Appendix A*

Surface Mount Standards

This appendix lists various standards, specifications, and guidelines that have an impact on surface mount technology from U.S. and international • bodies, including the U.S. Department of Defense, although DoD is now committed to using industry standards.

These documents can be obtained from the following sources:

• INSTITUTE FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS (IPC): 2215 Sanders Road, Northbrook, IL 60062-6135 Telephone 847-509-9700; FAX 847-509-9798

• ELECTRONIC INDUSTRIES ASSOCIATION (EIA) 2001 Pennsylvania Avenue, NW Washington, D.C. 20006-1813 Telephone 703-907-7500; FAX 703-907-7501

• GLOBAL ENGINEERING DOCUMENTS 2805 McGaw Avenue, Irvine, CA 92713 Telephone: 800-854-7179; FAX 314-726-6418

Military documents are available from:

• STANDARDIZATION DOCUMENTS Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094 Telephone 215-697-2667

Central office of the IEC:

* Adapted from Surface Mount Council Status of the Technology, Industry Activities and Action Plan, September 8-12, 1996, available from IPC.

726 Appendix A

• INTERNATIONAL ELECTROTECHNICAL COMMISSION (1EC) Rue de Varembe, 1211 Geneva 20, Switzerland

lEe documents are also available from:

• AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI) 11 West 42nd Street, New York, NY 10036

The letter prefix of each document indicates the organization responsible for that document:

EIA JEDEC

IPC

MIL DoD J-Std

Electronic Industries Association Joint Electron Devices Engineering Council of the EIA Institute for Interconnecting and Packaging Elec­tronic Circuits Military Department of Defense Joint Industry Standards

Components, General

EIA-886-E

EIA-481-A

EIA-481-1

EIA-481-2

EIA-48 1-3

EIAlIS-47

EIA-PDP-lOO

EIA-JEP-95

Standard Test Methods for Passive Electronic Com­ponent Parts-General Instructions and Index (this document is an umbrella document that consists of a series of uniform test methods for electronic compo­nent parts), Taping of Surface Mount Components for Auto­matic Placement 8 mm and 2 mm Taping of Surface Mount Compo­nents for Automatic Handling 16 mm and 24 mm Embossed Carrier Taping of Sur­face Mount Components for Automated Handling 32 mm, 44 mm, and 56 mm Embossed Carrier Tap­ing of Surface Mount Components for Automated Handling Contact Termination Finish Standard for Surface Mount Devices Registered and Standard Mechanical Outlines for Electronic Parts JEDEC Registered and Standard Mechanical Out­lines for Semiconductor Devices

EIA-JESD30

EIA-JESD95-1

IPC-9501 IPC-SM-786A

J-Std-020

Surface Mount Standards 727

Descriptive Designation System for Semiconductor Device Packages Design Requirements for Outlines of Solid-State and Related Products Component Qualification for the Assembly Process Recommended Procedure for Handling of Moisture Sensitive Plastic IC Packages MoisturelReflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices

Components, Passive

Capacitors:

EIA-198-D

EIA-469-B

EIA-479

EIA-51O

EIA-535

EIA-CB-ll

EIAlIS-28

EIAlIS-29

EIAIIS-35 EIAlIS-36 EIA/IS-37

EIAlIS-38 EIAlIS-39

IEC-384-3

Ceramic Dielectric Capacitors Classes I, II, III, and IV Standard Test Method for Destructive Physical Anal­ysis of High Reliability Ceramic Monolithic Capac­itors Film-Paper, Film Dielectric Capacitors for Micro­wave Ovens Standard Test Method for Destructive Physical Anal­ysis of Industrial Grade Ceramic Monolithic Capac­itors Series of Detail Specifications on Fixed Tantalum Capacitors that have been adopted by the National Electronic Components Quality (NECQ) Assessment System Guidelines for the Surface Mounting of Multilayer Ceramic Chip Capacitors Fixed Tantalum Chip Capacitor Style 1 Protected­Standard Capacitance Range Fixed Tantalum Chip Capacitor Style I Protected­Extended Capacitance Range Two-Pin Dual In-Line Capacitors Chip Capacitors, Multi-Layer (Ceramic Dielectric) Multiple Layer High Voltage Capacitors (Radial Lead Chip Capacitors) Radial Lead Capacitors (Conformally Coated) Ceramic Dielectric Axial Capacitors (Glass Encapsu­lated) Sectional Specification, Tantalum Chip Capacitors

728 Appendix A

IEC-384-10

IECQ draft

IECQ-PQC-31

IECQ-PQC-32

Resistors:

EIA-575

EIA-576 EINIS-34

Components, Active

EIA-JEP-95

EIA-JESDII

EIA-JESD21-C EIA-JESD22-B

EIA-JESD-26A EIA-JESD30

EIA-JESD95-1

Sectional Specification, Fixed Multilayer Ceramic Chip Capacitors Blank Detail Specification, Fixed Multilayer Ce­ramic Chip Capacitors Sectional Specification, Fixed Tantalum Chip Capaci­tors with Solid Electrolyte Blank Detail Specification, Fixed Tantalum Chip Ca­pacitor

Resistors, Rectangular, Surface Mount, General Purpose Resistors, Rectangular, Surface Mount, Precision Leaded Surface Mount Resistor Networks Fixed Film

JEDEC Registered and Standard Outlines for Semi­conductor Devices Chip Carrier Pinouts Standardized for CMOS 4000, HC, and HCT Series of Logic Circuits Configurations for Solid State Memories Test Methods and Procedures for Solid State De­vices Used in TransporatationiAutomotive Applica­tions (Series format-consists of over 16 different test procedure documents.) General Requirements, PEM, Rugged Environments Descriptive Designation System for Semiconductor Device Packages Design Requirements for Outlines of Solid-State and Related Products

Components, Electromechanical

Connectors:

EIA-429

EIA-364-B

Industry Standard for Connectors, Electrical Flat Ca­ble Type (IPC-FC-218B) Electrical Connector Test Procedures Including Envi­ronmental Classifications (Series format consisting of over 60 electrical connector test procedures.)

EIA-506

EIA-507

EIA-IS-47

EIAlIS-64

Sockets:

EIA-5400000

Switches:

IECQ-PQC-41 -US00003 EIA-448-23 EIA-5200000-A

Printed Boards:

IPC-FC-250

IPC-RF-245

IPC-RB-276 IPC-MC-324 IPC-HM-860 IPC-6105

MIL-P-50884

MIL-P-55110

Surface Mount Standards 729

Dimensional and Functional Characteristics Defining Sockets for Leadless Type A Chip Carriers (.050 Spacing) Dimensional Characteristics Defining Edge Clips for Use with Hybrid and Chip Carriers Contact Termination Finish Standard for Surface Mount Devices Two Millimeter, Two-Part Connectors for Use with Printed Boards and Backplanes

Generic Specification for Sockets for Integrated Cir­cuit (IC) Packages for Use in Electronic Equipment (Series format with over 20 sectional, blank detail, and detail specifications, approved for use in the NECQ system.)

Detail Specification, Dual-in-Line Switch, Surface Mountable, Slide Actuated Surface Mountable Switches, Qualification Test Generic Specification for Special-Use Electrome­chanical Switches of Certified Quality (Series format with over 25 sectional, blank detail and detail speci­fications, approved for use in the NECQ system.)

Performance Specification for Single and Double­sided Flexible Printed Boards Performance Specification for Rigid-Flex Multilayer Printed Boards Performance Specification for Rigid Printed Boards Performance Specification for Metal Core Boards Performance Specification for Hybrid Multilayer Performance Specification for Organic Multichip Module Structures (MCM-L) Military Specfication Printed Wiring, Flexible, and Rigid Flex Military Specification Printed Wiring Boards, Gen­eral Specification For

730 Appendix A

IPC-DW-42S/424 MIL-P-PRF-31032

Materials:

IPC-L-IOSB

IPC-L-I09B

IPC-CC-110

IPC-L-llSB

IPC-CF-14S IPC-MF-lS0F IPC-CF-lS2A

IPC-SM-S17 IPC-3406 IPC-3407

IPC-340S

IPC-CC-S30

IPC-SM-S40C

J-Std-004 J-Std-OOS

J-Std-006

Design Activities

IPC-D-249

IPC-D-27S

Discrete Wiring Technology Printed Circuit BoardlPrinted Wiring Board Manu­facturing, General Specification For

Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards Specification for Resin Preimpregnated Fabric (Pre­preg) for Multilayer Printed Boards Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications Specification for Rigid Metal Clad Base Materials for Printed Boards Resin Coated Metal for Multilayer Printed Boards Metal Foil for Printed Wiring Applications Metallic Foil Specification for CopperlInvar/Copper (CIC) for Printed Wiring and Other Related Applica­tions General Requirements for SMT Adhesives Guidelines for Conductive Adhesives General Requirements for Isotropically Conductive Adhesives-Paste Types General Requirements for Anistropically Conductive Adhesive Films Qualification and Performance of Electrical Insula­tion Compounds for Printed Board Assemblies Qualification and Performance of Permanent Poly­mer Coating (Solder Mask) for Printed Boards Requirements for Soldering Fluxes General Requirements and Test Methods for Elec­tronic Grade Solder Paste General Requirements and Test Methods for Soft Solder Alloys and Fluxed and Non-Fluxed Solid Sol­ders for Electronic Soldering Applications

Design Standard for Flexible Single and Double­Sided Printed Boards Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies

IPC-D-279

IPC-D-317

IPC-C-406

IPC-SM-782

IPC-H-855 IPC-D-859 IPC-2105

MIL-Std-2118

Surface Mount Standards 731

Reliability Design Guidelines for Surface Mount Technology Printed Board Assemblies Design Standard for Electronic Packaging Utilizing High Speed Techniques Design and Application Guidelines for Surface Mount Connectors Surface Mount Land Patterns (Configuration and De­sign Rules) Hybrid Microcircuit Design Guide Design Standard for Multilayer Hybrid Circuits Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies Design Standard for Flexible Printed Wiring

Component Mounting

EIA-CB-ll

IPC-CM-770D IPC-SM-784 SMC-TR-OOl

IPC-SM-780

IPC-MC-790

J-Std-012

J-Std-013

Guidelines for the Surface Mounting of Multilayer Ceramic Chip Capacitors Guidelines for Printed Board Component Mounting Guidelines for Direct Chip Attachment Introduction to Tape Automated Bonding and Fine Pitch Technology Electronic Component Packaging and Interconnec­tion with Emphasis on Surface Mounting Guidelines for Multichip Module Technology Utili­zation Implementation of Flip Chip and Chip Scale Tech­nology Implementation of Ball Grid Array and Other High Density Technology

Soldering and Solderability

EIAlIS-46

EIAlIS-49-A

EIA-448-19

IPC-TR-460A

Test Procedure for Resistance to Soldering (Vapor Phase Technique) for Surface Mount Devices Solderability Test Method for Leads and Termina­tions Method 19 Test Standard for Electromechanical Components Environmental Effects of Machine Sol­dering Using a Vapor Phase System Trouble Shooting Checklist for Wave Soldering Prin­ted Wiring Boards

732 Appendix A

IPC-TR-462

IPC-TR-464 J-Std-OOI

J-Std-002

J-Std-003 IPC-S-816 IPC-AJ-820

Quality Assessment

EIA-469-B

EIA-51O

IPC-A-600 IPC-A-61O MIL-Std-883 IPC-TR-551

IPC-A-24 IPC-A-36 IPC-A-38 IPC-A-48 IPC-AI-640

IPC-AI-641

IPC-AI-642

IPC-AI-643

Solderability Evaluation of Printed Boards with Pro­tective Coatings Over Long-Term Storage Accelerated Aging for Solderability Evaluations Requirements for Soldered Electrical and Electronic Assemblies Solderability Tests for Component Leads, Termina­tions, Lugs, Terminals, and Wires Solderability Tests of Printed Boards Troubleshooting for Surface Mount Soldering Assembly and Joining Handbook

Standard Test Method for Destructive Physical Anal­ysis of High Reliability Ceramic Monolithic Capac­itors Standard Test Method for Destructive Physical Anal­ysis of Industrial Grade Ceramic Monolithic Capac­itors Acceptability of Printed Boards Acceptability of Printed Board Assemblies Methods and Procedures for Microelectronics Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Compo­nents Reliability Flux/Board Interaction Board Cleaning Alternatives Artwork Fine Line Round Robin Test Pattern Surface Mount Artwork User Requirements for Automatic Inspection of Un­populated Thick Film Hybrid Substrates User Guidelines for Automated Solder Joint Inspec­tion Systems User Guidelines for Automated Inspection of Art­work and Inner Layers User Guidelines for Automatic Optical Inspection of Populated Packaging and Interconnection

Surface Mount Process

IPC-SC-60 IPC-SC-61 IPC-AC-62

Post Solder Solvent Cleaning Handbook Post Solder Semi-Aqueous Cleaning Handbook Post Solder Aqueous Cleaning Handbook

IPC-TR-580

Reliability

IPC-SM-785

IPC-D-279

Surface Mount Standards 733

Cleaning and Cleanliness Test Program Phase 1 Test Results Reliability

Guidelines for Accelerated Surface Mount Attach­ment Reliability Testing Design Guidelines for Reliable Surface Mount Tech­nology Printed Board Assemblies

Numerical Control Standards

IPC-NC-349

IPC-D-350D IEC-1182-1

IPC-D-351 IPC-D-352

IPC-D-354

IPC-D-356

EIA-224-B

EIA-227-A EIA-267-B

EIA-274-D

EIA-281-B

EIA-358-B

EIA-408

EIA-431

EIA-441

Computer Numerical Formatting for Drilling and Routing Equipment Printed Board Description in Digital Form Printed Board Description in Digital Form Compan­ion Documents Printed Wiring Documentation in Digital Form Electronic Design Database Description for Printed Boards Library Format Description for Printed Boards in Digital Form Bare Board Electrical Test Information in Digital Form Character Code for Numerical Machine Control Per­forated Tape One-Inch Perforated Tape Axis and Motion Nomenclature for Numerically Controlled Machines Interchangeable Variable Block Data Format for Po­sitioning, Contouring, and Contouring/Positioning Numerically Controlled Machines Electrical and Construction Standards for Numerical Machine Control Subset of American National Standard Code for In­formation Interchange for Numerical Machine Con­trol Perforated Tape Interface Between Numerical Control Equipment on Data Terminal Equipment Employing Parallel Bi­nary Data Interchange Electrical Interface Between Numerical Control and Machine Tools Operator Interface Function of Numerical Controls

734 Appendix A

EIA-474

EIA-484

EIA-494

Test Methods

EIA-JEDEC

EIA-JEDEC

EIA-JEDEC

IPC-TM-650

Repair

IPC-R-700C

Outsourcing

IPC-I720

Flexible Disk Format for Numerical Control Equip­ment Information Interchange Electrical and Mechanical Interface Characteristics and Line Control Protocol Using Communication Control Characters for Serial Data Link Between a Direct Numerical Control System and Numerical Control Equipment Employing Asynchronous Full Duplex Transmission 32 BIT Binary CL Exchange (BCL) Input Format for Numerically Controlled Machines

Method B 105-A, Lead Integrity-Plastic Leaded Chip Carrier (PLCC) Packages Method B 102, Surface Mount Solderability Test (JESD22-B) Method B 108, Coplanarity (intended for inclusion into JESD22-C) Test Methods Manual

Guidelines for Repair and Modification of Printed Board Assemblies

OEM Standards for Electronics Manufacturing Ser­vices Industry Qualification Profile

Terms and Definitions

IPC-T-50F Terms and Definitions for Interconnecting and Pack­aging Electronic Circuits

Appendix 8

Detailed Questionnaire for Evaluating SMT Equipment: Pick-and-Place (Appendix 81), Screen Printer (Appendix 82), and Reflow Oven (Appendix 83).

Appendix 81: Questionnaire for Evaluating SMT Pick-and-Place Equipment for Surface Mounting

Name of company machine: Model #: ___ _

Contact name: Telephone number: ______ _

Date _________ _

Does the equipment comply with Surface Mount Equipment Manufacturers

Association (SMEMA) standards? Yes No __ _

Comments

BOARD SIZE HANDLING CAPACITY

Maximum board size? ____ Minimum board size? ___ _

Maximum board thickness? __ Minimum board thickness? __

Maximum board warpage allowable? __________ _

736 Appendix B

Larger board size capability available? Yes No __ _

If Yes: Maximum board size? __ Minimum board size? __ _

If the larger board size capability is forecasted but is not yet available, then

when will the size above be available? ___________ _

COMMENTS: ____________ ~-----------------------

FEEDER TYPES AND SLOT CAPACITY

Part feeders acceptable: Tape ___ Tube ___ Bulk _____ _

Maximum reel diameter that can be mounted on the machine? ___ _

Sizes of tape that can be handled (i.e., 8mm, 12mm, etc.)? _____ _

Maximum number of 8mm feeders that can be mounted on the machine? ______________________ _

Number of input slots that each feeder requires (8mm feeder = 1):

12mm 16mm 24mm 32mm Other __ _

Tape types handled? Paper ___ Plastic ___ Other __ _

COMMENTS: __________________________________ ___

TYPES AND SIZES OF COMPONENTS

What size ranges of components can be placed? (part type and minimax di­mensions)

Chips 1206 and larger __ 0805 __ 0603 __ 0402 __

SOT _________________ ___

PLCC Max size and pin count _________ _

sorC-shrink body __ sorC-narrow body __ sorC-wide body __

Detailed Questionnaire for Evaluating SMT Equipment 737

Fine pitch (20 and 25 mil pitch) __ Ultra fine pitch (specify the pitch) __

Ball grid array (BGA) _ Maximum body size (for any component) _

Otherpackages ____________________ _

PLACEMENT RATE

Is this machine dedicated only to certain size components? Large parts __ Small parts __

Average throughput (partslhour) __________ _

Placement rate for 0805 and 1206 chips (partslhr) ________ _

Placement rate for 0603 and 0402 chips (partslhr) ________ _

Typical placement rate for SOICs and PLCCs (partslhr) _____ _

Typical placement rate for 20125 mil pitch PQFP (partslhr) ____ _

Typical placement rate for parts under 0.5 mm (20 mil) pitch (partslhr) __

Conditions under which the above speeds are valid? _____ ~ __ _

COMMENTS: __________________ _

PLACEMENT ACCURACY /REPEATABILITY ITEST CAPABILITY

Is on line component test/verification available? __________ _

If yes, what is the brand of tester used? __ Passive parts only? __

Does the system have auto recovery system for repairing misplaced parts?

__ If yes, describe __________________ _

Placement reliability (with auto recovery)? __________ _

Placement reliability (without auto recovery)? _________ _

738 Appendix B

Placement Head Details:

Type (i.e. drum, XY, etc.)? _______________ _

Resolution (min increments) X __ Y __ Z __ Theta __

Repeatability (in mils/degrees) X __ Y __ Z __ Theta __

Placement accuracy (in mils) Minimum part spacing ____ _

Does the head rotate the parts? _______________ _

Are centering fingers used to center the parts? _________ _

Chuck changes required for different parts? __________ _

VISION CAPABILITY

Vision system: Standard __ Optional __ Can be added later ($) __

Single Camera _____ Dual Camera ____ _

Binary imaging system (Back lighting system) __ Gray scale imaging system __

Level of Gray scale (256 levels?) __ Field of view (Largest part in mm)

BGA Placement capability (Gray Scale VisionIFront lighting system) __

COMMENTS: _________________________________ ___

ADHESIVE DISPENSING CAPABILITY

Adhesive Head Details:

Type (i.e., syringe, etc.)? ________ Qty. of dispensers? __

Programmable location? __ Programmable amount (time, pressure) __

Detailed Questionnaire for Evaluating SMT Equipment 739

Adhesive viscosity required or common adhesives supported? ____ _

Thermal jacket for adhesive? __ Positive displacement capability for ad­hesive? __

Programmable patterns of adhesive? __ Max qty patterns? __

Is dispensing unit integral to the machine or is it a separate unit? ____ _

Maximum speed of the adhesive dispenser? __________ _

COMMENTS: ____________________________________ _

BOARD HANDLING

Direction of machine flow (i.e. right to left)? __________ _

Is track width adjustable? _____ If yes, then how is it done:

Manual (crank) __ Fully automatic __

Does the board ever get rotated? _____ If so, why? _____ _

Is manualload/unload available as an option? __________ _

Are centering stations available that locate using:

Tooling pins _____ Edge of board _____ Other ____ _

Can the machine handle pallets that carry circuit boards? ______ _

Does your company design the pallets? ____________ __

What types of pallets? ___________________ _

Will your board handler and centering station work if leaded components are auto inserted prior to SMT placement?

COMMENTS: __________________________________ ___

740 Appendix B

PROGRAMMING

Any particular orientation for pin 1 required for CAD library? ____ _

Capability to identify bad board in a panel (in order to skip placing on it)? __

Methods available to program:

CAD down load __ Manual coordinate entry __ Teach __

Is an off line programming station available? __________ _

Estimated time to create a program consisting of __ total components with adhesive, and __ different types of parts using one or all of the following:

CAD down load __ Manual coordinate entry __ Teach __

Maximum number of steps per program? ___________ _

Step and repeat capability of multipak boards? _________ _

Maximum number of steps and repeats per program? _______ _

NC tape code (i.e., ASCII parity, etc.)? ____________ _

COMPUTER INFORMATION

Does each machine come with a separate computer or do they link into a host computer system? __________________ _

Maximum number of machines per host computer? ________ _

Computer brand: _____ Model: _____ CPU ____ _

Amount of RAM in computer? _____ Megabytes

How many programs at one time can be placed in RAM? _____ _

Type of host interface (i.e., RS232, IEEE, etc.) ________ _

Detailed Questionnaire for Evaluating SMT Equipment 741

PRODUCTION CHANGEOVER TIMES

Estimated time to load a tape feeder? _____________ _

Estimated time to replace a reel on the input carriage? _______ _

Estimated time to down load a program? ____________ _

Estimated time to change from one board width to another (assume tooling holes in same locations) ____ _

COMMENTS: ________________________________ __

MAINTENANCEIW ARRANTY

Standard warranty on parts? ________________ __

Standard warranty on labor? ________________ __

What is your guaranteed lead time for spares and service on down equipment:

Spare parts _____ Service ____ _

Where are parts and service centers located?

Location(s)

Estimated frequency of repair? _______________ _

Estimated average time per repair? ______________ _

Estimated total up time? __________________ _

Power requirements? ______ Air requirements? ______ _

COMMENTS: __________________________________ ___

TRAININGIDOCUMENTATION

In addition to training on equipment, do you provide SMT process training to your customers? ____ _

Documentation included: Training: ____ Maintenance: ___ _

742 Appendix B

Schematics: ________ Operation manual: _______ _

Programming manual: ________ Other: _______ _

How much training is included at: Factory ____ Installation ___ _

Maximum number of people who can participate in this training? __ _

How long does installation team stay at our factory? _______ _

How long does a typical acceptance test at your factory take? ____ _

Where is your factory located? _______________ _

COMMENTS: __________________ __

REFERENCES

Names and telephone numbers of users

Appendix 82: Questionnaire for Evaluating SMT Screen Printing Equipment

Name of company/machine: ________ Model #: ____ _

Contact name: _________ Telephone number: ____ _

Date _________ _

Detailed Questionnaire for Evaluating SMT Equipment 743

BOARD SIZE

Maximum board size? _____ Minimum board size? _____ _

Maximum board thickness? Minimum board thickness? ___ _

Maximum board warpage allowable? _____________ _

Larger board size capability available? Yes __ No __

If Yes: Maximum board size? __ Minimum board size? __

Maximum stencil/screen frame holding capability ________ _

Maximum print area _________ _

Stencil wipe feature available? __________ _

Vision alignment feature available? _____ Cost $ ____ _

COMMENTS: ____________________________________ _

SPEED

Print rate Minimum ___ Maximum ___ Range __ _

Print rate adjustment mechanism _______________ _

Print force adjustment ___________________ _

Snap-off adjustment __________________ _

COMMENTS: __________________________________ ___

BOARD HANDLING

Direction of machine flow (i.e., right to left)? __________ _

Is track width adjustable? If yes, then how is it done:

Manual (crank) Fully automatic ____ _

Does the board ever get rotated? _____ If so, why? _____ _

744 Appendix B

Is manualloadlunload available as an option? _________ ~

Are centering stations available that locate using:

Tooling pins _____ Edge of board _____ Other ___ _

Vacuum hold _________ _

COMMENTS: __________________________________ ___

ADDITIONAL QUESTIONNAIRE

See Appendix B 1 for questionnaire on: computer information, production change-over times, maintenance/warranty, training/documentation, and refer­ences.

Appendix 83: Questionnaire for Evaluating Reflow Oven for Surface Mounting

Name of company/machine: ________ Model #: ____ _

Contact name: _________ Telephone number: ____ _

Date ____ _

TYPE OF HEAT SOURCEITEMPERATURE UNIFORMITYINITROGEN CAPABILITY

Class I: It is an IR dominant system _____________ _

Class II: It is an IRiconvection dominant system ________ _

Class III: It is a convection dominant system __________ _

Heat circulation mechanism ____ . ____________ _

Detailed Questionnaire for Evaluating SMT Equipment 745

Number of heating zones _____ Top heating zones ____ _ Bottom heating zones ____ _

Can the temperature of each zone be controlled individually? ____ _

Fan at the end of the oven for cooling? ____________ _

Ever experienced fire hazard from deposited flux inside the cooling fan? __

Explmn ________________________ __

Uniformity of temperature across board ____________ _

Center of the board ______ Edge of the board ______ _

Use heated rails? _____ Nitrogen inerting capability ____ _

Can it be retrofitted with nitrogen inerting capability later? _____ _

Cost of retrofit _____ Consumption of Nz/hour __ $Ihr __ _

Temperature control mechanism _______________ _

Time to ramp to reflow temperature ____ _

Time to ramp down to adhesive cure temperature from reflow temper-ature ____ _

COMMENTS: _________________ ___

BOARD SIZE AND THROUGHPUT

Maximum board size? _____ Minimum board size? ____ _

Conveyor speed: Minimum ___ Maximum ___ Range ___ _

List the applicable (a) conveyor speed and (b) temperature uniformity for ovens with different number of zones (4, 5, 7, 10, etc.) to achieve the same profile for a particular board under evaluation:

746 Appendix B

(a) Conveyor speed __ in __ zone oven __ in __ zone oven __ in __ zone oven

(b) Temperature uniformity __ Dp (DC) in __ zone oven __ DP(DC) in __ zone oven

BOARD HANDLING

Direction of machine flow (i.e., right to left)? __________ _

How do you reflow double-sided SMT board? _________ _

Impact of pallets on thermal profile ______________ _

Is track width adjustable? _____ If yes, then how is it done:

Manual (crank) ________ Pully automatic ______ _

Is manualloadlunload available as an option? __________ _

COMMENTS: ______________________ ___

ADDITIONAL QUESTIONNAIRE:

See Appendix B 1 for questionnaire on: computer information, production change-over times, maintenance/warranty, training/documentation, and refer­ences.

Appendix C

Glossary

A-Stage. The condition of low molecular weight of a resin polymer during which the resin is readily soluble and fusible.

Anisotropic Adhesive. A material filled with a low concentration of large conductive particles designed to conduct electricity in the Z axis but not the X or Y axis. Also called a Z axis adhesive.

Annular Ring. The conductive material around a drilled hole. Aqueous Cleaning. A water-based cleaning methodology which may in­

clude the addition of the following chemicals: neutralizers, saponifiers, and surfactants. May also use DI (deionized) water only.

Aspect Ratio. A ratio of the thickness of the board to its preplated diameter. A via hole with aspect ratio greater than 3 may be susecptible to cracking.

Azeotrope. A blend of two or more polar and nonpolar solvents that behaves as a single solvent to remove polar and nonpolar contaminants. It has one boiling point like any other single component solvent, but it boils at a lower temperature than either of its constituents. The constituents of the azeotrope cannot be separated by distillation.

B. Stage. -See Prepreg Ball Grid Array (BGA). Integrated circuit package in which the input and

output points are solder balls arranged in a grid pattern. Blind Via. A via extending from an inner layer to the surface. See also

Via Hole. Blowhole. A large void in a solder connection created by rapid outgassing

during the soldering process. Bridge. Solder that "bridges" across two conductors that should not be

electrically connected, thus causing an electrical short. Buried Via. A via hole connecting internal layers that does not extend to

the board surface. Butt Joint. A surface mount device lead that is sheared, so that the end of

the lead contacts the board land pattern. (Also called "I-Lead"). C-Stage Resin. A resin in a final state of cure. See also B-Stage and

Prepreg.

748 Appendix C

Capillary Action. The combination of force, adhesion, and cohesion which causes liquids such as molten metal to flow between closely spaced solid surfaces against the force of gravity.

Castellation. Metallized semicircular radial features on the edges of LCCC's that interconnect conducting surfaces. Castellations are typically found on all four edges of a leadless chip carrier. Each lies within the termination area for direct attachment to the land patterns.

CFC. Chlorinated flurocarbon, cause depletion of ozone layer and sched­uled for restricted use by the environmental protection agency. CFCs are used in air conditioning, foam insulation and solvents, etc.

Characteristic Impedance. The voltage-to-current ratio in a propagation wave, i.e., the impedance which is offered to the wave at any point of the line. In printed wiring its value depends on the width of the conductor to ground plane(s) and the dielectric constant to the media between them.

Chip Component. Generic term for any two-terminal leadless surface mount passive devices, such as resistors and capacitors.

Chip-on-Board Technology. Generic term for any component assembly technology in which an unpackaged silicon die is mounted directly on the printed wiring board. Connections to the board can be made by wire bonding, tape automated bonding (TAB), or flip-chip bonding.

CLCC. Ceramic leaded chip carrier. Cold Solder Joint. A solder connection exhibiting poor wetting and a

grayish, porous appearance due to insufficient heat or excessive impurities in the solder.

Column Grid Array (CGA). Integrated circuit package in which the inpit and output points are high temperature solder cylinders or columns arranged in a grid pattern.

Component Side. A term used in through-hole technology to indicate the component side of the PWB. See also Primary Side and Secondary Side.

Condensation Inert Heating. A general term referring to condensation heating where the part to be heated is submerged into a hot, relatively oxygen-free vapor. The part, being cooler than the vapor, causes the vapor to condense on the part transferring its latent heat of vaporization to the part. Also known as vapor phase soldering.

Constraining Core Substrate. A composite printed wiring board consist­ing of epoxy-glass layers bound to a low thermal-expansion core material, such as copper-invar-copper, graphite-epoxy, and aramid fiber-epoxy. The core constrains the expansion of the outer layers to match the expansion coefficient of ceramic chip carriers.

Contact Angle. The angle of wetting between the solder fillet and the termination or land pattern. A contact angle is measured by constructing a line tangent to the solder fillet that passes through a point of origin located at the plane of intersection between the solder fillet and termination

Glossary 749

or land pattern. Contact angles of less than 90°C (positive wetting angles) are acceptable. Contact angles greater than 90°C (negative wetting angles) are unacceptable.

Control Chart. A chart that tracts process performance over time. Trends in the chart are used to identify process problems that may require corrective action to bring the process under control.

Coplanarity. The maximum distance between the lowest and the highest pin when the package rests on a perfectly flat surface. 0.004 inch maximum coplanarity is acceptable for peripheral packages and 0.008 inch maximum for BGA.

Crazing. An internal condition that occurs in the laminated base material in which the glass fibers are separated from the resin at the weave intersec­tions. This condition manifests itself in the form of connected white spots, of "crosses," below the surface of the base material, and is usually related to mechanically induced stress.

CTE (Coefficient of Thermal Expansion). The ratio of the change in dimensions to a unit change in temperature. CTE is commonly expressed in ppm/°C.

Delamination. A separation between plies within the base material, or between the base material and the conductive foil, or both.

Dendritic Growth. Metallic filament growth between conductors in the presence of condensed moisture and electrical bias. (Also known as "whiskers.")

Design for Manufacturability. Designing a product to be produced in the most efficient manner possible in terms of time, money, and resources taking into consideration how the product will be processed, utilizing the existing skill base (and avoiding the learning curve) to achieve the highest yields possible.

Dewetting. A condition that occurs when molten solder has coated a surface and then receded, leaving irregularly shaped mounds of solder separated by areas covered with a thin solder film. Voids may also be seen in the dewetted areas. Dewetting is difficult to identify since solder can be wetted at some locations and base metal may be exposed at other locations.

Dielectric Constant. A property that is a measure of a material's ability to store electrical energy.

DIP (Dual In-Line Package). A package intended for through-hole mount­ing that has two rows of leads extending at right angles from the base with standard spacing between leads and row.

Disturbed Solder Joint. A condition that results from motion between the joined members during solder solidification. Disturbed solder joints exhibit an irregular surface appearance, although they may also appear lustrous.

Drawbridging. A solder open condition during reflow in which chip resis­tors and capacitor resemble a draw bridge. See also Tombstoning.

750 Appendix C

Dual-Wave Soldering. A wave soldering process that uses a turbulent wave with a subsequent laminar wave. The turbulent wave ensures complete solder coverage in tight areas and the laminar wave removes bridges and icicles. Designed for soldering surface mount devices glued to the bottom of the board.

Electroless Copper. Copper plating deposited from a plating solution as a result of a chemical reaction and without the application of an electri­cal current.

Electrolytic Copper. Copper plating deposited from a plating solution by the application of an electrical curent.

Etchback. The controlled removal of all components of base material by a chemical process on the side wall of holes in order to expose additional internal conductor areas.

Eutectic. The alloy of two or more metals that has a lower melting point than either of its constituents. Eutectic alloys, when heated, transform directly from a solid to a liquid and do not show pasty regions.

Fiducial. A geometric shape incorporated in the artwork of a printed wiring board, and used by a vision system to identify the exact artwork location and orientation. Generally three fiducial marks are used per board. Fiducial marks are necessary for the accurate placement of fine pitch packages. Both global and local fiducials can be used. Global fiducials (generally three) locate the overall circuitry pattern to the PCB, whereas local fiducials (one or two) are used at component locations, typically fine pitch patterns, to increase the placement accuracy. Also known as alignment target.

Fillet. (1) A radius or curvature imparted to inside meeting surfaces. (2) The concave junction formed by the solder between the footprint pad

and the SMC lead or pad. Fine Pitch. A center to center lead distance of surface mount packages of

0.025 inch or less. Flatpack. An integrated circuit package with gull wing or flat leads on two

or four sides, with standard spacing between leads. Commonly the lead pitches are at 50 mil centers, but lower pitches may also be used. The packages with lower pitches are generally referred to as fine pitch packages.

Flip Chip. A leadless structure which is electrically and mechanically con­nected to the substrate via contact lands or solder bumps.

Flip-Chip Technology. A chip-on-board technology in which the silicon die is inverted and mounted directly to the printed wiring board. Solder is deposited on the bonding pads in vacuum. When inverted, they make contact with the corresponding board lands and the die rests directly above the board surface. It provides the ultimate in densification also known as C4 (controlled collapse chip connection).

Footprint. A nonpreferred term for Land Pattern. See Land Pattern.

Glossary 751

Functional Test. An electrical test of an entire assembly that simulates the intended function of the product.

Glass Transition Temperature. The temperature at which a polymer changes from a hard and relatively brittle condition to a viscous or rubbery condition. This transition generally occurs over a relatively narrow tempera­ture range. It is not a phase transition. In this temperature region, many physical properties undergo significant and rapid changes. Some of those properties are hardness, brittleness, thermal expansion, and specific heat.

Gull Wing Lead. A lead configuration typically used on small outline packages where leads bend and out. An end view of the package resembles a gull in flight.

Icicle (Solder). A sharp point of solder that protrudes out of a solder joint, but does not make contact with another conductor. Icicles are not ac­ceptable.

In-Circuit Test. An electrical test of an assembly in which each component is tested individually, even though many components are soldered to the board.

Ionograph. An instrument designed to measure board cleanliness (the amount of ions present on a surface). It extracts ionizable materials from the surfaces of the part to be measured and records the rate of extraction and the quantity.

JEDEC. Joint Electronic Device Engineering Council. J-Lead. A lead configuration typically used on plastic chip carrier packages

which have leads that are bent underneath the package body. A side view of the formed lead resembles the shape of the letter "J."

Known Good Die. Semiconductor die that has been tested and is known to function to specification.

Laminar Wave. A smoothly flowing solder wave with no turbulence. See Dual-Wave Soldering.

Land. A portion of a conductive pattern usually, but not exclusively, used for the connection, or attachment, or both of components. (Also called a "pad").

Land Pattern. Component mounting sites located on the substrate that are intended for the interconnection of a compatible Surface Mount Compo­nent. Land patterns are also referred to as "lands" or "pads."

LCC. A nonpreferred term for "leadless ceramic chip carrier." LCCC (Leadless Ceramic Chip Carrier). A ceramic, hermetically-sealed,

integrated circuit package commonly used for military applications. The package has metallized castellations on four sides for interconnecting to the substrate. (Also known as LCC).

Leaching. The dissolution of a metal coating, such as silver and gold, into liquid solder. Nickel barrier underplating is used to prevent leaching. Also known as scavenging.

752 Appendix C

Lead Configuration. The solid formed conductors that extend from a com­ponent and serve as a mechnical and electrical connection that is readily formed to a desired configuration. The gull wing and the J-Iead are the most common surface mount lead configurations. Less cOl1)IIlon are butt leads formed by cutting standard DIP package leads at the knee. See also Butt Joint.

Lead Pitch. The distance between successive centers of the leads of a component package. The lower the lead pitch, the smaller the package area for a given pin count in a package. In DIP, the lead pitch is 100 mil; in surface mount packages it is 50 mil. For fine pitch, commonly used lead pitches are 33 (Japanese), 25, and 20 mils. In tape automated bonding (see TAB), generally 10 mil pitches are used.

Legend. Letters, numbers, symbols, and/or patterns on the PCB that are used to identify component locations and orientation for aid in assembly and rework/repair operations.

Manhattan Effect. See Drawbridging. Mass Lamination. The simultaneous lamination of a number of pre-etched,

multiple image, C-stage panels or sheets, sandwiched between layers of prep reg (B-stage) and copper foil.

Mealing. A condition at the interface of the conformal coating and base material, in the form of discrete spots or patches, which reveals a separation of the conformal coating from the surface of the printed board, or from the surfaces of attached components, or from both.

Measling. An internal condition that occurs in laminated base material in which the glass fibers are separated from the resin at the weave intersection. This condition manifests itself in the form of discrete white spots or "crosses" below the surface of the base material, and is usually related to the thermally induced stress.

MELF. A metal electrode leadless face surface mount device that is a round, cylindrical passive component with a metallic cap termination located at each end.

Metallization. A metallic deposited on substrates and component termina­tions by itself, or over a base metal, to enable electrical and mechnical interconnections.

Multichip Module (MCM). A circuit comprised of two or more silicon devices bonded directly to a substrate by wire bond, TAB, or flip chip.

Multilayer Board. A printed wiring board that uses more than two layers for conductor routing. Internal layers are connected to the outer layers by way of plated via holes.

Neutralizer. An alkaline chemical added to water to improve its ability to dissolve organic acid flux residues.

No-Clean Soldering. A soldering process that uses a specially formulated

Glossary 753

solder paste that does not require the residues to be cleaned after solder pro­cessing.

Node. An electrical junction connecting two or more component termina­tions.

Nonwetting. A condition whereby a surface has contacted molten solder, but has had part or none of the solder adhere to it. N onwetting is recognized by the fact that the bare base metal is visible. It is usually caused by the presence of contamination on the surface to be soldered.

Omegameter. An instrument used to measure board cleanliness (ionic resi­dues on the surface of PCB assemblies). The measurement is taken by immersing the assembly into a predetermined volume of a water-alcohol mixture with a known high resistivity. The instrument records and measures the drop of resistivity caused by ionic residue over a specified period of time. Also see Ionograph.

Ounces of Copper. This refers to the thickness of copper foil on the surface of the laminate: 112 ounce copper, 1 ounce copper, and 2 ounces copper are common thicknesses. One ounce copper foil contains 1 ounce of copper per square foot of foil. The foil on the surface of the laminate may be designated for the copper thickness on both sides by: III = 1 ounce, two sides; 212 = 2 ounces, two sides; and 211 = 2 ounces on one side and 1 ounce on the other side. 112 ounce = 0.72 mil = 0.00072 inch; 1 ounce = 1.44 mils = 0.00144 inch; 2 ounces = 2.88 mils = 0.00288 inch.

Outgassing. De-aeration or other gaseous emission from a printed circuit board or solder joint.

PAD. A portion of a conductive pattern usually, but not exclusively, used for the connection, attachment, or both of components. Also called a "Land."

Pin Grid Array (PGA). Integrated circuit package in which the input and output points are through-hole pins arranged in a grid pattern.

P/I Structure. Packaging and interconnecting structure. See Printed Cir­cuit Board PCBIPrinting Wiring Board (PWB).

PLCC (Plastic Leaded Chip Carrier). A component package that has J­leads on four sides with standard spacing between leads.

Prepreg. Sheet material (e.g., glass fabric) impregnated with a resin cured to an intermediate stage (B-stage resin).

Primary Side. The side of the assembly that is commonly referred to as the component side in through-hole technology. In SMT, the primary side is reflow soldered.

Printed Circuit Board (PCB)IPrinted Wiring Board (PWB). The general term for completely processed printed circuit configurations. It includes rigid or flexible, single, double, or multilayer boards. A substrate of epoxy glass, clad metal, or other material upon which a pattern of conductive traces is formed to interconnect components.

754 Appendix C

Printed Wiring Assembly (PW A). A printed wiring board on which sepa­rately manufactured components and parts have been added. The generic term for a printed wiring board after all electronic components have been completely attached. Also called "printed circuit assembly."

Profile. A graph of time versus temperature. PTH (Plated Through Hole). A plated via used as an interconnection

between top and bottom sides or inner layers of a PWB. Intended for mounting component leads into through-hole technology.

Quadpack. Generic term for SMT packages with leads on all four sides. Most commonly used to describe packages with gull wing leads. Also known as a flat pack, but flat packs may have gull wing leads on either two or four sides.

Reference Designators. A combination of letters and numbers that identify the class of the component on an assembly drawing.

Reflow Soldering. A process of joining metallic surfaces (without the melt­ing of base metals) through the mass heating of preplaced solder paste to solder fillets in the metallized areas.

Resin Recession. The presence of voids between the barrel of the plated through hole and the wall of the holes, seen in cross-sections of plated through holes in boards that have been exposed to high temperatures.

Resin Smear. A condition usually caused by drilling in which the resin is transferred from the base material to the wall of a drilled hole covering the exposed edge of the conductive pattern.

Resist. Coating material used to mask or protect selected areas of a pattern from the action of an etchant, solder, or plating.

Saponifier. An alkaline chemical, when added to water, makes it soapy and improves its ability to dissolve rosin flux residues.

Secondary Side. The side of the assembly that is commonly referred to as the solder side in through hole technology. In SMT, the secondary side may be either reflow soldered (active component) or wave soldered (pas­sive component).

Self-Alignment. Due to the surface tension of molten solder, the tendency of slightly misaligned components (during placement) to self align with respect to their land pattern during reflow soldering. Minor self-alignment is possible, but one should not count on it.

Semi-Aqueous Cleaning. This cleaning technique involves a solvent clean­ing step, hot water rinses, and a drying cycle.

Shadowing (Infrared Reflow). A condition in which component bodies block radiated infrared energy from striking certain areas of the board directly. Shadowed areas receive less energy than their surroundings and may not reach a temperature sufficient to completely melt the solder paste.

Shadowing (Solder). A condition in which solder fails to wet the surface mount device leads during the wave soldering process. Generally the trail-

Glossary 755

ing terminations of a component are affected, because the component body blocks the proper flow of solder. Requires proper component orientation during wave soldering to correct the problem.

Single-Layer Board. A printed wiring board that contains metallized con­ductors on only one side of the board. Through-holes are unplated.

Single-Wave Soldering. A wave soldering process that uses only a single, laminar wave to form the solder joints. Generally not used for wave sol­dering.

SMC. A surface mount component. SMD. A surface mount device. Registered service mark of North American

Philips Corporation to denote resistor, capacitor, SOIC, and SOT. SMOBC (Solder Mask Over Bare Copper). The technology of using

solder mask to protect the external bare copper circuitry from oxidation, and for coating the exposed copper circuitry with tin-lead solder [usually by using the hot air level (HAL) manufacturing process].

SMT (Surface Mount Technolgy). A method of assembling printed wiring boards or hybrid circuits, where components are mounted onto the surface rather than inserted into through-holes.

SOIC (Small Outline Integrated Circuit). An integrated circuit surface mount package with two parallel rows of gull-wing leads, with standard spacing between leads and rows.

SOJ (Small Outline J-Leaded). An integrated circuit surface mount pack­age with two parallel rows of J-Leads, with standard spacing between leads and rows. Generally used for memory devices.

Solder Balls. Small spheres of solder adhering to laminate, mask, or con­ductors. Solder balls are most often associated with the use of solder paste containing oxides. Baking of paste may minimize formation of solder balls, but overbaking may cause excessive balling.

Solder Bridging. The undesirable formation of a conductive path by solder between conductors.

Solder Cream. See Solder Paste. Solder Fillet. A general term used to describe the configuration of a solder

joint that was formed with a component lead or termination and a PWB land pattern.

Solder Paste. A homogeneous combination of minute spherical solder parti­cles, flux, solvent, and a gelling or suspension agent used in surface mount reflow soldering. Solder paste can be deposited on a substrate via solder dispensing and screen or stencil print.

Solder Side. A term used in through-hole technology to indicate the sol­dered side of the PWB. See Primary Side and Secondary Side.

Solder Wicking. The capillary action of molten solder to a pad or compo­nent lead. In the case of leaded packages, excessive wicking can lead to an insufficient amount of solder at the lead/pad interface. It is caused by

756 Appendix C

rapid heating during reflow or excessive lead coplanarity, and is more common in the vapor phase than in IR soldering.

Solvent. Any solution capable of dissolving a solute. In the electronics industry, aqueous, semi-aqueous and non-ozone-depleting solvents are used.

Solvent Cleaning. The removal of organic and inorganic soils using a blend of polar and nonpolar organic solvents.

SOT (Small Outline Transistor). A discrete semiconductor surface mount package that has two gull wing leads on one side of the package and one on the other.

Squeegee. A rubber or metal blade used in screen and stencil printing to wipe across the screen/stencil to force the solder paste through the screen mesh or stencil apertures onto the land pattern of the PCB.

Stencil. A thick sheet of metallic material with a circuit pattern cut into it. Surface Insulation Resistance (SIR). A measure in ohms of the insulating

material's electrical resistance between conductors. Surfactant. Contraction of "surface active agent." A chemical added to

water in order to lower surface tension and allow penetration of water under tighter spaces.

TAB (Tape Automated Bonding). The process of mounting the integrated circuit die directly to the surface of the substrate, and interconnecting the two together using a fine lead frame.

Tape Carrier Package (TCP). See TAB. Tenting. A printed board fabrication method of covering over plated via

holes and the surrounding conductive pattern with a resist, usually dry film. (See Via hole and PTH.)

Termination. The metallization surfaces, or in some cases, metal end clips on the ends of passive chip components.

Thixotropic. The characteristic of a liquid or gel that is viscous when static, yet fluid when physically "worked."

Tombstoning. See Drawbridging. Type I Assembly. An exclusive SMT PCB assembly with components

mounted on one or both sides of the substrate. Type II Assembly. A mixed technology PCB assembly with SMT compo­

nents mounted on one or both sides of the substrate and through-hole components mounted to the primary or component side.

Type III Assembly. A mixed technology PCB assembly with passive SMT components and occasionally SOICs (small outline integrated circuits) mounted on the secondary side of the substrate and through-hole compo­nents mounted to the primary or component side. Typically this type of assembly is wave soldered in a single pass.

Ultra Fine Pitch. A center to center lead distance of surface mount packages of O.4mm or less.

Glossary 757

Vapor Phase Soldering. See Condensation Inert Heating. Via Hole. A plated through hole connecting two or more conductor layers

of a multilayer printed board. There is no intention to insert a component lead inside a via hole.

Void. The absence of material in a localized area. See also Blowhole. Wave Soldering. A process of joining metallic surfaces (without the melt­

ing of the base metals) through the introduction of molten solder to metal­lized areas. Surface mount devices are attached using adhesive and are mounted on the secondary side of the PWB.

Weave Exposure. A surface condition of base material in which the unbro­ken fibers of woven glass cloth are not completely covered by resin.

Wetting. A physical phenomenon ofliquids, usually in contact with solids, wherein the surface tension of the liquid has been reduced so that the liquid flows and makes intimate contact in a very thin layer over the entire substrate surface. Regarding wetting of a metal surface by a solder, flux reduces the surface tension of the metal surface and the solder, resulting in the droplets of solder collapsing into a very thin film, spreading, and making intimate contact over the entire surface.

Wicking. Absorption of liquid by capillary action along the fibers of the base metal. See also Solder Wickering.

Index

Accelerated test, of solder joint reliability, 254, 256

Accept/reject criteria, for solder joints, See workmanship

Accept/reject criteria, for voids in adhesive, 367, 368

Accuracy, of placement machines, 503-505 Acrylic adhesives, 345-46, 375, 376, 377, 378,

379 Active SMT components

characteristics of, 103-109 plastic packages as, 109-29 standards for, 728

Adhesives acrylic adhesives, 345-46 application methods, 350-58 conductive adhesives, 346-50 curing of, 341, 358-69 defects related to, 663-64 differential scanning calorimetry and evalua­

tion of, 369-80 dispensing capability of placement equip-

ment, 508, 509 epoxy adhesives, 344-45 introduction to, 339 postcure properties of, 342-43 precure properties of, 340-41 single-step soldering and, 556-58 void in adhesive, 362-368 wave soldering and contamination of, 678,

679 Alignment targets, for placement of compo­

nents, 300-302, 506 Alumina, advantages and disadvantages of as

substrate, 158, 167 Aluminum, and contamination of solder, 459 Anisotropic electrically conductive adhesives,

348, 349 Application specific integrated circuit (ASIC)

devices, 126, 305

Approved qualification status, for suppliers, 69 Aqueous cleaning solvents, 623, 630-36 Assembly. See also Manufacturing

costs of as design consideration, 225-26 quality control and testing of, 709-15

Automated inspection, of solder joints, 683-90 Automated placement, of parts, 496 Automated test equipment (ATE)

fixtures for, 711-14 guidelines for, 331-34 issues in, 714-15 solder joint inspection and, 683

Automatic printers, for solder paste, 404

Baking, high and low temperature cycles for, 247-48. See also Curinglbaking ovens

Ball grid array (BOA) packages alignment of components for placement,

300-302, 506 characteristics of as SMT components,

129-36 design considerations for, 211 inspection of, 683, 685-90 land pattern design for, 291-92 moisture-related cracking of, 29 repair of, 701-707 solder paste printing and, 437

Ball-wedge bonding, and chip-and-wire technol-ogy, 36

Barrel plating cracks, 199, 200 Barrier underplating. See Nickel Base limiting layer (BLM), for flip chip, 46 Batch-to-batch variation, in adhesives, 369 Batch cleaners, 624-25, 626-29, 634 BeryIlia, and composition of ceramic sub-

strates, 167 Binary phase diagram, 445-47 Binary vision imaging system, for component

placement, 506, 507

760 Index

Bismaleimide triazene (BT) resin, 134 Bismuth, in lead-free solders, 461, 463 Bismuth-tin, phase diagram, 465 Black ball phenomenon, in solder paste, 401 Blind vias, cost of, 220 Board warpage

quality control and, 659-60 solder paste printing and, 431

Body sizes, of BGAs, 130-31 Bond strength, and thermal cure profile of ad­

hesive, 359-62 Brazing, definition of, 533 Bridging, and wave soldering, 537-39, 549,

550, 677-78 Brookfield viscometer, 395-96, 426, See also

Maleom viscometer Bulk feeders, 518 Bumped tape-automated bonding (BTAB),

39-40 Buried vias, cost of, 220 Butt leads, 142-43, 673, 674 Butt mounting, 287-89

Capacitors characteristics of ceramic, 92-97 cracking of, 95, 661-63 land patterns for, 269-70 standards for, 727-28 tantalum, 97-101 wave soldering and shift in tolerance, 539

Capital investment, in SMT equipment, 20-27, 493

Carbon dioxide lasers, 585 Case sizes

of ceramic capacitors, 96-97 of molded tantalum capacitors, 99, 100 of resistors, 90

Castellations, of leadless ceramic chip carriers, 104

Ceramic ball grid array (CBGA) characteristics of, 131-32 solder ball composition in, 706, 707

Ceramic capacitors, characteristics of, 92-97, 648

Ceramic column grid array (CCGA), 132-33 Ceramic leaded chip carriers, characteristics of,

108-109 Ceramic packages

characteristics of, 103-109 cracking of plated-through holes, 30

Ceramic substrates, characteristics of, 167-69 Chelation, of water, 633-34 Chemically etched stencils, 432-34, 435,

436 Chip-on-board (COB) technology

description of processes, 33-36 tape-automated bonding (TAB) compared to,

39 Chip capacitors, at SIR site, 647-48 Chip scale packaging (CSP), characteristics of,

136-37 Chip-and-wire technology, description of pro­

cesses in, 36-38 Chlorofluorocarbons (CFCs), environmental im­

pact and decline in use of, 25, 552, 558, 598, 615, 616-19

Cleaning and cleanliness, selection of pro-cesses for

adhesives and tests for, 367 alternatives to CFCs, 623 aqueous cleaning, 630-36 capital investment in equipment for, 25 cleanliness testing and requirements, 636-

46 concerns in, 599-601 contaminants and, 612-15 designing for, 330, 646-48 introduction to, 598-99 organic solvents and, 623-25 selection of materials for, 615-21 semi-aqueous cleaning, 625-30 solder paste and, 393 test methods for, 636-46

Coatings, alternative for board surfaces, 191-94. See also Surface finish

Coefficients of thermal expansion (CTEs) characteristics of substrates, 152-55 constraining core substrates, 169-73 LCCCs and mismatch of, 5 package cracking and, 234 solder joint cracking and, 251-52 substrate selection and compatibility,

163-65 Cohesive failure, in adhesives, 342 Colored adhesives, 340 Colored resistive layer, of surface mount resis­

tor, 90-91 Color legends, and solder mask application,

183-84 Column diameter, for CCGAs, 132-33 Compliant layer substrates, 173-74

Components, for SMT. See also Placement, of components

ball grid arrays (BGAs), 129-36 characteristics of, 86-87 chip scale packaging (CSP), 136-37 cleaning materials and, 620 cost and, 224-25 defects related to, 660-63 design issues, 211-12 design-for-manufacturability and orientation

of,311-16 design-for-manufacturability and selection

of,302-305 introduction to, 85-86 land patterns for, 266-72 lead configuration, 140-43 lead coplanarity, 138-39 passive surface mount components, 87-

102 procurement guidelines for, 144-46 solder paste printing and types of, 436-41 standards for, 144, 726-30 types and sizes of and selection of place­

ment equipment, 502 Computer-assisted design (CAD)

design and layout considerations, 260-61 land patterns and, 267 pad-to-pad spacing and, 317 placement equipment and, 510 tooling of for SMT, 30

Condensation soldering. See Vapor phase sol­dering

Conditional qualification status, of suppliers, 68-69

Conductive adhesives, 343, 346-50 Conductive tooling, for repair and rework, 26 Constraining core substrates, 149, 169-73 Contaminants, and cleaning, 612-15 Controlled collapse bonding, 41-47 Convection ovens

for adhesive curing, 358, 359, 364, 366 for reflow soldering, 24

Cooling zone, in reflow soldering, 582 Copper, and glass epoxy substrates, 175. See

also Copper plating Copper plating, electroless and electrolytic pro­

cesses of, 186-89 Corner bumpers, and fine pitch packages, 127,

128 Cosmetic defects, 668-69 Cosolvent cleaning, 623-24

Index 761

Cost benefits of SMT, 19-20 design and considerations of, 208, 218-26 hot bar soldering and, 590 metal composition of solder paste and, 385,

387 selection of cleaning materials and, 619-20 selection of soldering options and, 593-94

Cover plates, and wave soldering, 308, 309 Cracking. See also Moisture-induced cracking

as component-related defect, 661-63 DIP leads and, 306 mechanisms of, 234-44 moisture-sensitivity classification for, 233-

34, 248-50 reliability of plastic packages and, 233-34 solutions to, 244-48 of via holes in substrate, 198-201

Curing, of adhesives, 358-69 Curinglbaking ovens, capital investment in,

23-24 Cyanoacrylate adhesives, 346 Cyclic hysteresis loop, 254--55 Cylindrical components, solder joint require­

ments for, 669, 670 Cylindrical passive (MELF) devices, land pat­

terns for, 272-75

Data loggers, and wave soldering, 543 Deionization, of water for cleaning, 631,

633-34 Deming, W. Edwards, 652, 653 Department of Defense, and SMT standards,

62. See also Military Desiccants

classification and floor life of components packed in, 240

shipping of baked packages in, 245 Design, of SMT. See also Design for manufact-

urability (DFM) CAD layout and, 260-61 cleaning and, 646-48 cost as factor in, 218-26 defects related to, 665-66 interconnections and, 257-60 introduction to, 204-205 land pattern, 264-95 manufacturing considerations in, 214,

217-18 package drivers, 207-12

762 Index

reliability of package and, 232-50 solder joint reliability and, 250-57 space concerns in, 212-14 specifications of rules and guidelines for, 59 standards for, 730-31 system considerations in, 205-206 thermal considerations in, 226-32 wave soldering and, 536-40

Design for manufacturability (DFM). See also Design

cleanliness and, 330 component orientation and, 311-16 general considerations in, 299-302 in-house documents for, 265 inter-package spacing, 316-17 introduction to, 296-97 organizational structure for, 297-99 repairability and, 328-29 soldering and, 305-11 solder mask and, 326-28 testability and, 330-34 via holes and, 322-26

Design team, and organizational structure for DFM,297-99

Dewetting, of solder, 469-71 Die size, and package cracking, 239-40 Differential scanning calorimetry, and evalua-

tion of adhesives, 369-80 Dip and look test, 476-79 Dispensing, and solder paste printing, 423-24 Dissolution, of metals in solder, 452, 453, See

also leaching Double-sided boards

single-step soldering of, 556-58 solder considerations in design of, 310-11

Drawbridging, and component misalignment, 678

Driclad resin, 134 Dry film solder masks, 195-97, 198, 327, 539 Dual in-line packages (DIPs)

butt mounting of, 143 development of, 3, 4 gull wing or J leads and cracking of, 306 land patterns for, 287-89 moisture-related cracking of, 29

Dual-wave soldering, 545-47 Dul! solder joints, 459-60 Dynachem Conformask, 327

ECD Inc. (Portland, OR), 543, 577 EDI Inc. (San Diego, CAl, 543, 577

Elasticity, and compatible CTE approach to substrate selection, 164-65

Elastomeric adhesives, 343 Electrically conductive adhesives, 346-48, 349 Electrical system, and package design, 208 Electroformed stencils, 434-36 Electroless plating

copper plating, 186-89 definition of, 184

Electrolytic plating, and copper, 186-89 Electromechanical components, standards for,

728-30 Electromigration, of polar contaminants in

cleaners, 614 Electronics Industries Association (EIA), 60,

61-62,264,2655 Electronics Industries Association of Japan

(ElAJ), 126-29,264,265 Electroplating, definition of, 184 Encapsulated tantalum capacitors, 303 Epoxy adhesives, 344-45, 372, 373, 374, 375 Epoxy aramid fiber and paper, advantages and

disadvantages of, 156 Equipment, for surface mount technology. See

also Placement; Printing; Solder and sol­dering

capital investment required, 20-27 specifications for, 58-59

Etched stencils, 432-34, 435, 436 Eutectic solder, 456 Eutectic temperature, and phase diagram, 447 Evaluation. See also Tests and testing

of adhesives through differential scanning calorimetry, 369-80

of suppliers, 67 Excess solder joints, 677 Experience, SMT processes and hands-on, 57 External SMT infrastructure, and standards,

60-62

Fabrication, of glass epoxy substrates, 178-84 Fatigue resistance, of solder alloys, 456 Feeders, for placement machines

input rates of, 500, 502 selection of, 514-22

Fiberglass/aramid composite fiber, advantages and disadvantages of, 157

Fiberglass/Tefion laminates, advantages and dis­advantages of, 157

Fiducials, for placement, 300-302 Filler metals, in adhesives, 347, 348

Fillet size, and metal content in solder paste, 388

Fine pitch packages alignment targets for component placement,

508 characteristics of, 126-29 design considerations for, 211 land patterns for, 289-91 solder paste printing and, 437-38

Fire hazard, cleaning solvents as, 621 Fit, as design consideration, 206 Flash point, of solvents, 621 Flat packs, development of, 3-4 Flex on cap (FOC), 47 Flexible dielectric, advantages and disadvan-

tages of, 157 Flexible metal mask stencils, 420-21 Flip chip, 41-47 Flux

activators in solder paste, 391-93 classification of, 603-12 entrapment of and adhesive cure profile,

362, 364, 367 function of, 601-602 introduction to, 598-99 selection of, 602-603 solderability testing and, 476 wave soldering and activity monitoring,

540-41 Form, as design consideration, 206 FR-4 laminates, 176 Function, as design consideration, 206-207 Functional cycling, as solder joint reliability

test, 253

Gang bonding, and TAB, 38 Glass epoxy substrates, characteristics of,

174-84 Glass transition temperature, and substrate lami-

nates, 150-52 Global warming, and CFCs, 617, 618, 623 Globule test, 482 Gold

as alternative coating for board surface, 193-94

ceramic substrates and, 167-68 indium-lead alloy solders and, 385 plating with, 189

Gray scale vision imaging systems, for BGA placement, 506, 507

Greenhouse effect, and CFCs, 617, 618

Gritty solder joints, 459 G-lO laminates, 176 GT laminate, 176 Guidelines

Index 763

for acceptable solderability in dip and look test, 478

for adhesive dot sizes, 352 for ATE testing, 331-34 for component selection, 302-305 for manual placement of components,

495-96 Gull wing leads

configuration of, 140-41 land patterns for fine pitch packages and,

289-91 solder joint requirements for, 671

GX laminate, 176

Halide-free fluxes, 603-605 Halons, 616, 618 Heating zones, and infrared reflow soldering,

569 Heat sinks, 349, 350 Heat spreaders

package design and, 227-28, 230 cracking and, 240, 244

Heat transfer mechanism in convection dominant soldering systems,

571-73 in infrared dominant soldering systems,

570-71 in vapor phase soldering, 561-63

Hermetic leadless ceramic chip carriers, types of, 104-105, 107-108

Hexamethyldisilazane (HMDS) vapor, 244 HFE-7100, 623 High temperature baking, 247 Hollis turbulent wave, 550, 551 Horizontal tube feeders, 519 Hot air repair/rework tools, 26, 328-29, 694-

97,699-701 Hot air solder leveling (HASL), 190, 484 Hot bar soldering, 588-91 Hot belt reflow soldering, 592 Hot dipping process, 485, 487-88 Humidity indicator cards (HIC), 245, 246,

248 Hybrid technology, and development of SMT, 4 Hydrochloric acid, as polar contaminant, 615 Hydrofluorocarbon (HFC) solvents, 623 Hydrofluoroether (HFE) cleaning solvent, 623

764 Index

Icicles, and wave soldering, 549-50, 678 I leads, 142-43 Implementation, of SMT as new technology

introduction to, 51-52 oflSO 9000, 719-20 manufacturing strategies and, 63-64 risk management and, 78-80 selection of outside assembly houses, 64-77 setting of strategy, 52-55 of statistical process control, 657-58

Indium, in lead-free solders, 461, 462, 463 Indium-lead alloy solders, 385 Inert environment, and soldering, 552-55,

575-76 Infrared (IR) ovens

for adhesive curing, 358, 359, 364, 365, 366 for reflow soldering, 24-25

Infrared reflow soldering, 567-76 Infrastructure, building of for SMT, 55-62 In-line cleaning systems, 629, 634 Inner lead bonding, for TAB, 40 Inorganic fluxes, 605-606 Inspection

equipment for, 26-27, 683-687 of solder joints, 681-90

Institute of Interconnecting and Packaging Elec-tronic Circuits (IPC), 60-62, 233, 264-65

Insufficient solder joints, 677 Insulation resistance, of adhesives, 342 Interconnections, as design consideration,

257-60 Internal pad-tubelet separation, 693 Internal reviews, and ISO certification, 717 Internal SMT infrastructure, development of,

56-60 International Electrotechnical Commission

(lEC), address of, 725-26 ISO 9000 quality standards and certification,

715-21

Japan butt leads, 143 COB technology, 34 development of SMT, 5, 533-34 quality control, 651, 652 SOlCs and, 115, 117 surface mount resistors and capacitors, 87

J-Ieads configuration of, 142 development of SMT and, 6 solder joint requirements for, 672, 673

Joint Electron Device Engineering Council (JEDEC),61

Junction-to-ambient thermal resistance, 227, 228, 231-32

KIC (EDI Inc.), 543, 577 Kyzen Ionox MC, 625

Laboratory, in-house SMT, 57 Laminate substrate, definition of, 149 Land patterns

for ball grid arrays, 291-92 for cylindrical passive (MELF) devices,

272-75 for DIP packages, 287-89 for fine pitch, gull wing packages, 289-91 introduction to, 264-65 for leadless ceramic chip carriers, 281-83 for passive components, 266-72 for plastic leaded chip carriers, 275-81 for small outline integrated circuits and R­

packs, 283-85 for small outline J-Iead devices, 286, 287 for solder paste and solder mask screens,

294 spacing requirements for selected compo­

nents,215-16 for TAB, 293 for transistors, 275

Lasers automated inspection of solder joints, 685 cut stencils, 434, 435, 436 reflow soldering, 584-88

Leaching metallization leaching in passive compo­

nents, 451-54, 539-40 nickel barrier underplating and prevention

of, 304 Lead, in semi-aqueous solvents, 619. See also

Lead-free solder Lead chloride, as polar contaminant, 614-15 Leaded ceramic packages, and substrates with

unmatched CTEs, 165 Lead-free solder, metallurgy of, 460-66 Leadless ceramic chip carriers (LCCCs)

characteristics of, 104-108 military and development of, 5 land patterns for, 281-83 solder joint reliability and, 252 solder joint requirements for, 674-75

Leads. See also Gull wing leads; J-Ieads configuration of and surface mount compo­

nents, 140-43 coplanarity and surface mount components,

138-39 finish on and solderability of, 485-90

Lead-tin solder plating, 189-91 Lid orientations, for ceramic chip carriers, 107 Liquid photoimageable (LPI) solder masks,

327, 539 Low residue fluxes, 599, 608-12 Low solid fluxes (LSFs), 609 Low temperature baking, 247-48

Malcom viscometer, 395-96, 398, 399, 426 Management

of relationships with suppliers, 76-77 review of SMT infrastructure, 56-57

Manual placement, of parts, 494-96 Manufacturing. See also Assembly; Design

for manufacturability; Fabrication implementation of in-house strategy, 63-64 questionnaires for rating of suppliers, 74-75 substrate selection and, 165-67 technical issues in, 31

Marketing, and ISO certification, 716 Materials

quality control and defects related to, 658-66

specifications for, 58 standards for, 730 for substrates, 155-67

Maximum power rating, and thermal design rules, 231

Mechanical cycling, as test of solder joint relia-bility, 255-56

Melting point, of solders, 386-87 Mesh designation, of solder paste, 389 Metal electrode leadless faces (MELFs)

characteristics of, 10 1-102 disadvantages of, 304 land patterns for, 272-75

Metallurgy, of solders component lead or termination finish and,

485-90 introduction to, 444-45 lead-free solder, 460-66 metallization leaching in passive compo­

nents, 451-54 Ni-Pd lead finish and, 488-90

phase diagrams, 445-51 properties of alloys, 454-60 solderability and, 466-73

Index 765

substrate surface finish and, 482, 484-85 test methods and requirements, 473-82

Metals, and composition of solder paste, 385-88. See also Metallurgy

Metal squeegees, 429-30 Microcracking, and nickel/palladium coated

leads, 489 Military. See also Department of Defense

development of SMT, 5 leaded ceramic packages, 252 standard documents, 725

Miniaturization, and COB technology, 34 Misalignment, of components, 677 Modified wave soldering, 549-50 Moisture. See also Moisture-induced cracking

package cracking and absorption data, 238 plastic packages and sensitivity to, 110 reflow soldering and, 232 sensitivity classification for package crack­

ing, 233-34, 248-50 Moisture-induced cracking

of BGAs, 29 of DIPs, 29 of tantalum capacitors, 98, 100-101

Molded plastic tantalum capacitors, 97, 270, 272 MOLE (ECD Inc.), 543, 577 Montreal Protocol, 598, 618 Multichip modules, description of processes

for, 47-49 Multicore Prozone, 625 Multilayer ceramic capacitors, 92-96 Multilayer printed circuit boards

glass-epoxy substrates and fabrication of, 178-84

thermal expansion of, 153-55 Multilevel stencils, 421, 422

Networks, surface mount resistor, 91-92 Nickel

barrier underplating and prevention of leach-ing, 304, 452, 540

lead finishes and solderability of, 488-90 plating of board surface with, 189 underplating of via holes with, 199, 200

Nitrogen IR reflow soldering in, 575-76 wave soldering in inert environment and,

552-55

766 Index

Noble metal coatings, for board surfaces, 191, 193-94

No-clean fluxes, 392-93, 599, 608-12 Non-equipment-dependent processes, specifica-

tions for, 58 Noneutectic solder, 449, 450, 456

Nonpolar contaminants, in cleaners, 612-13 Nonwetting, of solder, 469 Numerical control standards, 733-34

Odor, of cleaning solvents, 621 Omega Wave, 547-49 Organic acid (OA) fluxes, 392, 606-607 Organic based substrates, advantages and disad-

vantages of, 156 Organic solderability protection (OSP), 191,

193, 194 Organic solvents, 623-25 Organizational structure, for DFM, 297-99 Original equipment manufacturers (OEMs),

and package design, 210 Outer lead bonding, for TAB, 40-41 Outgassing, and wave soldering, 537 Outsourcing, standards for, 734 Over molded plastic pad array (OMPAC), 133 Oxidation, of solder powder particles, 401, 403 Ozone layer, CFCs and depletion of, 598, 617,

618

Palladium, as coating for board surface, 193, 194

Parasitics multichip modules and, 48 SMTs and reduction in, 17

Particulate contaminants, in cleaners, 612-14 Particle size, and shape in solder paste, 388-91 Part movement, and reflow soldering, 583 Partnership, and relationships with suppliers,

76-77 Passivation layer, of resistor, 88-89 Passive surface mount components

characteristics of, 87-102 land patterns for, 266-72 metallization leaching in, 451-54, 539-40 standards for, 727-28

Peelable masks, for solder, 195 Pentaerythritol tetrabenzoate, 608-609 Perfluorocarbons, 623 Personnel. See Organizational structure;

Training

Petroferm solvents, 621 Phase diagrams, and metallurgy of solder,

445-51 Photoimageable solder masks, 197-98 Pick-and-place equipment. See also Placement

adhesive dispensing head, 354, 355, 356 capital investment, 22-23, 493 flip chip assembly and, 44, 45 questionnaire evaluating, 735-42

Pin numbering system, for PLCCs, 121 Pin transfer, of adhesives, 353 Placement, of components. See also Pick-and­

place equipment automated, 496 capital investment in placement machines,

22-23, 493 commercially available equipment for,

522-31 introduction to, 493-94 manual placement of, 494-96 selection criteria for equipment, 497-514 selection of feeders for, 514-22

Plan, writing of for internal SMT infrastruc­ture,56

Plastic ball grid array (PBGA), 133-35, 706, 707

Plastic leaded chip carriers (PLCCs) as active SMT components, 121-24 development of SMT and, 5-6 land patterns for, 275-81 lead coplanarity in, 138, 139 wave soldering and, 310

Plastic packages, as active SMT components, 109-29

Plating processes, for substrates, 184-91 Polar contaminants, in cleaners, 612-13,

614-15 Polymers, and glass transition temperature,

150-52 Polymide aramid fiber, advantages and disad­

vantages of, 157 Polymide fiberglass, advantages and disadvan­

tages of, 156 Polymide quartz, advantages and disadvantages

of, 157 Polymides, and substrate laminates, 176 Porcelainized steel substrates, 168-69 Postleaded chip carriers, 109 Pot life, of adhesives, 340 Powder size, of solder paste, 388-91 Preheat zone, and reflow soldering, 581 Preleaded ceramic chip carriers, 108-109

Preliminary survey, for supplier qualification, 68

Printability, of solder paste, 403-404 Printed circuit boards (PCBs)

cost and design of, 218, 220, 222, 224 impact of contaminants on, 612 solder paste screen printers and, 23 standards for, 729-30

Printing equipment and processes, for solder paste. See also Screen printing; Stencil printing

different types of components and, 436-41 equipment for, 23, 404-409 processes of, 409-25 variables in, 426-36

Process-related defects, 664-65 Procurement, of SMT components, 144-46 Profile development

rellow soldering and, 576-82 wave soldering and, 542-44

Programmable logic devices (PLDs) manual placement of, 496 placement equipment and, 513 thermal problems and, 229

Propagation delay, and interconnect design con­siderations, 259-60

Quad packs, and development of SMT, 5 Qualification, of suppliers, 67-69 Qualification requirements, for components,

304 Quality manuals, for ISO 9000, 719 Quality and quality control. See also Reliabil-

ity; Testing assembly testing and, 709-15 introduction to, 651 ISO 9000 standards and certification,

715-21 materials and, 658-66 solder joints and, 666-79, 681-90 standards for, 732 statistical quality control, 652-58 of via holes, 201

Questionnaires for evaluating SMT equipment, 735-46 for rating of suppliers, 70-76

Ramp rate cure profile for adhesive and, 364, 367 package cracking and, 235

Index 767

Rating, of suppliers, 69-76 Real estate. See Size reduction; Spacing Records, for ISO 9000, 719 Rectangular chip components, solder joint re­

quirements for, 668, 669 Rectangular passive components, and land pat­

tern design, 269-70 Rellow ovens, questionnaire for evaluating,

744-46 Rellow soldering

capital investment in equipment for, 24-25 common defects in, 582-84 curinglbaking ovens and, 23-24 development of, 534 hot belt rellow soldering, 592 infrared rellow soldering, 567-75 laser rellow soldering, 584-88 moisture and, 232 no-clean Iluxes and, 611 profile development, 576-82 via hole location and, 325-26

Rellow zone, and rellow soldering, 581-82 Relationships, management of with suppliers,

76-77 Relative humidity, and moisture absorption,

239 Reliability

of compliant layer substrates, 174 as package design consideration, 232-50 of solder joints as design concern, 250-57 standards for, 733 via hole diameter and, 164, 199, 200 wave soldering and, 539

Repairs. See also Reworking electrically conductive adhesives and, 348 equipment for and processes of, 26-27,

690-709 of BGA, 701-07 repairability as consideration in design,

328-29 standards for, 734

Repeatability, and selection of placement ma­chines, 503-505

Required paste volume (RPV), for solder paste printing of through hole components, 440

Resins for PBGAs, 134 thermoplastic as substrate, 156

Resistors land patterns for, 269-70 networks of, 91-92 standards for, 728

768 Index

surface mount discrete, 88-91 wave soldering and shift in tolerance, 539

Reworking. See also Repairs adhesives and, 342 profiles for, 707-709

Rheological properties, of solder paste, 393-400

Risk management, and implementation of SMT,78-80

Robber pads, SOlC orientation with, 315 Robotic placement, 22-23 Rosin-based fluxes, 391-92, 607-608 Rotational accuracy, of placement machines,

504-505 R02800 (substrate material), 164-65 R-packs, 92, 283-85 Rubber squeegees, 428-29

Saponifiers, 630 Scanned beam laminography inspection, of sol­

der joints, 685-90 Screen printers and printing

questionnaire for evaluating, 742-44 for solder paste, 23, 405-419, 421-23, 431

Seating planes, for ceramic chip carriers, 107 Selection

of cleaning materials, 615-21 of components and design-for-manufactura-

bility, 302-305 of fluxes, 602-603 of placement equipment, 497-522 of printing equipment for solder paste,

405-409 of soldering process and equipment, 593-94 of solder mask, 194-98 of substrate material, 155-67 of suppliers, 64-77 of processes for SMT, 58-59

Selective printing, 421-22 Semi-aqueous solvents, 619, 620, 623, 625-30 Semi-automatic printers, for solder paste, 404-

405, 407, 414-18 Service, of placement equipment, 511-12 Shelf life, of adhesives, 340, 345 Shock resistance, as benefit of SMT, 17-18 Silver, in tin-lead solders, 385, 387 Single-camera systems, for alignment of com-

ponents, 505 Single-step soldering

of double-sided boards, 556-58 of mixed assemblies, 555-56

Size reduction, as benefit of SMT, 15-17, 18. See also Spacing

Skipping of adhesive, 358 of solder, 537, 538

Ski-slope feeders, 519 Slot capacity, of placement machines, 500, 502 Slug packages, 228, 229, 230 Slump, of solder paste, 398, 664 Small outline integrated circuit (SOlC)

packages characteristics of, 114-20 development of SMT and, 5, 9 land patterns for, 283-85 robber pads and orientation of, 315 wave soldering and design of, 310, 316, 317

Small outline J packages (SOJ s) characteristics of, 124-26 land patterns for, 286, 287

Small outline packages (SOPs) characteristics of, 118, 119 land patterns for, 283-86

Small outline transistors (SOTs) characteristics of, 112-14 land pattern design for, 275 low versus high profile, 303

Soak zone, and reflow soldering, 581 Socketing, and package design, 210 Sockets, standards for, 729 SOD 123 transistor/diode, land pattern for, 278 Software, programs for placement equipment,

508,510-11 Solder balls, 400-403, 612 Solder bumping, for flip chip, 46-47 Soldering irons, for repair, 697-99 Solder joint requirements, 666-79 Solder mask

cleanliness and, 647 design for manufacturability (DFM) and,

326-28 reflow soldering and discoloration of, 584 selection of, 194-98 solder mask over bare copper (SMOBC) and

glass epoxy substrates, 179, 182 Solder paste

defects related to, 664 introduction to, 383 no-clean, 609, 610 printing for different components, 436-41 printing equipment for, 404-409 printing processes for, 409-25 printing variables, 426-36

properties of, 383-404 screen printers for, 23

Solder and soldering. See also Cleaning; Flux; Land patterns; Reflow soldering; Solder mask; Solder paste; Wave soldering

design for manufacturability and, 305-11 hot bar soldering, 588-91 introduction to, 533-35 land patterns for paste and mask screens,

294 lead-tin plating and, 189-91 metallurgy of, 444-90 quality control and solder joints, 666-79,

681-90 reliability of joints as design consideration,

250-57 selection of process and equipment for,

593-94 single-step of double-sided boards, 556-58 single-step for mixed assemblies, 555-56 standards for, 731-32 of ultra fine pitch packages by hot bar pro­

cess, 10-11 vapor phase soldering (VPS), 558-66

Solid solder deposition (SSD), 191 Solvent extraction, as test for cleanliness,

636-37 Solvents. See Cleaning and cleanliness;

Flux SOT 143 transistor/diode, land pattern for, 278 SOT 223 transistor/diode, land pattern for, 279 Spacing, interpackage. See also Size reduction

ATE testing and, 332, 333 as design consideration, 208-209, 212-14 design-for-manufacturability and, 316-22 minimums for, 324 requirements for selected components,

215-16 Specifications, categories of for SMT Squeegees, and solder paste printing, 428-30 S-shaped leads, 252 Staggered components, 313-14 Staggered vias, 222 Standard form factor, 299-300 Standards and standardization

external SMT infrastructure and, 60-62 for land patterns, 264-65 list of, 725-34 on moisture sensitive package classification,

233-34 SMT components and, 144

Stand-off clearance, for components, 600

Index 769

Statistical quality control, 652-58 Steam aging requirements, 474-75 Steel, and porcelainized steel substrates,

168-69 Stencil printing

of adhesives, 351, 353 of solder paste, 23, 410-14, 419-23, 431-36

Stencils, aperture width and powder size of sol-der paste, 390, 391

Step soldering, 459 Stick feeders, 519-521 Storage rack, for stencils, 415 Streaking properties, of cleaning materials, 621 Stress-deformation curves, for epoxy-glass lam-

inate, 151 Stringing, of adhesive, 356-57 Stylus, for pin transfer of adhesive, 354 Subcontractors

as alternative to in-house manufacturing, 63-64

selection of, 64-77 Substrates, for surface mounting

alternative coatings for board surfaces, 191-94

ceramic, 167-69 coefficients of thermal expansion (CTE) and,

152-55 compliant layer substrates, 173-74 constraining core substrates, 169-73 glass epoxy substrates, 174-84 glass transition temperature, 150-52 introduction to, 149-50 material selection for, 155-67 placement machines and maximum size of,

500,501 plating processes for, 184-91 quality control and defects related to,

659-60 solder mask selection, 194-98 surface finishes and solderability of, 482,

484-85 via hole cracking in, 198-201

Suppliers, selection of, 64-77 Surface finishes, and solderability, 482,

484-90 Surface insulation resistance (SIR)

of adhesives, 343, 367 as cleanliness measurement method, 614,

637-46, 647-48 Surface Mount Council, 62, 233, 264, 265 Surface Mount Equipment Manufacturers Asso­

ciation (SMEMA), 62

770 Index

Surface mount technology (SMT) adhesives for, 339-81 applications appropriate for, 27-28 benefits of, 14-20 capital investment in equipment for, 20-27 cleaning of, 598-651 components for, 85-147 design considerations, 204-61 design for manufacturability (DFM),

296-335 flux and cleaning processes for, 598-649 future of, 33-49 history of, 3-7 infrastructure and implementation of as new

technology, 51-81 inspection of, 681 land pattern design, 264-95 metallurgy of solder, 444-90 placement of components, 493-532 quality control for, 651-722 repair of, 690-94 soldering of components, 533-95 solder paste and, 383-441 substrates for, 149-202 technical issues in, 28-31 test of, 330-331, 709-11 trends in, 31-33 types of, 7-14

Surface Mount Technology Association (SMTA),62

Surface tension, of cleaning solutions, 620-21 Switches, standards for, 729 Syringing, of adhesives, 353-54, 356-58

Tackiness, of solder paste, 400 Tantalum capacitors

characteristics of, 97-10 I encapsulated, 303

. land pattern designs for, 270-72 Tape-automated bonding (TAB)

description of processes, 38-41 hot air soldering and, 588, 589 land pattern design for, 293

Tape ball grid array (TBOA), 135-36,706-707 Tape and reel feeders, 514-18 Tape and reel packaging, standardization of,

144 Temperature

curing of adhesives and, 341, 360-61, 362 decomposition of adhesives and, 375

decomposition of fluxes and, 607 dissolution rate of metals in solder, 453-54 glass epoxy boards and operating, 178, 179 package cracking and threshold for, 235 plastic packages and, 110 of soldering as factor in component selec­

tion, 303 substrate selection and, 166 substrate laminates and glass transition,

150-52 viscosity of adhesives and, 357 viscosity of solder pastes and, 426-27

Tensile strength, of copper plating, 188 Terminations, surface finish and solderability

of, 485-90 Tessera Micro BOA, 137 Tests and testing. See also Evaluation

of adhesives, 367 of assemblies, 709-11 capital investment in equipment for, 31 of cleanliness, 636-46 design for manufacturability and, 330-34 of placement equipment, 513 slump test of solder paste, 398 of solderability, 473-82 of solder joint reliability, 253-57 standards for, 734 of via holes, 20 I

Test points (TPs), guidelines for, 332 Thermal cure, of adhesives, 358 Thermal cycling, as solder joint reliability test,

253-54, 255, 256 Thermal expansion. See Coefficients of thermal

expansion Thermally conductive adhesives, 349-50 Thermal management, and package design,

208, 226-32 Thermal shock

cracking of capacities, 95, 660-63 dry film solder masks, 196 hot air solder leveling and, 190 reflow soldering and, 583

Thermocouples, and wave soldering, 543 Thermodes, and hot bar soldering, 589 Thermoplastic adhesives, 343-44 Thermoplastic resin, advantages and disadvan-

tages of as substrate, 156 Thermosetting adhesives, 344 Thick film technology

ceramic substrates and, 167, 168 characteristics of resistors for, 88

Thin film technology ceramic substrates and, 167, 168 characteristics of resistors for, 88

Thixotropic fluids, solder pastes as, 394 3M Corporation, 623 Through-hole mount assembly (THMA)

cost of compared to SMT, 218 solder paste printing and mixed assemblies,

438-41 Tin-lead plating, of glass epoxy substrates,

179, 182 Tin-lead solders

composition of, 385, 387 phase diagrams for, 445, 447-49

Tin-zinc, phase diagram, 465 Titanium, as cover plate material, 309 Tombstoning

component misalignment and, 678 land patterns and, 268 reflow soldering and, 583

TO 252 (DPAK) transistor/diode, land pattern for, 279

Training, of personnel effective SMT implementation and, 59-60 placement equipment and, 511-12

Transistors, land patterns for, 275 Transistor-transistor logic (TTL) devices, 229 Transmission X -ray inspection, of solder

joints, 685-90 Tube feeders, 519, 520, 521 Tubular MELF devices, land pattern design

for, 274 Tubular passive components, 101-102 Two-camera systems, for alignment of compo­

nents, 505 2,3 dihydrodecafluoropentane compound, 623

Ultra fine pitch (UFP) packages soldering of by hot bar process, 10-11 solder paste printing and, 437-38

Ultrasonic cleaning, 629 Ultraviolet (UV) light, and curing of adhe­

sives, 345, 367, 369 Undercutting, of chemically etched stencils,

432-33 Urethane adhesives, 346

Vacuum pipette, for placement of components, 495

Index 771

Vapor degreasers, 624-25 Vapor phase soldering (VPS), 24, 558-66 Vendors. See Suppliers Vertrel SMT, 623 Via holes

cracking problems in substrates, 198-201 design for manufacturability and, 322-26 prevention of cracking, 251 size of and cost, 222, 224 size of and plate-through-hole (PTH) reliabil­

ity, 164 Vibrating wave soldering, 547-49 Viscosity

of adhesives, 357 of solder paste, 394-97, 426-27, 664

Vision capability, of placement machines, 505-508

Visual inspection for cleanliness, 636 of solder joints, 680, 681-83

Voids in adhesives, 362, 364 in solder joints, 678-79 solder paste and formation of, 393

Waffle packs fine pitch packages and, 128, 522 placement equipment and, 521-22

Warpage of boards and quality control, 659-60 of PBGA packages, 134-35

Washable masks, for solder, 195 Water cleaning, 630 Water-soluble fluxes, 392 Watt ratings, of resistors, 89 Wave soldering

capital investment in equipment for, 25-26 cover plates and, 308, 309 development of, 533 epoxy adhesives and, 375 inert environment and, 552-55 leaching and, 454 lead-free solder, 466 nickel barrier underplating, 304 no-clean fluxes and, 611 of plastic packages, 119 process of, 535-42 profile development for, 542-44 SOlCs and, 9, 316, 317 types of, 544-50, 551

772 Index

Wedge-wedge bonding, and chip-and-wire tech-nology, 36-37

Weight reduction, as benefit of SMT, 14-15 Welding, definition of, 533 Weller Pick-a-Chip apparatus, 699,700 Wet film solder masks, 195-97, 327 Wetting, and solderability, 467-68, 469 Wetting balance test, 479-82 Wicking, of solder joints, 456-57, 564-66,

678 Working life, of solder paste, 399 Work instructions, for ISO 9000, 719 Workmanhip,666-69

X-ray laminography, 690 X7R capacitors, 303, 663 XXXPC laminate, 176, 178 X-Y tables, for placement of components,

504-505, 508, 512

YAG-Nd lasers, 585, 586

Z-axis adhesives, 348 Z5U capacitors, 303, 663 Zinc-tin lead-free solder, 464, 465