avs-62 san jose 2015 eld cu nps conc il-v2
TRANSCRIPT
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Electrostatic Coating with Ligandless Copper Nanoparticles:
Films, Surfactant Concentration, 3D Deposition
AVS-62, San José, CAOctober 22, 2015
Lance Hubbard & Anthony MuscatDepartment of Chemical & Environmental
EngineeringUniversity of Arizona
Tucson, AZ 85721
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Nanoparticles, Thin Films, Features
2
Substrate
Cu NP Film
Metallic Nanoparticles (NPs): Low
Temperature Metallization
Electroless Thin
Film Plating
Spectroscopy
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Conductive Copper Nanoparticles • Cu NP film
• Electroplating seed layer
• Atmospheric pressure and lower temperatures
• Nanophase reduces sinter temp. by ↑ surface energy
• Suspended Cu metal
• Cu NPs oxidize quickly = not conductive
• Ligands (mol. bound to surface)
• Lowers conductivity
• Ionic liquid charge compensator3
NP SEM Surface:
Cu NPs Bath
Coated Film:
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Ligands and Charge Compensators
4
Ligands: Charge Compensator:
3.1±1.6 nm
Diameter
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Approach to Deposit Blanket Films
SiO2
Pt Pt PtPt PtPt
Example Conventional Process:
(not to scale)
Electroless Coating Process:
SiO2
Diffusion Barrier
7 Å Amine
Terminated
Layer
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TEM Bath Coated Cu Films
6
Ionic Liquid Added
Substrate
Cu NP Film
Control, No Ionic
Liquid Added
Substrate
Cu NP Film
Grain
Void
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Light Absorbance vs. Ionic Liquid Conc.
7
Discontinuous FilmsContinuous Films
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Photoluminescence vs. IL Conc.
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Bulk Conductivity
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Electrical Conductivity of Films vs. Ionic Liquid Concentration
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Ellipsometry Model: Oscillators• Woollam’s copper Palik layer
• Infrared: Lorentz
• Visible: Tauc-Lorentz
• Ultra Violet: Tauc-Lorentz
• Ultra Violet: Gauss
• Nanophase Cu response
• Alter strength/width oscillators
• Nanophase/polydisperse
• Effective medium Approximation
• Voids/ion shell
• Surface roughness10
Si (1 mm)
SiO2 (16.8 Å)
APTMS (7.6 Å)
Cu NPs + Void EMA (Variable)
(not to scale)
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X-Section High Angle SEM: Void Increase vs. IL Conc.
11
0.5 mM
2.1 mM
4.3 mM
5 µm
5 µm
5 µm
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EMA Fractions and Depolarization: Interparticle interactions
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Ellipsometry: Polydisperse NPs and Increased Particle Interactions
13
• 2.1-2.5 mM:
• Increased
• Light absorbance
• Photoluminescence
• Conductivity
• Ellipsometry
• Polydisperse NPs
• Increased UV intensity
• Particle interactions
• Bulk like behavior
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Conclusion• Thin blanket Cu NP
films
• Smooth layers
• Electroplating seed
• Ionic Liquid Conc.
• 2.1-2.4 mM
• Interparticle Interactions
• Increased Abs, PL, conductivity
14
Substrate
Cu NP Film
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Other Work: 3D Feature Deposition
15
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Metallized Flexible-Bendable SubstratesPaper
Only:
PaperCuNP
Film
CuNP
Reagents: Cu NP/Wax Paper Film Sintered:
16
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Acknowledgements
• Armando Luna
• LAM Research
• Sandia National Labs
• UA University Spectroscopy and Imaging Facility
• Thank You for Your Time
17
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Backup Slides
18
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X-TEM: ≤3 nm Dia. Nanoparticles
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1.9 mM
2.4 mM 4.3 mM
20 nm
20 nm 20 nm
≥ 3 nm Dia.
2.1 mM20 nm
≤ 3 nm Dia.
Cu NPs
SiO2/APTMS
Si
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Cross Section SEM and Ellipsometry
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Other Ellipsometry Parameters
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Ellipsometry Parameters
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Synthesis and Characterization
23
No I.L.
I.L.3.5±2 nm
15±7 nm
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UV-Vis vs. IL Conc.: Max Abs. at 2.1-2.4 mM IL Conc.
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Positive Charges on Substrate Influence Film Formation
25
0.92
0.91
0.90
0.89
0.88
0.87co
s(A
ve
rag
e C
on
tact
Ang
le)
12111098
pH
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Glass and Amine Termination is Influenced by Initial pH of Substrate
26
Cu NPs on Glass: Cu NPs on Amine-Glass:
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Increasing Sinter Temperature Degrades Amine Termination but not Ionic Liquid
27
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SEM Bath Coated Cu Films
28
a
b
c
d
• Sinter reduces film thickness
• Same interparticle distance
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SEM of Bath Coated Cu Films
• Sinter reduces irregularities in the Cu NP film
• Regularities do not expose underlying silica substrate
• Partial explanation to the decrease in film thickness seen in SEM
29
Substrate Void
ELD film 20oC N2 1hr: ELD film 200oC N2 1hr:
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Copper Nanoparticles: Oxidation
• Improved particle oxidation from minutes to months
• Changed solvent from diphenyl ether to ethylene glycol
• Added µL amounts of ionic liquid as a charge compensator
• Enabled Cu NPs stable in ambient instead of nitrogen
30
0 100 200 300 400 500 600
2468
1012141618202224
Run 3 (~6min Air)
Run 2 (~3min Air)
Run 1
DLS Relative Count vs. Particle Diameter of CuNPs
Co
un
t (%
)
Diameter (nm)
0 5 10 15 20 25 30
0
5
10
15
20 Diameter Increase
Oxidation Initial DLS
After 1 Wk Air
After 2 Wks Air
After 3 Wks Air
DLS Count vs. Particle Diameter for CuNPs
in Ethylene Glycol Over 3 weeks
DLS
Rela
tive Inte
nsity (
%)
Diameter (nm)
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Solution Cycle Coating of Cu NPs• Copper particles concentrate
• Mix with ethanol (EtOH), centrifuge 30min; repeated 3X
• Silica substrates prepared with MPTMS
• Increasing Cu NP SPR response
• 1st 4 cycles
• Cycle 5 response decreases
• Substrates dipped for 1 hr in Cu NP/EtOH solution
• Cleaned with EtOH between steps
• Dipped in ethane dithiol for 1 hr
• Repeated 5X
31
500 550 600 650 700
0.00
0.01
0.02
0.03
0.04
CuNP Film Response Increasing with Cycles
Up to Cycle 4, Decrease in Response at Cycle 5
CuNPs
UV-Vis Absorbance vs. Wavelength for CuNP Cycle Coat
on Glass 1mol% EDT 0.17mg/mL CuNPs in EtOH each
1hr Each EtOH wash Between, 10min Sinter FG 200oC
Cycle 1Cycle 5
Cycle 4
Cycle 3
Cycle 2
Ab
so
rba
nce
Wavelength (nm)
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Reaction Coating: Alternate Substrates
• Reaction Coating
• Films form on positively charged substrate surfaces
• Metals
• Polymers
• Molybdenum
• ~80% conductivity of bulk Cu
• Steel
• ~20% conductivity of bulk Cu
• Reaction coating is applicable to multiple materials
32
Cu NPs on Moly:Molybdenum:
Cu NPs on
Steel:
Cu NP Film on
Biopolymer:
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Reaction Coat Cu NPs on Biopolymers: Polysaccharide (i.e. Copy Paper)
• Paper reaction coated with Cu NPs
• Formed ~micron scale film
• Appears uniform on outer surface
• Little island growth seen upon sintering
33
Paper:160oC
EG Only:
Paper
Paper:160oC
Cu NP Reagents:
Cu
NP
Film
Cu NP/Paper Film Sintered
200oC ,N2, 30min:
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