mems-based systems solutions review and overview … · mems-based systems solutions review and...

MEMS-Based Systems Solutions

Review and Overview

with a

Focus on Current and Emerging Applications

Roger Grace

Roger Grace Associates

Microtech 2011

June 16, 2011

Boston, Massachusetts

Outline• Definition

• Functional Requirements

• Situational Analysis

• Commercialization Report Card

• Drivers for Adoption

• Research Methodology

• Case Studies

• Critical Success Factors

• Commercialization Opportunities

• Summary and Conclusions

Attention

This is a business strategy/commercialization/ applications

presentation that has been created to validate that there are great

opportunities to create wealth and serve society vis-à-vis MEMS-

Based Systems Solutions/Smart Systems Integration NOW.

Carpe diem!!!!

Roger Grace Associates Overview• Founded in 1982,a pioneer in the MEMS strategic marketing and analysis

sector

• Clients include the “who’s who” of industrial and government organizations

worldwide

• Headquartered in Naples, Florida/ San Francisco, California

• Focus on MEMS/Semiconductors and Capital Equipment

• Capabilities include

– Custom market research

– Market strategy development

– M&A due diligence

– Integrated marketing communications

• Promotion

• Positioning and Branding

• New product launches

Definition• Traditional “MEMS” and “MST” are not typically systems…they are

in fact devices

• “MEMS-Based System Solutions” (MBSS) are an integration of

MEMS-based sensors/actuators/structures with other functionalities

e.g. signal processing, networking delivered in a package and

optimized for a customer application/solution “(R. Grace)

MEMS-Based Systems Solutions

MEMS FRONT

•Sensor(s)

•Actuator(s)

•Structure(s)

SIGNAL

CONDITIONING

ELECTRONICS

•ASICs

•DSP

•Microcontroller

POWER/CONTROL

ELECTRONICS

•Energy Harvesting

•Battery

BACK END

•COMMUNICATIONS

ELECTRONICS

•Wireless

•Non-wireless

•Networked

Design for Manufacturing and Test

Co-Design

Systems Engineering

FUNCTIONS

DESIGN

PRINCIPLES

PACKAGING/INTERCONNECTS

Monolithic/Heterogeneous

MEMS-Based System Solutions

MEMS FRONT

•Sensor(s)

•Actuator(s)

•Structure(s)

SIGNAL

CONDITIONING

ELECTRONICS

•ASICs

•DSP

•Microcontroller

FUNCTIONS

MEMS FRONT

•Sensor(s)

•Actuator(s)

•Structure(s)

SIGNAL

CONDITIONING

ELECTRONICS

•ASICs

•DSP

•Microcontroller

POWER/CONTROL

ELECTRONICS

•BatteryFUNCTIONS

MEMS FRONT

•Sensor(s)

•Actuator(s)

•Structure(s)

SIGNAL

CONDITIONING

ELECTRONICS

•ASICs

•DSP

•Microcontroller

POWER/CONTROL

ELECTRONICS

•Battery

BACK END

•COMMUNICATIONS

ELECTRONICS

•Wireless

•Non-wireless

•Networked

FUNCTIONS

MEMS FRONT

•Sensor(s)

•Actuator(s)

•Structure(s)

SIGNAL

CONDITIONING

ELECTRONICS

•ASICs

•DSP

•Microcontroller

POWER/CONTROL

ELECTRONICS

•Battery

BACK END

•COMMUNICATIONS

ELECTRONICS

•Wireless

•Non-wireless

•Networked

FUNCTIONS

MEMS FRONT

•Sensor(s)

•Actuator(s)

•Structure(s)

SIGNAL

CONDITIONING

ELECTRONICS

•ASICs

•DSP

•Microcontroller

POWER/CONTROL

ELECTRONICS

•Battery

BACK END

•COMMUNICATIONS

ELECTRONICS

•Wireless

•Non-wireless

•Networked

Systems Engineering

FUNCTIONS

DESIGN

PRINCIPLES

MEMS FRONT

•Sensor(s)

•Actuator(s)

•Structure(s)

SIGNAL

CONDITIONING

ELECTRONICS

•ASICs

•DSP

•Microcontroller

POWER/CONTROL

ELECTRONICS

•Battery

BACK END

•COMMUNICATIONS

ELECTRONICS

•Wireless

•Non-wireless

•Networked

Co-Design

Systems Engineering

FUNCTIONS

DESIGN

PRINCIPLES

MEMS FRONT

•Sensor(s)

•Actuator(s)

•Structure(s)

SIGNAL

CONDITIONING

ELECTRONICS

•ASICs

•DSP

•Microcontroller

POWER/CONTROL

ELECTRONICS

•Battery

BACK END

•COMMUNICATIONS

ELECTRONICS

•Wireless

•Non-wireless

•Networked

Design for Manufacturing and Test

Co-Design

Systems Engineering

FUNCTIONS

DESIGN

PRINCIPLES

SUBJECT 98 99 00 01 02 03 04 05 06 07 08 09 10

R&D A A A A A A- A- A- A- A- B+ B

Marketing C- C C+ C+ C+ C C C+ C+ C+ C+ C

Market Research C B- B- B- B B B+ B- B B B B+

Design For Manufacturing C+ B- B B B B B C+ B- B B+ A-

Established Infrastructure C+ B B+ A A A A A- A- A- B+ B+

Industry Association INC INC INC B B+ B+ B+ B B B+ B B

Standards INC INC INC INC C B- B- B- C+ C C C

Management Expertise C C C+ C+ C+ C+ C+ B- B- B B B

Venture Capital Attraction C B- B+ A C C- C C+ C+ C C- D

Creation Of Wealth C B- B+ A C C- C- C- C- C C- D+

Industry Roadmap N/A B- B B+ A- A A B B- C+ C- C-

Profitability C- C- C- C- C- C- C- C C+ C C- D+

Employment INC INC INC INC INC C C C+ C+ C+ C C-

Cluster Development INC INC INC INC INC B B+ B+ B B- C+ C+

Overall Grade B B B- B- C+ C+

MEMS COMMERCIALIZATION REPORT CARD

SUBJECT 98 99 00 01 02 03 04 05 06 07 08 09 10

Situational Analysis• Design for manufacture and test and infrastructure development are

key elements for the successful commercialization of MBSS

• Both of these “grades” have progress favorably from their 1998

levels

• With the commoditization of many MEMS sensors for autos and

games, companies have learned to optimize their design for high

volume manufacture just to keep competitive (Darwinian)

• There is sufficient infrastructure in place with good history from a

device supplier, signal conditioning supplier, software developers,

wafer foundries and a host of packaging strategies including wafer

scale and chip stacking to create a low barrier to entry for potential

suppliers

• Companies owning unique IP for MEMS devices are realizing that

in-house vertical integration / value add significantly increases profit

margin e.g. HP, Polychromix(Thermo-Fisher)

Drivers for Adoption• Broad availability of commoditized devices

• Novel implementations of unique sensors/actuators/structures

• Need for product differentiation

• Commercial availability of low cost signal conditioning/ processing/

memory…ASICs ,DSPs, Flash, E2PROM

• Evolution of wafer level packaging /TSV/films

• Desire to maximize value added and maximize profit margin

• Continuous price reduction of MBSS components

• Relatively low barrier to entry for prospective suppliers

Research Methodology• In-person and telephone interviews

• Conducted in the November 2009 to August 2010 time frame

including visits to:

– Photonics West-San Francisco California-Jan. 2010

– Pittcon-Orlando, Florida-Feb. 2010

– American Chemical Society-Boston, MA-Aug. 2010

Tire Pressure Monitor• Supplier: Schrader Electronics

• System comprised of custom designed

piezoresistive pressure sensor,

custom design ASIC with

microcontroller core,OTS motion

sensor, RF chip and antenna, Lithium

ion battery on a PC board in a plastic

package mounted in valve stem

• Key specs

– -40 to 125 degree C temp range

– 500-600 r.p.m. rotation

– 1000’s of g’s

– Lifetime of 150,000 mi./ 6-10 yrs.

• First introduced in 1995

• Volume production >40Million units in

Navigation System(AHRS)• Supplier: Crossbow

Technologies, California

• (Outsourced OTS gyros/accels

and custom DSP (Kallman

filtering,flash,E2 memory)

• Significant algorithm

development effort/major

defensible IP

• Custom package minimizes

shock and vibration effects

• Application: Attitude heading

and reference System (AHRS)

for private aircraft

• Introduced in 1995

Gesture Recognition Controller

• Supplier: Movea, California

US/France/China(mfg.)

• Founded in 1989 as Gyration

• Outsources OTS. 3-axis gyros, 3-

axis ,accelerometers ,ASICs,

microcontrollers

• Market sectors served:– Sports and fitness( “virtual coach” for

swimming, running, yoga)

– Healthcare and wellness (range of

motion analyzer)

– Consumer pointing (computer mice, TV

controllers

– “65 market sectors for pointing

products”

Human-Machine Interface Device• Supplier: Hillcrest Labs,

Maryland US

• Outsourced OTS 3- axis

accelerometers,1/2 axis

gyros,32- bit DSP and other

• In-house proprietary

algorithm development

• Board size 0.9 x 0.9 in.

• Full production in 2004

• Applications include hand-

held air pointing cursor

control for TVs and games

Toy• Supplier: MEMSIC,

Massachusetts US

• In-house monolithic thermally

activated two-axis

accel,amplifier,A/D

converter,heater control

circuit,temp. comp.,trimming

fuse,and I2C digital interface

• OTS microcontroller with

programmable interface and

memory, battery, LEDs, plastic

wand package

• Strong co-design effort

• Featured at 2008 Olympics

Micro Gas Chromatograph

SAW LIGA-GC PP-PC

BYPASS SAW

SAMPLE IN

OUT TO PUMP

• Supplier: Defiant Systems,

New Mexico ,US

• In-house development of

critical components…collector,

column , SAW detector

• Key specs:

• Size 5.25x7.5x2.25 in.

• Weight 1.6 lbs.

• Battery life 4 hrs /9v

• RS 232 interface

• Applications include nerve

agent detection, pesticide

detection, EPA regulatory

monitoring

• Status: in devel./early proto.

Micro Gas Chromatograph• Supplier: University of

Michigan-Wireless Integrated

Microsystems Center (WIMS),

Michigan ,US

• Part of NSF/ERC Center

founded in 2000

• Platform strategy features low

loss ASICs and wireless IC

• Applications include

environmental monitoring,

homeland security, food

processing, bio markers

• Expected to reach

commercialization by 2015

Inertial Measurement Unit (IMU)• Supplier: MilliSensor Systems and

Actuators, Massachusetts USA

• Monolithic IMU with six

accelerometers(two accelerometers

per axis) and three gyros(each with a

single degree of freedom)

• Measures six degrees of freedom

• Gyro bias stability:20-100 degree/hr.

• Accelerometer bias stability: 0.5-1.0

• Application focus currently is for

military guidance and navigation

systems

• Currently under development

Seismic Platform• Supplier: HP, California/Oregon ,US

• In-house design of high performance two-

axis accelerometer, battery, power

management chip,

microcontroller,memory, wireless

chip,housing/package…”measurement

engine”

• Key specs:

– < 50 mw./axis power

– < 100 ng /square root hertz

– >130 dB dynamic range

– 0-250 Hz BW

– 7 mm. x 7 mm. die/package

• Current application massive distributed

sensing array for land-based oil and gas

exploration (Shell),future applications

include structural and machine health

condition monitoring

H.P. – Shell Oil/Gas Exploration

Accelerometer

Wireless Mesh Network

System Development and Management

“In-Field” Data Storage

Imaging and Printing Group

Pro curve

Enterprise Business

FTIR Spectrometer• Supplier: Block Engineering

• Hand-held Fourier-Transform

• Spectrometer..”Chem Pen”

• Uses Sandia National Labs

SUMMiT V process for the

• Currently funded through DOD

R$D…$6 M US

• Projected availability in 2013

• Large volume pricing of $1000

• Applications include chemical

warfare agent detection,

environmental monitoring,

hazardous materials analysis

Micro Gas Chromatograph• Supplier: Thermo-Fisher

(formerly c2v..Netherlands)

• MEMS engine

• Introduced 2009

• Applications include process

control petrochemical analysis

• Currently part of a rack

mounted solution with plans for

miniaturization to a hand held

instrument

NIR Spectrometer• Supplier: Thermo-Fisher

Scientific (formerly

Polychromix)

• MEMS engine license from

• Sandia National Laboratory

license of SUMMiT IV process

• Introduced Fall 2009

• Totally self contained hand-

held measurement system

including display, power

supply, application algorithms,

• Selling price of $15 K to $20 K

NIR Spectrometer• OEM Spectrometer Engine and

Anavo Portable NIR Analyzer

• System consists of a tunable

laser based spectrometer,

integrated wavelength and

amplitude reference, extended

range photodetector, and control

and processing electronics

– Portable NIR system also

includes a diffuse reflectance

sample interface and LCD screen

with on board libraries for

Qualitative ID or Quantitative

measurement

• Key Specifications

– SNR of 5500:1

– 3cm-1 Resolution

– Millisecond measurement speed

– 1300-1800nm Wavelength range

34Courtesy Axsun Technologies

Telecom Optical Channel Monitor• MEMs Tunable Compact Optical

Spectrum Analyzer (OSA)

• System consists of a tunable Filter

with integrated Photodiode and

Wavelength Reference, and control

and processing electronics

– Scans through Dense Wavelength

Division Multiplexed Laser Channels

and reports Optical Power,

Wavelength and SNR

– Covers C or L Bands or 1 module

covers C+L (1520-1610nm)

– High Spectral Resolution (< 1pm)

and Dynamic Range (30dB)

– Compatible with 10Gb/s, 40Gb/s

and 100Gb/s and advanced

modulation techniques

– 25 Year Life

• More than 30,000 shipped

– > 400 Million device hours of

operation35

Courtesy Axsun Technologies

Wireless Sensor Node for Structural

Analysis• Investigator: Univ.of Michigan

(Prof. Gerry Lynch)

• Supported by US NIST for

bridges and DOD for structural

ship hull monitoring

• Current implementation uses

off the shelf accelerometers

and strain gages

• Currently deployed on many

bridges in the US and US

Navy ship

• Research areas include chip

stacking, energy harvestesr,

low loss CMOS circuitry and

wireless transmitters

Swept Laser Engines for Optical Imaging• OEM Tunable Laser Engines for

Optical Coherence Tomography

• System consists of a wide band

tunable laser, Interferometer and

Balanced Detection, with

Associated Control, Processing and

high-speed Data Acquisition

Electronics

– SNR of 105 dB

– 100nm Tuning Range

– 1310nm or 1060nm Wavelength

– Up to 100kHz tuning speed

– Long coherence length for deep

imaging

• Applications in Ocular imaging,

Coronary Artery imaging, Cancer

Detection, Endoscopy, etc.

Laser5

K-Clock

(to DAQ)

Interferometer

signal (to DAQ)

From Sample Arm

From Ref. Arm

Sweep Trigger

(to DAQ)

Laser Output

50/5050/50

From power

Optional Safety

Shutdown Circuit

Axsun Swept Source OCT Engine

Balanced

Detector

OCT Retina Image OCT Anterior Chamber Image

Cornea

Courtesy Axsun Technologies

Leverage Analysis Company Product MEMS

Device

Solution

Cost (BOM)

Selling

Leverage

H.P. Seismic

Sensor

Accel. $60. N/A N/A Immense!!!

Thermo-

Fisher

Spectro

Optical

mirror

$100 $1350 $17,000 170:1

Thermo-

Fisher

Micro GC Microfluidic

$150 $1500 $25,000 166:1

Axsun NIR Spectro

Optical

mirror

$135 $1700 $16,000 118:1

Hillcrest

Motion

analyzer

Accels.

$10 $25 $75 7.5

Business Case• Many MEMS/MST devices have become commoditized over the

past couple of years…accelerometers, microphones, pressure

sensors

• Smart Systems Solutions offers a “way out” of this fighting for

market share and continuously declining prices and gross margin

• Value added to the basic front end vis-à-vis

intelligence/communication/packaging is a solution

RECENT / CURRENT DEALS

Company

Acquired

Product Acquiring

Company

Acquisition Price Date

Polychromix FT-IR Spectrometer Thermo Fisher $28 million Q-2,2010

c2v Microfluidic

Chromatograph

Thermo Fisher Undisclosed Q-1,2010

AMS MEMS Foundry Plures Technologies Undisclosed Q-4, 2010

Jyve Location and activity –

based solutions

Fairchild

Semiconductor

Undisclosed Q-4, 2010

Verreon Glass-based technologies

/ displays

Qualcom $5 million Q-2, 2010

Crossbow MEMSIC MEMS Modules $18 million Q-4, 2009

Kionix Rohm Accelerometers Undisclosed Q-4, 2009

Silicon Clocks Silicon Labs Oscillators Undisclosed Q-2, 2010

Akustica Microphones Bosch Undisclosed Q-3, 2009

HandyLabs Microfluidic Systems Becton Dickinson Undisclosed Q-4, 2009

DEAL STRATEGY

• The big question….Go IPO???? or sell to strategic partner????

• Predominance of acquisition approach over IPO in past

• Limited number of IPO’s to date– MEMSIC

– MEMSCAP (France)

– Microvision

• Acquired companies get 3.0-3.5 X multiple on sales (typically)…e.g.

Ahura/Thermo Fisher

• However companies have been acquired pre-revenue…e.g. Verreon

• Are we seeing another “feeding frenzy” on acquiring companies who can

support the portable electronics business similar to the optical telecom

scenario????

• Next possible deal…Invensense?

PROGNOSTICATIONS

(next 12 months)

• Venture capital will continue to be elusive:

– Worldwide economic status remains uncertain

– Limited number of new startups

– Possible failure to fund advanced rounds

– Industrial funding partners will continue to make strategic

investments/acquisitions…e.g. CardioMEMS …keep your eyes and ears tuned

for some other upcoming news!

– Limited number of IPOs…e.g. Invensense…will it go?

• Recent increased M&A activity e.g. Kionix, Akustica, LV Sensors, Sunion, Miradia,

HandyLabs, Polychromix, c2v, TI / Attleboro MA, …??????

• 2011 market to grow at 17-19 % over 2010 (sales)

• Continued participation of traditional semi players in the market

• Wafer scale packaging/chip stacking and TSV continue their widespread adoption

• Higher value added/systems solution approach adoption

– Establish product differentiation/competitive advantage

– Minimize commoditization

Critical Success Factors

• Availability of commoditized front ends e.g. inertial sensors

• Creation of enabling MEMS devices e.g. Micro GC, Micro LC,

Spectrometers

• Selection of the right ASIC/DSP partner

• Software/algorithm application development expertise

• Adoption of Co-Design principles

• Packaging/connectivity and test expertise

• Adopt lessons learned from successful implementations e.g.

Polychromix,C2V (both recently acquired by Thermo

Fisher))…”those that forget the past are condemned to relive

it”…George Santayana, Age of Reason (1916-1918)

• and most importantly…”think outside the chip”

Summary and Conclusions• Much excellent work has been done in the R&D labs on integration, especially

monolithic functionality

• The commoditization of MEMS e.g. inertial and pressure sensors has enabled

system solutions in a variety of high volume consumer products

• The emergence of low cost integration of smart systems in the photonics and

microfluidics sectors will enable a new set of industrial, medical and consumer

applications

• There are currently numerous and significant success stories to establish the

feasibility of the proposed business models

– Commoditized front ends with proprietary software and packaging

– Enabling front ends integrated into systems and packages

• We expect to see a proliferation of the “systems solutions” approach in the

immediate future since they bring numerous benefits to their users including:

enhanced robustness and faster time to market while providing the suppliers with

extended leverage of their technology and higher product differentiation and

maximized gross margins.

• Think “blue ocean” versus “red ocean” strategies

Critical Success Factors

• Availability of commoditized front ends e.g. inertial sensors

• Creation of enabling MEMS devices e.g. Micro GC, Micro LC,

Spectrometers

• Selection of the right ASIC/DSP partner

• Software development expertise

• Adoption of Co-Design principles

• Packaging/connectivity and test expertise

• Adopt lessons learned from successful implementations e.g.

Polychromix,C2V…”those that forget the past are condemned to

relive it”…George Santayana, Age of Reason (1916-1918)

• and most importantly…”think outside the chip”

Commercialization Opportunities

• Point of care diagnostics(bio/inertial)

• Portable micro analytical systems(chem/bio)

– Environmental monitoring

– In-situ process control and monitoring

– Homeland security/military threat monitoring

– “Non-lab” medical analysis

• Wireless autonomous systems (inertial/temp./pressure)

– Structural/machine health monitoring

• Navigation/guidance/motion(inertial)

– Smart munitions

– Toys/games

– Medical

Summary and Conclusions• Much excellent work has been done in the R&D labs on integration, especially

monolithic functionality

• The commoditization of MEMS e.g. inertial and pressure sensors has enabled

system solutions in a variety of high volume consumer products

• The emergence of low cost integrated MEMS-based solutions in the photonics and

microfluidics sectors will enable a new set of industrial, medical and consumer

applications

• There are currenntly numerous and significant success stories to establish the

feasibility of the proposed business models

– Commoditized front ends with proprietary software and packaging

– Enabling front ends integrated into systems and packages

• We expect to see a proliferation of the “systems solutions” approach in the

immediate future since they bring numerous benefits to their users including:

enhanced robustness and faster time to market while providing the suppliers with

extended leverage of their technology and higher product differentiation and

maximized gross margins.

References• R. Grace, MEMS/MST Based Systems Solutions:Think Outside the

Chip, ST News, Nov. 2009, www.rgrace.com

• R. Grace, Thinking Outside the Chip: MEMS-Based Systems

Solutions, Small Times, Nov./Dec. 2008, www.rgrace.com

• R. Grace, MEMS Based Systems Solutions: Thinking Outside the

Chip, Euro-Asia Semiconductor, Dec. 2008/Jan. 2009,

www.rgrace.com

• R. Grace, Thinking Outside the Chip for MEMS Design Success,

Electronic Products, Feb. 2010, www.rgrace.com

• R. Grace, Think Outside the Chip, Embedded Systems Design, May

25, 2010, www.rgrace.com

• S. Senturia, MEMS Enabled Products: A Growing Market Segment,

www.polychromix.com

Upcoming Conferences of Interest

MEMS Industry Group (MIG) Executive Congress,

Monterey CA, Nov.2-3, 2011

www.memsindustrygroup.com

Sensor Tech Forum

Boston MA, Oct. 10-12, 2011

www.sensortechfoprum.com

Smart Systems Integration Conference

Zurich Switzerland, March 20-21, 2012

Acknowledgements• Polychromix

• Schrader

• Hillcrest Labs

• HP

• University of Michigan- Wireless Integrated MicroSystems Center

(WIMS)

• MEMSIC

• Movea

• Defiant Technologies

• Fraunhofer Chemnitz ENAS

• Crossbow Technologies

• Integrated Sensing and Systems (ISSYS)

• Millisensor Systems and Actuators (MSSA)

• C2V

• Boston Micromachines

• THANK YOU / DANKE / MERCI / HSIEH

HSIEH / SHOKRUN / GRAZIE /

OBRIGADO / EFHARISTOU/GRACIAS

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