AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Fabriksgasse 13 | A-8700 Leoben Tel +43 (0) 3842 200-0 | E-Mail info@ats.net

www.ats.net

AT&S First choice for advanced applications

Investor and Analyst Presentation

April 2017

Company Overview

Strategy & Market

Annex

Financials

Table of Contents

1

High-end interconnect

solutions for

Mobile Devices, Automotive,

Industrial, Medical Applications

and Semiconductor Industry

Continuously

outperforming

market growth

€ 762.9m revenue in FY 2015/16;

Q1-3 2016/17: revenue

growth of 5.3% to € 615.1m

# 1 manufacturer in Europe

# 3 in high-end technology

worldwide

9,452 employees

Cost-competitive production

footprint with

6 plants in Europe and Asia

AT&S – a world leading high-tech PCB company

2

Outstanding process know-how

and process efficiency

Our competitive advantages

Cost advantage as first high-end IC

substrates manufacturer in

China

Strategic focus on high-end

technologies and applications

Technology leverage between

customer segments

Quality

3

What guides us

Vision First choice for advanced applications

Targets

Strengthening the technology leadership

Long-term profitable growth with the target to be one of the most profitable

players in the industry

Generation of shareholder value

Strategy

Focus on high-end technologies and applications with above average

growth potential and long-term profitability

Focus on highest service-level and customer orientation

Focus on operational excellence

Focus on cash flow generation

4

High-end PCBs and IC substrates for high-end applications

Revenue Share*

Segment Selected Market

Leaders**

GoPro

Sony

LG

Canon

Qualcomm

Lenovo

Nvidia

Vivo

Huawei

Samsung

Xiaomi

ZTE

Intel

Apple

Alphabet

Asus

Selected Applications

Osram

Hella

Siemens

Boston Scientific

Continental

Harman

Airbus

Sonova

Mobile Devices & Substrates

Automotive, Industrial, Medical

Consumer Electronic

Smartphones Wearables

Tablets, Ultra-books, 2 in 1

Automotive: Navigation, Advanced Driver Assistance Systems, Infotainment...

Industrial: Machine-2-Machine communication, industry computer...

Medical: MRT, hearing aids, pacemaker, patient monitoring...

* Based on external revenue; Q1-3 2016/17 ** Does not reflect actual customer base

61%

39%

5

IC substrates for High Performance Computing

61%

39% Mobile Devices &Substrates

Automotive,Industrial, Medical

514 542

590

667

763

584 615

103 102 127

168 168 140

102

42 31 54

90 77 76

12*

2011/12 2012/13 2013/14 2014/15 2015/16 Q1-32015/16

Q1-32016/17

Revenue EBITDA EBIT

AT&S – Key Facts

Strong track record 1 Balanced portfolio/Global customer base 2

7%

Split revenue: Business Unit, Q1-3 2016/17

Split revenue: Customer Region, Q1-3 2016/17 based on sold to party

+5% +9% +13% +14%

* Based on ramp-up effects for new plants in China

Revenue growth

€ in millions

6

23%

6%

14%

57%

Germany/Austria

Other Europeancountries

Asia

Americas

Global footprint ensures proximity to supply chain & cost efficiency

European production facilities: high mix/low volume Asian production facilities: high volume/low mix

Sales network spanning three continents 9,452 employees*

Plant Shanghai, China Staff: 4,561*

Plant Ansan, Korea Staff: 296*

Plant Nanjangud, India Staff: 1,132*

Plant Chongqing, China In ramp phase Staff: 2,035*

Plant Leoben, Austria Headquarters Staff: 978*

Plant Fehring, Austria Staff: 372*

AT&S sales offices AT&S plants

* Average, FTE, Q1-3 2016/17; 78 employees in other locations

7

PCB market – Overview

15.654 17.146

16.203 17.543

7.676

8.084 3.638

4.332 3.645

4.417 2.288

2.520

2016 2020Computing Communication

Consumer Automotive

Industrial/Medical Military/Aerospace

4.9%

4.5%

1.3%

2.3%

2.0%

Source: Prismark, Feb. 2016

Moderate growth of 2.4% forecast for the total PCB market until 2020.

49.104 54.042 CAAGR 2016-

2020: 2.4%

2.4%

USD in billions

8

AT&S outperformed a flat market in the past 5 years and is set to continue to do so also in the future.

100.5 101.3 103.7 99.8

105.4 114.8

129.8

148.4

2011* 2012 2013 2014 2015

Index (2011 = 100)*

PCB & substrates market AT&S revenue

* Basis 2011: PCB & substrates market: USD 55.4bn AT&S revenue: € 514m

AT&S outperformed the market by scaling high-end any-layer technology and by leveraging HDI technology to the Computer-, Consumer-, Automotive-, Industrial and Medical market.

Company Overview

Strategy & Market

Annex

Financials

Table of Contents

9

10

AT&S positioning – Current

Strategic focus on high-end technologies

AT&S revenue structure in 2015/16 – based on technologies

High-end HDI PCBs and IC substrates

~ 30%

Single-sided (SS), double-sided (DS), multilayer (ML), flex and rigid-flex (RF) PCBs

~ 70%

High-end technology share > 70% HDI and any-layer PCBs, Embedding

Complementary technology share: < 30% SS, DS, ML,

Flex, RF

Structure of general PCB market – based on technologies

11

Source: Prismark 2015; JMS 2015; NTI 2015; AT&S Strategy

Market position HDI Technology

Revenue (USD in millions)

Rank Country Supplier HDI Non HDI

PCBs IC

substrates Total

revenue

1 TWN Unimicron 738 634 758 2,130

2 TWN Compeq 624 486 - 1,110

3 AUT AT&S 557 329 - 886

4 JPN Ibiden 462 376 655 1,493

5 KOR SEMCO 392 200 970 1,562

6 USA TTM 376 1,046 - 1,422

7 TWN Zhen Ding 369 2,114 - 2,483

8 TWN Tripod 321 1,070 - 1,391

9 TWN Unitech 302 153 - 455

10 CHN Kingboard (E&E) 275 688 - 963

Market Player/Position HDI Technology

12

Driving Future Trends: Internet of Things (IoT) Applications Everything is going to be smart and/or connected

Healthcare & Fitness

Smart Watches and Glasses Wearable Electronics

Smart Mobility Autonomous Driving

Car2X Communication

Smart City Smart Lighting

Smart Buildings Home/Building Automatization

Smart Home Devices

Smart Production/Industry 4.0 Automatization/Robotics

Machine-to-Machine Communication

Smart Healthcare Connected Patient Monitoring Systems

Connected Consumer Healthcare Devices

Smart Energy Smart Metering

Building Blocks of IoT Modules: Sensing, Connectivity, Energy Storage/Harvesting, Power Management

30-50 billion of „Things“ will be connected in 2020

Wearable electronic devices offer revenue opportunities of USD 61.7bn beyond the smartphone market in 2020 Source: Gartner Inc. 2016

The world is changing – miniaturization & modularization as main drivers

2003/04 2013 2017 202x

?

Type Mobile Phone Smartphone Smartphone All in One

PCB 125x55mm 85x20mm 80x20mm 25x25mm ?

FF 1 0.25 0.23 0.06 ?

L/S 100/100µm 40/40µm 30/30µm 10/10µm

Techn. 1-n-1 Any-layer mSAP – Any-layer FO/SAP/mSAP

13

From vision to strategy

14

Targets/Key Performance Indicators

Strategy

Strengthening technology leadership • Leading player in the high-end core

business • Medium-term: leading player in new

business areas • Innovation Revenue Rate: > 20%

Continuous innovation and focus on high-end technologies and applications

Focus on innovative solutions

Long term profitable growth/to be one of the most profitable players in the industry • Medium-term EBITDA margin target of

18-20% • Medium-term revenue target of ~ € 1bn

Focus on technologies and applications with above- average growth potential and long-term profitability

Focus on highest service-level and customer orientation

Focus on operational excellence

Focus on cash flow generation

Generation of shareholder value • Medium term ROCE of 12%

Sustainable development focusing on ROCE

Stable dividend policy

Vision: “First choice for advanced

applications”

The best employees and executives • Talent Programs • Trainings • Leadership Excellence Program

Sustainable management To be the benchmark of the industry by reduction of: • 5% CO2 emissions p.a. • 3% freshwater consumption p.a.

Capital Excellence • Equity ratio: > 40% • Financing costs of < 2% (in a

corresponding interest environment) • Payback period of < 3 years

19.6% of AT&S‘ total revenue in 2015/16 is generated by products with new, innovative

technologies introduced to the market within the last three years (Innovation Revenue

Rate). IRR decreased due to a generation of mature products.

162 patent families, resulting in 212 patents.

R&D expenses: € 95.5m in the financial year 2015/16.

R&D quota (i.e. relation to revenue): 12.5% (vs. 8.7% in the previous year). Adjusted for

project IC substrates: 4.5%.

32.9

24.7 31.8

57.9

95.5

2011/12 2012/13 2013/14 2014/15 2015/16

15.0

19.2

26.5

29.2

19.6

2011/12 2012/13 2013/14 2014/15 2015/16

101

124

153

174

212

2011/12 2012/13 2013/14 2014/15 2015/16

IRR (Innovation Revenue Rate)

€ in millions in % Quantity

Patents R&D expenses

Research and development as the key for technological leadership

15

„New interconnect solutions“ > supporting miniaturization and

modularization

„High-end Toolbox“

New and existing Application Areas

New and existing customers Semiconductors Packaging

companies (OSATs) Original Electronic

Manufacturers (OEMs)

Tier 1 suppliers

Future positioning as leading high-end interconnect solutions provider

Mobile Devices

Automotive

Industrial

Medical

INTERNET of

THINGS

NEW TECHNOLOGIES

IC substrates Advanced Packaging

Substrate-like PCBs

EXISTING TECHNOLOGIES

Multilayer PCBs HDI any-layer PCBs

Embedding Flexible PCBs

CORE BUSINESS Multilayer PCBs, HDI any-layer PCBS, Embedding, Flexible PCBs

e-IC substrate Advanced Packaging/SLP (SiB) Advanced Packaging/(SiP) e-Interposer

16

„More comprehensive positioning in the value chain“

17

AT&S’ advanced technology solutions

General Description & Technology Application Areas Customer Base

High-end (HDI) PCBs

PCBs are the interconnection platform for electric, electronic & mechanical components (such as resistors, capacitors, ICs,

connectors, etc.) Density: Line/Space > 35 micron

Computer, Consumer, Communication, Automotive

Industrial, Medical

OEMs Tier 1 Tier 2

Substrate-like PCBs

Substrate-like PCBs are the next evolution of high-end HDI PCBs with higher density: Line/Space < 30 micron

Mobile Applications like Wearables

OEMs Tier 1 Tier 2

18

General Description & Technology Application Areas Customer Base

IC substrates

IC substrates serve as interconnection platform with higher density (Line/Space < 15 micron) between

semiconductors (Chips) & PCBs

High-end processors for Computer, Communication,

Automotive, Industrial

OEMs Semiconductor

Industry

Embedded Component Packaging

(ECP®)

Embedded Component Packaging allows to embed active/passive components (e.g. wafer level dies) within the

layers of a PCB – contributes to miniaturization

Power Electronics, e.g. for

Automotive, Industrial

OEMs

Semiconductor Industry

AT&S’ advanced technology solutions

Growth Project Chongqing

IC substrate project Investment* Phase 1: ~ € 280m Investment* as of 31/12/2016: € 258m

Substrate-like PCB project Investment* Phase 1: ~ € 200m** Investment* as of 31/12/2016: € 170m

IC substrates: > Ramp of first production line still ongoing – with operative improvements resulting in higher output and yields, target yield levels should be achieved in the second half of calendar year 2017 > 9 products for client computer and server qualified, 11 under qualification > Second production line started in December 2016

Substrate-like PCBs: > First production line in serial production, running on high capacity utilization and good yield > Second production line under installation

* CAPEX for tangible fixed assets ** Additional investment of ~ € 30m for mSAP technology

19

Q4 2015/16 (January – March 2016)

Challenge: Ramp of three production lines within 12 months

Ramp: PRODUCTION LINE 1 – IC SUBSTRATES

Q1 2016/17 (April – June 2016)

Q2 2016/17 (July – September 2016)

Q3 2016/17 (October – December 2016)

Q4 2016/17 (January – March 2017)

Ramp: PRODUCTION LINE 1 – SUBSTRATE-LIKE PCBs

Ramp: PRODUCTION LINE 2 – IC SUBSTRATES

FY 2015/16 FY 2016/17

20

21

Company Overview

Strategy & Market

Annex

Financials

Table of Contents

87

72

105

144 137

130

17

Sound top-line growth, above industry margins and increasing cash conversion

Revenue YoY growth

Operating Cash Flow YoY development

EBITDA and EBITDA-margin

Revenue increase based on revenue from Chongqing plants and organic growth.

EBITDA impacted by negative effects from ramp-up of new plants in Chongqing.

EBITDA margin adjusted for Chongqing clearly above high level of Q1-3 2015/16.

Decrease is based on lower EBIT and higher depreciation.

€ in millions

514 542

590

667

763

584 615

€ in millions

103 102 127

168 168

140

102

142* 154*

€ in millions; % * Adjusted for Chongqing effects

20.1% 18.9% 21.6% 25.1% 22.0% 24.0% 16.6%

25.8%* 23.7%* 24.4%* 26.0%*

22

Revenue: flat revenue in core PCB business due to limited capacities, stronger seasonality in Q1 and negative FX effects; revenue increase on segment level mainly based on Chongqing revenue

EBITDA adjusted: negative price/product mix effects in Q1 not compensated by cost savings program

Business Development – Mobile Devices & Substrates

68.0

88.7

120.9 104.5 115.9 112.2

123.4

101.0 97.7

126.6

148.6

Q12014/15

Q22014/15

Q32014/15

Q42014/15

Q12015/16

Q22015/16

Q32015/16

Q42015/16

Q12016/17

Q22016/17

Q32016/17

€ in millions (unless otherwise indicated)

Q1-3 2015/16 Q1-3 2016/17 Change in %

Revenue 419.6 438.6 4.5%

Revenue with external customers 351.5 372.9 6.1%

EBITDA 109.1 56.1 (48.6%)

EBITDA margin 26.0% 12.8% -

EBITDA adjusted* 111.5 103.7 (7.0%)

EBITDA margin adjusted* 26.7% 25.0% -

€ in millions; ** Revenue with external customers

Revenue per quarter**

23

* Adjusted for Chongqing effects

72.6 71.7

65.9

72.6

77.8 79.5 72.7 76.6

80.4 79.9 78.9

Q12014/15

Q22014/15

Q32014/15

Q42014/15

Q12015/16

Q22015/16

Q32015/16

Q42015/16

Q12016/17

Q22016/17

Q32016/17

Automotive: continuous high demand for HDI PCBs (e.g. driver assistance systems and safety features)

Strong growth in medical segment continued

On EBITDA level, positive impact from release of a provision for unused production space

Business Development – Automotive, Industrial, Medical

24

€ in millions; * Revenue with external customers

€ in millions (unless otherwise indicated)

Q1-3 2015/16 Q1-3 2016/17 Change in %

Revenue 246.7 262.0 6.2%

Revenue with external customers 230.0 239.2 4.0%

EBITDA 24.9 37.0 48.3%

EBITDA margin 10.1% 14.1% -

Revenue per quarter*

7,341 7,403 7,399 7,379 7,339 7,386 7,417

1,049 1,152 1,289 1,380 1,826 1,929 2,035

8,390 8,555 8,688 8,759 9,165 9,315 9,452

Q12015/16

H12015/16

Q1-32015/16

2015/16 Q12016/17

H12016/17

Q1-32016/17

Core business Employees Chongqing

40.3

57.9

78.7 77.4

66.3

76.2

49.8

Q12015/16

Q22015/16

Q32015/16

Q42015/16

Q12016/17

Q22016/17

Q32016/17

Net CAPEX & Staff

Net CAPEX CAPEX spending of € 192.3m in Q1-3 2016/17 includes investments in Chongqing project (whereof € 141.0m in Q1-3) and technology investments in existing locations.

STAFF* The increased headcount is primarily based on Chongqing.

€ in millions * incl. leased personnel, FTE, average for the period

25

Financials Q1-3 2016/17

€ in thousands (unless otherwise

stated)Q1-3 2015/16 Q1-3 2016/17

Change

YoY

STATEMENT OF PROFIT OR LOSS

Revenue 584,333 615,063 5.3%

produced in Asia 81% 82% 1pp

produced in Europe 19% 18% (1pp)

EBITDA 140,233 102,108 (27.2%)

EBITDA margin 24.0% 16.6% (7.4pp)

EBITDA adjusted 141,619 153,715 8.5%

EBITDA adjusted margin 24.4% 26.0% 1.6pp

EBIT 76,074 11,840 (84.4%)

EBIT margin 13.0% 1.9% (11.1pp)

EBIT adjusted 83,792 97,239 16.0%

EBIT adjusted margin 14.5% 16.4% 1.9pp

Finance costs – net (2,664) (18,551) (>100%)

Income taxes (13,182) (13,038) 1.1%

Profit/(loss) for the period 60,228 (19,749) (>100%)

Earnings per share € 1.55 (€ 0.51) (>100%)

26

Negative impact from project Chongqing of € 51.6m.

Improved vs. prior year due to FX and cost savings despite higher seasonality and unfavorable prices and product mix (mainly in Q1).

Includes negative FX effects of € 8.2m; prior year: positive FX effects of € 3.1m.

Financials Q3 2016/17

€ in thousands (unless otherwise

stated)31 Mar 2016 31 Dec 2016 Change

STATEMENT OF FINANCIAL

POSITION

Non-current assets 866,338 979,328 13.0%

Current assets 478,312 453,978 (5.1%)

Equity 568,936 546,791 (3.9%)

Non-current liabilities 421,407 586,552 39.2%

Current liabilities 354,307 299,963 (15.3%)

Total assets 1,344,650 1,433,306 6.6%

Net debt 263,192 451,808 71.7%

Net gearing 46.3% 82.6% 36.3pp

Net working capital 88,427 133,015 50.4%

Net working capital per revenue 11.6% 16.2% 4.6pp

Equity ratio 42.3% 38.1% (4.2pp)

27

Reduced due to net loss of € 19.7m, dividend payout of € 14.0m. Positive impact from FX of € 11.7m.

Increase due to high CAPEX spending.

Increase mainly due to accounts receivables.

273 299

372 405

523

618

31

82

261 274

260 166 242 217

111 131

263

452

2011/12 2012/13 2013/14 2014/15 2015/16 Q1-32016/17

Gross debt Financial assets and cash Net debt

2.3

2.1

0.9 0.8

1.6

2011/12 2012/13 2013/14 2014/15 2015/16

Expected multiple in temporary peak of Chongqing investments: ~ 3.5x

Net debt/EBITDA

Gross debt, financial assets and cash, net debt

Sufficient liquid funds of € 166m for further financing of Chongqing and other running or planned investments until end of FY 2016/17.

€ in millions

28

Gross debt, financial assets and cash, net debt

77.0%

18.8%

4.2%

Currency mix of debt portfolio

EUR USD RMB

€ in millions* < 1 Year 1-5 Years > 5 Years Total

Promissory note loans 2014 1.9 61.2 5.0 68.1

Promissory note loans 2015 0.7 156.6 66.5 223.8

Promissory note loans 2016 0.3 49.9 100.0 150.2

Subsidized loans 43.9 35.5 - 79.4

Bank Borrowings and others 43.2 53.2 - 96.4

Total 31/12/2016 90.0 356.4 171.5 617.9

Total 31/03/2016 161.4 285.3 76.3 523.0

Overview Debt Portfolio Duration

Average debt portfolio duration: 3.1 years (2015/16: 3.9 years)

Financing costs: 2.4% (as of 31/12/2016)

€ 224m of credit lines not utilized (as of 31/12/2016)

Currency mix of EUR and USD to support natural hedging strategy

29

Maturity

* Including accrued interest and placement costs

Financials Q1-3 2016/17

€ in thousandsQ1-3 2015/16 Q1-3 2016/17

Change

YoY

STATEMENT OF CASH FLOWS

Operating result (EBIT) 76,074 11,840 (84.4%)

Paid/received interests (7,843) (11,629) (48.3%)

Paid taxes (6,575) (10,706) (62.8%)

Non cash bearing of profit or loss 61,767 85,004 37.6%

Cash flow from operating activities

before changes in working capital123,423 74,509 (39.6%)

Changes in working capital 6,475 (57,705) (>100%)

Cash flow from operating activities 129,898 16,804 (87.1%)

Cash flow from investing activities (175,667) (108,650) 38.2%

Cash flow from financing activities 204,117 78,440 (61.6%)

Change in cash and cash equivalents 158,348 (13,406) (>100%)

30

2016/17 includes payout of promissory note loans of € 150m for repayment of retail bond.

Net working capital increase due to seasonality.

Net Working Capital Management

92

103

92 95 88

133

18.0% 19.0%

15.6%

14.3%

11.6%

16.2%

2011/12 2012/13 2013/14 2014/15 2015/16 Q1-3 2016/17

Net Working Capital development Net Working Capital as a percentage of revenues

€ in millions; % of revenue

Net Working Capital development

31

AT&S – Stock Profile

Listing: Vienna Stock Exchange,

Prime Standard

Indices: ATX Prime, WBI

Thomson Reuters (A): ATSV.VI

Bloomberg (A): ATS:AV

Annual results 2016/17 09 May 2017

Record Date Annual General Meeting 26 June 2017

23rd Annual General Meeting 06 July 2017

Ex-Dividend Day 25 July 2017

Record Date Dividend 26 July 2017

Dividend Payment Day 27 July 2017

32

Financial Calendar Shareholder structure

# of shares outstanding 38.85m

Average daily volume: ~ 68,600 shares*

Performance YTD: +10.53%*

Dividend 2015/16: € 0.36 per share

Dividend yield: 2.8%

* 01/01/2017 – 31/03/2017

Focus on:

- Chongqing plant 1 (IC substrates): finish ramp phase and continue ramp of the second

production line

- Build-up of the new technology generation (mSAP) for high-end PCBs in plant Shanghai

and plant 2 in Chongqing

- Cost and price management

AT&S expects usual seasonality in Q4. Based on the developments in the raw material markets (copper,

laminates), cost of material is under pressure. Due to changes in product and technology cycle in the

semiconductor industry high price pressure for IC substrates continues.

Based on a macroeconomic stable environment, FX relation of USD-EUR on a similar level than FY 2015/16 and a

stable demand in the core business, management expects revenue growth of 4-6%. EBITDA margin should be on

a level of 15-16%, based primary on costs related to the ramp of Chongqing. EBITDA margin in core business

should be on a similar level than in FY 2015/16. Higher depreciation for the project Chongqing of additional

~ € 40m in FY 2016/17 will have a clear impact on EBIT level.

Outlook FY 2016/17

33

34

Company Overview

Strategy & Market

Annex

Financials

Table of Contents

AT&S Product Portfolio – I

ECP®: Embedded Component Packaging

IC substrates Substrate-like printed circuit boards

Embedded Component Packaging allows to embed active/passive components (e.g. wafer level dies) within the layers of a PCB – contributes to miniaturization.

IC substrates serve as interconnection platform with higher density (Line/Space < 15 micron) between semiconductors (Chips) & PCBs .

Substrate-like PCBs are the next evolution of high-end HDI PCBs with higher density: Line/Space < 30 micron.

Production site Leoben

Chongqing

Chongqing, Shanghai

Applications Devices such as smartphones, tablets, digital cameras and hearing aids

High-end processors for Computer, Communication, Automotive, Industrial

Mobile applications like wearables

35

AT&S Product Portfolio – II

HDI any-layer printed circuit

boards

HDI microvia printed circuit boards – high density interconnect

Multilayer printed circuit boards

Double-sided printed circuit boards

IMS printed circuit boards – insulated

metal substrate

Further technological enhancement to HDI microvia: All electrical connections in HDI any-layer boards consist of laser-drilled microvias. Advantage: further miniaturization, and higher performance and reliability. AT&S produces HDI any-layer in 4 to 12 layers.

HDI: high density interconnect, meaning laser-drilled connections (microvias). HDI is first step towards miniaturization. AT&S can produce 4-layer laser PCBs up to 6-n-6 HDI multi layer PCBs.

Found in almost every area of industrial electronics. AT&S produces printed circuit boards with 4 to 28 layers, in quantities from individual prototypes to small batches and mass production.

Used in all areas of electronics. AT&S focuses on double-sided printed circuit boards with thicknesses in the range of 0.1-3.2mm.

IMS: insulated metal substrate. Primary function: heat dissipation for use mainly with LEDs and power components.

Production site Shanghai

Shanghai, Leoben

Leoben, Nanjangud, Fehring

Fehring, Nanjangud

Fehring

Applications Smartphones, Tablets, Notebooks

Mobile phones and nearly all electronic applications including automotive (navigation, infotainment and driver assistance systems)

Used in all electronic applications including touch panels, and in products ranging from aircraft to motorcycles, from storage power plants to solar arrays

Primarily industrial and automotive applications

Lighting industry

36

AT&S Product Portfolio – III

Flexible printed circuit boards

Semi-flexible printed circuit boards

Rigid-flex printed circuit boards

Flexible printed circuit boards on aluminum

AT&S patented technologies

Used to replace wiring and connectors, allowing for connections and geometries that are not possible with rigid printed circuit boards.

More limited bend radius than flexible printed circuit boards. The use of a standard thin laminate makes them a cost-effective alternative.

Combine the advantages of flexible and rigid printed circuit boards, yielding benefits for signal transmission, size and stability.

Used when installing LEDs in car headlights, for example, where the printed circuit board is bonded to an aluminum heat sink to which the LEDs are then attached.

Production site Ansan, Fehring

Fehring

Leoben, Ansan

Ansan

Applications Nearly all areas of electronics, including measuring devices and medical applications

Automotive applications

Industrial electronics, such as production machines and industrial robots

Lighting, automotive, building lighting

ECP®: Embedded Component Packaging ECP® is a patented AT&S packaging technology used to embed active and passive electronic components in the inner layers of a printed circuit board. ECP® technology is used in ever smaller, more efficient and more powerful devices, such as smartphones, tablets, digital cameras and hearing aids. Production site: Leoben

2.5D® Technology Platform Combines mechanical and electronic miniaturization, and enables partial reduction of the thickness of a circuit board. Advantage: populated assemblies have a thinner profile. Can be also used to make cavities in the printed circuit board, e.g. for acoustic channels. Major application for this technology is the 2.5D® rigid-flex printed circuit board, a lower cost alternative for flex-to install applications. Production sites: Leoben, Shanghai

37

Management

Andreas Gerstenmayer, CEO Born 1965; joined AT&S as CEO in 2010 Previous positions include:

18 years of work experience at Siemens, including Managing Director with Siemens Transportation Systems GmbH Austria and CEO of the Drive Technology business unit in Graz from 2003 to 2008

Partner at FOCUSON Business Consulting GmbH after leaving Siemens Education and other positions:

Member of the Research Council of Styria Degree in Production Engineering from Rosenheim University of

Applied Sciences

Heinz Moitzi, COO Born 1956; COO since 2005; with AT&S since 1981* Previous positions include:

Various management positions within AT&S Measurement engineer with Leoben University of Mining and

Metallurgy Education:

Degree from Higher Technical College of Electrical Engineering

Karl M. Asamer, CFO Born 1970; joined AT&S as CFO in 2014 Previous positions include:

Managing Director of GEKA Group in Germany Managing Director of Sell GmbH in Germany

Education: Degree: Doctorate in business administration in Linz, Austria

* He was already with the founding company of AT&S

Responsibilities: Sales and Marketing Human Resources Investor Relations, Public Relations and

Internal Communications Business Development & Strategy Compliance CSR & Sustainability

Responsibilities: Finance and Accounting, Treasury Controlling Legal Affairs, Risk Management and

Internal Audit IT and Organization Procurement

Responsibilities: Research & Development (R&D) Operations Quality Management Business Process Excellence Environment Safety

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Milestones in the Group’s history

1987 Founding of the Group, emerging

from several companies owned by

the Austrian State Owned

Industries.

1994 Privatization and acquisition

by Messrs. Androsch,

Dörflinger, Zoidl.

1999 Initial public offering on Frankfurt Stock Exchange

(„Neuer Markt“). Acquisition of Indal Electronics

Ltd., largest Indian printed circuit board plant

(Nanjangud) – today, AT&S India Private Limited.

2002 Start of production at new Shanghai

facility – one of the leading HDI

production sites in the world.

2010 Start of production

at plant II in India.

2009 New production direction: Austrian

plants produce for high-value niches

in the automotive and industrial

segment; Shanghai focuses on the

high-end mobile devices segment.

2008 AT&S changes

to Vienna Stock

Exchange. 2006 Acquisition of Korean

flexible printed circuit

board manufacturer,

Tofic Co. Ltd. – today,

AT&S Korea Co., Ltd.

2015 AT&S again achieves record high sales and earnings for

financial year 2014/15 and decides to increase the investment

program in Chongqing from € 350m to € 480m.

2011 Construction starts on new

plant in Chongqing, China.

Capacity increase in

Shanghai by 30%.

2013 AT&S enters the IC substrates

market in cooperation with a

leading manufacturer of

semiconductors.

2016 AT&S starts the serial production

of IC substrates at the plant in

Chongqing.

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Five core dimensions of sustainability within AT&S

Energy and carbon footprint

Water

AT&S – a learning organization

Resources

Thinking ahead – shaping the future

CSR gains importance in long term success Improving efficiency Motivated and qualified staff

CSR as a key to sustainable business success

The importance of sustainability is rising within:

Authorities (basis for securing operation licenses)

Customers (relevant for placing orders)

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AT&S saves CO2 and Water…

Sustainability – Figures and Fields of Action

AT&S aims to minimize its environmental footprint by reducing the CO2 emissions per m2 PCB attributable to production processes by 5% a year.

AT&S aims to reduce the Group‘s annual fresh water consumption per m2

PCB by 3%.

765.2

834.7

783.9

734.0 718.6

2011/12 2012/13 2013/14 2014/15 2015/16

Freshwater consumption**

** in liters per sqm weighted PCB

1)

47.4

51.0 50.7

49.0

50.7

2011/12 2012/13 2013/14 2014/15 2015/16

CO2-Footprint*

1)

* in kg per sqm weighted PCB

1) Since 2012/13 calculation according to EICC standards; before that AT&S internal calculation

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