bluetooth 5 system on chip - system plus consulting · ©2018 by system plus consulting | bluetooth...

©2018 by System Plus Consulting | Bluetooth 5 System on Chip 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Bluetooth 5 System on ChipComparison between NXP, Nordic, Dialog and Qualcomm

IC review by Farid HAMRANISeptember 2018 – version 1

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT


Versions of the Report

Version Date Updates

V1 05/09/18 o Initial release


Table of ContentsOverview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Technology and Cost Review 8

NXP QN9080

o Summary of the Physical Analysis

o Packaging

Package Overviews, Dimensions

o Die

Die View & Dimensions

Die Delayering & Main Blocks ID

Die Process

Die Cross-Section

Die Process Characteristic

o Die Front-End Process & Fabrication Unit

o Back-End Process & Fabrication Unit

o Cost Analysis

o Die

Die Front-End Cost

Die Probe Test & Dicing

Wafer & Die Cost

o Packaged Component

Packaging Cost

Back End: Final Test

Component Cost

Dialog Semiconductor DA14585

Nordic nRF52810

Qualcomm QCC5121

Comparison 102

o Overall Comparison

o Die Topology Comparison

o Manufacturing Comparison

o Price Comparison

Feedbacks 107

Company services 109


Overview / Introduction

Technology & Cost Reviewo NXP QN9080CHNYo Nordic nRF52810o Dialog DA14585o Qualcomm QC5121

Comparison

Feedbacks

About System Plus

• Marking:

NXP (Manufacturer)

9080 (reference)

PFSB57

.00 09

EX1744C (Fab xxxx,OSAT: xxx, xxx, Chip revision C)

Package Views & Dimensions

NXP - 9080 Bottom View ©2018 by System Plus Consulting

NXP - 9080Top View©2018 by System Plus Consulting

GND (Pin0)6mm

6m

m

• Package: QFN48

• Dimensions: xxxxx mm3

• Pin Pitch: x.xmm

NXP - 9080 Side View ©2018 by System Plus Consulting

0.85mm Pin1 Indicator

Pin1 Indicator




Comparison

Feedbacks

About System Plus

Package Overview and Cross-Section

• Package cross-section reveals one die glued and connected with wire bonding to the Lead Frame.

• Package Thickness 850 µm

• Lead Frame Thickness 210 µm

• Adhesive Thickness 22.5 µm

• Die Thickness 195 µm

nRF52810 Package Cross-section©2018 by System Plus Consulting

Copper Wire Bonding

Die Substrate

Silver Filled Adhesive

Lead Frame

nRF52810 Package Cross-section©2018 by System Plus Consulting

Epoxy Molding

Die Substrate

Lead Frame (210 µm)

Wire Bonding




Comparison

Feedbacks

About System Plus

Package Opening

Dialog - DA14585 Top Decap View©2018 by System Plus Consulting

• Wire Bonding Number: 55

• Wire Bonding Material: xxx

• Wire Bonding Diameter: xx µm




Comparison

Feedbacks

About System Plus

Die Views & Dimensions

• Die Area: xxx mm² (xxx x xxx mm²)

Dialog - DA14585 Top View©2018 by System Plus Consulting

Xxx mm

Xxx

mm

• Pad number: xxxx




Comparison

Feedbacks

About System Plus

• The marking on the dies includes:

Ⓜ© (Copyright Logos)

NXP2016

<Symbol>N9080

386A

387A

Die Marking

Die Overview – Optical View©2018 by System Plus Consulting

Die Marking – Optical View©2018 by System Plus Consulting




Comparison

Feedbacks

About System Plus

Die Process – CMOS Transistor

Die Delayering – Optical View©2018 by System Plus Consulting

Die Process – SEM View©2018 by System Plus Consulting


51 nm

• The process uses CMOS transistors

– MOS transistor gate length: ~XXX nm

• The gate length measurement, and the XXXX cell size let us think that the technology node is XXX nm.




Comparison

Feedbacks

About System Plus

Die Process – SRAM Memory



41 nm

• Type: SRAM 6 transistors

• Cell size:

– XXXX µm x XXXX µm = XXXXX µm²

– Corresponds to XXXX nm technology node

SRAM Cell Size




Comparison

Feedbacks

About System Plus

Die Delayering





Comparison

Feedbacks

About System Plus

• The process uses XXX metal layers.XXXX Layer

Die Cross-Section – Metal Layers

Die Cross-Section – Metal Layers View©2018 by System Plus Consulting




Comparison

Feedbacks

About System Plus

Front-End Cost

The front-end cost for the wafer is estimated at $XXXXXX between2018 and 2022.

The largest portion of the manufacturing cost is due to theequipment and consumable respectively at XXXX% and XXXX%.




Comparison

Feedbacks

About System Plus

Estimated Manufacturer Price

We estimate that Qualcomm realizes agross margin of XXXX% on the component,which results in a final component priceestimated between $XXXXXX in 2018 and$XXXXX in 2022.

This corresponds to the selling price forlarge volume to XXXXX.


COMPARISON



Technology & Cost Review

Comparison o Overviewo Die Topologyo Manufacturing Processo Price

Feedbacks

About System Plus

Manufacturing Comparison

We’ve considered the same foundry facility for all of the studied samples, XXXXXXXXXX. This results in a similar foundry margin. Thedifference of the topology on the die results in a variation of the wafer price.The size of the die influence the number of potential of good dies per wafer ranging from the range of XXXXXX for the bigger die, theXXXXXXXX to the range of XXXXXX dies per wafer for the two smaller dies, the XXXXXX and the XXXXXX. This obviously has an influence onthe die cost as more processed wafer to obtain the same number of dies.The difference of the Test and Assembly cost of the XXXXXXXX die resides that the assembly cost of the XXXXXXXX is included in theunprobed wafer cost

Nordic Semiconductor

nRF52810

NXP

QN9080CHNY

Qualcomm

QCC5121

Dialog Semiconductor

DA14585

The price of the tested and assembled die range from $XXXXXX the XXXXX to xxxx for the XXXXXXXXX. This is due to number of die per waferresulting from the die size.



Technology & Cost Review

Comparison o Overviewo Die Topologyo Manufacturing Processo Price

Feedbacks

About System Plus

Die Topology Comparison

Nordic Semiconductor

nRF52810

NXP

QN9080CHNY

Qualcomm

QCC5121

Dialog Semiconductor

DA14585

The difference of the die topology mostly in the die size range from xxxmm² for the Nordic nRF52810 to almost three times the area for theQualcomm QCC5121. As for the technology nodes, we all measured that the dies share the same technology node, xxxnm. The number ofmetal layer slightly varies from xxx to xxx layers.As for the memory, we can see that the for manufacturers went for different options for memory types and sizes which directly relate to thetargeted specific application segment.

Die

Die Area (mm²)

Die Thickness (µm)

Technology Node (nm)

Metal layers 7 7 6

55nm

8

5.76mm²

195µm

55nm

6.13mm²

55nm

16mm²

238µm

55nm

9.92mm²

238µm 267µm

Memory

RAM Memory Size (kB)

Type

Cell Size

Total Memory Area

ROM Memory Size (kB)

Cell Size

Total Memory Area

Flash Memory (kB)

Cell Size

Total Memory Area

0.43µm²

0.0234µm²0.1µm² -

-

0.45µm² 0.28µm²0.42µm²

0.17µm²

0.21mm²

0.18µm² - 0.17µ² -

0.28mm²- -0.94mm²

6T

192kB

0.21mm²

24kB

-

6T

-

0.33mm²

96kB

128kB

6T

-

0.2mm²

1mm²

80kB

5Mb

6T

512kB

0.5mm²

0.24mm²

128kB

256kB



Company Profile & Supply Chain

Physical Analysis

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Pluso Company serviceso Related reportso Contacto Legal

Related Reports

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

RF - PACKAGING• 5G’s Impact on RF Front-End Module and Connectivity for Cell

Phones 2018• Advanced RF SiPs for Cell Phones: Reverse Costing Overview

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

RF - PACKAGING• BCD Technology and Cost Review• RF Front-End Module Comparison 2018 • Qualcomm VIVE® QCA9500 High Density WiGig/WiFi

802.11ad Chipset for the 60 GHz Band

https://www.i-micronews.com/category-listing/product/bcd-technology-and-cost-review.html


https://www.i-micronews.com/category-listing/product/p5g%E2%80%99s-impact-on-rf-front-end-module-and-connectivity-for-cell-phones-2018.html

https://www.i-micronews.com/category-listing/product/advanced-rf-sips-for-cell-phones-reverse-costing-overview.html


http://www.systemplus.fr/reverse-costing-reports/rf-front-end-module-comparison-2018/

http://www.systemplus.fr/reverse-costing-reports/qualcomm-vive-qca9500-high-density-wigigwifi-802-11ad-chipset-for-the-60-ghz-band/



http://www.systemplus.fr/reverse-costing-reports/qualcomm-60ghz-wigigwifi-802-11ad-chipset-worlds-first-smartphone-edition/

http://www.systemplus.fr/reverse-costing-reports/qualcomm-60ghz-wigigwifi-802-11ad-chipset-worlds-first-smartphone-edition/






COMPANYSERVICES




Physical Analysis


Cost Analysis


Feedbacks


Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>40 reports per year)

Costing Tools

Trainings




Physical Analysis


Cost Analysis


Feedbacks


Contact

www.systemplus.fr

NANTESHeadquarter

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.

KOREAYOLE

Headquarters22 Boulevard Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

Asia Sales OfficeTakashi [email protected]

Mavis WANGGREATER [email protected]

America Sales OfficeSteve LAFERRIEREEastern [email protected]

Troy BLANCHETTEWestern [email protected]

ORDER FORMPlease process my order for “Bluetooth 5: System-on-Chip Comparison 2018” Reverse Costing® – Structure, Process & Cost Report Ref: SP18427

Full Structure, Process & Cost Report : EUR 3,990* Annual Subscription offers possible from 3 reports, including this

report as the first of the year. Contact us for more information.

SHIP TO

Name (Mr/Ms/Dr/Pr): .............................................................

Job Title: …….............................................................................

Company: ….............................................................................

Address: …….............................................................................

City: ………………………………… State: ..........................................

Postcode/Zip: ..........................................................................

Country: ……............................................................................

VAT ID Number for EU members: ..........................................

Tel: ……………….........................................................................

Email: .....................................................................................

Date: ......................................................................................

Signature: ..............................................................................

BILLING CONTACT

First Name : ............................................................................

Last Name: …….......................................................................

Email: …..................................................................................

Phone: ……..............................................................................

PAYMENT

By credit card:

Number: |__|__|__|__| |__|__|__|__| |__|__|__|__|

|__|__|__|__|

Expiration date: |__|__|/|__|__|

Card Verification Value: |__|__|__|

By bank transfer:HSBC - CAE- Le Terminal -2 rue du Charron - 44800 St Herblain FranceBIC code: CCFRFRPP• In EUR

Bank code : 30056 - Branch code : 00955 - Account : 09550003234 IBAN: FR76 3005 6009 5509 5500 0323 439

• In USDBank code : 30056 - Branch code : 00955 - Account : 09550003247 IBAN: FR76 3005 6009 5509 5500 0324 797

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTBLUETOOTH 5: SYSTEM-ON-CHIP COMPARISON 2018

Each year System Plus Consultingreleases a comprehensive collectionof new reverse engineering andcosting analyses in various domains.You can choose to buy over 12months a set of 3, 4, 5, 7, 10 or 15Reverse Costing® reports.

Up to 47% discount!

More than 60 reports released eachyear on the following topics(considered for 2018):• MEMS & Sensors: Accelerometer

– Environment - Fingerprint - Gas - Gyroscope - IMU/Combo -Microphone - Optics - Oscillator -Pressure

• Power: GaN - IGBT - MOSFET - Si Diode - SiC

• Imaging: Camera - Spectrometer• LED and Laser: UV LED – VCSEL -

White/blue LED• Packaging: 3D Packaging -

Embedded - SIP - WLP• Integrated Circuits: IPD –

Memories – PMIC - SoC• RF: FEM - Duplexer• Systems: Automotive - Consumer

- Energy - Telecom

ANNUAL SUBSCRIPTIONS

Return order by: FAX: +33 2 53 55 10 59MAIL: SYSTEM PLUS CONSULTING

22, bd Benoni GoullinNantes Biotech44200 Nantes – France

EMAIL: [email protected]

*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format*For French customer, add 20 % for VAT*Our prices are subject to change. Please check our new releases and price changes on www.systemplus.fr. The present document is valid 6 months after its publishing date: August 2018

mailto:[email protected]

http://www.systemplus.fr/

1.INTRODUCTIONThe present terms and conditions apply to the offers, sales and deliveries of services managed by System PlusConsulting except in the case of a particular written agreement.Buyer must note that placing an order means an agreement without any restriction with these terms and conditions.

2.PRICESPrices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros andworked out without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will becharged on these initial prices.System Plus Consulting may change its prices whenever the company thinks it necessary. However, the companycommits itself in invoicing at the prices in force on the date the order is placed.

3.REBATES and DISCOUNTSThe quoted prices already include the rebates and discounts that System Plus Consulting could have granted accordingto the number of orders placed by the Buyer, or other specific conditions. No discount is granted in case of earlypayment.

4.TERMS OF PAYMENTSystem Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in thecase of a particular written agreement.If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting apenalty for late payment the amount of which is three times the legal interest rate. The legal interest rate is thecurrent one on the delivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoicedeadline. This penalty is sent without previous notice.When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of thetotal invoice amount when placing his order.

5. OWNERSHIPSystem Plus Consulting remains sole owner of the delivered services until total payment of the invoice.

6.DELIVERIESThe delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed.Consequently any reasonable delay in the delivery of services will not allow the buyer to claim for damages or tocancel the order.

7.ENTRUSTED GOODS SHIPMENTThe transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost ordamage on the base of their real value, he must imperatively point it out to System Plus Consulting when theshipment takes place. Without any specific requirement, insurance terms for the return of goods will be the carriercurrent ones (reimbursement based on good weight instead of the real value).

8.FORCE MAJEURESystem Plus Consulting responsibility will not be involved in non execution or late delivery of one of its dutiesdescribed in the current terms and conditions if these are the result of a force majeure case. Therefore, the forcemajeure includes all external event unpredictable and irresistible as defined by the article 1148 of the French CodeCivil?

9.CONFIDENTIALITYAs a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.A non-disclosure agreement can be signed on demand.

10.RESPONSABILITY LIMITATIONThe Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirectdamage, financial or otherwise, that may result from the use of the results of our analysis or results obtained usingone of our costing tools.

11.APPLICABLE LAWAny dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolvedapplying the French law.It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.

TERMS AND CONDITIONS OF SALES

bluetooth 5 system on chip - system plus consulting · ©2018 by system plus consulting | bluetooth...

Documents