balance, you have tomeasure at the below conditions.Picture Mode : User 1Dynamic Contrast : OffDynamic Colour : Off(If you miss the upper condition, the coordinates of W/Bcan be lower than the spec.)
- 15 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
Coordinate Mode
x y Temp uv∆
Cool 0.285 ± 0.002 0.293 ± 0.002 9300K 0.000
Medium 0.295 ± 0.002 0.305 ± 0.002 8000K 0.000
Warm 0.313 ± 0.002 0.329 ± 0.002 6500K 0.000
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 16 -
TROUBLESHOOTING
No power(LED indicator off)
Check 24V, 12V, 5,2V of Power B/D
Check short of Main B/D or Change Power B/D
Pass
Check Output of IC1001, IC1003, IC1007
Check P307 Connector
Change LED Assy
: [A] PROCESS
Fail
Fail
Pass
Pass
Check LED Assy
Change IC1002,, Q1003
Pass
Check short of IC1001,IC1003, IC1007
Fail
Re-soldering or Change defectpart of IC1001, IC1003, IC1007
Fail
No Raster [B]: Process
Check LED statusOn Display Unit
Repeat A PROCESS
Pass
Fail
Check Output of IC802 Change IC802Fail
Change Inverter ConnectorOr InverterFail
Pass
Fail
Pass
Change ModuleFail
Check LVDS Cable
Pass
Check Panel Link Cable Or Module
Change Panel Link CableOr Module
Check Inverter ConnectorOr Inverter
Pass
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 17 -
No Raster on PC Signal
Check Input source Cableand Jack
Pass
Re-soldering or Change the defect part
Pass
Check the Input/OutputOf IC100 Fail
Re-soldering or Change the defect part,Check RGB EDID Data
Repeat [A], & [B] Process
Pass
Check the Input/OutputOf J104 Fail
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Pass
No Raster on COMMPONENT Signal
Check Input source Cable And Jack
Pass
Re-soldering or Change the defect part
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
Check The Input/OutputOf JK101 Fail
Pass
No Raster on HDMI Signal
Check Input source Cable And Jack
Pass
Check the Input/OutputOf JK301, JK302, JK303 Fail
Re-soldering or Change the defect part
Pass
Pass
Check the Input/OutputOf IC300, IC301, JK302 Fail
Re-soldering or Change the defect partCheck HDMI EDID Data
Re-download HDCP
Pass
Pass
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 18 -
No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal
Check Input source Cable And Jack
Pass
Check Input source Cable And Jack
Pass
Check The Input/OutputOf JK101, JK201
Pass
Re-soldering or Change the defect part
Pass
Fail
Pass
Repeat [A], & [B] Process
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Pass
Check The Input/OutputOf TU500
Pass
Re-soldering or Change the defect part
Pass
Fail
Check the Input/OutputOf IC800 Fail
Re-soldering or Change the defect part
Repeat [A], & [B] Process
No Sound
Check The Input Sourse.
Check The Input/OutputOf IC600.
Re-soldering or Change the defect part.Fail
Pass
Pass
Check The Speaker. Change Speaker.Fail
Check The Speaker Wire.
Pass
Change The Source Input.Fail
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 19 -
BLOCK DIAGRAM
RG
B_P
C
PC
_Au
dio
TV
(RF
)
CO
MP
1
HD
MI1
HD
MI2
RS
23
2
TX
23
2C
Dri
ver
ST
32
32
CT
x/R
x :
1
5V
pp
PC
_R/G
/B/H
S/V
S
PC
_Au
dio
_L/R
:70
0m
Vrm
s
MN
T_O
UT
: 1
Vp
p
SID
E_V
:1
Vp
p
SID
E_L
/SID
E_R
:50
0m
Vrm
s
DD
R2
(51
2M
B)
L_S
PK
_OU
T
R_S
PK
_OU
T
EE
PR
OM
24
C0
2
Co
mp
1_L
/R :5
00
mV
rms
TU
NE
R
AV
1_V
IN:
1V
pp
AV
11
_LIN
/RIN
:50
0m
Vrm
s
PW
MN
TP
31
00
L
MN
T_O
UT
MN
T_L
OU
T/R
OU
T: 5
00
mV
rms
AV
2(S
ide
AV
)
MA
IN S
CA
LE
R
TX
D /
RX
D :
5V
Dig
ita
l
CO
MP
1_Y
/Pb
/Pr: 1
/0.7
Vp
p
CO
MP
2_Y
/Pb
/Pr: 1
/0.7
Vp
p
IR HD
MI_
DA
TA
_1H
DM
I_D
AT
A_2
HD
MI1
_SC
L/S
DA
OU
T_E
_TX
_CL
K
OU
T_E
_TX
_EO
UT
_E_T
X_D
OU
T_E
_TX
_CO
UT
_E_T
X_B
OU
T_E
_TX
_AT
U_M
AIN
S I
F
CO
MP
1_Y
/Pb
/Pr
1/0
.7V
pp
AV
1_V
IN
PC
_Au
dio
_L/R
CO
MP
1_L
IN/R
IN
L_C
HR
_CH
LVDSconnector
TU
_MA
INS
UB
_SC
LS
DA
EE
PR
OM
24
C0
2
EE
PR
OM
24
C0
2
SIF
AV
1_L
IN/R
IN
MN
T_L
/R O
UT
AV
1
MN
T_O
UT
Co
mp
2_L
/R :5
00
mV
rms
CO
MP
2_Y
/Pb
/:
1/0
.7V
pp
CO
MP
2_L
IN/R
IN
CO
MP
2
OU
T_O
_TX
_CL
K
OU
T_O
_TX
_EO
UT
_O_T
X_D
OU
T_O
_TX
_CO
UT
_O_T
X_B
OU
T_O
_TX
_A
PC
_R/G
/B/H
S/V
S
HD
M2
_SC
L/S
DA
PC
_SC
L/S
DA
MN
T_V
OU
T
AV
2_V
IN
AV
2_L
IN/R
IN
IIS
_OU
T
US
B
US
B_D
N/P
N
AU
DIO
AM
P
HD
MI3
_SC
L/S
DA
EE
PR
OM
24
C0
2H
DM
I_D
AT
A_3
TM
DS
TM
DS
TM
DS
HD
MI3
US
BF
or
D/L
EE
PR
OM
(25
6K
)
Se
ria
l Fla
sh
(8M
Byt
e)
RG
B_P
C
PC
_Au
dio
TV
(RF
)
CO
MP
1
HD
MI1
HD
MI2
RS
23
2
TX
23
2C
Dri
ver
ST
32
32
C
–
PC
_R/G
/B/H
S/V
S
PC
_Au
dio
_L/R
:70
0m
Vrm
s
MN
T_O
UT
: 1
Vp
p
SID
E_V
:1
Vp
p
SID
E_L
/SID
E_R
:50
0m
Vrm
s
DD
R2
(51
2M
B)
EE
PR
OM
24
C0
2
Co
mp
1_L
/R :5
00
mV
rms
TU
NE
R
AV
1_V
IN:
1V
pp
AV
11
_LIN
/RIN
:50
0m
Vrm
s
PW
MN
TP
31
00
L
MN
T_O
UT
MN
T_L
OU
T/R
OU
T: 5
00
mV
rms
AV
2(S
ide
AV
)
MA
IN S
CA
LE
R
TX
D /
RX
D :
5V
Dig
ita
l
CO
MP
1_Y
/Pb
/Pr: 1
/0.7
Vp
p
CO
MP
2_Y
/Pb
/Pr: 1
/0.7
Vp
p
HD
MI_
DA
TA
_1H
DM
I_D
AT
A_2
_
OU
T_E
_TX
_CL
K–
OU
T_E
_TX
_–
OU
T_E
_TX
_–
OU
T_E
_TX
_C–
OU
T_E
_TX
_B–
OU
T_E
_TX
_A–
TU
_MA
IN
S I
F
CO
MP
1_Y
/Pb
/P:
1/0
.7V
pp
AV
1_V
IN
PC
_Au
dio
_L/R
CO
MP
1_L
IN/R
IN
L_C
HR
_CH
LVDSconnector
TU
_MA
IN/
EE
PR
OM
24
C0
2
EE
PR
OM
24
C0
2
SIF
AV
1_L
IN/R
IN
MN
T_L
/R O
UT
AV
1
MN
T_O
UT
Co
mp
2_L
/R :5
00
mV
rms
CO
MP
2_Y
/Pb
/Pr
1/0
.7V
pp
CO
MP
2_L
IN/R
IN
CO
MP
2
OU
T_O
_TX
_C–
OU
T_O
_TX
_E–
OU
T_O
_TX
_D–
OU
T_O
_TX
_C–
OU
T_O
_TX
_B–
OU
T_O
_TX
_A–
PC
_R/G
/B/H
S/V
S
PC
_SC
L/S
DA
PC
_SC
L/S
DA
MN
T_V
OU
T
AV
2_V
IN
AV
2_L
IN/R
IN
IIS
_OU
T
US
B
US
B_D
N/P
N
AU
DIO
AM
P
HD
MI3
_SC
L/S
DA
HD
MI3
_SC
L/S
DA
EE
PR
OM
24
C0
2H
DM
I_D
AT
A_3
TM
DS
TM
DS
TM
DS
HD
MI3
US
BF
or
D/L
EE
PR
OM
(25
6K
)
Se
ria
l Fla
sh
(8M
Byt
e)
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only- 20 -
300
500
200
530
540
910
900
800
AC
1
400
510
121
120
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
A2
LV1
A10
MUL
TI_P
W_S
W
10R
859
56AR812
SUB_
SDA
HPD_MST_3
+1.8
V_DD
R
COM
P2_P
B
RT1
C39
04-T
112
Q80
2E
BC
DDR2
_DQM
0
100 R825
0.04
7uF
C82
8
KEY1
RL_ON
MX2
5L64
05DM
I-12G
IC80
2
3NC
_1
2VC
C
4NC
_2
1HO
LD
6NC
_4
5NC
_3
7CS
8SO
/SIO
19
WP/
ACC
10GN
D
11NC
_5
12NC
_6
13NC
_7
14NC
_8
15S
I.S
IO016
SCLK
0.01
uFC
864
0.1uF C882
I2S_SCK
TMDS
2_RX
2-0.
1uF
C83
3
I2S_MCLK
USB_DN
100
R88
2
MAI
N_SI
F
PC_G
100 R8024
33R
844
10 R801HDMI3_SIDE
0.04
7uF
C83
0
PANEL_STATUS
TMDS
2_RX
0+
MNT
_VOU
T_T
TMDS3_RX0+
0.1u
FC
842
SW_R
ESET
RXD
0.01
uFC
858
TMDS
2_RX
2+
+3.3
V_M
ULTI
_MST
0.1uF C81312MHzX801
10R
874
1MR839
4.7u
FC
812
RL_O
N
M_SDA
DDC_SDA3
+3.3
V_M
ULTI
_MST
+3.3
V_M
ST
MUT
E_LIN
E
EEP_
SCL
E-DIM
SIDE
_RIN
10R
862
56AR80
5 DDR2
_DQM
1
10 R848HDMI3_SIDE
EEP_SCL
CEC_C
10
uF
C8
66
0.01
uFC
860
47R
834
56AR813
TMDS3_RX1+
SYS_RESET
SPI_CZ
I2S_SDO
0.1u
FC
815
22K
R84
2TMDS
2_RX
C+
DDC_SCL1
0.04
7uF
C83
7
POWER_SW
47R
832
TMDS
2_RX
C-
+5VS
T_M
ST
0.1u
FC
848
56AR81
0
10 R841HDMI3_SIDE
0.1u
FC
838
+1.2
V_VD
DC_M
ST
+3.3
V_M
ULTI
_MST
JTP-
1127
WEM
SW80
0
1
2 4
3
MNT_
L_AM
P
0.1
uF
C8
11
MNT
_VOU
T
DDR2_CASZ
PANE
L_ON
1000
pFC
835
0.1u
FC
849
PC_B
TMDS3_RX2+
+3.3
V_M
ULTI
_MST
0.04
7uF
C82
9
DDC_SCL3
DDR2_BA1
DISP
_EN/
VAVS
_ON
DDR2_RASZ
DD
R2_
D[0
-15]
TMDS3_RX0-
10R
854
COM
P2_Y
33AR818
0.04
7uF
C83
2
PC_AUD_L
PC_VS
CVBS_LIN
SPI_
DI
402
R80
7 READ
Y
0.1uF C883
DDR2_BA0
EEP_
SCL
10 R820HDMI3_SIDE
0.01
uFC
859
+3.3
V_M
ULTI
_MST
DDR2
_DQS
0M
SIDE
_LIN
SIDE
_V
0.04
7uF
C83
1
0.01
uFC
803
TMDS
2_RX
1+
+1.8
V_DD
R
DDC_SDA1
SUB_
SCL
DSUB_SDA
10R
890
100
R88
1
CAT2
4WC0
8W-T
IC80
3
3A
2
2A
1
4V
SS
1A
0
5S
DA
6S
CL
7W
P
8V
CC
DDR2_CKE
+12V
_AUD
IO
SPI_CLK
+3.3
V_M
ULTI
_MST
DDR2
_DQS
1M
0.01
uFC
807
KDS1
81D
803
USB_DP
+3.3
V_M
ST
100 R8025
+3.3
V_M
ULTI
_MST
56AR80
9
I-DIM
SPI_
CZ
0.1uF C808
0.1u
FC
804
56 R852
IR
0.01
uFC
841
EEP_SDA
DD
R2_
A[0-
12]
+3.3
V_M
ULTI
_MST
10 R822HDMI3_SIDE
CVBS
_VIN
10R
851
DDR2
_DQS
1P
10 R823HDMI3_SIDE
TMDS3_RXC-
MNT_
VOUT
_T
TMDS
2_RX
0-
+3.3
V_M
ULTI
_MST
DDR2
_DQS
0P
10 R821HDMI3_SIDE
10R
869
47R
837
DDR2
_MCL
KZ
DDR2_WEZ
TXD
56AR80
6
0.04
7uF
C83
4
EEP_
SDA
TMDS
1_RX
C+
24LC
256-
I/SM
IC80
1
3A
2
2A
1
4V
SS
1A
0
5S
DA
6S
CL
7W
P
8V
CC
COMP2_R
M_SCL
+3.3
V_M
ULTI
_MST
PC_HS
TMDS
1_RX
2-
0.01
uFC
850
+3.3
V_M
ULTI
_MST
TMDS3_RXC+47
uF25
VC
870
+3.3
V_M
ULTI
_MST
470
R83
5
10R
891
KDS1
81D
802
TV_M
AIN
1000pF C818
COM
P2_P
R
RT1
C39
04-T
112
Q80
4N
ON
19
_2
2"
EB
C
0.1
uF
C8
67
22K
R84
5
100 R8026
TMDS3_RX1-
P_24
V_SM
ALL_
15V
0.01uF C840
2.2u
FC
861
HPD_
MST
_1
10R
873
10R
880
SPI_
DO
PC_AUD_R
0.01
uFC
810
56AR814
+1.2
V_VD
DC_M
ST
100 R8023
TMDS
2_RX
1-
DDC_SCL2
10R
858
10R
892
TMDS
1_RX
1+
10R
871
TMDS
1_RX
2+
EEP_
SDA
56AR800
10 R805HDMI3_SIDE
KDS1
81D
801
DDR2_ODT
TMDS
1_RX
C-
SPI_DI
I2S_WS
DDR2
_MCL
K
0.04
7uF
C82
6
TMDS
1_RX
0-
10R
872
MNT_
R_AM
P
10R
879
HPD_
MST
_2
0.1u
FC
853
0.01
uFC
839
DSUB_SCL
0.01
uFC
865
COMP2_L
10uF16V C809
+1.8
V_DD
R
0.01
uFC
862
+1.2
V_VD
DC_M
ST
TMDS
1_RX
1-
4.7uF C820100 R824
100 R829
KEY2
56AR815
TMDS
1_RX
0+
0.01
uFC
857
CVBS_RIN
2.2u
FC
856
0.1u
FC
869
+5VS
T_M
ST
0.1u
FC
814
PC_R
SPI_
CLK
33R
843
0.1uF C844
10R
856
TMDS3_RX2-
0.01uF C876
DDC_SDA2
SPI_DO
P_12
V_SM
ALL_
15V
+5VS
T_M
STPO
WER
_DET
POWER_DET
RT
1C
39
04
-T1
12
Q8
03
E
B
C
+5VS
T_M
ST
SYS_
RESE
T
100 R8012
0.01
uFC
877
0.01
uFC
878
0.01
uFC
879
TXDRXD
0.1uF C863
ISA1
530A
C1
Q80
0
EB
C
ISA1
530A
C1
Q80
1
EB
C
2.2
uF
16V
C8
00
0R
EA
DY
+3.3
V_M
ULTI
_MST
0 R806
0 R870
S_VI
DEO_
DET
SIDE
_YSI
DE_C
DDC_
WP
OPC_
EN
4.7K
R87
7
4.7K
R80
044.
7KR
817
470
R80
9
47
R8
04
1
220
R80
8
68R81
0
0R80
0RE
ADY
0R80
01
390
R84
0
47R
814
47R
816
47R
818
47R
838
47R
833
47R
836
470
R80
3
47R
804
47R
815
47R
897
47R
802
47R
831
47R
857
47R
830
47R
875
47R
876
100
R84
610
0R
847
100 R8039HDMI3_SIDE
100 R8040HDMI3_SIDE
4.7K
R86
3
4.7K
R86
4
10
0R
80
42
1K
R8
03
8
1K
R8
01
8
4.7K
R86
54.
7KR
866
1K R867 1K R868
100R8021100R8022
100 R850
100 R849100 R895
0READY
R80170
READYR8016
0 R8033READY
0 R80340 R8035
10K
R8
02
0
10K
R80
03
0.04
7uF
C80
00.
047u
FC
801
0.04
7uF
C82
7
0.04
7uF
C82
50.
047u
FC
847
0.04
7uF
C84
5
0.04
7uF
C84
3
0.04
7uF
C83
6
0.1u
FC
868
1000
pFC
846
1KR88
4RE
ADY
1KR88
9
1KR81
1RE
ADY
1KR88
3
4.7K
R80
284.
7KR
8027
22R
812
22R
813
0.1u
FC
819
0.1u
FC
806
0.1u
FC
805
4.7K
Non_
Smal
l_FH
D
R80
10-*
2 4.7K
Smal
l_FH
D
R80
10-*
1
4.7K
Smal
l_H
DR
896
4.7K
Apo
llo
R80
10-*
3
4.7K
Smal
l_FH
D
R89
6-*1
4.7K
Non
_Sm
all_
HD
R80
11-*
1
4.7K
Non
_Sm
all_
HD
R89
6-*2
4.7K
Apo
llo
R80
11-*
24.
7KA
pollo
R89
8-*14.
7KNo
n_Sm
all_
FHD
R89
8
4.7K
100H
z
R80
11-*
34.
7K10
0Hz
R89
8-*2
4.7K
R80
11
Smal
l_FH
D
4.7K
R80
10
Smal
l_H
D
22R
8005
22R
8006
0 R8260 R827
4.7
uF
10V
C8
71
RE
AD
Y
12
0-o
hm
L8
00
120-ohm
L801
12
0-o
hm
L8
02
2.2uF C8232.2uF C824
2.2uF C821
2.2uF C873
2.2uF C822
2.2uF C874
2.2uF C802
2.2uF C875
MST
99A8
8ML(
MAT
RIX
BASI
C)
IC80
0
1RX
BCKN
2RX
BCKP
3RX
B0N
4RX
B0P
5HO
TPLU
GB6
RXB1
N7
RXB1
P8
AVDD
_33_
19
RXB2
N10
RXB2
P11
RXAC
KN12
RXAC
KP13
RXA0
N14
RXA0
P15
AVDD
_33_
216
RXA1
N17
RXA1
P18
GND_
119
RXA2
N20
RXA2
P21
HOTP
LUGA
22RE
XT23
VCLA
MP24
REFP
25RE
FM26
BIN1
P27
SOG
IN1
28G
IN1P
29RI
N1P
30BI
NM31
BIN0
P32
GINM
33G
IN0P
34SO
GIN
035
RINM
36RI
N0P
37AV
DD_3
3_3
38GN
D_2
39BI
N2P
40G
IN2P
41SO
GIN
242
RIN2
P43
CVBS
644
CVBS
545
CVBS
446
CVBS
347
CVBS
248
CVBS
149
VCOM
150
CVBS
051
VCOM
052
AVDD
_33_
453
CVBS
OUT
54GN
D_3
55SI
F0P
56SI
F0M
57VD
DC_1
58AU
L559
AUR5
60AU
VRM
61AU
OUTL
262
AUOU
TR2
63AU
OUTL
164
AUOU
TR1 65AUL0
66AUR067AUL168AUR169AUL270AUR271AUL372AUR373AUCOM74AUL475AUR476GND_477AUVRP78AUVAG79AVDD_AU80GND_581VDDC_282DDCA_CK83DDCA_DA84DDCDA_CK85DDCDA_DA86DDCDB_CK87DDCDB_DA88GPIO2089VDDP_190VDDC_391UART2_RX92UART2_TX93DDCDC_CK94RXCCKN95RXCCKP96DDCDC_DA97RXC0N98RXC0P99GND_6100RXC1N101RXC1P102AVDD_DM103RXC2N104RXC2P105HOTPLUGC106USB1_DM107USB1_DP108SCK109SDI110SDO111SCZ112PWM0113PWM1114PWM2115PWM3116LVA4P117LVA4M118LVA3P119LVA3M120LVACKP121LVACKM122LVA2P123LVA2M124LVA1P125LVA1M126LVA0P127LVA0M128VDDP_2
129
LVB4
P13
0LV
B4M
131
LVB3
P13
2LV
B3M
133
LVBC
KP13
4LV
BCKM
135
LVB2
P13
6LV
B2M
137
LVB1
P13
8LV
B1M
139
LVB0
P14
0LV
B0M
141
AVDD
_LPL
L14
2GN
D_7
143
VDDC
_414
4G
PIO
150/
I2C_
OUT
_MUT
E14
5G
PIO
151/
I2C_
OUT
_SD2
146
GPI
O15
2/I2
C_O
UT_S
D314
7GN
D_8
148
GPI
O51
149
GPI
O52
150
GPI
O53
151
GPI
O54
152
GPI
O55
153
GPI
O56
154
GPI
O57
155
GPI
O58
156
VDDP
_315
7VD
DC_5
158
B_M
DATA
[4]15
9B_
MDA
TA[3]
160
GND_
916
1B_
MDA
TA[1]
162
B_M
DATA
[6]16
3AV
DD_D
DR_1
164
B_M
DATA
[11]
165
B_M
DATA
[12]
166
GND_
1016
7B_
MDA
TA[9]
168
B_M
DATA
[14]
169
AVDD
_DDR
_217
0B_
DDR2
_DQM
[1]17
1B_
DDR2
_DQM
[0]17
2GN
D_11
173
B_DD
R2_D
QS[
0]17
4B_
DDR2
_DQ
SB[0
]17
5AV
DD_D
DR_3
176
VDDP
_417
7GN
D_12
178
B_DD
R2_D
QS[
1]17
9B_
DDR2
_DQ
SB[1
]18
0AV
DD_D
DR_4
181
B_M
DATA
[15]
182
B_M
DATA
[8]18
3GN
D_13
184
B_M
DATA
[10]
185
B_M
DATA
[13]
186
AVDD
_DDR
_518
7B_
MDA
TA[7]
188
B_M
DATA
[0]18
9B_
MDA
TA[2]
190
B_M
DATA
[5]19
1B_
MCLK
192
B_MC
LKZ
193 GND_14194 AVDD_MEMPLL195 MVREF196 A_ODT197 A_RASZ198 A_CASZ199 A_MADR[0]200 A_MADR[2]201 A_MADR[4]202 GND_15203 A_MADR[6]204 A_MADR[8]205 A_MADR[11]206 A_WEZ207 A_BADR[1]208 A_BADR[0]209 A_MADR[1]210 A_MADR[10]211 AVDD_DDR_6212 A_MADR[5]213 A_MADR[9]214 A_MADR[12]215 A_MADR[7]216 A_MADR[3]217 A_MCLKE218 VDDC_6219 I2S_IN_WS/GPIO67220 I2S_IN_BCK/GPIO68221 I2S_IN_SD222 I2S_OUT_MCK223 I2S_OUT_WS224 VDDP_5225 GND_16226 VDDC_7227 I2S_OUT_BCK228 I2S_OUT_SD229 SPDIFO230 UART2_RX/I2CM_SDA231 UART2_TX/I2CM_SCK232 UART1_RX/GPIO86233 UART1_TX/GPIO87234 GND_17235 GND_18236 USB0_DM237 USB0_DP238 SAR0239 SAR1240 SAR2241 SAR3242 AVDD_MPLL243 XOUT244 XIN245 GPIO134246 GPIO135247 GPIO138248 GPIO139249 GPIO140250 IRIN251 HSYNC0252 VSYNC0253 HSYNC1254 VSYNC1255 CEC256 HWRESET
LG
E3767A
[M
ST
99A
88M
L(M
AT
RIX
ON
LY
SD
DIV
X_ N
ON
RM
) ]
IC8
00
-*1
1R
XBC
KN
2R
XB
CK
P
3R
XB
0N
4R
XB
0P
5H
OTP
LUG
B
6R
XB
1N
7R
XB
1P
8A
VD
D_33_1
9R
XB
2N
10
RX
B2P
11
RXAC
KN
12
RXAC
KP
13
RX
A0N
14
RX
A0P
15
AV
DD
_33_2
16
RX
A1N
17
RX
A1P
18
GN
D_1
19
RX
A2N
20
RX
A2P
21
HO
TPLU
GA
22
RE
XT
23
VC
LAM
P
24
RE
FP
25
REFM
26
BIN
1P
27
SO
GIN
1
28
GIN
1P
29
RIN
1P
30
BIN
M
31
BIN
0P
32
GIN
M
33
GIN
0P
34
SO
GIN
0
35
RIN
M
36
RIN
0P
37
AV
DD
_33_3
38
GN
D_2
39
BIN
2P
40
GIN
2P
41
SO
GIN
2
42
RIN
2P
43
CV
BS
6
44
CV
BS
5
45
CV
BS
4
46
CV
BS
3
47
CV
BS
2
48
CV
BS
1
49
VC
OM
1
50
CV
BS
0
51
VC
OM
0
52
AV
DD
_33_4
53
CV
BS
OU
T
54
GN
D_3
55
SIF
0P
56
SIF
0M
57
VD
DC
_1
58
AU
L5
59
AU
R5
60
AUVRM
61
AU
OU
TL2
62
AU
OU
TR
2
63
AU
OU
TL1
64
AU
OU
TR
1
65 AUL0
66 AUR0
67 AUL1
68 AUR1
69 AUL2
70 AUR2
71 AUL3
72 AUR3
73 AUCOM
74 AUL4
75 AUR4
76 GND_4
77 AUVRP
78 AUVAG
79 AVDD_AU
80 GND_5
81 VDDC_2
82 DDCA_CK
83 DDCA_DA
84 DDCDA_CK
85 DDCDA_DA
86 DDCDB_CK
87 DDCDB_DA
88 GPIO20
89 VDDP_1
90 VDDC_3
91 UART2_RX
92 UART2_TX
93 DDCDC_CK
94 RXCCKN
95 RXCCKP
96 DDCDC_DA
97 RXC0N
98 RXC0P
99 GND_6
100 RXC1N
101 RXC1P
102 AVDD_DM
103 RXC2N
104 RXC2P
105 HOTPLUGC
106 USB1_DM
107 USB1_DP
108 SCK
109 SDI
110 SDO
111 SCZ
112 PWM0
113 PWM1
114 PWM2
115 PWM3
116 LVA4P
117 LVA4M
118 LVA3P
119 LVA3M
120 LVACKP
121 LVACKM
122 LVA2P
123 LVA2M
124 LVA1P
125 LVA1M
126 LVA0P
127 LVA0M
128 VDDP_2
12
9LV
B4P
13
0LV
B4M
13
1LV
B3P
13
2LV
B3M
13
3LV
BC
KP
13
4LV
BC
KM
13
5LV
B2P
13
6LV
B2M
13
7LV
B1P
13
8LV
B1M
13
9LV
B0P
14
0LV
B0M
14
1A
VD
D_LP
LL
14
2G
ND
_7
14
3V
DD
C_4
14
4G
PIO
150/I2C
_O
UT
_M
UT
E1
45
GP
IO1
51
/I2
C_
OU
T_
SD
21
46
GP
IO1
52
/I2
C_
OU
T_
SD
31
47
GN
D_8
14
8G
PIO
51
14
9G
PIO
52
15
0G
PIO
53
15
1G
PIO
54
15
2G
PIO
55
15
3G
PIO
56
15
4G
PIO
57
15
5G
PIO
58
15
6V
DD
P_3
15
7V
DD
C_5
15
8B
_M
DA
TA
[4]
15
9B
_M
DA
TA
[3]
16
0G
ND
_9
16
1B
_M
DA
TA
[1]
16
2B
_M
DA
TA
[6]
16
3A
VD
D_D
DR
_11
64
B_M
DA
TA
[11]
16
5B
_M
DA
TA
[12]
16
6G
ND
_10
16
7B
_M
DA
TA
[9]
16
8B
_M
DA
TA
[14]
16
9A
VD
D_D
DR
_21
70
B_D
DR
2_D
QM
[1]
17
1B
_D
DR
2_D
QM
[0]
17
2G
ND
_11
17
3B
_D
DR
2_D
QS
[0]
17
4B
_D
DR
2_D
QS
B[0
]1
75
AV
DD
_DD
R_3
17
6V
DD
P_4
17
7G
ND
_12
17
8B
_D
DR
2_D
QS
[1]
17
9B
_D
DR
2_D
QS
B[1
]1
80
AV
DD
_DD
R_4
18
1B
_M
DA
TA
[15]
18
2B
_M
DA
TA
[8]
18
3G
ND
_13
18
4B
_M
DA
TA
[10]
18
5B
_M
DA
TA
[13]
18
6A
VD
D_D
DR
_51
87
B_M
DA
TA
[7]
18
8B
_M
DA
TA
[0]
18
9B
_M
DA
TA
[2]
19
0B
_M
DA
TA
[5]
19
1B_M
CLK
19
2B
_MC
LKZ
193GND_14194AVDD_MEMPLL195MVREF196A_ODT197A_RASZ198A_CASZ199A_MADR[0]200A_MADR[2]201A_MADR[4]202GND_15203A_MADR[6]204A_MADR[8]205A_MADR[11]206A_WEZ207A_BADR[1]208A_BADR[0]209A_MADR[1]210A_MADR[10]211AVDD_DDR_6212A_MADR[5]213A_MADR[9]214A_MADR[12]215A_MADR[7]216A_MADR[3]217A_MCLKE218VDDC_6219I2S_IN_WS/GPIO67220I2S_IN_BCK/GPIO68221I2S_IN_SD222I2S_OUT_MCK223I2S_OUT_WS224VDDP_5225GND_16226VDDC_7227I2S_OUT_BCK228I2S_OUT_SD229SPDIFO230UART2_RX/I2CM_SDA231UART2_TX/I2CM_SCK232UART1_RX/GPIO86233UART1_TX/GPIO87234GND_17235GND_18236USB0_DM237USB0_DP238SAR0239SAR1240SAR2241SAR3242AVDD_MPLL243XOUT244XIN245GPIO134246GPIO135247GPIO138248GPIO139249GPIO140250IRIN251HSYNC0252VSYNC0253HSYNC1254VSYNC1255CEC256HWRESET
3.3
KR
81
9
DSUB_SDA
LED_R
RT1
C39
04-T
112
Q80
5R
EA
DY
EB
CDD
C_W
P10
K
R82
8
RE
AD
Y
4.7K
R87
8
4.7K
R89
3
1KR
861
0
R8
03
7N
ON
19
_2
2"
0 R8940 R899
2KR88
6
150
R88
51K
R86
0
10K
R80
00
33K
R80
07N
ON
19
_2
2"
10K
R85
5
1KR85
3
100
R88
8
33K
R88
7
20K
R8
03
6
19
_2
2_
26
"
20pF C817
20pF C816
DDR2_A[2]
DDR2
_D[1
]
DDR2_A[6]
GND
DDR2
_D[5
]
DDR2_A[10]
DDR2
_D[0
]
DDR2
_D[1
0]
DDR2_A[12]
DDR2
_D[1
4]
DDR2_A[0]
DDR2
_D[6
]
DDR2_A[5]
DDR2
_D[3
]
DDR2_A[4]
DDR2
_D[4
]
DDR2
_D[1
2]
DDR2_A[9]
DDR2
_D[1
1]
DDR2_A[8]
DDR2
_D[8
]
DDR2
_D[7
]
DDR2
_D[1
5]
DDR2
_D[9
]
DDR2_A[3]
DDR2
_D[1
3]
DDR2_A[11]
DDR2
_D[2
]
DDR2_A[1]
DDR2_A[7]
TXCE
4-TX
CE4+
TXCE
3-TX
CE3+
TXCL
KE-
TXCL
KE+
TXCE
2-TX
CE2+
TXCE
1-TX
CE1+
TXCE
0-TX
CE0+
TXCO
4-TX
CO4+
TXCO
3-TX
CO3+
TXCL
KO-
TXCL
KO+
TXCO
2-TX
CO2+
TXCO
1-TX
CO1+
TXCO
0-TX
CO0+
I2S_
OUT HD
MI_3
EEPR
OM
HDMI_1
[MO
DE
SELE
CTI
ON
]
HDMI_2
C80
4/C
805/
C80
6:C
lose
to
IC
a
s c
los
e a
s p
os
sib
le
GAI
N X
4
RESE
T
Close to ICwith width trace
Clo
se t
o I
C a
s cl
ose
as
po
ssib
le
HDCP
EEP
ROM
USB PART
SER
IAL
FLAS
H 6
4M
S-V
IDE
O
4.7K
X4.
7K
4.7K
X4.
7K
R80
10
X
R89
8
Non
Sm
all F
HD
4.7K
X4.
7K
Smal
l HD
*H/W
OPT
ION
4.7K
4.7K
4.7K
100H
Z
4.7K
4.7K
4.7K
Apo
llo
Non
Sm
all H
D
R80
11
X
X
X
4.7K
X
R89
6
X
Sm
all F
HD
(27
)
4.7KX
** S
ma
ll H
D :
19
/22
/26
In
ch
** N
on
Sm
all
FH
D :
No
rma
l(n
on
10
0H
z)
FH
D M
od
el
THE
S
YMBO
L M
ARK
OF
THIS
SC
HEM
ETIC
DIA
GR
AM IN
CO
RPO
RAT
ESSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PR
OTE
CTI
ON
FR
OM
X-R
ADIA
TIO
N.
FILR
E AN
D E
LEC
TRIC
AL S
HO
CK
HAZ
ARD
S, W
HEN
SER
VIC
ING
IF IS
ES
SENT
IAL
THAT
ONL
Y M
ANUF
ATUR
ES S
PECF
IED
PART
S BE
USE
D FO
RTH
E C
RIT
ICAL
CO
MPO
NEN
TS IN
TH
E
SYM
BOL
MAR
K O
F TH
E SC
HEM
ETIC
.
SCHEMATIC DIAGRAM
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
MSTAR
+1.8
V_D
DR
DD
R2_A
[0-1
2]
DD
R2_B
A0
DD
R2_B
A1
DD
R2_M
CLK
DD
R2_M
CLK
ZD
DR
2_C
KE
DD
R2_O
DT
DD
R2_R
AS
ZD
DR
2_C
AS
ZD
DR
2_W
EZ
DD
R2_D
QS
0P
DD
R2_D
QS
1P
DD
R2_D
QM
0D
DR
2_D
QM
1
DD
R2_D
QS
0M
DD
R2_D
QS
1M
+1.8
V_D
DR
+1.8
V_D
DR
DD
R2_D
[0-1
5]
10
00
pF
C9
05
V_R
EF
56
R9
00
56
R9
01
56
R9
02 5
6R
90
3
56
R9
04 5
6R
90
5
0.0
1u
FC
90
4
0.0
1u
F50V
C9
00
0.0
1u
FC
90
10
.01
uF
C9
02
0.0
1u
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Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
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6IN
PUT2
-
5IN
PUT2
+
7O
UT2
8O
UT3
9IN
PUT3
-10IN
PUT3
+
11G
ND
12IN
PUT4
+
13IN
PUT4
-14O
UT4
68
00
pF
C6
28
68
00
pF
C6
27
MNT
_LO
UT
AUDI
O_R
SPK_
R-_H
OTE
L
SPK_
R+_H
OTEL
1250
5WR
-09A
00
HOTE
L_OP
T
P601
1 2 3 4 5 6 7 8 9
10
0.1u
FHO
TEL_
OPT
C63
6
+16V
_NTP
RT1
C39
04-T
112
HOTE
L_OP
T
Q60
2
E
BC
AMP_
MUT
E_HO
TEL
+3.3
V_M
ULTI
_MST
SW_R
ESET
10uF
16V
C60
0 10uF
16V
C60
4
10uF
16V
C60
9
3.3
R60
4
12R60
812R
611
12R61
012R
638
4.7K
R66
3
4.7K
R62
3
3.3
R62
6
3.3
R62
5
100
R60
1
3.3K
R60
0
100 R676
100 R677
100 R678
100
R60
2 100
R60
3
0 R656HOTEL_OPT
0R
673
12R65
812R
653
12R62
112R
654
4.7K
R62
8
4.7K
R66
7
3.3
R67
1
3.3
R63
5
1K
R6
07
10K
NO
N_H
OTE
L_O
PT
R61
3
12K
HO
TE
L_O
PT
R61
3-* 5.
6KR
614
5.6K
R61
5
10K
NO
N_H
OTE
L_O
PT
R61
6
12K
HO
TE
L_O
PT
R61
6-*
1K
R6
09
4.7
KR
60
6
200
HOTE
L_OP
TR
612
10K
HOTE
L_OP
T
R61
7
0HO
TEL_
OPT
R62
0
0H
OTE
L_O
PT
R61
9
4.7
KR
60
533
pFC
631
33pF
C63
3
0.1u
FC
620
0.1u
FC
622
6.8K
R61
8
6.8K
R62
2
NTP
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0LIC
600
1BS
T1A
2VD
R1A
3RE
SET
4AD
5DV
SS_1
6VS
S_IO
7CL
K_I
8VD
D_IO
9DG
ND_P
LL
10AG
ND_P
LL
11LF
M
12AV
DD_P
LL
13DV
DD_P
LL
14TE
ST0
15 DVSS_2
16 DVDD
17 SDATA
18 WCK
19 BCK
20 SDA
21 SCL
22 MONITOR_0
23 MONITOR_1
24 MONITOR_2
25 FAULT
26 VDR2B
27 BST2B
28 PGND2B_1
29PG
ND2B
_2
30O
UT2B
_1
31O
UT2B
_2
32PV
DD2B
_1
33PV
DD2B
_2
34PV
DD2A
_1
35PV
DD2A
_2
36O
UT2A
_1
37O
UT2A
_2
38PG
ND2A
_1
39PG
ND2A
_2
40BS
T2A
41VD
R2A
42NC
43VDR1B
44BST1B
45PGND1B_1
46PGND1B_2
47OUT1B_1
48OUT1B_2
49PVDD1B_1
50PVDD1B_2
51PVDD1A_1
52PVDD1A_2
53OUT1A_1
54OUT1A_2
55PGND1A_1
56PGND1A_2
MLB
-201
209-
0120
P-N
20L
CML0
0003
B
12
0-o
hm
L605
MLB
-201
209-
0120
P-N
2
0LCM
L000
03B
12
0-o
hm
L606
33
pF
50V
C6
38
RE
AD
Y
33
pF
50V
C6
39
RE
AD
Y
+3.3
V_M
ST
10K
R63
0 RT1
C39
04-T
112
Q60
3E
BC
10K
R62
9
MUL
TI_P
W_S
W0
R62
7R
EA
DY0
R62
4R
EA
DY
22K
R63
1R
EA
DY
SP
K_
L-
Main
AM
P
AMP
:GAI
N X
4
Chi
nese
Hot
el O
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THE
S
YMBO
L M
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OF
THIS
SC
HEM
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DIA
GR
AM IN
CO
RPO
RAT
ESSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PR
OTE
CTI
ON
FR
OM
X-R
ADIA
TIO
N.
FILR
E AN
D E
LEC
TRIC
AL S
HO
CK
HAZ
ARD
S, W
HEN
SER
VIC
ING
IF IS
ES
SENT
IAL
THAT
ONL
Y M
ANUF
ATUR
ES S
PECF
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PART
S BE
USE
D FO
RTH
E C
RIT
ICAL
CO
MPO
NEN
TS IN
TH
E
SYM
BOL
MAR
K O
F TH
E SC
HEM
ETIC
.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
AUDI
MAI
N_SI
F
0.01
uFC
501
M_S
DA
27pF
C50
0
+5V_
TUNE
R
TV_M
AIN
M_S
CL
+5V_
TUNE
R
C5
04
RE
AD
Y
27pF
C50
2
10
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L5
02
RE
AD
Y
82
pF
C5
07
RE
AD
Y
10
uF
16V
C5
08
12
0-o
hm
L500
RE
AD
Y
ISA1
530A
C1
Q50
2E
BC
TA
FT
-H2
03
F
TU
50
0-*
1
NTS
C_TU
NE
R
14
NC
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13
V-O
UT
5R
F_A
GC
12
NC
_4
11
MO
PLL_A
S
2G
ND
_1
19
NC
_8
18
NC
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10
SC
L
4N
C_2
1N
C_1
17
NC
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9S
DA
8G
ND
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3+
B[5
V]
16
SIF
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T
7N
C_3
6T
P[3
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PT
]
15
A-O
UT
21
SH
IELD
20
NC
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TAFT
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3DTU
500
PA
L_T
UN
ER 14
NC_5
13V-
OUT
5RF
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C
12NC
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11M
OPL
L_AS
2G
ND_1
19NC
_8
18NC
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10SC
L
4NC
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1NC
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17NC
_6
9SD
A
8G
ND_2
3+B
[5V]
16SI
F-O
UT
7NC
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6TP
[3.3
V_O
PT]
15A-
OUT
21 SHIE
LD20NC
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4.7K
R50
2
220
R50
6
220
R50
7
100u
F16V
C50
510
0uF1
6VC
509
100u
F16V
C50
6
12
0-o
hm
L501
47R
504
47R
505
0.1
uF
50V
C5
03
0L5
01
-*1
0 O
hm
Ne
ar th
e p
in
THE
S
YMBO
L M
ARK
OF
THIS
SC
HEM
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DIA
GR
AM IN
CO
RPO
RAT
ESSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PR
OTE
CTI
ON
FR
OM
X-R
ADIA
TIO
N.
FILR
E AN
D E
LEC
TRIC
AL S
HO
CK
HAZ
ARD
S, W
HEN
SER
VIC
ING
IF IS
ES
SENT
IAL
THAT
ONL
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ANUF
ATUR
ES S
PECF
IED
PART
S BE
USE
D FO
RTH
E C
RIT
ICAL
CO
MPO
NEN
TS IN
TH
E
SYM
BOL
MAR
K O
F TH
E SC
HEM
ETIC
.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
TUNER
TMDS
3_RX
2-
+5V_
HDM
I_2
TMDS
3_RX
C-
HPD_
MST
_2
TMDS
3_RX
0+
TMDS
2_RX
2-
CEC
TMDS
2_RX
C-
TMDS
2_RX
C+
TMDS
1_RX
C-
TMDS
2_RX
0+
TMDS
3_RX
0-
TMDS
3_RX
1+
TMDS
3_RX
C+
+5V_
HDM
I_2
HPD_
MST
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CEC
TMDS
1_RX
2+
TMDS
2_RX
1+
+5V_
MUL
TI
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HDM
I_1
TMDS
3_RX
2+
TMDS
2_RX
0-
TMDS
1_RX
1-
TMDS
2_RX
1-
TMDS
1_RX
2-
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HDM
I_3
TMDS
3_RX
1-
+5V_
MUL
TI+5
V_HD
MI_
3
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MUL
TI+5
V_HD
MI_
1
TMDS
1_RX
0-
TMDS
1_RX
1+
CEC
TMDS
1_RX
0+
TMDS
2_RX
2+
TMDS
1_RX
C+
HPD_
MST
_3
DDC_
SDA2
DDC_
SCL2
DDC_
SDA1
DDC_
SCL1
DDC_
SDA3
DDC_
SCL3
JP
30
4
JP
30
5
JP
30
1
JP
30
0
JP
30
2
JP
30
3
2SC
3875
S
RT
1C
39
04
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12
Q30
1
E
B
C
2SC
3875
SR
T1
C3
90
4-T
11
2
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0 E
B
C
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3875
S
RT
1C
39
04
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12
Q30
2 E
B
C
KJA
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0-00
32
JK30
3
14
NC
13
CE
C
5D
AT
A1_S
HIE
LD
20
JAC
K_G
ND
12
CLK
-
11
CLK
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HIE
LD
2D
AT
A2_S
HIE
LD
19
HP
D
18+5V
_P
OW
ER
10
CLK
+
4D
ATA
1+
1D
ATA
2+
17 D
DC
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C_G
ND
9D
AT
A0-
8D
AT
A0_S
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LD
3D
AT
A2-
16
SD
A
7D
ATA
0+
6D
AT
A1-
15
SC
L
KDS1
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D30
0
A1
C
A2
KDS1
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D30
1
A1
C
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2
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C
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01
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2
2A
1
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1A
0
5S
DA
6S
CL
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8V
CC
CA
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2A
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0
5S
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CL
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CC
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00
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2
2A
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0
5S
DA
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CL
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8V
CC
DDC_
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DDC_
WP
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BSS8
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C_RE
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3
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C
+3.3
V_M
ST
CEC_
C
CDS3
C30G
TH30
VCE
C_RE
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4
MM
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3
10K
R30
1
1KR30
3
0.0
1u
FC
30
0
10K
R30
0
1KR30
2
100
R32
9
1KR31
4
10K
R31
2
68K
CEC_
READ
Y
R31
5
0R31
3
100
R31
7
100
R31
810
0R
305
100
R30
4
0.0
1u
FC
30
1
100
R33
1
100
R30
6
100
R30
7
0.0
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FC
30
2
100
R32
7
10K
R30
810
KR
310
10K
R30
910
KR
311
10K
R31
910
KR
320
QJ4
1193
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E1-7
FJK
301
1D
ATA
2+
2D
AT
A2_S
HIE
LD
3D
AT
A2-
4D
ATA
1+
5D
AT
A1_S
HIE
LD
6D
AT
A1-
7D
ATA
0+
8D
AT
A0_S
HIE
LD
9D
AT
A0-
10
CLK
+1
1
12
13
14
15
16
17
18
19 20
JAC
K_G
ND
21
.
22
QJ4
1193
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E1-7
FJK
302
1D
ATA
2+
2D
AT
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LD
3D
AT
A2-
4D
ATA
1+
5D
AT
A1_S
HIE
LD
6D
AT
A1-
7D
ATA
0+
8D
AT
A0_S
HIE
LD
9D
AT
A0-
10
CLK
+1
1
12
13
14
15
16
17
18
19 20
JAC
K_G
ND
21
.
22
56K
CEC_
READ
Y
R31
6
OP
TIO
N
SW
_H
PD
: U
SE
SW
HP
D (
De
fau
lt)
MS
T_H
PD
: U
SE
MS
T H
PD
THE
S
YMBO
L M
ARK
OF
THIS
SC
HEM
ETIC
DIA
GR
AM IN
CO
RPO
RAT
ESSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PR
OTE
CTI
ON
FR
OM
X-R
ADIA
TIO
N.
FILR
E AN
D E
LEC
TRIC
AL S
HO
CK
HAZ
ARD
S, W
HEN
SER
VIC
ING
IF IS
ES
SENT
IAL
THAT
ONL
Y M
ANUF
ATUR
ES S
PECF
IED
PART
S BE
USE
D FO
RTH
E C
RIT
ICAL
CO
MPO
NEN
TS IN
TH
E
SYM
BOL
MAR
K O
F TH
E SC
HEM
ETIC
.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
HDMI
THE
S
YMBO
L M
ARK
OF
THIS
SC
HEM
ETIC
DIA
GR
AM IN
CO
RPO
RAT
ESSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PR
OTE
CTI
ON
FR
OM
X-R
ADIA
TIO
N.
FILR
E AN
D E
LEC
TRIC
AL S
HO
CK
HAZ
ARD
S, W
HEN
SER
VIC
ING
IF IS
ES
SENT
IAL
THAT
ONL
Y M
ANUF
ATUR
ES S
PECF
IED
PART
S BE
USE
D FO
RTH
E C
RIT
ICAL
CO
MPO
NEN
TS IN
TH
E
SYM
BOL
MAR
K O
F TH
E SC
HEM
ETIC
.
CVBS
_LIN
MUT
E_LIN
E
AUDI
O_R
SD05
ZD10
0
100u
F16
VC
102
SD05
ZD10
3
SD05
ZD10
5
MNT
_ROU
T
CVBS
_VIN
SPK_
R+_H
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RT1
C39
04-T
112
Q10
0
EB
C
SPK_
R-_H
OTE
L
CVBS
_RIN
SD05
ZD10
4
10uF
16V
C10
1
MUT
E_LIN
E
SD05
ZD10
1
SD05
ZD10
2
MNT
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T
RT1
C39
04-T
112
Q10
1E
BC
MNT
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T
10uF
16V
C10
030
VNO
N_HO
TEL_
OPT
D10
2
30V
NON_
HOTE
L_OP
T
D10
3
30V
D101
30V
ADUC
30S0
3010
L_AM
ODI
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D1
00
30V
D10
4
30V
D10
5
COM
P2_Y
COM
P2_P
B
COM
P2_P
R
COM
P2_L
COM
P2_R
S_VI
DEO
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SIDE
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SIDE
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+3.3
V_M
ULTI
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OP
TR
EA
DY
C1
04
30V
D10
6
30V
D10
7
SD05
ZD10
6
SD05
ZD10
7
PS
J0
14
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JK
10
1S
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GN
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1
C-L
UG
1
2C
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G2
30
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RIN
G
4C
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G3
5C
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G4
SH
IELD
7
75R
102
0HO
TEL_
OPT
R10
3
0HO
TEL_
OPT
R10
5
0NO
N_HO
TEL_
OPT
R10
6
0HO
TEL_
OPT
R10
1
75R109
75R108
75R107
220K
R104
12K
R118
12K
R117
12K
R11
9
12K
R12
0
10K
R113
10K
R11
5
10K
R11
6
220K
R100
220K
R11
1
220K
R11
2
75R11
0
75R12
2
S-V
IDE
O
75R12
1
S-V
IDE
O
10K
R1
23
100p
FRE
ADY
C10
3
10K
R114
PP
J226
-01
JK10
0
9A[G
N]1P
_CAN
4A[G
N]O
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ING
_A
3A[G
N]CO
NTAC
T_A
9B[B
L]1P
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8B[B
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LUG
_A
9C[R
D]1P
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_1
8C[R
D]C-
LUG
_A
9D[W
H]1P
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8D[W
H]C-
LUG
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9E[R
D]1P
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4E[R
D]O
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ING
_A_1
3E[R
D]CO
NTAC
T_A_
1
9F[Y
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4F[Y
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3F[Y
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TACT
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9G[W
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8G[W
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9H[R
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4H[R
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3H[R
D]CO
NTAC
T_A_
2
5J
[YL
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PR
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6J
[YL]C
ON
TA
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7K
[WH
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UG
_B
5L
[RD
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PR
ING
_B
6L
[RD
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NT
AC
T_B
PO
P N
OIS
E
MNT_OUT
COMPONENT1
PO
P N
OIS
E
AV1
COM
PONE
NT1,
AV1
, MNT
_OUT
[JAC
K PA
CK T
YPE
D] :
JK10
0
S-V
IDE
O(C
hin
a M
od
el)
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
INPUT1
USB_
DN
USB_
DP
SIDE
_LIN
SIDE
_RIN
5.6
BZ
D203
SIDE
_V
PP
J2
18
-01
JK
20
1
5C[R
D]CO
NTAC
T
2C[R
D]U_
CAN
4C[R
D]O
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ING
2B[W
H]U_
CAN
3B[W
H]C_
LUG
2A[Y
L]U_
CAN
5A[Y
L]CO
NTAC
T
4A[Y
L]O
_SPR
ING
5.6
BZ
D202
USB DOWN STREAM
KJA-UB-4-0004
SID
E_U
SBJK
204 1 2 3 4 5
IR_O
UT
+3.3
V_M
ST
TXD
4.7K
R20
4
ST32
32CD
RIC
200
3C
1-
2V+
4C2
+
1C1
+
6V-
5C
2-
7T2
OUT
8R
2IN
9R2
OUT
10T2
IN
11T1
IN
12R1
OUT
13R
1IN
14T1
OUT
15GN
D
16VC
C
4.7K
R20
5
RXD
KCN
-DS-
1-00
88JK
20
0
1 2 3 4 5
6 7 8 9 10
+3.3
V_M
ST
+5VS
T_M
ST
6630
TGA0
04K
KCN
-DS-
1-00
89
JK20
2
1RE
D
2GR
EEN
3BL
UE
4GN
D_1
5DD
C_GN
D
6RE
D_GN
D
7GR
EEN_
GND
8BL
UE_G
ND
9NC
10SY
NC_G
ND
11GN
D_2
12DD
C_DA
TA
13H_
SYNC
14V_
SYNC
15DD
C_CL
OCK
16SH
ILED
SD05
ZD20
0
DSUB
_SDA PC
_VS
SD05
ZD20
1
ENKMC2837-T112D211
A AC
C
PC_B
ENKMC2837-T112D210
A AC
C
PEJ0
24-0
1JK
203
6BT_
TERM
INAL
2
8SH
IELD
_PLA
TE
7BB_
TERM
INAL
2
5T_
SPRI
NG
4R_
SPRI
NG
7AB_
TERM
INAL
1
6AT_
TERM
INAL
1
3E_
SPRI
NG
DSUB
_SDA
PC_A
UD_R
PC_G
DSUB
_SCL
CA
T24C
02W
I-G
T3
IC2
01
3A
2
2A
1
4V
SS
1A
0
5S
DA
6S
CL
7W
P
8V
CC
ENKMC2837-T112D212
A AC
C
DDC_
WP
PC_H
S
PC_A
UD_L
+5V_
MUL
TI
DSUB
_SCL
PC_R
CDS3
C30G
TH30
VD2
02
CDS3
C30G
TH30
VD2
03
ADUC
30S0
3010
L_AM
ODI
ODE
30
V
D20
0
ADUC
30S0
3010
L_AM
ODI
ODE
30
V
D20
1
30V
D20
6
30V
D20
5
ADUC
30S0
3010
L_AM
ODI
ODE
30
VD2
04
ADUC
30S0
3010
L_AM
ODI
ODE
30
VD2
09
30V
D2
08
RE
AD
Y30V
D2
07
RE
AD
Y
USB_
DL_N
USB_
DL_P
0
RE
AR
_U
SB
R2
29
0
RE
AR
_U
SB
R2
30
USB DOWN STREAM
UB01123-4HHS-4F
JK
20
5R
EA
R_U
SB
1 2 3 45
0.1u
FC
203
0.1u
FC
200
0.1u
FC
201
0.1u
FC
202
0.0
1u
FC
20
5
0.1
uF
C2
04
0.1
uF
C2
06
0.1
uF
C2
07
100
R20
2
100
R20
3
75R22
7
220K
R22
3R
EA
DY
220K
R22
2R
EA
DY
12K
R22
6
12K
R22
8
75R211
75R212
75R213
4.7K
R214
4.7K
R215
220K
R231
220K
R232
10K
R233
10K
R234
12K
R235
12K
R236
4.7K
R220
4.7K
R221
100
R216
100
R217
100
R218
0.1u
FOC
P_RE
ADY
C20
8
MIC
2009
YM6-
TR
OCP_
READ
YIC
202
3EN
ABLE
2GN
D
4FA
ULT/
1VI
N6
VOUT
5IL
IMIT
10uF
OCP_
READ
Y
C20
9
120O
HMOC
P_RE
ADY
L200
+5V_
USB
1K OCP_
READ
Y
R20
9
4.7K
OCP_
READ
Y
R21
0
0No
n_O
CPR
237
10uF
6.3V
C21
0
USB_
DL_N
USB_
DL_P
68
R2
07
68
R2
08
68
pF
C2
13
68
pF
C2
11
4.7K
R219
RE
AD
Y
0R2
00
0R2
01
500
L201
22
0u
F16V
C2
12
10
0u
F16V
C2
14
KD
S226
D2
13
OC
P_R
EA
DY
AA
C
C
510
OCP_
READ
Y
R23
8
160
OCP_
READ
YR
206
10K
R22
4
10K
R22
5
IR_O
UT
US
B
It’s
pos
sibe
l to
27~
47oh
m
**
1A
De
sig
n
SID
E A
V
RS-
232C
(CI I
TEM
)
PC E
DID
PC PC S
OUN
D
Pin
to
Pin
wit
hE
AN
43
43
94
01
Clo
se
to
SID
E_
US
B
THE
S
YMBO
L M
ARK
OF
THIS
SC
HEM
ETIC
DIA
GR
AM IN
CO
RPO
RAT
ESSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PR
OTE
CTI
ON
FR
OM
X-R
ADIA
TIO
N.
FILR
E AN
D E
LEC
TRIC
AL S
HO
CK
HAZ
ARD
S, W
HEN
SER
VIC
ING
IF IS
ES
SENT
IAL
THAT
ONL
Y M
ANUF
ATUR
ES S
PECF
IED
PART
S BE
USE
D FO
RTH
E C
RIT
ICAL
CO
MPO
NEN
TS IN
TH
E
SYM
BOL
MAR
K O
F TH
E SC
HEM
ETIC
.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
INPUT2
TXC
E0+,
TXC
E0-,T
XCE1
+,TX
CE1
-,TXC
E2+,
TXC
E2-,T
XCE3
+,TX
CE3
-,TXC
E4+,
TXC
E4-,T
XCLK
E+,T
XCLK
E-,T
XCLK
O+,
TXC
LKO
-,TXC
O0+
,TXC
O0-
,TXC
O1+
,TXC
O1-
,TXC
O2+
,TXC
O2-
,TXC
O3+
,TXC
O3-
,TXC
O4+
,TXC
O4-
47pF
C40
322
IR-O
UTR
430
470p
FC
404
NO
N_
19
_2
2_
26
"
KEY1
ZD40
1
120o
hmL4
06N
ON
_1
9_
22
_2
6"
ZD40
2
+5VS
T_M
ST
ZD40
0
500-
ohm
L410
NO
N_1
9_22
_26"
IR_O
UT
+3.3
V_M
ULTI
_MST
10K
IR-O
UT
R42
9
2SC
3052
Q40
5
IR-O
UTE
BC
500-
ohm
L411
NO
N_1
9_22
_26"
SUB_
SCL
120o
hmL4
02
KEY2
2SC
3052
Q40
4
IR-O
UTE
BC
+5VS
T_M
ST
IR
SUB_
SDA
0.1u
FC
408
NO
N_
19
_2
2_
26
"+3.3
V_M
ST
+5VS
T_M
ST
0.1u
FC
411
NO
N_
19
_2
2_
26
"
470p
FC
412
NO
N_
19
_2
2_
26
"
120o
hmL4
03N
ON
_1
9_
22
_2
6"
+3.3
V_M
ULTI
_MST
+3.3
V_M
ULTI
_MST
+5V_
+12V
_LCD
0.1u
FC
407
READ
Y
47uF
16V
C40
6
0.1u
F16
VC
414
NO
N_1
9_22
_26"
+3.3
V_M
ST
KE
Y2
10
0p
F50V
C4
01
19
_2
2_
26
"
KE
Y1
10
0p
F50V
C4
00
19
_2
2_
26
"
+5V_
+12V
_LCD
TXC
E0+,
TXC
E0-,T
XCE1
+,TX
CE1
-,TXC
E2+,
TXC
E2-,T
XCE3
+,TX
CE3
-,TXC
E4+,
TXC
E4-,T
XCLK
E+,T
XCLK
E-,T
XCLK
O+,
TXC
LKO
-,TXC
O0+
,TXC
O0-
,TXC
O1+
,TXC
O1-
,TXC
O2+
,TXC
O2-
,TXC
O3+
,TXC
O3-
,TXC
O4+
,TXC
O4-
+5V_
+12V
_LCD
+3.3
V_M
ULTI
_MST
OPC_
EN
E-DI
M
OPC_
OUT
10
0p
F50V
C4
05
19
_2
2_
26
"
SU
B_S
CL
10
0p
F50V
C4
02
19
_2
2_
26
"
12
50
7W
S-1
2L
P4
00
NO
N_
19
_2
2_
26
"
1S
CL
2S
DA
3G
ND
4K
EY
1
5K
EY
2
65V
_S
T
7G
ND
8W
AR
M_S
T(L
ED
_R
_B
IG)
9IR
10
GN
D
11
ST
_3
.3V
(LE
D_
B)
12
PO
WE
R_O
N(L
ED
_R
_S
MA
LL)
13
.
P4
05
19
_2
2_
26
"
1K
EY
1
2K
EY
2
3G
ND
45V
_S
T
5G
ND
6IR
7LE
D_B
8LE
D_R
9
.B
G1
60
8B
12
1F
L4
00
19
_2
2_
26
"
BG
16
08
B1
21
FL
40
1
19
_2
2_
26
"
BG
16
08
B1
21
FL
40
8
19
_2
2_
26
"
BG
16
08
B1
21
FL
40
5
19
_2
2_
26
"
4.7K
R42
04.
7KR
421
10K
IR-O
UT
R42
7
10K
IR-O
UTR
428
47K
IR-O
UTR
426
0R
41
7N
ON
_1
9_
22
_2
6"
0R
40
0
RE
AD
Y
0
R4
03
NO
N_
19
_2
2_
26
"
0R
41
3R
EA
DY
0R40
2
8BIT
or
52 s
harp
4.7K
10BI
T
R40
1
4.7K
JEID
A
R40
7
0R42
4VE
SA10
0R
409
RE
AD
Y
0READ
YR
405
0
OP
C_E
NA
BLE
R4
12
470
R43
5
OPC_
ENAB
LE
SM
AW
200-0
3
P4
04
19
_2
2_
26
"
1K
EY
1
2K
EY
2
3G
ND
120-
ohm
L404
120-
ohm
L407NO
N_1
9_22
_26"
TF
05
-51
S
P4
01
1 2 3 4 5 6 7 8 9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
FF
10
00
1-3
0
P4
02
1 2 3 4 5 6 7 8 9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
SM
W200-2
8C
P4
03
1 2 3 4 5 6 7 8 9 10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
LE
D_R
+3.3
V_M
ST
RT1
C39
04-T
112
Q40
0
OP
C_E
NA
BLE
EB
C1K
R41
1
OP
C_E
NA
BLE
10K
R40
4
19_2
2_26
"
2SC
3052
Q40
119
_22_
26" E
BC+3
.3V_
MUL
TI_M
ST 10K
R41
0
19_2
2_26
"
10K
R41
4
19_2
2_26
"
2SC
3052
Q40
2
19_2
2_26
"EB
C+3.3
V_M
ST
10K
R41
519
_22_
26"
4.7K
R40
619
_22_
26"
0RE
ADY
R41
6
0RE
ADY
R41
8
0N
ON
22/
27" F
HD
R41
9
0N
ON
22/
27" F
HD
R42
2
0N
ON
22/
27" F
HD
R42
3
0N
ON
22/
27" F
HD
R43
1
0N
ON
22/
27" F
HD
R42
5
TXCO
3+
TXCE
1+
TXCO
1+
TXCE
1-
TXCL
KO+
TXCO
2-
TXCO
2+
TXCO
1-
TX
CE
2+
TX
CE
2-
TX
CLK
E+
TX
CLK
E-
TX
CE
3+
TX
CE
3-
TX
CE
4+
TX
CE
4-
TX
CO
3-
TX
CO
4+
TX
CO
4-
TX
CLK
O-
TX
CE
2-
TX
CE
2+
TX
CE
1-
TX
CE
1+
TX
CE
0-
TX
CE
0+
TX
CLK
E+
TX
CLK
E-
TX
CE
3+
TX
CE
3-
TX
CE
3-
TX
CE
3+
TX
CLK
E-
TX
CLK
E+
TX
CE
2-
TX
CE
2+
TX
CE
1-
TX
CE
1+
TX
CE
0-
TX
CE
0+
TXCE
0-
TXCE
0+
TXCO
0+
TXCO
0-
FH
D
X
R40
24.
7K10
BIT
(FH
D)
X8B
IT(H
D)
X X0
X
32 s
harp
R40
1
00 X52
sha
rp8B
IT(F
HD
)
CO
NT
RO
L K
EY
OP
C_E
AB
LE
OP
C_O
UTP
UT
Ex
tern
al
VB
R
PA
NE
L W
AF
ER
IR
(1
9/2
2/2
6")
(1
9/2
2/2
6")
HD
(1
9/2
2")
IR
(N
on
1
9/2
2/2
6)
CO
NT
RO
L K
EY
(N
on 1
9/2
2/2
6)
*8B
IT(F
HD
):22
/27"
HD
(2
6/3
2/3
7/4
2/4
7")
THE
S
YMBO
L M
ARK
OF
THIS
SC
HEM
ETIC
DIA
GR
AM IN
CO
RPO
RAT
ESSP
ECIA
L FE
ATU
RES
IMPO
RTA
NT
FOR
PR
OTE
CTI
ON
FR
OM
X-R
ADIA
TIO
N.
FILR
E AN
D E
LEC
TRIC
AL S
HO
CK
HAZ
ARD
S, W
HEN
SER
VIC
ING
IF IS
ES
SENT
IAL
THAT
ONL
Y M
ANUF
ATUR
ES S
PECF
IED
PART
S BE
USE
D FO
RTH
E C
RIT
ICAL
CO
MPO
NEN
TS IN
TH
E
SYM
BOL
MAR
K O
F TH
E SC
HEM
ETIC
.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
LGE Internal Use Only
LVDS/ CTR KEY
Feb., 2009Printed in KoreaP/NO : MFL60021521
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