automotive semiconductory and market analysis
TRANSCRIPT
Automotive ICs/ElectronicsBuilding traction in a high-growth, global market
Key issues in the use of ICs/electronics in the automotive sector• What is the opportunity?
• Size and growth of automotive, and electronics/ICs within automotive, around the world
• Where is the opportunity?• How are electronics/ICs responding to – and affecting – changing market expectations and needs?
• Four key areas…• Drive train, body electronics and chassis control, driver assistance and entertainment
• …lead to many important benefits• Better driver control, improved vehicle safety and reliability, fewer collisions, better handling, improved fuel efficiency, reduced
emissions, enhanced in-vehicle entertainment and navigation…
• What “macro trends” affect future demand for automotive electronics/ICs?• Electric vehicles, passenger-centric transport and regulations designed to address congestion and pollution
will combine to create further demand for smart vehicles
• Who is driving these trends?• The auto manufactures and semiconductor firms are collaborating to provide consumers with shift towards a
seamless electronic/IC-intensive future connecting other devices, networks and data into useful paradigms
• How TechInsights can help you to build traction in the automotive electronic/IC market?• Case study examples of our analysis
What is the opportunity?Penetration rate statistics show that automotive has tremendous scope for long-term growth
• The middle classes of India and China are growing by around 10 million people per year in each country. In Brazil too, several million Brazilians are likely to join the lower middle class in the foreseeable future. Particularly in Africa and Asia, people are being drawn to the megacities, where the switch from the bicycle or moped to the car is seen as an expression of growing prosperity. At 83 cars per 1,000 heads of population, in 2011 China reached the level measured in Europe around 60 years ago. Car density in the USA is higher by a factor of 10.
• The fastest growth rate for car production around the world is likely to be generated in future by demand for low-cost cars coming from the BRIC countries (Brazil, Russia, India and China) as well as from countries such as Indonesia, Mexico, Malaysia and Thailand. It is one of the major challenges of our times to make sure that these developments take their course in a manner that causes the least possible damage to the environment and global climate. The manufacturers of these cars will increasingly need to employ innovative electronics that will require intelligent integration at semiconductor level in order to comply with safety, emissions and cost targets for low-cost cars.
• Infineon 2012 annual report, page 43 (bold added for emphasis)
http://www.infineon.com/dgdl?folderId=db3a30433b47825b013b4d4bda8c1a55&fileId=db3a30433b92f0e8013b989bf5cd15f3, page 43
What is the opportunity?Auto sales continue to increase…
From the Infineon 2012 annual report, page 42: http://www.infineon.com/dgdl?folderId=db3a30433b47825b013b4d4bda8c1a55&fileId=db3a30433b92f0e8013b989bf5cd15f3
What is the opportunity?Like consumption, production is distributed globally – not tied to a single economy
From http://en.wikipedia.org/wiki/Automotive_industry, referencing http://oica.net/category/production-statistics/
What is the Semiconductor opportunity?The value of ICs in vehicles is high, and continues to increase
From the Infineon 2012 annual report, page 43: http://www.infineon.com/dgdl?folderId=db3a30433b47825b013b4d4bda8c1a55&fileId=db3a30433b92f0e8013b989bf5cd15f3
• According to the market research specialist Strategy Analytics, the total value of semiconductor components in an average car in the 2011 calendar year amounted to US$309 or approximately €250 – a new record figure.
• The total value of semiconductor components per car in the world’s established markets (Europe, North America and Japan) stands at around US$400, while the average car sold in emerging markets has only half as much value on board. Over the coming years and decades, countries in these regions are likely to catch up with the well established automobile nations. For this reason, the compound annual growth rates for the value of semiconductors per car in China and Brazil (meanwhile the world’s largest and fourth-largest car nations respectively), are likely to be twice as high as those recorded in Europe and North America.
The “net net”: estimated growth in automotive IC value, 2011-2015
$-
$2,000.00
$4,000.00
$6,000.00
$8,000.00
$10,000.00
$12,000.00
2011 2012 2013 2014 2015
In $
M
Automotive IC value and growth by region, 2011-2015
Asia (ex Japan) Japan Europe North America LATAM MEA
Source: IT Market Dynamics/TechInsights, 2013
CAGR: 13.5%
CAGR: 8.1%
CAGR: 0.8%
CAGR: 10.0%
CAGR: 9.0%
CAGR: 6.8%
Estimated 2015 market: $32.4 billion,
CAGR of 8.4%
Estimated 2011 market: $23.5 billion
Primary automotive electronic/IC market segments
Drive train
Body electronics and chassis control
Entertainment
Driver assistance
• Each segment includes a unique blend of requirements and opportunities – and each has the ability to change the competitive positions of (and commercial relationships between) OEMs, automotive suppliers, electronics/IC suppliers…
Overview: ICs and electronics in the drivetrain
• ICs/electronics are critical components in drivetrain systems:• Engine and transmission control: enable the efficient distribution of power, improving
predictability and responsiveness while also reducing fuel consumption and emissions
• ICs/electronics power additional critical components in hybrid and electric vehicles
• Battery management is a crucial factor in EV/hybrid performance and reliability (and for EVs, it is at the core of viability)
• Chargers: EVs and hybrids rely on sophisticated electronic charging systems to replenish batteries
• Motor control: EVs don’t use conventional throttles – they rely on electronic systems for motor control
• IC Characteristics in the Automotive Space• IC must meet criteria around reliability, durability, and ability to handle harsh environments• Lifecycle of vehicle is ~7-10 years, OEM must stock to sell and support over the lifetime.
Key issues in drivetrain electronics
• Manufacturers are pursuing better efficiency – in combustion-powered, hybrid, plug-in hybrid and electric vehicles
• Pending regulations in Europe and the U.S. will require that automakers achieve average fuel efficiency (of 4 litres of fuel per 100 km, or approximately 59 miles per gallon) and pollution benchmarks that are well beyond current norms –and which will require increased use of IC/electronics-heavy weight reduction technologies in conventionally-powered cars, and increased emphasis on advanced/alternative approaches to powering vehicles
• However, this is not entirely a regulatory “stick” issue –there is the “carrot” of increased market share, as increasingly, automotive marketing also centres on innovation in drivetrain electronics
• [The new Audi Q series, which includes] “an innovative and efficient plug-in hybrid drive, based on a specially developed 1.5 three-cylinder TFSI engine and two electric motors, is setting new benchmarks as it only uses 1.1 l of fuel per 100 km and only emits 26 grams of CO2 per kilometer.”
• “The Audi A6 L e-tron concept, which was designed specifically for the Chinese market, is the first hybrid technology concept for the premium class. The plug-in hybrid features a 2.0 TFSI engine with 155 kW (211 PS) and a 70 kW electric motor and can cover a distance of 80 km running solely on electric power”
• Volkswagen 2012 annual report
http://www.volkswagenag.com/content/vwcorp/info_center/en/publications/2013/03/Y_2012_e.bin.html/binarystorageitem/file/GB+2012_e.pdf
VW’s annual report provides detailed information on its vehicles’ CO2 performance, under the heading “Value-Enhancing Factors”
Overview: Body electronics and chassis control
• ICs/electronics are critical elements in delivery of advanced handling, safety, and comfort features:
• Power steering: electronics-based systems integrate with other automotive systems (such as safety features; and electronics-based systems are both lighter and more power-efficient than hydraulic systems, enabling OEMs to reduce fuel consumption
• ESC (Electronic Stability Control): systems sense a loss of traction, and adjust braking and acceleration to each wheel to restore control
• Radar-based driver assistance: systems that alert drivers to potential obstacles/collisions before they occur
• Tire-pressure monitoring systems: Mandatory since 2007, these systems alert drivers to hazardous tire conditions
• Other uses of ICs in body electronics and chassis control: ABS (anti-lock braking systems), airbags, air conditioning, door electronics, lighting, power windows, sunroof, windshield wipers…
Safety through ICs
• Automotive safety has progressed rapidly from the mechanical (seatbelts) to the electronic (e.g., predictive braking, lane departure warnings)
• Experts believe that future emphasis will be on avoiding collisions and dangerous situations, rather than mitigating them – which will in turn require increasingly sophisticated, intelligent and interconnected systems
• “EU regulations to make active pedestrian protection systems mandatory equipment for all new cars as from 2017 are a further step towards achieving this objective. A deformable air hose will be built into the front bumper with a pressure sensor fitted at both ends for redundancy reasons. Upon impact, these sensors measure the pressure change within the air hose, evaluate the data in real-time and transmit them to a central control unit, which in turn activates a mechanism that lifts the car’s hood, thereby cushioning the impact of the pedestrian and significantly reducing the risk of injury.”
• -Infineon Annual Report
http://www.infineon.com/dgdl?folderId=db3a30433b47825b013b4d4bda8c1a55&fileId=db3a30433b92f0e8013b989bf5cd15f3, pages 45-46
Advanced chassis/body systems: functional and emotional appeal to the buyer• Auto manufacturers are reaching out to customers
to connect IC/electronics-enabled control systems with messages emphasizing both the functional and emotional appeal of advances in areas like drive-by-wire:
• “How does [The Nissan Infinity’s steer-by-wire system] work? The system interprets the driver's input from force applied to the steering wheel. This information is fed to multiple electronic control units (ECUs). The ECUs then process this information and turn it into instructions for the steering angle actuator, which turns the front wheels. It can make driving less like manual labor, and more like a video game…
• “Nissan's system also mounts a forward-facing camera onto the rear-view mirror. It scans the road ahead, and sends information about lane detection and the vehicle's direction of travel to the steer-by-wire system. Discrepancies are then adjusted for with an opposing force to the tire angle – if the car starts drifting to one side, for instance, the system will automatically steer the car back towards the center of its lane. It sounds like something from Terminator, but a successful implementation could make driving more smooth and relaxing.”
• Gizmag, October 2012
http://www.gizmag.com/nissan-infiniti-drive-by-wire/24605/
Nissan Infinity’s Steer-by-Wire system
Overview: Advanced Driver Assistance Systems
• Advanced Driver Assistance Systems use IC/electronics enabled systems in conjunction with Human-Machine Interface technologies to improve systems by having the car work actively with the driver to improve safety
• ADAS systems include:• In-vehicle navigation and communication systems• Systems designed to improve visibility
• Night vision systems, adaptive light control• Systems for monitoring/modifying the speed and path of a vehicle on the highway
• Adaptive cruise control, lane departure warning systems, lane change assistance systems, collision avoidance systems, blind spot detection, driver drowsiness recognition
• Systems assisting drivers in city/tight-quarters situations• Pedestrian protection systems, automatic parking, traffic sign recognition
• Other driver assistance systems• Hill descent control, electric vehicle power warnings
Advanced Driver Assistance Systems in action
• Advanced Driver Assistance Systems combine technologies that alert drivers to issues with electronic chassis control systems to improve passenger safety
• The picture to the left illustrates how Honda’s advanced Driver Assistance Systems combine technologies to provide both driver alerts and automatic responses to avoid (or mitigate the impact of) collisions
• Source: Autoevolution
• “Collision avoidance" was until now considered the ultimate safety measure in some ways and was thus a longtime dream for automotive industry insiders…[Now], government is pushing forward with policies and measures that further the commercial application of Pre-Crash Safety systems, Driver Assistance Systems, and the like as a way to reduce the growing number of accidents.”
• Source: Electro to Auto Forum
http://www.autoevolution.com/news/honda-cmbs-awarded-euro-ncap-advanced-honor-25006.html
http://e2af.com/trend/071210.shtml
The environment – and the automotive environmentMacro trends driving additional opportunity for automotive ICs/electronics
Key issues in automotive ICs/electronics
• The Electro to Auto Forum feature “Automotive industry seeking electronic solutions to four main issues” identifies ways in which ICs/electronics are driving change in the automotive industry
• Improving drivability systems, including:• Parking support, cruise control systems using CMOS/CCD cameras• Improved HMI (human/machine interface) displays
• Enhancing safety features, such as:• Pre-crash safety systems – e.g., cameras, drowsy driver alerts• Systems that support the trend from “damage reduction” to “collision
avoidance”
• Lowering environmental burden• Use of electronics to improve fuel injection and related systems which “lead
to a great contribution to overall fuel economy”• “The development of eco-friendly vehicles such as HEVs, electric vehicles,
and fuel-cell electric vehicle is a must-do task for automakers”
• Realizing greater operational reliability, for example, through better software:
• “It would be difficult for automakers to concurrently develop four to five different types of power train systems, ranging from gasoline engines, diesel engines, and hybrid drive systems to electric vehicles and fuel-cell electric vehicles. Consequently, joint development projects between automakers, or projects between automakers and automotive component manufacturers or automotive electronics manufacturers, are becoming common”
• TechInsights believes that this emphasis on better IP management will lead to more opportunities for IC/electronics suppliers to work within/lead/profit from these ventures
http://e2af.com/trend/071210.shtml
Macro trends affecting the automotive industry –and their affect on IC/electronics demand• Beyond the drive to perfect components used to
deliver better drivetrain performance, improved body and chassis control, enhanced driver assistance systems and superior entertainment –there are broad trends that affect the automotive industry and its need for/reliance on ICs and electronics
• These include:
• Pollution, fuel consumption, and mandates that promote hybrids and EVs
• Regulations requiring further advances in safety
• Customer-centric (rather than vehicle-centric) approaches to urban mobility
• Connected vehicle technologies
• Increasing requirements for inter-company collaboration
• In 2011, Ernst and Young identified “8 Automotive Megatrends” that point to increasing complexity in (and around) the automotive industry
• All of these trends, to one extent or another, emphasize the importance of information exchange –and as a result, of automotive ICs/electronics
http://autobeatinsider.com/perspectives/automotive-industry-mega-trends
Projected growth of EVs – and what this means to automotive ICs
Hybrid and electric vehicles create the potential for a “hockey stick” growth path for automotive ICs: sales are growing rapidly (in both absolute terms and share), and the value of ICs in EVs is roughly 2x the value of ICs in conventional vehicles
Connected vehicles
• We are starting to see a groundswell of support for connected vehicles that communicate with roadside infrastructure and other vehicles
• With connected vehicles, the network of integrated suppliers becomes much broader, including telcos (operating the roadside infrastructure) and application vendors (who will connect to vehicles via this infrastructure)
• As the figure illustrates, we are still at the beginning of the connected vehicle market. The Intelligent Transportation Society of America notes: “Deployment of DSRC (Dedicated Short-Range Communications) is complex and faces the classic "chicken and egg" problem…”ITSA adds, though, that the US Department of Transportation will “aggressively pursue” connected car systems (beginning with vehicle-to-vehicle) and that “U.S. DOT anticipates that a foundational network (or network of networks) will need to be developed to exchange diagnostics, security, authentication data between vehicles and a V2V centralized cloud based network management authority to manage V2V applications nationwide.”
• Already, we see a combination of specialized providers (Airbiquity, WirelessCar), component suppliers (Qualcomm, Sierra Wireless) and systems and application vendors (OnStar, Hughes Telematics) – and a host of OEMs (BMW, Chrysler, Daimler, Ford, GM, Toyota…) jockeying for position in this high-growth area
This forecast for embedded telematics (i.e., not including aftermarket products) calls for a 15-year CAGR of 27% for the key technology enabling connected cars
http://www.gsma.com/connectedliving/wp-content/uploads/2012/03/gsma2025everycarconnected.pdf
http://www.itsa.org/industryforums/connectedvehicle
Leading sources of automotive ICs/electronics
OEMsAutomotive
suppliersIC suppliers NPEs
There is opportunity for any of these types of suppliers to build market presence independently, by allying with similar firms, and/or by partnering with organizations in other areas
• Automobile manufacturers: GM, Volkswagen, Toyota, etc.
• Importance of electronics: differentiate products for end customers; comply with regulatory requirements
• Suppliers of automotive components to OEMs: Bosch, Denso, Magna, etc.
• Importance of electronics: align with OEM demand; incorporate added-value (and additional margin) into products
• Suppliers of integrated circuits and electronics to OEMs and automotive suppliers: Renesas, Infineon, Freescale, etc.
• Importance of electronics: Core product offering; innovation is essential to competitiveness
• Suppliers of integrated circuits and electronics to OEMs and automotive suppliers: Renesas, Infineon, Freescale, etc.
• Importance of electronics: Core product offering; innovation is essential to competitiveness
Leading OEMs: share, and impact of ICs/electronics
0 2 4 6 8 10
Chrysler
Kia
Fiat
Suzuki
Renault
PSA
Honda
Hyundai
Nissan
Ford
Toyota
Volkswagen
General Motors
2011 sales, in millions• The world’s top 10 OEMs combined for approximately 70% of the global
vehicle market in 2011
• Leadership in electronics features heavily in automotive marketing…• From the 2012 Volkswagen Annual Report: “Some examples (of innovation in
the Volkswagen Golf) are the Front Assist with an integrated city emergency braking function, fatigue detection, an electronic differential lock as standard, the Lane Assist lane keeping assistant, road sign recognition and the latest generation of the Park Assist automatic parking assistant, which warns against obstacles with a graphical 360 degree display. The multi-collision brake, which comes as standard and was awarded a “Golden Angel” in 2012 from German automobile club ADAC, slows the vehicle down after an accident so as to reduce the remaining energy and thus avoid typical secondary accidents. Additional technologies such as the progressive steering system, a driver profile selection with five programs and the new information and entertainment system with a display that reacts to hand movements via a proximity sensor round off the specification package.”
• …and leadership in IC/electronics related IP is important to corporate strategy
• “Toyota carefully analyzes patents and the need for patents in each area of research to formulate more effective R&D strategies. We identify R&D projects in which Toyota should acquire patents, and file relevant applications as necessary to help build a strong global patent portfolio. In addition, we want to contribute to sustainable mobility by promoting the spread of technologies with environmental and safety benefits. This is why we take an open stance to patent licensing, and grant licenses when appropriate terms are met. A good example of this policy is the licensing to other companies of patents in the area of hybrid technology, which is one of our core technologies involving environmental energy.”
• 2012 Toyota Annual Report
• “In the 70’s, metal was the single highest value component in vehicle. In the 80’s and into the 90’s, it was computer HW. Early in this decade, the cost of software became the highest value component of the vehicle”
• Ford, as quoted in IT in Canada
Source: Ernst & Young, cited in Frankfurter Allgemeine Zeitung, and cited in the Automotive industry – StatistaDossier 2012
Leading automotive suppliers: share, and impact of ICs/electronics
0 5 10 15 20 25 30 35
Faurecia
Goodyear
Johnson Controls
Michelin
Magna
Aisin Seiki
Bridgestone
Denso
Continental
Bosch
2011 revenue, in billions €• The world’s top 10 automotive suppliers combined for
just less than 50% of the global automotive supplier market in 2011 – and
• Leadership in electronics features heavily in their marketing positioning:
• “The automotive industry is in a period of transition, and Bosch is a driving force behind change. We are able to reduce the fuel consumption of diesel and gasoline cars by at least another 30 percent, and we are well prepared for the gradual transition to electromobility. At the same time, we are getting ever closer to the goal of accident-free driving.”
• “DENSO seeks to create innovative products that win the approval of our clients, while meeting the needs of end users and our entire automotive society. In our quest for technological progress, we are striving to realize a world of mobility, free from environmental concerns and traffic hazards, where convenient vehicles supply ideal driving comfort. To achieve these advances, we promote technology development that focuses on the environment, safety, comfort, and convenience.”
• “Faurecia develops and produces entire exhaust systems, from the manifold to the tail pipe. The group is the joint brains behind the Diesel Particulate Filter with PSA, contributing to the development of "clean" cars by treating pollutants (e.g. nitrogen oxides) and recovering energy.”
Source: Ernst & Young, cited in Frankfurter Allgemeine Zeitung, and cited in the Automotive industry – StatistaDossier 2012
Focused on parts including electronics Focused on tires
http://www.faurecia.com/expertise-innovation/automotive-equipment/Pages/emission-control-technologies.aspx
http://www.bosch-automotivetechnology.com/en/com/home/homepage_com.htmlhttp://www.globaldenso.com/en/technology/index.html
The growing importance of aftermarket automotive suppliers• Even with a forecasted drop to
30% of all automotive value in 2010, these figures show that the contribution of (aftermarket) automotive suppliers increased by 30%-60% over the past decade
• These firms play a critical role in connecting ICs with OEMs, and ultimately, with customers – and they are potentially innovators in this area themselves
0%
5%
10%
15%
20%
25%
30%
35%
40%
0
50
100
150
200
250
300
in $
bill
ion
s U
.S.
United States automotive original equipment and aftermarket parts market from 2000 to 2010
Original equipment Aftermarket Aftermarket % of total
Source: DesRosiers and U.S. Dept of Commerce, cited in the Automotive industry – StatistaDossier 2012 * - forecast/estimate
Leading automotive IC/electronics suppliers• The world’s top 10 automotive IC suppliers combined for
roughly 55% of the global market in 2010.
• Innovation in applying ICs to automotive requirements is the primary determinant of competitive success:
• “Infineon Technologies is a leading player and pioneer in automotive electronics. Our enduring success in this field is due to a clear strategic focus on automotive applications and standards, the understanding and insights that have emerged from over 40 years of dedicated experience and our ability to continually innovate this market with a broad portfolio of outstanding quality. Our sensors, microcontrollers and power semiconductors help automotive manufacturers achieve their increasingly challenging safety, affordability and efficiency targets. Above all, we are helping tocreate more sustainable mobility choices by lowering emissions and fuel consumption.”
• “Whatever design challenges you encounter, Freescale's broad portfolio of automotive microcontrollers, integrated circuits and sensors solutions, plus our growing enablement and technical support, help you get back on track. We enable you to create the next breakthrough automotive designs for powertrain, body, chassis and safety, infotainment and telematics, and in-vehicle networking applications.”
• “The car is evolving from a simple mode of transport to a personalized mobile information hub. NXP helps you drive this change by enabling all electronic communication to, from and within the vehicle – reliably, securely, and efficiently.”
Renesas11%
Infineon7.9%
STMicroelectronics7.7%
Freescale5.8%
Bosch5.5%
Texas Instruments
5.0%NXP4.9%Toshiba
3.2%Fujitsu2.2%
ON Semiconductor2.1%
Other44.7%
2010 market share
http://www.ecnmag.com/news/2011/03/automotive-semiconductor-market-grew-37-cent-2010
http://www.nxp.com/applications/automotive/
http://www.freescale.com/webapp/sps/site/homepage.jsp?code=IFATOATMTV
http://www.infineon.com/dgdl?folderId=db3a30431c48a312011c6695d55802cb&fileId=db3a30431c48a312011c6696b47402cc
Case Study:Reverse Engineering Chevy Volt
BatteryThis example shows our engineering expertise to look at innovative
design, development and go-to-market aspects in the EV space.
Chevy Volt Battery ModuleProject #45458
Objective: Technical Analysis of Power Train of Chevy Volt
The battery pack is located under the car along the
tunnel between the passenger and drivers seats,
secured to the bottom of the car with numerous
threaded fasteners around its perimeter. The batteries
are secured to a large T-shaped metal stamping and
covered with a large compression molded cover. All of
the interface connections are conveniently at the front
of module. The one exception is the service
disconnect plug which extend up through the floor into
the passenger compartment for easy access.
Chevy Volt Battery Pack
The Chevy Volt’s battery pack system component
locations:
1) Battery Interface Module 30 cell
2) Battery Interface Module 24 cell (2ea)
3) Battery Interface Module 18 cell
4) Battery Energy Control Module (ECM)
5) Battery Management Module
Front
Rear
1
2
23
4
5
Battery Pack Design
The battery pack is split into four major sections (red
box). The rear section consists of two modules with 72
cells on the right and 54 cells on the left which are
connected with a short buss bar. The front module
contains 90 cells, the middle module 72 cells. Each
section of the battery has a single electronic module
(green box) to monitor temperatures and voltages.
At the very front of the pack (blue box) are the high
current relays and vehicle cable, wiring and coolant line
interfaces.
Battery Pack
Voltage Reading 18 voltage Sensors 3 temp sensors
4 1
8 2
12 3
16 4
20 5
24 6
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32 8
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60 15
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68 17
72 18Connector 1
Connector 2
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Location #3
Battery Interface Module 4
18 cells Module 3B
The battery pack consists of 288 cells which are
grouped by connecting three cells in parallel to create
96 individual sub modules. These 96 sub modules are
distributed into the four main battery modules. The left
rear battery pack monitoring system is shown to the
right, the other three packs are designed similarly.
This section contained 18 sub modules (54 individual
cells) connected in series. The average cell voltage
was 4.0278 VDC. Three temperature sensors are used
and are assumed to be located between cells 4/5, 9/10
and 14/15.
Battery Pack Current
-
Voltage Reading
18 voltage
Sensors 3 temp sensors
4 1
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20 5
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28 7
32 8
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68 17
72 18
18 cells Module 3B
Battery Interface Module 4
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+
-+Battery Positive Terminals
Battery Negative Terminals
Pos
Pos
Neg
Neg
Neg
Battery Individual Cell
Battery Individual Cell
Battery Individual Cell
Pos
Shown above is an example of one of the battery packs consisting of three
cells in parallel. Each of these packs are then connected in series to make up
the battery modules. To the right is the 18 cell module (left rear). The red and
blue lines represent the three cell packs being connected in series along the
length of the module. As with any series circuit design, an open in any portion
of the circuit results in the entire module being inoperative.
Positive
Negative
Cooling Channel
Battery Individual Cell
Cell Pack 1 Cell Pack 2 Cell Pack 3 Cell Pack 4
Negative
Battery Individual Cell
Positive
Negative
Battery Individual Cell
Cooling Channel
Cooling Channel
Positive
Negative
Battery Individual Cell
Positive
3 Parallel Cells
Pack 1 2 3 4
Battery Pack Layout
Volta
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Connector 1 Connector 2 Connector 3
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terfa
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odul
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lls M
odul
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vol
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4 te
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82
123
164
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287
328
369
4010
4411
4812
5213
5614
6015
6416
6817
7218
7619
8020
8421
8822
9223
9624
Connector 1 Connector 2
Appr
oxim
ate
Loca
tion
#1
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oxim
ate
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#2
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terfa
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odul
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24 ce
lls M
odul
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Mid
dle
Pack
Voltage Reading 24 voltage Sensors 4 temp sensors
4 1
8 2
12 3
16 4
20 5
24 6
28 7
32 8
36 9
40 10
44 11
48 12
52 13
56 14
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64 16
68 17
72 18
76 19
80 20
84 21
88 22
92 23
96 24
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Location #1
Connector 1Connector 2
Battery Interface Module 3
24 cells Module 3A
Voltage Reading 18 voltage Sensors 3 temp sensors
4 1
8 2
12 3
16 4
20 5
24 6
28 7
32 8
36 9
40 10
44 11
48 12
52 13
56 14
60 15
64 16
68 17
72 18
Connector 1Connector 2
Approximate
Location #1
Approximate
Location #2
Approximate
Location #3
Battery Interface Module 4
18 cells Module 3B
Rear
Pac
k
The battery pack layout for monitoring is depicted in the picture. Every cell pack is
connected to a voltage sensing circuit (red fill) while the temperature sensors are
assumed to be evenly spaced throughout the cell pack (green fill).
Initial voltage readings taken after removal:
Front Cell:120.8 VDC
Middle Cell: 96.6 VDC
Right Rear Cell: 96.7 VDC
Left Rear Cell: 72.5 VDC
Total Battery Pack Voltage: 386.6 VDC
Front Pack Middle Pack
Rear Packs
Battery Pack CurrentThe four main battery modules are connected in series. The front
module provides the positive connection to the vehicle cables and
the left rear module provides the negative connection. Current flow
can be in either direction depending on vehicle mode (Electric
Drive – Charging).
A current sensor monitors the buss bar connection between the front and middle
modules. The service disconnect plug splits the series connection between the
middle and rear modules.
-
+
Volta
ge R
eadi
ng
30 V
olta
ge
Sens
ors
5 te
mp
sens
ors
41
82
123
164
205
246
287
328
369
4010
4411
4812
5213
5614
6015
6416
6817
7218
7619
8020
8421
8822
9223
9624
100
25
104
26
108
27
112
28
116
29
120
30
Fron
t Pac
k30
cells
Mod
ule
1
Batte
ry In
terfa
ce M
odul
e 1
Appr
oxim
ate
Loca
tion
#1
Appr
oxim
ate
Loca
tion
#2
Appr
oxim
ate
Loca
tion
#3
Appr
oxim
ate
Loca
tion
#5
Appr
oxim
ate
Loca
tion
#4
Volta
ge R
eadi
ng
24 v
olta
ge
Sens
ors
4 te
mp
sens
ors
41
82
123
164
205
246
287
328
369
4010
4411
4812
5213
5614
6015
6416
6817
7218
7619
8020
8421
8822
9223
9624
Mid
dle
Pack
24 ce
lls M
odul
e 2
Batte
ry In
terfa
ce M
odul
e 2
Appr
oxim
ate
Loca
tion
#1
Appr
oxim
ate
Loca
tion
#2
Appr
oxim
ate
Loca
tion
#3
Appr
oxim
ate
Loca
tion
#4
Rear
Pac
k
Voltage Reading
24 voltage
Sensors 4 temp sensors
4 1
8 2
12 3
16 4
20 5
24 6
28 7
32 8
36 9
40 10
44 11
48 12
52 13
56 14
60 15
64 16
68 17
72 18
76 19
80 20
84 21
88 22
92 23
96 24
24 cells Module 3A
Battery Interface Module 3
Approximate
Location #1
Approximate
Location #2
Approximate
Location #3
Approximate
Location #4
Voltage Reading
18 voltage
Sensors 3 temp sensors
4 1
8 2
12 3
16 4
20 5
24 6
28 7
32 8
36 9
40 10
44 11
48 12
52 13
56 14
60 15
64 16
68 17
72 18
18 cells Module 3B
Battery Interface Module 4
Approximate
Location #1
Approximate
Location #2
Approximate
Location #3
- + ++
+
-
-
- -
+ Battery Positive Terminals
Battery Negative Terminals
Buss Bars
Positive Buss Bar
Negative Buss Bar
Current Sensor
Service Disconnect Plug
Battery Pack Cooling
InCe
ll5
tem
p se
nsor
sOu
t
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
Appr
oxim
ate
Loca
tion
#5
Fron
t Pac
k
Appr
oxim
ate
Loca
tion
#3
Appr
oxim
ate
Loca
tion
#4
Appr
oxim
ate
Loca
tion
#2
Appr
oxim
ate
Loca
tion
#1
InCe
ll4 t
emp
sens
ors
Out
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Mid
dle
Pack
Appr
oxim
ate
Loca
tion
#3
Appr
oxim
ate
Loca
tion
#4
Appr
oxim
ate
Loca
tion
#1
Appr
oxim
ate
Loca
tion
#2
Out Cell 4 temp sensors In
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Approximate
Location #4
Right Rear Pack
Approximate
Location #3
Approximate
Location #1
Approximate
Location #2
Out Cell 3 temp sensors In
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
Left Rear Pack
Approximate
Location #3
Approximate
Location #2
Approximate
Location #1
The battery uses coolant for heating and cooling of the battery modules. During cold weather
operations, a coolant heater would be activated to warm the cells. Once a specific
temperature is reached, the coolant system would then switch to a cooling cycle to maintain
a constant temperature within a specified range. Coolant is routed down one side of each of
the modules and then channels through separator plates between the battery cells. It exits
on the opposite side and flows back out the front of the battery pack.
Example of coolant (Green) flowing
between the battery packs (from
one side to the other)
Coolant Flow In
Coolant Flow Out
Battery Interface Module
Three unique modules were found on top of each battery section. The middle section and one of
the rear sections share a common board (Blue PCB). These control modules monitor the
temperature and voltages of their respective battery modules. The orange connectors are the
interfaces to the battery sensors while the black connectors provide connections for
communications, five volt, ground reference and high voltage fault signal lines. The control modules
are contained in simple injection molded housings with the PCB attached with four threaded
fasteners. The control modules then attach to the battery with a snap fit.
Battery Interface Module Electronics
• Sense voltage, current, and temperature.
LG Chem Battery Management ASSP• Manufactured by ST Microelectronics in proprietary BCD technology.
• Up to 10 Li-ion cells/IC
LG Chem L9763 Block Diagram• Cell voltage monitoring with sample and hold.
• Charge pump to drive Power-MOS.
• Cell balancing using passive discharge.
Source: ST Microelectronics
L9763 Close Up
DIFFERENTIAL INPUTS
SAMPLE AND HOLD
CELL BALANCING
ST die mark
Battery ECM
The battery pack front module contains a circuit board which is
used to control the high current relays, coolant heater and the
coolant pump for battery temperature control. The module also
contains a current sensor on the DC output circuits. The
module is contained in an aluminum die casting with numerous
injection molded brackets for component attachment. It is
sealed around the outer perimeter to the cover and at the
bottom to the large stamped steel battery support member.
Control
Module
Relays Current Sensors
Coolant Temp Sensors
Battery ECM Electronics
Battery Management
All of the battery pack modules are linked to a single control
module located under the passenger seat. This is referred to
as the “battery management module.” Based on GM service
information, this module stores all diagnostic information.
The module design is more in line with a module found in
the engine compartment, as opposed to an interior module.
It is completely sealed with the cover having to be pried off
for access to the PCB. The entire PCB is sealed using a
thick conformal coating layer.
Case Study:Systems and Software
Linking the IC design and implementation with Systems and Software Analysis.
Inside the Car
Source: GM
Inside the Car
Source: GM
Pedestrian Warning
7” LCD Touchscreen
Power
“Leaf”
mode
Touch Sensitive
Controls
Instrument Cluster Display
Source: GM
Instrument Cluster:Tire Pressure
Source: GM
Efficiency Gauge
Source: GM
Keep the ball centered
Braking too hard
Infotainment System Analysis
The infotainment section covers the center
stack and the instrument cluster along with
the body control module and the
communications interface module. The body
control module is located under the instrument
panel (IP) on the drivers side, while the
communication interface module is on the
passenger side (also under the IP).
Instrument ClusterThe instrument cluster is located directly behind the steering
wheel. It provides the vehicle operator with typical feedbacks
including vehicle speed, fuel level, battery level,
temperatures, seat belt connection, compass heading, gear
selection, trip meter, brake, airbag and engine indicators. It
has a 32 pin connector with only 11 pins being used. Circuit
connections include: 12 VDC, Low Reference, Ground,
Run/Crank Signal, Driver Information Center Switch, Low
Washer Fluid, Check Engine Signal and Low Speed GMLAN
Data.
Instrument Cluster PCB
SPANSION
GL512N11FFA02
MIRRORBIT FLASH
FREESCALE
SPC5121YVY400B
DISPLAY CONTROLLER
Manufacturer Not Identified
F3377AM21A1
Center Stack
The center stack provides the customer
convenience displays and custom controls for
hybrid monitoring. A touch screen display along
with physical hard buttons are used for operator
interface. The display and all control buttons/knobs
are part of one single module that snaps into the
center of the IP and is retained with two threaded
fasteners at the bottom (hidden behind trim).
Center Stack
The center stack has three electrical connections, one
to the hard buttons/knobs and two to the touch screen
display. It is installed as an assembly to the vehicle
using snap fits and two threaded fasteners at the
bottom. It is primarily a plastic molded design with the
exception of the display which is in a stamped metal
housing.
Centre Stack Video PCB
• Consider putting detailed info right after module overview for each?
SONY
CXB1458R
GVIF RECEIVER
RENESAS
R5F3650MDFB
32/16 BIT MICROPROCESSOR
Centre Stack Radio PCB
Blue LEDs
Mechanical Switch
Centre Stack Radio PCB
CYPRESS
CY8C21534-24PVXA
PROGRAMMABLE SOC
D78FD535A
8-BIT MICROCONTROLLER (?)
CYPRESS
CY8C21534-24PVXA
PROGRAMMABLE SOC
Communications ModuleThe telematics communication interface module has two connections, a 16 pin connector and a 12
pin. The 16 pin connector provides high and low speed (GMLAN) serial data communication links,
key pad signals and 12 volt power and ground. The 12 pin is used for hands free cell phone use
(cell phone voice signals, voice recognition signals and micro phone signals), three low reference
(clean ground) connections, two drain wire connections and a second high speed GMLAN signal
line.
Communications Module PCB
FREESCALE
SC103335VR400B
SDRAM/DDR Memory Controller
SPANSION
S29GL512P10TE
512 Mb MirrorBit Flash ZENTEL
A3S56D40ETP-GS1
256Mb SDRAM
Bluetooth Antenna
LG
LBMA-2C66B7
Bluetooth Transceiver