cardmati bending & torsion tester ... test equipment for mastercard cqm program ... on providing...
TRANSCRIPT
Cardmati Card & RFID Automation
GLUE CAVITY MODULE DUAL CARD TESTING INLAY SIM COM TEST
TAPE MILLING EMBEDDING INTERFACE SOLUTIONS PRODUCTION PUNCH TOOLS
Product Catalogue
Table of Contents
ABOUT US
Cardmatix Company Profile Key Markets & Products
ARIES SERIES
An introduction to and overview of Cardmatix
Multi-Functional Milling & Embedding Machines
MME-04 Fully featured Milling and Embedding Machine
MERCURY SERIES Single Process High-Speed Milling & Embedding
MSM-124
MSE-124
GTL-03
MultiSIM Cavity Milling MultiSIM Module Embedding High-Speed Glue Tape Laminator
GEMINI SERIES Card Scoring & Punching Machines for SIM Cards & Other Formats.
GSM-124 MultiSIM Punch Machine GSM-7000 SIM Punch Machine IDSP-01 ID Slot Punching & Scoring Machine
DUET SERIES Dual Interface Card Production Machines
WirePRO
MPM-01
APM-01
CEM-01
Dual Interface Milling and Embedding Machine Dual Interface Module Preparation Dual Interface Antenna Preparation Dual Interface Module Embedding
APOLLO SERIES RF Inlay Production Line
WEM-01 Antenna Wire Embedding Machine
ARGO SERIES Utility Tools & Consumables
MTS-01
SCMB
CQM SERIES
COM
CTS-01
IMS-01
MCM-01
IST-01
TM-403
TM-404
TM-406
TM-408
TM-409
TM-410-C
TM-410-E
TM-411
TM-412-P
TM-412
TM-414
TM-416
Module Tape Splicer Solid Carbide Milling Bits
Test Equippment for MasterCard's CQM Program
Introduction Card Testing System Inlay Measurement System Module Counting Machine RF Inlay Sheet Tester Height & Width Gauge Thickness Gauge Corner Stencil Bending Stiffness Tester Clamping Fixtures for Durability Test Card Warpage Ramp Embossed Card Warpage Ramp Cantilever Fixture Peel Strength Preparation Tool Peel Strength Tester Dynamic Bending & Torsion Tester Impact Resistance Tester
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Table of Contents
CQMSERIES
TM-417
TM-421
TM-422
TM-423-P
TM-423
TM-427
Test Equipment for MasterCard CQM Program
Corner Impact Test Fixture
Three Wheel Tester
Mechanical Reliability Wrapping Tool
Preparation Tool for Module Spot Pressure Test
Back of Card Spot Pressure Test Fixture
Digital Three Wheel Tester
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About Us
Founding: Cardmatix was estab
lished in 2002 to focus on the manu
facturing of equipment for the produc
tion and testing of contact, contact
less, and dual interface smart cards
for the world market.
We are headquartered in a 4000m2
R&D and manufacturing facility with a
staff of about 100 employees, located
one hour from the Hong Kong border
in Dongguan China.
Our design goal is a balance of
speed, features, and reliability, at a
price you can afford backed up by
an experienced customer support
team.
Philosophy: We believe that satisfy
ing your end card customers should
guide our product design.
We know that your success depends
on providing cards at a good price,
with short lead times - while keeping
shipping dates firm, and not making
mistakes.
Reputation: Durable, high speed
machines engineered for easy main
tenance and years of reliable service.
With over a decade of of experience,
our engineers and technical support
staff are proud that they have earned
a reputation for reliable products and
strong ongoing technical support.
Service: Today, leading card makers
trust Cardmatix equipment to build
and maintain their reputations for
supplying high quality smart cards.
Cardmatix customers know that we
will do whatever it takes to make sure
their equipment performs when they
need it most.
1
lnnovation:The truth is, we owe
many of our innovations and improve
ments to our customers, who are
always looking for ways to improve -
and who have more knowledge of the
day to day process than any machine
maker ever could.
Developing close relationships with
maintenance and production manag
ers has given Cardmatix an edge - as
our best ideas are often thanks to
their generous input and collaborative
approach to R&D.
Manufacturing: To ensure tight
process control, Cardmatix maintains
extensive in-house engineering and
machine processing departments -
equipped with CNC's, vertical milling
machines, wire cutters, lathes,
precision grinders, sheet metal
bending and cutting, and a welding
shop.
Engineering, processing, assembly,
testing, and customer training are
all done in-house.
Dual Interface: Cardmatix is widely
known for its patented Direct Bond
Method for making dual interface
cards. It is the first choice of most
Chinese card manufacturers
The Cardmatix DUET Direct Bond
Method now easily accounts for the
issuance of over a billion dual inter
face cards in China and surrounding
Asia Pacific.
Milling & Embedding: Our most
popular production machine today is
the MME-04 Milling and Embedding
Machine, which sets a new standard
for price and reliability.
Developed with extensive input from
leading card makers, and available
with a wide variety of advanced
options, we feel there is no better
choice in the market for a all-in-one
solution for smart card milling and
embedding.
SIM Punching: SIM card production
has evolved very quickly over the last
five years to accommodate many
different form factors and Cardmatix
has kept up.
Multi-SIM Punching: Along side our
popular multi-SIM milling and embed
ding machines, Cardmatix has a very
strong line up of versatile punch
machines for making single, dual &
quad SIM cards.
Card Testing: With a customer list
that includes over 70% of the world
wide Visa/MasterCard certified card
makers, Cardmatix is the world's
leading supplier of bank card testing
equipment.
2
The ARIES Series All-In-One Milling & Embedding
ARIES MME-04
Smart Card Milling & Embedding Machine
• Single Cavity Milling• Module Embedding• Automatic Changing Magazines• Glue Tape Laminator• Card Orientation Monitoring• Cavity Depth Measurement• Module Height Measurement• lnline ATR Testing
Output: 3800+CPH Voltage: 380VAC 50/60Hz Power: 7.5kW Compressed Air: 6kg/cm2 150 L/min Dims: [L]2480mm [W]830mm [H]1950mm Multimedia: G Video link
ARIES MME-04
Stations
Perfect for a wide range of smart card production needs where speed, flexibility, and high efficiency are required.
The MME-04 sets the standard for value, speed, and reliability in a turn-key smart card solution
Four Auto-Changing Magazines:
Optional configuration with auto changing dual magazine input and dual magazine output for maximum runtime.
Card Orientation: An optional sensor that ensures cards are loaded in the correct orientation and are of the correct version - preventing costly mistakes during production.
Cavity Milling: Two high speed milling stations for accurate, clean, cavities. Mitsubishi servo control for peak performance, milling accuracy and yield.
Glue Tape Laminator: Optional station for punching and laminating glue tape to the module tape.
Cavity Cleaning: Powerful cleaning station with a powerful vacuum and rotating brushes ensure all cavities are free from milling debris.
Cavity Depth & Module Height Test:
Optional inline precision gauges from Keyence accurately measure cavity milling depth and/or module height, ensuring high-quality production output.
ARIES MME-04
Card Orientation Sensor
Embedding Stations: Three hot-presses and one cold-press, designed to swing open for easy maintenance and tooling changes.
The MME-04 can be delivered with optional fourth hot-press station. Manual adjustment of pressure or optional PLC-controlled pressure with digital force indication.
lnline ATR Testing: Installed to ensure proper operation of modules after embedding.
lnline ATS Testing: Option available for dual-inteface card production.
Vision Inspection: Optional station for checking of module positioning and blemishes .
3
The MERCU MultiSIM Milling & Em
R'( Senes bedding Graphics
MSM & MSE M
High-S . ult1SIM -124
peed Milling & E b m edding
�SM MultiSIM-124Smgle-SIM
Cavity Milling
Dual-SIM
Cavity Milling
Quad-SIM
Cavity Milling
�SE MultiSIM-124Smgle-SIM
Module Embedding
Dual-SIM
Module Embedding
Quad-SIM
Module Embedding
4
The MERCURY Series Multi-SIM Cavity Milling
MERCURY MultiSIM MSM-124
MultiSIM Cavity Milling Machine
• Single SIM Cavity Milling
• Dual SIM Cavity Milling
• Quad SIM Milling
• Automatic Changing Magazines
• Cavity Depth Measurement
• Card Orientation Monitoring
Output: 6000 + Cavities Per Hour
Voltage: 380VAC 50/60Hz
Power: 5.5kW
Compressed Air: 6kg/cm2 130 L/min
Dims: [L]2700mm [W]980mm
[H]1930mm
Multimedia: GVideo link
MERCURY MultiSIM MSM-124
Stations
Perfect for SIM card production -
where speed, flexibility, and high
efficiency are required.
The MSM-124 is the ideal solution for
high-speed cavity milling for Single,
Dual, and Quad SIM cards.
Fast setups for all form factors to
meet the ever changing needs of your
telco customers.
Four Auto-Changing Magazines:
Two input and two output magazines
reduce labor and ensure maximum
output.
Magazines are interchangeable with
the MSE-124 MultiSIM Embedding
Machine for fast loading between
processes.
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Card Orientation: An optional sensor
that ensures cards are loaded in the
correct orientation and are of the
correct version - preventing costly
mistakes during production.
Cavity Miling: Two high speed milling
stations for crisp, clean, cavities.
Easily configurable to mill single, dual
or quad SIM card formats. Mitsubishi
servo control for peak performance,
milling accuracy and yield.
MITSUBISHI PLC Interface:
Field-Proven stability and longterm
reliability are expected with the
Mitsubishi PLC. Quickly configured
with the use of pre-loaded milling
templates for all popular module
types.
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MERCURY MultiSIM MSM-124
Cavity Cleaning Station
Cavity Cleaning: Powerful cleaning
stations with a powerful vacuum and
rotating brushes ensure all cavities
are free from milling debris.
Cavity Depth Test: Optional preci
sion inline measurement gauges from
Keyence accurately measure cavity
milling depth, ensuring the quality of
cards delivered for module embed
ding.
Heavy Duty Industrial Chiller: Quiet,
heavy duty cooling technology keeps
the milling stations cool and stable for
years to come.
5
The MERCURY Series Multi-SIM Module Embedding
MERCURY MultiSIM MSE-124
MultiSIM Module Embedding Machine
• Automatic Changing Magazines
• Card Orientation Monitoring
• Single SIM Module Embedding
• Dual SIM Module Embedding
• Quad SIM Module Embedding
• Module Height Measurement
• 1-2-4 Module ATR Testing
Output: 6000 + Modules Per Hour
Voltage: 220VAC 50/60Hz
Power: 4.5kW
Compressed Air: 6kg/cm2 150 L/min
Dims: [L]3320mm [W)980mm [H)1930mm
Multimedia: GVideo link
MERCURY MultiSIM MSE-124
Stations
Perfect for SIM card production -
where speed, flexibility, and high
efficiency are required.
The MSE-124 is the ideal solution for
high-speed module embedding for
Single, Dual, and Quad SIM cards.
Fast setups for all form factors to
meet the ever changing needs of your
telco customers.
Four Auto-Charging Magazines:
Two input and two output magazines
reduce labor and ensure maximum
output. Magazines are interchange
able with the MSE-124 MultiSIM
Milling Machine for fast loading
between processes.
Card Orientation: An optional sensor
that ensures cards are loaded in the
correct orientation and are of the
correct version - preventing costly
mistakes during production.
Module Punch: HSS Tool Steel is
used for precision module punching.
Easy changeover with M2 and M3
module size tooling integrated into
one tool/punching station.
Module Pick & Place: Unique new
dual pick and place stations. Engi
neered for flexibility to quickly change
from single, dual, or quad sim module
placement.
MERCURY MultiSIM MSE-124
Pick & Place Station
Hot & Cold Pressers: To ensure the
best bond and highest yields across
all form factors, the MSE-124 features
twelve hot-pressing stations and four
cold-pressing stations. The new
hinged design allows for easy mainte
nance and setups of embedding
tooling.
Module Height Measurement:
Optional precision inline measure
ment gauges from Keyence accurate
ly measure module height after
embedding.
MultiSIM ATR Test: Custom
designed station for ATR testing on
single, double, and quad SIM cards.
6
The MERCURY Series High-Speed Glue Tape Lamination
MERCURY GTL-03
High-Speed Glue Tape Laminator
• Glue Tape Punch• Glue Tape Lamination
Output: 22,000 M3 Modules/Hr 15,000 M4 Modules/Hr Voltage: 220VAC 50/60Hz Power: 0.8 kW Compressed Air: 6kg/cm2 80 Umin Dims: [L]2010mm [W]730mm [H]1830mmMultimedia: (!)Video link
MERCURY GTL-03
Glue Tape Punching Station
The MERCURY high-speed series includes separate machines for cavity milling, module embedding, and glue tape application. These machines are engineered to work independently at a a market dominating pace.
The GTL-03 is a heavy-duty high speed glue tape laminator with an economical price point. It will give you the speed and reliability required for those large projects where every efficiency counts.
Glue Tape Punch: For trimming glue tape and paper carrier to match the module tape profile. Japanese HSS tool steel is used to make customized tooling for virtually any type of module tape - from SIM to Dual Interface modules.
MERCURY GTL-03
Module Reel
Dual Format Tooling (for example, M2 and M3) so changing between module types is fast and easy, requiring only a manual switch and a touch screen selection.
Adjustable Heat & Cycle Time:
Programmable temperature and lamination time to ensure maximum compatibility with a wide variety of glue tape suppliers.
Heating Elements: T he GTL-03 is equipped with an dual ceramic heating elements and an Omron PIO temperature controller for precise temperature control and long life.
MERCURY GTL-03
Glue Tape Lamination Station
Heat is applied to the top and bottom of the module tape to achieve the consistent application of glue tape.
Tape Detection Sensors: Sensors detect both the presence of glue tape and modules to ensure optimal production control.
PLC Control: Mitsubishi PLC for reliable field proven machine control.
7
The GEMINI Series Multi-SIM Punch & Scoring - SIM Cards
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Quad SIM
/
Half Card
Re-pluggable SIM
8
The GEMINI Series MultiSIM Punching & Separation
GEMINI GSM-124
MultiSIM Punching Machine
• SIM Punch• Single SIM Cards• Dual SIM Cards• Quad SIM Cards• Quad SIM Separation Station
Output: 6000 + Cavities Per Hour Voltage: 380VAC 50/60Hz Power: 5.SkW Compressed Air: 6kg/cm2 130 L/min Dims: [L]2700mm [W]980mm [H]1930mm Multimedia: (!>Video link
GEMINI GSM-124
Stations
The GSM-124 MultiSIM Punch is designed for GSM cards - a single machine engineered to be flexible enough to handle today's challenges -but also adapt to the ones we don't know about yet. This is a massive machine, equipped with six inline 1.SkW electrical servo motors for punching and scoring any card job you throw at it. One look and you will know it has the power and speed to get the toughest card punching jobs done. It's a machine we are proud to offer - and you will be proud to own.
Set Up: Our new design allows for punch tooling to be removed and replaced with four screws, allowing for lightning-speed reconfiguration.
Speed: All speeds indicated are for re-pluggable type, Cambi SIM: (2FF, 3FF, 4FF):
Format
Single SIM Card Dual SIM Card Quad Card Half Card Quarter SIM Card
SIMs/Hr
6,000 10,000 20,000
8,000 11,000
Punch Stations: Equipped with six Mitsubishi 1.SkW servos with heavy duty gear box. Suitable for punching or scoring.
Card Check: lnline sensor checks for card orientation.
GEMINI GSM-124
SIM Punching Stations
Input: Comes with 500 card removable magazine with the option to double up with dual auto changing magazine configuration.
Output:Two horizontal trays holding 1000 cards for manual unloading, and also, two separate and removable magazines for Quad Cards.
Punch Waste: Each punch station's waste is collected into a central collection point.
Independent Stations: Each punch station can be used for both punching or scoring and can be individually turned on or off from the user interface.
9
The GEMINI Series SIM Punching & Scoring
GEMINI GSM-7000
SIM Punching Machine
• SIM Punch• Single Sim Punch• DualSim Punch• Dual Electrical Cutting Heads• Card Orientation Error Detection
Output: 7000 Cards/Hr Voltage: 220VAC 50/60Hz Power: 2.6kW Compressed Air: 6kg/cm2 11 O Umin Multimedia: (!)Video link
GEMINI GSM-7000
SIM Punching Station
The GEMINI Series features flexible configurations for single or multiSIM production while still maintaining the precise tolerances and high throughput needed.
The GEMINI GSM-7000 sets the standard for value, speed, and reliability. It is perfect for companies looking to enter the market or add capacity.
Optional customized tooling is reasonably priced and designed for quick changeovers from one SIM plug configuration to the next.
GEMINI GSM-7000
SIM Scoring Station
Punch Stations: Four Mitsubishi electrical punch stations drive dual cutting heads to ensure a cleanly cut SIM plug with precise scoring cuts for an easy release.
Capable of producing single, double and quad SIM plug cards in a wide array of shapes and sizes.
GSM-7000 is efficiently designed for small footprint that delivers high output.
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GEMINI GSM-7000
Single & Dual SIM Card
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The GEMINI Series ID Card Slot Hole Scoring & Punching
GEMINI IDSP-01
• ID Card Slot Punch
• Full Face Punching
• Full Face Scoring
• 1000 Card Shingling Output
Output: 3000 Cards per Hour
Voltage: 220VAC 50/60Hz
Power: 0.8kW
Weight: 320kg
Compressed Air: 6kg/cm2 150 Umin
Dims: [L)1145mm [W]693mm
[H]1475mm
Multimedia: G Video link
GEMINI IDSP-01
Input Magazine
Designed for customers needing a
heavy-duty professional solution for
slot punching ID cards. The IDSP-01
can be run as hard as you need.
Input: Manually fed 500 card hopper
or optional removable magazines that
can be loaded off-line.
Tooling Design: The tooling is based
on long lasting tool steel and can
punch or score the full face area of
the card.
Heavy Duty Punch Station: The
punch station is powered by a
heavy-duty 750W servo motor that
with built-in capacity for larger punch
ing requirements.
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GEMINI IDSP-01
Scoring & Punching Station
•
Scoring or Punching: The tooling
and punch station design can be
used to punch or score cards ac
curately.
Output: Extended high-capacity
shingling output with a capacity for
1000 cards allows one operator to run
several machines. Shingling output
also allows for many non-standard
card shapes to be managed.
Custom Tooling: Order customized
tooling to meet the needs of your
project. Punch tooling is easily and
quickly changed.
GEMINI IDSP-01
Output
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I I I I I I l
The DUET Wire PRO Direct Solder™ Dual Interface Process
In the last five years, over 1.5 billion
bank cards were made with the
Direct-SolderTM method.
Wire PRO Dual Interface Process
Cavity Milling
The Wire PRO is equipped with three
cavity milling stations to accurately
expose the antenna for removal and
then forming the final module cavity.
Antenna Preparation
Using vision controlled robotics, the
antenna leeds are QC checked and
their location is sent to a robot picking
device that pulls them from the
module cavity in preparation for the
bonding station.
Direct-Solder
Antenna leads are direct-soldered to
the dual interface module using
thermal compression method. Module
antenna pads are pre-soldered in a
separate process ..
Wire Dressing
The antenna leeds are folded under
the module in preparation for the
embedding station
Module Embedding
The traditional process of embedding
the module into the card body with a
standard glue tape lamination
process.
12
The DUET Series Dual Interface Milling & Embedding
DUET Wire PRO™
Dual Interface Milling & Embedding
• Direct Solder Process
• Cavity Milling
• Module Embedding
• ATR & ATS Testing
Output: 2500-3000 CPH
Voltage: 380VAC 50/60 Hz
Power: 11kW
Compressed Air: 6kg/cm2 220 Umin
Dims: [L]4900mm [W]1050mm
[H]1950mm
Multimedia: G Video Link
DUET Wire PRO
Stations
Developed by Cardmatix, the patent
ed Direct-Solder Process drives the
production of over 500 million dual
interface banking cards a year.
No other process offers the RF
performance, longevity, or durability of
a solder connection. A direct-solder
connection does not impair RF
performance, and will not decay or
change with time.
The Direct-Solder Method is the
process of soldering a copper wire
antenna embedded within the card
body directly to wire antenna pads on
the back of the dual interface module.
Consumables: There are no hidden
costs or complicated logistics associ
ated with sourcing proprietary glues,
inlays, or special module designs.
DUET Wire PRO
Antena Preparation
Removable Magazines: Attach or
detach magazines for easy loading
and unloading of cards.
Cavity Milling: The WirePRO is
equipped with three cavity milling
stations to expose the antenna and
then form the final module cavity.
Antenna Preparation: Using vision
controlled robotics, the antenna leeds
are located, QC checked, and pulled
from the cavity.
Direct-Solder: Antenna leeds are
soldered to the dual interface module
using thermal compression method.
Wire Dressing: The antenna leeds
are folded under the module.
•
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DUET Wire PRO
Module Embedding
DUET Wire PRO
HD Vision Inspection
-
Module Embedding - is the process
of embedding the module into the
card body with the hot-melt glue tape
lamination process with three
hot-pressers and one cold presser.
Glue Tape: The WirePRO uses
traditional hot-melt glue tape com
monly available on the market.
ATS: Contactless interface function
ing is tested first after antenna
connection, and again after module
embedding.
ATR: Contact interface functioning is
tested after embedding.
13
The DUET Series Dual Interface Milling & Embedding
Module Antenna
Preparation Preparation
DUET MPM-01
Direct
Solder
Dual Interface Module Preparation
• Pre-Solder
• Leveling Solder Bump
• Glue Tape
Output: 2400 Modules/Hr
Voltage: 380VAC 50/60 Hz
Power: 5.1 kW
Compressed Air: 6kg/cm2 130 L/min
The fully automatic MPM-01 prepares
modules while they are still in tape
form by first 'tinning' or pre-soldering
the antenna connection pads.
The tinning process leaves a solder
bump on the antenna pads which is
milled to a consistent height for
precise attachment of the antenna
leads on the CEM-01. Traditional
hot-melt glue tape is applied in the
same production pass.
Wire
Dressing
DUET APM-01
Module
Embedding
Dual Interface Antenna Preparation
• Cavity Milling
• Antenna Preparation
• Antenna Pulling
Output: 1200 Cards/Hr
Voltage: 380VAC 50/60 Hz
Power: 10.2kW
Compressed Air: 6kg/cm2 220 L/min
The semi-automatic DUET APM-01
mills the module cavity and prepares
the antenna for soldering to the dual
interface module.
This machine was designed specifi
cally to be added as an upgrade to
existing CEM-01 's to fully automate
the DUET direct-solder process.
DUET Direct-Solder Technology
from Cardmatix drives the most
reliable method for manufacturing
dual interface cards in the industry.
The DUET Series of dual interface
production lines are offered in both
fully automatic and semi-automatic
versions.
Both require the use of the MPM-01
automatic module preparation
machine.
DUET CEM-01
Dual Interface Module Embedding
• Antenna Soldering
• Module Embedding
Output: 1200 Cards/Hr
Voltage: 220VAC 50/60 Hz
Power: 3.7kW
Compressed Air: 6kg/cm2 90 L/min
The semi-automatic DUET CEM-01 is
used to attach the antenna wires to
the pads on the back of the dual
interface smart card module.
Antenna soldering is done with TC
bonding technology to ensure a high
quality physical connection between
antenna and module.
14
The APOLLO Series Contactless Wire Embedding
APOLLO WEM-01
Wire Embedding Machine
• Ultrasonic Wire Embedding
• Contactless Inlay Production
• PC Programmable
Output: Up to 2,400 Standard
Mifare Coils/Hr
Voltage: 220VAC 50/60Hz
Power: 3kW
Compressed Air: 6kg/cm2
Dims: [L]16000mm [W)1100mm
[H]1800mm
APOLLO WEM-01
WEM-01 Configured for Ten Wire Embedding Heads
The WEM-01 Wire Embedding
Machine is the ideal solution for
making your own RF inlays for cards,
passports, and tokens.
Formats: The WEM-01 is user
configurable, (depending on the
number of embedding heads ordered)
for any inlay format from 1 to 50
antennae per sheet - with up to a
500mm x 610mm sheet size.
Speed: Wire embedding speed best
referenced as the cycle time to
embed a standard five coil antenna
as would be used for a standard ISO
Mifare card. The WEM-01 will com
plete a single cycle in 15 seconds.
WEM-01 with a 10 head configuration
outputs 2,400 antennae per hour.
Note that antenna shape and size can
vary the cycle time.
Embedding Plates: Heavy duty,
10mm thick, stainless steel with
registration pins, magnets, or an
optional vacuum system to register
and hold sheets in position.
Accuracy: Using Mitsubishi servos
and HIWIN screw drives and rails the
WEM-01 maintains an accuracy of +/-
10 microns.
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APOLLO WEM-01
Inlay Sheet Formats
PC Control: Antenna design specifi
cations are imported via a USS stick
into a PC control system for easy to
manage control of unlimited projects.
Sheet Materials: Compatible with all
standard inlay materials such as PVC,
PEG, ABS. Sheet thickness from 130
µm to 300µm can be accommodated.
Antenna Wire: Compatible with all
industry standard copper and copper
alloy wire types ranging in thickness
from 1 00µm to 160µm.
15
The ARGO Series Module Tape Cutting & Splicing
ARGO MTS-01
Module Tape Splicer
• Precision Cutter
• Tape Splicer
The MTS-01 is small mechanical
device tailor-made to maximize your
module tape inventory.
Designed for accurate, fast and easy
splicing of module tape, this tool
makes a quick job is of connecting
two pieces of module tape together or
attaching module tape to leader tape.
ARGO MTS-01
Cut
The MTS-01 accuracy maximizes
the potential of existing module stock
and its ergonomic portable design
makes module splicing accessible
anywhere on the factory floor.
ARGO MTS-01
Place
High quality tooling aligns modules,
punches sprocket wholes in splicing
tape, and punches reject wholes in
the modules located at the splice
point.
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Available for standard M2 or M3
modules. Specify module type when
ordering.
16
The CQM Series
Market Leader: Building a reputation
for quality smart card production
means having the right measurement
tools at a price that makes sense.
Today we are proud to count most of
the wold's Visa/MasterCard certified
facilities as our customers, making
Cardmatix the leading supplier of
COM testing equipment.
Cardmatix designed the COM series
to meet testing requirements of
third-party certification authorities
using standards derived from
1S0/IEC, ANSI/INCITS, and Master
Card COM.
Custom Designs: Share your ideas
with Cardmatix. We welcome the
opportunity to make customized
versions of the products you see here
based on your unique requirements.
Special Requests: Upon special
request, we have supplied equipment
for tests that exceed standards as
well as for other products such as
card RF inlays, passports, powered
cards, and GSM cards.
Audit-Proven Confidence: Our
product designs have been proven
through hundreds of quality audits
around the world. You can be confi
dent that Cardmatix will meet your
requirements.
18
The CQM Series Card Testing System
COM CTS-01
Card Testing System
• Bending / Module Adhesion
• RF Frequency & Q Factor
• Module Height Measurement
• ATR & ATS Testing
Output: 5000-6000 Cards/Hr
Voltage: 220VAC 50/60Hz
Power: 2.SkW
Compressed Air: 6kg/cm2 150 L/min
Dims: [L]2480mm [W]830mm
[H]1950mm
Multimedia: GVideo link
COM CTS-01
ATR & ATS Stations
Protect your reputation for quality
assurance with the CTS-01, the ideal
solution for high-speed, automated
testing of dual-interface, contact, and
contactless smart cards.
It tests module bonding, antenna
connections, RF stability, and func
tionality of contact and contactless
interfaces.
Card Flexing: The card body is
flexed 30° across the module embed
ding area. Laser sensors detect
separation between module and
cavity - rejecting cards with poor
adhesion.
Flexing prior to RF testing also helps
to ensure that the connection
between antenna and module is
secure.
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COM CTS-01
Card Flexing Stations
RF Testing: Build customer confi
dence with guaranteed delivery of
cards within a set RF range. Two
Rigel spectrum analyzers provide
accurate frequency and Q-Factor test
results. Custom Smartware<TMJ testers
for additional analysis are available.
Removable Magazines: Input and
output magazines are interchange
able and can be used with other
Cardmatix machines for easier
loading with less handling.
Module Height Test: lnline gauges
from Keyence accurately measure
embedded module height, ensuring
that only good cards make it to the
shipping department.
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COM CTS-01
Card Orientation Sensor
ATR & ATS Testing : Ensure that
contact and/or contactless interfaces
are functioning properly after flex
testing by communicating with the IC
chip. For contactless cards, this may
be the only point during production
when these tests can be performed
economically and at high speed.
Vision Inspection System: An option
that will detect and eliminate anoma
lies related to module alignment and
placement within the cavity; it identi
fies and rejects modules with visible
surface defects such as scratches,
smudges, or fingerprints.
Card Orientation: An optional sensor
that separates cards loaded in the
wrong orientation or version prior to
testing, shipping & personalization.
19
The CQM Series Inlay Measurement
COM IMS-01
Inlay Measurement System
• Inlay Measurement
• Printed Sheet Measurement
Voltage: 220VAC, 50/60Hz
Accuracy: +/- 1 Oµm
Power: 0.3kW
Dims: [L]1058mm [W]1058mm
[H]1720mm
Printed Sheet Size: Maximum sheet
size 600mm x 600mm.
Inlay Sheet Size: Best for and up to
5 x 10 and 7 x 8 formats
COM IMS-01
Stations
The CQM IMS-01 is a heavy-duty
precision linear measurement system
for measuring flat surfaces such as
inlays and printed sheets.
Perfect for inlay production lines
where the positioning of registration
holes, guide marks and embedded
antennas are critical for process
control and general quality control
management.
Vision Inspection: HD Vision
Inspection Camera with 20x
magnification lens.
•
COM IMS-01
Vision Inspection Processing
Camera Control: Rods and rails from
HIWIN (Taiwan) with joystick and
manual control inputs.
Measurement Controller: SOXIN
SX2088-2V measurement controller.
Sheet Size: Maximum sheet size is
600mm x 600mm. Best for and up to
5 x10 and 7 x 8 inlay sheet formats.
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COM IMS-01
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SOXIN SX2088-2V Controller
20
The CQM Series Module Counting & Testing
COM MCM-01
Module Counting Machine
• Reel-to-Reel Module Tape Counter
• Automatic Module Tape Rewind
• Real-Time Reports on Module Viability
• Marks Tape at Programable Quantity Intervals
Output: 8 Pin Modules -70,000 Units/Hr
6 Pin Modules -100,000 Units/Hr
Voltage: 220VAC, 50Hz
Power: 1.5kW
Weight: 128 kg
Dims: [L]1580mm [W]550mm
[H]1760mm
Multimedia: G Video link
COM MCM-01
Stations
Automate your module tape inventory
with vision inspection technology. The
MCM-01 makes counting and rewind
ing module tape fast and easy.
It is designed to:
Generate Reports showing good,
rejected & total quantity for each
module tape reel.
Confirm Incoming Inventory on
modules received from suppliers -
prior to entry into your inventory.
Program Reel Splicing: Program
the splicing of module tape reels into
smaller designated quantities to be
issued from warehouse to production
by project or work group.
COM MCM-01
Ink Stamping Station
Partial Auditing partial module tape
reels returned into inventory from
production.
Split Reels: Splitting module tape
reels into smaller programmable
quantities to be sold separately.
Security Auditing module tape use
for bank cards.
Instant Replay quickly rewinds
module tape reels to reverse module
orientation after counting or after glue
tape application.
Ink Stamping: MCM-01 ink stamping
system marks module tape in
programmable quantity intervals
allowing for easy splitting of reels.
_____ ____,
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COM MCM-01
HD Vision Inspection
Vision Inspection: MCM-01 uses
vision inspection technology to
accurately count modules on tape
using pattern recognition. Good and
rejected modules are identified and
recorded separately (with the hole
punch).
User Programmable Templates:
MCM-01 is compatible with most
30mm module tapes and suppliers.
User-programable templates are
designed to be compatible with the
next generation of module tape
technology.
21
COM IST-01
RF Inlay Sheet Tester
COM TM-403
Height & Width Gauge
COM TM-404
Thickness Gauge
COM TM-406
Corner Stencil
The corner stencil is used to quickly
and accurately evaluate the card
body corner radius as well as the
location of card features like IC
module, magstripe, hologram, signa
ture panel, or personalization.
A reference template is included, but
this tool is specifically designed for
customers that want to create and
mount their own templates to the
fixture. This can be easily done in any
pre-press department.
The IST-01 is perfect for incoming
material conformance testing
programs as well as helping to avoid
costly mistakes related to mixed up
inlay inventories and improper
lamination settings.
Each unit is custom configured to
your sheet format. A matrix of bi-col
ored red/green LEDs quickly indicate
the Pass-Fail test results of each
transponder location on the inlay.
A quick and accurate method to
measure card body width and height
according to CQM test requirements.
Two digital indicator gauges are
integrated within a solid stainless
steel fixture designed to conveniently
hold a card body in place for precise
measurements. One gauge is dedi
cated for measuring height and the
other width.
A quick and accurate way to measure
card body thickness and embossed
character relief height according to
CQM test requirements.
This fixture is designed with a digital
indicator gauge with a low-force
probe, integrated into a fixture that
conveniently holds a card body in
place during the measurement of
thickness and embossed relief.
Standard Reference: Med
COM Test Reference: 13.2.1 .15
COM Test Method: TM-406
RF Transponder Compatibility:
ISO 14443 Type A and B [proximity]
Mifare Ultralight C, Classic 1 K,
Classic 4K, Plus, Desfire EV1,
AT888SCxxxxCRF, ICODE1
SL 1 ICS30, ICODE SLI SL2 ICS20.
Power: 110/220VAC 50/60 Hz.
Supplied with stainless steel calibra
tion block (85,595 mm x 53,975 mm).
Fixture is milled from stainless steel
bar stock for durability and a long
lasting finish.
Standard Reference: ISO 7810
-10373-1
COM Test Method:13.2.1.12
TM-403: Width and Height
The fixture is milled from stainless
steel bar stock for durability and a
long lasting finish.
Standard Reference: ISO 7810
-10373-1, ISO 7816.
COM Test Method:13.2.1.13
TM-401 : Relative Height of Contacts;
TM-404: Card Thickness; TM-405:
Thickness Within Add-on Areas.
22
COM TM-408
Bending Stiffness Tester
COM TM-409-2
Clamping Fixtures for Durability Test
COM TM-410
Card Warpage Ramp (TM-410-C)
Embossed Card Warpage Ramp
(TM-410-E)
COM TM-411
Cantilever Fixture
This fixture holds 3 cards in a cantile
vered position during high tempera
ture storage in an oven. Card mount
ing is exactly according to the specifi
cation and placement is a snap with
two large tensioning knobs.
It includes a sliding steel ruler for
measuring deformation after testing.
Crafted from aircraft grade 6061
aluminum alloy bar stock, electrostati
cally coated for a long-lasting finish.
This fixture is designed to hold a test
card in a cantilevered position. Card
placement is a snap with a large
tensioning knob.
Once clamped in the test position, a
stainless steel weight - calibrated to
apply a force of 0,7N - is applied on
the opposite edge of the card body.
The resulting deformation is mea
sured using the integrated ruler.
A set of two fixtures recommended for
holding a card body in a stressed
position during durability testing
within a climate chamber.
One fixture is designed to hold a card
stressed at its horizontal axis ( 15 +/-
1 mm), while the other holds a card
with the stress on the vertical axis (30
+/- 1 mm).
This fixture is a gravity-fed ramp with
defined gaps for the quick in-produc
tion Pass/Fail testing of overall card
warpage.
The ramp gap is calibrated to quickly
identify unembossed cards with an
overall warpage exceeding 1,5mm. A
secondary gap identifies cards with
warpage exceeding 1,3mm.
Crafted from aircraft grade 6061
aluminum alloy bar stock and and
electrostatically coated for a durable
long-lasting finish.
Crafted from aircraft grade 6061
aluminum alloy bar stock and electro
statically coated for a durable
long-lasting finish. Fittings and test
weight are made of stainless steel.
Standard Reference: ISO 7810 -
10373-1
COM Test Reference: TM-408
COM Test Method: 13.2.1 .17
TM-408: Bending Stiffness
Crafted from solid blocks of aircraft
grade 6061 aluminum alloy bar stock
and electrostatically coated for a
durable long-lasting finish.
Standard Reference: ISO 781 O
-10373-1
COM Test Reference:TM-409-2
COM Test Method: 8.1.1 TM-409-2:
Stability under temperature and
humidity
Crafted from aircraft grade 6061
aluminum alloy bar stock and and
electrostatically coated for a durable
long-lasting finish.
Standard Reference: ISO 7810 -
10373-1
COM Test Reference: TM-41 O
COM Test Method: 13.2.1 .20
TM-410: Overall Card Warpage
Standard Reference: ISO 7810 -
10373-1
COM Test Reference: TM-411
COM Test Method: 13.2.1.21
TM-411 : Resistance to Heat
23
COM TM-412-P
Peel Strength Test Preparation Tool
COM TM-412
Peel Strength Tester
T his newly designed peel strength
tester has been built specifically for
testing the peel strength bond
between overlay and card body
according to ISO 10373 in a compact
footprint to save desk space.
T he fixture controls are simple and
have been placed on a remote control
for easy testing of many sample strips
from a comfortable seated position.
T he vertical movement of the test
gauge is set once and will move to the
the force gauge to the upper and
lower limits of the test without having
to monitor or make further adjustment.
T he test grip has been redesigned to
make it fast and easy to mount and
remove test strips quickly without
force.
COM TM-413
Adhesion & Blocking Test Fixture
T his test fixture is designed to hold a
stack of cards under a calibrated
weight to measure their resistance to
adhesion and blocking.
Milled from stainless steel bar stock
for durable long-lasting finish.
Fittings and test weight are stainless
steel.
The Peel Strength Preparation Tool is
designed to prepare card bodies for
the TM-412 Peel Strength Test. It will
make precise, easily repeatable cuts,
safely and quickly.
Simply place the test card on the
positioning plate and use horizontal
and vertical cutting heads to prepare
four test strips 10 mm wide +/- 0.2
mm. It also makes the vertical scoring
cut 10 mm from the vertical edge of
the card as required by the standard.
Test rollers are optimized for easy
loading and unloading of test strips.
A precision force gauge provides
accurate measurements of the force
required to pull the overlay from the
card body. It is supplied with
software that will track your test
results and produce a printout
according to COM requirements.
Voltage: 110 or 220VAC 50/60 Hz;
Software: Windows XP & Windows 7
compatible
Standard Reference: ISO 7810 -
10373-1
COM Test Reference: TM-412
COM Test Method: 13.2.1.22
TM-412: Peel Strength; TM-424:
Advanced Peel Strength Test.
This tool is made of heavy duty
aluminum bar stock and stainless
steel. It will last a life-time. Circular
cutting blades are high quality and
can be easily replaced.
Standard Reference:
ISO/IEC10373-1 :2006(E) Section
5.3.2.
COM Test Reference:TM-412
COM Test Method: TM-412
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Standard Reference: ISO 7810 -
10373-1
COM Test Reference: TM-413
COM Test Method: 13.2.1.23
TM-413: Adhesion & Blocking
24
COM TM-414
Dynamic Bending and Torsion Tester
This "Four-In-One" unit was rede
signed to meet new shortened
bending requirements for IC cards set
forth in COM Requirements Ver 2.2,
2013.
It performs the horizontal, vertical,
shortened and the torsional bending
tests simultaneously. One to five
cards can be tested in each station
for a total of twenty cards in a test
cycle.
COM TM-416
Impact Resistance Tester
Traditional manual test tool designed
according to industry specifications
for card body impact testing.
The TM-416 is configured to quickly
set two drop heights to generate an
impact force of 2000mmN and
10.000mmN.
COM TM-417
Corner Impact Test Fixture
This manual test tool is designed to
measure card's resistance to delami
nation and cracking when subjected
to corner impact.
Safety Feature: Requires two hands
to drop test weight - assuring safe
operation. T he card is secured in the
weighted fixture and released from
the height of 305 mm (12 in).
COM TM-421
Three Wheel Tester
T his completely automated machine
performs the three-wheel test as
outlined in MasterCard's COM
program.
A card is positioned in the machine
such that the the rollers will cycle 100
times over the front (50) and then
back (50) of the IC with a cycle
frequency of 0,5 Hz and a downward
force of 8N.
The TM-414 can be set to stop after
any user-defined number of test
cycles; speed of the bending or
torsion cycles can also be adjusted
by the user, depending on require
ments and calibration.
Power: 110 or 220 VAC 50-60HZ
Standard Reference: ISO 7810,
7816, 10373-1, ISO 24789-2.
COM Test Reference: TM 414, 415
COM Test Method: 13.2.1.24,
13.2.1 .25 Dynamic Bending and
Torsional Stress
Standard Reference: ANSI NCIT S
322 5.7 [ISO 7811-1]
COM Test Reference: TM-416 COM
Test Method: 13.2.1.26 TM-416:
Impact Resistance
Impact weight is calibrated to create
an impact force of 13.3 ± 0.5 N (3.0 ±
0.1 lbf).
TM-417 is made of stainless steel bar
stock for a long-lasting finish. Fittings
and test weights are stainless steel.
Standard Reference: [ANSI NCITS
322 5.20]
COM Test Reference: TM-417
COM Test Method: 13.2.1.27
TM-417: Corner Impact Test
After the test, the IC card should be
intact and function electronically.
An additional weight, for a recom
mended second test, with a force of
15N is also included.
Power: 110 or 220 VAC 50/60 Hz.
Standard Reference: Med
COM Test Reference: TM-421
COM Test Method: 13.2.1.31
TM-421 : Three Wheel Test
C.
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COM TM-422
Mechanical Reliability Wrapping Tool
(Set of Three)
A set of three fixtures designed to
apply local bending stress to an IC
module embedded within a card
body.
The set is supplied with one fixture
each for three different bending
diameter: 50mm, 40mm, and 30mm.
COM TM-423-P
Preparation Tool for Module Spot
Pressure Test
The Back of Card Spot Pressure Test
Preparation Tool is designed to
quickly and easily prepare card
bodies for the TM-423 Spot Pressure
Test. Mount the card body on the
positioning plate and turn the handle
to create a precise hole in the card
body - directly behind the center of
the IC module.
COM TM-423
Back of Card Spot Pressure Test
Fixture
The TM-423 measures the amount of
force required to push a smart card
module from its card body by apply
ing pressure to the back of the
module.
This is done by drilling a 6mm diame
ter cavity in the card body directly
behind the IC module, and using
TM-423-P to apply the force probe
directly to the back of the module until
it detaches from the card body.
COM TM-427
Digital Three Wheel Tester
This digital Three Wheel Tester has
been built specifically to test the
surface of Interactive Cards, which
can contain built in devices like push
buttons, displays, LEDs, but not
necessarily containing a battery.
The test is designed to determine the
mechanical robustness of interactive
This fixture can also be used for the
TM-B02 Embossed Character Relief
Height Retention test. It's manual
design and analog gauge were
specifically chosen to best meet the
requirements of COM and day to day
lab testing.
Standard Reference: Med
COM Test Reference: TM-423
COM Test Method: 13.2.1.33
TM-423: Solidity: Back of Card Spot
Pressure Test TM-423-P Test Cavity
Preparation Tool
cards by moving the IC cyclically
between three steel wheels rolling
over mechanically sensitive areas.
Power: 110 or 220 VAC 50/60 Hz.
Standard Reference: Med
COM Test Reference: TM-427
COM Test Method 13.2.1.37
TM-427: Advanced Three Wheel Test
Crafted from aircraft grade 6061
aluminum alloy bar stock and electro
statically coated for a durable
long-lasting finish.
Standard Reference: Med
COM Test Reference: TM-422
COM Test Method: 13.2.1.32
TM-422: Mechanical Reliability:
Wrapping Test
The TM-423-P comes with two
positioning plates - one for M2 and
one for M3 modules.
Standard Reference: Med
COM Test Method: 13.2.1.33
TM-423: Solidity: Back of Card Spot
Pressure Test TM-423-P Test Cavity
Preparation Tool
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26
Factory HQ:
Cardmatix Ltd. Dongguan China
No.: 109D, Luyuan Road, Tangxia
Dongguan, China
Tel: +86-769-8685-5889
Office:
Cardmatix Ltd. Hong Kong
Unit 1103, 11/F., Trendy Centre
682-684 Castle Peak Road
Kowloon, Hong Kong
[email protected] Website: cardmatix.com