plans and status of aao based mcp at anl
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Plans and status of AAO based MCP at ANL
Seon W. Lee† and H. Hau Wang*,‡
High Energy Physics Division †, Materials Science Division *,‡
Argonne National Laboratory
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Self-ordered alumina by 2-step anodization- experimental procedures
Electropolishing is carried out HClO4/EtOH
First anodization using0.3 M sulfuric acid
Selective dissolution of the formed oxide layerChromic acid/phosphoric acid
Second anodization1~2 days
Pore widening In phosphoric acid
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Diameter of pores, pore-to-pore distance, thickness of AAO
Jpn. J. Appl. Phys. Vol. 38 (1999)Nat Materials, vol 5, Sep 2006
L/D ~ 40
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Photolithography
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www.hitequest.com/Kiss/photolithography.gif
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Photolithography on Aluminum anodic oxide (AAO) using laser (400nm) writer
Create larger pores : 2 um ~ 10 um
Surface roughness on Aluminum plate –polishing Al surface before annodization
Photoresist can infiltrate into pores – deposit thin film on AAO to close pores
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Photolithography (test results - need at least 1 week or longer to test once)
10 um pores hcp (hexagonal-closed-packed)arrays on Si wafer
Same pattern on AAO : Surface roughness on Al will cause distortion of image
Al plate with smoother surface:better image
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Mechanical polishing of aluminum plate at either Jeff’s lab or APS shop
need to draw new pattern with various pore diameters (2um –10um ) and pore-to-pore distance (mask design software : L-edit)
Need to optimize various parameters : – Thin film deposition on AAO to close pores– Type of photoresist– Laser power, exposure time
Etching - AAO – Etching solution, concentration, time
Photolithography – plans for near future
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The First Strike Problem
Funnel like entrance– by the Focused Ion Beam (FIB)
Curved pores
Nanotechnology 18 (2007) 035304
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Focused Ion Beam (FIB) Microscopy and micromachining
Milling is achieved by accelerating concentrated gallium ions to a specific site, which etches off any exposed material, leaving a very clean hole or surface
MRS Bulletin, Vol 32, May 2007
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MRS Bulletin, Vol 32, May 2007
Focused Ion Beam (FIB) Microscopy and micromachining
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