apv25 & origami status m.friedl, c.irmler, m.pernicka hephy vienna
TRANSCRIPT
APV25 & Origami Status
M.Friedl, C.Irmler, M.Pernicka
HEPHY Vienna
2Markus Friedl (HEPHY Vienna)18 Mar 2009
APV25 Purchase & Thinning
3Markus Friedl (HEPHY Vienna)18 Mar 2009
APV25 Purchase
• Current Belle purchase – 1500 diced „normal“ APV chips (~300µm
thick)– 2500 uncut APVs on wafers (for thinning)
• Future order– 1000 more „normal“ APVs which did not
fit in current purchase due to financial limits
• 8 wafers with a total of 2674 known good dies were delivered to Vienna on 9 Jan 2009
• One wafer contains 360 APVs in total • Each chip was tested on the wafer, yielding an average of 93% good
dies
• The 1500 normal APVs are at KEK, financial transaction underway
4Markus Friedl (HEPHY Vienna)18 Mar 2009
APV25 wafers (8")
Wafer map showing test results (used to ink mark bad dies on wafer)
More photos: http://www.hephy.at/gallery2/v/electronics2/8inchwafer
APV25 Wafer Inspection
• On 19 Jan 2009, we sent 1 wafer (319 good dies) for– Thinning (100µm target), dicing and waffle packing
• Received back on 4 Feb 2009– 105µm (nominal) thickness– 314 (out of 319) good dies (= 98.4% yield)
5Markus Friedl (HEPHY Vienna)18 Mar 2009
Inspection of Thinned APVs
More photos: http://www.hephy.at/gallery2/v/electronics2/1stwaferthinned
Thickness measurement(Mitutoyo CMM)
Waffle-packed thinned APV chips
6Markus Friedl (HEPHY Vienna)18 Mar 2009
Investigation of Thinned APV25 Chips
• Thickness measurement: 106.6 +/- 3.2 µm • Thin dies are still quite rigid, easy handling
thinning mechanically OK
• Mounting 16 thinned chips on hybrids + 4 normal chips for electrical measurements
• All perform equally well
thinning electrically OK
• Next step: populate 2 Origami modules, one with normal, one with thinned APVs
• If again no difference, we will proceed with thinning all the chip-on-sensor wafers
7Markus Friedl (HEPHY Vienna)18 Mar 2009
SVD Layout & Origami
8Markus Friedl (HEPHY Vienna)18 Mar 2009
Possible SuperSVD Layout
• Geometry optimization is underway• Pixel double-layer using DEPFET• Strip layers extend to r~14 cm (presently
8.8 cm)• Every sensor is read out individually
(no ganging) to maintain good S/N Origami concept for inner DSSDs (red)
Double-layer of DEPFET pixels
4 layers of double-sided strip sensors
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-10-20-30 10 20 30 40More on the layoutby Thomas Bergauer
9Markus Friedl (HEPHY Vienna)18 Mar 2009
Origami Chip-on-Sensor Concept
(readout connections not shown)
• Kapton hybrid design for 4“ sensor done,being manufactured now
• Design for assembly jigs is ongoing• Module to be constructed in April 2009
Total material budget: 0.72% X0
(cf. 0.48% for conventional readout)
10Markus Friedl (HEPHY Vienna)18 Mar 2009
Origami – 4" DSSD Layout
4 n-side APV chips
2 p-side APV chips 2 p-side APV chips Connectors(on both sides)
Flex fanouts to bewrapped aroundthe sensor edge
• 3-layer flex hybrid design• p- and n-sides are
separated by 80V bias• n-side pitch adapter is
integrated in hybrid• ordered at CERN PCB
workshop, expected back ~end of March
Animal farm (mascots:cat MF, eagle SS, bat CI)
11Markus Friedl (HEPHY Vienna)18 Mar 2009
APV25 Trigger, Clock and Dead Time
12Markus Friedl (HEPHY Vienna)18 Mar 2009
No External Restrictions
• Min Lost: too little distance between triggers (6 clocks min.)• FIFO Lost: too many pending readouts (filling APV25 buffers)• Nakao-san wishes <3% dead time @ L1=30kHz OK (0.87%) for 42.4MHz clock, slightly higher (3.43%) at 31.8MHz
Trigger Loss @ 42.4MHz
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Trigger rate [kHz]
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loss [
%]
FIFO Lost [%]
Min Lost [%]
Trigger Loss @ 31.8MHz
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Trigger rate [kHz]T
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loss [
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FIFO Lost [%]
Min Lost [%]
12.8 25.9
13Markus Friedl (HEPHY Vienna)18 Mar 2009
Trigger Loss @ 42.4MHz
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Trigger rate [kHz]
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FIFO Lost [%]
Min Lost [%]
External 500ns Dead Time Requirement (ECL)
• Nakao-san‘s wish (<3% dead time @ L1=30kHz) met in both cases 0.42% for 42.4MHz clock and 2.7% at 31.8MHz• 500ns dead time (as required by ECL) not accounted for APV25
– Hence minimum lost figure is always zero
Trigger Loss @ 31.8MHz
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Trigger rate [kHz]T
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FIFO Lost [%]
Min Lost [%]
11.4 24.0
14Markus Friedl (HEPHY Vienna)18 Mar 2009
Summary & Outlook
• APV Thinning– 1st wafer successfully thinned (16.6 µm)– Electric sample (~5%) tests are fine– Remaining APV wafers to be processed
after successful tests on Origami
• Origami Status – flex circuit design submitted for fabrication at CERN, expected
back ~end March 2009– Jig design underway, will assemble in April
• Dead Time – Always <3% dead time with both
42.4 and 31.8 MHz clocks in case of500 ns dead time requirement (ECL)
15Markus Friedl (HEPHY Vienna)18 Mar 2009
Backup Slides
16Markus Friedl (HEPHY Vienna)18 Mar 2009
Origami Concept
• Extension of chip-on-sensor to double-sided readout• Flex fan-out pieces wrapped to opposite side (hence “Origami“)• All chips aligned on one side single cooling pipe
zylon rib
APV25 cooling pipe
4-layer kapton hybrid
integrated fanout(or: second metal)
DSSD
single-layer flex wrapped to p-side
Side View (below)
APV25(thinned to 100µm)
zylon ribcooling pipe
DSSDRohacellKapton