automatic, non-contact die monitoring system
DESCRIPTION
MICRON. MICRON. Automatic, Non-Contact Die Monitoring System. The Low Cost Solution For:. Misfeeds Slug detection Material Changes Stroke Deviation Mis-alignment between punch and die Broken punch or die assemblies. Micron base unit with 2 additional channels. - PowerPoint PPT PresentationTRANSCRIPT
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Helm Instrument Co., Inc
Automatic, Non-Contact Die Monitoring System
Micron base unit with 2 additional channels
MICRONMICRON
The Low Cost Solution For:
• Misfeeds• Slug detection• Material Changes• Stroke Deviation• Mis-alignment between punch and die• Broken punch or die assemblies
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Helm Instrument Co., Inc
Micron is the most advanced monitoring system available
to the stamping industry
With precise accuracy to .00004 inches (1/1000 mm)
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Helm Instrument Co., Inc
Micron Detects Separation Gap to Within .00004 Inches
L o w er D ie
A b n o rm alN o rm al
U p p er D ie
U p p er D ie S h o e
L o w er D ie S ho e
S en so rTarg et
S en so r S lu g
S trip p er
M ateria l
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Helm Instrument Co., Inc
Easy to use, limits are set automatically
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Helm Instrument Co., Inc
Each stack includes one channel of monitoring with high and low limits
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Helm Instrument Co., Inc
HMIC-R Sensor and target
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Helm Instrument Co., Inc
Power requirements:Power consumption:Output contacts:Response time:Operating speed:Repeatability:Operating temperature:Alarm adjustment:Sensor type:Maximum sensing distance:Enclosure size:
115VAC ±10%30 watts1 NO-NC, 250VAC 5A ratingLess than 10 MsecUp to 2500 SPMTo .00004 inches-10°C to 50°C± 99 MicronsProximity 500 KHZ.1 inch (2.5mm)Base 8.25”w x 9.50”d x 3.25”hStack 8.25”w x 9.50”d x 4.75”h
Specifications: