MOLEX CONFIDENTIAL INFORMATION — FOR INTERNAL USE ONLY

Amrit Panda

Victor Zaderej

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•  The drive to add electronics into “everything” •  The need to package components into smaller

spaces •  Higher Functionality (i.e. faster/ more features) •  Use less power and manage thermal budget •  ALL MUST BE DONE FOR LOWER COST

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•  ASEP is a flexible, continuous processing and design platform

•  ASEP Advantages •  Integrate different substrates as required (Lead Frames,

Connectors, PCBs, Flex) with •  Devices such as: Sensors, Processors and Passives to include •  Features such as: thermal and power management, high speed

signal transmission, EMI shielding etc. •  In end applications such as wireless power, handheld medical

devices, small form factor hand tools, spatially distributed sensor networks etc.

•  Maximize use of multi-axis 3-D space •  Reduce weight and part count •  High volume manufacturing and resultant low cost advantage •  Green Process – reduces waste dramatically because of high

additive process content

"   MEMS devices are typically - Fabricated, Capped (or WLP), molded into SMT (or other PCB

compatible) format, Assembled onto a rigid board, with connectors to interact with the outside world

- MEMS devices are non-standard processes, each requiring device specific handling and processing unlike CMOS processes.

- When discrete devices need to be packaged – size and cost increase.

"   ASEP Allows - Devices to be packaged in their final use form i.e. into the end

application it is intended to be used for

- ASEP takes MEMS devices (mirrors, sensors etc) – eliminating the molded SMT (generic format, size, test and cost) – and packages into the customizable application

- Functional integration based on end Application - Example: An integrated sensor in an eye-glass wire frame for VR or

heads up displays, with a gyro activated mems mirror used in a display

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ETCH MOLD SEED

LAYER

INTERNAL BUSSING

ELECTROPLATE

Electroplating allows much smoother finishes allowing multi-level die attach and wirebonding

Inks or pastes alone are too rough, not conductive enough, expensive (Not Functionally Sufficient)

But by using them as seed layers only – A RDL quality package is possible

SOLDER MASK

COMPONENT ASSEMBLY

BACKSIDE VIEW

SINGULATION

•  Reflow •  Die Attach and

Wirebond •  Epoxy •  ACF Bonding •  Wave Solder •  Ultrasonic

Bonding

High Tolerance – upto 10 um is possible in molding – allowing for applications better than traditional packaging

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MULTI STEP REPEAT PROCESS AS REQUIRED

Technologies 2D/3D Process Materials

Substrates Maturity Cost

Lithography 2D Photoresist Any High Medium

Laser 3D NA Catalyzed plastics– for metallization Any –for surface modification

High Medium

PVD/CVD PVD – 2D CVD – 3D

Metals Dielectrics

High Temp substrates

High High

Electro/ Electroless Plating

3D Metals Any High Low

Aerosol/Inkjet Aerosol – 3D Inkjet – 2.5 D

Metals Dielectrics Ceramics

Any Medium Medium

Molding / Passivation

3D Polymers Dielectrics

Any High Medium

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Raw PCB (Vendor 1) 1.  Drill 2.  Electroless Plate 3.  Laminate Dry Film 4.  Expose Both Sides 5.  Develop 6.  Electroplate Cu 7.  Electroplate Sn 8.  Strip Dry Film 9.  Sn Strip 10.  Cu Etch 11.  Soldermask 12.  Singulate/Punch 13.  Electrical Test

PCB Assembly (Vendor 2)

1.  Stencil Paste 2.  Pick and Place

Components 3.  Reflow Oven 4.  “Depanelize” 5.  Electrical Test

Connector (Vendor 3) 1.  Stamp Contacts 2.  Plate Contacts 3.  Mold Part One 4.  Mold Part Two 5.  Singulate Contacts 6.  Assemble 7.  Electrical Test

CM Assembly (Vendor 4) 1.  Cut 3 wires to length 2.  Strip Ends of wires 3.  Crimp wires to Connector 4.  Wrap wires with tape 5.  Hand solder wires to PCB 6.  Mold Cover 1 7.  Mold Cover 2 8.  Mold Light Pipe 9.  Assemble Light Pipe 10.  Assemble covers to PCB 11.  Electrical Test Total of 36 Steps

And 4 Vendors

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Current  Product:  36  Process  Steps  

4  Vendors  Involved  

ASEP Technology: 16 Process Steps All Manufactured in one Location Less Expensive to Manufacture, Easier to design, Smaller Footprint

"  Software Tools - Design Software to incorporate ASEP design guidelines

- 3D software to capture and translate design intent

- Simulation tools interfacing to design software to predict mechanical, thermal and signal integrity

"  Applications and challenges specific to packaging of MEMS devices

"  Which applications can truly benefit from a 3D package

"  Design partners to leverage ASEP technology

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