Asic solutionsCutting-Edge Technologies and Premier Turnkey Services for Optimal Product Differentiation

Samsung’s ASIC Solution at a Glance • Advancedlogicprocesstechnologies(including

32/28nmandbelow)

• First-classandcomprehensivedesignservices

• Leaderinmixed-signaldesigns,withsilicon-validatedIP

• VariousIPlineupenablesproductdifferentiation

- ARMProcessors:CortexA9/A15,ARM11andARM9

- PCIe/SATAcomboPHY

- USB3.0PHY

- DDRPHY

- PLL/ADC/DAC/CODeC

- LVDS

- HDMIPHY

• Supportofkeyapplications

- Mobile

- Media

- Storage

- HomeNetwork

• Advancedpackagingandtestingservices

- System-in-Package(SiP)

- PoP(PackageonPackage)

- FCBGA

• Regionaldesigncenterssupportfirst-passdesignsuccess

ASIC System-on-Chip Solutions

OurASICsolutionsarecomplementedbyoursystem-levelknowledgeandexpertiseindeepsub-microndesignmethodologies.Asthemarkethasembracedsystem-on-chip(SoC)technology,workingwithSamsungenablesyoutostreamlinethecreationanddifferentiateleading-edgeproducts.

WithARM®standard-celllibraries,whichareoptimizedforhigh-performance,high-densityandlow-power,plusvariousIPsolutions,weminimizeanyrisksofgettingyourproductstomarket.

Samsung provides customers with the most comprehensive and reliable path to successful ASIC development and production using our technologies. Our total solutions for 32/28nm and smaller process technologies, coupled with premier design expertise, a high-quality IP portfolio, high-volume silicon manufacturing, and advanced packaging and testing capabilities results in a shortened development time, reduced risk and first-pass component design.

As the world’s second-largest semiconductor supplier, we continually enhance our technologies, providing you access to the state-of-the-art logic processes that enrich and differentiate your products.

Your Partner for Next-Generation Designs

A Closer Look — Samsung’s OfferingsOur ASIC solutions provide first-class services such as prototyping, package development, assembly, test, qualifications, characterization, failure analysis, logistics and supply chain management.

• Rich IP Portfolio, Standard Cell, I/O and Memory Libraries

WeofferthebroadestselectionofARMcores,alongwithwiderangeofadvancedmixed-signalIPsolutions.Wealsoprovidesilicon-validatedDDR,PCIe/SATAandUSB3.0IPcoresforvariousapplications.

• Regional Design Centers

OurASICDesignCentersarefocusedondeliveringsuperiorservices.TheyarestaffedbyhighlyskilledASICengineerswhounderstandawidearrayofthird-partydesigntoolsandwillhelpyouwithyourcompleximplementations.Ourregionalcentersoffercompletesupportofdeepsub-microndesignmethodologies,architecturalanalysis,costanalysisandevaluationofsystem-leveltradeoffs.

• Advanced Process Technology

Utilizingouryearsofsuccessasatopsemiconductorsupplier,wehavedevelopedtheprocessexpertiseforhigh-volumemanufacturingwhilealsousingthisknowledgetoincreasethecapabilitiesofyourASICdesigns.

• Packaging and Testing Services

Weofferafullselectionofpackagingoptionsthataccommodatehigh-levelintegrationandmultipleformfactors.WeareoneofthepioneersinPoPandSiPtechnologiesforvariousapplications.Alsoavailableareincreasinglypopularpackagingoptionslikefine-pitchBallGridArray(BGA)andFlip-ChipBGA.Inaddition,weprovidecompletetestingservicesinourownfactories.

Our regional centers offer complete support of deep sub-micron design methodologies, architectural analysis, cost analysis and evaluation of system-level tradeoffs.

Design PartnerDesign CenterManufacturing Site

Tokyo FTS

SeoulC&S Dawin Tech

Alpha Chips

Gilheung (Fab, R&D)

Onyang (Ass’y & Test)

Uniquify

San Jose SSI DC

Advanced Process Technologies

• 65nm

• 45nm

• 32/28nmHKMG

• 20nmHKMG**Targetedfor2H2012

CPU Cores• ARMCortexA9/A15

• ARM7,9&11families

• Cortex-MSeries

DSP Cores• TeakLite

• Teak

A Closer Look —Samsung’s Offerings

The appearance of all products, dates, figures, diagrams and tables are subject to change at anytime, without notice. © 2011 Samsung Electronics is a registered trademark of Samsung Electronics Co. Ltd. All other names and brands are the property of their respective owners.

BRO-11-ASIC-001 Printed 05/11

Samsung Semiconductor, Inc.

3655NorthFirstSt.,SanJose,CA95134-1713TeL:408-544-4000FAX:408-544-4950

Formoreinformation,visithttp://www.samsung.com/us/foundryorscantheQRcode.

Peripheral Cores• 10/100MACethernetControllers

• USB2.0/3.0FunctionCores

• Ieee1394LinkControllers

• PCIeControllers

• SATAControllers

• IrDA

• UART

• SynchronousSerialI/F

• Real-TimeClocks

• Keyboard/MouseI/F

• General-purposeI/F

• SmartCard/SIMI/F

• MultimediaCardI/F

• AsynchronousStaticMemory

Controllers(SRAM,Flash,ROM)

• UniversalMemoryControllers

(SDRAM,SynchFlash,SRAM)

• DMAControllers

• LCDControllers

• Watch-dogTimers

• ProgrammableInterruptControllers

Interface IP • HDMIPHYTxv1.3

• MIPIPHY

• SMIAPHY(CCP2)

• USB3.0PHY

• PCIe/SATAPHY

Mixed-Signal Cores • ADC:6to14bits,upto450MHz

• DAC:8to16bits,upto300MHz

• PLL:Upto2GHz,Frequency

Synthesizer,De-skew,PixelClock,

Dithered,Clock

• CODeC:16-bitAudio,14-bitVoice

• AFe

• VoltageRegulator