Appendix 1

AT&T ESD Policy

Policy

One of the strengths of AT&T products and services has always been its continuing commitment to high quality and reliability. Central to that endeavor is Electrostatic Discharge (ESD) control and prevention. It is, therefore, our policy to:

• Consistently provide components and systems that are sufficiently ESD design hardened to meet the quality and reliability expectations of our customers.

• Consistently adhere to the proper ESD handling, storage, packaging and transportation techniques throughout all facets of our business.

Intent

ESD is known to affect electronic components and systems in a variety of ways and is heavily influenced by technology, design and handling techniques. Therefore, we will strive for continual improvement in prevention techniques, employee awareness, and designed-in-protection

285

286 Appendix 1

at all levels of our company. It is our intention to maintain AT&T as a "World Class" leader in ESD control and design.

This will require the adherence to appropriate design standards as well as controlling the environment around which electronic products are designed, manufactured, transported and used. In order to satisfy this intent we will need to comply with documents such as the AT&T ESD Control Handbook and all appropriate AT&T Product Information Practices. We will strive to provide products that are sufficiently ESD robust in design and free of any latent ESD handling defects to give our customers significant economic advantages in their market.

Responsibilities

Each business group president, entity head, and senior staff officer is responsible for:

• Communicating the policy and seeing that it is carried out effectively.

• Providing adequate support and resources.

Each member of management is responsible for:

• Ensuring adequate design qualification of our product offerings.

• Setting the example by complying with the handling procedures in the "AT&T ESD Control Handbook" at all times.

• Communicating our ESD policy to each employee, visitor and supplier.

• Clarifying specific responsibilities for ESD prevention, awareness and design.

• Establishing effective ESD process controls.

• Ensuring consistent compliance with the AT&T ESD policy and initiating corrective action if needed.

Appendix 1 287

• Implementing and reviewing specific ESD improvement programs.

• Providing education and training in ESD awareness and prevention for all employees.

Appendix 2

Industry, Military, and AT&T Standards Used to Evaluate ESD Control Materials, Equipment, and Devices

Following is a list of the most common standards used to test and evaluate materials, equipment, and devices used in the electronics industry for Electrostatic Oischarge testing and control.

AMERICAN ASSOCIATION OF TEXTILE CHEMISTS AND COLORISTS (AATCC)

AA TCC-134 - Electrostatic Propensity of Carpets

AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)

ASTM 0257-78 - OC Resistance or Conductivity of Insulating Materials

ASTM 0790-86 - Flexural Properties of Unreinforced and Reinforced Plastics and Electrical Materials

ASTM 0882-82 - Tensile Properties of Thin Plastic Materials

ASTM 02863/88-029 - Measuring the Minimum Oxygen Concentration to Support Candle-Like Combustion of Plastics

289

290 Appendix 2

ASTM E595-84 - Total Mass Loss and Collected Volatile Condensible Materials from Outgassing in a Vacuum Environment

AMERICAN TELEPHONE AND TELEGRAPH (AT&T AND AT&T BELL LABS)

AT&T Electrostatic Discharge Control Handbook - Issue 2, 1988

PUBS 5100 - Network Equipment Building System (NEBS) Generic Equipment Requirements

T1 Y1 /88-029 - American National Standard Central Office Equipment-Electrostatic Discharge Requirements

BELL COMMUNICATIONS RESEARCH (BELLCORE)

TA TSY 000870 - Electrostatic Discharge Control in the Manufacturer of Telecommunications Equipment

TR TSY 00078 - Generic Physical Design Requirements for Telecommunications Products and Equipment

TR TSY 000357 Component Reliability Assurance Requirements for Telecommunications Equipment

ELECTRONICS INDUSTRIES ASSOCIATION (EIA)

EIA-541 - Packaging Material Standards for ESD Sensitive Materials

JEDEC 108 - Distributor Requirements for Handling Electrostatic Discharge Sensitive (ESDS) Devices

ELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE ASSOCIATION (EOS/ESD ASSN.)

EOS/ESD Glossary of Terms

EOS/ESD Draft Standard #1.0 - Personnel Grounding Wrist Straps

Appendix 2 291

EOS/ESD Draft Standard #2.0 - Personnel Garments (Preliminary)

EOS/ESD Draft Standard #3.0 - Ionization (Preliminary)

EOS/ESD Standard #4.0 - Worksurfaces

EOS/ESD Draft Standard #5.0 - Human Body Model (HBM) Test Method (Preliminary)

EOS/ESD Draft Standard #6.0 - Grounding (Preliminary)

INTERNATIONAL ELECTROTECHNICAL COMMISSION (IEC) (EUROPEAN)

IEC 801-2 - Electromagnetic Compatibility for Industrial Process Measurement and Control Equipment, Part 2: Electrostatic Discharge (ESD) Requirements

NATIONAL ELECTRICAL MANUFACTURERS ASSOCIATION (NEMA)

NEMA #LD-3--85-3.01 - High Pressure Decorative Laminates

NEMA #LD-3.1-85 - Performance, Application, Fabrication, and Installation of High Pressure Decorative Laminates

NATIONAL FIRE PROTECTION ASSOCIATION (NFPA)

NFPA 5-8 - Static Electricity

NFPA 56A - Superceded by NFPA-99

NFPA 77 - Static Electricity

NFPA 99 - Chapters 6 and 7-Standards for Health Care Facilities

UNITED STATES GOVERNMENT (000 - FED - MIL)

DOD HDBK 263 - Electrostatic Discharge Control Handbook for Protection of Electrical and Electronic Parts, Assemblies and Equipment

292 Appendix 2

000-STO-1686 - Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment

000-STO-2000-1 B Quality/High Reliability

Soldering and Technology, High

000-STO-2000-2A - Part and Component Mounting for High Quality/High Reliability Soldered Electrical and Electronic Assemblies

000-STO-2000-3A - Criteria for High Quality/High Reliability Soldering Technology

000-STO-2000-4A - General Purpose Soldering Requirements for Electrical and Electronic Equipment

FED TEST METHOD STO 101 - Method 4046 - Electrostatic Properties of Materials

MIL-STO-129 - Marking for Shipment and Storage ESO Standard List

MIL-STO-454 - Standard General Requirements for Electronic Equipment (Requirement 5 replaced by 000-STO-2000)

MIL-STO-701 - List of Standard Semiconductor Devices

MIL-STO-785 - Reliability Program for Systems and Equipment Development and Production

MIL-STO-883 - Method 3015-4 - Electrostatic Discharge Sensitivity Classification

MIL-STO-1285 - Marking of Electrical and Electronic Parts

MIL-STO-1686A - Electrostatic Discharge Control Program for Protection of Electrical and Electronics Parts, Assemblies and Equipment

MIL-E-17555 - Electronic and Electrical Equipment, Accessories, and Provisioned Items (Repair Parts: Packaging of)

Appendix 2 293

MIL-M-38510 - Microcircuits, General Specification for

MIL-STD-45743 E (replaced by DOD-STD-2000)

MIL-D-81705 - Barrier Materials, Flexible, Electrostatic Free, Heat Sealable

MIL-P-81997 - Pouches, Cushioned, Flexible, Electrostatic Free, Reciosable, Transparent

MIL-P-82646 - Plastic Film, Conductive, Heat Sealable, Flexible

MIL-P-82647 - Bags, Conductive Plastic, Heat Sealable, Flexible

PPP-C-1842 - Cushioning Materials, Plastic, Open Cell (for packaging applications)

WS 6536 - (replaced by DOD-STD-2000)

Appendix 3

How to Test the Integrity of the Ground Connection on a Work Surface

Once you have qualified your work surface materials according to industry standards, follow the suggestions below to simplify testing techniques for accepting and installing the material and its ongoing use.

To simplify testing the integrity of the connection between the ground and the inner conductive layer of multilayer work surfaces, we install a second ground bolt (Figure 1). The test is now easy to do with simple equipment. Almost any employee in the manufacturing operation should be capable of using and reading an inexpensive tester such as a wrist strap checker, a continuity checker, or a hand-held, battery-powered multi meter. However, without the second bolt, a more precise and expensive meter is needed to measure the flow of current through the high resistance (108 to 1010 ohms) dissipative work surface.

The second bolt (test bolt) is installed at a standardized distance (which can be anywhere between two inches and eight inches) from the ground bolt, and then a resistance measurement is made between the bolts with a hand-held multimeter. With the distance fixed, we can predict the reading along with a given tolerance, between the two bolts and through the conductive buried layer (103 to 105 Q /0). Typically, the resistance between bolts eight inches apart will measure less than 500 kohms.

295

296 Appendix 3

TEST BOLT (NO WIRE CONNECTION)

DISSIPATIVE ( ~_...ojl LAMINATE

CONTACT POINT BETWEEN CONDUCTIVE LAYER AND BOLTS

i+---{ n )---~

:S 500 Kn

• ..,..,~r-r""';-,.n

r- 2" TO 8" ----1

DISSIPATIVE WORK SURFACE 10 8 -10 10 AID

CONDUCTIVE BURRIED LAYER 10 3 -10 5 AID

BENCH SUBSTRATE (WOOD)

EQUIPMENT ':' GROUND

Figure 1. Laminated bench top grounding configuration

Once the work surface has been qualified, we can trust the results of this pass-fail test to check on an on-going basis for a gross failure with the integrity of the connection between the conductive layer and the ground bolt. A wrist strap checker will detect if the resistance is below approximately 750 kohms. Since the conductive layer should be less than 500 kohms, a red light signals an acceptable ground connection between the ground bolt and the conductive buried layer. A continuity test from the ground bolt to equipment ground will, now, verify that the work surface is properly grounded ..

Glossary

The following terms are used in this book. *

Air Ionizers: A source of charged air molecules (ions). The positive ions are attracted to negatively charged bodies and the negative ions to positively charged bodies, resulting in charge neutralization. (See also Ionization.)

Ampere: The unit of electrical current.

Antistat, Antistatic Agent: A chemical compound that, when impregnated in or topically applied to a primary material or substrate, renders the primary material antistatic.

Antistatic: A property of materials that resist triboelectric charging and produce minimal static charge when separated from themselves or other materials. A material's antistatic property is not necessarily correlated with its resistivity.

Antistatic Plastic: Any specialized plastic that reduces triboelectric charging. Although some antistat agents, especially hygroscopic ones, might slightly increase the surface conductivity of the base plastic, the resultant conductivity is usually insufficient to provide Faraday Cage shielding. (See also Topical Antistats.)

Antistatic Property: The characteristic of an item that allows the item to effectively minimize the production of a static charge when materials are separated from another surface. This characteristic is not a dependent function of material resistivity or static decay performance.

• For a more complete definition of terms used in the industry, refer to the EOS/ESD Glossary of Terms.

297

298 Glossary

Astatic (European terminology): A distinction in resistivity level. In terms of increasing resistivity: antistatic, astatic, static. These terms have been used over the years in European literature.

Avalanche Breakdown: A breakdown caused by the cumulative multiplication of charge carriers through field-induced impact ionization.

Bare PWB: A printed wiring board that has not been populated with components.

Bipolar Transistor: A device containing junction semiconductors that uses both positive (p-type) and negative (n-type) charge carriers.

Catastrophic Failure: A failure that is both sudden and complete and that involves complete loss of the required function. Catastrophic ESD failures are the result of electrical overstress (EOS) caused by an electrostatic discharge.

COM: Charged-device model.

Charge: An excess or deficiency of electrons on the surface of material, measured in units of coulombs.

Charged-Device Model: A model characterizing an ESD in which a device isolated from ground is charged and then suddenly discharged.

CMOS: An integrated circuit that uses complementary n-channel and p­channel metal oxide semiconductor transistors.

Component: A semiconductor device.

Conductive: A property of materials which are either metal or impregnated with metal, carbon particles or other conductive materials, or whose surface has been treated with such materials through a process of lacquering, plating, metalizing, or printing. A conductive material for static control purposes shall have a surface resistivity less than 1 x1 05 ohms/square or 1 x1 03 ohm-cm if volume conductive. A conductive material is not necessarily antistatic.

Conductor: A material that allows a current of electrons to continuously pass along it or through it when a voltage is applied. These materials exhibit low resistance.

Glossary 299

Coulomb: The unit or quantity of electricity or charge. One coulomb is the quantity of charge transferred by a current of 1 ampere in 1 second.

CPM: Charge plate monitor.

Cumulative Failure: A device failure resulting from multiple exposures to ESD.

DC: Direct current.

Decay Time: The time between two specified values of a variable that decreases with time.

Device: A package of electronic circuitry. This term is often interchangeably used with "semiconductor" or "component" when describing units sensitive to ESD damage.

Dielectric Breakdown: A threshold effect in a dielectric medium where at some electric field strength across the medium, bound electrons become unbounded and travel through the medium as a current. In solid media, the region of the current path can be permanently damaged. The units of measurement are usually volts per unit of thickness.

DIP (Dual In-line Package): A type of housing for integrated circuits consisting of a molded plastic or ceramic container with two rows of pins.

Dissipative: Material exhibiting a surface resistance of 105 through 1012

ohms per square. Dissipative materials bleed off charges at an optimal rate, neither too fast nor too slow.

DOA (Dead-On-Arrival): A failure of a device that occurs in the device's initial usage.

OUT: Device under test.

ECL: Emitter-coupled-Iogic microcircuit.

Electrical Overstress (EOS): The electrical stressing of items beyond their specifications. May be due to ESD.

Electromagnetic Compatibility (EMC): The capability of electronic equipment or systems to function in the intended operational electromagnetic environment.

300 Glossary

Electromagnetic Interference (EMI): Impairment of a desired electromagnetic signal by an electromagnetic disturbance.

Electromagnetic Pulse (EMP): A pulse generated by transient electromagnetic fields.

Electromagnetic Shield: A screen or other housing placed around devices or circuits to reduce the effects of external electric and magnetic fields.

Electron: A negatively charged particle with an electrical charge equal to approximately 1.6x1 019 coulomb.

Electrostatic Charge: See Static Electricity.

Electrostatic Damage: Damage to a device from static electricity by either (1) discharge from a charged conductor, (2) electric field induction, or (3) self discharge.

Electrostatic Discharge (ESD): The transfer of electrostatic charge between bodies at different electrostatic potentials.

Electrostatic Field: The region surrounding an electrically charged object in which another electrical charge will experience a force. Quantitatively, it is the voltage gradient between two points at different potentials.

Electrostatic Potential: The potential difference between a pOint and an agreed-upon reference.

Electrostatic Shield: A barrier or enclosure that prevents the penetration of an electrostatic field. An electrostatic shield may not offer much protection against the effects of electromagnetic fields.

Electrostatic: The study of properties and behavior of electrical charge at rest.

EIA: Electronic Industries Association.

EMI: Electromagnetic interference.

EOS: Electrical overstress.

Glossary 301

EPROM: Erasable programmable read-only memory.

EPS: Expanded polystyrene.

ESD (Electrostatic Discharge): A sudden transfer of charge between two objects.

ESD Susceptibility: A measure of the susceptibility of an item to ESD damage. (See also ESDS Device Classification.)

ESDS (Electrostatic Discharge-Sensitive): Describes devices that are vulnerable to damage from electrostatic discharge.

ESDS Device Classification: ESDS items are divided into classes based on their specific test failure voltages.

ESDS Item: Electrical and electronic parts, assemblies, and equipment that are sensitive to ESD voltage.

EUT: Equipment under test.

Failure Mechanism: The process by which a device is caused to fail.

Failure Mode: The effect by which a failure is observed; for example, an open circuit.

Faraday Cage: An electrically continuous conductive enclosure that provides electrostatic shielding.

FCDM: Field-induced, charged-device model.

Field-Induced Model: A model used to test for ESDS that simulates a situation where an electrically floating device is subjected to an electrostatic field and then contacted to a conductive object.

Film Resistor: A resistor made by deposition of a resistive metal or compound onto a substrate.

Floating Conductor: A conductor that is isolated from the grounding system within a static controlled environment.

FMA: Failure mode analysis.

302 Glossary

GaAsFET: Gallium-arsenide field effect transistor.

Ground: A metallic connection with the earth to establish zero potential or voltage with respect to ground or earth. It is the voltage reference point in a circuit. There mayor may not be an actual connection to earth, but it is understood that a point in the circuit said to be a ground potential could be connected to earth without disturbing the operation of the circuit.

Grounding: Connecting to a ground or to a conductor that is grounded.

Ground Straps: A wrist, leg, or ankle strap that discharges static charges on the human body safely to ground and equalizes personnel static levels with that of the work surface. Straps should be current­limited for safety.

HBM: Human body model.

HIC: Hybrid integrated circuit.

Human Body Model: A circuit that simulates the ESD from a person for testing purposes.

IEC: International Electrotechnical Commission.

Inductive Charging: See Field-Induced Model.

Input Protection: A protective network at the input pins of an item that attempts to prevent damage from ESD.

Insulator: A material that does not conduct electricity. Also known as "dielectric" material.

Insulation Resistance (Ri): The ratio of the direct voltage applied to two electrodes that are in contact with or embedded in a specimen to the total current between them. It is dependent on both the volume and surface resistivity of the specimen.

Insulative Material: A material having a surface resistivity of at least 1x1012 ohms/square, or 1x1010 ohm-cm volume resistivity.

Integrated Circuit (IC): A monolithic electron device containing transistors, resistors, capacitors, etc., in a Single package.

Glossary 303

Ionization: The process by which a neutral atom or molecule. such as air, acquires a positive or negative charge.

JFET: Junction field effect transistor.

Latent Failure: A hidden failure that did not result in an immediately detectable defect condition.

LOO: Lightly doped drain.

Lid: Metal or ceramic ends or covers for integrated circuit packages.

MOSFET: Metal-oxide-semiconductor field effect transistor.

NEMA: National Electrical Manufacturers Association.

NFPA: National Fire Protection Association.

NMOS: N-type metal oxide semiconductor.

Nonconductor: Usually, a dielectric or insulating material that breaks down and begins to conduct current when a high enough voltage is applied.

Ohm: The unit of electrical resistance. It is the resistance through which a current of 1 ampere flows when a voltage of 1 volt is applied.

Ohms per Square: A unit of surface resistance. The surface resistance of a material is numerically equal to the resistance between two electrodes forming opposite sides of a square. The size of the square is immaterial.

Op Amp: Operational amplifier.

Potential: Stored energy that is able to do work and is measured in millivolts, volts, or kilovolts (kV).

PVT: Personnel voltage tester.

PWB: Printed wiring board.

PWB assembly: A printed wiring board that has been populated with components.

304 Glossary

Radio Frequency Interference (RFI): A form of electromagnetic interference (EMI). Any electrical signal capable of being propagated and interfering with the proper operation of electrical or electronic equipment. The spark from a static discharge is a source of RFI.

Resistance: The degree of "difficulty" that an electrical current encounters in passing through a circuit or conductor. Resistance is measured in ohms and is a property of conductors that is determined by conductor dimensions, materials, and temperature. The resistance of a material determines the current produced by a given voltage.

RTG: Resistance to ground.

RVM: Residual voltmeter.

Schottky Diode: A metal-semiconductor rectifying contact. It is often used in transistor-transistor-Iogic (TTL) integrated circuits to shunt the base collector junction of transistors. It forms a clamped composite transistor with a very short saturation time constant.

SCR: Silicon-controlled rectifier.

Semiconductor: Any class of solid (such as germanium or silicon) whose electrical conductivity is similar to that of metals at high temperatures and virtually absent at low temperatures.

SEM: Scanning electrical microscope.

Shop: A manufacturing department or designated work area assigned to one functional manager.

SRM: Surface resistivity meter.

Static Charge: See Charge.

Static Electricity: Electrical charge at rest.

Static Eliminator - Induction: Induction static eliminators generally consist of a series of conductive grounded points or brushes. When a single sharp grounded-needle is brought into the proximity of any high­charged surface, it has induced in it a charge opposite to that of the surface. When a high enough charge concentration has been

Glossary 305

developed, the surrounding air will break down. A vast number of charge balancing ions are formed. The simple "tinsel string" static eliminator is an example of an induction static eliminator.

Static Eliminator - Nuclear: Nuclear static eliminators create ions by the irradiation of the air molecules. Some models use an alpha particle emitting isotope to create sufficient ion pairs to neutralize a charged molecule. The high speed particle interacts with the air molecules with sufficient energy to actually strip off one of its outer electrons. (See also Ionization and Air Ionizers.)

Static-Safe: Conditions or materials that provide adequate protection for the product sensitivity involved. The material test specifications are defined in EIA-541, Packing Material Standards for Protection of Electrostatic Discharge Sensitive Devices, from the Electronic Industries Association.

Surface Resistivity (p,): The ratio of a DC voltage to the current that passes across the surface of the system. In this case, the surface consists of a square unit of area. In effect, the surface resistivity is the resistance between two opposite sides of a square and is independent of the size of the square or its dimensional units. Surface resistivity is expressed in ohms/square. When using a concentric ring fixture, resistivity is calculated by using the following expression:

Surface Resistivity (Ps) = [~~22:gN ]XR

Where D2 = Inside diameter of outer electrode D1 = Outside diameter of inner electrode R = Measured resistance

Surfactant: See Antistatic Agent and Topical Antistats.

Topical Antistats: Chemical agents that when applied to surfaces of insulative materials reduces their ability to generate static.

Triboelectric: A term referring to a static charge generated by friction or the separation of materials.

306 Glossary

Triboelectric Charging: The generation of electrostatic charges when two pieces of material in intimate contact are separated (where one or both is an insulator). Substantial generation of static electricity can be caused by contact and separation of two materials or by rubbing two substances together. (See also Triboelectric Series.)

Triboelectric Series: A list of substances arranged so that one can become positively charged when separated from one farther down the list, or negatively charged when separated from one farther up the list. The series is used primarily to indicate likely resultant charge polarities after triboelectric generation. However, this series is derived from specially prepared and cleaned materials tested in very controlled conditions. In everyday circumstances, materials reasonably close to one another in the series can produce charge polarities opposite to that expected. This series is only a guide.

VCP: Vertical conducting plane.

Volt: The unit of electromotive force or potential. One volt sends a current of 1 ampere through a resistance of 1 ohm.

Voltage Suppression: A phenomenon where the voltage from a charged object is reduced by increasing the capacitance of the object rather than decreasing the charge on the object. The relation Q=CV describes the phenomenon.

Volume Resistivity (pj: The ratio of the DC voltage per unit thickness applied across two electrodes in contact with a specimen to the amount of current per unit area passing through the system. Volume resistivity is generally given in ohm-centimeters. When using a concentric ring fixture, resistivity is calculated by using the following expression:

Volume Resis#vity (p,) = [.~~2lXR Where D1 = Diameter of inner electrode or disc

R = Measured resistance in ohms T = Thickness of specimen.

VMOS: Vertical metal-oxide semiconductor.

VSLI: Very large scale integration.

References

1. Gagne, Robert, Essentials of Learning for Instruction, Prentice Hall,1988.

2. McAteer, O. J., "ESD - A Decade of Progress," EOSIESD Symposium Proceedings, EOS-10 (1988).

3. McFarland, W. Y., "The Economic Benefits of an Effective ESD Awareness and Control Program - An Empirical Analysis", EOSIESD Symposium Proceedings, EOS-3 (1981).

4. Euker, R., "ESD in I. C. Assembly (A Baseline Solution)", EOSIESD Symposium Proceedings, EOS-4 (1982), p. 142.

5. Dangelmayer, G. T., "ESD - How Often Does It Happen?", EOSIESD Symposium Proceedings, EOS-5 (1983), p. 1.

6. Downing, M. H., "Control Implementation and Cost Avoidance Analysis", EOSIESD Symposium Proceedings, EOS-5 (1983), p. 6.

7. Lindholm, A., "A Case History of an ESD Problem", EOSIESD Symposium Proceedings, EOS-7 (1985), p. 10.

8. Halperin, S. A., "Estimating ESD Losses in the Complex Organization", EOSIESD Symposium Proceedings, EOS-8 (1986), p. 1.

9. Frank, D. E., "The Perfect '10' - Can You Really Have One?", EOSIESD Symposium Proceedings, EOS-3 (1981), p. 21.

10. Strand, C. J., A. Tweet and M. E. Weight, "An Effective Electrostatic Discharge Protection Program", EOSIESD Symposium Proceedings, EOS-4 (1982), p. 145.

11. Kirk, W. J., "Uniform ESD Protection in a Large Multi-department Assembly Plant", EOSIESD Symposium Proceedings, EOS-4 (1982), p. 165.

307

308 References

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13. Lai, E. and J. Plaster, "ESD Control in the Automotive Electronics Industry - A Case Study", EOSIESD Symposium Proceedings, EOS-9 (1987), p. 1.

14. McAteer, O. J., "An Effective ESD Awareness Training Program", EOSIESD Symposium Proceedings, EOS-1 (1979), p.1.

15. Schnetker, T. R. "Human Factors in Electrostatic Discharge Protection", EOSIESD Symposium Proceedings, EOS-1 (1979), p.122.

16. Halperin, S. A., "Facility Evaluation: Isolating Environmental ESD Problems", EOSIESD Symposium Proceedings, EOS-2 (1980), p. 192.

17. McAteer, R. E., G. H. Lucas and A. McDonald, "A Pragmatic Approach to ESD Problem Solving in the Manufacturing Environment, A Case History", EOSIESD Symposium Proceedings, EOS-3 (1981), p. 34.

18. Hansel, G. E., "The Production Operator: Weak Link or Warrior in the ESD Battle?", EOSIESD Symposium Proceedings, EOS-5 (1983), p. 12.

19. Dangelmayer, G. T. and E. S. Jesby, "Employee Training for Successful ESD Control", EOSIESD Symposium Proceedings, EOS-7 (1985), p. 20.

20. R. J. Zezulka, "Tracking Results of an ESD Control Program Within a Telecommunications Service Company", EOSIESD Symposium Proceedings, EOS-11, 1989, p. 36.

21. Kirk, W. J. Jr., L. S. Carter and M. Waddell, "Eliminate Static Damage to Circuits", Electronic Design, March 29, 1976.

22. "An ESD Management Focus," EOSIESD Association, 1989.

23. Halliday, D., and R. Resnick, Fundamentals of Physics, Second Edition, Wiley, New York, 1981.

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References 309

25. Moore, A. D., Electrostatics, Doubleday, Garden City, NY, 1968.

26. Ku, C. C., and R. Liepins, Electrical Properties of Polymers, Hanser Publishers, Munich, 1987.

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28. Jon, M. C., D. Robinson-Hahn, and T. L. Welsher, "Tape and Reel Packaging-An ESD Concern," EOSIESD Symposium Proceedings, EOS-10, 1988, p. 15.

29. Bossard, R. P., R. G. Chemelli, and B. A. Unger, "ESD Damage from Triboelectrically Charged Pins," EOSIESD Symposium Proceedings, EOS-2, 1980, p. 17.

30. Avery, L. R., "Charged Device Model Testing: Trying to Duplicate Reality," EOSIESD Symposium Proceedings, EOS-9, 1987, p. 88.

31. Lafferty, D., "Secondary Discharge: A New Jeopardy and New Tool," EOSIESD Symposium Proceedings, EOS-6, 1984, p. 131.

32. Maloney, T. J., "Designing MOS Inputs and Outputs to Avoid Oxide Failure in the Charged-Device Model," EOSIESD Symposium Proceedings, EOS-10, 1988, p. 220.

33. Chemelli, R. G., B. A. Unger, and P. R. Bossard, "ESD by Static Induction," EOSIESD Symposium Proceedings, EOS-5, 1983, p. 29.

34. Speakman, T. S., "A Model for the Failure of Bipolar Silicon Integrated Circuits Subjected to Electrostatic Discharge," 12th Annual Proceedings Reliability Physics, April 1974, p. 60.

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37. Antinone, R. J., P. A. Young, D. D. Wilson, W. E. Echols, M. G. Rossi, W. J. Orvis, G. H. Khanaka and J. H. Lee, Electrical Overstress Protection for Electronic Devices, Noyes Publications, Park Ridge, New Jersey, 1986.

310 References

38. Pel ella, A. R., "Design of ESD Protection Networks for Integrated Circuits," Doctoral Dissertation, Clarkson University, Potsdam, NY, 1985.

39. Minear, R. L., and G. A. Dodson, "The Phantom Emitter-an ESD-Resistant Bipolar Transistor Design and its Applications to Linear Integrated Circuits," EOSIESD Symposium Proceedings, EOS-1, 1979, p. 188.

40. Lin, C. M., "A CMOS VLSI ESD Input Protection, DIFIDW," EOSIESD Symposium Proceedings, EOS-6, 1984, p. 202.

41. Duwury, C., R. N. Rountree, Y. Fong, and R. A. McPhee, "ESD Phenomena and Protection Issues in CMOS Output Buffers," 25th Annual Proceedings Reliability Physics, 1987, p. 174.

42. Polgreen, T., and A. Chatterjee, "Improving the ESD Failure Threshold of Silicided NMOS Output Transistors by Ensuring Uniform Current Flow," EOSIESD Symposium Proceedings, EOS-11, 1989, p. 167.

43. Rieck, G., and R. Manely, "Novel ESD Protection for Advanced CMOS Output Drivers," EOSIESD Symposium Proceedings, EOS-11, 1989, p. 182.

44. Ott, H. W., Noise Reduction Techniques in Electronic Systems, Second Edition, Wiley-Interscience, 1988.

45. Mardiguian, M., Electrostatic Discharge, Interference Control Technologies, Inc., Gainesville, VA, 1986.

46. Boxleitner, W., Electrostatic Discharge and Electronic Equipment, IEEE Press, New York, 1988.

47. "Electrostatic Discharge Sensitivity Testing," MIL-STD 883C, Method 3015.6, February 1989.

48. "Human Body Model (HBM) Electrostatic Discharge Sensitivity Testing," EOS/ESD-DS-5.0, Preliminary Draft Standard, EOS/ESD Association, Rome, NY, 1989.

49. Chemelli, R. G., and L. F. DeChiaro, "The Characterization and Control of Leading Edge Transients from Human Body Model ESD Simulators," EOSIESD Symposium Proceedings, EOS-7, 1985, p. 155.

References 311

50. Lin, D. L., M. S. Strauss, and T. L. Welsher, "On the Validity of ESD Threshold Data Obtained Using Commercial Human-Body Model Simulators," 25th Annual Proceedings Reliability Physics, 1987, p. 77.

51. Duvvury, C., R N. Rountree, and o. Adams, "Internal Chip ESD Phenomena Beyond the Protection Circuit," IEEE Trans. Electron, Dev. 35, 1988, p. 2133.

52. Renninger, R G., D. L. Lin, M. C. Jon, T. Diep, and T. L. Welsher, "A Field-Induced Charged-Device Model Simulator," EOSIESD Symposium Proceedings, EOS-11, 1989, p. 59.

53. Anderson, D. C., "Conductor Contact, a cause of ESD Damage," Appliance Engineering, Vol 7, p. 49 (1990)

54. Huntsman, J. R, "Triboelectric Charge: Its ESD Ability and a Measurement Method for its Propensity on Packaging Materials", EOSIESD Symposium Proceedings, EOS-6, 1984, p. 64.

55. Unger, B. A., R G. Chemelli, P. R Bossard, and M. R Hudock, "Evaluation of Integrated Circuit Shipping Tubes", EOSIESD Symposium Proceedings, EOS-3, 1981, p. 57.

56. Unger, B. A., and D. L. Hart, "Triboelectric Characterization of Packaging Materials", EOSIESD Symposium Proceedings, EOS-7, 1985, p. 107.

57. Jon, M. C., D. Robinson-Hahn, and T. L. Welsher, "Tape and Reel Packaging - An ESD Concern", EOSIESD Symposium Proceedings, EOS-10, 1988, p. 15.

58. Yenni, D. M., and J. R. Huntsman, "The Deficiences in Military Specification MIL-B-81705: Considerations and a Simple Model for Static Protection", EOSIESD Symposium Proceedings, EOS-1, 1979, p. 45.

59. Huntsman, J. R, and D. M. Yenni, "Test Methods for Static Control Products", EOSIESD Symposium Proceedings, EOS-4, 1982, p. 94.

60. Kolyer, J. M., and W. E. Anderson, "Selection of Packaging Materials for Electrostatic Discharge-Sensitive (ESDS) Items", EOSIESD Symposium Proceedings, EOS-3, 1981, p. 75.

312 References

61. Holmes, G. C., P. J. Huff, and R. L. Johnson, "An Experimental Study of the ESD Screening Effectiveness of Anti-static Bags", EOSIESD Symposium Proceedings, EOS-6, 1984, p. 78.

62. Chemelli, R. G., B. A. Unger, and P. R. Bossard, "ESD by Static Induction", EOSIESD Symposium Proceedings, EOS-5, 1983, p. 29.

Index

A

Acceptance criteria 128, 261

Action corrective 29, 142, 145,

153,164,165,171-174 177,178,237 '

plan 3, 14, 26, 71 self-initiated 165

Added cost 180 Air

discharge 89, 265 gaps 249,253,254 257

258 " ionization 48, 49, 51 138

241,254,256 " ionizers 98 114

Aluminum ' anodized 264

Amides of lauric acid 244 Amines 244 Ammonium compounds 244 Analysis 30

economic 20,22 e~gineering 164, 177, 178 failure mode 10, 11 Pareto 10,162 166 168

213 '" regular 25 scientific 74 trend 158 168

Analytic laboratory 98 Anodized aluminum 264 Antistatic 39, 242

equipment 261 Antistats 244

topical 244

Area sensitivity classification 118

Assemblies PVVB 28,43,54,56,58-62,65--73,75,77,8182 89, 112, 113, 119 124 12'5 128,132,133,137,226- ' 228,248,260,263 264 271, 273, 281 282' ,

Assignments 141: 142 147 150,154,159 "

special 170 training 214

Attraction force of 34

Audit cycle 162 Auditing 2,28,29,31,54, 126,

127,141,142,144 147 149 157, 159,. 165, 174: 177: 279'

checklists 208 cycle 149, 151 data 177, 280 inspector 141, 159, 165,

170,174,185,209 period 207 process 165 programs 1 , 6, 9, 10 13

15,29,158,163 164 1'77 216 '"

reports 142,147, 149, 159, 161,177,178,181,207, 212,213,215,240

results 176, 177, 215, 279 techniques 117 127 176

Auditor 10 " checklists 240

Automation 3,259-261 264 271,276 "

313

314 Index

Automation (Continued) caused ESO damage 259-261, 267, 277

Average cost 280 yield improvement 74

Award zero deviation 174

Awareness techniques 238 training 26, 126, 238

B

Basic statistical technique 162 Bench ionizers 104 Benefits

economic 19, 20, 63, 73, 74,237

financial 4 intangible 23, 282

Binding force 9, 142 Bipolar devices 58 Bolt

ground 169, 171 Boots

conductive 131 Box

tote 37 Breakdown

dielectric 78, 242, 249, 256 Bulletins

ESO 165 Buyer beware 184

Capability testing 10

c

Capacitance 37,43,51,78,87, 91,101,229,233,248,249,252

human body 37 parasitic 256

Capacitive coupling 257 probe test 249

Capacitor 37, 38, 47, 48, 81, 84,89,112,115,232

Carbon particles 248 Carts 132,141,159

grounded 98 COM

field-induced 87 Certification

employee 234 process checker 235 training 127

Chamber humidity 98, 112

Charge 33, 34, 36-39, 43, 48, 49,51,56,86,96,98,101--104, 109, 112, 114, 120, 122, 123, 133--138, 186, 197--199, 204,209,220,221,223--226, 228,229,233,234,242--244, 247--249,252,254,256,258, 260,262,263,266,268,273, 274

dissipation 49, 124, 233 dissipative 124 flow 243 generation 38, 39, 49, 123,

222,247 like 33 negative 38 opposite 33 plate monitor 97 positive 38 preventing separation 274 residual 47 separation 47,70,226,229,

275 static 39 suppression 116 transfer 34, 134, 244, 268 triboelectric 123 unit 36

Charged plate monitor 218 Charged-device model

(COM) 43, 51, 55, 84, 92, 123, 134,136,228,242,257,258, 260

Charger personnel 218

Charging

Charging (Continued) contact 39 corona 39 induction 48, 102 ion beam 39 photoelectric 39 spray 39

Charts 39,145,164,221,222, 234, 236

control 145 Pareto 158, 162-164, 169,

171-174,177,178 second-level Pareto 166,

169, 173 summary 236 trend 10,158,162-165,

172,174,177,178,212 yield 210

Checkers process 185 wrist strap 95, 186, 199,

206,210 Checklists 10

auditing 208 auditor's 240

Circuits integrated 47,58,67,98,

274 Classification

area sensitivity 118 Cleaning

solution 58 station 57

Commitments management 2 questionnaire 177

Committees 7, 20, 28, 86, 176 active 1,2 corporate 7 ESD 1, 3, 6, 15, 20, 21, 30,

118, 125, 139 ESD control 26

Communications 1, 7, 11, 17, 22,26,27,29,119,147,152, 153, 157, 159, 163, 164, 178, 187

programs 15 Compatibility test 206 Component damage to a test

set 271

Index 315

Compounds quaternary ammonium 244

Conductors 51, 122 Constant

dielectric 37 Contact

charging 39 discharge 89 mechanics 39 resistance 199

Control chart 145 experiments 53 facilities 31 quality 6, 145 statistical quality 6 techniques 54, 119, 126,

138,139,280,282 Conveyors 39, 43, 113, 138,

264, 268-271 ungrounded 267

Coordinator 1, 3, 6, 9-15, 18-20,23-26, 28, 93, 97, 136, 142, 144, 145, 147, 149, 150,153,158,161-165, 171-174,177,178,181,188, 199,238,239,259,261,266

ESD 2,4 full-time 1, 2, 4, 15

Corrective action 29, 142, 145, 153,164,165, 171-174, 177, 178,237

Costs 13, 19, 21, 30, 63, 70, 72, 75,82,91,92,118,123,130, 138, 179, 180, 185, 188, 190, 204,265,281,283

added 180 average 280 implementation 279, 280,

283 maintenance 10 nonconformance 64-66 real 180, 206 reduction 66, 90 requirements 199, 202

Coulomb 34, 36, 137 law 34

Coulombmeter 39 Coupling

316 Index

Coupling (Continued) capacitive 257

Criteria 72, 89, 128, 182, 202 acceptance 128, 261 qualification 261,266,277

Cumulative damage 225 Current

injection 89 Curve tracer 98 Customer satisfaction 23 Cycle

audit 162 auditing 149, 151

D

Damage automation-caused 259-

261,267,277 cumulative 225

Data 6, 10, 47, 60, 64, 66, 68, 77,84,88,104,126,135,141, 142,144,145,147-151,153, 154,157-159, 162, 164, 174, 177,179,185,236,237,257, 258

auditing 177, 280 experimental 53,54,59,63,

65, 73, 74 field failure 81 gathering 147 manufacturing 53, 54, 59, 60,62,63,73,74

scientific 147 Decay

mode 102 times 102

Defect rate 65 Demonstrations 217 Design 1, 4, 12, 17, 24, 30, 48, 60,67,72-75,77,82,84,87, 91,92,125,128,130,132,135, 137,171,183,187,213,258, 261,265,269,274,276,277, 280,283

ESD 81,91 requirements 282 techniques 77,82,84,92

Deviations facility related 168 from-prescribed-

procedure 147 process 168 zero 11, 144 zero award 174

Devices 2, 4, 10, 14, 23, 24, 27, 30,37,43,47--49,51,54,55, 57,62,69--73,75,77,78,81, 82,84,86--88,90,92-94,98, 112, 114, 115, 118, 119, 125, 130,133-138,181,190,204, 207,209,210,212,214,217, 218,223,225,228,234,237, 241-243,248,249,256-261, 263,268,272,276,277,281

bipolar 58 energy-sensitive 247 microelectronic 47,241 semiconductor 38 sensitivity 21, 47 testing 84 ultrasensitive 69,71,72,

75, 118, 119, 134, 137, 140, 190,198,204,215,258, 284

Dielectric 232 breakdown 78,242,249,

256 constant 37

Discharge 43, 49, 56, 78, 82, 86,87,89,114--116,123,132, 197,222-225,228,229,242, 254,256,258,260,262,263, 265,270,272,273

air 89,265 contact 89 personnel 256

Dissipation charge 49, 124, 233

Dissipative floor mats 131 mats 127, 273 static 242

Distributors 3 Dollar savings 72 Double jeopardy 228 Duties

Duti~s (Continued) Inspector 151

E

Economic analysis 20,22 benefits 19,20,63,73,74,

237 gains 279, 283

Electr!c. field 36, 51, 103, 123 Electricity

static 34, 56 Electrodes 106 Electromagnetic

fields 82 interference technique 82 radiation 82

Electrostatic 33 field meter 103 locator 56, 218 220 226 potential 36 47 ' shielding 254 voltage 39, 249

EMI shields 243 Employee

acceptance 189 acceptance testing 180 certification 234 discomfort 273

Enforcement constructive 159

Engineering 4, 6, 13, 18, 20, 25, 29,33,118-120, 125, 126, 138--140,164,214,216 237 238,259,261,277 ' ,

analysis 164, 177, 178 human factors 1 2 8 ~olutions 21, 165, 213

Engineers 4 6 9 28 Environment ' 22, 26, 36, 39, 49, 53,77,92,117,119,120 138 256,257,282 "

static-safe 120 Equipment 4, 13, 21, 27, 28, 30, 43,72,77,84,89,92,9495 97,99,101, 104, 112, 114--' 116, 127--129, 138 142 150 151,153,158, 162, '164, '17~ 188,205,207,213,215,217,

Index 317

218,233,234,238 240 243 249,259--261,263--269 271 273 ' ,

Equipment (Continued) antistatic 261 automated 266 ESD control 10 24 144

179,205 ", problems 181 quali~ing 10 suppliers 182 test 11, 12,43, 87, 94, 95,

97.' 116, 141,159,180 261 testing 180 '

ESD auditing inspector 141 bulletin 11 165 by induction' 226 committee 3, 6, 15, 20 21

30,118, 125, 139 " control committee 26 control equipment 10 24

144,179,205 " control facilities 28 control requirements 7 117 control techniques 70 '117

219 ' , coordinator 2 4 design 81, 91' failure scenarios 254 guns 89 monitor 98 policy statement 22, 27 precautions 63 program management 17,

31 requirements 236 scenarios 48 simulators 97 solution 4, 13 testing 87

Evidence 58 60 73 74 168 207,260 ' , , , ,

circumstantial 63 65 economic 53 ' experimental 58, 67 management 4 manufacturing 60 63 67 scientific 19, 30' ,

318 Index

Experimental data 53, 54, 59, 63, 65, 73,

74 results 65 technique 54

Experimentally predicted 63 Experiments 19, 22, 34, 53, 54, 57--61,66,73,74,97,226, 280,282

control 53 Extraordinary handling

measures 137

F

Facilities 8, 26--28, 30, 53, 54, 73,94,95,97,98,113,114, 117,119,127--129,137,139, 261

control 31 deviations 168 ESD control 28 related deviations 168 test 2, 11, 15 testing 11 , 95

Factors twelve critical 20,26

Factory standards 139, 265 Failure

latent 67 mode analysis 11

False test indictment 269 Faraday 82,97,112,113,220, 244,263,268,273,275

Faulty grounds 268, 269 Field

attenuation tests 249 audit kits 95 auditor's kit 98 electric 36, 51, 103, 123 electromagnetic 82 failure data 81 induced CDM 87 meters 94, 103 performance 66

Final reports 157, 158, 163 tests 235

Financial benefits 4 Finishes

floor 202 Fixed goals 13, 14 Float mode 101 Floor

finishes 101, 202 mats 65,122,129--131,

139, 145, 148, 149, 153, 182,195,199,238

Footwear 130 conductive 27

Force binding 142 of attraction 34 of repulsion 34

Formal report 22

G

Gains 78 economic 279,283 tangible 284

Gaps air 249, 253, 254, 257, 258

Generation charge 222,247

Generators ionized air 138 Van de Graaff 218, 219,

234,240,267 Glycols 244 Goals 15

fixed 13, 14 interim 15 measurable 9,14,15,207,

209,212,220,239,240 primary 14, 15, 144 realistic 18 teaching 212 testing 11 ultimate 13

Ground bolt 169, 171 Grounding

personnel 27, 43, 129, 131, 212

techniques 122 Grounds

Grounds (Continued) faulty 268,269

Guidelines purchasing 24

Guides 145, 148, 154, 158, 159,169,208

inspector 141 reference 208

Guns ESD 89

H

Handbooks 4,8,10--12,15, 72, 117, 118, 126, 139, 154, 164,181,209,211,238

Heelstraps 12, 65, 122, 127, 182,191--193,213,234

Hidden problems 181 High contact resistance 188 Human

body 38 body capacitance 37 body model 43,51,84,92 factors engineering 1, 2, 8 nature 21

Humidity 39, 58, 109, 135, 138, 202,244,245,248

chamber 98, 112 relative 60

Impedance 43 Implementation

costs 279, 280, 283 plans 1--3, 14, 21 , 23 techniques 237

Improvements average yield 74 continual 1, 10, 13, 15, 142,

144, 161, 165, 171, 173, 177

continuous 1, 2, 6, 9, 13, 15,18,158,163,182

outgoing quality 73 yield 20,63

Inclined plane 244 Indictment

false test 269 Inductance

parasitic 87 Induction

Index 319

charging 48, 102 ESD by 226 static 43

Industrial standards 89

Injection current 89

Input protection 78

Inspector 95,141,144, 147--151,153,154,157--159,163, 166,193,219,266

auditing 141, 159, 165, 170, 174,185,209

duties 151 ESD auditing 141 guide 141 manual 126

Instructions manual 95 process checking 236

Instrumentation 98 Insulators 37--39, 43, 48, 49, 51,102,103,114,122,226, 228,241,243,274

Integrated circuits 37, 43, 47, 54,58,67,98,112,134,145, 245,248,274

Interim goal 15 Investments

return on 21 Ion

beam 39 current meter 98

Ionization 72, 97 air 48,49,51,138,241,

254, 256 Ionizers 204

air 98, 114 bench 104

320 Index

Job

Kits

J

qualifications 145

K

field audit 95 field auditor's 98

L

Laboratories analytic 98 test 25

Latent failure 67 Like charges 33 Locator 220,268

electrostatic 56, 218, 226

Maintenance costs 10

Management

M

commitment 1 , 23 ESD program 17,31 reports 22

Manu~s 4,8,10,11,154 Inspector 126 instruction 95 reference 211

Manufacturing 29 data 53, 54, 59, 60, 62, 63,

73, 74 process 60 results 65

Materials conductive 123, 242 packaging 123 protective 49 shielding 60, 242 static generating 125

Mats 110 conductive floor 131

Mats (Continued) dissipative 273 d issi pative floor 13 t floor 65,131,139,145,

148, 149, 153, 182, 195, 199,238

table 65, 129, 131 Measurement

techniques 39 Measures

extraordinary handling 137 Metallized 248 Meters

field 94, 103 ion current 96, 98 Megger 98, 105 noncontacting field 96 SRM/RTG 98 temperature/humidity 98

Models charged-device 43,51,55,

84,92, 123, 134, 136,228, 242,257,258,260

human body 43, 51, 84, 92 parallel plate capacitor 252

Modes decay 102

Monitors charge plate 97 charged plate 218 ESD 98

Motivation 210

N

Nonconductors 122

o Offset voltage 104, 204 Ohmmeter 98, 108, 110 Ohms per square 136 Opposite charges 33 Oscilloscope 98

p

Packaging materials 123 tape-and-reel 133, 245

Parasitics circuit 86 inductance 87

Pareto analysis 10, 162, 166, 168,

213 charts 158, 162-164, 169,

171-174,177,178 second-level chart 166,

169, 173 Particles

carbon 248 Partnership

vendor 182 Period

auditing 207 Personnel

charger 218 discharge 256 grounding 27, 43, 129, 131,

212 voltage tester 98, 114, 218,

220,221,234,240 Pilot studies 20 Plane

inclined 244 Planning

systemic 1 2, 12, 15 Plans

action 3, 14, 26, 71 implementation 1-3,14,

21,23 Plastics 97, 104, 122, 124, 125

essential 124 nonessential 124

Plugs wrist strap 188, 198 wrist strap banana 188

Points common ground 199

Policy ESD statement 22 statement of 30

Index 321

Positions work 64,131,132,168,273

Potential electrostatic 36, 47

Precautions ESD 63

Preliminary reports 153, 157, 158, 163

Pretest 235 Primary goal 14, 15, 144 Probes 107

test 249 Problems 18, 23, 30, 38, 55, 56, 69,71,72,74,82,86,93,118, 126,129,141,142,144,147, 149, 150, 158, 159, 161-163, 165,169,171,172,174,177, 178,181-183,186,188,204, 206,212,237-240,245,259, 261,264,266,267,269,274, 275,277,282

equipment 181 evidence of 67 hidden 181 safety 131, 139, 192 solving 165, 172 uncover training 212 yield 268

Procedures testing 18, 181 touch ground 27

Process auditing 165 checker certification 235 checkers 145, 153, 165,

185 checking 8 checking instruction 236 deviations 168 manufacturing 60

Programs auditing 1, 6, 9, 10, 13, 15,

29,158,163,164,177,216 communication 2, 11, 15 training 1 , 4, 9, 15, 18, 20,

25,28,126,145,164,181, 190,208,211,239

Protection designed-in 283

322 Index

Protection (Continued) input 78 techniques 254

PVT 114 PWB

assemblies 28, 43, 54, 56, 58--62,65--73,75,77,81, 82, 89, 112, 113, 119, 124, 125, 128, 132, 133, 137, 226--228,248,260,263, 264,271,273,281,282

assembly yields 70

Q

Qualifications criteria 261,266,277 job 145

Qualifying equipment 10 Quality

control 6,25, 145, 147, 184, 185,266

Fair 11, 208, 219, 220, 239, 240

outgoing 65 Quaternary ammonium

compounds 244 Questionnaires

commitment 177

R

Radiation electromagnetic 82

Rate of return 64 Realistic

goals 18 handling requirements 21,

30,54,118 requirements 1, 2, 15 solutions 279

Receptacles wrist strap 198

Recorders strip chart 94, 218, 229 temperature/humidity 98

Reduction

Reduction (Continued) cost 66,90

Reference guide 208 manuals 211

Reports 9--11,23,26,29,65, 69,71,134,137,141,142,150, 153, 157, 158, 169, 174, 177, 178,215

auditing 142,147,149,159, 161,177,178,181,207, 212,213,215,240

final 157, 158, 163 formal 22 management 22 preliminary 153,157,158,

163 published 9 staff summary 163 status 26 summary 141

Repulsion force of 34

Requirements 8, 10, 11, 18, 21--25, 27--29, 65, 72, 77, 84, 89,92--94,117--120,123--128, 133--135, 138, 139, 150, 237,239,254,274,282

cost 199, 202 design 282 ESD 236 ESD control 7, 117 realistic 1, 2, 15 realistic handling 21, 30, 54,

118 Residual

charge 47 voltage 186 voltmeter 98

Resistance 43, 49, 50, 56--58, 95--97,103,105,108--110, 130,131,135,166,183,188--190,192--194,196,199,243, 245, 247--249, 254

contact 199 high contact 188 point-to-point 49, 110 to ground 110

Resistivity

Resistivity (Continued) surface 49,107

Resources allocating 215

Results auditing 176,177,215,279 experimental 65 manufacturing 65

Ring perimeter guard 82

Ripple effect 12 Root cause 12 Rules 120

80-20 162, 178 three basic 120

s Safety problems 192 Sampling

statistical 149 Savings 20, 22, 26, 73, 193,

203,279--281,283 dollar 72

Scenarios ESD 48 ESD failure 254

Scientific analysis 74 data 147 evidence 19, 30 studies 147

Semiconductor 37, 47, 53, 69, 77, 78

devices 38 Sensitivity

device 47 Separation

charge 226, 229 preventing charge 274

Shielding 124 electrostatic 254 materials 60, 242

Shields EMI 243

Shipping tubes 43, 112, 129, 134,137,144,220,245,247, 249,268,272

Shoes conductive 131

Shunts 70, 72

Index 323

conductive plastic 137 Simulators 84, 94, 114, 115,

265, 272 automatic 115 commercial HBM ESD 115 ESD 97 FCDM 115 manual 115

Sixteen (16) basic steps 17 Software 148,157--159 Solutions 7, 11--15, 18,30,56, 69--72,74,92,113,117,122, 125,130,137,139,182,189, 214,267

cleaning 56 engineering 21 165, 213 ESD 4,13 realistic 279

Special assignment 170 SRM/RTG meter 98 Staff

summary reports 163 Standards 185

factory 139, 265 industrial 89

Statement ESD policy 27

Static awareness symbol 133 charge 39 decay time tester 98 dissipative 242 dissipative tote trays 63 electricity 34, 56 generating materials 125 induction 43 safe environment 120 voltmeter 98

Station cleaning 55, 57

Statistical quality control 6 sampling 149 sampling techniques 10,

279 techniques 162

324 Index

Straps wrist 11, 26-28, 48, 58-

60, 63--65, 70, 72, 95, 96, 101,102,114,122,127, 129,131,132,135,137, 139, 142, 144, 145, 147, 148, 153, 164--166, 168, 169,171, 180, 181,183, 186, 188-194, 196,204, 207,209,210,212,217, 219,221-223,225,226, 233,234,237,241,256, 261,265,273,274,282-284

Strip chart recorder 94, 218, 229

Studies pilot 20 scientific 147

Subcontractors 3, 24, 154, 174, 177

Summary charts 236 reports 141

Supervision 61, 149, 193 Supervisor 172, 173

training 236 Suppliers 3,24,82,154,174,

181,182,184,261,265,266, 268,269,276,283

equipment 182 Surface resistivity 49, 107 Surfactants 244 Symbol

static awareness 133 Systemic planning 1, 2, 12, 15

T

Table mats 65, 129, 131

Tabletops 110, 127 Tape-and-reel 43

packaging 133, 245 test 245

Techniques 6, 14,81,82,90, 119,127,137,138,149,182, 210,214,238,240

Techniques (Continued) auditing 117, 127, 176 awareness 238 basic statistical 162 control 54, 119, 126, 138,

139,280,282 cost-effective 14 design 77, 82, 84, 92 electromagnetic

interference 82 ESD control 70, 117, 219 experimental 54 grounding 122 handling 122 implementation 237 measurement 39 prevention 64 primary 13 protection 254 statistical 162 statistical sampling 10, 279 test 266 training 14, 27, 208

Temperature/humidity meter 98 recorder 98

Test capacitive probe 249 compatibility 206 equipment 11, 12, 43, 87,

94,95,97,116,141,159, 180,261

facilities 2, 11, 15 field attenuation 249 final 235 follow-up 235 lab 1 laboratory 25 shipping tubes 245 tape-and-reel 245 techniques 266 voltage 89 voltage monitoring 249 wrist strap 199

Testers buried layer 98 personnel voltage 98, 114,

218,220,221,234,240 static decay time 98

Testing 10, 37, 58, 60, 68, 69, 86,89,92,93,110,113,127--129,151,153,170,171,180, 185,186,188,197,199,203, 204,212,233,234,245,265, 266,268

capability 10 device 84 employee-acceptance 180 equipment 180 ESD 87 facilities 11, 95 goals 11 procedures 18, 181 trial 13, 192, 193

The basic steps 18 Three basic rules 120 Three Principles 208, 209, 215,

233,239 Threshold 55 Toestraps 127 Tools

training 10, 178 Topical antistat 244 Tote box 37 Training 2, 4, 6

assignment 214 awareness 26, 126, 238 certification 127 employee 65 engineer 237 on-going 25 on-the-job 150 problems 212 program 20,25,28 programs 1 , 4, 9, 15, 18,

126,145,164,181,190, 208,211,239

supervisor 236 techniques 14,27,208 tools 10, 178

Transfer charge 34, 134, 244, 268

Trays 26,60,61,65,68,120, 122, 129, 133--135, 153, 198, 199,202,269,273

static dissipative tote 63 Trend 23,65,69,73,75,89,

90,92,141,142,147,149,171, 176,236,260

Index 325

Trend (Continued) analysis 158, 168 charts 10,158, 162--165,

172,174,177,178,212 long-term 158

Tribocharging 39, 204 T riboelectric

charge 123 series 39

Triboelectricity 39 Tubes

shipping 43, 112, 129, 134, 137,144,220,245,247, 249,268,272

Twelve critical factors 1, 20, 26

u Ultimate goal 13 Ultrasensitive devices 69, 71, 72,75,118,119,134,137,140, 190,198,204,215,258,284

v Van de Graaff generator 218,

219,234,240,267 Variations

unnecessary 181 Videos 217, 219, 233--237, 239,240

Voltage 37, 39, 47, 48, 78, 86, 89,94,96,101--105,109,110, 112,114--116, 190, 198,220, 222--224,228,229,233,249, 253,257,268

electrostatic 39, 249 monitoring test 249 offset 104,204 residual 186 suppression 233 test 89 withstand 47,82

Voltmeters noncontacting 109 residual 98 static 98

326 Index

w Work positions 64, 131, 132,

168,273 Workbenches 139, 182, 188,

197--199,209,215,235,238, 247

Wrist straps 11, 26--28, 48, 5~0, 63--65, 70, 72,95,96, 101,102,114,122,127,129, 131,132,135,137,139,142, 144, 145, 147, 148, 153, 164--166,168,169, 171,180,181, 183, 186, 188--194, 196,204, 207,209,210,212,217,219, 221--223,225,226,233,234, 237,241,256,261,265,273, 274,282--284

checkers 95, 186, 199, 206, 210

Wrist straps (Continued) plug 188, 198 receptacles 198 test 199

y

Yield charts 210 improvements 20,63 problems 268 PWB assembly 70 PWB Assembly 70 reports 149, 159

z Zappers 84, 97