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BS66FV340/350/360 Application and Development in Touch with Voice Products AN0398E V1.10 1 / 24 December 11, 2016 BS66FV340/350/360 Application and Development in Touch with Voice Products D/N: AN0398E Introduction As an extension to the BS66F340/350/360 series, Holtek has also produces these Enhanced Touch Key Voice Flash MCUs, the BS66FV340/350/360. These devices integrate the new version enhanced Touch Key Engine (V3.2), which with its hardware acceleration circuit, has enhanced the Touch Key algorithm efficiency. The integrated 16-bit D/A converter and audio power amplifier meet the demands for high-quality voice and provide users with integrated touch key and voice product solutions. Additionally, the speaker output is controlled by an internal digital volume control function instead of using external variable resistors. With their high level of functional integration, these devices can have a master control MCU, touch keys and voice functions completely implemented within the same MCU. By using the SPI interface to connect to external SPI Flash Memory, the voice data can be easily updated and the difficulty of handling different languages and production inventory costs can be more efficiently managed. According to their different voice application requirements, such as voice quality, voice length and voice changes, etc., users can flexibly select different SPI Flash Memory capacities. The BS66FV3x0 series can be used in products which include both touch keys and voice functions, such as home appliances, normal consumer products, health care products, etc. Some of the special characteristics of the devices can be seen in their combination of touch key and voice functions within an MCU, their industrial quality specification of -40°C~85°C operating temperature, operating voltage range of 2.2V~5.5V, Flash Program Memory capacity of 4K/8K/16K words, SRAM Data Memory capacity of 512/768/1024 bytes, touch keys pin-shared with I/O ports, I²C, SPI and UART interfaces, integrated high accuracy RC oscillator, four selectable Low Voltage Reset voltage options and eight selectable Low Voltage Detector voltage options. Containing 20, 24 or 28 touch keys and in addition to the advantages of the previous generation devices, these new devices have an enhanced touch detection rate and improved anti-interference abilities. Their internal LED drivers support four segments with current output control, which can drive LED displays directly without requiring additional external current-limiting resistors or transistors, reducing the number of external components and reducing costs extensively. The software controlled LCD driver extends the application area to include LCD display products.

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Page 1: BS66FV340/350/360 Application and Development in Touch ......BS66FV340/350/360 Application and Development in Touch with Voice Products AN0398E V1.10 2 / 24 December 11, 2016 The devices

BS66FV340/350/360 Application and Development in Touch with Voice Products

AN0398E V1.10 1 / 24 December 11, 2016

BS66FV340/350/360 Application and Development in Touch with Voice Products

D/N: AN0398E

Introduction As an extension to the BS66F340/350/360 series, Holtek has also produces these

Enhanced Touch Key Voice Flash MCUs, the BS66FV340/350/360. These devices

integrate the new version enhanced Touch Key Engine (V3.2), which with its hardware

acceleration circuit, has enhanced the Touch Key algorithm efficiency. The integrated 16-bit

D/A converter and audio power amplifier meet the demands for high-quality voice and

provide users with integrated touch key and voice product solutions. Additionally, the

speaker output is controlled by an internal digital volume control function instead of using

external variable resistors. With their high level of functional integration, these devices can

have a master control MCU, touch keys and voice functions completely implemented within

the same MCU. By using the SPI interface to connect to external SPI Flash Memory, the

voice data can be easily updated and the difficulty of handling different languages and

production inventory costs can be more efficiently managed. According to their different

voice application requirements, such as voice quality, voice length and voice changes, etc.,

users can flexibly select different SPI Flash Memory capacities. The BS66FV3x0 series can

be used in products which include both touch keys and voice functions, such as home

appliances, normal consumer products, health care products, etc.

Some of the special characteristics of the devices can be seen in their combination of

touch key and voice functions within an MCU, their industrial quality specification of

-40°C~85°C operating temperature, operating voltage range of 2.2V~5.5V, Flash

Program Memory capacity of 4K/8K/16K words, SRAM Data Memory capacity of

512/768/1024 bytes, touch keys pin-shared with I/O ports, I²C, SPI and UART interfaces,

integrated high accuracy RC oscillator, four selectable Low Voltage Reset voltage options

and eight selectable Low Voltage Detector voltage options. Containing 20, 24 or 28 touch

keys and in addition to the advantages of the previous generation devices, these new

devices have an enhanced touch detection rate and improved anti-interference abilities.

Their internal LED drivers support four segments with current output control, which can

drive LED displays directly without requiring additional external current-limiting resistors

or transistors, reducing the number of external components and reducing costs

extensively. The software controlled LCD driver extends the application area to include

LCD display products.

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The devices have an internal 8-channel 12-bit A/D converter for temperature, humidity or

other signal measurements, an internal RTC clock with extremely low power consumption

and an integrated EEPROM memory for storing application parameters and settings

directly. By also including Holtek’s In-Application program technology, users have a

convenient means with which to directly store a large number of data, parameters and

settings and as well as having the ability to update their application programs.

As is the case with other Holtek 8-bit MCUs, these devices have a full array of protection

features including high noise immunity, Watchdog Timer and Low Voltage Reset to

provide maximum protection when operating in electrically hostile environments. During

product development, by providing an e-Link coupled with OCDS EV devices and

together with Holtek’s new touch switch software development platform (Touch MCU

Workshop) coupled with the voice function library, users have all the tools to hand to

ensure rapid touch and voice product development. Regarding voice product

development, users can use the professional mode of the new voice development

platform (Voice MCU Workshop) to generate a voice file, which will be programmed into

the external SPI Flash Memory. These devices are available in 48-pin LQFP (7mm×7mm)

and 44-pin LQFP (10mmx10mm) package types.

BS66FV340/350/360 Main Specification Comparison Table

Note : The SPIA is a hardware SPI serial interface, which is specifically used to interface

to external SPI Flash Memory for voice data accessing and can implement a level

shift function via its VDDIO pin.

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Block Diagram

Application Circuits

Traditional Solution

BS66FV3x0 SoC Solution

Master MCU

SPIFlashROM

PowerAmplifier+

Touch Peripheral

MCU

Voice MCU

BS66FV3x0(SoC)

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Touch Project Development

Touch MCU Development Platform – Touch MCU Workshop

In order to help customers rapidly develop their touch products, Holtek provides a Touch

MCU Workshop to assist customers to quickly implement touch switch functions. The

main features are as follows:

• Customers do not need to develop the underlying touch program code themselves

• Easy to use allowing entry-level developers can get started quickly

• The touch key function can be implemented using drag and drop operations

• Based on the program framework generated by the platform, users can modify or expand their program

• Easy to add other MCU functions besides touch key function for fast application development

• Open libraries for which users can add their own MCU functional program

• Can be an assistive tool for project management

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Touch MCU workshop software interface description:

• Setup the MCU I/O pins as the touch keys

• Setup the touch library parameters

• Provides program compiler and programming functions. The program can be downloaded to the MCU after successful compilation.

• Code generator − Based on the program framework generated by the platform, advanced users can

use the HT-IDE3000 to continue with project devlopment.

• Tuning Software − Provides touch key sensitivity adjustment function − Allows users to observe the other touch key condition immediately after adjusting

one touch key with the internal oscilloscope display.

Touch MCU Workshop Development Flow:

The Touch MCU Workshop software can be freely downloaded on the Holtek website for

which a Youtube video is provided to show a practical operation demo. These allow users

to quickly learn how to use the touch development platform to complete their projects.

Development Platform

Model Function

Holtek Touch MCU Workshop Development Platform for Touch MCU

Software

Model Function Note

Holtek Touch MCU Workshop Development Platform for Touch MCU Supports: Windows XP or above

Tools Introduction Video

Model Link

Holtek Touch Key Workshop https://www.youtube.com/watch?v=1iKVCqYjYtA

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Touch Software Library

The Holtek touch software library no longer just includes touch functions, but also

provides peripheral functional modules such as LED drivers, slider functions, wheel

functions, communication functions, voice functions and others.

These functions can be developed by original product engineers or third party agents,

and encapsulated into software packages and then provided to developers who require

their functions. By using these software functions, users are then relieved of the task of

repeated software development thus speeding up product development and lowering the

development threshold for touch key applications.

Software Library Structure and Rules

For functional modularity, it is required to develop software libraries of different functions.

To ensure a standardized method of software library development, some rules including

file composition and naming rules must be established.

A software library should have at least four basic files (it also can add other documents or

schematic diagrams) and the four files must have the same base name and different

extension to distinguish their different purposes.

The four basic files are:

1. xxxx.ASM: the assembly program file. If using C code, replace “.ASM” with “.C”. If there

is a confidentiality requirement then use the “.OBJ” extension. The touch software

library is in an .OBJ format.

2. xxxx.CEX: the reference file provided by the software library for other software libraries.

(C language)

3. xxxx.AEX: the reference file provided by the software library for other software libraries.

(Assembly language)

4. xxxx.INC: if the parameters, names or functions which are set in other software

libraries are used in the program file, the package library’s external reference file (.AEX

file or .CEX file) must be added into the .INC file.

Advantages of using a software library:

• Helps users get started quickly and avoid repeating the same functional development

• Shorten the product development cycle

• Easy program management

• Users can generate related library according to their requirements

• Each functional module is independent which allows different people at the same time to do different module development.

• Compatible with both assembler and C language and can used together with the platform

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Used with the Touch Development Platform:

• Using the platform allows direct adjustment of some parameters including sensitivity, I/O configuration, etc.

• Supports superposition of different functional modules

• Users can modify the application function themselves then add it to the platform

• More efficient program file management

• Resource sharing

Touch Key Layout Considerations Layout Considerations: http://www.holtek.com.tw/english/tech/appnote/uc/pdf/ha0353e.pdf

16-bit DAC and Power Amplifier The BS66FV3x0 devices include a fully integrated Class AB audio power amplifier with a

high output power of 1.5W @ 5V and 10% THD+N. The pins are described below.

SP+ Power amplifier positive output SP- Power amplifier negative output AUD_IN Power amplifier input BIAS Power amplifier internal reference voltage AUD 16-bit DAC output AVDD_PA Power amplifier positive power supply AVSS_PA Power amplifier negative power supply

The 16-bit DAC and power amplifier can be easily controlled by MCU registers as shown

below.

DAEN(PLAC.0): Controls the 16-bit DAC. Setting the bit high will enable the 16-bit DAC.

PAEN(PLAC.1): Controls the Power Amplifier. Setting the bit high will enable the Power

Amplifier. The 16-bit DAC output pin is AUD. Its data registers are PLADL (Low Byte) and

PLADH (High Byte). The software uses the Timer Mode of the Timer Module to generate

a regular interrupt. For example an interrupt will be generated every 125µs for a voice

sampling frequency of 8kHz. When the interrupt time has elapsed, the voice data read

from the SPI Flash Memory will be written into the 16-bit DAC by software, then amplified

via the integrated Power Amplifier and output to drive the speakers.

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The following example shows how the CTM0 generates an 8kHz interrupt in the Timer

Mode for fSYS =16MHz:

;CTM0 Setting(Timer Mode), Timer Counter Clock=fSYS/4=4MHz

SET T0M1

SET T0M0 ;Timer Mode

SET T0CCLR ;Compare A match

SET CTMA0E ;CTM0 Comparator A match interrupt control

CLR TM0DL

CLR TM0DH

;------8kHz---------------------

MOV A,LOW(4000/8)

MOV TM0AL,A

MOV A,HIGH(4000/8)

MOV TM0AH,A

SET T0ON ;CTM0 Enable

SET MF0E ;MF0(CTM0) Enable

To avoid the annoying "pop" caused by the DAC and the audio power amplifier during

on/off operations, the Ramp up and Ramp down processes are necessary.

First initialise the DAC 16-bit data registers, known as PLADL/PLADH, to 0000H and

MUTEB=0.

Ramp up - start playing voice

Set PAEN=1 and DAEN=1, increase PLADL/PLADH from 0000H to 8000H gradually,

MUTEB=1, and then begin to play the voice.

Ramp down - stop playing voice

Adjust the current 16-bit DAC contents PLADL/PLADH to 8000H, MUTEB=0, reduce the

DAC content PLADL/PLADH from 8000H to 0000H gradually, then turn off the power

amplifier and DAC by setting PAEN=0 and DAEN=0.

As a general rule, if the Ramp up/down process takes more than 200ms, the pop sound

will not be generated.

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Voice Data

The voice data is stored in an external SPI Flash Memory. The stored data can be read by

the MCU via an integrated SPI interface as shown below.

The maximum operating voltage of the SPI Flash Memory is 3.6V. Therefore for

applications with 5V system power supply, an external LDO is required to drop the voltage

to 3V which is then connected to the VDDIO pin. Here the PBS05 and PBS04 bits in the

PBS0 register should be set to 10 to select the VDDIO function. The SPIA interface is

powered by the external VDDIO pin, so the SPI interface voltage is 3V.

Note: In the BS66FV3x0 voice product EFT test, the SPI clock line SCK connected to the

SPI Flash Memory is easily disturbed by EFT. Therefore during PCB Layout care must be

taken that the SCK line should be located close to the MCU and the routing length made

as short as possible.

SPI Flash Memory Capacity Selection Example:

Assume that the sampling frequency is 16kHz, the audio format is 16-bit PCM (no

compression). If a 2-minute voice needs to be stored then it requires 16k × 16-bit × 2 × 60

seconds = 30720kbits = 30Mbits. Therefore the required SPI Flash Memory capacity is

32Mbits (Ex: MX25R3235F).

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The following examples are the SPIA SPI_Init and RW_SPI subroutines. The MCU is in

Master Mode, the SPI Flash Memory is in Slave Mode:

;*************************************************************** ;Function Name: SPI_Init ;Objective: Hardware SPIA Intialization ;*************************************************************** SPI_Init: ;SPIA Setting CLR SASPI0 CLR SASPI1 CLR SASPI2 ;SASPI2~ SASPI0=(000): SPI master mode; SPI clock is fSYS/4 SET SAMLS ;MSB First SET SACKEG SET SACKPOLB SET SPIAEN ;Enable SPI Interface SET SACSEN ;Enable SPI CS ;------------------------------------------------------- RET RW_SPI: MOV A,WriteSPIBuf MOV SPIAD,A SZ SAWCOL JMP RW_SPI CHECKTRF: CLR WDT SNZ SATRF JMP CHECKTRF CLR SATRF MOV A, SPIAD MOV READSPIBUF,A RET Main_Start: : : ;----------------------------------------------------------- ;SPIA I/O Setting SET PCS10 CLR PCS11 ;PC4/SDOA SET PCS12 CLR PCS13 ;PC5/SCKA SET PCS14 CLR PCS15 ;PC6/SDIA SET PCS16 CLR PCS17 ;PC7/SCSAB SET PCPU7 ;PC7/SCSB PULL-HIGH ENABLE MOV A, 00001100B ORM A,SLEDC1 ;SPIA Source Current MAX, (PCPS3,PCPS2)=(1,1) ;----------------------------------------------------------- : : CALL SPI_Init MOV WRITESPIBUF, A SET SACSEN CALL RW_SPI CLR SACSEN : :

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Volume Control

The BS66FV3x0 devices have two volume control methods.

1. External variable resister volume control – analog method

2. Digital volume control

External Variable Resister (VR) Volume Control – analog method:

Connect an external variable resistor between the DAC output AUD and the Power

Amplifier input AUD_IN to control the volume.

Digital Volume Control:

No external variable resistor VR is required. The digital volume can be adjusted by the

USVC[6:0] bits in a range of +6dB to -32dB with each step having a 0.5dB (big) or 1dB

(small) increment. MUTEB, bit 7 in the USVC register, is the speaker mute control bit.

When this bit is cleared to 0, the speaker will be muted.

Application circuits are shown below:

• 5V Application Circuit

BIAS

AUD

AUD_IN

SP+SP-

I/O

SCOMxSSEGx

VSS AVSS_PA

PC4/SDOAPC5/SCKAPC6/SDIAPC7/SCSAB

SPI FlashROM

4

PB2/VDDIO

V33

F/W enable VDDIO function by PBS0 register

Speaker8Ω

XT2

XT1

OSC1

OSC2

RX

RS488 Transceiver

TX

I/O RS_DIR

System Crystal

32768HzRTC

TM PWM / Capture

1nF

1kΩ

Note:VR (Variable Resistor)for Volume Control

10kΩ

1mF

1μF

1nF

2.7kΩ Note:Digital Volume ControlWithout VR

VSS: Digital GroundAVSS_PA: Power Amplifier Ground

47μF

LDO

VCC(5V)HT7133-1

10μF

V33

VDD

1Ω 10μFKey1

Keyx

A/DAnalog signal

SPI Flash ROM maximumoperating voltage is 3.6V

VDD AVDD_PA

0.1μF 22μF

VCC(5V)

VDD: Digital PowerAVDD_PA: Power Amplifier Power

VDD

10μF

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• 5V Application Circuit

BIAS

AUD

AUD_IN

SP+SP-

I/O

SCOMxSSEGx

VSS AVSS_PA

PC4/SDOAPC5/SCKAPC6/SDIAPC7/SCSAB

SPI FLASHROM

4

PB2/VDDIO

Speaker8Ω

XT2

XT1

OSC1

OSC2

RX

RS488 Transceiver

TX

I/O RS_DIR

System Crystal

32768HzRTC

TM PWM / Capture

1nF

1kΩ

Note:VR (Variable Resistor)for Volume Control

10kΩ

1mF

1μF

1nF

2.7kΩ Note:Digital Volume ControlWithout VR

VSS: Digital GroundAVSS_PA: Power Amplifier Ground

Key1

Keyx

A/DAnalog signal

SPI Flash ROM maximumoperating voltage is 3.6V

VDD AVDD_PA

0.1μF 22μF

VCC(3.3V)

VDD: Digital PowerAVDD_PA: Power Amplifier Power

VDD

47μF

VCC(3.3V) VDD

1Ω 10μF

VDD

F/W disable VDDIOfunction by PBS0 register

10μF

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Taking the BS66FV340 Demo Board as an example, the actual application circuit is

described as follows:

AVDD_PA should be connected to the positive power supply directly and the AVSS_PA

should be connected to the negative power supply directly. As AVDD_PA will output a

large current when the Audio Power Amplifier is functioning, it may cause the AVDD_PA

voltage to experience rather large fluctuations. Therefore, it is necessary to connect the

external R7/C2/C3 components as a filter to prevent the MCU Power VDD from

interference.

PCB Layout Considerations:

• Give priority to the power filter capacitor which should be placed as close to the MCU as possible. Other components should also be located as close to the MCU as possible, especially the SPI clock line length should be as short as possible.

• To avoid interference caused due to instantaneous large currents generated when the Audio Power Amplifier is operating, the two power groups, VDD and AVDD_PA, should have their power sources routed separately.

• The Audio Power Amplifier power supply pin AVDD_PA should be connected to the positive power supply directly. The routing width must not be less than 12 mils.

• To avoid interference caused due to instantaneous large currents generated when the Audio Power Amplifier is functioning, the two ground groups, VSS and AVSS_PA, should be routed separately.

• The Audio Power Amplifier ground pin AVSS_PA should be connected to the negative power supply directly. The routing width must not be less than 12 mils.

• The two ground groups, VSS and AVSS_PA should be independently connected to ground using poured copper.

• Reserve enough space for VDD and VSS line routing during component placement.

• The Power Amplifier output SP+/SP- routing width must be thick and without vias if possible.

• As rectangular outlines more easily accumulate charge there exists point discharge effects. Therefore PCB stability will be adversely affected. To solve this problem it is better to use 45 degree angles or arcs.

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Load Customised Voice Source Files

For voice product development, users can use the professional mode of the voice

development platform (Voice MCU Workshop) to load the customised voice files, which

can be programmed into the external SPI Flash Memory. A voice function library can then

be called to implement the voice function.

The voice source file can be user-defined wav PCM file, which is loaded by using the

professional mode of the Voice MCU Workshop.

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The Voice MCU Workshop can be downloaded from the Holtek website. A YouTube

Introduction video is also provided for additional assistance. These allow users to quickly

learn how to use the Voice MCU Workshop to complete their projects.

Development Platform

Model Function Note

Holtek Voice MCU Workshop Development Platform for Voice MCU Can be used with ESK-66FV-100+ e-Link

Software

Model Function Support Hardware Note

Holtek Voice MCU Workshop Voice development platform ESK-66FV-100 + e-Link Supports :

Windows XP or above

Tools Introduction Video

Model Link

Holtek Voice MCU Workshop https://www.youtube.com/watch?v=fFlP32HpEfM&feature=youtu.be

Touch with Voice Project Development

Touch with Voice Development Flow

Generate voice data by using the professional mode of the

Voice MCU Workshop

Program Flash Memory voice data

Create a project by using the Touch MCU Workshop

Add the voice library

USER_PROGRAMAdd voice playing function

Complete

Set the parameters in the voice software library

Voice MCU Workshop

Touch MCU Workshop

IDE3000

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Generate Voice Data Select the required MCU and set the HIRC options

Add the voice source file and choose the HT-PCM16 mode

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Add all the voice sources

Generate the voice data

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Program the Flash Memory Voice Data

Create a Project Using the Touch MCU Workshop

Enter the project name and choose the MCU that is used in the project.

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Click the "Configuration Options"

Set the HIRC option

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Add the voice library In the "Toolbox" →"Component", select the "BS66FV3x0_PCM16_V100" and drag it to

the IC.

In the "Toolbox" → "Component", select the "BS66FV_VOICE_V100" and drag it onto the

IC.

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Set the parameters in the Voice software Library Setup PB2 to be used as IO or VDD_IO

Set RAMP_Time

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Finish the Project Build Project

Add a Play Voice Function into the USER_PROGRM

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Application Circuit – BS66FV340 Touch with Voice Demo Board

BS66FV340 Demo Board

Power Circuit

SPI Flash ROM

Speaker Output

BS66FV340

LDO

Touch Key

SPI Flash

BS66FV340

Display

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BS66FV340/350/360 Application and Development in Touch with Voice Products

AN0398E V1.10 24 / 24 December 11, 2016

Touch + Voice Library MCU Resources (PCM16)

MCU ROM Usage RAM Usage

BS66FV340 2196/4096(53%) 324/512(63%)

BS66FV350 2236/8192 (27%) 372/768(48%)

BS66FV360 2343/14632(14%) 424/1024(41%)

Used Interrupt Addresses

Interrupt Name Address

Multi-Function 0 04H

Touch key 10H

Multi-Function 2 20H

Time Base 0 24H