wide bandgap for aerospace ivhm coe applications · 2017-12-01 · dr suresh perinpanayagam . 2...

IVHM COE

Wide Bandgap for

Aerospace

Applications Dr Suresh Perinpanayagam

2

Outline

• Overview of Cranfield Power Electronics

Capabilities

• Towards All-Electric Aircraft

• SiC MOSFET Case Study

• Developing failure models for Wide Bandgap

• Prognostics development for Wide Bandgap

Welcome to Cranfield

We are an exclusively postgraduate university that is a global leader for education and transformational research in technology and management.

We provide:

• Impact and influence

• Premier learning

• Transformational research.

3

Impact and influence

Aerospace:

Defence and Security:

Environment:

Leadership and Management:

we have strategic relationships with global

companies such as Airbus, BAE Systems,

Boeing and Rolls-Royce

we are one of the world’s largest providers of

postgraduate defence and security education

working with all UK water utility companies and

advising major government departments such as

Defra

we work with major international businesses such as

Jaguar Land Rover, L'Oréal and Shell, developing

high performance leaders across the world

leading two and key partners in an additional four

EPSRC Centres for Innovative Manufacturing.

We work with 750+ businesses

and governments around the

world

Manufacturing:

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Global reach

5

Power

Electronics

Group

Cranfield Nano The Institute's world-class facilities

include clean rooms, laboratories

and test/fabrication services through

to prototype component

manufacture, with extensive analysis,

modelling, synthesis and

characterisation capability.

Wide

Bandgap

Capabilitie

s

Cranfield’s Centres

6

Towards All-Electric

Aircraft

• Novel architecture for

generation and

distribution of loads

• Thermal

management and

thermal exchange

• Flight-proven

electrical equipment

systems, including

environmental

conditioning and

protection

7

Electrical Distribution

Architecture for Regional

Aircrafts

8

Comparison

between a Si IGBT

and a SiC MOSFET

A comparison of the overall losses between a Si

IGBT and a SiC MOSFET with similar nominal

ratings 9

Inverter for Ground

Power Units

45 KW INVERTER DESIGN PARAMETERS

Parameter Value Unit

DC Link Voltage 500 VDC

Output Voltage -

Line to Line 232 VAC

Output Frequency 400 Hz

Power Factor 0.85

Nominal Output

Power 45 kW

400% Overload

value 180 kW

Switching

Frequency at

Nominal Load 16 kHz

Switching

Frequency at

Overload 4 kHz

Heatsink Thermal

Resistance 0.017 K/W

Maximum Junction

Temperature 150 ᵒC

Ambient

Temperature 40 ᵒC

10

Effect of Junction

Temperature

Junction temperatures of switching devices under nominal load

and overload conditions. Note the reduction in temperature

which corresponds with the reduction in switching frequency. 11

Comparison of

Losses

• 67% reduction in losses can be expected.

• 1.6% increase in efficiency if the IGBT4 module with

SiC diodes is used.

• 2.3% increase if the SiC MOSFET module is used.

12

Junction

Temperature at

125% Overload

Standard IGBT4 technology reaches its limit at a 55kW nominal

load.

SiC-based devices would be able to increase the nominal rating of

the power assembly to 95kW, which represents a 72% increase in

power density.

SiC-based devices have the potential to double the power density

of typical 3-phase inverters. 13

Power Electronics

Reliability Studies

• Repeated heating and cooling leads to

repetitive mechanical stress and eventual

failure.

• Exposure to sustained high temperatures

drives diffusion-related mechanisms

(creep, intermetallic growth, annealing).

• Mismatch in CTE causes fatigue failure (de-

bonding) of bond wires and soldered

interfaces.

14

Physics-of-Failure

Applied in Design

Mission Profile

(1)Thermal Profile Generator

(2) Rain-Flow Analysis

(3) Damage Profile Generator

and

Lifetime Prediction

I(t)

T interface (t)

ΔT interface vs No. of Cycles

Interfaces: •Wire-bonds

•Chip solder

•Substrate

solder

•Power-electronics process

•Switching strategy

•Device electrical models

•Device thermal models

Electrical systems:

•Trains, Planes & Automobiles

•Renewable power sources

•Power generation &

distribution

•Industrial processes

•Failure models

•POF/Empirical

•Statistical models

•Weibull 15

Electro-Thermal

and

Thermo –

Mechanical Models

1-duty cycle

load current1

UPPER SOLDER1-a LegA

UPPER SOLDER1-a Leg C

Sine Wave4

Sine Wave3

Sine Wave2 original

Sine Wave2

Sine Wave1

Repeating

Sequence

Interpolated

Rate Transition (5KHz) 2

Rate Transition (5KHz) 1

Rate Transition (5KHz)

Rate Transition (1KHz)1

LOWER SOLDER1-b LegA

LOWER SOLDER1-b Leg B

LOAD CURRENT

G4-SOLDER2 Leg C RIGHT

G4

G3-SOLDER2 Leg B

G3

G2-SOLDER2 (Leg A LEFT)

G2

G1-SOLDER2 leg A

G1

0.5

Dutycycle

Power to Lower IGBT_ A (G2)

Power to Upper DIODE_ A (D1)

Power to Lower DIODE_ A (D2)

Power to Upper IGBT_ A (G1)

Power to Upper IGBT_ C (G3)

Power to Upper DIODE_ C (D3)

In3

Power to Lower IGBT_ C (G4)

Power to Lower DIODE_ C (D4)

LOW _SIDE IGBT _A (G2) Junction Temperature

HIGH_SIDE Diode_A (D1) Junction Temperature

LOW _SIDE IGBT _A (G2) SOLDER_2 Temperature

LOW _SIDE DIODE _A (D2) Junction Temperature1

HIGH _SIDE IGBT_C (G3) Junction Temperature

LOW _SIDE DIODE _C (D4) Junction Temperature2

HIGH_SIDE Diode_C (D3) Junction Temperature

HIGH _SIDE IGBT_A (G1) Junction Temperature2

HIGH _SIDE DIODE _A (D1) SOLDER_2 Temperature

HIGH _SIDE IGBT _A (G1) SOLDER_2 Temperature

LOW _SIDE DIODE _A (D2) Solder_2 Temperature

UPPR _SIDE_3a SOLDER_1 Temperature

LOWER_SIDE_3b SOLDER_1 Temperature

BASE PLATE-A Temperature

LOW _SIDE IGBT _C (G4) Junction Temperature

HIGH _SIDE IGBT _C (G3) SOLDER_2 Temperature

LOW _SIDE IGBT _C (G4) SOLDER_2 Temperature1

HIGH _SIDE DIODE _C (D3) SOLDER_2 Temperature

LOW _SIDE DIODE _C (D4) Solder_2 Temperature

UPPR _SIDE_3a SOLDER_1 (C) Temperature

LOWER_SIDE_3b SOLDER_1 (C) Temperature

BASE PLATE (C) Temperature

BASE PLATE-A IR Temperature 1

BASE PLATE (C) -IR Temperature 1

Determined Temparature

D4-SOLDER2 Leg B

D4

D3-SOLDER2 Leg B

D3

D2-SOLDER2 leg A

D2

D1-SOLDER2 leg A

D1

1

Constant1

Base plate-IR Leg B

Base plate- Leg B

Base plate- Leg A

Base plate- IR Leg A

L oad Current

dA

temp D1

dC

temp D3

temp D4

temp D2

tempG1

tempG2

temp G3

temp G4

Out D1

Out D2

Out D3

Out D4

Out G1

Out G2

Out G3

Out G4

AVERAGE INPUT POWER (W)

PROCESS 2 OK

Thermo-Mechanical Model

Electro-Thermal Model

16

Wire bond wear-out models

597.3)1110*4.1( TfN

Nf is the material number of cycles to

failure

ΔT is temperature variation.

Reliability life-time models for IGBT

bond wire interconnect.

Life-Time Models

17

IGBT (G2)

Diode (D1)

Comparisons between Junction Temperature

Estimates and Measurements

Infra-Red Measurements

CEDIP Titanium high

frame rate camera

IGBT Reliability

18

Integrated Vehicle

Health

Management

• Production,

certification & testing

• Total ownership costs

• System & life cycle

• Requirements

• FMECAs

• Design models

• Failure modes/models

• System test data

Design

Engineering

Manufacturing

• Maintenance Scheduling

• Spares Supply

• Asset Tracking

• Maintenance Execution

Vehicle Maturation/New Product

• Operational Demand

• Fleet Availability

• MR & O leading • Operational Schedule

• Operational Effectiveness

Health Status

Act Acquire

Transfer

Sense

Health Status

• Current

• Predicted

Analyse

Asset

Data Repository

& Ground Processing

Maintenance &

Logistics

Operational Control

19

Power Module IGBT

Repeated heating and cooling leads to repetitive mechanical

stress and eventual failure.

Exposure to sustained high temperatures drives diffusion-

related mechanisms (creep, intermetallic growth, annealing).

Mismatch in CTE causes fatigue failure

(de-bonding) of bond wires.

CTE mismatch causes fatigue failure at

soldered interfaces.

Heatsink

Thermal Grease Copper base

plate

Substrate Solder Substrate

Die

Solder

Wire

bond

Elements of the heat transfer path of

the power electronic module

Silicon Die

20

Power Cycling Ageing

Test The power cycling ageing test provides monitoring and measurements of temperature and electrics.

• On-state collector emitter voltage (Vce) changes with different power cyclings.

• The junction temperature and the collector-emitter are measured and recorded constantly until the IGBT fails in accelerated ageing experiments.

• The failure mode involves wire bond lifting off and progressively ending before reaching the open circuit.

• The Vce (on-state) parameter indicates any increases in a non-monotone fashion and shows discrete steps with noise invasion until the IGBT fails.

• The Vce (on-state) voltage precursor indicates a sudden fall at the end of the ageing process when the IGBT fails after more than 4,500 time units.

21

Noise Filtering

First IGBT data set after filtering

500 1000 1500 2000 2500 3000 3500 4000 45001.9

2

2.1

2.2

2.3

2.4

Cycles (Times)

Vce

(V

olts

)

IGBT 1

IGBT 2

IGBT 3

IGBT 4

All IGBT run-to-failure data sets after filtering

22

TABLE III: IGBT Degradation

Phase Duration

Data Clustering

0 500 1000 1500 2000 2500 3000 3500 4000 4500 50001

2

3

4

5

6

7

8

9

10Classtring data

Cycles (Times)

Vce

(Vol

ts)

23

Parameter Optimization

Using analytical maximum

likelihood estimation

(MLE) method to estimate

best fit of the modelling

parameter λ for Poisson

distribution

𝑃(𝑥𝑖|𝜆) =𝜆𝑥𝑖 . 𝑒−𝜆

𝑥𝑖!, 𝑥𝑖 ≥ 0

𝜆 𝑀𝐿𝐸 =1

𝑛 𝑥𝑛

𝑁𝑛=1

MLE for Poisson Probability

Distribution

24

Results from RUL

Estimation Using

Weibull Model

Constructed Markov model & Monte Carlo

simulation for RUL prediction

25

0 1000 2000 3000 4000 50000

2000

4000

6000

8000

10000

12000

14000

Life of IGBT

RU

L o

f IG

BT

Real RUL

Estimated Mean RUL

0 1000 2000 3000 4000 50000

2000

4000

6000

8000

10000

12000

14000

Life of IGBT

RU

L o

f IG

BT

Real RUL

Estimated Mean RUL

0 1000 2000 3000 4000 50000

2000

4000

6000

8000

10000

12000

Life of IGBT

RU

L o

f IG

BT

Real RUL

Estimated Mean RUL

0 1000 2000 3000 4000 50000

1000

2000

3000

4000

5000

6000

7000

8000

Life of IGBT

RU

L o

f IG

BT

Real RUL

Estimated Mean RUL

Conclusions

• Reliability and maintenance-free power solutions are

important for wide adaption of Wide Bandgap technology.

• Cranfield could assist industry to develop reliability

models for Wide Bandgap applications.

• Cranfield could develop prognostics capabilities for Wide

Bandgap applications.

• This will enable safety-conscious industry, such as electric

aircraft, to adapt Wide Bandgap.

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