apple a9 series application processor
TRANSCRIPT
APL5598
APL0698 APL5698
ARM® ARMv8DC 28nm HKMG
ARM® ARMv7aDC, 32nm HKMG
DC, 28nm HKMGM7 Motion Coprocessor
ARM® ARMv7DC 32 HKMG
APL5498
APL0598
DC, 32nm HKMG
APL2498APL0498
ARM® CortexTM‐A9DC, 45nm
APL7498
ARM® CortexTM‐A9DC, 45nm
ARM® CortexTM‐A9DC, 32nm HKMG
ARM® CortexTM‐A9SC, 32nm HKMG
APL2498APL0498
APL0398
APL7498
2010 2011 2012 2013 2014
ARM® CortexTM‐A8SC, 45nm
APL1012APL0898 APL1012
APL1011 APL1012 ARM® ARMv8aDC, 14/16nm FinFET
M9 Motion Coprocessor
M9M9
ARM® ARMv8aDC, 16 FinFET
M9 Motion Coprocessor
ARM® ARMv8aDC/TC, 20nm HKMG
M8 Motion Coprocessor
APL0778
ARM® v7aSC, 28nm HKMG
APL0778
2014 2015 2016
Apple A9
APL1022/339S00129
Apple A9
APL0898/339S00114
TSMC 16nm FinFET process SAMSUNG 14nm FinFET process
Apple A9
APL1022/339S00129
Apple A9
APL0898/339S00114
TSMC 16nm FinFET process
104.5mm2
SAMSUNG 14nm FinFET process
96mm2
APL1022/APL0898APL1022/APL0898
‐ TSMC 16nm FinFET/SAMSUNG 14nm FinFET process
‐ Apple 3rd generation ARM v8a architecturepp g
‐ Integrated M9 motion coprocessor
‐ Imagination PowerVR Series 7 GPU
‐ 4‐channel 16‐bits LPDDR4
‐MIPI‐DSI/MIPI‐CSI/eDP(?)
PCI HSIC I2C UART USB
M9
‐ PCIe, HSIC, I2C, UART, USB
‐ Fingerprint sensor controller
‐ Apple customized PoP package pp p g
70%CPU Performance %FASTER
ARM® v8a architectureDual Core
M9
ARM® v8a architectureDual Core
ARM® v8 architecture
ARM® v7 architecture
ARM v8 architectureDual Core
339S0030 339S0036
ARM®ARM11Single Core
339S0073
ARM® CortexTM‐A8Single Core
ARM v7 architectureDual Core
ARM® CortexTM‐A8Single Core
ARM® CortexTM‐A9Single Core
ARM®ARM11Single Core gg
2007 2015
90%Graphics Performance %FASTER
ImaginationPowerVR Series 7
M9
PowerVR Series 7 GPU
ImaginationPowerVR Series6XT
4‐Clusters
Imagination
ImaginationPowerVR GX6430
339S0030 339S0036 339S0073
ImaginationMBX Lite
ImaginationMBX Lite
Imagination PowerVR SGX535
ImaginationPowerVR SGX535
ImaginationPowerVR SGX543MP2
ImaginationPowerVR SGX543MP3
MBX Lite
2007 2015
M9
338S00120‐A1338S00122 A1338S00122‐A1
PMIC
338S00014338S00105Audio Codec
338S1285Audio AMP 16GB/64GB/128GB
NVMe SSD
The only thing that’s changed is everything.
iPhone 6S A1688
SKYWORKS RF1347
Texas Instruments 57A6CVI 3539
Apple A9 processor, Apple customized PoP package
h l b b d / /4‐channle 16‐bits LPDDR4, 16Gb density, Micron/SAMSUNG/SK Hynix
InvenSense MP‐67B
Bosch BMA280
Qualcomm MDM9635MQ
SKYWORKS SKY77812‐19
Qualcomm QFE1100
TriQuint TQF6405
AVAGO AFEM‐8030
iPhone 6S A1688USI 339S00043 WiFi/BT M d l USI 339S00043 WiFi/BT Module
Ne G98/Murata(?), RF Front‐End Module
ALPS HSCDTD007
NXP 66V10
Apple 338S00105
Apple 338S00120‐A1 Texas Instruments 65730AOP
SKYWORKS SKY77357 8
Main storage, 16GB/64GB/128GB, NVMe SSDSK Hynix : H230DG8UD1ACS, 16GB
SKYWORKS SKY77357‐8 Bosch BMP280
Toshiba : THGBX5G7D2KLFXG, 16GB
Apple 338S1285
NXP1610A3
Qualcomm PMD9635 Qualcomm WTR3925
Rd G54/Murata(?), RF Front‐End Module
Murata 240 Front‐End Module
Apple 338S1285 RFMD RF5150
Texas Instruments 57A5KXI
Rear facing camera4 7”
Front facing camera
ALS4.7
1334x750343S00014
LPDDR4
LPDDR4 4‐channel 16‐bit
16Gb LPDDR4LPDDR4
TAPTICENGINE
I2C
16Gb LPDDR4
16/64/128GBNVMe SSDBosch
BMA280
InvensenseMP67B
LPDDR4I2C
I2C/SPI
I2C/SPI
ALPSHSCDTD007
BMA280
B h338S00120‐A1I C/SPI
338S00105
BoschBMP280
PMIC
338S1285
M9M9
PCIeUARTPCIe
USIQualcommMDM9635M
QualcommWTR3925
PA Chips
338S00105Audio Codec
NXPNXP66V10
Audio AMP
PA chips is model dependent Lightning
339S00043
QualcommQFE1100
MDM9635MWTR3925
QualcommPMD9635
pCBTL1610A366V10
iPhone 6S Plus A1687
SKYWORKS RF1347
Apple A9 processor, Apple customized PoP package
h l b b d / /4‐channle 16‐bits LPDDR4, 16Gb density, Micron/SAMSUNG/SK Hynix
InvenSense EMS‐A
In the iPhone 6s, there is Bosch BMA280 here.
But, in the iPhone 6s Plus, there is no chip here but “PCB pad only”
Qualcomm MDM9635MQ
SKYWORKS SKY77812‐19
Qualcomm QFE1100
TriQuint TQF6405
Avago AFEM‐8030
iPhone 6S Plus A1687USI 339S00043 WiFi/BT M d l
Skyworks SKY13701
ALPS HSCDTD007
USI 339S00043 WiFi/BT Module
Texas Instruments 57A6CVI 3539
NXP 66V10
Apple 338S00122‐A1
Apple 338S00105 Texas Instruments 57A6CVI 3539
Texas Instruments TPS65730AOP
Main storage, 16GB/64GB/128GB, NVMe SSDSK Hynix : H230DG8UD1ACS 16GB
Bosch BMP280 SKYWORKS SKY77357‐8
SK Hynix : H230DG8UD1ACS, 16GB
Apple 338S1285 Qualcomm PMD9635
NXP1610A3 Qualcomm WTR3925Murata 240 Front‐End Module
Af G54/Murata(?), RF Front‐End Module
Texas Instruments 57A5KXI
Af G54/Murata(?), RF Front End Module
Apple 338S1285 RFMD RF5150
Rear facing camera5 5”
Front facing camera
ALS5.5
1920x1080343S00014
LPDDR4
LPDDR4 4‐channel 16‐bit
16Gb LPDDR4LPDDR4
TAPTICENGINE
16Gb LPDDR4
16/64/128GBNVMe SSD
LPDDR4
InvensenseEMS‐A
I2C
338S00122‐A1
I2C/SPI
I2C/SPI
ALPSHSCDTD007
BoschBMP280
PMIC
M9M9338S00105Audio Codec
338S1285Audio AMP
PCIeUARTPCIe
USIQualcommMDM9635M
QualcommWTR3925
PA Chips NXPNXP
66V10
Audio Codec
PA chips is model dependent Lightning
339S00043
QualcommQFE1100
MDM9635MWTR3925
QualcommPMD9635
pCBTL1610A366V10
Manufacturer Device Function
▼Processor
AppleApple A9 Microprocessor(APL0898 & APL1022)
‧SAMSUNG 14nm FinFet/TSMC 16nm FinFET process‧Dual‐core, Apple 3rd generation ARMv8a architecture, 1.8GHz‧Imagination PowerVR 7 series GPU‧A l t i d P P k‧Apple customized PoP package
▼Memory
MicronSAMSUNGSK Hynix
D9SND (MT53B256M64D2NL)K3RG1G10BM‐BGCHH9HKNNNBTUMUMR‐NLH
‧16‐bit, Quad‐channel, 16Gb LPDDR4‧Apple customized PoP package
SK Hynix H9HKNNNBTUMUMR NLH
SK HynixToshiba
‧NAND Flash‐based storage‧Apple customized package
‧16GB/64GB/128GB16GB: SK Hynix H230DG8UD1ACS
Toshiba THGBX5G7D2KLFXG
▼PMIC
Apple Apple 338S00120‐A1 PMIC for Apple A9 Processor (iPhone 6s)
Apple 338S00122‐A1 PMIC for Apple A9 Processor (iPhone 6s Plus)
Qualcomm PMD9635 PMIC for Qualcomm MDM9635M baseband processor
▼Audio
Apple Apple 338S00105 Audio Codec
Apple 338S1285 Audio AMP
▼T h S C t ll▼Touch Screen Controller
Apple 343S00014 Touch screen controller for 3D Touch
▼Others
Texas Instruments 65730AOP Power management IC
57A6CVI 3539 LED backlight Retina display driver
57A5KXI Charger IC
NXP 1610A3 USB charging
Manufacturer Device Function
▼Sensors
InvenSense MPU‐6700(MP67B) (iPhone 6s) 6‐Axis Gyro and Accelerometer
Bosch Sensortech EMS‐A (iPhone 6s Plus) 6‐Axis Gyro and Accelerometer
A280(3 LA) (i h 6 ) 3 A i A lBMA280(3P 7LA) (iPhone 6s) 3‐Axis Accelerometer
BMP280 Barometer
ALPS HSCDTD007 Electronic Compass
AMS TSL2586 ALS
▼Radio Frequency
USI 339S00043 ‧802.11 ac/a/b/g/n Wi‐Fi‧Bluetooth 4.2
NXP 66V10 (PN66V?) NFC controller( )
Qualcomm MDM9635M baseband processor Baseband Processor:
‧20nm process
‧1.2GHz ARM Cortex‐A7 + 800MHz QDSP
‧Rel 9 LTE Cat 6
‧DC‐HSPA
‧TD‐SCDMA
‧EVDO Rev. B, CDMA 1X
‧GSM
‧QICE, Envelope Tracking
‧Integrated Memory
WTR3925 ‧28nm process
‧ GSM/CDMA/W‐CDMA/LTE Transceiver
QFE1100 Envelope Power Tracker
Manufacturer Device Function
iPhone 6s Model A1688
Skyworks SKY77812‐19 Power Amplifier Module
SKY77357‐8 Power Amplifier Module
A AFEM 8030 P A lifi M d lAvago AFEM‐8030 Power Amplifier Module
RFMD RF5150 Antenna Switch
RF1347 Antenna Switch Module
TriQuint TQF6405 Power Amplifier Module
Murata 240 Front End module
Murata(?) Ne G98 RF Front End module
Rd G54 RF Front End module
iPh 6 Pl M d liPhone 6s Plus Model A1687
Skyworks SKY77812‐19 Power Amplifier Module
SKY77357‐8 Power Amplifier Module
SKY13701‐17 WLAN front end module
Avago AFEM‐8030 Power Amplifier Module
RFMD RF5150 Antenna Switch
TriQuint TQF6405 Power Amplifier Module
Murata 240 Front End module
Murata(?) Af G54 RF Front End module
▼Processor
Application Processor
‧Dual‐core‧Apple 3rd generation ARM v8a architecture‧Imagination PowerVR Series 7 GPUImagination PowerVR Series 7 GPU‧SAMSUNG 14nm FinFET process
TSMC 16nm FinFET process‧Apple M9 motion coprocessor
M9
Apple M9 Coprocessor
‧ Integrated in the Apple A9 processor
▼Memory
System Memory
‧ Quad‐Channel 16‐bits LPDDR4 controller‧ 16Gb density LPDDR4‧ Apple customized PoP package
System Storage
‧Apple NVMe controller inside Apple A9‧16GB/64GB/128GB capacity NAND Flash
▼Radio Frequency
WiFi/BT‧ USI WiFi/BT module
Baseband Processor‧Qualcomm MDM9635M‧Qualcomm WTR3925
PA Chips‧Avago‧Qualcomm‧RF Micro‧Skyworks‧TriQuint
NFC 66V10
▼PMIC
PMIC for AP‧Apple 338S00120‐A1 (iPhone 6s)
Apple 338S00122‐A1 (iPhone 6s Plus)
PMIC f BPPMIC for BP‧ Qualcomm PMD9635
▼Audio
d dAudio Codec‧Apple 338S001285
‧Apple 338S000105
▼Touch Screen Controller
Controller
▼MEMs
Gyroscope
AccelerometerAccelerometer
Barometer
Compass
M9
A9 ‐ CPU Performance
M9
A9 ‐ CPU Performance
M9
A9 ‐ CPU Performance
M9
A9 ‐ CPU Performance
M9
A9 ‐ CPU Performance
M9
A9 ‐ CPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ GPU Performance
M9
A9 ‐ Storage Performance
NVMe SSD
UFS 2.0
M9
A9 ‐ Storage Performance
NVMe SSD
UFS 2.0
M9
A9 ‐ Storage Performance
NVMe SSD
UFS 2.0
eMMC 5.0
NVMe SSD
UFS 2.0
eMMC 5.0
M9
A9 ‐ Storage Performance
NVMe SSD
UFS 2.0NVMe SSD
eMMC 5.0
NVMe SSD
UFS 2.0
eMMC 5.0
M9
338S00170‐A1PMIC
338S00105Audio Codec
338S1285Audio AMP 16GB/64GB
NVMe SSD
Skyworks SKY77611
Apple A9 processor, Apple customized PoP package
4‐channle 16‐bits LPDDR4, 16Gb density, Micron/SAMSUNG/SK Hynix
Qualcomm MDM9635MQ
Qualcomm WTR1625L
Qualcomm QFE1100
ALPS HSCDTD007
Murata 339S00134 WiFi/BT Module
NXP 66V10 NFC
Broadcom BCM5976
TI 343S0645
Apple 338S00105 InvenSense EMS‐A
Apple 338S00170‐A1
TI 5CARCPI 3539 TI 65730AOP
Main storage, 16GB/64GBGB, NVMe SSDSK Hynix : H230DG8UD1ACS, 16GB
NXP CBTL1610A3
Apple 338S1285
Qualcomm PM8019
TI 5AA56PI SN2400AB0
Qorvo(TriQuint) TQF6410 Qualcomm PM8019
Qualcomm WFR1620 Skyworks SKY77357
Avago ACPM‐8020
TDK EPCOS D5255
Skyworks SKY77826
Qorvo(RF Micro) RF5159
Rear facing camera4”B d
Front facing camera
ALS4
1136x640BroadcomBCM5976
LPDDR4
LPDDR4 4‐channel 16‐bit
16Gb LPDDR4LPDDR4
I2C
16Gb LPDDR4
16/64GBNVMe SSDBosch
BMA280
InvensenseEMS‐A
LPDDR4I2C
PCIe
I2C/SPI
I2C/SPI
ALPSHSCDTD007
BMA280
B h338S00170‐A1I C/SPI
338S00105
BoschBMP280
PMIC
338S1285
M9M9
PCIeUARTHSIC
QualcommMDM9625M
QualcommWTR1625L
PA Chips
338S00105Audio Codec
NXPNXP66V10
Audio AMP
QualcommWFR1620
M
PA chips is model dependent Lightning
339S00043
QualcommQFE1100
MDM9625MWTR1625L
QualcommPM8019
ChipsCBTL1610A366V10WFR1620
Manufacturer Device Function
▼Processor
AppleApple A9 Microprocessor(APL0898 & APL1022)
‧SAMSUNG 14nm FinFet/TSMC 16nm FinFET process‧Dual‐core, Apple 3rd generation ARMv8a architecture, 1.8GHz‧Imagination PowerVR 7 series GPU‧A l t i d P P k‧Apple customized PoP package
▼Memory
SK HynixH9HKNNNBTUMUMR‐NLH
‧16‐bit, Quad‐channel, 16Gb LPDDR4‧Apple customized PoP package
Toshiba‧NAND Flash‐based storage‧Apple customized package
‧16GB/64GBGB16GB: Toshiba THGBX5G7D2KLFXG
▼PMIC
Apple Apple 338S00170‐A1 PMIC for Apple A9 Processor (iPhone SE)
Qualcomm PM8019 PMIC for Qualcomm MDM9625M baseband processor
▼Audio
Apple Apple 338S00105 Audio Codec
Apple 338S1285 Audio AMPApple 338S1285 Audio AMP
▼Touch Screen Controller
Texas Instruments 62ARFKI 343S0645 Line Driver
Broadcom BCM5976 Touch screen controller
▼Others
Texas Instruments 65730AOP Power management IC
5CARCPI 3539 LED backlight Retina display driver
5AA56PI SN2400AB0 Charger IC5AA56PI SN2400AB0 Charger IC
NXP CBTL1610A3 USB charging
Manufacturer Device Function
▼Sensors
InvenSense EMS‐A 6‐Axis Gyro and Accelerometer
Bosch SensortechBMP280 Barometer
ALPS HSCDTD007 Electronic Compass
▼Radio Frequency
USI 339S00043 ‧Broadcom BCM4350‧ 802 11 ac/a/b/g/n Wi‐Fi802.11 ac/a/b/g/n Wi Fi‧Bluetooth 4.2
NXP 66V10(PN549/PN66V)) NFC controller
Qualcomm MDM9625M baseband processor Baseband Processor:‧Rel 9 LTE Cat 4(150Mbps)‧ Rel 10 LTE‐FDD CA‧ Rel10 3C HSDPA+ 63Mbps‧ DC HSUPA‧ TD‐SCDMA‧ DOrB‧ QICE, Envelope TrackingQICE, Envelope Tracking‧Integrated Memory
WTR1625L GSM/CDMA/W‐CDMA/LTE RxD Transceiver
WFR1620 GSM/CDMA/W‐CDMA/LTE Receiver
Manufacturer Device Function
iPhone SE Model A1662
Skyworks SKY77826 Ultra low‐band Power Amplifier Module
SKY77357 2G/Edge Power Amplifier Module
SKY77611 Q d b d P A lifi M d lSKY77611 Quad‐band Power Amplifier Module
Avago AFEM‐8020 Mid‐band Power Amplifier Duplexer
Qorvo(RFMD) RF5159 Antenna Switch
Qorvo(TriQuint) TQF6410 Low‐band Power Amplifier Duplexer
TDK EPCOS D5255 Diversity Receive Module
APL1021/343S00074APL1021/343S00074
‐ TSMC 16nm FinFET process
‐ Apple 3rd generation ARM v8a architecture, 2.26GHzApple 3 generation ARM v8a architecture, 2.26GHz
‐ Integrated M9 motion coprocessor
‐ Imagination PowerVR Series 7 GPU
‐ 8‐channel 16‐bits LPDDR4 memory controller
‐ DisplayPort/MIPI‐CSI
CI HSIC I2C UA US (?)‐ PCIe, HSIC, I2C, UART, USB(?)
‐ Fingerprint sensor controller
‐ 147mm2
M9147mm
22XCPU PerformanceFASTER
M9
ARM® ARMv8aDual Core
16nm FinFET
ARM® ARMv8aTri Core
20nm HKMG
ARM® ARMv8DC, 28nm HKMG
ARM® CortexTM‐A8SC, 45nm
ARM® CortexTM‐A9DC, 45nm
ARM® CortexTM‐A9DC, 45nm
ARM® ARMv7DC, 32nm HKMG
2010 2015
360XGraphics PerformanceFASTER
M9
ImaginationPowerVR Series 7 GPU
ImaginationPowerVR Series 6XTPowerVR Series 6XT
8‐Clusters
I i ti
ImaginationPowerVR SGX535
ImaginationPowerVR SGX543MP2
ImaginationPowerVR SGX543MP4
ImaginationPowerVR SGX554MP4
ImaginationPowerVR G6430
PowerVR SGX535
2010 2015
M9M9
338S1213Audio Codec
338S00052‐A1PMIC
32GB/128GBNVMe SSD
338S00025‐A1PMIC
iPad Pro
iPad ProiPad ProSuper. Computer.Now in two sizes.
iPad Pro AKM AK8963
Apple 343S1213
This area is reserved for 4G modem which is used in the WiFi + Cellular model
Maxim Integrated MAX98721CEWV
pp
Bosch Sensortec BMP280
SK Hynix H9HCNNNBTUMLNR‐NLH, 16Gb LPDDR4 Apple A9X processor
NXP Semiconductor 65V10
Toshiba THGBX5G8D4KLDXG 32GB storage
SK Hynix H9HCNNNBTUMLNR‐NLH, 16Gb LPDDR4
Apple A9X processor
Bosch Sensortec BMA280 InvenSense MP67B
Apple 343S00025‐A1
Apple 343S00052‐A1 NXP Semiconductors LPC11U37
Fairchild Semiconductor FDMC 6683
USI 339S00045 WiFi/BT Module
Maxim Integrated MAX98721CEWV
NXP Semiconductors LPC11U37
Fresco Logic FL1100SX
NXP Semiconductor 1610A3
iPad ProRear facing camera
d12.9”
Front facing camera
ALSBroadcomBCM15900
BroadcomBCM15900
ParadeDP695
TITPS65144
12.92732x2048
LPDDR4
LPDDR4 4‐channel 16‐bit
16Gb LPDDR4LPDDR4
LPDDR4I2C
NXP8416A1
eDP
I2CBoschBMA280
InvensenseMP67B
LPDDR4I2C
LPDDR4
LPDDR4 4‐channel 16‐bit
16Gb LPDDR4LPDDR4
LPDDR4
I2C/SPI
I2C/SPI32/128GBNVMe SSD
AKMAK8963
Bosch
LPDDR4
338S1213A di C d
BMP280
338S00052‐A1PMIC
M9MAXIMMAX98721CEWV
338S00025‐A1PMIC
M9
PCIeUARTHSIC
USI339S00045
QualcommQFE1100 Qualcomm
MDM9625MQualcommWTR1625L
Audio Codec
NXP65V10
FreescoFL1100SX
PCIe
NXPLP11U37
STMSTMSTM32L052x6
This is for WiFi + Cellular model
339S00045MDM9625MWTR1625L
QualcommPM8019
PA Chips
NXP1610A3
FL1100SX LP11U37
QualcommWTR1620
iPad ProManufacturer Device Function
▼Processor
AppleApple A9X Microprocessor(APL1021)
‧16nm FinFET process‧Dual‐core, Apple 3rd generation ARMv8a architecture, 2.25GHz‧Imagination PowerVR 7 series GPU
▼Memory
SAMSUNGSK Hynix
K3RG1G1 OBMKGCHH9HCNNNBTUMLNR‐NLH
‧16‐bit, Octa‐channel, 16Gb LPDDR4‧Total system memory capacity is 4GB(16Gbx2)‧Apple customized package
NAND Fl h b d A l P i NVM SSD 32GB d 128GB iSanDiskToshiba
‧NAND Flash‐based storage‧Apple customized package
‧Apple Proprietary NVMe SSD, 32GB and 128GB capacity32GB: Toshiba THGBX5G8D4KLDXG 128GB: SanDisk SDMMSEDF8
▼PMIC
Apple Apple 338S00052‐A1 PMIC for Apple A9X ProcessorApple Apple 338S00052 A1 PMIC for Apple A9X Processor
Apple 338S00025‐A1 PMIC for Apple A9X Processor
Qualcomm PM8019 PMIC for Qualcomm MDM9625M baseband processor (For Wi‐Fi + Cellular model)
▼Audio▼Audio
Apple Apple 338S1213 Audio Codec
Maxim Integrated MAX98721CEWV Boosted class amplifier
▼Touch Screen Controller
Broadcom BCM15900B0 Touch screen controller
▼MEMs
InvenSense MPU‐6700(MP67B) 6‐Axis Gyro and Accelerometer
Bosch Sensortech BMA280 3‐Axis AccelerometerBosch Sensortech BMA280 3 Axis Accelerometer
BMP280 Barometer
AKM AK8963 Electronic Compass
iPad ProManufacturer Device Function
▼Others
Texas Instruments TPS65144 LCD Bias with Integrated Gamma
NXP CBTL1610A3 USB charging
L C11U3 C M0 i llLPC11U37 Cortex‐M0 microcontroller
NVT8416A1 Unknown
Parade DP695 LCD timing controller
Fresco Logic FL1100SX PCIe‐to‐USB 3.0 controller
Fairchild Semiconductor FDMC 6683 DC/DC Converter
FXMA2012 Translator
STMicroelectronics STM32L052x6 Ultra‐low power ARM Cortex‐M0+ MCU with 64‐Kbyte Flash, 32 MHz CPU, USB
iPad ProManufacturer Device Function
▼Radio Frequency
USI 339S000045(Boradcom BCM4350)
‧802.11 ac/a/b/g/n Wi‐Fi‧Bluetooth 4.2
NXP 65V10 NFC controller
For Wi‐Fi + Cellular model
Qualcomm MDM9625M baseband processor Baseband Processor:
‧Rel 9 LTE Cat 4(150Mbps)
‧Rel 10 LTE‐FDD CA
‧Rel 10 3C HSDPA+ 63Mbps
‧DC HSUPA
‧TD‐SCDMA
‧DOrBDOrB
‧QICE, Envelope Tracking
‧Integrated Memory
WTR1625L GSM/CDMA/W‐CDMA/LTE RxD Transceiver
WFR1620 GSM/CDMA/W‐CDMA/LTE ReceiverWFR1620 GSM/CDMA/W CDMA/LTE Receiver
QFE1100 Envelope Power Tracker
Avago A8020 Power Amplifier Module
TriQuint TQF6410 Power Amplifier Module
TQF6430 Power Amplifier Module
RFMD RF5159 Antenna Switch Module
RF5145 Antenna Switch
RF5147A Antenna SwitchRF5147A Antenna Switch
M9M9
343S00089‐A1Audio Codec
338S00051‐A1PMIC
32GB/128GBNVMe SSD
iPad Pro
Broadcom BCM15900B0
NXP Semiconductor CBTL1610A3
Murata 339S00109 WiFi/BT Module
NXP Semiconductor CBTL1610A3
Maxim Integrated MAX98721BEWV
Apple 343S00051‐A1 SAMSUNG K3RG1G1 OBMKGCH, 16Gb LPDDR4 Apple 343S00089‐A1
Apple A9X processor
STMicroelectronics STM32L052x6
Bosch Sensortec BMA280
NXP Semiconductor 66V10
Maxim Integrated MAX98721BEWV
SK Hynix H23QEG8VG1ACA 32GB storage
InvenSense EMS‐A
This area is reserved for 4G modem which is used in the WiFi + Cellular model
iPad ProRear facing camera
d9.7”
Front facing camera
ALSBroadcomBCM15900
BroadcomBCM15900
ParadeDP815
98667AB5528T
9.72048x1536
LPDDR4
LPDDR4 4‐channel 16‐bit
16Gb LPDDR4LPDDR4
LPDDR4I2C
NXP8416A3
eDP
InvenSenseEMS‐A
LPDDR4I2C
I2C/SPI
I2C/SPI32/128/256GBNVMe SSD
eCompass
Bosch
PCIe
343S00089‐A1A di C d
BMP280
338S00051‐A1PMIC
M9MAXIMMAX98721BEWV
M9
PCIeUARTPCIe
QualcommMDM9635M
QualcommWTR3925
Audio Codec
NXP66V10
STMSTMSTM32L052x6
NXP1610A3
339S00109
M
This is for WiFi + Cellular model
MDM9635MWTR3925
QualcommPMD9635
PA Chips Qualcomm
QFE1100
339S00109
iPad ProManufacturer Device Function
▼Processor
AppleApple A9X Microprocessor(APL1021)
‧16nm FinFET process‧Dual‐core, Apple 3rd generation ARMv8a architecture, 2.25GHz‧Imagination PowerVR 7 series GPU
▼Memory
SAMSUNG K3RG1G1 OBMKGCH‧16‐bit, Quad‐channel, 16Gb LPDDR4‧Total system memory capacity is 2GB(16Gb)‧Apple customized package
NAND Fl h b d A l P i NVM SSD 32GB 128GB d 256GB iSK Hynix
‧NAND Flash‐based storage‧Apple customized package
‧Apple Proprietary NVMe SSD, 32GB, 128GB and 256GB capacity32GB: SK Hynix H23QEG8VG1ACA
▼PMIC
Apple Apple 338S00052‐A1 PMIC for Apple A9X Processor
Qualcomm PMD9635 PMIC for Qualcomm MDM9635M baseband processor (For Wi‐Fi + Cellular model)
▼Audio
Apple Apple 343S00089‐A1 Audio Codec
Maxim Integrated MAX98721BEWV Boosted class amplifierg p
▼Touch Screen Controller
Broadcom BCM15900B0 Touch screen controller
▼MEMs
InvenSense EMS‐A 6‐Axis Gyro and Accelerometer
Bosch Sensortech BMA280 Barometer
Unknown Unknown Electronic Compass
iPad ProManufacturer Device Function
▼Others
Texas Instruments TPS65144 LCD Bias with Integrated Gamma
NXP CBTL1610A3 USB charging
V 8416A1 U kNVT8416A1 Unknown
Parade DP815 LCD timing controller
Fairchild Semiconductor FDMC 6683 DC/DC Converter
FXMA2012 Translator
STMicroelectronics STM32L052x6 Ultra‐low power ARM Cortex‐M0+ MCU with 64‐Kbyte Flash, 32 MHz CPU, USB
iPad ProManufacturer Device Function
▼Radio Frequency
Murata 339S00109(Boradcom BCM4350)
‧802.11 ac/a/b/g/n Wi‐Fi‧Bluetooth 4.2
NXP 66V10 NFC controller
For Wi‐Fi + Cellular model
Qualcomm MDM9635M baseband processor Baseband Processor:‧20nm process1 2GH ARM C A7 800MH QDSP‧1.2GHz ARM Cortex‐A7 + 800MHz QDSP
‧Rel 9 LTE Cat 6‧DC‐HSPA‧TD‐SCDMA‧EVDO Rev. B, CDMA 1X‧GSM‧QICE, Envelope Tracking‧Integrated Memory
WTR3925 ‧28nm process‧ GSM/CDMA/W‐CDMA/LTE Transceiver
QFE1100 E l P T kQFE1100 Envelope Power Tracker
iPad Pro
ST Microelectronics AS5C Y533
ST Microelectronics STML151UCY6, ARM Cortex‐M3 MCU
L05286 QS4 VG Z SGP 528
EWX 01129
(STMicroelectronics STM32L052x6)
Bosch Sensortec BMA280
Cambridge Silicon Radio (Qualcomm)CSR1012A05
Bosch Sensortec BMA280
8529043 343S00008‐A1(Customized part for Apple?)
iPad ProManufacturer Device Function
▼Apple Pencil
ST Microelectronics STML151UCy6 ARM Cortex‐M3 MCU
AS5C Y533 unknown
h S h 280 3 A i A lBosch Sensortech BMA280 3‐Axis Accelerometer
Qualcomm/CSR CSR1012A05 Bluetooth Smart chip
STMicroelectronicsL05286 QS4 VG Z SGP 528
(STM32L052x6)Ultra‐low power ARM Cortex‐M0+ MCU with 64‐Kbyte Flash, 32 MHz CPU, USB
Unknown(MAXIM?) EWX 01129 unknown
Unknown(Customized for Apple?)
8529043 343S00008‐A1 unknown
▼Smart Keyboard
ST Microelectronics STM32F103VB 72MHz ARM Cortex‐M3 MCU
iPad Pro▼Processor
Application Processor
‧Dual‐core‧Apple 3rd generation ARM v8a architecture‧Imagination PowerVR Series 7 GPUImagination PowerVR Series 7 GPU‧TSMC 16nm FinFET process‧Apple M9 motion coprocessor
M9
Apple M9 Coprocessor
‧ Integrated in the Apple A9X processor
▼Memory
System Memory
‧Eight‐Channel 16‐bits LPDDR4 controller‧16Gb density LPDDR4‧Apple customized package
System Storage
‧Apple NVMe controller inside Apple A9‧16GB/64GB/128GB capacity NAND Flash
iPad Pro▼Radio Frequency
WiFi/BT ‧Broadcom BCM4350‧USI WiFi/BT module
Baseband Processor‧Qualcomm MDM9625M‧Qualcomm MDM9635M‧Qualcomm WTR3925‧Qualcomm WTR1625L‧Qualcomm WTR1620‧Qualcomm QFE1100‧Qualcomm QFE1100
NFC 65V1066V10
▼PMIC
PMIC for AP‧Apple 338S00052‐A1Apple 338S00025‐A1Apple 338S00025 A1
Apple 338S00051‐A1
PMIC for BP‧ Qualcomm PM8019
Q l PMD9635Qualcomm PMD9635
▼Audio
Audio‧Apple 338S001213Apple 338S00089‐A1
‧Maxim MAX98721CEWV
iPad Pro▼Touch Screen Controller
Controller
▼MEMs
Gyroscope
AccelerometerAccelerometer
Barometer
Compass
iPad ProA9X ‐ CPU Performance
M9
iPad ProM9
A9X ‐ CPU Performance
iPad ProM9
A9X ‐ CPU Performance
iPad ProM9
A9X ‐ CPU Performance
iPad ProM9
A9X ‐ GPU Performance
iPad ProM9
A9X ‐ GPU Performance