a.nomerotski,2/3/2005 1 layer0 status andrei nomerotski 2/3/2005 outline introduction module...

1A.Nomerotski,2/3/2005

Layer0 Status Andrei Nomerotski 2/3/2005

Outline Introduction Module Production Assembly of Layer0 Electronics System tests Schedule

Mechanical and Installation issues will be covered in Bill Cooper’s talk


Overview Layer0 will improve impact parameter resolution

and mitigate degradation of performance caused by radiation damage to the SMT inner layers after 3-4 fb-1

Important for tracking & b-tagging at high luminosity and for Bs mixing measurement

Layer0 uses R&D and experience of the DZero Run2B Silicon Upgrade

Many components prototyped in advance

Contributing institutions : Brown, CINVESTAV,Fermilab, Fresno, UIC, U.Indiana, U.Kansas, Kansas State, Louisiana Tech, U.Mississippi, MSU, Moscow State, NorthWestern, Rice, Stony Brook, U.Washington, Zurich


Layout of Layer0

Inside SMT

• 6-fold symmetry, total 48 modules, 96 SVX4 readout chips• 8 module types different in sensor and analog cable length


Run2B Silicon Closeout Run2B closeout is complete Results on L2-5 stave and grounding R&D on Layer0 have been presented at

several instrumentation conferences and published in proceedings. NIM paper on the grounding R&D submitted

Though present Layer0 has a different design, the original Run2B Layer 0 allowed to prototype many aspects of the new design

CF support structure Grounding/noise issues Assembly issues

Original Run2B support structure


Layer 0 Module : Concept

Sensor connected to hybrid with double-deck analog cable

hybrid

analog cablesensor


Module Production We are in production since mid January 2005

Had PRR in Nov 2004 – very useful, implemented many recommendations of the committee

8 types of modules, 6 of each type Total 48 needed

Have parts for ~100 modules, plan to build 64 modules to select best 48

During Sept-Dec 2004 built 14 preproduction modules Most of them used for system tests

Will discuss below Production components Module assembly Status and Production rate Module QC


Sensors Pitch 71/81 micron,

intermediate strip, 70/120 mm long: four types

Ordered from HM 120 sensors (4 x 30) in March 2004

Received 112 in July and 8 in November 2004

All IV, CV tested at Fermilab 3 out of spec due to large I/V

- used for prototypes Only one(!) bad strip – pinhole

on one of last 8 sensors Out of 120 x 256 = 30720 strips spec 1%

Four sensors fully probed at Stony Brook

Results consistent with HM Four sensors and test

structures irradiated at KSU Measured at Stony Brook Built two modules, see later

Depletion Curves

0.0E+00

5.0E+17

1.0E+18

1.5E+18

2.0E+18

2.5E+18

3.0E+18

3.5E+18

4.0E+18

4.5E+18

5.0E+18

0 50 100 150 200 250 300 350

Volts

1/C

^2

Layer 0 VI Curves

1.00E-08

1.00E-07

1.00E-06

0 100 200 300 400 500 600 700 800

Voltage

Cu

rren

t


Pitch Adapter

Two types of Pitch Adapter Ordered in June 2004,

received in Oct 2004 (Seigert)

Satisfactory bond strength (6.8+/- 0.8 g) and etching quality

Before unsuccessfully tried two other vendors

As backup ordered pitch adapters also from Advanced Thin Film Products

Provided samples with very good pull strengths

Received and evaluating first batches

Building a module with this PA


Analog Cable 8 types of cables

required (4 pairs different in length) 128 signal lines per

cable Max length 34 cm

Ordered in March 2004, delivered in July 2004 (Dyconex) Total 200 cables

Testing : visual inspection – no bad channels


Hybrid 48 hybrids required Had 267 tested

SVX4.2B chips Received 119 hybrids

in Sept 2004 (Amitron)

70 good, 49 “out of spec”

“out of spec” : cutoff edge off by 200 micron, can be used with modified fixtures

Mechanical tests at Fermilab and KU

Flatness < 80 micron, thickness < 800 micron (both better than spec)

Assembled 101 hybrids at NXGen and 10 at Fermilab

Yield (before burn-in) ~90%

7 hybrids left unstuffed, 1 broken

>50% of hybrids are burnt-in (KU)

A.Nomerotski,2/3/2005

sensor

top cable

bottom cable

pahybrid

SVX

glue joints

ceramic spacers

2

3

4

5

66

7

1

1

Module Assembly Overview

1) Sensor and spacer are glued to kapton wrap-around circuit; Spacers are glued to top cable

2) Bottom cable is glued to hybrid and pitch adapter3) SVX chip is wire bonded to the bottom cable4) Top cable is glued to bottom cable. Wrapping of sensor

is completed5) Pitch adapter is glued to the sensor6) Cables are wire bonded to the pitch adapter and SVX

chip7) Sensor is bonded to pitch adapter

Day 1

Day 2

Day 3

Day 4


Stage 4

Stage 4

A number of fixtures is required for all steps Typically have double quantity of fixtures

Example below : Gluing of analog cable

Module Assembly Fixtures

Bond profiles for analog cable

analog cable

hybrid

pitch adapter


Assembled Layer0 Module

analog cable

hybrid

pitch adapter

SVX4

sensor


Current status : 10 production modules assembled since Jan 13

Current rate : 4 modules per week Have all fixtures to boost production to 8 modules per week

Module QC Mechanical inspections I-V curve Burn-in : 72 hours with 200V bias Encapsulation of HV and GND bonds Another short burn-in before storage

Results analyzed and put into the module database So far three modules with 0 defects, two with 1 defect, one with

many, others still need to be tested Additional module testing (done for a few modules)

Several modules underwent long-term tests in April-July 2004 Built and tested two modules with irradiated sensors (~10 fb-1

equivalent) Thermocycling Laser tests

Production Rate and Module QC


V-I plots Range 0-300V, typically current ~ 50-150 nA,

correlates well with sensor current


Examples of plots from hybrid burn-ins : pedestals

L0 - 202


Differential Noise vs. Strip Current

20

22

24

26

28

30

32

34

36

0 100 200 300 400 500 600

Current, mkA

no

ise,

AD

C c

ou

nts

*10

396 nsec

132 nsec

Tests of Irradiated Modules : Shot Noise

Good opportunity to check that we understand irradiated modules

Normally stored in the freezer - warmed up to increase current Current vs. Temperature dependence is in agreement with

expectations Minimal increase of noise wrt non-irradiated module at

operational T Observed rising contribution from shot noise with rising T

Shot noise scales as sqrt(Integration time x Current) ~1400 e for 396 ns integration time at T=+10oC : agrees with

calculations


Support Structure Assembly Fixture

Base Plate90”x20”

CF Support Structure

Support Mount South

Support Mount North

Middle Support

South Modules Holders

North Modules HoldersCF Support Structure

Rotation Control

Collar North

Collar South

The fixture will be mounted on CMM TableLab C at SiDET


Sensor & Hybrid Holders

Each module after mounting is tested electrically


Layer0 Electronics Layer0 will use 48 readout channels now used by

Outer H-disks Readout chain needs to be interfaced to Run2A

SMT electronics New wrt Run2A : Hybrid-Jumper Cable-Junction Card-

Twisted Pair Cable-Adapter Card Adapter Card isolates Layer0 ground and detector

ground Needed because South is shorted to North by the support

structure SVX4 needs to coexist with SVX2

Status of Cables Digital Jumper Cables (KSU & KU)

Production cables ordered from Compunetics in Jan 2005 Have reduced thickness to 0.15 mm

Twisted Pair Cable (KU) – ready


Junction Card Two channels per card Cable routing and dressing prototyped with mockup Design finalized, will be ordered in Feb


Adapter Card Four channel per card Ground isolation tests done in Sept-Oct 2004

Had good results with and without isolation Plan to reproduce them with the prototype

support structure

Design finalized, will be ordered in Feb


System Tests Effects of possible interference with support

structure and between modules – addressed with setups at Sidet

Readout of modules installed on the support structure

Readout of large number of channels, in the limit full Layer0

Testing at conditions similar to operations – addressed with setups at DZero

Use real DAQ with Trigger Framework Preparation and exercising of online software

Cooling system / Thermocycling


Prototype Support Structure

modules installed on the support structure

CF support structure for Layer0 implements new grounding approach: laminated ground mesh covering all surface – crucial design feature ensuring low inductance path for GND and hence low noise

Prototype is electrically and mechanically the same as final structure

Have 8 L0 modules mounted on the prototype support structure since Nov 2004

Simultaneous readout through simplified chain


Results with Prototype Structure Low total and random noise (no Faraday

cage) the grounding scheme works well

Observe pedestal shapes at fast SVX4 settings Caused by digital-to-analog couplings between

hybrid and analog cable below the hybrid

Noise ~ 1500 eS(MIP) / N ~ 15:1 Coherent noise very small Noise for 4 modules

cablesensorhybrid


Pedestal Shapes Pedestal peak-to-peak

difference At fast preamp settings :

6-7 ADC counts At slow settings : 2 ADC

counts - acceptable

Other remedies It looks that most of

pickup comes from clock signals – will have provisions to regulate clock amplitude at AC

Have a spacer between hybrid and analog cable

0.2 mm spacer significantly reduces effect

More testing in progress

fast preamp settings

slow preamp settings

Pedestals for 4 modules

10 ADC counts

10 ADC counts


Plans for system tests at Sidet

Feb 2005 : Read out 10 modules on the support structure through Junction Card-Twisted Pair Cable-Adapter Card Use prototype JumperCable-JC-TPC-AC

Mar 2005 : Read out the 10 modules though full chain (above + Sequencer + VRB)

May 2005 : Expand full readout to 48 channels

June 2005 : Read out full Layer0 Use production JC-JC-TPC-AC

Also : thermocycle prototype support structure with 10 modules (Feb 2005)


System tests at DZero Installed two L0 modules, two hybrids, WIENER LV PS

and power distribution during the 2004 shutdown Successfully read out in special runs

Data is being analyzed, noise looks reasonable However these SVX4 strings are not yet in operations,

waiting for acceptable SEQC firmware Have a stand at DZero with IB, SEQ and VRB crates connected to

Trigger Framework to debug firmware

4 ch. Adapter Card at HorseShoe

These SVX4 strings will be used

To develop all slow control and monitoring online software

Exercise offline software

Measure S/N from real particles in the modules


Other Integration Issues Some remapping choreography of Layer0/Inner H-

disks/Outer H-disk readout and HV channels will be required during 2005 shutdown

Isolated LV Supply (WIENER) Provides SVX4 power PS and heavy power cabling installed during 2004

shutdown Power distribution to Adapter Cards will be installed

during 2005 shutdown High Voltage Supplies

Located outside of Collision Hall (in MCH2) Install more channels of Bira supplies Install new fanout box rated to 700 V

Integrate new components to Slow Controls Interlock Online GUIs


Schedule Hybrid production essentially done

(1/25/2005) Junction/Adapter Cards production ends on

3/18/2005 Module production ends on 4/22/2005 Start module installation 4/1/2005 Layer0 ready for system tests at Sidet on

5/11/2005 Layer0 ready to go to DZero on 7/19/2005

Main schedule risks are in 1) Design and preparation of assembly

fixturing 2) Full system tests


Summary Good progress on all fronts All parts in hand - started module

production in January 2005 Layer0 assembly to start in April 2005 Detector should be ready to go to

DZero in July 2005

Paying attention to system tests – so far all looks under control

a.nomerotski,2/3/2005 1 layer0 status andrei nomerotski 2/3/2005 outline introduction module...

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