bta212x-600b

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Philips Semiconductors Preliminary specification

Three quadrant triacs BTA212X series Chigh commutation

GENERAL DESCRIPTION QUICK REFERENCE DATA

Glass passivated high commutation SYMBOL PARAMETER MAX. MAX. MAX. UNIT

triacs in a full pack, plastic envelopeintended for use in circuits where high BTA212X- 500C 600C 800Cstatic and dynamic dV/dt and high VDRM Repetitive peak off-state 500 600 800 VdI/dt can occur. These devices will voltagescommutate the full rated rms current IT(RMS) RMS on-state current 12 12 12 Aat the maximum rated junction ITSM Non-repetitive peak on-state 95 95 95 Atemperature, without the aid of a currentsnubber.

PINNING - SOT186A PIN CONFIGURATION SYMBOL

PIN DESCRIPTION

1 main terminal 1

2 main terminal 2

3 gate

case isolated

LIMITING VALUESLimiting values in accordance with the Absolute Maximum System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

-500 -600 -800VDRM Repetitive peak off-state - 500

1 6001 800 Vvoltages

IT(RMS) RMS on-state current full sine wave; - 12 AThs 56 CITSM Non-repetitive peak full sine wave;

on-state current Tj = 25 C prior tosurget = 20 ms - 95 At = 16.7 ms - 105 A

I2t I2t for fusing t = 10 ms - 45 A2sdIT/dt Repetitive rate of rise of ITM = 20 A; IG = 0.2 A; 100 A/ s

on-state current after dIG/dt = 0.2 A/striggering

IGM Peak gate current - 2 AVGM Peak gate voltage - 5 VPGM Peak gate power - 5 WPG(AV) Average gate power over any 20 ms - 0.5 W

periodTstg Storage temperature -40 150 CTj Operating junction - 125 C

temperature

T1T2

G1 2 3

case

1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac mayswitch to the on-state. The rate of rise of current should not exceed 15 A/s.

October 1997 1 Rev 1.000

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ISOLATION LIMITING VALUE & CHARACTERISTICThs = 25 C unless otherwise specified

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNITVisol R.M.S. isolation voltage from all f = 50-60 Hz; sinusoidal - 2500 V

three terminals to external waveform;heatsink R.H. 65% ; clean and dustfree

Cisol Capacitance from T2 to external f = 1 MHz - 10 - pFheatsink

THERMAL RESISTANCES

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Rth j-hs Thermal resistance full or half cyclejunction to heatsink with heatsink compound - - 4.0 K/W

without heatsink compound - - 5.5 K/W

Rth j-a Thermal resistance in free air - 55 - K/Wjunction to ambient

STATIC CHARACTERISTICSTj = 25 C unless otherwise stated

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

IGT Gate trigger current2 VD = 12 V; IT = 0.1 A

T2+ G+ 2 - 35 mAT2+ G- 2 - 35 mAT2- G- 2 - 35 mA

IL Latching current VD = 12 V; IGT = 0.1 AT2+ G+ - - 20 mAT2+ G- - - 30 mA

T2- G- - - 20 mAIH Holding current VD = 12 V; IGT = 0.1 A - - 15 mAVT On-state voltage IT = 17 A - 1.3 1.6 VVGT Gate trigger voltage VD = 12 V; IT = 0.1 A - 0.7 1.5 V

VD = 400 V; IT = 0.1 A; Tj = 125 C 0.25 0.4 - VID Off-state leakage current VD = VDRM(max); Tj = 125 C - 0.1 0.5 mA

DYNAMIC CHARACTERISTICSTj = 25 C unless otherwise stated

SYMBOL PARAMETER CONDITIONS MIN. TYP. UNIT

dVD/dt Critical rate of rise of VDM = 67% VDRM(max); Tj = 125 C; exponential 1000 - V/ soff-state voltage waveform; gate open circuit

dIcom/dt Critical rate of change of VDM = 400 V; Tj = 125 C; IT(RMS) = 12 A; without 3 14 A/mscommutating current snubber; gate open circuit

tgt Gate controlled turn-on ITM = 12 A; VD = VDRM(max); IG = 0.1 A; - 2 stime dIG/dt = 5 A/s

2 Device does not trigger in the T2-, G+ quadrant.


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MECHANICAL DATA

Dimensions in mm

Net Mass: 2 g

Fig.1. SOT186A; The seating plane is electrically isolated from all terminals.

Notes1. Refer to mounting instructions for F-pack envelopes.2. Epoxy meets UL94 V0 at 1/8".

10.3max

3.23.0

4.6max

2.9 max

2.8

seating

plane

6.4

15.8max

0.6

2.5

2.54

5.08

1 2 3

3 max.not tinned

3

0.5

2.5

0.9

0.7

M0.4

15.8max.

19max.

13.5min.

Recesses (2x)

2.50.8 max. depth

1.0 (2x)

1.3


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DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

Product specification This data sheet contains final product specifications.

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above oneor more of the limiting values may cause permanent damage to the device. These are stress ratings only andoperation of the device at these or at any other conditions above those given in the Characteristics sections ofthis specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Philips Electronics N.V. 1997

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of thecopyright owner.

The information presented in this document does not form part of any quotation or contract, it is believed to beaccurate and reliable and may be changed without notice. No liability will be accepted by the publisher for anyconsequence of its use. Publication thereof does not convey nor imply any license under patent or otherindustrial or intellectual property rights.

LIFE SUPPORT APPLICATIONSThese products are not designed for use in life support appliances, devices or systems where malfunction of theseproducts can be reasonably expected to result in personal injury. Philips customers using or selling these productsfor use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resultingfrom such improper use or sale.


bta212x-600b

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