atom chip technology (act) a new program to focus a new quantum technology for emerging national...
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Atom Chip Technology (ACT)Atom Chip Technology (ACT)A New Program to Focus a New Quantum A New Program to Focus a New Quantum Technology for Emerging National NeedsTechnology for Emerging National Needs
CQI
Please See Nick Bigelow
With Questions
Atom Chip Technology (ACT)Atom Chip Technology (ACT)A New Program to Focus a New Quantum A New Program to Focus a New Quantum Technology for Emerging National NeedsTechnology for Emerging National Needs
Relevance and ObjectiveAdvancements in quantum optics and atomic physics have provided powerful new strategies for implementing sensitive devices useful for quantum information technologies. Development to a state compatible with field-ready specifications is required and is realistic to expect. The objective of ACT is to provide the Nation with an advanced quantum/atom optical toolbox implement-able within a rugged, portable environment.
Present State– Preliminary atom chip devices have already been demonstrated in several European laboratories, but only to a limited extent in the US. There is a need for the US to ensure capability in this emergent area.
Approach–ACT will extend the concepts used in the production of integrated electronic circuits to realize integrated atomic chip devices offering the capabilities to manipulate both atoms and light using a micro-chip based technology known as the atom chip; a self-contained, chip-based laboratory
CQI
Needed Laser Technology Needed Laser Technology is Already Robust and isis Already Robust and is
Ready for ACT IntegrationReady for ACT Integration
Key to ACT are high performance solid-state lasers–atoms manipulated on the atom chip must be laser cooled to low enough energies that quantum behavior is accessed and to low enough energies that control fields on the chip can be effective
ACT Approach– Next generation ACT devices will have the diode laser systems integrated in the atom chip making the ACT based systems portable and increasingly rugged.
Current State of Technology–ACT laser used in laboratory based work are already compact rugged devices based on semiconductor (diode) lasers similar to those used in portable CD players, laser pointers etc.– These systems are compact, self-contained and can be battery powered (see photo).– Such laser systems are already field ready and have passed NASA shake table tests for deployment aboard the Shuttle, in satellites and the on International Space Station.
CQI
Vacuum Systems Needed for ACT are Vacuum Systems Needed for ACT are Already CompactAlready Compact
Atoms in ACT devices mandate that atom chips operate in vacuum conditions–atoms manipulated on the atom chip must be protected from collisions with off chip atoms. This is achieved by operating the ACT device in a vacuum.
ACT Approach– Next generation ACT systems will include self contained units similar in construction and reliability to electronic vacuum tubes and CRTs.
Current State of Technology–Laser cooled atom traps have already been operated by numerous groups in simple stainless steel vacuum “crosses” such as shown above. – Similar hardware is regularly used in space flight and remote sensing systems.–Pre-pumped vacuum chambers can be maintained using only ion pumps run from lightweight batteries.
High Temperature Superconductors High Temperature Superconductors Will Take Atom Chip Technology Will Take Atom Chip Technology to New Performance Levels While to New Performance Levels While
Remaining Portable and Field ReadyRemaining Portable and Field Ready
Use of superconducting wires will dramatically enhance ACT performance–Replacing conventional metal-film wires with superconducting wires in ACT will allow stronger control fields to be used and simultaneously will reduce on-chip power dissipation (a significant problem in state-of-the-art microprocessors)
ACT Approach– Next generation ACT devices will be developed using superconducting component. – The strong confinement and control fields will allow access to quantum mechanical motional states sought for quantum information applications– Superconducting “ground planes” will virtually eliminate environmental quantum decoherence, estimates show
Current State of Technology–Suitable high temperature superconductors are readily available that do not require cumbersome and fragile liquid helium cooling systems–Compact, portable cryostats are readily available offering long cold times and rugged construction– NASA shake-table tests cryostats have been developed and are used in space and in ocean going sea-ship detection buoys
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface
First Rochester Atom Chips Are First Rochester Atom Chips Are Already Being Constructed Using 3-d Already Being Constructed Using 3-d
Wire-bond Fabrication Technique:Wire-bond Fabrication Technique:The Atom Raster & The Atom FunnelThe Atom Raster & The Atom Funnel
Identified Need: The Atom Raster–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms to sites of choice on the chip. Functional Concept –By selectively sending current through different wires, the micro-clouds can be translated to the position of choice, a few tens of microns over the wire raster grid.
Identified Need: The Atom Funnel–Useful Atom Chip devices will require techniques for delivering micro-clouds of atoms from a three dimensional cloud onto the atom chip or into the atom raster. Functional Concept –By distorting the magnetic field used to create the atom cloud hovering above the chip, a small neck in the trap tens of microns in diameter can be funneled down to the atom chip surface.
Atom Cloud from Trap
I I
Atom Funnel to Surface