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VISIBILITYFrom Any Location :• Know your tool status

• Observe tool usage and create schedules

• Access full process history, logs, and analytics

FLEXIBILITY

Process Flexibility• Supports substrates sizes from 50 to 300 mm

• Compatible with peel, thermal slide, laser lift-off,

and chemical release debonding methods

• Supports oversized carriers and irregular shapes

• Designed for semiconductor production by material

• Throughput of up to 20 WPH

scientists

Brewer Science® Apogee™ BonderSemi-Automated Temporary BonderAccelerate product development and lower production costs with the Brewer Science® Apogee™ bonding system. Achieve high yield and throughput without the high cost and complexity of full automation. Maximize your process options with a tool that bonds wafers from 50 to 300 mm and supports all debonding processes.

Cost Reductions• Reduced cost per wafer with ≥ 99% device yield

• Leading reliability and efficiency

• Increased utilization with size flexibility

• High throughput and capacity with improved cycle times

• Reduced start-up costs

• Fast ramp to production

LOWER COST OF OPERATION

Total Throughput

System Uptime

Total Thickness Variation (TTV)

Mean Time between Failures(MTBF; hours,cycles)

Qualified Wafer Materials

Est. 8-20 WPH (process dependent)

>99% over 12-month period

As low as 5%

>600 hours, 6,000 cycles

SiC, GaN, GaAs, InP, sapphire, silicon, glass

Temporary Wafer Bonding Tool Platform Reliability

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INTEGRATED PROCESS SOLUTION

Coating & Baking Bonding Debonding

• The Apogee™ bonder completes Brewer Science’s temporary bonding tool suite to support thin wafer handling applications.

• Brewer Science is uniquely positioned to combine processing equipment, temporary bonding materials, and process integration into

a complete turnkey solution.

SECURE DATA ANDNETWORK CONNECTION

Real-Time Access Outside The Production Area• Temperature and humidity monitoring and logging

• Familiar browser user interface

• Offline backup and data analysis

• Push notifications sent to any web-enabled device

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The Brewer Science temporary bonding tool suite provides optimal cost of ownership for low-volume production.• Reduced investment in capital equipment

• Improved yield and throughput to reduce costs

• Throughput up to 20 WPH

• Tool suite is the lowest cost contributor per

device over a 5-year period

FINANCIAL REWARDS Cost-per-wafer contributors: small-volume production

Equipment Purchase

Delivery, Facilities, Taxes, Duties

Materials and Consumables

Direct and Indirect Labor for Start-up

Throughput, Utilization, Yield, Rework, Scrap

Cee ® 200XSpin Coater

Cee ® 1300XBake Plate

Cee ® 1300CSXSeparation Tool

Cee ® 300MXDMegasonic Developer/Cleaner

Apogee™

Temporary Bonder

Cleaning

Brewer Science®

Mechanical Separation Tool

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UTILITY REQUIREMENTSAND DIMENSIONS• Bonder dimensions:

48 in W x 31 in D x 15 in H

• Nitrogen or CDA: 50 psi (1 cfm)

• Vacuum pump provided

• Electrical requirements:

208-240 VAC: 50/60 Hz, 3,400 watts (17 A)

• Machine weight: 320 lb

• Shipping weight: 680 lb

OTHER SPECIFICATIONS• Max. temperature: 300°C (higher temperatures available)

• Piston force: 3.5-12k N

• Force resolution: 10-N steps

• Dual heated platens

• No-contact extraction arm for loading and unloading

• Bond chamber evacuation time: < 90 seconds

• Carrier and device are separated during pre-bond

evacuation

• Platen temperature uniformity: ± 1%

• Alignment accuracy: ≤ 0.5 mm (dependent on substrate

tolerances)

• Data logging: Force, temperature, vacuum, and process

cycle time (ambient temperature and humidity)

• Cycle times: < 5 minutes (process dependent)

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DIMENSIONS ININCHES

© 2015 Brewer Science, Inc. All statements, technical information and recommendations contained herein are based on tests we believe to be accurate, but the accuracy or completeness thereof is not guaranteed and the following is made in lieu of warranty expressed or

implied. Neither the seller nor manufacturer shall be liable for any injury, loss or damage, direct or consequential, arising from the use or inability to use the product. Before using, user shall determine the suitability of the product for his intended use, and user assumes all risk

and liability whatsoever in connection therewith. No statement or recommendation contained herein shall have any force or e�ect unless in an agreement signed by o�cers of the seller and manufacturer.