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May 4, 2011 1May 4, 2011 1
REDEFINING MIXED SYSTEM-ON-CHIP DESIGN
Rajeev MadhavanCEO and Chairman, Magma Design Automation
May 4, 2011 2May 4, 2011 2
System-on-Chip Complexity Continues to Rise
• More functionality
• Much more Analog IP
• Large, complex digital blocks
• Shorter time-to-market
Motorola DroidX
Communication
Memory
Power
Software
Multimedia
GPS
Computing
NFC
Connectivity
Gyrometer
May 4, 2011 3May 4, 2011 3
SoC Example - 28nm 4G/3G Wireless Mobile Chip
• Chip Stats:– Instances: ~20 Million
• Top Level: 3.5 Million
– Blocks: 25-30• Block sizes: 100K – 1M
cells
– Clocks: >70– Frequency: 400MHz-
1.5GHz – Utilization: 70-80%– Timing Scenarios: 70-80
• 10 Modes• 7 Corners
Components
Application Processor
RF Interfaces
ADCDAC
Video CODEC
Display & Imaging Support
Modem
A/R Interfaces
GSMGPS
Audio CODEC
Graphics
Memory
Connectivity
SDIOUSBSIM
GPIO
Internal Functions
Clock GenerationPower Optimization
SecurityPLL
Analog Digital Mixed
May 4, 2011 4May 4, 2011 4
Challenges to Build this SoC
• Increasing Analog IP
• Increasing Digital Capacity & Complexity
• Final Signoff Closure
May 4, 2011 5May 4, 2011 5
Complexity Is Ever Increasing For Analog IP
• Complexity of analog IP has increased multiple fold• Current design flows are manual and very iterative.
Not scalable for increasing complexity of analog IP designed using advance process nodes
• Productivity has to be improved for next generation analog IP
May 4, 2011 6May 4, 2011 6
Analog IP Design Flows Have Not Evolved
• Entire design flow must be manually repeated to accommodate any change in: – Design
Specifications & Constraints
– Process node– Target Fab
Traditional Iterative Analog Design
Each new derivative requires nearly complete redesign
Schematic Capture
Simulation
Manual Layout
DRC/LVSExtraction
May 4, 2011 7May 4, 2011 7
New Model-Based Analog Design
Circuit Models Customized Analog IP
Optimization&
Placement/Routing
Target Specs
Process Models (PDK)
OpampsVoltage Reg
Charge Pump
SerDes
Layout
Optimization Goals
May 4, 2011 8May 4, 2011 8
Analog Optimization – Multiple Specs in a Week Spec - TTN / FFC / SSC / FFH / SSH Spec 1 Spec 2 Spec 3 Spec 4
Reference frequency range 16-200MHz 6-150MHz 27MHz 25-250MHz
VCO frequency range 1-2GHz 0.4-1.2GHz 0.81-1.62GHz 0.125-1.25GHz
PLL area 310m x 310m 295m x 295m 538m x 538m 628m x 628m
Power 5.9mW 2.2mW 16.5mW 10mW
Period jitter (Tpj @ Fvco,max) 1 1.7ps 2.5ps 0.5ps 0.95ps
Tpj (5% Vdd step @ Fvco,max) 16ps 17ps 15ps 19ps
Acc. jitter (Taj @ Fvco,max) 1 6.4ps 6.8ps 4.8ps 2.9ps
Taj (5% Vdd step @ Fvco,max) 89ps 126ps 191ps 91ps
Static phase error 1 53ps 82ps 68ps 87ps
Acquisition time 5.6us 19us 3.2us 30us
PLL bandwidth (typ) 1.4MHz 0.5MHz 1.9MHz 0.83MHz
Main loop filter capacitor 258pF 282pF 600pF 1200pF
DC VCO power-supply rejection -35dB -34dB -42dB -36dB
PLL’s generated for many specs simultaneously (Frequency ranges, Jitter, Bandwidth, Area, Power etc.)
May 4, 2011 9May 4, 2011 9
Analog Optimization – Power vs Area
• Analog optimization provides quick tradeoffs of power and area for design exploration
• Example: Regulator circuit– Analog optimization characterized on 5 corners– Tradeoff 40% power reduction vs 50% area reduction
Performance Hand Design Optimization for Power Optimization for AreaArea (um2) 20000 20000 10000 (-50%)Max Current (mA) 13.6 8.2 (-40%) 15.1 (+11%)Min DC Gain (dB) 35 40 345Min PM (degree) 84 86 77Min BW (Hz) 1.9M 2.5M 5.7MMax PSRR (dB) -11 -13 -5
May 4, 2011 10May 4, 2011 10
Challenges to Build this SoC
• Increasing Analog IP
• Increasing Digital Capacity & Complexity
• Final Signoff Closure
May 4, 2011 11May 4, 2011 11
Digital Designs: Increasing CapacityDramatic throughput needed
1999 2007 2009 2010 2012 2014100
1000
10000
100000
Flat
Blo
ck C
apac
ity(0
00s
of In
stan
ces)
250K
500K
3M
Capacity-DrivenProductivity Gap
10M
Achievable Flat Block Capacity
Needed Flat Block Capacity
1M
May 4, 2011 12May 4, 2011 12
Limitations in Tool Capacity Create Risk
• Limitations force design teams to artificially break up design– 5 blocks, 10 blocks, 20 blocks, 50 blocks or more?
• Partitioning increases complexity – more iterations!!!– Requires budgeting, clocks and interface timing closure
• Introduces schedule risks, requires more engineering resources
1M
500K 500K
1M
May 4, 2011 13May 4, 2011 13
Multi-Threading: Good, but not Good Enough
Typical “sweet spot” for EDA multi-threading
Number of cores/threads
May 4, 2011 14May 4, 2011 14
Current Digital Design Methodology
80M Cells
May 4, 2011 15May 4, 2011 15
4-5M
Place & Route
Place & Route
Place & Route
Place & Route
Place & RouteDistributed
Implementation(Master Process)
1 – ImplementationEngineer
New Distributed Digital Design
• Multi-million cells/day throughput• Design capacity per engineer up to 10M cells, flat!
May 4, 2011 16May 4, 2011 16
Benefit of Distributed Design
• Greatly increases designer productivity
• Leverages existing hardware and P&R licenses
• Implements bigger designs faster using existing engineering resources
May 4, 2011 17May 4, 2011 17
Design Example
• ~4M cells hierarchical design• Redefined as flat and distributed across 8 servers
Stage WNS (ps)
TAT (hrs)
Peak Mem (Gb)
Original Goal -200 168.0 <70Final Results -200 61.7 51
May 4, 2011 18May 4, 2011 18
Challenges to Build this SoC
• Increasing Analog IP
• Increasing Digital Capacity & Complexity
• Final Signoff Closure
May 4, 2011 19May 4, 2011 19
Final Signoff Closure Too LongP&R Timing Closure ECOs
Signoff
Mask
Prep
Metal Fill Insertion
Extraction
Timing
LogicalECO
ECOP&R
DRC Checking
8-20Iterations
• 4-17 hoursExtraction STAR RC
• 3-7 hoursSTA PT & PTSI
• 1-7 hoursMetal Fill Calibre
• 5-15 hoursFile Transfers:
• 5- 80 hoursLogical ECO :
• 3-24 hoursECO P&R:
3-5 days per iteration!Final Netlist Closure: 100 days!
~50 days ~50 days
May 4, 2011 20May 4, 2011 20
SignoffVerification
New ZERO ECO Approach
• Best-in-class runtime for each tool Improves TAT of each iteration
• Integrated flow Fewer iterations
• Result: Faster Total Throughput
10 days
Metal Fill Insertion
Extraction
Timing
LogicalECO
ECOP&R
DRC Checking
1-2 days per iteration
20 days 5 days
5 days
P&RTiming
Closure ECOs
SignOff
Mask
Prep
Final Netlist Closure: 40 days!
Place & Route
May 4, 2011 21May 4, 2011 21
Summary
• Every SoC is Mixed Signal• Every EDA tool must focus on Silicon first• Mixed Signal SoC redefined EDA must comprehend
& solve new mixed signal challenges
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