asic design classification details

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    ASIC

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    Integrated Circuit Background

    SSI (Small Scale Integration)

    Less than 10 gates

    Logic gates like 2 input NAND, XOR and other

    standard low functionality ICs

    MSI (Medium Scale Integration)

    10 to 100 gates

    ASICs, JK flip-flops, Counters and other standard

    low functionality ICs

    LSI (Large Scale Integration) 100 to 5000 gates

    ASICs, Early microprocessors, Peripheral Interface

    ICs etc.

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    Integrated Circuit Background

    VLSI (very large scale integration)

    More than 5000 gates

    Microprocessors, memory chips, ASICs

    ULSI( Ultra Large Scale Integration) More than 50,000 (50K) gates

    RAMS,VLIW processors. ULSI terminology is used

    mostly in Japan

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    The earliest ICs were based on the bipolar

    transistor logic

    They are classified as Transistor Transistor

    Logic ICs (TTL) or as Emitter Coupled Logic

    (ECL) ICs based on the circuit configuration.

    The invention of Metal Oxide Silicon (MOS)

    transistors in 1970 helped to reduce the

    power consumption and cost of IntegratedCircuits.

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    In 1980s-Aluminium gates of the MOS transistorsare replaced by polysilicon.

    This enables to build NMOS and PMOS on thesame IC.

    The introduction of CMOS (Complementary MetalOxide Silicon) technology in the 1980srevolutionized the Integrated Circuits.

    The major advantages of the CMOS technologyare the reduced power consumption and highlevel of integration.

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    The major advantages of using the ASICs are

    Miniaturization: The usage of custom ICs will reduce the size of the endproduct. An ASIC may replace the functions of a number of PCBs in the

    system, resulting in size reduction.

    Lesser inventory: The reduced number of components per system reducesthe inventory. This in turn reduces the cash out flow.

    Reduced cost and maintenance: Lesser components lead to fewer failuresand lesser system down time. Maintenance will be easy. All it may need

    would be the replacement of a single PCB.

    Lower power consumption: Lesser number of components in a systemreduces the power consumption. Most of the ASICs are based on the low

    power CMOS technology.

    Proprietary nature: Full protection from copycats. Your R&D investments

    are well protected. Performance: More and more functions can be integrated to the ASIC,

    without increasing the size or cost or power consumption of the product.

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    The major Risks of using the ASICs are

    Higher cost: ASIC will be always expensive than thestandard components. We will have to invest more time

    and money for the design and development phase. Theselection of the ASIC technology is very important.

    Time to market: The product lead time will be more for anASIC based system. The market research team should

    define the requirement of the end product well in advance.Last minute changes in the specification will result in

    delayed market entry and revenue loss. The right product

    should be introduced in to the market at the right time.

    First time success: The ASIC design should be properlysimulated and thoroughly tested to insure the first time

    success. Any failure will affect the time to market and

    resulting huge loss in revenue.

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    An ASIC should be designed only if a functionally

    equivalent standard, off the shelf. component is

    not available from the market.

    For example no engineer will design a memory

    ASIC to be used in his system. Instead he will usethe standard components available from the

    market.

    Any IC that can be purchased by quoting a partnumber from the market is called a standard IC.

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    By this definition we can treat all RAMS, ROMS,

    Microprocessors, Counters, Flip-flops, Logic gates as

    standard ICs. A standard IC will be always listed in the

    data manual

    An IC developed for a hand held game unit.

    An IC used in a camera, an IC used in the smart card or

    the like can be classified as ASIC products.

    The ASIC part number will not be listed in the general DataManual. You will not be able to buy this product from the

    open market against the part number.

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    Application Specific Standard Product

    (ASSP)

    This is an ASIC designed to meet a specificapplication, but available from the market against a

    part number.

    This IC can not be classified as a standard product,

    since it can not be used in different applications.

    Some of the chips used in the PCs, modems,network controllers, remote controllers etc. can be

    classified under ASSPs.

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    TYPES OF ASICs Full-custom ASIC

    Semi-custom ASIC

    Cell-base ASIC

    Gate-array-based ASIC

    Programmable ASIC

    Programmable LogicDevice (PLD)

    Field-programmable

    Gate array (FPGA)

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    Engineer defines all or most of cells,circuits or layoutsfor that ASIC from scratch.

    Designer has to define the characteristics of the cellsand circuits.

    This technology is chosen if the existing cell libraries

    - are not suitable for the particular design-are not fast

    - consume more power

    Most expensive design approach

    Full custom technology is widely used in the mixedanalog digital ASICs.

    FULL CUSTOM ASICs

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    Standard-Cell-Based ASIC

    Cell-based IC (CBIC-sea-bick) usespredesigned logic cells known as standardcells

    Designer only defines the placement of thestandard cells and the interconnection.

    Using a predesigned standard-cell library

    reduced design risk and time Each standard cell can be optimized

    individually

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    Standard cell library includes

    Sample logic gates. Functions like XOR,FF,ADDER, and

    COMPARATORS,ALU.

    Megafunctions like micropocessorcores,RAM core

    The mega function blocks are sometime

    known as fixed blocks.

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    By selecting the CBIC technology, the designer

    saves a lot of design and characterization timecompared to the Full Custom technology.

    To customize the chip, the designer has to

    define the floor planning and interconnects.

    Like full custom design, since the placements of

    the cells are done at the design phase, thefabrication of the ASIC has to go through all the

    mask process

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