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©2017 by System Plus Consulting | Autoliv Night Vision System 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Autoliv Night Vision SystemSafety Application Automotive IR CameraReport by Farid HAMRANI & Sylvain HALLEREAUJune 2017


Table of Contents – Autoliv Night Vision System

Overview / Introduction 3

o Executive Summary

o Reverse Costing Methodology

Company Profile 6

o Autoliv

Physical Analysis 8

o Views and Dimensions of the System

o System Opening

o Electronic Board

Top Side – Global view

Top Side – High definition photo

Top Side – Main components markings

Top Side – Main components identification

Top Side – Other components markings

Top Side – Other components identification

Bottom Side – idem …

o Sealing Glue EDX Analysis

o Sensor Unit Module Disassembly

o NV3 Core Board

o NV3 Personality Image Sensor

o Microbolometer Board

o Optical Elements Cross-Section

Cost Analysis 63

o Accessing the BOM

o PCB Cost

o CIS Cost

o BOM Cost – Electronic Board

o BOM Cost – Camera Module

o Housing Parts – Estimation

o BOM Cost – Housing

o Material Cost Breakdown by Component Category

o Accessing the Added Value (AV) cost

o Electronic Board Manufacturing Flow

o Details of the Electronic Board AV Cost

o Details of the System Assembly AV Cost

o Details of the Housing AV Cost

o Manufacturing Cost Breakdown for 100k units

Estimated Price Analysis 87

o Estimation of the Manufacturing Price

Company services 89


Table of Contents – FLIR ISC0901BO Microbolometer Die

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o Flir

o microbolometer Characteristics

Physical Analysis 14

o Synthesis of the Physical Analysis

o Physical Analysis Methodology

o Package 19

Package Views & Dimensions

Package Opening & Wire Bonding Process

Package Cross-Section

o Window 23

View, Dimensions

Cross-Section

Au/Sn Eutectic bonding

o Microbolometer 31

View, Dimensions & Marking

Active Pixels

Compensation Pixels

Cross-Section

Process Characteristics

o ROIC 54

o Comparison 59

Manufacturing Process Flow 64

o Global Overview

o ROIC Front-End Process

o ROIC Wafer Fabrication Unit

o Microbolometer Process Flow

o Window Wafer Fabrication Unit

o Packaging Process Flow

Cost Analysis 77

o Synthesis of the cost analysis

o Yields Explanation & Hypotheses

o ROIC 82

ROIC Front-End Cost

o Microbolometer 96

MEMS Front-End Cost

MEMS Front-End Cost per process steps

o Window

o Component 88

Bonding Front-End Cost

IR Sensor Wafer & Die Cost

Back-End : Final Test Cost

microbolometer Component Cost

Estimated Price Analysis 96

Company services 100


O V E R V I E WMETHODOLOGY


Overview / Introductiono Executive Summaryo Reverse Costing

Methodology

Company Profile & Supply Chain

Physical Analysis

Cost Analysis

Manufacturing Process Flow

Selling Price Analysis

About System Plus

Executive Summary

Based on a high definition ISC0901 microbolometer from FLIR, the Autoliv night vision infrared camera targets the high-end automotive market using two FLIR cores. Based on the solid first design from 2009, the microbolometer offers better performance in definition and frame rate. The camera also embraces the quality approach with a complex optical system and powers its night vision using sophisticated numerical processing based on an Altera field-programmable gate array (FPGA) and custom algorithm.

The Autoliv night vision camera consists of two modules, the camera and a remote processing unit. The system is made very compact and easy to integrate for car makers.

The ISC0901 thermal camera uses FLIR’s 17µm pixel design, optimized for automotive applications. Based on vanadium oxide technology, the ISC0901 microbolometer features a 336x2256 resolution wafer level package, achieving an incredibly compact design.

The ISC0901 is the automotive version of a surveillance microbolometer. By using wafer level package technology to encapsulate the microbolometer FLIR offers the best price performance ratio.

This report is divided into two parts, one focused on the microbolometer and the second on the other systems. It is based on a complete teardown analysis of the night vision camera and the associated electronic control unit. Using this, it provides the bill-of-material (BOM) and manufacturing cost of the infrared camera. The report also offers a complete physical analysis and manufacturing cost estimate of the infrared module, including the lens module and the microbolometer itself.

The report’s final component is a comparison between the characteristics of the FLIR ISC0901, FLIR Lepton 3 and the PICO384P from ULIS. The comparison highlights differences in technical choices made by the companies.


Overview / Introduction


Physical Analysis o Views & Dimensionso System Openingo Electronic Boardo Camera Moduleo Image Sensor Boardo CMOS Image Sensor

Cost Analysis



About System Plus

Views and Dimensions

System’s Front and Right view.





Cost Analysis



About System Plus

Electronic Board – Top Side – Global View

Cross section of Electronic Board (XX layers)





Cost Analysis



About System Plus

Sealing Glue EDX Analysis





Cost Analysis



About System Plus

NV3 Personality Board – Top Side – Main Components Markings





Cost Analysis



About System Plus

NV3 Core Board – Top Side – Main Components Identification





Cost Analysis



About System Plus

Microbolometer Overview

ROIC

ROIC

Package Tilted Side View





Cost Analysis



About System Plus

Microbolometer Silicon Window Removed

Microbolometer with ROIC – Optical View

AuSn Sealing Frame XXXXXXXXXXXXXX

XXXXXXXX– Optical View

The window has been de-soldered of the ROIC.

Solder sealing ring





Cost Analysis



About System Plus

Microbolometer Contact

There is a recess in the passivation likely to disengage the tops of the tungsten plugs and thus increase the contact surface between the tungsten layer and TiNiCr.

Contact– Tilted SEM viewTungsten plug

Contact– Cross-Section SEM view

M5





Cost Analysis



About System Plus

Lens

XXXXXXX window

We found the same coating on the two sides of the two lens.




Physical Analysis

Manufacturing Process Flowo Global Overviewo ROIC Front-End Processo Microbolometer Processo Window Process

Cost Analysis


About System Plus

Microbolometer Process Flow 3/3

ROIC wafer

•Contact metal: aluminum deposition

•Pattern : Lithography 8

ROIC wafer

•Microbridge: 2nd absorbing layer deposition (SiN)

•Pattern & etch: Lithography 9

•Blind Pixel: reflector deposition


ROIC wafer

• Seal layer: gold deposition


•Release: sacrificial polyimide removal

drawing not to scale




Physical Analysis

Cost Analysis


Selling Price Analysiso Financial Ratioso Manufacturer Price

About System Plus

Microbolometer Estimated Manufacturer Price


C O S TANALYSIS




Physical Analysis

Cost Analysiso Accessing the BOMo PCB Costo CIS Costo BOM Cost – Electronicso BOM Cost – Camera

Moduleo Housing Parts Estimationo BOM Cost - Housingo Material Cost Breakdown



About System Plus

BOM Cost – ECU Electronic Board(1/2)




Physical Analysis

Cost Analysis

Manufacturing Process Flowo Added-Value Costo Manufacturing Cost


About System Plus

Details of ECU Board Added-Value (AV) Cost

Details of the Main Board assembly step costs.


SELLINGP R I C E




Physical Analysis

Cost Analysis


Selling Price Analysiso Financial Ratioso Manufacturer Price

About System Plus

Estimation of the Manufacturing Price




Physical Analysis

Cost Analysis



About System Pluso Company serviceso Feedbackso Contacto Legal

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

IMAGING• Imaging Technologies for Automotive 2016• Uncooled Infrared Imaging Technology and Market Trends 2016• Sensors and Data Management for Autonomous Vehicles report

2015• Camera Module Industry Report

Related Reports

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

IMAGING• Thermal Expert Infrared Camera for Smartphones• Opgal Therm-App Infrared Camera & Ulis IR Microbolometer• Seek Thermal Infrared Camera & Raytheon IR Microbolometer

PATENT ANALYSIS - KNOWMADE

• Honeywell Microbolometer Patent Portfolio Analysis

http://www.systemplus.fr/reverse-costing-reports/imaging-technologies-for-automotive-2016/

https://www.i-micronews.com/category-listing/product/uncooled-infrared-imaging-technology-and-market-trends-2016.html

https://www.i-micronews.com/category-listing/product/sensors-and-data-management-for-autonomous-vehicles-report-2015.html

http://www.systemplus.fr/reverse-costing-reports/camera-module-industry-report/

http://www.systemplus.fr/reverse-costing-reports/thermal-expert-infrared-camera-for-smartphones/

http://www.systemplus.fr/reverse-costing-reports/opgal-therm-app-infrared-camera-ulis-ir-microbolometer/

http://www.systemplus.fr/reverse-costing-reports/seek-thermal-infrared-camera-raytheon-ir-microbolometer-2/

https://www.i-micronews.com/category-listing/product/honeywell-microbolometer-patent-portfolio-analysis.html


COMPANYSERVICES




Physical Analysis

Cost Analysis




Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings




Physical Analysis

Cost Analysis




Contact

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