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User's GuideSLAU288A–August 2009–Revised May 2010
TAS5630DKD2EVM
This user’s guide describes the operation of the evaluation module for the TAS5630DKD 300W StereoFeedback Analog-Input Digital Amplifier from Texas Instruments. The user’s guide also providesmeasurement data and design information including the schematic, BOM, and PCB layout.
Contents1 Overview ..................................................................................................................... 3
1.1 TAS5630DKD2EVM Features .................................................................................... 31.2 PCB Key Map ...................................................................................................... 4
2 Quick Setup Guide .......................................................................................................... 52.1 Electrostatic Discharge Warning ................................................................................. 52.2 Unpacking the EVM ................................................................................................ 52.3 Power Supply Setup ............................................................................................... 62.4 Applying Input Signal .............................................................................................. 62.5 Speaker Connection ............................................................................................... 6
3 Protection .................................................................................................................... 73.1 Short-Circuit Protection and Fault-Reporting Circuitry ........................................................ 73.2 Fault Reporting ..................................................................................................... 7
4 TAS5630DKD2EVM Performance ........................................................................................ 74.1 THD+N vs Power (BTL – 4 Ω) ................................................................................... 94.2 THD+N vs Power (BTL – 8 Ω) ................................................................................... 94.3 THD+N vs Frequency (BTL –4 Ω) .............................................................................. 104.4 THD+N vs Frequency (BTL –8 Ω) .............................................................................. 104.5 THD+N vs Power (PBTL – 2 Ω) ................................................................................ 114.6 THD+N vs Frequency (PBTL – 2 Ω) ........................................................................... 114.7 FFT Spectrum with –60-dBFS Tone (BTL) .................................................................... 114.8 Idle Noise FFT Spectrum (BTL) ................................................................................ 124.9 FFT Spectrum With –60-dBFS Tone (PBTL) ................................................................. 124.10 Idle Noise FFT Spectrum (PBTL) .............................................................................. 134.11 Channel Separation (BTL ....................................................................................... 134.12 Frequency Response (BTL) ..................................................................................... 144.13 Frequency Response (PBTL) ................................................................................... 144.14 High-Current Protection (BTL) .................................................................................. 154.15 High-Current Protection (PBTL) ................................................................................ 154.16 Pop/Click (BTL) ................................................................................................... 164.17 Pop/Click (PBTL) ................................................................................................. 164.18 Output Stage Efficiency .......................................................................................... 17
5 Related Documentation from Texas Instruments ..................................................................... 175.1 Additional Documentation ....................................................................................... 18
Appendix A Design Documents ............................................................................................... 18
List of Figures
1 Integrated PurePath™ HD Amplifier System............................................................................ 4
2 Physical Structure for the TAS5630PHDEVM (Approximate Layout) ................................................ 5
3 THD+N vs Power (BTL – 4 Ω) ............................................................................................ 9
4 THD+N vs Power (BTL – 8 Ω) ............................................................................................ 9PurePath is a trademark of Texas Instruments.
1SLAU288A–August 2009–Revised May 2010 TAS5630DKD2EVM
Copyright © 2009–2010, Texas Instruments Incorporated
www.ti.com
5 THD+N vs Frequency (BTL – 4 Ω)...................................................................................... 10
6 THD+N vs Frequency (BTL – 8 Ω)...................................................................................... 10
7 THD+N vs Power (PBTL – 2 Ω) ......................................................................................... 11
8 THD+N vs Frequency (PBTL – 2 Ω) .................................................................................... 11
9 FFT Spectrum with –60-dBFS Tone (BTL)............................................................................. 12
10 Idle Noise FFT Spectrum (BTL) ......................................................................................... 12
11 FFT Spectrum with –60-dBFS Tone (PBTL)........................................................................... 13
12 Idle Noise FFT Spectrum (PBTL) ....................................................................................... 13
13 Channel Separation (BTL) ............................................................................................... 14
14 Frequency Response (BTL).............................................................................................. 14
15 Frequency Response (PBTL) ............................................................................................ 15
16 High-Current Protection (BTL) ........................................................................................... 15
17 High-Current Protection (PBTL) ......................................................................................... 16
18 Pop/Click (BTL) ............................................................................................................ 16
19 Pop/Click (PBTL) .......................................................................................................... 17
20 Output Stage Efficiency................................................................................................... 17
List of Tables
1 TAS5630DKD2EVM Specification ........................................................................................ 3
2 Recommended Supply Voltages .......................................................................................... 6
3 TAS5630 Warning/Error Signal Decoding ............................................................................... 7
4 General Test Conditions ................................................................................................... 7
5 Electrical Data ............................................................................................................... 8
6 Audio Performance ......................................................................................................... 8
7 Thermal Specification ...................................................................................................... 8
8 Physical Specifications ..................................................................................................... 8
9 Related Documentation from Texas Instruments ..................................................................... 18
2 TAS5630DKD2EVM SLAU288A–August 2009–Revised May 2010
Copyright © 2009–2010, Texas Instruments Incorporated
www.ti.com Overview
1 Overview
The TAS5630DKD2EVM PurePath™ HD customer evaluation module demonstrates the integrated circuitTAS5630DKD from Texas Instruments (TI).
The TAS5630DKD is a high-performance, integrated Stereo Feedback Analog-Input Digital AmplifierPower Stage designed to drive 4Ω speakers at up to 300W per channel. This amplifier requires only asimple passive demodulation filter to deliver high-quality, high-efficiency audio amplification.
This EVM is configured with 2 BTL channels and the possibility to apply either a single ended or adifferential analog input signal.
The OPA1632 is a High Performance Fully Differential Audio Op Amp designed to allow operation withsingle ended or differential input signals to the EVM.
This EVM is a complete stereo analog input 2 × 300 W power amplifier ready for evaluation and greatmusic.
Table 1. TAS5630DKD2EVM Specification
Key Parameters
Output stage supply voltage 25 V – 50 V
Number of channels 2 × BTL, 1 x PBTL
Load impedance 4–8 ΩOutput power, 4 Ω, 10% THD 310 W
Output powerr, 8 Ω, 10% THD 175 W
Dynamic Range >100 dB(A)
SE to Differential Amplifier OPA1632D
Output stage TAS5630DKD
Other features +15 V on-board switcher from PVDD supply
This document covers EVM specifications, audio performance and power efficiency measurementsgraphs, and design documentation that includes schematics, parts list, layout, and mechanical design.
1.1 TAS5630DKD2EVM Features• Stereo PurePath™ HD evaluation module.• Self-contained protection system (short circuit and thermal).
3SLAU288A–August 2009–Revised May 2010 TAS5630DKD2EVM
Copyright © 2009–2010, Texas Instruments Incorporated
+12 V Fan OutControl
2 x Analog Input 2 ChannelSpeaker Output
TAS5630DKD2EVM
MODULE
Power Supply
Overview www.ti.com
• Standard 1VRMS single ended line input or differential input.• Double-sided, plated-through PCB layout.
Figure 1. Integrated PurePath™ HD Amplifier System
1.2 PCB Key Map
Physical structure for the TAS5630DKD2EVM is illustrated in Figure 2.
4 TAS5630DKD2EVM SLAU288A–August 2009–Revised May 2010
Copyright © 2009–2010, Texas Instruments Incorporated
RESET(SW11)
+15V(J17)
+50V(J15)
LEFTSPEAKEROUTPUT
(J11)
RIGHTSPEAKEROUTPUT
(J13)
DIFF INPUT(J24)
DIFF INPUT(J25)
JUMPER1 JUMPER2
OU
TP
UT
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NE
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NE
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EF
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S(U
15 &
U16)
+12 V
FA
NR
egula
tor
+12 V
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tor
SE
LE
FT
INP
UT
(J20)
SE
RIG
HT
INP
UT
(J20)+12 V FAN
OUTCONTROL
(J22)
www.ti.com Quick Setup Guide
Figure 2. Physical Structure for the TAS5630PHDEVM (Approximate Layout)
2 Quick Setup Guide
This chapter describes the TAS5630DKD2EVM board in regards to power supply and system interfaces.The chapter provides information regarding handling and unpacking, absolute operating conditions, and adescription of the factory default switch and jumper configuration.
This section provides a step-by-step guide to configuring the TAS5630DKD2EVM for device evaluation
2.1 Electrostatic Discharge Warning
Many of the components on the TAS5630DKD2EVM are susceptible to damage by electrostatic discharge(ESD). Customers are advised to observe proper ESD handling precautions when unpacking and handlingthe EVM, including the use of a grounded wrist strap at an approved ESD workstation.
CAUTION
Failure to observe ESD handling procedures may result in damage to EVMcomponents.
2.2 Unpacking the EVM
On opening the TAS5630DKD2EVM package, ensure that the following items are included:
• 1 pc. TAS5630DKD2EVM board using one TAS5630DKD.
5SLAU288A–August 2009–Revised May 2010 TAS5630DKD2EVM
Copyright © 2009–2010, Texas Instruments Incorporated
+1
2V
Re
gula
tor
SE
LE
FT
INP
UT
(J20
)
SE
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HT
INP
UT
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RESET(SW11)
+15 V(J17)
+50 V(J15)
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Reg
ula
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DIFF INPUT(J24)
DIFF INPUT(J25)
+12V FANOUT
CONTROL(J22)
JUMPER1 JUMPER2
If a single ended input signal is applied please insert jumpers in theheader J24 and J25
Quick Setup Guide www.ti.com
• 1 pc. PurePath CD-ROM.
If any of the items are missing, contact the Texas Instruments Product Information Center nearest you toinquire about a replacement.
2.3 Power Supply Setup
To power up the EVM, one power supply are needed. An onboard switched voltage regulator is supplyingsystem power, logic and gate-drive. Power supply is connected to the EVM using connector J15.
NOTE: While powering up set switch SW11 to the RESET position.
Table 2. Recommended Supply Voltages
Description Voltage Limitations Current Requirement Cable
Output stage power supply 25 – 50 V 16 A J15 (marked +50V)
CAUTION
Applying voltages above the limitations given in may cause permanent damageto your hardware
NOTE: The length of power supply cable must be minimized. Increasing length of PSU cable isequal to increasing the distortion for the amplifier at high output levels and low frequencies.
2.4 Applying Input Signal
It is possible to apply either a single ended input signal to J20 and J21 or a differential input signal to J24and J25.
NOTE: If a single ended input signal is applied insert jumpers in the header J24 and J25.
2.5 Speaker Connection
CAUTION
Both positive and negative speaker outputs are floating and may not beconnected to ground (e.g., through an oscilloscope).
6 TAS5630DKD2EVM SLAU288A–August 2009–Revised May 2010
Copyright © 2009–2010, Texas Instruments Incorporated
www.ti.com Protection
3 Protection
This section describes the short-circuit protection and fault-reporting circuitry of the TAS5630 device.
3.1 Short-Circuit Protection and Fault-Reporting Circuitry
The TAS5630 is a self-protecting device that provides fault reporting (including high-temperatureprotection and short-circuit protection). The TAS5630 is configured in back-end auto-recovery mode, andtherefore; resets automatically after all errors (M1, M2, and M3 is set low); see the data sheet (SLES220)for further explanation. This mean that the device restart itself after an error occasion and report throughthe SD error signal.
3.2 Fault Reporting
The OTW and SD outputs from TAS5630 indicate fault conditions. See the TAS5630 data manual for adescription of these pins.
Table 3. TAS5630 Warning/Error Signal Decoding
SD OTW1 OTW2 Device Condition
0 0 0 High-temperature error and/or high-current error
0 0 1 Undervoltage lockout or high current error. 100°C temperature warning.
0 1 1 Undervoltage lockout or high-current error
1 0 0 125°C temperature warning
1 0 1 100°C temperature warning
1 1 1 Normal operation, no errors/warnings
The shutdown signals together with the temperature warning signal give chip-state information asdescribed in the Table 3. device fault-reporting outputs are open-drain outputs.
4 TAS5630DKD2EVM Performance
Table 4. General Test Conditions
General Test Conditions Notes
Output stage supply voltage: 50 V Laboratory power supply (EA-PS 7065-10A)
Load impedance: 4 and 8 ΩInput signal 1 kHz sine
Measurement filters AES17 and AUX0025
Note: These test conditions are used for all tests, unless otherwise specified.
7SLAU288A–August 2009–Revised May 2010 TAS5630DKD2EVM
Copyright © 2009–2010, Texas Instruments Incorporated
TAS5630DKD2EVM Performance www.ti.com
Table 5. Electrical Data
Electrical Data Notes/Conditions
Output power, 1% THD+N, 4 Ω: 250 W 1 kHz, TA = 25°C
Output power, 10% THD+N, 4 Ω: 310 W 1 kHz, TA = 25°C
Output power, 1% THD+N, 8 Ω: 140 W 1 kHz, TA = 25°C
Output power, 10% THD+N,8 Ω: 175 W 1 kHz, TA = 25°C
Maximum peak current: >16 A 1-kHz burst, 1 Ω, ROC = 22 kΩOutput stage efficiency: >90% 2 x channels, 4 ΩDamping factor: 27 1 kHz, relative to 4 Ω load
H-Bridge Supply current: 55 mA 1 kHz, input grounded
Idle power consumption: <3 W H-Bridge Supply, input grounded
Table 6. Audio Performance
Audio Performance Notes/Conditions
THD+N, 4 Ω: 1 W <0.05% 1 kHz
THD+N, 4 Ω: 10 W <0.04% 1 kHz
THD+N, 4 Ω: 50 W <0.02% 1 kHz
THD+N, 4 Ω: 100 W <0.03% 1 kHz
THD+N, 4 Ω: 200 W <0.40% 1 kHz
THD+N, 8 Ω: 1 W <0.04% 1 kHz
THD+N, 8 Ω: 10 W <0.03% 1 kHz
THD+N, 8 Ω: 50 W <0.02% 1 kHz
THD+N, 8 Ω: 100 W <0.10% 1 kHz
Dynamic Range: >100 dB Ref: rated power, A-weighted, AES17 filter, 2 ch avg
Noise Voltage: 320 mVrms A-weighted, AES17 filter
Click/Pop, DC step: <30 mV Mute/Unmute, No signal, 4 ΩChannel Separation: >89 dB 1 kHz
Frequency Response: ±0.5 dB 100 W / 8 Ω, unclipped
Table 7. Thermal Specification
Thermal Specification** THEATSINK* Notes/Conditions
Idle, all channels switching 30°C 1 kHz, 15 min, input grounded, TA = 25°C
2 x 31.3 W, 4 Ω (1/8 power) 45°C 1 kHz, 1 hour, TA = 25°C
2 x 250 W, 4 Ω 70°C 1 kHz, 5 min, TA = 25°C
*Measured on surface of heatsink
** During the thermal test the heat sink has been ventilated with a fan (NMB-MAT Type: 2410ML-04W-B50) connected to J22.
Table 8. Physical Specifications
Physical Specifications Notes/Conditions
PCB dimensions: 94 × 140 × 55 Width × Length × Height (mm)
Total weight: 400 gr Components + PCB + Heatsink + Mechanics
Note: All electrical and audio specifications are typical values.
8 TAS5630DKD2EVM SLAU288A–August 2009–Revised May 2010
Copyright © 2009–2010, Texas Instruments Incorporated
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www.ti.com TAS5630DKD2EVM Performance
4.1 THD+N vs Power (BTL – 4 Ω)
Figure 3. THD+N vs Power (BTL – 4 Ω)
4.2 THD+N vs Power (BTL – 8 Ω)
Figure 4. THD+N vs Power (BTL – 8 Ω)
9SLAU288A–August 2009–Revised May 2010 TAS5630DKD2EVM
Copyright © 2009–2010, Texas Instruments Incorporated
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TAS5630DKD2EVM Performance www.ti.com
4.3 THD+N vs Frequency (BTL –4 Ω)
Figure 5. THD+N vs Frequency (BTL – 4 Ω)
4.4 THD+N vs Frequency (BTL –8 Ω)
Figure 6. THD+N vs Frequency (BTL – 8 Ω)
10 TAS5630DKD2EVM SLAU288A–August 2009–Revised May 2010
Copyright © 2009–2010, Texas Instruments Incorporated
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www.ti.com TAS5630DKD2EVM Performance
4.5 THD+N vs Power (PBTL – 2 Ω)
Figure 7. THD+N vs Power (PBTL – 2 Ω)
4.6 THD+N vs Frequency (PBTL – 2 Ω)
Figure 8. THD+N vs Frequency (PBTL – 2 Ω)
4.7 FFT Spectrum with –60-dBFS Tone (BTL)
Reference voltage is 28.3 V. FFT size 16k.
11SLAU288A–August 2009–Revised May 2010 TAS5630DKD2EVM
Copyright © 2009–2010, Texas Instruments Incorporated
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TAS5630DKD2EVM Performance www.ti.com
Figure 9. FFT Spectrum with –60-dBFS Tone (BTL)
4.8 Idle Noise FFT Spectrum (BTL)
Input grounded – Reference voltage is 28.3 V. FFT size 16k.
Spurious tone at 52 kHz has it’s origin from the TL2575 switching voltage regulator.
Figure 10. Idle Noise FFT Spectrum (BTL)
4.9 FFT Spectrum With –60-dBFS Tone (PBTL)
Reference voltage is 28.3 V. FFT size 16k.
12 TAS5630DKD2EVM SLAU288A–August 2009–Revised May 2010
Copyright © 2009–2010, Texas Instruments Incorporated
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www.ti.com TAS5630DKD2EVM Performance
Figure 11. FFT Spectrum with –60-dBFS Tone (PBTL)
4.10 Idle Noise FFT Spectrum (PBTL)
Input grounded – Reference voltage is 28.3 V. FFT size 16k.
Spurious tone at 52 kHz has it’s origin from the TL2575 switching voltage regulator.
Figure 12. Idle Noise FFT Spectrum (PBTL)
4.11 Channel Separation (BTL
Channel 1 input signal is set corresponding to 100W / 8 ΩChannel 2 input is grounded. Reference voltage 28.3 Vrms.
13SLAU288A–August 2009–Revised May 2010 TAS5630DKD2EVM
Copyright © 2009–2010, Texas Instruments Incorporated
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TAS5630DKD2EVM Performance www.ti.com
Figure 13. Channel Separation (BTL)
4.12 Frequency Response (BTL)
Measurement bandwidth filter 80 kHz.
Figure 14. Frequency Response (BTL)
4.13 Frequency Response (PBTL)
Measurement bandwidth filter 80 kHz.
14 TAS5630DKD2EVM SLAU288A–August 2009–Revised May 2010
Copyright © 2009–2010, Texas Instruments Incorporated
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www.ti.com TAS5630DKD2EVM Performance
Figure 15. Frequency Response (PBTL)
4.14 High-Current Protection (BTL)
Input 1-kHz bursted signal, load 1 Ω.
Figure 16. High-Current Protection (BTL)
4.15 High-Current Protection (PBTL)
Input 1-kHz bursted signal, load 1 Ω.
15SLAU288A–August 2009–Revised May 2010 TAS5630DKD2EVM
Copyright © 2009–2010, Texas Instruments Incorporated
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TAS5630DKD2EVM Performance www.ti.com
Figure 17. High-Current Protection (PBTL)
4.16 Pop/Click (BTL)
No input signal applied. The measurement results are presented in frequency domain.
Figure 18. Pop/Click (BTL)
4.17 Pop/Click (PBTL)
No input signal applied. The measurement results are presented in frequency domain.
16 TAS5630DKD2EVM SLAU288A–August 2009–Revised May 2010
Copyright © 2009–2010, Texas Instruments Incorporated
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www.ti.com Related Documentation from Texas Instruments
Figure 19. Pop/Click (PBTL)
4.18 Output Stage Efficiency
Efficiency is tested with 2 BTL channels loaded 8 Ω.
Figure 20. Output Stage Efficiency
5 Related Documentation from Texas Instruments
Table 9 contains a list of data manuals that have detailed descriptions of the integrated circuits used in thedesign of the TAS5630DKD2EVM. The data manuals can be obtained at the URL http://www.ti.com.
17SLAU288A–August 2009–Revised May 2010 TAS5630DKD2EVM
Copyright © 2009–2010, Texas Instruments Incorporated
Appendix A www.ti.com
Table 9. Related Documentation from TexasInstruments
Part Number Literature Number
TAS5630 SLES220
OPA1632D SBOS286
LM317M SLVS297
TL2575HV-15I SLVS638
5.1 Additional Documentation1. System Design Considerations for True Digital Audio Power Amplifiers application report (SLAA117)2. Digital Audio Measurements application report (SLAA114)3. PSRR for PurePath Digital™ Audio Amplifiers application report (SLEA049)4. Power Rating in Audio Amplifiers application report (SLEA047)5. PurePath Digital™ AM Interference Avoidance application report (SLEA040)6. Click and Pop Measurements Technique application report (SLEA044)7. Power Supply Recommendations for DVD-Receivers application report (SLEA027)8. Implementation of Power Supply Volume Control application report (SLEA038)
Appendix A Design Documents
This appendix comprises design documents pertaining to the TAS5162DDV6EVM evaluation module. Thedocuments are presented in the following order.
• Schematic (4 pages)• Parts List (1 pages)• PCB Specification (1 page)• PCB Layers (6 pages)• Heat-Sink Drawing (1 page)
18 Design Documents SLAU288A–August 2009–Revised May 2010
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Page Title:
TIHome Audio Amplifiers
ALL RIGHTS RESERVEDTEXAS INSTRUMENTS INCORPORATED
Project:
File Name:
Date:
Engineer:
Page: of
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AUDIO/IMAGING GROUP
A3
3.00
Jonas L. Holm
Disclaimer
A846-SCH-001.DSN
TAS5615/30DKD2EVM
Wednesday, May 20, 2009 1 4
/ TAS5630DKD2EVM BOM 3.00
Rev:
Page Title:
TIHome Audio Amplifiers
ALL RIGHTS RESERVEDTEXAS INSTRUMENTS INCORPORATED
Project:
File Name:
Date:
Engineer:
Page: of
Size:
AUDIO/IMAGING GROUP
A3
3.00
Jonas L. Holm
Disclaimer
A846-SCH-001.DSN
TAS5615/30DKD2EVM
Wednesday, May 20, 2009 1 4
/ TAS5630DKD2EVM BOM 3.00
Rev:
Page Title:
TIHome Audio Amplifiers
ALL RIGHTS RESERVEDTEXAS INSTRUMENTS INCORPORATED
Project:
File Name:
Date:
Engineer:
Page: of
Size:
AUDIO/IMAGING GROUP
A3
3.00
Jonas L. Holm
Disclaimer
A846-SCH-001.DSN
TAS5615/30DKD2EVM
Wednesday, May 20, 2009 1 4
/ TAS5630DKD2EVM BOM 3.00
TAS5630DKD2EVM
Page1/4: Front Page and Schematic Disclaimer2/4: TAS5630 Amplifier
Design Name:
Version:Date:Design Engineer:
Audio Configuration:
Interfaces:
File Name: A846-SCH-001.DSN3.0019.May 2009Jonas L. Holm (jlh@ti.com)
PurePath HD Digital Amplifier Design1 x TAS5630DKD
Setup:
Type: Mass Market EVM
4 Ohm (BTL) Speaker Loads
TI
Copyright 2008 Texas Instruments, Inc - All rights reserved - The TI and PurePath Digital logos are trademarks of Texas Instruments.
Performance: 2 x 300 W / 4 Ohm (BTL) 10% THD+N> 102 dB Dynamic Range
4/4: Mechanics
J20-J21: RCA Connector for Analog Input
J15: Banana binding post for H-Bridge SupplyJ11, J13: Banana binding posts for speaker connection.
+50 V H-Bridge Supply Voltage
3/4: Input Stage
SCHEMATIC DISCLAIMERThe schematic information and materials ("Materials") provided here are provided by Texas Instruments Incorporated ("TI") as a service to its customers and/or suppliers, and may be used for informational purposes only, and only subject to the following terms. By downloading or viewing these Materials, you are signifying your assent to these terms.
1.) These evaluation schematics are intended for use for ENGINEERING DEVELOPMENT AND EVALUATIONPURPOSES ONLY and are not considered by Texas Instruments to be fit as a basis for establishing productionproducts or systems. This information may be incomplete in several respects, including but not limited to informationrelating to required design, marketing, and/or manufacturing-related protective considerations and product safety measures typically found in the end-product incorporating the goods.
2.) Accordingly, neither TI nor its suppliers warrant the accuracy or completeness of the information, text, graphics, links or other items contained within the Materials. TI may make changes to the Materials, or to the products described therein, at any time without notice. TI makes no commitment to update the Materials.
3.) TI assumes no liability for applications assistance, customer product design, software performance, or services that may be described or referenced in the Materials. The user assumes all responsibility and liability for proper and safe design and handling of goods. Accordingly, the user indemnifies TI from all claims arising from its use of the Materials.
4.) TI currently deals with various customers for products, and therefore our arrangement with the user will not be exclusive. TI makes no representations regarding the commercial availability of non-TI components that may be referenced in the Materials.
5.) No license is granted under any patent right or other intellectual property right of TI covering or relating to anycombination, machine, or process in which such TI products or services might be or are used. Except as expressly provided herein, TI and its suppliers do not grant any express or implied right to you under any patents, copyrights, trademarks, or trade secret information. 6.) Performance tests and ratings, to the extent referenced in the Materials, are measured using specific computersystems and/or components and reflect the approximate performance of TI products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing.
7.) Resale of TI's products or services with statements different from or beyond the parameters stated by TI for that product or service in official TI data books or data sheets voids all express and any implied warranties for the associated TI product or service, and is an unfair and deceptive business practice, and TI is not responsible for any such use.
8.) The Materials are copyrighted and any unauthorized use may violate copyright, trademark, and other laws. Youmay only download one copy for your internal use only, unless you are specifically licensed to do otherwise by TI inwriting. This is a license, not a transfer of title, and is subject to the following restrictions: You may not: (a) modify the Materials (including any associated warranties, conditions, limitations or notices) or use them for any commercialpurpose, or any public display, performance, sale or rental; (b) decompile, reverse engineer, or disassemble softwareMaterials except and only to the extent permitted by applicable law; (c) remove any copyright or other proprietary notices from the Materials; (d) transfer the Materials to another person. You agree to prevent any unauthorized copying of the Materials. TI may terminate this license at any time if you are in breach of the terms of this Agreement. Upon termination, you will immediately destroy the Materials.
9.) THE MATERIALS ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED WARRANTY OF ANY KIND INCLUDING WARRANTIES OF MERCHANTABILITY, NONINFRINGEMENT OF INTELLECTUAL PROPERTY, OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT SHALL TI OR ITS SUPPLIERS BE LIABLE FOR ANY DAMAGESWHATSOEVER (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESSINTERRUPTION, LOSS OF INFORMATION) ARISING OUT OF THE USE OF OR INABILITY TO USE THE MATERIALS, EVEN IF TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
NOTE1
Not Used
SCHEMATIC DISCLAIMERThe schematic information and materials ("Materials") provided here are provided by Texas Instruments Incorporated ("TI") as a service to its customers and/or suppliers, and may be used for informational purposes only, and only subject to the following terms. By downloading or viewing these Materials, you are signifying your assent to these terms.
1.) These evaluation schematics are intended for use for ENGINEERING DEVELOPMENT AND EVALUATIONPURPOSES ONLY and are not considered by Texas Instruments to be fit as a basis for establishing productionproducts or systems. This information may be incomplete in several respects, including but not limited to informationrelating to required design, marketing, and/or manufacturing-related protective considerations and product safety measures typically found in the end-product incorporating the goods.
2.) Accordingly, neither TI nor its suppliers warrant the accuracy or completeness of the information, text, graphics, links or other items contained within the Materials. TI may make changes to the Materials, or to the products described therein, at any time without notice. TI makes no commitment to update the Materials.
3.) TI assumes no liability for applications assistance, customer product design, software performance, or services that may be described or referenced in the Materials. The user assumes all responsibility and liability for proper and safe design and handling of goods. Accordingly, the user indemnifies TI from all claims arising from its use of the Materials.
4.) TI currently deals with various customers for products, and therefore our arrangement with the user will not be exclusive. TI makes no representations regarding the commercial availability of non-TI components that may be referenced in the Materials.
5.) No license is granted under any patent right or other intellectual property right of TI covering or relating to anycombination, machine, or process in which such TI products or services might be or are used. Except as expressly provided herein, TI and its suppliers do not grant any express or implied right to you under any patents, copyrights, trademarks, or trade secret information. 6.) Performance tests and ratings, to the extent referenced in the Materials, are measured using specific computersystems and/or components and reflect the approximate performance of TI products as measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of information to evaluate the performance of systems or components they are considering purchasing.
7.) Resale of TI's products or services with statements different from or beyond the parameters stated by TI for that product or service in official TI data books or data sheets voids all express and any implied warranties for the associated TI product or service, and is an unfair and deceptive business practice, and TI is not responsible for any such use.
8.) The Materials are copyrighted and any unauthorized use may violate copyright, trademark, and other laws. Youmay only download one copy for your internal use only, unless you are specifically licensed to do otherwise by TI inwriting. This is a license, not a transfer of title, and is subject to the following restrictions: You may not: (a) modify the Materials (including any associated warranties, conditions, limitations or notices) or use them for any commercialpurpose, or any public display, performance, sale or rental; (b) decompile, reverse engineer, or disassemble softwareMaterials except and only to the extent permitted by applicable law; (c) remove any copyright or other proprietary notices from the Materials; (d) transfer the Materials to another person. You agree to prevent any unauthorized copying of the Materials. TI may terminate this license at any time if you are in breach of the terms of this Agreement. Upon termination, you will immediately destroy the Materials.
9.) THE MATERIALS ARE PROVIDED "AS IS" WITHOUT ANY EXPRESS OR IMPLIED WARRANTY OF ANY KIND INCLUDING WARRANTIES OF MERCHANTABILITY, NONINFRINGEMENT OF INTELLECTUAL PROPERTY, OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT SHALL TI OR ITS SUPPLIERS BE LIABLE FOR ANY DAMAGESWHATSOEVER (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESSINTERRUPTION, LOSS OF INFORMATION) ARISING OUT OF THE USE OF OR INABILITY TO USE THE MATERIALS, EVEN IF TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
NOTE1
Not Used
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
/SD
OSC_IOM
READY
/OTW
OSC_IOP
L_IN_N
L_IN_P
R_IN_N
R_IN_P
/RESET
/SD
/OTW
READY
GND
GND
GND
GNDGND
GND GND
GND
GND
GNDGND
VREG
GND
VREG
GND
GND
GND
GND
GND
GND
+12V
+12V PVDD PVDD
GND
PVDD
PVDD
GND
GND
VREG
GND
PVDD
GND
GND
GND
GND
VREG
VREG GND
Rev:
Page Title:
TIHome Audio Amplifiers
ALL RIGHTS RESERVEDTEXAS INSTRUMENTS INCORPORATED
Project:
File Name:
Date:
Engineer:
Page: of
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AUDIO/IMAGING GROUP
A3
3.00
Jonas L. Holm
Main Schematic
A846-SCH-001.DSN
TAS5615/30DKD2EVM
Wednesday, May 20, 2009 2 4
/ TAS5630DKD2EVM BOM 3.00
Rev:
Page Title:
TIHome Audio Amplifiers
ALL RIGHTS RESERVEDTEXAS INSTRUMENTS INCORPORATED
Project:
File Name:
Date:
Engineer:
Page: of
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AUDIO/IMAGING GROUP
A3
3.00
Jonas L. Holm
Main Schematic
A846-SCH-001.DSN
TAS5615/30DKD2EVM
Wednesday, May 20, 2009 2 4
/ TAS5630DKD2EVM BOM 3.00
Rev:
Page Title:
TIHome Audio Amplifiers
ALL RIGHTS RESERVEDTEXAS INSTRUMENTS INCORPORATED
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Date:
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AUDIO/IMAGING GROUP
A3
3.00
Jonas L. Holm
Main Schematic
A846-SCH-001.DSN
TAS5615/30DKD2EVM
Wednesday, May 20, 2009 2 4
/ TAS5630DKD2EVM BOM 3.00
LEFT
4 OHM BTLSPEAKEROUTPUT
RIGHT
4 OHM BTLSPEAKEROUTPUT
High Powersupply
50V
GND
OptionalSync signal
R29
1.5R
R29
1.5R1 2
C3133nFC3133nF
21
C17
10uF
C17
10uF
1 2
SW1
Switch
SW1
Switch
1
3
6
45
2
R51
100R
R51
100R
12
R19
100R
R19
100R
12
C13
100nF
C13
100nF
21
C431nFC431nF
21
C52680nF
C52680nF
21
C482.2uFC482.2uF
21
C322.2uFC322.2uF
21
J11
Red and black banana socket
J11
Red and black banana socket
1
2
R59
100R
R59
100R
12
J13
Red and black banana socket
J13
Red and black banana socket
1
2
C20
330pF
C20
330pF
2 1
C72100pF
C72100pF
21
L117uHL117uH
1 2
R31
1.5R
R31
1.5R1 2
R40
100R
R40
100R
12
C4610nFC46
10nF
21
C25
33nF
C25
33nF
21
R18
100R
R18
100R
12
C22100nFC22100nF
21
C302.2uF
C302.2uF
21
C331000uF
C331000uF
12
C57
47uF
C57
47uF
12
R15
10k
R15
10k12
J15
Red and black banana socket
J15
Red and black banana socket
1
2
C59100pF
C59100pF
21
C15
10uF
C15
10uF
1 2
C4510nFC45
10nF
21
C351000uFC351000uF
12
R333.3RR33
3.3R
12C40
1nFC401nF
21
C37680nF
C37680nF
21
R14
Not Used
R14
Not Used12
C361000uF
C361000uF
12
R3947kR3947k
12
C282.2uF
C282.2uF
21
R353.3RR35
3.3R
12
C4410nFC44
10nF
21
C38680nFC38680nF
21
C39680nFC39680nF
21
C19100nFC19100nF
21
L147uHL147uH
1 2
J19
Header
J19
Header
12
C262.2uFC262.2uF
21
C21100nFC21100nF
21
C29 33nFC29 33nF2 1
C4710nFC47
10nF
21
C14
10uF
C14
10uF
1 2
C23100nFC23100nF
21
R17
100R
R17
100R12
C411nFC411nF
21
C1810uFC1810uF
12
C421nFC421nF
21
U11
TAS5630DKD
U11
TAS5630DKD
PSU_REF1
VDD2
OC_ADJ3
/RESET4
C_STARTUP5
INPUT_A6
INPUT_B7
VI_CM8
GND9
AGND10
VREG11
INPUT_C12
INPUT_D13
FREQ_ADJ14
OSC_IO+15
OSC_IO-16
/OTW18 OUT_D 27
OUT_D 28
GND_D 29
GND_C 30
OUT_C 31
PVDD_C 32
BST_C 33
BST_B 34
PVDD_B 35
OUT_B 36
GND_B 37
GND_A 38
OUT_A 39
OUT_A 40
/SD17
GVDD_AB 44
BST_A 43
PVDD_A 42
PVDD_A 41
M120
M221
M322 GVDD_CD 23
BST_D 24
PVDD_D 25
READY19 PVDD_D 26
C49
10nF
C49
10nF
21
R363.3RR36
3.3R
12
C27 33nFC27 33nF2 1
C60100pF
C60100pF
21
C58100pF
C58100pF
21
SW2
Switch
SW2
Switch
1
3
6
45
2
C73100pFC73100pF
21
L137uHL137uH
1 2
C16
10uF
C16
10uF
1 2
R11
100R
R11
100R
12
R37
3.3R
R37
3.3R
1 2
C24100nF
C24100nF
21
L127uHL127uH
1 2
C341000uFC341000uF
12
R52
100R
R52
100R
12
R12
24k
R12
24k
12
R22
100R
R22
100R
12
C12
1nF
C12
1nF
2 1
C11
4.7nF
C11
4.7nF
2 1
R343.3RR34
3.3R
12
R16
100R
R16
100R12
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
/OTW
/RESET
R_IN_N
R_IN_P
/SD
READY
L_IN_N
L_IN_P
+15V
GND
GND
GND GND
GND
GND GND
+12V
GND
GND
GND GND
+12V
+15V
GND GND
+12V
GND GND
GND GND
GND
+12V
GND
GND
GND
+12V
GND
GND
+15VPVDD
GND
Rev:
Page Title:
TIHome Audio Amplifiers
ALL RIGHTS RESERVEDTEXAS INSTRUMENTS INCORPORATED
Project:
File Name:
Date:
Engineer:
Page: of
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AUDIO/IMAGING GROUP
A3
3.00
Jonas L. Holm
Input Stage
A846-SCH-001.DSN
TAS5615/30DKD2EVM
Wednesday, May 20, 2009 3 4
/ TAS5630DKD2EVM BOM 3.00
Rev:
Page Title:
TIHome Audio Amplifiers
ALL RIGHTS RESERVEDTEXAS INSTRUMENTS INCORPORATED
Project:
File Name:
Date:
Engineer:
Page: of
Size:
AUDIO/IMAGING GROUP
A3
3.00
Jonas L. Holm
Input Stage
A846-SCH-001.DSN
TAS5615/30DKD2EVM
Wednesday, May 20, 2009 3 4
/ TAS5630DKD2EVM BOM 3.00
Rev:
Page Title:
TIHome Audio Amplifiers
ALL RIGHTS RESERVEDTEXAS INSTRUMENTS INCORPORATED
Project:
File Name:
Date:
Engineer:
Page: of
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AUDIO/IMAGING GROUP
A3
3.00
Jonas L. Holm
Input Stage
A846-SCH-001.DSN
TAS5615/30DKD2EVM
Wednesday, May 20, 2009 3 4
/ TAS5630DKD2EVM BOM 3.00
+12VFAN
2 speed FAN Control& Temp Indicator
125 degCChip temp
RE
AD
Y
Shut
dow
n
RES
ET
ON/OFF ControlSTATUS MONITOR12V lin regulator
Optional
LEFT Input
RIGHT Input
Single ended or ballanced input1st order high pass at 1.6Hz& 2nd order active low pass at 80kHz
Jumper J24 & J25 pin 1-2For single ended input
For ballanced input use J24 & J25
+15V Switcher
R434.7kR434.7k
12
D14RedD14
Red
C76470pFC76470pF
21
J22
Header
J22
Header
12
Q162N7002Q162N70021
32
R702.2kR702.2k
1 2
U12 LM317U12 LM317
IN3 OUT 2
AD
J1
OUT 4
R712.2kR712.2k
1 2
C62100nFC62100nF
21
R66 10.0kR66 10.0k1 2
C671nFC671nF
21
C75470pFC75470pF
21
R53
0R
R53
0R
12
V-
V+
V_OCM
EN
U16OPA1632
V-
V+
V_OCM
EN
U16OPA1632
1
2
3
4
5
67
8
C85330uF63V
C85330uF63V
12
R464.7kR464.7k
12
R47560RR47560R
12
C7010uFC7010uF
12
J20
Phono socket
J20
Phono socket
234
1
R54
0R
R54
0R
12
D16Red
D16Red
C56100nFC56100nF
21
C54100nFC54100nF
21
D11GreenD11Green
C7110uFC7110uF
12
R73100kR73100k
12
U17TL2575HV-15IU17TL2575HV-15I
OUTPUT 2VIN1
GN
D3
FB 4
ON
/OFF
5
GN
D-P
AD
6
C5510uF
C5510uF
12
C84
100nF
C84
100nF
21
C5310uF
C5310uF
12
R692.2kR692.2k
1 2
Q142N7002Q142N70021
32
R42560RR42560R
12
R642.2kR642.2k
1 2R652.2kR652.2k
1 2
C6410uF
C6410uF
12
R7510RR7510R
12
R481.2kR481.2k
12
R632.2kR632.2k
1 2
C77 150pFC77 150pF
21
C82 150pFC82 150pF
21
J21
Phono socket
J21
Phono socket
234
1
R501.8k
R501.8k
12
C681nFC681nF
21
R55
0R
R55
0R
12
C6610uFC6610uF
12
C79
100nF
C79
100nF
21C6910uFC6910uF
12
R672.2kR672.2k
1 2
R56
0R
R56
0R
12
R612.2kR612.2k
1 2
R74100kR74100k
12
R72 10.0kR72 10.0k1 2
Q112N7002Q112N70021
32
C6310uFC6310uF
12
C86470uF16V
C86470uF16V
12
R58
0R
R58
0R
12
C61470uF
C61470uF
12
D13Red
D13Red
R68 10.0kR68 10.0k
1 2
J24Shunt Header
J24Shunt Header
1
2
3
R414.7k
R414.7k
12
C65100nFC65100nF
21
C502.2uF100V
C502.2uF100V
21
R57
0R
R57
0R
12
L151mHL151mH
1 2
C78 150pFC78 150pF21
V-
V+
V_OCM
EN
U15OPA1632
V-
V+
V_OCM
EN
U15OPA1632
1
2
3
4
5
67
8
J25Shunt Header
J25Shunt Header
1
2
3
R454.7kR454.7k
12
D1830BQ060D1830BQ060
Q132N7002Q132N70021
32
SW11
Switch
SW11
Switch
1
3
6
45
2
R62 10.0kR62 10.0k
1 2
U13
LM317
U13
LM317
IN3 OUT 2
AD
J1
OUT 4
C83 150pFC83 150pF21
5
5
4
4
3
3
2
2
1
1
D D
C C
B B
A A
GND
Rev:
Page Title:
TIHome Audio Amplifiers
ALL RIGHTS RESERVEDTEXAS INSTRUMENTS INCORPORATED
Project:
File Name:
Date:
Engineer:
Page: of
Size:
AUDIO/IMAGING GROUP
A4
3.00
Jonas L. Holm
Mechanics
A846-SCH-001.DSN
TAS5615/30DKD2EVM
Wednesday, May 20, 2009 4 4
/ TAS5630DKD2EVM BOM 3.00
Rev:
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TIHome Audio Amplifiers
ALL RIGHTS RESERVEDTEXAS INSTRUMENTS INCORPORATED
Project:
File Name:
Date:
Engineer:
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AUDIO/IMAGING GROUP
A4
3.00
Jonas L. Holm
Mechanics
A846-SCH-001.DSN
TAS5615/30DKD2EVM
Wednesday, May 20, 2009 4 4
/ TAS5630DKD2EVM BOM 3.00
Rev:
Page Title:
TIHome Audio Amplifiers
ALL RIGHTS RESERVEDTEXAS INSTRUMENTS INCORPORATED
Project:
File Name:
Date:
Engineer:
Page: of
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AUDIO/IMAGING GROUP
A4
3.00
Jonas L. Holm
Mechanics
A846-SCH-001.DSN
TAS5615/30DKD2EVM
Wednesday, May 20, 2009 4 4
/ TAS5630DKD2EVM BOM 3.00
MECHANICS
JUMPER2
Black
JUMPER2
Black
WASHER20
Not Used
WASHER20
Not Used
SCREW14
M3x6
SCREW14
M3x6
STANDOFF14
M3x16
STANDOFF14
M3x16
F11
Not Used
F11
Not Used
1 1
WASHER12
M3
WASHER12
M3
WASHER16
M3
WASHER16
M3
PCB
PCB11
A846-PCB-001_3.00
PCB
PCB11
A846-PCB-001_3.00
MH13
Mounting Hole
MH13
Mounting Hole
1MH16
Mounting Hole
MH16
Mounting Hole
1WASHER14
M3
WASHER14
M3
MH15
Mounting Hole
MH15
Mounting Hole
1
STANDOFF13
M3x16
STANDOFF13
M3x16
MH14
Mounting Hole
MH14
Mounting Hole
1
WASHER15
M3
WASHER15
M3
WASHER13
M3
WASHER13
M3
SCREW16
M3x6
SCREW16
M3x6
SCREW13
M3x6
SCREW13
M3x6
F14
Not Used
F14
Not Used
1 1
MH11
Mounting Hole
MH11
Mounting Hole
1
STANDOFF12
M3x16
STANDOFF12
M3x16
HEAT SINK
HEATSINK11
TIC-HSINK-061_2.00HEAT SINK
HEATSINK11
TIC-HSINK-061_2.00
SCREW12
M3x6
SCREW12
M3x6
WASHER21
Not Used
WASHER21
Not Used
F13
Not Used
F13
Not Used
1 1 JUMPER1
Black
JUMPER1
Black
SCREW15
M3x6
SCREW15
M3x6
MH12
Mounting Hole
MH12
Mounting Hole
1
WASHER11
M3
WASHER11
M3
SCREW11
M3x6
SCREW11
M3x6
STANDOFF11
M3x16
STANDOFF11
M3x16
F12
Not Used
F12
Not Used
1 1
TAS5630DKD2EVM Parts List (3.00).xls
TIQty Part Reference Description Manufacture First Mfr P/N6 R53 R54 R55 R56 R57 R58 0R / 5% / 0603 Thick Film Resistor Yageo RC0603JR-070RL10 R51 R52 R59 100R / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-07100RL1 R15 10k / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-0710KL4 R62 R66 R68 R72 10.0k / 100mW / 1% / 0603 Thick Film Resistor Yageo RC0603FR-0710KL2 R73 R74 100k / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-07100KL1 R75 10R / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-0710RL1 R48 1.2k / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-071K2L
2 R29 R31 1.5R / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-071R5L1 R50 1.8k / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-071K8L
8R61 R63 R64 R65 R67 R69 R70 R71 2.2k / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-072K2L
1 R12 24k / 100mW / 1% / 0603 Thick Film Resistor Yageo RC0603FR-0724KL
5 R33 R34 R35 R36 R37 3.3R / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-073R3L4 R41 R43 R45 R46 4.7k / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-074K7L1 R39 47k / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-0747KL2 R42 R47 560R / 100mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-07560RL
5 C44 C45 C46 C47 C49 Ceramic 10nF / 100V / 20% X7R 0805 Capacitor BC Components 0805B103M101NT4 C40 C41 C42 C43 Ceramic 1nF / 100V / 10% NP0 1206 Capacitor BC Components 1206N102K101NT
6 C26 C28 C30 C32 C48 C50Ceramic 2.2uF / 100V / 20% X7R 1210 Capacitor Murata GRM32ER72A225KA35L
1 C12 Ceramic 1nF / 50V / 10% NP0 0805 Capacitor BC Components 0805N102K500NT
12C13 C19 C21 C22 C23 C24 C54 C56 C62 C65 C79 C84 Ceramic 100nF / 16V / 20% X7R 0603 Capacitor Vishay VJ0603Y104MXJ
4 C25 C27 C29 C31 Ceramic 33nF / 25V / 20% X7R 0603 Capacitor BC Components 0603B333M250NT
1 C11 Ceramic 4.7nF / 50V / 20% X7R 0603 Capacitor BC Components 0603B472M500NT
5 C58 C59 C60 C72 C73 Ceramic 100pF / 50V / 10% NP0 0603 Capacitor BC Components 0603N101K500NT2 C67 C68 Ceramic 1nF / 50V / 10% NP0 0603 Capacitor BC Components 0603N102K500NT
4 C77 C78 C82 C83 Ceramic 150pF / 50V / 10% NP0 0603 Capacitor BC Components 0603N151K500NT
1 C20 Ceramic 330pF / 50V / 10% NP0 0603 Capacitor BC Components 0603N331K500NT
2 C75 C76 Ceramic 470pF / 50V / 10% NP0 0603 Capacitor BC Components 0603N471K500NT
4 C37 C38 C39 C52Metal Film 680nF / 250V / 20% Polypropylene 15mm (W:8mm L:18mm) Capacitor Wima MKP 4 0.68uF/20%/250Vdc PCM15
13C14 C15 C16 C17 C18 C53 C55 C63 C64 C66 C69 C70 C71
Electrolytic 10uF / 16V / 20% Aluminium 2mm ø5mm M Series - General Purpose Capacitor Panasonic ECA1CM100
4 C33 C34 C35 C36
Electrolytic 1000uF / 63V / 20% Aluminium 7.5mm ø16mm FC Series - Low Impedance Capacitor Panasonic EEUFC1J102
1 C85Electrolytic 330uF / 63V / 20% Aluminium 5mm ø10mm FC Series - Low Impedance Capacitor Panasonic EEUFC1J331L
1 C57Electrolytic 47uF / 63V / 20% Aluminium 5mm ø10mm Capacitor BC Components 2222 136 68479
1 C86Electrolytic 470uF / 16V / 20% Aluminium 3.5mm ø8mm Low ESR Capacitor Rubycon 16ZL470M8x16
1 C61Electrolytic 470uF / 25V / 20% Aluminium 3.5mm ø8mm FC Series - Low Impedance Capacitor Panasonic EEUFC1E471L
1 L151mH / 0.55A 20% (1.68R) Ferrite Inductor (12.8x12.8x8.0) Epcos B82477G4105M000
4 L11 L12 L13 L14 7uH / 5A (30mR) Low THD+N Ferrite Inductor Fe-Tronic TIC-INDC-026 (1.00)1 D18 3A / 60V Schottky 30BQ060 Diode (SMC) Int. Rectifier 30BQ060PBF3 D13 D14 D16 Light Emitting Red Red LED (0603) Toshiba TLSU10081 D11 Light Emitting Green Green LED (0603) Toshiba TLGU10084 Q11 Q13 Q14 Q16 0.115A / 60V N-ch Power 2N7002 Mosfet (SOT- Fairchild 2N7002
1 U11TAS5630DKD / Stereo Analog Audio PWM Power Output Stage (PSOP3-44) Texas Instruments TAS5630DKD
2 U15 U16OPA1632 / High-Performance, Fully-Differential Audio Opamp (SO8) Texas Instruments OPA1632D
2 U12 U13LM317 / 0.5A Positive Adjustable Regulator (DCY) Texas Instruments LM317MDCY
1 U17TL2575HV-15I / 15V/1-A SIMPLE STEP-DOWN SWITCHING VOLTAGE REGULATORS (KTT5) Texas Instruments TL2575HV-15IKTTR
6SCREW11 SCREW12 SCREW13 SCREW14 SCREW15 SCREW16 M3x6 Pan Head, Pozidriv, A2 Screw Bossard BN 81882 M3x6
6
WASHER11 WASHER12 WASHER13 WASHER14 WASHER15 WASHER16 M3 Stainless Steel Spring Washer Bossard BN 760 M3
1 of 2 5.Aug. 2009 / JSV
TAS5630DKD2EVM Parts List (3.00).xls
TI4
STANDOFF11 STANDOFF12 STANDOFF13 STANDOFF14 M3x16 nickel plated brass Stand-off Bossard BN 3320 M3x16
2 J19 J222 pins / 1 row / 2.54mm Pitch Vertical Male Friction lock Pin header Header Molex 22-27-2021
2 JUMPER1 JUMPER22 pins / 1 row / 2.54mm Pitch Horizontal Female Black Shunt Black Molex 15-29-1024
2 J20 J21 Horizontal Female w. Switch Coax Phono socket Chunfeng RJ843-4W
3 J11 J13 J152 pins / Vertical Female Banana Red and black banana socket Cliff TPP-3CT
2 J24 J253 pins / 1 row / 2.54mm Pitch Vertical Male Shunt Header Shunt Header Samtec TSW-107-07-T-T
3 SW1 SW2 SW11 Switch DPDT PCB Mount Switch NKK-Nikkai G-22-AP
1 PCB11A846-PCB-001_3.00 / TAS5630DKD2EVM Printed Circuit Board (ver. 3.00) Printline A846-PCB-001(3.00)
1 HEATSINK11TIC-HSINK-061_2.00 / Heatsink for 1 DKD44 package, length 78 mm Phonotech TIC-HSINK-061(2.00)
2 of 2 5.Aug. 2009 / JSV
TI A846-PCBSPEC-001(3.00)
Jonas Holm
Page 1 of 1
TAS5630DKD2EVM PCB SPECIFICATION
Version 3.00
BOARD IDENTIFICATION: A846-PCB-001(3.00)
BOARD TYPE: DOUBLE-SIDED PLATED-THROUGH BOARD
LAMINATE TYPE: FR4
LAMINATE THICKNESS: 1.6mm
TOP LAYER COPPER THICKNESS: 70μm (INCL. PLATING EXTERIOR LAYER)
BOTTOM LAYER COPPER THICKNESS: 70μm (INCL. PLATING EXTERIOR LAYER)
COPPER PLATING OF HOLES: >25μm
MINIMUM HOLE DIAMETER 0.3 mm
SILKSCREEN COMPONENT SIDE: WHITE - REMOVE SILKSCREEN FROM SOLDER AREA & PRE-TINNED AREAS
SILKSCREEN SOLDER SIDE: None
SOLDER MASK COMPONENT SIDE: GREEN
SOLDER MASK SOLDER SIDE: GREEN
PROTECTIVE COATING: SOLDER COATING AND CHEMICAL SILVER ON FREE COPPER
ELECTRICAL TEST: PCB MUST BE ELECTRICAL TESTED
MANUFACTURED TO: PERFAG 2E (www.perfag.dk)
APERTURE TABLE: PERFAG 10A (www.perfag.dk)
BOARD SIZE: 95 x 140 mm
Aprox. Number of holes 410
COMMENTS: SEE DRILL INFORMATION FILE (A846-PCB-001(3.00).pdf)
EVALUATION BOARD/KIT IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must haveelectronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be completein terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmentalmeasures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit doesnot fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling(WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days fromthe date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYERAND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OFMERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claimsarising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and allappropriate precautions with regard to electrostatic discharge.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANYINDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents orservices described herein.
Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. Thisnotice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/orsafety programs, please contact the TI application engineer or visit www.ti.com/esh.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, orcombination in which such TI products or services might be or are used.
FCC Warning
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSESONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radiofrequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which aredesigned to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments maycause interference with radio communications, in which case the user at his own expense will be required to take whatever measures maybe required to correct this interference.
EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the power supply voltage range of 0 V to 50 V.
Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questionsconcerning the input range, please contact a TI field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification,please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than 90°C. The EVM is designed to operateproperly with certain components above 125°C as long as the input and output ranges are maintained. These components include but arenot limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identifiedusing the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation,please be aware that these devices may be very warm to the touch.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2008, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.
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TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.
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Amplifiers amplifier.ti.com Audio www.ti.com/audio
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DSP dsp.ti.com Computers and www.ti.com/computersPeripherals
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