at9900063 active metal brazing of different metals to
TRANSCRIPT
AT9900063
Active metal brazing of different metals to aluminiumnitride ceramics
B. Loeser and D. Brunner
ANCeram GmbH & Co.KG, Bindlach, Germany
During recent years aluminium nitride ceramics for substrates, coolers and components have
found more applications in micro- and power electronics.
Aluminium nitride ceramic with high thermal conductivity, small CTE and good thermal
shock resistance is used in aeronautical equipment as well as in drive systems of
undergrounds and high speed trains.
Different metals and alloys can be bonded to A1N by the so-called "AMB-process". The
bonding mechanism is based on the use of so-called active metals like Ti, Zr, Hf.
Copper conductor lines can be brazed onto AlN-jubstrates and components, resistor sheets
can be applied on ceramic water coolers and a couple of other metals and alloys like
Tantalium, Titanium, KOVAR and steel can be attached to AIN-ceramics by active brazing.
Processing, analytical aspects and some special applications will be discussed.
167
Active Metal Braang of Different Metals to AIN Vienna, 06/05/97
Historical Background of the AMB-Process
Aluminium Nitride
Active Metal Brazing of AIN
Analytical Aspects
Special Applications
Summary
Active Metal Brazing of
Different Metals
to Aluminium Nitride Ceramics
Dr. D. Brunner, B. Lflser, ANCeram GmbH & Co. KG, Bindlach,Germany
Aluminium Nitride Ceramics GmbH & Co KG, Esbachgraben 21, Bindlach, Germany
Active Metal Brazing of Different Metals to AIN Vienna. 06/05/97
Historical Background
W.D. Kingery and M. llumenik, 1954 :Surface tension and wettability of metal-ceramic systems
Y. Naidich, 1981 : Wetting induced by Titanium
Joints of Silicon Nitride and Carbide with Metals byActive Brazing ( 1982 ); Degussa, llanau
Joints of AIN with Kovar® by Active Brazing ( 1984 );lleraeus, llanau
Joints of AIN with Copper by Active Brazing ( 1984 );Toshiba
II. Krappitz, H. Thiemann, W. Weise, 1989 :Reactive brazed Ceraniic-Metal-Joints forAutomotive Applications
Joining AIN with Tantalum and Titanium ( 1993 );ANCeram
Historical Background of the AMB-Process
Aluminium Nitride
Active Metal Brazing of AIN
Analytical Aspects
Special Applications
Summary
Aluminium Nitride Ceramics GmbH & Co. KG, Esbachgraben 21, Bindlach, Germany
250-
Thermal conductivity of conventional ceramic substratematerials
materials
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Active Metal Brazing of Diffefent Metals to AIN Vienna. 06/05/97
Historical Background of the AMB-Process
• Aluminium Nitride
Active Metal Brazing of AIN
Analytical Aspects
Special Applications
• Summary
Aluminium Nitride Ceramics GmbH & Co. KG, Esbachgraben 21, Bindlach, Germany
4. Mikroclinrnkterisiennifj
Rcaktionen:
Rcaktionszonen:
Schliflbild:
4Ti + 3A1N - 3TiN + TiAl3
Ag-Cu-Eutektikum bei 780°C
Kupfer
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Active Metal Brizing of Different Metals to A1N Vienna. 06/05/97
Historical Background of the AMB-Process
Aluminium Nitride
Active Metal Brazing of AIN
Analytical Aspects
Special Applications
Summary
Aluminium Nitride Ceramics GmbH & Co. KG, Esbachgraben 21, Bindlach, Germany
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Soldering Metal
Alloy Junction
OFHC-Cu
Alloy junction
Alumina
174
Active Metal Brazing of Difl'erenl Metals to AlN Vienna. 06/05/97
Historical Background of the AMB-Process
Aluminium Nitride
Active Metal Brazing of AlN
Analytical Aspects *-"'
Special Applications
• Summary
Aluminium Nitride Ceramics GmbH & Co. KG, Rsbachgraben 21, Bindlach, Germanyy
Active Brazing Process
AIN Substrate ] L Copper Foil
Rinsing Punching
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| Screen Printing of Metal Paste Cleaning
Adjusting of Copper Foils in Solder Fixture
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Reactive Brazing
Screen Printing of Etch Resist
Baking
Etching
Resist Stripping
07 07 9S
\cii\e Bra/ing Process
AIN Subsiraic ( tipper ( 'oil
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AIN/AMB Fa.ANCeramGefugeausbildung
Kante 5
Faust Kante 6
111"!Fraunhoftr
tnstitutZuvariflssigkeit undMkrointegration
DepartmentMECHANICAL RELIABILITYAND MICRO MATERIALSHead: Prof. Dr. Bemd Michel
Aluminium Nitride Substrates for Power Electronics
Active Brazed Copper (ABC)Substrates developed byANCeram
R . H a h l l , ANCERAM2DOC. 21.ll.1996. HahitTUB. Tel. 030 314 72833. Fax. 030 314 72 835
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Water-cooled inverter torunderground trains, equippedwith ANCeram modules
Active Metal Brazing of Different Metals to AIN Vienna. 06/05/97
Summary
AIN is wettable to different alloys activated by Ti, Zr, Hf,Ni, and Cr
AIN is attachable to KOVAR, Titanium, Tantalum, stainlessSteel and Copper
AIN-Metal-Joints show high peel strength and sufficientthermal and electrical behavior
AIN active brazed with Copper may become an alternativeto the DCB-Process on Alumina for high power application
Aluminium Nitride Ceramics GmbH & Co. KG. Esbachgraben 21. Bindlach. Germany
180