shanghai feb 20111 shanghai microsemi semiconductor co., ltd

Shanghai

Feb 2011 1

Shanghai Microsemi

Semiconductor Co., Ltd.

Shanghai

Feb 2011 2

Company Profile

• Located at Xin Zhuang, Shanghai, China

• Established in September 1995

• 100% owned by Microsemi Corp in Dec 2007

• 4” Wafer Fab with monthly output 60K pcs, 80% utilization rate

Shanghai

Feb 2011 3

Products Portfolio• GPP Chips• Finished Goods

Shanghai

Feb 2011 4

Finish Goods

Diode

GPP Diode

ModulesBridges

3-Phase Rectifier Bridges

High VoltageStack Diode

Single-PhaseRectifier Bridges

Diode Modules

Rectifier+SCR Modules

3-Phase Rectifier Modules

FRED Modules

SCR Modules

Products Tree

Shanghai

Feb 2011 5

Microsemi Shanghai ’s

Technology Advantages

Shanghai

Feb 2011 6

Passivation techniquesPassivation techniquesStar Die Construction

Process Diffused wafer (Open Junction)

Diffused wafer

+ Silicone rubber

protection

Grooves etching

+ Glass layer on etched grooves

Grooves etching

+ SIPOS

+ Glass layer on etched grooves

Quality rating

Low end

Low quality

Low end

Low quality

Medium quality Better than medium quality

P+ N

N+

P+ N

+

P+ N N+

P+N

N+N

N+ P+

Shanghai

Feb 2011 7

Microsemi’s Microsemi’s 5-Star5-Star Passivation Passivation

P+ N

N+

Silicon nitride layer

= Silicon Nitride & Glass passivation = Silicon Nitride & Glass passivation Microsemi uses the process for all hi-rel discrete devicesMicrosemi uses the process for all hi-rel discrete devices

Process : Grooves etching + Silicon Nitride + glass layer on Process : Grooves etching + Silicon Nitride + glass layer on etched grooves etched grooves

Quality rating: Highest quality process Quality rating: Highest quality process

Shanghai

Feb 2011 8

Advantages of SMSC’s GPP chips• Technology coming from Microsemi

Corp’s Hi-Rel processing

• Unique multilayer passivation ensure excellent high temperature characteristics and passing 200C HTRB test

• Die size from 0.050” Sq to 0.672” Hex

LPCVD : Low Pressure Chemical Vapor Deposition

High purity evaporated metal ensure a strong metallurgical bond and provides extremely low contact resistance

P+ Layer

N+ Layer

LPCVD growth layers plus glass passivation

Shanghai

Feb 2011 9

GPP Chips -- SMSC’s New developed Passivated Double Isolation Chips

Double Isolation Technology

Advantages:

Shanghai

Feb 2011 10

FG’s Release to Market (RTM) Procedures

Die qualification

1. Visual examination

2. Electrical inspection

3. HTRB

SMSC SMSC/Sub-con SMSC

Die receiving inspection

1. Visual / Electrical inspection

2. Assembly

Finished Goods (FG)

1. Visual/Electrical

2. Stamping

3. Reliability tests

REPEATEDABILITY TRIALS

FG inspection

1. Visual / Electrical inspection

2. Reliability tests (next slide)

RTM

Shanghai

Feb 2011 11

Reliability Tests Plan

Test Description PurposeDevice Under

Test

1High Temperature reverse

Voltage Burn-inDetermine the effect of bias and temp on the

device over an extended period of timeDie & F.G.

2 AutoclaveDetermine the effect of temp, humidity & pressure

on the device over time, unbiasedF.G.

3High temperature storage

test

To accelerate failure mechanisms which are thermally activated through the application of

extreme temp, unbisedF.G.

4 Temperature CyclingDetermine the effect of temp on Material Thermal

MismatchF.G.

5 Intermittent Operating Life

To evaluate the bulk stability of the die and to generate defects resulting from manufacturing aberrations that are manifested as time and

stress-dependent failures

F.G.

6 Reverse Energy test Application test for high voltage diodeHigh voltage

diode

7 Welder test Application test for UFT modules UFT Modules

Shanghai

Feb 2011 12

Reliability TestsTest Description Test Conditions

High Temperature Storage Life(HTSL)

Ta = 150 , T=48H,℃No bias

Temperature Cycling Test(TCT)

HOT Ta=Tvjm T= 30mins, COLD Ta=Tvjl T= 30mins, TRANSFERRING ≤

10secs, Cycles=10

Pressure Cooker Test (PCT)—(Plastic package)

15P.S.I @ 121 , T=48H℃

High Temperature Reverse Bias(HTRB)

Tj=150 , VBR=80%VRRM, T=96H℃

Intermittent Operating Life(OP-Life)

Ton = Toff = 5minutes, or Ton =From Tj= 25+/-5 to Tj =150+0/-10 , ℃ ℃

Toff= From Tj= 150+0/-10 to Tj =25+/-5 ℃ ℃

Shanghai

Feb 2011 13

Single Phase Bridge Rectifiers Specs:

Io = 0.5~50A STD VRRM =200 ~ 1000V

Typical Applications: GBJ 、 IH 、 KBJ Series:

Induction Heater/Home Appliance/Switching Power/Industrial Power Controller

GBU 、 GBL 、 KBP Series: PC Power/LCD-TV/Industrial Power Controller

GBPC & GBPC-W Series: Welder/Air-condition/Communication Power Supply/Industrial Power Controller

Shanghai

Feb 2011 14

High Voltage Stack Diodes • Plastic case UL flammability recognition 94V-0

• Replacement of Philips parts (e.g. BYX134GPL)

• Using SMSC’s unique passivated GPP chips

• High voltage up to 6KV GPP chips

• High maximum operating temperature

• Application: Ignition systems; High voltage coils;

X-ray system; Microwave system, etc.

Business Partners: Federal Mogul Delphi Eldor

TYPE

MAIN ELECTRICAL PARAMETERSPKG

DIMMVRRM / kV IF （ AV ） / mA IFSM/A VF/ V

BYX134P 4 10 30 5.00 DO-15

MSHV40P 4 10 30 5.00 DO-41

Shanghai

Feb 2011 15

FRED ModulesUltra Fast Recovery Epitaxial Diodes

•Common cathode configuration •Epoxy Potting body •Low Leakage Current •Low Forward Voltages •150 Operating Junction Temperature ℃•RoHS Compliance

CODE VRRM VF I F Trr

UFT20040CT 400V 1.1 V 100A 75ns

UFT20060CT 600V 1.2 V 100A 75ns

Shanghai

Feb 2011 16

3-Phase Bridge Rectifiers MT Series

35 to 50 Ampere Current Rating

800V to 1800V Reverse Voltage Rating

Direct Replacement to IXYS & IR parts

Typical Applications:

UPS, Industrial Power Controller,

Input rectifiers for PWM inverter,

Battery DC power supplies

High-frequency Switching Power Supply

Shanghai

Feb 2011 17

3-Phase Bridge Rectifiers

Type Frame Remark

MT3516A

Framework: Aluminium Copper Clad Laminate

The lower Case-temperature, the higher efficient, the better reliability, and the longer lifetime

MT3516Framework: Aluminium based Case

NEW

Shanghai

Feb 2011 18

3-Phase Bridge Rectifiers

Brand Type Rthj-c( /W)℃

MSC MT3516A 1# 0.73

MSC MT3516A 2# 0.70

(A) Vxx36-16 1# 1.76

(A) Vxx36-16 2# 2.04

(B) 36Mx160 1# 2.70

Shanghai

Feb 2011 19

Assembly Technology -- “Vacuum + H2” Multi-Gas Brazing Technology

-- Brazing with DBC for excellent thermal distribution

-- Ultrasonic scanning to ensure reliable brazing quality

-- High insulation voltage ≥ 3000V

-- Vacuum Welding Technology -- Voidage: <2.5%

-- X-ray Whole Body Scanned

Power Diode Modules NEW

Quality Assurance SMSC’s New developed

Passivated Double Isolation

Chips Inside

100% HTRB Test for Each

Lot

Double Moat Structure

DGP Chip

DGP design would improve the reliability and performance

Shanghai

Feb 2011 20

Power Diode Modules Diode-Diode Modules

CODE CIRCUIT VRRM IF PKG

MSKD

800V-1800V

36A-120A D1

165A-200A D2

MSAD

250A-300A D3

350A-400A D4

MSCD

500A-600A D5

800A D6

Shanghai

Feb 2011 21

Power Diode Modules Rectifier Modules

CODE CIRCUIT VRRM ID PKG

MSD 800V-1800V

30A-50A M1

52A-75A M2

100A-200A M3

Shanghai

Nov 2010 22

Power Diode Modules

Applications

-- DC Power Equipment

-- Inverter

-- Battery Charger

-- DC Motor Power Supply

-- Welding Machine

-- PWM Converter Rectifier

Shanghai

Feb 2011 23

New product Promotion

Applications -- Input rectification

-- Output rectifies which are available in indentical package outlines

-- Industrial Level

60EPS Series •High Reliability & High current capacity•Low Leakage Current•Low Forward Voltage•150 Operating Junction Temperature℃•ROHS Compliance•Replacement of IR Parts•The official approval document of 60EPS by APC of Schneider Denmark.

TYPE

MAIN ELECTRICAL PARAMETERSPKG

DIMMVRRM / V IF （ AV ） / A IFSM/A VRSM/ V

60EPS12 1200 60 1100 1300TO-247AC

60EPS16 1600 60 1600 1700

Shanghai

Feb 2011 24

New product Promotion ——3-phase Rectifier Modules

MSDM Series• Glass passivated chip• High Reliability• Superior thermal conductivity• Blocking voltage:800 to 1800 V• Heat transfer through aluminum

oxide DBC ceramic isolated metal

baseplate

Application --Three phase rectifiers for power supplies

--Rectifiers for DC motor field supplies

--Battery charger rectifiers

--Input rectifiers for variable frequency drives

Thin modules(17mm high)

M2-1M3-1

CODE IF CASE

MSDM 50~100A

M2-1

150~200A M3-1

Shanghai

Feb 2011 25

New product Promotion ——Diode Modules

MSCD-B/MSAD-B/MSKD-B Series• Blocking voltage:800 to 1800V

• Heat transfer through aluminum

oxide DBC ceramic isolated metal

baseplate

• Glass passivated chip

Application• Non-controllable rectifiers for

AC/AC converters

• Line rectifiers for transistorized

AC motor controllers

• Field supply for DC motors

D2-1

MSKD-B3 12

MSAD-B3 12

MSCD-B3 12

D1-1

Circuit CODE IFCAS

E

MSCD-BMSKD-BMSAD-B

36A-120A D1-1

165A-240A D2-1

Shanghai

Feb 2011 26

New product Promotion ——Thyristor Modules

MSTC/MSFC Series• Isolation voltage 3000V• High surge capability• Glass passivated chips• International standard package • Simple Mounting• Heat transfer through aluminum oxide DCB

ceramic isolated metal baseplate

Application• Power Converters• Lighting Control• DC Motor Control and Drives • Heat and temperature control

MSTC1 32

4

7

5

6

Circuit

T1/F1

T2/F2

MSFC1 32

45

Shanghai

Feb 2011 27

New product Promotion ——3 phase Rectifiers+SCR Modules

MSDT Series• Three Phase Diode and a

Thyristor• Isolation voltage 3000V• High surge capability• Glass passivated chips• Simple Mounting• Isolated Module Package

Application• Inverter for AC or DC motor control• Current stablilzed power supply• Switching power supply

1 2

5 4 3

0

67

Circuit

M4 M5

CODE Case

MSDT75 M4

MSDT100 M4

MSDT150 M5

MSDT200 M5

Shanghai

Feb 2011 28

Power ModulesCross Reference Guide (partial) ：

* For Reference Only

Microsemi Semikron IXYS

MSD75-16 SKD82/16 VUO82-16N07

MSD100-16 SKD110/16 VUO110-16N07

MSD160-16 SKD160/16 VUO160-16N07

MSD200-16 SKD210/16 VUO190-16N07

MSDM150-16 / VUO162-16N07

MSDM200-16 / VUO192-16N07

MSCD100-16 SKKD100/16 MDD95-16N1B

MSCD165-16 SKKD162/16 MDD172-16N1B

MSCD250-16 SKKD260/16 MDD220-16N1B

MSCD400-16 SKKD380/16 MDD312-16N1B

MSTC25-16 SKKT27/16 MCC26

MSTC60-16 SKKT57/16 MCC56

MSTC110-16 SKKT106/16 MCC95

MSTC160-16 SKKT162/16 MCC161

MSFC25-16 SKKH27/16 MCD26

MSFC60-16 SKKH57/16 MCD56

MSFC110-16 SKKH106/16 MCD95

MSFC160-16 SKKH162/16 MCD161

3-phanse modules

Diode modules

Thyristor/Diode modules

Thyristor/Thyristormodules

Shanghai

Feb 2011 29

Power Modules Cross Reference Guide (partial) ：

* For Reference Only

Microsemi SanRex

MSDT75-16 DFA75BA160

MSDT100-16 DFA100BA160

MSDT150-16 DFA150AA160

MSDT200-16 DFA200AA160

MSDM50-16 DF50AA160

MSDM75-16 DF75AA160

MSDM100-16 DF100AA160

MSCD60B-16 DD60KB160

MSCD100B-16 DD100KB160

MSCD165B-16 DD160KB160

MSCD240B-16 DD240KB160

Three Phase Diode + aThyristor

3-phanse modules

Diode modules

Shanghai

Feb 2011 30

Major Customers

Shanghai

Feb 2011 31

Quality System

• ISO

9001:2008

• ISO 14001:2004

Shanghai

Feb 2011 32

Quality System

• RoHS Compliance

• REACH

Compliance

• UL Approved

Shanghai

Feb 2011 33

Thank YouShanghai Microsemi Semiconductor Co., Ltd.

203 Shen Nan Road, Shanghai, 201108, PRC

Website: http://www.smsemi.com

Email: Sales@smsemi.com

Sales : 0086 - 21 - 6489 - 6650