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PUBLIC
NXP RF Front-End Solutions
for 5G mMIMO Systems
April 2019
PUBLIC 1
5G Benefits and Key Pillars
• High speed, high capacity
− Faster data transmission than previous generations
• Supports interactive multimedia, voice, streaming
video
− 5G will be more effective, attractive
• Better reliability
− More clarity and quality than previous generations
• Increased throughput
− Capable of handling the huge increase expected with 5G
data usage
PUBLIC 2
5G Cellular Market Challenges
• Capacity, data rates, subscribers
− Smart devices increasing Internet traffic
• Reduce equipment size
− Smaller footprint to reduce installation costs
• Network infrastructure evolution
− Active antenna rise
− Power consumption
• Multiple standards to support
− 2G to 4G advanced
• Reduce CAPEX/OPEX
PUBLIC 3
NXP is Enabling Cost Effective mMIMO Active Antenna Systems
• NXP RF has developed a series of RF front-end components for use in 4G and
5G mMIMO TDD network equipment covering various cellular bands
− Family of low power Doherty PA pre-driver modules
− Family of high efficiency LDMOS Doherty PA modules
− Integrated TR-Switch and LNA module
With shield and
without shield
PUBLIC 4
NXP Front-End SolutionsPre-Driver Amplifier
• 3x4 mm2 package
Rx Front-End Module
• 4x4 mm2 package
PA Module
• 6x10 mm2 package
Low Cost Small Size
• 21x35 mm2 solution
NXP has developed a family of
fully integrated High Efficiency
Power Amplifiers
• Power levels up to 38 W Peak
• Roadmap covering bands 2.3 GHz to 5 GHz
• Easy implementation – 50 Ω input and output
• Pin-compatibility between all frequency bands and
power levels
• LDMOS – low cost solution
PUBLIC 5
NXP Integration Strategy:Performance, Smaller Size, BOM reduction
• Integration using a combination of SiGe, GaAs and LDMOS technologies into 50 Ω in/out modules reduces the number of components on PCB and decreases total system cost
• RF Front-End assembly is less than 21 x 35 mm2 in size and provides excellent RF performance
• NXP is executing its integration strategy:
− Performance
− Smaller size
− BOM reduction by utilizing NXP’s unique position in system expertise by supplying high voltage power amplifiers and low noise amplifiers
21 mm
35 mm
PUBLIC 6
NXP Front-End Solutions Overview
PAM 10x6 mm2
Solution 15x11 mm2
Pre-Driver Amplifier
• 3x4 mm2 package
Rx Front-End Module
• 4x4 mm2 package Family of fully integrated
High Efficiency Power Amplifiers Modules
• Power levels 2.5 – 5 Watt devices
• Covers cellular frequency bands 2.3 GHz to 5 GHz
• Easy implementation
• Footprint and pin-compatibility between all frequency bands and
power levels
• LDMOS – low cost solutions
PCB < 30 x 20 mm2
Rx
Pre-Driver
Power Amplifier Module Power Amplifier Module
PUBLIC 7
mMIMO Portfolio
PUBLIC 7
PUBLIC 8
mMIMO PA Front-End Solutions – NXP Advantage
NXP has developed a family of fully integrated power amplifiers
Applications
• Communications
• Radar
• massive MIMO systems
• Outdoor small cells
Semiconductor Technologies
• GaN, LDMOS
• GaAs, SiGe
Power levels
• 1-5 Watt devices
Roadmap frequency bands
• 1.8 GHz to 5 GHz
Value Proposition
• Easy implementation – 50 Ω input and
output
• Highly integrated form factor – smallest
size in the industry at 6 x 10 mm
• High efficiency Doherty PA
• Lowest circuit and DPD complexity in
the industry
• Lowest overall OEM system and
development cost
• Compatible multilayer FR4 board
• Pin-compatibility between all frequency
bands and power levels
PUBLIC 9
5G mMIMO Modules
• NXP to release 6 PAMs at IMS
Ref circuits Smart Demo
23D34 x
23D37 x
26D37 x x
35D35 x
35D37 x x
37D37 x
PUBLIC 10
Family of fully integrated High Efficiency Power Amplifiers Modules
• Power levels 2.5 – 5 Watt devices
• Covering cellular frequency bands from 2.3 GHz to 5 GHz
• 50 Ω in/out easy implementation
• 6x10 mm2 footprint and pin-compatibility between all frequency bands and power
levels
• LDMOS = low cost solutions
PUBLIC 11
Family of fully integrated modules of
Doherty pre-drivers and TR-Switch & LNA
• Pre-drivers (3x4 mm2)
−Wideband performance, covering multiple cellular bands, fully
integrated, 50 Ω in/out, footprint and pin-compatibility between all
frequency variants
−25/29 dBm P1dB, 32 dB gain
− Id = 50 mA, 3.3 / 5 V operation, 1.8 V logic enable
• TR-Switch & LNA (4x4 mm2)
−2.3 GHz – 5 GHz, fully integrated, 50 Ω in/out
−NF < 1.2 dB, gain ~33dB
−0.8 µsec switching speed, 2nd stage bypass
−100mA at 5 V, 1.8 V logic
PUBLIC 12
5G mMIMO Solutions
Highlights
• Full RF Integration
• Small form factor
• Wide range of power and frequency variants
• Footprint and pin compatibility of variants
Customers
• Global traction for NXP solutions
• Winning majority of sockets
Fast growing RF Front-End portfolio
• Majority of products are in production now
• Full portfolio by end of 2019
Critical ramp programs on track
• Established manufacturing capacity
• Critical programs developed in collaboration with customers
PUBLIC 13
5G Network Development | Carriers Turning on mMIMO
• 5G field trials are now underway
• With 70+ trials underway worldwide, the 5G push is gaining momentum
• Sprint’s massive MIMO service launched in April 2018 in select U.S. markets
− https://www.fiercewireless.com/tech/sprint-to-turn-massive-mimo-6-cities-april
• NXP’s innovative mMIMO products are generating significant customer demand
NXP, the NXP logo and NXP SECURE CONNECTIONS FOR A SMARTER WORLD are trademarks of NXP B.V. All other product or service names are the property of their respective owners. © 2018 NXP B.V.
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