application note - erni...e 074665 1116 eition 2 7 1 diameter of drilled hole min. via length for...

ERmet ZDpro®

Application Note

ED. 02 | 11.2016Appl ica t ion Note E 074665

2 E 074665 11/16 Edition 2 www.erni.com

ERmet ZDproMale and Female

The ERmet ZD is specifically designed for high speeddifferential signaling in telecom applications at data rates of up to 25 Gbits/second. This robust, high performance, modular connector system is also de-signed to be used in conjunction with the 2 mm Hard Metric (IEC 61076-4-101) family of connectors. It sha-res the chassis and board design features along with common layout references. The connector meets the electrical performance requirements of high speed, low voltage differential signaling. The ERmet ZD connector family is available in pressfit versions. The backplane module is a male pin header that has two mating levels. The ground shield and signal pins mate sequentially at 1.5 mm intervals.

The robust mechanical design and excellent signal integrity are a result of the internal differential shielding scheme and the “L” shaped male shield blades. The inherently rigid male shields stand higher than the sig-nal pins and surround each pair. An improved guidan-ce feature completes the rugged mechanical design. Optimized grid design to improve the RF characteri-stics. Easy and economical trace routing achieved by in line-design of signal and ground pins. Simulation models available upon request.

ERmet ZDpro - Application Note

GENERAL

OVERVIEW

3E 074665 11/16 Edition 2 www.erni.com

Modules

Mating

Design

Contacts

Multiline crosstalk

Differential crosstalk

Skew compensation

Data rate

Alignment features

Standards

Mating cycles

Material and plating

4 pair versions available

Compatible to ERmet ZD and ZDplus connectors

Wafers with individually fully shielded pairs of contacts

Low noise, dual beam contacts, one ground blade for every pair of signals

< 3% at 100ps rise time, 250 mV swing

100 Ω ±5%

max. 3 ps differential skew

per differential pair 25+ Gbit/s

Pre-alignment guide with polarizing feature

Meets the requirements of100G ATCA technology and 100 Gbit/s Ethernet (IEEE802.3bj)

> 250

Plastic parts: LCPContact Material: Cu alloyMating area: PdNi with gold flashTermination are: Sn


FEATURES

TECHNICAL FEATURES


1,25 1,25

Via construction in accordance to474999 and 384191 specification.

GN

D a a b

GN

D b

GN

D c

GN

D e

GN

D f

GN

D g

GN

D hc d e f g h

GN

D d

ERmetZDpro

ERmetZDpro

ERmetZDpro

ERmetZDpro

1

10

Daughtercard assembly side

finished hole = 0,46 0,05 (18 mil)

depends from manufacturerand size of the Backplane

finished hole = 0,3 (12 mil)

depends from manufacturerand size of the Backplane

2 tolS1 tolS

1

10

Annular Ring

Annular Ring

A

1,3

3,6

4,5

3 x 4,5 = (13,5)

2,5

22,

5

17,1

30

0,55 drill diameter (21,65 mil)

0,65 (25,6 mil)


0,5 (19,7 mil)

2,5

min

+0,06-0,01

2,8 (110 mil)

1,7

(67

mil)

Einzelheit AM 10:1 Zusätzliche Schirmnase über und unter der Signallage

verbessert Impedanzverlauf.Additional shielding nose under and above the signal layerimproves impedance characteristics.

45°

0,1

5 (6

mil)

0,1

5 (6

mil)


RECOMMENDED PCB LAYOUT

BACKPLANE LAYOUT 4 PAIR MALE CONNECTOR


1) Via construction in accordance to 474999 and 384191 specification.

1)

GND a

ab

GND b

cd

GND d

ef

GND f

gh

GND h

10

GND c

GND e

GND g

depends from manufacturer and board size

finished hole = 0,46mm 0,05 (18 mil)

depends from manufacturer and board size

finished hole = 0,3mm (12 mil)

Annular Ring

Annular Ring

A

1

2,5

5

0,15 (6 mil)

0,3 (11,8 mil)

22,5

0,65 (25,6 mil)


0,5 (19,7 mil)


1,04

1,2

1

,3 1

4,5

0,9

17

+0,06-0,01

1,7 (67 mil)

2,8

(110

mil)

Einzelheit AM 10:1

Zusätzliche Schirmnase über und unter der Signallageverbessert den Impedanzverlauf.Additional shielding nose under and above of the signal layer improves impedance characteristics.

0,15 (6 mil)

0,15 (6 mil)

45°


RECOMMENDED PCB LAYOUT

DAUGHTERCARD LAYOUT 4 PAIR FEMALE CONNECTOR


Two press fit terminals are required for ERmet ZDpro modules.These press fit terminals have been used suc-cessfully with plated tin, immersion tin, organic coatings over bare copper and immersion gold hole plating process. The hole recommenda-tions and press in force information shown in this catalog are for plated tin-lead.The usage of backdrilling is recommended.

The bottom connection (right) is preferable, due to less reflection.


PLATED-THROUGH HOLES FOR PRESSFIT TERMINALS

PLATED-THROUGH HOLE

STUBBING EFFECT


1

Diameter of drilled hole

min. via lengthfor backdrilling

µm Cu 20 - 25

±0,020,4

2)

0,05min.

0,3

max. 2 µm Sn

plated-through holeDiameter of finished

Restring width

2) Accuracy of the finished diameter, is only in the min. via length for backdrilling required.

+0,06-0,01

Diameter of drilled hole

0,46

0,05min.

µm Cu

0,55

25min.

±0,02

±0,05

max. 10 µm Sn

plated-through hole

Restring width

Diameter of finished


SIGNAL PIN

PLATED-THROUGH HOLE

SHIELDING PIN


Agilent ENA E5071C with Cascade Microtech Z-Probes (GSGSG)


MEASUREMENT RESULTS

MEASUREMENT EQUIPMENT

INSERTION AND RETURN LOSS



NEAR-END CROSSTALK

FAR-END CROSSTALK

MEASUREMENT RESULTS

SKEW


Channel operating margin (COM) is a figure of merit for the physical electrical connection between a transmitter and a receiver block (channel). The result is determined from a minimum PHY architecture and the Channel s-parameters. COM ist substituting compliance diagrams that are frequency depending.


GENERAL

COM - 100 GBIT/S ETHERNET

FORMER COMPLIANCE DIAGRAMS

COM FLOW CHART


Package launch

5” blade transmission line

Blade connector launch

ZDplus/pro connector

Backplane connector launch

Backplane channel crossing

11” backplane transmission line

Backplane connector launch

ZDplus/pro connector

Blade connector launch

5” blade transmission line

Package launch


COM SIMULATION SETUP: ATCA „100GBASE-KR4“



Far-End Crosstalk Near-End Crosstalk

Victim Pair

Aggressors


PIN CONFIGURATION (BASED ON ATCA LAYOUT)



ERmet ZDpro achieves more than 1 dB margin in ATCA applications compared to ZDplus.


COM SIMULATION RESULTS



SMA

SMA

SMA

SMA

Signal +

Signal -

Ground

TestEquipment

Backplane TestPaddle Card

Backplane Backplane TestPaddle Card

TP1 TP4

Test setup for Front Board S-parameter Tests Test Setup in accordance to PICMG 3.1 R2.0

Measuring Equipment

Test Equipment Description Notes/Comments

Agilent N5242A4-Port Vector Network Analyzer10 MHz to 26.5 GHz

S-Parameter measurements

Test Equipments and Tools

Test Equipment Description Notes/Comments

Test-PICMG-BP Rev.2.0(8406811N61B_FAB_REV_A)

PICMG Backplane Test Paddle Card with ZDpro Connector (ERNI 474960)

Test fixture for backplane validationLow Loss Material:DF = 0.002 - 0.003

Test-PICMG-BP Rev.2.0(8406811N61B_FAB_REV_A)

PICMG Front Board Test Card withZDpro Connector (ERNI 474982)

Test fixture for adapter validation


SETUP IN ACCORDANCE TO IEEE FOR 100 GBIT/S

ATCA SYSTEM MEASUREMENT


Backplane Measurement according IEEE P802.3bj/D3.2

Transmitter (blue), Receiver (green) Eqn T_tdr=8.0ns

Dataset Date

Top_BP_AXP4440_400_L01tcL02 Jul 23, 2014


SHORT RANGE

S-PARAMETER ANALYSIS


Backplane Measurement according IEEE P802.3bj/D3.2

Transmitter (blue), Receiver (green) Eqn T_tdr=8.0ns

Dataset Date

Top_BP_AXP4440_400_L01tcL02 Jul 23, 2014


LONG RANGE

S-PARAMETER ANALYSIS

© ERNI Electronics GmbH & Co. KG 2016 • Printed in Germany • A policy of continuous improvement is followed and the right to alter

any published data without notice is reserved.

ERNI®, ERNI WoR&D®, Act. Connect. Perfect®, MicroCon®, MicroStac®, MicroSpeed®, MiniBridge®, MaxiBridge®, ERmet®, ERmet

ZD®, ERmet ZDplus®, ERmet ZD HD®, ERbic®, ERNIPRESS®, INTERact®, BLUEcontact® and WHITEspeed® are trademarks (registered

or applied for in various countries) of ERNI Electronics GmbH & Co. KG.

ERNI Electronics GmbH & Co. KG Europe South America Africa

Seestrasse 973099 Adelberg GermanyPhone +49 7166 50-0Fax +49 7166 [email protected]

ERNI Electronics, Inc. North America Canada Mexico

2201 Westwood AveRichmond, VA 23230/USAPhone +1 804 228-4100Fax +1 804 [email protected]

ERNI Asia Holding Pte Ltd. Asia Australia New Zealand

Blk 4008 Ang Mo Kio Avenue 10#04-01/02 Techplace ISingapore 569625Phone +65 6 555 5885Fax +65 6 555 [email protected]

application note - erni...e 074665 1116 eition 2 7 1 diameter of drilled hole min. via length for...

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