status of ixys products products rohs compliance …...catalogue 04/05) latest date of conversion to...
Post on 07-Jun-2020
1 Views
Preview:
TRANSCRIPT
1Efficiency Through Technology
STATUS RoHS – lead-free
Status of IXYS Status of IXYS Status of IXYS ProductsProductsProducts RoHSRoHSRoHS ComplianceComplianceCompliance
IXYS/Q Jan. ‘06
2Efficiency Through Technology
STATUS RoHS – lead-free
BackgroundEC Commission prepares an Integrated Product Policy (IPP) since 1997
2000/53/EC on
end-of life vehicles
IPPIntegrated Product Policy
”Green Book”
WEEEWaste Electrical and Electronic Equipment implement
WEEE & RoHS
in Germany
REACH
Registration Evaluation
Authorisation of
Chemical substances
EUPFramework for the Setting of Eco-Design
Requirements for Energy
Using Products
2000 2001 2002 2003 2004 2005
Draft status
Decision !
RoHS2002/95/EC
Restriction of Hazardous Substances
3Efficiency Through Technology
STATUS RoHS – lead-free
2002/95/EC Restriction of the use of certain Hazardous Substances in electrical and electronic equipment
under Article 4 „Prevention“ Clause 1
Member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain
lead, mercury, cadmium, hexavalent chromium, polybrominated
biphenyls (PBB) or polybrominated diphenyl ethers (PBDE).
4Efficiency Through Technology
STATUS RoHS – lead-free
However, there are exemptions listed in the Annex of RoHS :
Among others:
lead in high temperature melting type solders (like tin-lead solderalloys containing more than 85 % lead)
This means that
high lead die attach soft solders are not affected at all !!
like PbSn2Ag2,5 etc.
5Efficiency Through Technology
Definition Green Package (common use in the industry)
“The substances listed below are not intentionally added, but might be present as an impurity with an upper limit according to the listed values. The limits refer to the individual material (such as mold compound, solder, plating, leadframe, substrate...) “
Definition substance upper limit (weight) material e.g.
Lead-free Pb < 1000 ppm = 0,1%
Lead finish Solder balls
Cadmium Cd < 100 ppm = 0,01%
Mold compoundsLaminates
Solder resist
All others Hg, Cr6+, PBB, PBDE
< 1000 ppm = 0,1%
Mold compoundsLaminates coatings
STATUS RoHS – lead-free
6Efficiency Through Technology
STATUS RoHS – lead-free
Discrete bipolar & Schottky – products 1
*) no Ni underplate
Outline Type Label Identifier Latest Date of Conversion to Pb-Free Terminals
Pb-Free Date Codes
(yyww or yww)
Terminal finish *)
(JESD97)
TO-220, TO-247, TO-3P
suffix “SN” after/below part
type Feb. 1st, 2004
higher than 0404 or 402 respectively
TO-262AB — Jan. 1st, 2004 higher than 0401
DS(A)1, IXBOD 1-06…10 — May 21, 2004 higher than
421
pure tin (e3)
metal can DS2, TO-3, … — n. a. all Ni
higher than 0414
SnAgCu (e1)
Thro
ugh
Hol
e Te
chno
logy
(TH
T)
ISOPLUSTM I4-PAC, 220, 247
suffix “SN” after/below part
type Apr. 1st, 2004
higher than 414 pure tin (e3)
7Efficiency Through Technology
STATUS RoHS – lead-free
„SN“ means Pb-free terminals and RoHS compliance
8Efficiency Through Technology
STATUS RoHS – lead-free
Discrete bipolar & Schottky products - 2
Outline Type Label Identifier
Latest Date of Conversion to
Pb-Free Terminals
Pb-Free Date Codes
(yyww or yww)
Terminal finish *)
(JESD97)
TO-263 (D2-Pak) suffix “SN” after/below part type Feb. 1st, 2004 higher than
0404
SMT
SMT TO-252, (D Pak) — Jan. 1st, 2004 higher than
0401
pure tin (e3)
SOT-227B (miniBLOC) — n. a. all Ni
Scr
ew
Mou
nt
metal can, stud base DO-4/ DO-5/ TO-48/ TO-64/5 — n. a. All*) pure tin
‘) DO-5 shims (supplied as accessory) will be RoHS compliant by March 31, 2006 (Cr6+ replaced by Cr3+)
cont
*) no Ni underplate
DDDD2D2D2
9Efficiency Through Technology
STATUS RoHS – lead-free
Module Products 1
Outline Types (examples)
Outline Drawings #(IXYS short form catalogue 04/05)
Latest Date of Conversion to
Pb-Free Terminals
Pb-Free Date Codes
(yyww or yww)
Terminal finish
(JESD97)
Pin array (V1-Pack) VUO 52, VUB 72, VW2x …io1 47 Aug. 31, 2005 higher than 542 SnAg3Cu0.5*
Pin array (V2-Pack), VVZB120…io1; VUO/VUB,
VWO…NO1/2 48, 74 n. a. all Au with Ni
underplate (e4)
MMO, MLO…io1 60, 61 n. a. all Ag, no underplate (e4)
CBI 1 MWI, MUBW…A/E6K 49a n. a. all pure tin**)
CBI 2 & 3 MUBW, MWI …A/E7; …A/E8,
…E9 81, 77, 95 March 31, 2006 higher than 612 pure tin with
Ni underplatesold
erab
le p
in a
rray
s
ECO-PAC1/2 VII,VMO…P1, VUE…NO7 24, 25, 78 n. a. all Au with Ni
underplate (e4) * = Ag undercoat
** = no Ni undercoat
10Efficiency Through Technology
STATUS RoHS – lead-free
Module Products 2
Outline Types (examples)
Outline Drawings #(IXYS short form catalogue 04/05)
Latest Date of Conversion to
Pb-Free Terminals
Pb-Free Date Codes
(yyww or yww)
Terminal finish
(JESD97)
flexi
ble
flat l
eads
VUM24/33, VUC25/36, VVZ/ VVY…io1, VBE20…NO1 45, 46 n. a. all Ag, no
underplate (e4)
11Efficiency Through Technology
STATUS RoHS – lead-free
Module Products 3
Outline Types (examples)
Outline Drawings #(IXYS short form catalogue 04/05)
Latest Date of Conversion to
Pb-Free Terminals
Pb-Free Date Codes
(yyww or yww)
Terminal finish
(JESD97)
VBO…O2; VUO…NO3; VHF…io5; 40, 43, 44 n. a. all Ni
Plu
g Ty
pe
(fast
on)
VBO/VUO…NO8; VBO, VHF, VHO, VKO, VTO, VYK,
VTOF, VVZF…io7 41, 42, 57, 62 n. a. all Au with Ni
underplate (e4)
12Efficiency Through Technology
STATUS RoHS – lead-free
Schedule for the elimination of Cr6+ on washers and screws for modules
Part Types Fig. No.* Screw Type
Delivery as
Alternative Coating Material
Date of Conversion
TO-240 style, MII75…300
26, 27, 28, 33, 34 M5x10 option
ZY253 week 17 ‘05
MCC/MDD/MCD310/250/220 35, 36 M8x16 standard week 26 ‘05 MCC/MDD/MCD200/162/132 FRED modules, VMM650/1500,MII/MID/MDI400
29…32 80 M6x16 standard week 29 ‘05
MCC/MDC/MCD/MDD312/255, MDO/MCO450/500/600, HVL900
37…39, 69 M8x20 standard
Zn with Cr III finish
week 18 ‘05
*= see IXYS short form catalogue
13Efficiency Through Technology
STATUS RoHS – lead-free
Module Products 4
Outline Types (examples) Outline Drawings #
(IXYS short form catalogue 04/05)
Latest Date of Conversion to
Pb-Free Terminals
Pb-Free Date Codes
(yyww or yww)
Terminal finish
(JESD97)
MCC/MCD/MDD 26, 162, 310, 500…io1/NO1/N1 26 … 39, 80, 103 n. a. all
Scr
ew M
ount
VBO, VUO, VWO…NO7/io7 49 … 54, 63 n. a. all
Sn or Ni on tabs and
auxiliary pins
14Efficiency Through Technology
STATUS RoHS – lead-free
Package Type Conversion
date Lead Free later than Date Code
Terminal finish (JESD97)
Label Identifier
TO-251 I-Pak TO-262 I2-Pak
TO-220 TO-220 FP
Jan 1, 2004 0401 Pure Tin (e3)
TO-268 leaded Jul 1, 2004 04027 Sn/Ag/Cu solder dip (e1)
TO-3P TO-247 K Jan 1, 2004 0401 Pure Tin (e3)
TO-247 P Jul 1, 2004 04027 Sn/Ag/Cu solder dip (e1)
TO-264 S Jan 1, 2004 0401 Pure Tin (e3) TO-264 P
TO-220 ISOPLUS/PLUS
TO-247 ISOPLUS/PLUS
TO-264 ISOPLUS/PLUS
I4-PAK
04027
Thro
ugh
Hol
e Te
chno
logy
(TH
T)
TO-3 METAL CAN
Jul 1, 2004
0427
Sn/Ag/Cu solder dip (e1) su
ffix
"SN
" afte
r/bel
ow p
art t
ype
IXYS MOS & IGBT products
15Efficiency Through Technology
STATUS RoHS – lead-free
IXYS MOS & IGBT products
Package Type Conversion
date Lead Free later than Date Code
Terminal finish (JESD97)
Label Identifier
TO-252 D-PAK
TO-263 D2-PAK
Jan 1, 2004 0401
SMT
TO-268 Jul 1, 2004 0427
Pure Tin (e3) suffix "SN" after/below part type
Screw mount SOT-227 n.a. all Ni —
D2D2D2
DDD
16Efficiency Through Technology
STATUS RoHS - ICs
Package Type Conversion date
Lead Free later than Date Code
Terminal finish (JESD97) Label Identifier
8-pin DIP Pure Tin (e3) suffix "SN" after/below part type
18-pin DIP
5 pin TO-263
5-pin TO-220
8-pin SOP
16-pin SOP
Jul 1, 2004 0427
IXYS PWM controllers and MOSFET/IGBT Drivers
17Efficiency Through Technology
STATUS RoHS – lead-free labels - Discretes
How to discern easier between leaded and lead-free on IXYS products ?
For discrete components IXYS will apply this marking on the card boxes and containers (according to JESD97)
18Efficiency Through Technology
STATUS RoHS – lead-free labels – Module Products 1, 2, 3, 4
For modules with various kinds of connectors *) (like screws, fast-on, solderable pins etc.)
IXYS will apply this marking on the card boxes
*) These are modules that have lead-free external electrical connectors, but with internal high-lead solders as exempted by the RoHS
19Efficiency Through Technology
STATUS RoHS – lead-free labels – Module Products 1, 2, 4
For modules that are totally lead-free *) IXYS will apply this marking on the card boxes
*) according to the definition given under 3.5 of JESD97
top related