best practices for stem capstone_07_07_15
TRANSCRIPT
Slide 1
Overview of Best Practices for Selecting and Executing STEM Capstone Projects – A guide for
Advisors and Mentors
Art Gooray, PhD
Formerly, Technology Commercialization Program Manager, Eastman
Kodak Co and Xerox Corp
And
Adjunct Technology Based Ventures/Innovation Professor, Wright State
University
• Technology Transfer/Technology Commercialization Focus
• Start to use Common Tools, Metrics and Requirements, in line with R&D Scientists/Engineers and Product Development Partners Commercialization
Capstone Project
Slide 2
Presentation Outline
• Innovation and Tech Commercialization
• Overview of the Time to Market (TTM) End to End
Commercialization Process
• Key Best Practices for Successful Capstone – Staging for
Tech Transfer
Well developed ‘Front End’ to focus R&D - Market, Product, Strategy,
Vision (MAP with VOC, competitive benchmarking, technology and
product platform planning)
Technology Readiness (Maturity) Requirements
Extending the Enterprise (Partnership) Co-development Model - Core
Competencies for Integrated Platform Solution
Capstone Project
Slide 3
Ex: University Partnerships for Effective Capstone Project Execution
School of Business•VOC Analyses
•Market Size, Growth, Trends
•Segmentation
•Competitive
•Analysis
•Core Competencies and Partnership
Analyses
•Business case analyses
•Entrepreneurship/innovation best practices
•Value Proposition
•Vector of Differentiation
•QFD – product specs
• Product Platform
•Technology Platform
•Partnership Plans
•Supply chain plans
•Validate Economic Case
•Technology Commercialization best practices
Market
Analyses
Technology
Solutions
Responses
MAP:
Clarity of Solution roadmap – Technology Platform and Product Platform
Deep Understanding of Market Segments
IP strategy
Initiatives to make the technology set disruptive – Creative thinking
Confirm the Business case analysis – ROI case studies
Evaluate potential issues with the TTM delivery model
Create and implement the various partnership models
All stake holders and value chain partners on the same page early
Accountability
In-depth knowledge of the business – who are the competitors and their strategies, how to gain market share, a long term sustainable plan for growth
Develop benchmarking and performance tracking metrics – time to profitability, slip rate, market share, etc
School of Law- IP
Strategy
Capstone Project
Office of Sponsored Research
Co-Development Commercialization Partners
Schools of Engineering/Arts & Sciences
Slide 4
Benchmarking Companies – Capstone in URQ
Capstone Project
Slide 5
Elements of Capstone Team Integration –I/O/C
Team
Transf.
Function:
-Overcome
Perceptual
Gaps
-Manage focus
-Use
Understandings
-Execute PDM
Input Output
Global
Cross
functional
Incentives
Processes
Capstone Project
Slide 6
KEY INITIATIVES FOR SELECTING AND EXECUTING CAPSTONE PILOT PROJECTS
• Market Attack Plan
• Technology and Product Platform Planning
• Technology Robustness Plan
• Licensing/Tech Transfer
• Partnership Model for Commercialization Integrated Solution
Capstone Project
Slide 7
INNOVATIONAND TECH
COMMERCIALIZATION
Capstone Project
Slide 8
INNOVATION
To Innovate (creating new technologies), first discover things and
then figure out how to put them to good use
Innovation - finding novel solutions to important problems and
as well as the opportunity to create new products and services
Disruptive Innovation –
New applications of existing
means or technologies
R&D Organizations
excellent at the
Discovery Phase
Need to ‘co-develop’
discovery with application
Phases - MAP
Capstone Project focuses on
Successfully Navigating the
Domains
Slide 9
Commercialization Innovation
Entrepreneurship
• The creation of an enterprise or business that has the chance of profit (or success)
• Creating Solutions for existing problems that have a customer need, using a well disciplined process (TTM, continuous feedback)
Technology Commercializing
• Commercialization -The process by which a new product or service is introduced into the general market
• Disruptive technologies introduce a set of attributes to a marketplace different than the ones that mainstream customers historically have valued
Capstone Project
Slide 10
Typical Capstone Design Steps
Assess EvaluateRecomm
end
Plan/
Design
Brainstor
m
MPSV Robustness
Focus on Best Practices for:
• Market, Product, Strategy, Vision (MPSV) - MAP
• Robustness - Technology Readiness Metrics
• Tech Transfer Requirements for Commercialization –
Partnerships for Integrated Platform Solution
Transfer,
License
Capstone Project
OVERVIEW OF END TO END INNOVATION COMMERCIALIZATION
PROCESS
- THE TIME TO MARKET (TTM) PROCESS- CAPSTONE PROJECT FOLLOW THE TTM PROCESS
Slide 12
Typical University Commercialization Process
Capstone Project
Slide 13
slide # 18
PlatformElementProposals
ProductProposals
ProductProposals
MarketAttackPlans
Corporate PlanningProcess
Portfolio Planning,RD&E Prioritization,
and Pipeline Management
MarketAttackPlans
Commercialize SelectMature
Filter Scan
Research Portfolio
Platform Pipeline
Product Pipeline
Deliver Value in Global Markets
Grow Revenue &Profits in Currentand New Markets
Delight Customers
Re
ve
nu
e
Tim e
$ ProductProposals
PlatformElementProposals
CorpMarketPortfolioStrategyVision
GroupMarketPortfolioStrategyVision
Tools / Engineering Environment / Info systems
Management Systems / Decisioning / Metrics
Voice of the Customer / MarketC
apab
ilit
ies
and L
ear
ning
Com
pan
y /
Team
Org
aniz
atio
n /
Cul
ture
Global Markets
Glo
ba
l Eco
no
my
World-wide Supplier Base
All A
vailab
le T
ech
nolo
gies
Com
peti
tion
End to End TTM Phases
Core Competencies / Skills and Knowledge / Resources
Phases 1 & 2- Technology Maturity
Technology Commercialization
Capstone Project
Slide 14
Confirm
Phase 1
Key Requirements for Technology Transfer – MAP, TPP, PPP and Tech Readiness (Phases 0, 1,2)
Product
Vision
Market Attack
Strategy
Platform Strategy
Ph 2Ph 3 Ph 4
Product Pipeline Strategy
Launch
A
ABCDEF
G
B
CD
E
FG
AB
C
DE
F
GH
I
B C D E F GHI
A
B
C
D E
F GA
B C D E F G
A
B C D E F
GH
I
A
B
C
D E F
GH
I A
Reu
se
Balance &
Select
Deliver
TTM SolutionProposal
-MAP
Ph 5
Technology Maturity
TechnologyReadiness
-Transfer
Phase 0
Slide 15
Time-To-Market OverviewPrinciples and Values
The TTM Program is an empowering framework of action that brings together industry best practices, while encouraging innovation enabling tailored implementations to be adapted to a variety of value-added business models.
Robust market-oriented front end for developing the Market and Product Strategy Vision and Market Attack Plans integrated with technology and value chain strategies and plans are fundamental to strategic management of the company
Customer first... focused on understanding what is needed to delight customers and achieve market success, with strong feedback linkages to the process “front end”.
Technology and Value Chain technology elements are matured and delivered, as reusable offering platform elements, through the use of a defined technology delivery process.
Offering-platform-based offering development, delivery and on-going support of the offering offerings in defined target markets over time .
Offering Programs are to be planned at benchmark or best-in-class schedules based on the TTM newness / complexity matrix.
Extensive, continuous use of customer feedback in each phase of the TTM Process.
Organizational learning and knowledge transfer is captured and applied to improve productivity and performance over time.
Capstone Project
BEST PRACTICES CAPSTONE PROJECT
- Market Attack Plan- Delivering Ready Technology
- Staging for Tech Commercialization – Extended Enterprise Partnership Planning
Slide 17
Technology Delivery/Transfer – Staging for Commercialization
Technical Reviews Market Attack
Plan
MPSV
Develop MAP
Document VOC
Prioritization
Assess Business Process
Change Needs
Plan Business Process Changes
Document Gaps to Requirements
Validate Deployment Plan
Share Lessons Learned
Verify
Performance
Enable Benefits
Plan Deployment Develop MPSV
Phase 1.0
Define
Phase 0
MPSV
Phase 4.0
Demonstrate Phase 3.0 (Gate 2)
Design Phase 2.0 (Gate 1)
Define
Phase 5.0
Deliver and Delight
Complete Business Process
Changes
Validate Business Process Changes
Perform Coherence Activities
Create Plan for end user
Solution
Proposal Solution
Definition
Solution Design
Stability
Solution Deployment
Readiness
Solution Production
Readiness
Document Customer
Business Reqs
Document Detail
Requirements
Assess
Technology
Prove
Technology
Validate Technology
Document Business Case
Update Business Case Validate Business Case
Engage Partners
Select Initial
Metrics
Update
Metrics
Commit
Metrics
Validate and Measure
Metrics
Reliability and Service
business
Metrics
MAP
Ready Technology Commercializing Technology
Extended Enterprise/Partnership
Slide 18
What is the Front End – MAP Output
Front End Is:
• Market-based
• Data-driven
• Integrated framework for cross-
functional planning and
execution
• Intended to deliver increased
profitable growth
• Collection of industry best
practices
• Customizable to fit different
situations/business needs
• Internally created strategy to
ensure buy-in
MAP Questions:
• What are competitors offering
• Is there an opportunity For
your Company
• What do we need to do
to take advantage of this
opportunity
• Is this a profitable business
(TTM metrics QCD’s)
Slide 19
Acquire Voice of the Customer (VOC) – Opportunity Exist?
WHO IS MY
CUSTOMER?
GOAL:
UNDERSTAND
AND FOCUS
ON THE VOICE
OF THE
CUSTOMER
Industry AnalysesCustomer ProfilesProduct PositioningMarket Segmentation
ManagersEngineersSales PeopleService Representatives
HOW CAN I
LISTEN?
Competitive Product AnalysesCustomers Surveys1-on-1 Customer InterviewsFocus Group InterviewsComplaints/Failure Analyses
QFD
HOW DO I
INTERPRET?
WHO SHOULD
LISTEN?
Capstone Project
Slide 20
Three Key Items for the TTM ‘Front End’ (MPSV)
S
AN
AL
Y
I S
RE
S
P
O
NS
E
M A R K E T
STRATEGIC BU PARTNERSHIP
Customer NeedsAnalysis
Size, Growth, TrendsSegmentation
CompetitorAnalysis
CompetencyAnalysis
EconomicCase
Value Chain Planssupply chain, channel& marketing programs
Value PropositionVector of Differentiation
Capstone Project
1.Market Attack
Plan (MAP).
Includes
Partnerships
Plans
2.Technology
Platform Plan
3.Product
Platform Plan
Product Lines& Platforms
Slide 21
Develop Upper Right Quadrants (URQs) – IP & Business Strategies
Slide 22
Ex: Upper Right Quadrant
Capstone Project
Slide 23Capstone Project
Ex: Upper Right Quadrant
Slide 24
Scanning SET factors Leads to POGs (Product Opportunity Gap)
Slide 25
Ex: SET Factors for Margaritaville Frozen Concoction Maker
Slide 26
Ex: Part Differentiation Matrix (PDM) for a Vehicle
Slide 27
What is SWOT
SWOT is a summary of your
Strengths
Weaknesses
Opportunities
Threats
Internal
External
Capstone Project
Slide 28
Develop SWOT
Capstone Project
Slide 29
Develop Lean Canvas Project NameDate:
Iteration #x
Cost Structure
Customer Acquisition costs
Distribution costs
Partnerships Integration
People, etc.
Revenue Streams
Revenue Model
Life Time Value
Revenue
Gross Margin
Problem
Top 3 problems
Solution
Top 3 features
Key MetricsKey activities you
measure
Unique Value
PropositionSingle, clear,
compelling message
that states why you are
different and worth
paying attention
Unfair AdvantageCan’t be easily copied
or bought
Channels/Partnershi
psPath to customers
Customer
SegmentsTarget customers
PRODUCT MARKET
Capstone Project
DefinitionsProduct Platform Planning
The PPP is our roadmap for a set of related products with common elements and architecture. They are a way of
organizing thoughts about products and the technologies they contain. Product platforms provide a
meaningful level of aggregation of individual product and technology projects.
Technology Platform Planning
The TPP is our roadmap for core technologies and innovations required to support the PPP and the
MAP. The TPP is a set of projects and initiatives for the development of a technology that will provide the
technical basis for building and sustaining a competitive advantage.
Slide 31
Capstone MAP Table of Contents
Section A: Summary
Section B: Background
I. Strategic Objectives
II. Market Analysis
III. Technology Analysis
IV. Value Chain Analysis
V. Related Initiatives
Section C: Recommendations
I. Target Segments and Vector of Differentiation
II. Product Alternatives
III. Product Offerings
IV. Supporting Value Chain Strategies & Plans
V. Skills and Resources
Section D: Economic Case
Section E: Monitoring Plan
Capstone Project
Slide 32
Identify Technology Delivery Requirements
Requirements for Technology Transfer for Commercialization
• Technology Capability Demonstration Best Practices
• Technology Readiness (Maturity) Best Practices
Capstone Project
Slide 33
DEVELOP TECHNOLOGY ROBUSTNESS PLAN AND METRICS
• Identify all Failure Modes and Control Factors for Failure Modes
• Identify Integration Requirements
• Identify Key Manufacturing Requirements
• Prototype Planning - Description of Integration Performance Testing
Capstone Project
Slide 34
Technology Readiness /
Manufacturing Readiness
Design and Mfg.
Process Stability
Product QCDs
Productivity
Supply Assurance
3Design
& Specify Product
4
Demonstrate Product
6
DelightCustomers
5
Deliver Product
1Define
Product Platform & Technology
3.3 Define
Product
2Define
Product & Deliver
Technology
0
MPSV
Focus:
TTM Technology Delivery Phases
R&D Portfolio Management focuses on Phases 0,
1, 2
(do not preclude concurrent activity in the
technology commercialization delivery process)
Tech Transfer for Commercialization
Capstone Project
Slide 35
Technology Delivery/Transfer – Staging for Commercialization
Technical Reviews Market Attack
Plan
MPSV
Develop MAP
Document VOC
Prioritization
Assess Business Process
Change Needs
Plan Business Process Changes
Document Gaps to Requirements
Validate Deployment Plan
Share Lessons Learned
Verify
Performance
Enable Benefits
Plan Deployment Develop MPSV
Phase 1.0
Define
Phase 0
MPSV
Phase 4.0
Demonstrate Phase 3.0 (Gate 2)
Design Phase 2.0 (Gate 1)
Define
Phase 5.0
Deliver and Delight
Complete Business Process
Changes
Validate Business Process Changes
Perform Coherence Activities
Create Plan for end user
Solution
Proposal Solution
Definition
Solution Design
Stability
Solution Deployment
Readiness
Solution Production
Readiness
Document Customer
Business Reqs
Document Detail
Requirements
Assess
Technology
Prove
Technology
Validate
Technology
Document Business Case
Update Business Case Validate Business Case
Engage Partners
Select Initial
Metrics
Update
Metrics
Commit
Metrics
Validate and Measure
Metrics
Reliability and Service
business
Metrics
MAP
Ready Technology Commercializing Technology
Extended Enterprise/Partnership – Most important Subprocess
Slide 36
Technology Readiness What is Technology Readiness? Do I know how to manufacture a
product capable of the required performance levels at the lowest cost?
Not just an assessment of the goodness of a technology but also how well is it understood, and how the understanding yields lowest cost manufacturing methods. In other words, Technology readiness implies that the centerline of the design capability is centered on the manufacturing variability and the distribution of manufacturing variability remains within the design latitude.
Technology Readiness implies that the assessment of the problems set has been completed and there is no indication that a solution must be invented (beyond normal design engineering practice) for either the design or manufacturing process to achieve the specified performance.
ManufacturingVariability
Design Latitude that YieldsAcceptance Performance
PerformanceFailure
PerformanceFailure
Capstone Project
Slide 37
Tech Readiness Requirements Best Practices
CRITERIA Phase 0 –
Analysis &
Experiments
Phase 1–
Technology
Capability
Demonstrated
Phase 2a -
Technology
Maturity
Capability
Demonstrated
Phase 2b –
Technology
Robustness
Verified
LOW
RISK
CRITERIA
MET
1. Failure
Modes
Modes
Projected.
Test plans
approved
Failure modes
observed under
Nominal short-
run
test conditions
Failure modes
identified under
initial system/
subsystem
life test and stress
conditions
Failure modes
confirmed and
initial testing of
fixes completed
on Integrated
Test Rig (ITR)
Failure mode
solutions
validated
on product intent
hardware.
Criteria and
measurements
met.
2. Critical
Parameter
Development
Parameters
projected
Sensitivity
studies
and optimization
initiated
Critical parameterfirst optimization andsensitivity studiescompleted. Failuremodes controlled indesign intent integrated hardware
Critical parameter
second
optimization
completed and
fixes
to defined failure
modes confirmed.
Critical
parameter
verified on
ITR test.
Criteria and
measurements
met.
3. Latitudes Latitudes
projected
and approach
defined
Process
demonstrated
at nominal set
point
Control parameter
operating windows
defined through
test and analysis
Control parameter
latitude
demonstrated under
environmental and
life stress
conditions.
Control
parameter
latitude verified
on ITR test.
Criteria and
measurements
met.
4.
Manufacturabilit
y
-
manufacturability
confirmed with
partner
Preliminary parts
manufacturability
projected, UMC
goals
concurrence
Evaluate critical
parts
manufacturability
with partner
involvement. New
Mfg. capability
requirements
identified.
Preliminary
evaluation of
projected critical
specification
tolerances
completed.
Process capability
projected.
Tolerance and
variance analysis
of design intent
drawings
completed.
Supplier
confirmation of
manufacturability
of critical
specifications
completed.
Criteria and
measurements
met.
5. Prototype
Performance
Integrated
technology
robustness
demonstrated
Integrated
technology rig
requirements
listed. Hardware
designed.
Hardware built anddebugged. Operability,safety, consumables and environmental plansapproved.
Initial integrated
test complete.
Architecture
stable.
Prototype layout
approved.
Integrated test.
Verification and
tolerance tests
completed under
environmental
stresses.
ITR tests & life
assessment
completed.
Criteria and
measurements
met.
Slide 38
Key Phase 1 Requirements – Technology Capability Demonstration
•Demonstrate key product technical requirements attributes can be achieved
•Demonstrate ‘sustained performance’ with 70% confidence with typical ‘customer
applications’
•Integrated technology operating window developed
•100% of the CP’s nominal & 80% of the CP latitudes defined.
•Tolerance allocations defined for all process critical components.
•Mfg. Processes capabilities for critical components confirmed based on prototype
database.
•Life tests performed to project performance against targets.
•System integration requirements documented.
•Diagnostics for key/critical failure modes defined.
•Performance projected against quality, cost and delivery schedule requirements
•Technology operating document documented
•Extended Enterprise Partner (s) identified for specific subsystem (s).
• Integration design developed.
•Environmental, health and safety requirements documented. Serviceability assessed
•IP’s and right to use completed.
Slide 39
Technology Readiness Development Steps
1. Develop Big Picture of selected technology set
2. Select subsystem design concepts
3. Complete failure mode analysis of each subsystem- Select critical parameters and noises
4. Define initial critical parameter set points for design intent
5. Define life testing requirements, input parameters, stress tests
6. Complete subsystem latitude development hardware design
7. Complete design analysis and drawing audit that demonstrates critical parameter conformance of hardware to design intent (Critical Parameter Drawing Audit)
8. Build latitude hardware and audit conformance of hardware to design intent (Critical Parameter Hardware Audit)
9. Build life testing hardware and start life testing
10. Complete first optimization using Taguchi latitude testing and operating windows- Optimize S/N ratio and define CP ranges
11. Upgrade failure mode analysis and CP set points and ranges
12. Complete integrated breadboard system design
13. Complete CP drawing audit, build. Complete CP hardware audit
14. Upgrade subsystem latitude hardware
15. Start production intent design (using all TTM design practices)
16. Complete system latitude testing
17. Complete second subsystem latitude optimization
18. Continue life testing
19. Upgrade production intent design (using all TTM design practices)
20. Upgrade failure mode analysis, CP set points and ranges- Final design intent
21. Complete CP manufacturability analysis- Demonstrate CP latitudes can be enabled by normal manufacturing process
22. Complete performance analysis- Predict performance compared to goals
23. Performance and manufacturability analysis are positive- Start design phase- If not, go back to step 12
Capstone Project
Slide 40
Use Lean Six Sigma Tools
MeasureMeasure
• Operational
Definitions
• Data Collection
Plan
• Pareto Chart
• Histogram
• Box Plot
• Statistical Sampling
• Measurement
System Analysis
• Setup Reduction
• Generic Pull
• Kaizen
• Control Charts
• Process Capability,
Cp & Cpk
AnalyzeAnalyze
• DOE Full &
Fractional Factorial
• Conjoint Analysis
• RSM
• Taguchi
• Scorecards
• Pareto Charts
• C&E Matrix
• Fishbone Diagrams
• Brainstorming
• Supply Chain
Accelerator Analysis
• Non Value-Added
Analysis
• Hypothesis Testing
• Confidence Intervals
• FMEA
• Simple & Multiple
Regression
• ANOVA
• Queuing Theory
• Analytical Batch Size
ImproveImprove
• Brainstorming
• Benchmarking
• Process
Improvement
Techniques
• Line Balancing
• Process Flow
Improvement
• Constraint
Identification
• Replenishment Pull
• Sales & Operations
Planning
• Poka-Yoke
• FMEA
• Pugh Matrix
• TRIZ
• ‘To-Be’ Process
Maps
• Piloting and
Simulation
ControlControl
• Control Charts
• Standard
Operating
Procedures
(SOP’s)
• Training Plan
• Communication
Plan
• Control Plan
• Visual Process
Control
• Mistake-Proofing
• Process Control
Plans
• Project
Commissioning
• Project
Replication
• Plan-Do-Check-
Act Cycle
* Tool Array, based on LSS for
Service by Michael George
• Value Stream
Map
• Various Financial
Analysis
• Charter Form
• Multi-Generational
Plan
• Stakeholder
Analysis
• Communication
Plan
• SIPOC Map
• High-Level
Process Map
• Non-Value Added
Analysis
• VOC and Kano
Analysis
• QFD
• Pareto Charts
• RACI & Quad
Charts
DefineDefine MeasureMeasure
• Operational
Definitions
• Data Collection
Plan
• Pareto Chart
• Histogram
• Box Plot
• Statistical Sampling
• Measurement
System Analysis
• Setup Reduction
• Generic Pull
• Kaizen
• Control Charts
• Process Capability,
Cp & Cpk
MeasureMeasure
• Operational
Definitions
• Data Collection
Plan
• Pareto Chart
• Histogram
• Box Plot
• Statistical Sampling
• Measurement
System Analysis
• Setup Reduction
• Generic Pull
• Kaizen
• Control Charts
• Process Capability,
Cp & Cpk
AnalyzeAnalyze
• DOE Full &
Fractional Factorial
• Conjoint Analysis
• RSM
• Taguchi
• Scorecards
• Pareto Charts
• C&E Matrix
• Fishbone Diagrams
• Brainstorming
• Supply Chain
Accelerator Analysis
• Non Value-Added
Analysis
• Hypothesis Testing
• Confidence Intervals
• FMEA
• Simple & Multiple
Regression
• ANOVA
• Queuing Theory
• Analytical Batch Size
AnalyzeAnalyze
• DOE Full &
Fractional Factorial
• Conjoint Analysis
• RSM
• Taguchi
• Scorecards
• Pareto Charts
• C&E Matrix
• Fishbone Diagrams
• Brainstorming
• Supply Chain
Accelerator Analysis
• Non Value-Added
Analysis
• Hypothesis Testing
• Confidence Intervals
• FMEA
• Simple & Multiple
Regression
• ANOVA
• Queuing Theory
• Analytical Batch Size
ImproveImprove
• Brainstorming
• Benchmarking
• Process
Improvement
Techniques
• Line Balancing
• Process Flow
Improvement
• Constraint
Identification
• Replenishment Pull
• Sales & Operations
Planning
• Poka-Yoke
• FMEA
• Pugh Matrix
• TRIZ
• ‘To-Be’ Process
Maps
• Piloting and
Simulation
ImproveImprove
• Brainstorming
• Benchmarking
• Process
Improvement
Techniques
• Line Balancing
• Process Flow
Improvement
• Constraint
Identification
• Replenishment Pull
• Sales & Operations
Planning
• Poka-Yoke
• FMEA
• Pugh Matrix
• TRIZ
• ‘To-Be’ Process
Maps
• Piloting and
Simulation
ControlControl
• Control Charts
• Standard
Operating
Procedures
(SOP’s)
• Training Plan
• Communication
Plan
• Control Plan
• Visual Process
Control
• Mistake-Proofing
• Process Control
Plans
• Project
Commissioning
• Project
Replication
• Plan-Do-Check-
Act Cycle
ControlControl
• Control Charts
• Standard
Operating
Procedures
(SOP’s)
• Training Plan
• Communication
Plan
• Control Plan
• Visual Process
Control
• Mistake-Proofing
• Process Control
Plans
• Project
Commissioning
• Project
Replication
• Plan-Do-Check-
Act Cycle
* Tool Array, based on LSS for
Service by Michael George
• Value Stream
Map
• Various Financial
Analysis
• Charter Form
• Multi-Generational
Plan
• Stakeholder
Analysis
• Communication
Plan
• SIPOC Map
• High-Level
Process Map
• Non-Value Added
Analysis
• VOC and Kano
Analysis
• QFD
• Pareto Charts
• RACI & Quad
Charts
DefineDefine
• Value Stream
Map
• Various Financial
Analysis
• Charter Form
• Multi-Generational
Plan
• Stakeholder
Analysis
• Communication
Plan
• SIPOC Map
• High-Level
Process Map
• Non-Value Added
Analysis
• VOC and Kano
Analysis
• QFD
• Pareto Charts
• RACI & Quad
Charts
• Value Stream
Map
• Various Financial
Analysis
• Charter Form
• Multi-Generational
Plan
• Stakeholder
Analysis
• Communication
Plan
• SIPOC Map
• High-Level
Process Map
• Non-Value Added
Analysis
• VOC and Kano
Analysis
• QFD
• Pareto Charts
• RACI & Quad
Charts
DefineDefine
Slide 41
Ex: Image Quality Variability - Root Cause Analysis
Machine -Media &
Transport Environment -Aerodynamics
Material/Machine – Jets Within PH
Machine - Tiled JM
Overlap Method - Image Data
Algorithm
PH stitched drops fail to
meet cross track spec of
+/-10 mm
In Track
error
Media to brush
roll height
Cross Track
error
Tach
and
Cue
Drier air flow
PH airflow with image
content
Web speed
JM to JM
positioning
Neighboring
drop flight
interactions
DC servo variation
Silicon rev
Ink
concentration
control
DC airflow
with end jets
DC servo variation
JM to JM
Error in data
collection –
cameras, cue
sensors,
Stitch
Correction
Algo
Nozzle diameter variation
Pressure
comp
Measurement_- Test Target,
Data collection, Analysis
Representative test
target
Image data
(pixel shift)
algorithm
Data analysisMedia
dimensional
change
BP Temp
effects
DC position variation
Ink/Media surface energy changes
Slide 42
5 Why’s
Fishbone (cause/effect) Diagram:
The fishbone diagram helps with exploring all potential or real causes that result in a single
defect or failure mode.
Once inputs are established on the fishbone, can use the 5 Whys technique to drill down to the
root causes.
The 5 Whys is a technique used in the Analyze phase of the Six Sigma DMAIC
(Define, Measure, Analyze, Improve, Control) methodology. By repeatedly asking the
question “Why” (five is a good rule of thumb), you can peel away the layers of
symptoms which can lead to the root cause of a problem.
Step 1:
Example: Long start up time for a product defines the issues (Head of the fish).
Agreement on the issue definition is needed to solve it (the various bones for the
fish).
Step2:
Ask why; what is causing that issue (the various issues on the bone of the fish).
Write down the symptom (most direct reason) for that issue and get agreement
before proceeding. Ask why again and agree on the cause of the issue. Repeat this
until you have asked why typically 5 times to get to the root cause.
Slide 43
5 Why’s
Project Name Failure Analysis for long start up
Research #4 Team Date
Issue Description
Enter the agreed upon issue description. Ex: Engine will not start when cold
1. Why is it happening?
Enter the most direct symptom/cause of the issue: Ex: Lubricant viscosity too large
2. Why is it happening?
Enter the direct symptom/cause of the answer listed in the box above
3. Why is it happening?
Enter the direct cause of the answer listed in the box above
4. Why is it happening?
Enter the direct cause of the answer listed in the box above
5. Why is it happening?
Enter the root cause of the answer listed in the box above
Slide 44
Ex: Problem Management Process (PMP) - Definition
PROGRAM ASSESSMENT MATRIX
DESCRIPTIONS
PROBLEM
SOLVING
PROCESS
1Identifying
&SelectingProblem
4Selecting
&PlanningSolution
3GeneratingPotentialSolutions
2AnalyzingProblem
6Evaluating
Solution
5Implementing
Solution
Problem identified. No proposed solution.
Problem not understood.Hypothesis proposed.
Problem understood.Solution set proposed.
Solution set defined.Verification tests incomplete.
Verification tests complete.
Solution set demonstrated
PROGRESS
Issue Category
Critical
Major
Ordinary
Impact
Show Stopper Now!
Could Become AShow Stopper
An Annoyance
RequiredActions(s)
Issue must be resolved, replan required
Issue requires approved, corrective action plan, with an assessment of its achieveability when integrated with other
corrective action plans into overall program plan (s)
Manageable within normal day-to-day activites
PHASE TRANSFER
IMPLICATIONS
I
M
P
A
C
T
Critical
Major
Ordinary
1 2 3 4 5 6
PROGRESS AND IMPACT
SatisfactoryDiscretionaryAdditional actions required
Capstone Project
Slide 45
Ex: Problems / Issues Severity –IJ PH
IMPACT 1. Identifying
& Selecting
Problem
2. Analyzing
Problem
3. Generating
Potential
Solutions
4. Selecting &
Planning
Solution
5.
Implementin
g Solution
6. Evaluating
Solution
Critical
(Show Stopper
“Now”)
Ink Handling
Design
Initial Fill ,
time t =0
performance
Ink Cp’s
optimization
(ES process
physics)
Major
(Potential barrier to
subsequent phase
transfer – could
become a show
stopper)
Drop
formation
CP’s
identification
& modeling
verification,
design for
energy
efficiency
Print head
packaging
design (mech.,
elect.,
fluidics)
Ordinary
(Minimal impact on
QCDs)
Capstone Project
Slide 46
P- Diagram (Input Output Constraint Transformation Function)
OUTPUTS (O) LATITUDEINPUTS (I)
Primary
Dysfunctional
From a Subsystem or Manufacturing Process:
Failure Mode
Failure Mode
Main Function: The purpose of the subsystem / system
Primary Inputs: Any action, physical object, or energy that needs to be supplied for the main
function to perform its intended purpose
Dysfunctional Inputs: Any action, physical object, or energy which may limit or prevent the subsystem from
performing its intended purpose
The variation in all inputs are termed external noises
Primary Outputs: Measurable performance the subsystem is intended to provide. Also called the ‘Primary
Response’
Dysfunctional Output: By-products from the subsystem performance which may be Dysfunctional Inputs to
other subsystems
Constraints: Key program requirements that impact the design
Latitude : The output variation remains within the boundary of the failure modes when the
design is subjected to expected levels of input variation (from noise factors)
Failure Mode: The deficiency which occurs when the output performance no longer meets the reqmnts
CONSTRAINTS (C)
MAIN
FUNCTION
Capstone Project
Slide 47
EX: IJ Printer Maintenance Station I/O/CMS INPUTS
From Maintenance
Vacuum pressure, 50 – 200 mm Hg
(gage)
Vacuum Dwell time, 2 – 10 s
Capping Force, 25 – 50 gF/cm
Wiper blade force, 25 - 100 gF/cm
Spitting Wave form, 100 – 150% WS
threshold
OTHER SUBSYS INPUTS
Printer:
Carriage Scan Speed, 15 – 30 IPS
Carriage Acceleration < 2 g’s
Ink:
Surface Tension, 20-45 dynes/cm
pH 7 – 9.5
Viscosity, 1 – 2.5 CP @ 24 0 C, 50RH
Re-dissolution 2 (scale 1-5)
% Pigments, Humectants –ref. Ink
design
Print Head:
Nozzle dia 10 – 20 um
# of nozzles/col, native res – 640/1200
DPI
Ink/PH front face wetting angle, 10 – 75o
Ink tank:
Static pressure < 0.25” water vacuum
(gage)
MAIN FUNCTIONS:
Maintain Printhead health over 5year
at 4 corners temp 150C - 350C, RH
20%-80%
•Initial ink install
•Ink tank / PH replacement
•Remove clogged/crusted inks in
nozzles
•Spitting for Latency
•Wiping to maintain PH nozzle face
•Capping of print head during
standby/storage
•Waste ink management
SECONDARY FUNCTION
•Protect PH and prevent waste ink spill
after printer install
OUTPUTS:
To IQ:
Dot size back to WS spec
Drop Directionality back to WS spec
To PH :
Recover missing nozzles due to ink clogs
and crust w/ 99% confidence on first clean
operation
Recover misdirected nozzles due to front
face contamination w/ 99% confidence
Remove debris & paper fiber from PH face
To Firmware:
Ref. MS algorithms document
UNDESIRED OUTPUTS:
•MS induced cross contamination & air
bubbles
•PH front face wear
•MS induced noise <45 dB ?
•Ink spatter or aerosol in maintenance
areas
•MS ink leakage from storage areas, 0 cc
over life
MS CONSTRAINTS:
UMC < $5
Life of components ~ 5 years
Standby/storage mode - no
maintenance
Waste ink usage <15% printable ink
Waste ink diaper size < 800 cc
SYSTEM CONSTRAINTS
Ink Re-dissolution < 2 (scale 1-5)
Ink Latency > 5 sec
PH front face flatness < 0.25 mm
HSE Compliance
Contamination from Mfg. & PH usage
<5 ppm, 2 um size internal)
Slide 48
EX: Ink Subsystem DesignInputs:
Drop Ejector Requirements
Colorant concentration ( all colors)
Surface tension
Viscosity
Density
pH
Contact Angle wrt front face
Dissolved gas
Ink Delivery (Ink tank) Requirements
Viscosity
Gas permeability
Surface Tension
Solubility
Maintenance Requirements
Solubility
Viscosity
Media Set Requirements
Photo reqmnts
Plain Paer reqmnts
Ambient Drying Requirements
Surface Tension
% water by wt
% co-solvent
Viscosity
Duplex Requirements
% water, % co-solvent
Usage conditions & Design Noise
Standby/ sleep mode
Ink supply variation during printing
Machine RH, Temperature
Ink Raw Materials variability
Outputs:
Measuring and monitoring to ensure product goals are met.
Jettability Performance
Drop volume, velocity, Jitter, FMax
Maintainability Performance
Latency, washability, solubility,
Recoverability
IQ Perfromance
Spot size,Dmax, Dmin, Raggedness, , ICB, Mottle, Gamut, Cockle, Curl, Smear (wet & dry), misting, W’fast, L’fast
Drying Performance
Ambient Dry Time
Duplex Performance
Strike-thru
Properties Stability
Shelf Aging
Ink composition in device over time
Ink properties over time in ink delivery subsystem
Materials life:
Components life exposed to ink
Main Functions:
Deliver ink set that achieves the following in Printer System Architecture: jetting performance, IQ performance on media set, acceptable life of all materials in ink path, acceptable print head maintainability and operability
Constraints:RTU
HSE
Materials Compatibility
Properties stability at operating temperature
Stability over life
UMC
Time To Ink Flush (design nominal)
Manufacturability
Supply Assurance/ Quality
Slide 49
Ex: Process Physics, Drop FormationCP’s INPUT
From Drop Formation
Amplitude. Nom +/- V
pulse width
# of pulses
pulse position odd vs even
odd-even phase shift (static &
dynamic)
From DC
•Pos excess air
•Neg air
•Catcher vacuum
From WSO
Ink pressure,
From Ink
Viscosity, ? CP @ 24 0 C, 50RH
From System
Ambient, 150C - 400C, RH 20%-
80%
DOE TO VERIFY:
Quality of catch drops and print
drops
•Small drops in catch
•Large drops exit PH
•Large drops momentum
MEASURED OUTPUT RESPONSEDrop Formation Response
•1x
l/d , Nom 4.5, +/- 0.3 (Typically 3.9 to 4.2)
• Small Drop Merge : At 2.5 mm below the nozzle
plate, the merge rate should be less than 1 out of
1,000,000 drops
•3x
Large Drop Formation Length ( <1200 microns)
1x to 3x merges (no merges before 2.5 mm)
Satellites: (Distances from Nozzle Plate)
Sat. Merge Distance (< 700 microns )
Sat. Flight Time ( < 110 microns)
Sat. Volume ( > 0.1 pL)
Measurement: no satellite filter collection after 30
minutes of continuous running
6 hour runability test
No Print window degradation
No Ink accumulation on Condensation Shield
Drop Control:
PW, > 1.5 inches of Water
Spits, <# 0,25 mm/1000 prints
IQ Response (Measured)
Horizontal line quality
Vertical line quality
Spot size, 56 +/- 5mm
IQ Response (Qualitative Measure)
•Pattern dependent X-talk, <? (see 1x above)
•Air flow defects
DYSFUNCTIONAL OUTPUT:
•Pepper Spray, Less than 2 per square inch at 656 ft/min
•Catcher spitting, <0.5x0.5 mm
NOISE:From Ink
Viscosity, 1.5 +/- CP
Surface tension
% solids
pH 7, 9.5+/-?
From JM
NP hole size
From Customer Job
•Image type
•Pattern
From Mfg
•Contamination
•Parts tolerance
From Service
•Parts positioning
System Config Constraints
•Test with Condensation solution
•ASV box
•Air system
•Web at speed
•Drier set points
From Environment
•Temp range
•RH range
•Contamination
Slide 50
Ex: Critical Parameter (CP) Tracking List
CP = Critical Parameter to monitor process function not found on a drawing
CS = Critical Specification found on drawings monitored at new build or audits
CRITICAL PARAMETER DEVELOPMENT CRITICAL PARAMETER IMPLEMENTATION
S/S Parameter DescriptionCP orCS
1
Units
Critical ParameterValue
Set Range
Comment / FailureModes/Outlook/Schedule/Technical
Testing Capability
Nom Range
CurrentNom/(Date)
2
Capstone Project
Catcher film thickness CP micron
s
400 +/-20 Stray drops on media
Drop volume CP picoL 9.5 +/-0.25 White space, DD
Slide 51
• Parts variability
• Resources to qualify for IQ defects
• Correlation between test stands
• Spitting
• Parts scheduled delivery next week,
• IQ Artifact
• Tests Completed on test stand
• Analyzed Service Calls Data & Identified
Contributors to IQ
• Reviewed Manufacturing data
• Top integration issues identified
• Integration initiatives priority
o Process Physics Development
oSpitting
o IQ defects
o
• Continue Process Physics Development
• Testing of modified parts
• Fabricate and test DOE parts
• Gather more failures from customer sites
Ex: Integration Robustness MBF
Key Deliverables
Recent Accomplishments Plan (next 30 days)
Issues / Risks / Help or Decision Needed
Capstone Project
- Open Innovation Model for Tech Transfer
Develop Strategy for Tech Transfer -Extending the R&D Enterprise through
Partnerships
Slide 53
Extended Enterprise Relationship to other TTM Sub-processes
Program Planning & Management
3.1 3.2 3.3 3.4 3.5 3.6
Customer Input & Validation
Platform Planning & Management
Economic & Business Case Financials
Requirements & Specifications
Technology
Systems Engineering
Integrated Testing - Internal / External
Standards & Regulatory Compliance
Globalization
Performance Metrics & Measurements
Marketing / Sales & Distribution
Manufacturing & Logistics
Third Party Arrangements (OEM and JV)
Launch
Customer Services & Support
Skills & Resource Planning
3 Customer Satisfaction & Loyalty
MPSV
3.2
DefineProduct &
Deliver
Technology
3.1DefineMarket Attack
Plan &
Technology
3.3
DesignProduct
3.4
Demon-
strateProduct
3.5
DeliverProduct
3.6
DelightCustomers
Market &
Product
Strategy
Vision
Sub-Processes
Core
Process
Subsystems Engineering
Extended Enterprise
7
5
1
2
4
6
8
9
10
11
12
13
14
15
16
18
19
20
17
(HW/SW, Supplies, FW/Elex)
Capstone Project
Slide 54
Extending The Enterprise -Partnership/Open Innovation Model for R&D and Design and Manufacturing
Former approaches:
Product development has used several approaches:
•Complete build-to-print
•Sourcing to original equipment manufacturers (OEMs)
•Joint Ventures (JVs) with other manufacturers
The Extended Enterprise is . . .
•The utilization of global supplier relationships for component, subsystem, and
module design and manufacturing
•R&D Tech Transfer to enable maximum leverage of expertise and significant
improvements in product cost and TTM factors
Close existing gaps with existing enterprise:
•Engage appropriate partners
•Optimize partner value contribution
•Leverage unique product and process capabilities
•Access production and purchasing scale
•Retain ownership of proprietary technologies and critical product
development areasCapstone Project
Slide 55
Extended Enterprise PartnershipExtended Enterprise is not “outsourcing”
Extended Enterprise retains strategic internal control over:
• Areas that are critical to sustainable competitive advantage
• Product strategy, development, and execution
• Product synthesis
• Product development management
• Systems engineering and integration
Capstone Project
Slide 56
Extended Enterprise: A TTM sub-process
Extended Enterprise Deployment through out TTM
3210 54MPSV
Company defines:
• Market / business strategy
• Core competencies and
strategic enabling
technologies
• Market Attack Plans and
Product Strategies
• All sources of technology
(internal and external)
• Company specifies product (core
competencies)
• Company develops a set of strategic
partners that:
Deliver technology
Design non-strategic elements
Manufacture those elements
• Company designs strategic elements
and modules
• Company becomes world class in:
Systems Design
Systems Architecture
Systems Engineering
and Integration
Company controls (core
competencies)
• Launch
• Final integration
at Company or
non-Company sites
Company optimizes back
end Extended Enterprise
partnerships:
• Distribution
• Order fulfillment
• Service and support
Capstone Project
Slide 57
CRITERIA COMMENTSEX: PARTNER RATING FOR
SELECTION
Low
1 2 3 4
Hig
h 5(Quantify where possible)
TECHNICAL CAPABILITIESDevice Research, Design &
Development
• Number of RD&E personnel
(researchers, engineers, technicians,
designers, etc.)
X - approximately 60-70 people working on MEMS
development at any one time (analysis, design,
prototyping, testing / characterization)
- other skilled supporting resources available
(expertise, tools, etc.)
•Skills & experience base of RD&E personnel X - MEMS capabilities include; Surface
micromachining process (SUMMit), Micromolding
(High Aspect Ratio Structures), Integrated
Electronics / Mechanics, Sealed Diaphragm,
Phtonics / MEMS
- Skills, breadth of capabilities, experience
appears very high ….. analysis, design, test and
prototype fabrication;
- Ph.D. & Master level engineers & scientists
– microelectronic & micromachining process
development
– equipment design
– materials engineering
– device physics
– chemical engineering
– failure analysis & reliability physics
– circuit design, computer science, etc.
• Development Process
- Definition & Documentation
- Cycle Time & Resource Guidelines
- Project Planning Process
- Process Flexibility
- Design & Development Practices
X Typically uses gov’t / MIL–Std type of requirements
and phased development processes, relatively high
level of documentation … appears OK but such
processes have not typically been known for
benchmark TTM resultsCapstone Project
Slide 58
Capstone Project Desired Outcome
• Carefully Manage the TTM Front end and Technology Delivery Phases
• Monitoring Top Problems (Root Cause analysis, CA’s, etc)
Managing for Results – Meet VOCs and QCDs
Effective Knowledge Transfer for Licensing, Tech Transfer and for Commercialization – Technology Readiness
Capstone Project
Slide 59
Tech Positioning- Upper Right Quadrant (URQ)
Existing New
Market
Te
ch
no
log
y
Su
sta
inin
gD
isru
pti
ve
Highest
Risk
Lowest
Risk
Capstone Project
Capstone
Slide 60
Summary: MAP Partnership Teams Integration –I/O/C
Team
Co-Dev
Function:
-Overcome
Perceptual
Gaps
-Focus on VOC
-Use TR
knowledge
-Execute TTM
Input Output
Global
Cross
functional
Incentives
Processes
Competition
Tech Comm Best Practices
Co-Development
4/19/2016
Slide 61
Successful Today’s Innovators – Capstone Team