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©2018 by System Plus Consulting | Broadcom AFEM-8072 1

21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

Broadcom AFEM-8072Mid&High Band Front End module in iPhone 8/XRF report by Stéphane ELISABETHFebruary 2018 – version 1


Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o Broadcom

o Company Major Customers

o Apple History

o Filter technologies

o Apple iPhone 8 & X Teardown

Market Analysis 23

o RF Components Market Forecast

o Supply Chain

Physical Analysis 27

o Summary of the Physical Analysis 28

o Module 30

Package Views & Dimensions

Package Opening:

Power amplifier, Switch, RF IC, Filters

Package Cross-Section:

Overview, Dimensions, Substrate, Internal & External Shielding

Summary of physical data

o Power Amplifier, Switch 56

Die Views & Dimensions

Die Cross-Section

Die Process Characteristics

o Matching RFIC Die 74

Die View & Dimensions

Die Overview, Delayering & Main Block ID

Die Process

Die Cross-Section

Die Process Characteristic

o Filter Dies 86

High/Mid band repartition

Dies Views, Dimensions & Opening

Dies Overview: Cap, Substrate, Cells

Die Cross-Section:

Sealing Frame, Anchor, TSV, Holes, FBAR Structure

Die Physical Data Summary

Physical Comparison with seperated Mid & High Band FEM from Broadcom 123

Manufacturing Process 130

o Switch & matching RFIC Die Front-End Process

o Filter Die Front-End Process & Fabrication Unit

o Filter Die Front-End Process Flow

o Packaging Process & Fabrication unit

o Packaging Process Flow

Cost Analysis 147

o Summary of the cost analysis 148

o Yields Explanation & Hypotheses 150

o Filter die 152

Die Front-End Cost

Die front Cost per process steps

Die Wafer & Die Cost

o Matching RFIC die 157

Die Front-End Cost

Die Wafer & Die Cost

o Packaged Component 159

Packaging Cost

Packaging Cost per process steps

Component Cost

Filter & Front-End Module Estimated Price 164

Feedbacks 168

Company services 170


Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Feedbacks

About System Plus

Executive Summary

Located on the main PCB substrate underneath the Sim card slot, the RF Front-End (RFFE) has different configuration depending on the Transceiver chipset. The AFEM-8072 from Broadcom was found in the Japanese and Sim-Free version of the Apple iPhone X (A1865 andA1902). In the European version, two separated modules from Avago shares the RFFE area with Qorvo, Skyworks, and TDK-Epcos.

The AFEM-8072 is a Mid and High band LTE FEM. As usual, it features several dies: Power amplifier, SOI Switch, Filters. The last ones are still using Avago’s Microcap bonded-wafer Chip Scale Packaging (CSP) technology with Through-silicon Vias (TSVs) enabling electrical contacts and Scandium Doped Aluminum nitride (AlScN) as a piezoelectric. Although for this special version, Broadcom has integrated two advanced features, first a RF IC featuring several IPD for the antenna matching and second an EMI shielding inside the FEM to reduce interferences between the dies. Moreover, Broadcom has decided to integrate Sony as a low power SOI switch supplier.

Thank to all these innovation, Broadcom is able to supply a cost effective two-in-one component with reduced I/O number. In this report, the complete FEM SiP is analyzed, including a complete analysis of the RF IC featuring IPDs, the filtering dies and the Internal and External EMI shielding. It also features a cost analysis and a price estimation of the component. Finally, it also integrated a physical comparison with the Mid and High band LTE FEM in the last Apple iPhone X (A1901).


Overview / Introduction


Market Analysis o Market Forecasto Supply Chain

Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

About System Plus

RF Components Market Forecast




Market Analysis

Physical Analysis o Package Overviewo Package Cross-Sectiono Power Amplifiero Switcho Matching RFICo Filter Overviewo Filter Cross-Section

Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Package Views & Dimensions




Market Analysis


Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Package Overview




Market Analysis


Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Package Overview – Switch




Market Analysis


Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Package Cross-Section




Market Analysis


Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Package Cross-Section – Internal Shielding




Market Analysis


Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Power Amplifier – Die Cross-Section




Market Analysis


Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Matching RFIC – Die Cross-Section




Market Analysis


Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Filters – Die Overview




Market Analysis


Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Filters – Die Overview – High-Band




Market Analysis


Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Filters – Die Overview – Mid-Band




Market Analysis


Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Filters – Die Opening – Cells




Market Analysis


Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Filters – Die Cross-Section – TSV




Market Analysis


Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Filters – Die Cross-Section – FBAR Structure




Market Analysis


Physical Comparison


Cost Analysis


Feedbacks

About System Plus

Filters – Physical Data Summary – Scandium Concentration




Market Analysis

Physical Analysis

Physical Comparison o Package Overviewo Package Cross-Sectiono Die Number & Areao Package Shielding


Cost Analysis


Feedbacks

About System Plus

Package View & Dimension

Apple iPhone X – A1865 & A1902©2018 by System Plus Consulting

Apple iPhone X – A1901©2018 by System Plus Consulting

Broadcom AFEM-8072©2018 by System Plus Consulting

Broadcom AFEM-8056 & AFEM-8066©2018 by System Plus Consulting




Market Analysis

Physical Analysis

Physical Comparison o Package Overviewo Package Cross-Sectiono Die Number & Areao Package Shielding


Cost Analysis


Feedbacks

About System Plus

Package Opening – Die area




Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flowo Dies Processo Filter Fabrication Unito Filter Process Flowo Packaging Fabrication Unito Packaging Process Flow

Cost Analysis


Feedbacks

About System Plus

Filters – Process Flow (1/7)




Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flowo Dies Processo Filter Fabrication Unito Filter Process Flowo Packaging Fabrication Unito Packaging Process Flow

Cost Analysis


Feedbacks

About System Plus

Packaging Process Flow (1/3)




Market Analysis

Physical Analysis

Physical Comparison


Cost Analysiso Synthesiso Filter Wafer & Die Costo Matching RFIC Wafer & Die

Costo Packaging Costo Component Cost


Feedbacks

About System Plus

Filter Front-End Cost




Market Analysis

Physical Analysis

Physical Comparison





Feedbacks

About System Plus

Matching RFIC Front-End Wafer & Die Cost




Market Analysis

Physical Analysis

Physical Comparison





Feedbacks

About System Plus

Component Cost




Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis

Selling Price Analysiso Financial Ratioso Manufacturer Price

Feedbacks

About System Plus

Filter & FEM Estimated Selling Price




Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


Feedbacks

About System Pluso Company serviceso Related reportso Contacto Legal

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https://www.i-micronews.com/reports/rf-devices-technologies/product/p5g%E2%80%99s-impact-on-the-rf-front-end-industry.html

https://www.i-micronews.com/reports/rf-devices-technologies/product/thin-film-integrated-passive-devices.html

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