virtual prototyping for emc - enginsoft.it · antennas & radiation • near and far field...

Virtual prototyping for EMC

Ing. Andrea Serra, Ph.D. a.serra@enginsoft.com

EMC? Not a problem!

What is EMC

Emissions Couplings

Crosstalk

SSN

PI SI

RF signals

Signal lines PDN Circuit components

Antennas

EMC? Not THE problem!

What is EMC

Emissions Couplings

Crosstalk

SSN

PI SI

RF signals

Signal lines PDN Circuit components

Antennas

What is EMC

Emissions Couplings

Crosstalk

SSN

PI SI

RF signals

Signal lines PDN Circuit components

Antennas

EMC and product development

Component level

Module level

System level

Platform level

Proj

ect D

evelo

pmen

t Pha

se

EMC checks are often done here only…

…but they could be done here…

…here…

…and even here…

EMC system analysis PI

SI

RFI Emissions

Agenda •

•

•• Scale

• Discipline

• Domain

• System

•

Some Ws for numerical simulations…

Some Ws for numerical modeling and simulations…

Numerical virtual

prototype model

Designers, analysts.

At designer’s desktop

At any design

process stage

•

•

•

Some Ws for numerical modeling and simulations…

Because this

Is

from this

And the H…

Let me show!

ANSYS Technologies Electronics: High-Frequency and SI (HFSS, SIwave, Q3D Extractor)

Fluid Mechanics: From Single-Phase Flows

To Multiphase Combustion

Structural Mechanics: From Linear Statics

Systems: From Data Sharing

To High-Speed Impact

To Multi-Domain System Analysis

Low-Frequency/Electromechanical (Maxwell, Simplorer)

ANSYS Electronics capabilities - Geometry Full Wave Finite Element Method (FEM) Transient Finite Element Solver (HFSS TR) Integral Equation Solver (HFSS IE) with PO SBR+ solver (Ray Tracing)

MCAD ECAD

Automatic geometrical handling Simple and user-friendly editing interface Complete and customizable material library

Supported ECAD Translations Cadence

Allegro ⇒ 16.0, 16.1, 16.2, 16.3, 16.5, & 16.6 APD ⇒ 16.0, 16.1, 16.2, 16.3, 16.5, & 16.6 SiP Digital/RF ⇒ 16.0, 16.1, 16.2, 16.3, 16.5, & 16.6 Virtuoso ⇒ 5.10, 6.14, 6.15, & 6.16 (Linux only)

Mentor Graphics Expedition ⇒ v2005, v2007.1 thru EE7.9 (uses HKP design flow) Boardstation ⇒ 8.x (uses HKP design flow) Boardstation XE ⇒ v2007, v2007.1, v2007.2, v2007.3 and v2007.7 (uses HKP design flow) PADS ⇒ PowerPCB v5.2a, v2005 and v2007 (ASCII Flow)

Zuken (Sold by Zuken) CR5000 ⇒ 10 and higher (Zuken translator for .anf & .cmp) CR8000 ⇒ 2013 and higher (Zuken translator for .anf & .cmp)

ODB++ Altium Designer ⇒ R10 and greater Mentor Expedition ⇒ EE7.9.1 and greater Mentor PADS ⇒ 9.4 and greater Zuken Cadstar ⇒ 12.1 and greater

IPC-2581

Pulsonix ⇒ Revision 8.5 build 5905 and greater

Other ECAD Formats .anf ⇒ ANSYS neutral file format .gds ⇒ IC Chip format .xfl ⇒ Apache Sentinel format .dxf ⇒ AutoCad drawing format

ANSYS Electronics capabilities – Fields & Circuit Antennas & Radiation

• Near and Far Field Radiation • Arbitrary 3D antennas • Finite and Infinite Arrays • Frequency Selective Surfaces (FSS) & Photonic Band Gaps (PBG)

Microwave • Filters, Cavities, Resonators • Connectors, Components and Transitions

Signal Integrity/High-Speed Digital • Package Modeling – BGA, • PCB Board Modeling – Power/Ground planes, Mesh Grid Grounds, Backplanes • Connectors • Transitions

Radar systems • Period structures • Radar Cross Section (RCS) and Time Domain Reflectometry (TDR)

ANSYS Electronics capabilities – Fields & Circuit Antenna & Radiation

• Near and Far Field Radiation Patterns • Emission and immunity • S,Y,Z matrix • Frequency and time domain pre-post processing

Microwave • Gain, Insertion Loss • Power and thermal capabilities

Signal Integrity/High-Speed Digital • Eye diagrams • PCB Board Modeling – Power/Ground planes, Mesh Grid Grounds, Backplanes • Connectors • Transitions

ANSYS Electronics capabilities - RFI • Manage system performance data... • Simulate RFI/EMI effects…

• Identify the root-cause of RFI/EMI… • Resolve RFI/EMI issues…

ANSYS Electronics capabilities - RFI

• Complete RF System Modeling • Single and Multi-Transmitter Simulation Modes

• Linear and Non-Linear Analysis • Rx-generated Intermod • Inter-Tx Intermod • Amplifier Saturation

• Includes Wideband Effects • In-Band and Out-of-Band Interference

Tx-1

Tx-2

Tx-3

Rx-0

Signal at this point gets compared to Rx susceptibility

to determine EMI margin

For Fixed Channels Systems: • Peak In-band EMI Margin • Noise In-band EMI Margin •Point EMI Margin

For Frequency Hopping Systems: • Random Analysis Mode

Simulate RFI/EMI Effects

Scale: from component to platform

Scale: from component to platform

• Mobile device in kitchen to router in living room • Multiple wall penetrations • Multipath, polarization mismatch

Mobile Phone

Router

Coupled EM Solutions: Location Performance

Electronics numerical problem scales

21 20/04/2018

Decomposition Method

Geometry and Material Complexity

Elec

trica

l Size

FEM (Frequency & Time)

Advanced Ray Tracing

MoM

Discipline: Power & Temperatures Power map and temperature data accounting for copper resistive losses and packages

Current Density

Power Map

Temperature

Temperature

Domain: Multi-domain analysis An integrated, multi-purpose UI that incorporates various solvers (numerical, circuit, system) with bi-directional coupling and vertical capabilities.

•

•

•

•

Domain: Multi-domain analysis

Non-Linear Circuit

EM-Fields

Push-Excitations

Dynamic Link

S-Parameters

System/Circuit

Dynamic Link

Push-Excitations

Domain: Multi-domain analysis RF and μwave frequency domain circuit design

Harmonic Balance Load-Pull Envelope Oscillator TV Noise/Phase Noise RFI

RF Spice based time domain circuit designs for Signal Integrity and Power Integrity Simulations

Transient, Quick-Eye, Verif-Eye AMI Analysis Q2D enabler

SI

Power integrity

PI solution example

( ) Ω=== m 800mA 87.376V 18.0

* pkdrivers

MaxSwingTarget AN

VZ

VV 8.1CC =

VVV 18.010/CCMaxSwing ==

Peak current = 37,87mA

PI solution example

PI solution example Capacitor Library Browser

1. More than 20,000 Cap & Inductor models included

2. Enables viewing multiple capacitor impedances curves

3. Calculates parallel impedance of multiple Caps

4. Enables creation of Customer Defined Libraries

PI solution example

0.00 10.00 20.00 30.00 40.00 50.00 60.00 70.00 80.00 90.00 100.00Time [ns]

1.20

1.40

1.60

1.80

2.00

2.20

2.40

Y1

[V]

U o eCurve Info pk2pk

V(VCC_U41-2)Transient 0.2177

V(VCC_U41-21)Transient 0.2295

V(VCC_U41-42)Transient 0.2418

V(VCC_U41-44)Transient 0.2549

V(VCC_U41-63)Transient 0.2729

V(VCC_U41-84)Transient 0.2169

Max peak to peak noise 273 mV 24% < limit

Time-domain noise specification met

Automated PI advisor STEP 1 • Select reference port locations

• Set VRM parameters

• Define impedance mask

Automated PI advisor STEP 2 - Select Candidate Capacitors for Optimization

1.

2. 3.

4.

5. 6. 7.

Automated PI advisor

STEP 3 – Setup optimization criteria • Total Price

• Total Number of Capacitors

• Total Number of Capacitors types

• Total Capacitor Area

Signal integrity

IBIS model – IBIS-AMI analysis IBIS-AMI

• AMI stands for Algorithmic Modeling Interface

• It allows users to specify their own transmitter and receiver models as C-interface compiled

libraries • ANSYS supports Matlab as well as compiled DLLs

• faster signal processing algorithms

• intellectual property protection

• Mainly used in convolution (fast) transient engines for channel simulation

• Designed to be used with fixed time step data

Signal Integrity analysis Models can be used for any time/frequency analysis

• SSO

• Verify signaling with non-ideal power delivery to drivers

• Eye diagrams

• Verify signal is clean enough for proper detection

• Cross-talk

• Verify neighbors do not cause excessive noise

SI analysis setup

Step 2: Assign IBIS TX/RX Buffers

Step 3: Identify Component Pwr/Gnd Nets

Step 4: Set VRM Parameters

Step 5: Set Transient Simulation

Step 1: Select Signal Nets

TX Circuit Module PCB Connector PCB Module RX Circuit

Signal Integrity – Serial channel example

Modules

Connectors

Signal Traces

Signal Integrity – Serial channel example

What is a Full System ANSYS EMI/EMC Methodology ANSYS EMI/EMC simulation method that

• Utilizes the best in class tools (accuracy, reliability, speed)

• Incorporates physical layouts and full 3D enclosures

• Uses actual real world transient signals

• Seamlessly combines frequency and time domain simulations

• Combines electromagnetic/circuit/system solvers with full bi-directionality

• Calculates quantities for regulation compliancy

What are the steps? 1. Import PCB layout and components.

2. Perform analysis of PCB to calculate S matrix.

3. Dynamically link results to the circuit solver and create driving circuit (attach drivers and receivers).

4. Perform a time/frequency domain analysis of entire system in Electronics Desktop.

5. Push voltage/excitation back and dynamically link to the EM solver.

6. Solve the full system with real signals.

Geometry Import Numerical solution for S matrix

Circuit solve with drivers and receivers

Push real excitations back

Solve full 3D system

The full system simulation

Push real excitations back

1.00 10.00 100.00 1000.00Freq [MHz]

-90.00

-80.00

-70.00

-60.00

-50.00

-40.00

-30.00

-20.00

-10.00

0.00

10.00

20.00

3m S

pher

e (dB

uVolt

s)

Ansoft Corporation HFSSModel1XY Plot 1

Curve Info

3M Sphere Max E Field valuesSetup1 : Sw eep1

Numerical FEM solution Solve driven circuit with S matrix model

Solve FEM model with real excitation Dynamically link to FEM