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WaferMappingpg. 15

Curve Tracepg. 15

Questions To Askpg. 19

Buyer’s Guide

TM

2

Typical Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

Devices Tested . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Table Of Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6Throughput of 5300HXComparison 5300HX / 5300X Test Methods

Range Extensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7Extended High Current Extended Low Current

DSP-100 - Remote Start / Display . . . . . . . . . . . . . . . . . . . . . . . .7

Test Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8Binning / Sorting External Relays

Datalogging / Data Management . . . . . . . . . . . . . . . . . . . . . . . . .9

Diagnostics / Auto Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

Adaptors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11Pin Programmable Scanner (30A / 1200V) . . . . . . . . . . . . .11Output Programmable Scanner (50-100A, 2KV) . . . . . . . .12Multiplexer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13OVP / Sidac / Diac Test Adaptor . . . . . . . . . . . . . . . . . . . . .13Multiple OVP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Fixtures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Handler / Prober Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Wafer Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Curve Trace . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

Test Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

Gated Device Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Weight and Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

Configuration Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

Selecting Testers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19Questions To Ask

Contents

3

5300HX-L with High Current Deck and DSP-100Measurements from 20pA - 1200A and 10mV - 2000V

Typical Configuration

4

Transistor Zener Quadrac®Triac MOV JFETSCR STS/SBS MOSFETOVP Solid State IGBT DiacDiode Sidac Opto-Coupler

Multiple DevicesMixed DevicesOpto LogicOpto SwitchOpto Triac

Programmable OVPGated Devices / SLIC Protector5 Pin Module

RegulatorPower HybridsCustom DevicesRelay (1-4 Pole) A, B, C Form

Quadrac® is a registered trademark or trademark of Teccor Electronics.

DISCRETE DEVICES

ARRAYS / LOGIC

PROGRAMMABLE OVERVOLTAGE PROTECTORS

IC’s/ HYBRIDS/ RELAYS

Devices Tested

5

DEVICE REQUIREDADAPTOR LEAKAGE BREAKDOWN GAIN ON-STATE OFF TRIGGER LATCH HOLD BREAKOVER

TransistorSustaining Tests useADP-410

IEBO, ICBO,ICEO/R/S/V

BVCBO, BVEBO,BVCEO, VCESUS

hFE

VCESAT,VBESAT,VBEON

Triac IDRM, IRRM VD+, VD- VT+, VT-IGT 1/2/3/4VGT 1/2/3/4

IL+, IL- IH+, IH-

SCR IDRM, IRRM,IGKO

VDRM, VRRM,BVGKO

VTM IGT, VGT IL IH

MOSFETIDSS/V,IGSSF,IGSSR

BVDSSVGSTH,gFS

VDSON, VSD,IDON, VGSON

Diode IR BVR VF

Zener IR BVZ, ZZ(1KHz) VF

Opto-Coupler ADP-310 ICOFF,

ICBO, IRBVCEO, BVCBO

CTR,hFE

VCESAT, VSAT

(COUPLED), VF

Regulator ADP-320Regulation,VO, VIN

MOV,TransientSuppressor

ID+, ID- VN+, VN-VC+, VC-

MOV-2500 Soak to 90 Secs, 2500V,10mA

J-FET IGSS,IDOFF, IDGO

BVDGO, BVGSS IDSS, VDSONVGSOF

F

Opto-Switch ICOFF VD

Notch = IGT1,IGT4VON=V=SAT(coupled)

ION=IGT1,IGT4IOFF=IGT1,IGT4

Diac ADP-350 VV+, VV-, V

VBO+, VBO-,IBO+, IBO-,Symmetry

VBO

Opto-Logic ADP-370 IRIFON, VOL,Hysteresis

IFOFF,VOH

SSOVP2KV Req’d

ADP-360 ADP-340-4/5 IDRM, IRRM

VCLAMP+,VCLAMP-, VZ+,VZ-

VT+, VT- IH+, IH-VBO+, VBO-,IBO+, IBO-

SSOVP/5 PinModule

ADP-340-5Tip-Com, Ring-Com,Tip-Ring

ID+, ID-, CoilResistance,Continuity

VB+, VB-, VZ+,VZ-,VL (100V/µSec)

VT+, VT- IH+, IH-

VBO+, VBO-,IBO+, IBO-VBB+, VBB-

QUADRAC® ADP-350 IDRM, IRRM VD+, VD- VT+, VT- IH+, IH-VBO+, VBO-,IBO+, IBO-

SIDAC2KV Req’d. ADP-360 VBB+, VBB- VT+, VT- IH+, IH-

VBO+, VBO-,IBO+, IBO-

IGBT ICES, IGESF,IGESR

BVCES VGETH

VCESAT,ICON, VGEON,VF

STS, SBS ADP-350 IH+, IH-

VSW+, VSW-,VBO+, VBO-,ISW+, ISW-

RELAY ADP-390 RCONT,RCOIL

OPTIME,RELTIME

VOPER,VREL

GATEDDEVICE ADP-340-5G IR, IG, IGKS,

IDVF, VT IGT, VGT IH VBO, IBO

Table of Tests

NOTE: Parameters that require two tests, such as GFS, are calculations.

6

Throughput is dependent upon a number of variables including number of test steps,absolute value of programmed currents, programmed soak time and handler/probermovement time.

For example, a six test step MOSFET test program (VGSTH, BVDSS, RDSON, 2 VGSON,and GFS calculation) takes approximately 96 milliseconds to run and provides a throughputof up to 37,440 devices per hour.

The 5300HX and 5300X differ in two ways:Datalog Speed: the 5300HX is fastest1 KHZ Zener Impedance: standard on the 5300HX

All other options, test complements, available adaptors, and features are the same,including:

50A / 1KV Standard100A Optional2KV Optional99 Tests (256 Tests Optional)96 SortsBranchingHandler InterfaceProgrammable Relay DriversAuto CalibrationSelf TestData ManagementCan be linked with other test equipment using LabView® or other similar software

Optional tests can be created for connection to external test equipment.

The Model 5300HX incorporates single testmeasure techniques to assure a measuredvalue with only one application of stimulus,including tests such as hFE. This minimizestest time, minimizes internal device heatingand maximizes throughput.

High resolution assures tests like RDSONto an accuracy of ± 0.5 milliohm at 1 A testcurrent.

LabView® is a registered trademark or trademark of National Instruments.

Throughput of 5300HX

Comparison 5300HX/5300X

Test Methods

Performance

7

HC-500 (500A)HC-1000 (1000A)HC-1200 (1200A)

On-state current tests such asVT, VF, VCESAT, VDSON, andRDSON can be extended tothe limits indicated above byuse of the High Current Deckpictured. A 500A version canbe upgraded to 1000A or1200A. HC-500 with DSP-100shown testing a high currentdevice.

LC-1000

Leakage test low end can beextended downward tomeasurements as low as20pA with 1pA resolution usingthe Low Current Deckpictured. Low Current Deck isalso shown connected to thetester for testing from handler.

Range Extensions

DSP-100 Remote Start / Display

Extended High Current

Extended Low Current

Provides a manual start of test anddisplays the Bin or Sort upon testcompletion. Also used for MultiplexerManual Stations.

8

Creating and editing test programs for the STI 5000 Series testers is both easy and intuitive.Each test program contains a series of test steps (these steps can be actual device tests orcalculations), bin/sort plan, and if required, relay plan. Test steps are added or edited with asingle or double mouse click. A device test window or calculation window is opened. In thedevice test window the limit parameter value is entered along with, if applicable, other biasvoltages or currents (one of the biases can be a calculation), load resistors, etc. In thecalculation window the calculation limit is entered along with the name and units to be used indisplaying the results and then the actual calculation which may reference any test result froma previously entered device test.

By default all programmed test steps are set to pass on SORT/BIN 1. Each test step may beset for pass, fail or do not care for each sort. Each sort may be set to any of the logical bins.Binning and sorting can be as simple as running all of the programmed test steps and thenfinding the first qualifying sort or as complex as branching on the first non-qualifying test to thenext valid sort. In this more complex mode it is quite possible that only a subset of theprogrammed tests will be run on a given device and that all devices tested may not run thesame subset of test steps.

Four to fifteen (depending on options supplied with the STI 5000 Series Tester) relay driverscan be assigned to any programmed test step. These relay drivers can be used to provideexternal loads or connections for a given device test.

Binning / Sorting

External Relays

Test Programming

9

Datalogging is defined as capturing the actual test values for later use. The STI 5000 SeriesTesters use the USB port (or serial port) to send the test results to the PC for storage anduse. Datalog can be selected individually per test. The entire test program can be set to Off(no Datalog), All (Datalog for all test steps selected), Every Nth (Datalog on every Nthdevice), Every Nth Sort 1 (Datalog on every Nth Sort 1), On Sort (Datalog each time thespecified sort is found), or On Not Sort (Datalog each time the specified sort is not found).

The logged data may be stored to disk, displayed on the PC screen, sent directly to Excel®,or any combination of the three. Data stored to disk can be used to create a columnar printfile (data printed in columnar format), a statistics file (number, high, low, average and sigma),or converted into a file that can be imported into Excel®. If the Wafer Mapping Option hasbeen selected, the data can be used to create a wafer map based on bin, sort, or testparameter.

Macros for use with Excel® to produce statistics, histograms, columnar format, and other dataanalysis and formats are available.

Excel® is a registered trademark or trademark of Microsoft Corporationin the United States and other countries.

Datalogging / Data Management

10

The STI 5000 Series Tester provides extensive diagnostics for the mainframe, low currentdeck, multiplexer, Pin Programmable Scanner, and OVP/Gated OVP adaptor. These selftest diagnostics are built into the tester code, and with the supplied self test fixture, can berun at any time.

In addition, the STI 5000 Series Tester has an extensive auto calibration procedure thatprovides the user the ability to track calibration trends, verify the DAC/ADC combination isfunctioning correctly, and supply calibration factors that will automatically correct the testresult.

Diagnostics / Auto Calibration

ADP401A-8 (4x8 Matrix)ADP401A-16 (4x16 Matrix)

The Pin Programmable Scanner isused for testing multiple devices,mixed pin packages, opto-couplers,opto-logic, and other similar devices.

Any input (drive / sense) can beprogrammed to any of 8 or 16 outputpins. A personality module containsa socket for a specified packagetype. The pins of the package canbe connected to any of the inputdrives for a given test step.

Bias supplies can be added.

A, AS G, GS K, KS GND

PIN 1

PIN 2

PIN 3PIN 4

PIN 5

PIN 6

PIN 7

PIN 8

PIN 16

Pers

onal

ityM

odul

epe

rPa

ckag

eTy

peFrom 5000 Series Tester

Assignable Pins forMultiple DevicePackages

ADP-401A-8 with PersonalityModule and DSP-100 shown.

Simplified Diagram ADP-401A-8/16

11

Adaptors

Pin Programmable Scanner 30A/1200V

12

Model 601050A, 2KV, 4-20 Scans100A, 2KV, 2-10 Scans

The Output Programmable Scanneris used for testing high current/highpower multiple devices, hybrids,and other similar devices.

Drive and sense input leads areswitched to one set of outputcables. Up to 20 sets of outputcables can be configured.

Output Programmable Scanner(50-100A, 2KV)

Model 6010 Simplified Diagram

Model 6010, 50A, 2KVwith 8 Scans shown.

13

MUX-3S 3 Output MultiplexerMUX-4S 4 Output MultiplexerMUX-STA Multiplex Manual Station

The multiplexer directs the STI 5000 SeriesTester outputs to one of three or four outputs.These outputs can be handlers, probers, orManual Stations. A Manual Station comes with aDSP-100 bin display / start module.

ADP-360

Single device adaptor for Solid State OVP(SSOVP), Sidac and Diac devices.

ADP-340-5 Adaptor for 5 Pin Modules (2 OVP's, 2 Heat Coils)

ADP-340-5G Adaptorfor: All ADP-340-5 devices

Programmable OVPGated Devices (SLIC Protector)Dual Programmable OVPDual Polarity OVP

Multiplexer

OVP / Sidac / Diac Test Adaptor

Multiple OVP

Multiplexer connected to testerwith two handler stations

ADP-360 connected to testerwith manual fixture

ADP-340-5G with test fixtureconnected

14

A selection of fixtures is available, including:

TO-220/218TO-72TO-5/18TO-92TO-3/66Axial (small and large)DP-4/58 Pin DIP6 Pin TO-5SOT-23, SOT-24, SOT-25, SOT-26D-PAKTO-252SOT-89TO-243D2-PAKSOT-223TO-261SMASMBSMCMELF (MINI-MELF, MICRO-MELF)SO-4, SO-6, SO-8, SO-16SOD-123, SOD-323, SOD-80Custom Fixtures (made for any device type for which a socket is commercially available)Blank

Fixtures

15

A 16 bin handler interface is standard. Logic prober interface is available as an option. Customermay specify handler and interface requirements. Bins or Sorts can be binary coded for use withwafer probers.

The wafer mapping option provides for the X-Y coordinates of the die being tested to be attached tothe Datalog data file and therefore must be configured for the prober being used. The supplied PCsoftware provides the means to create the desired wafer map based upon bin, sort, or parametricdata. Shown below are wafer map examples based on parametric data and sorts.

Parametric Map Sort Map

TRIACIH TEST

Handler / Prober Interface

Wafer Mapping

Curve Trace

16

SCIENTIFIC TEST INC. 5300S/5300HS TEST SPECIFICATIONS

TEST SPECIFICATION

PARAMETER V RANGE I RANGE MAXRES. ACCURACY

LEAKAGE

IR,ICBO, ICEO/R/S/X,IDSS/X,IDOFF, IDRM,IRRM

.10V to 999V (2000V) 1 100NA (20PA)2 to 50MA 1 NA (1PA) 2 1% + 10NA + 20PA/V(1% + 200PA + 2PA/V) 2

IEBO, IGSSF, IGSSR,IGSS, IGKO,IR (OPTO)

.10V to 20V (80V)3 100NA (20PA) 2 to 3A 1 NA (1PA) 2 1% + 10NA + 20PA/V(1% + 200PA + 2PA/V) 2

BREAKDOWN

BVCEO, BVCES(IGBT)(300µS Pulse above 10mA)

.10V to 450V (900V) 1

to 700V (1400V) 1

to 800V (1600V) 1

100µA to 200MAto 100MAto 50MA

1 MV 1% + 100MV

BVDSS, VD, BVCBO,VDRM, VRRM, VBB

.10v to 999V (2000V) 1 100NA to 50MA 1 MV 1% + 100MV

BVR, BVZ .10V to 5.000V to 9.999V to 50.00V to 700V (1400V) 1

to 999V (2000V) 1

BVZ Soak- 50V (100V) 0 to 50ms

to 99secs

10µA to 49.9A (500A) to 25A (250A)to 3Ato 100MAto 50MAto 400mAto 80mA

1 MV 0.4% + 2 LSB

BVEBO, BVGSS,BVGKO

.10V to 20V (80V) 3 100NA to 3A 1 MV 1% + 10MV

VCESUSVCEOSUS, VCERSUS,VCEVSUS

VCE: to 1500VInductive Kickback,35mH choke

IC: to 4A 0.5V 2% + 0.5V

IMPEDANCEZZ (1 kHZ)0.1 to 20 K

0.1V to 200V DC(measure 50µV to 300mVrms)

100µA to 300mA DC 0.001 1µV

1% + 1% Range

GAINhFE (1 to 99,999)CTR (.01 to 99,999)

VCE: .10V to 5.00V 5

to 9.99V to 49.9V

IE: 10µA to 49.9A (500A)4

derate to 25A (250A)4

derate to 3AIF, IB: 100NA to 10A

.01 hFE

.0001 CTRVCE: 1% + 10MVIC: 1% + 100NAIF, IB: 1% + 5NA

ON STATE

VCESAT, VBESAT,VBEONVF, VTVDSON, IDON, VGSONVGEON VF (Opto-Diode)

VCE, VD, VF, VT: .10Vto 5.00Vto 9.99V

VGS, VGE, VBE, VF:.10V to 9.99V

IE, VT, IF, ID: 10µAto 49.9A (500A) 4

derate to 25A (250A) 4

IB, IF, IGT: 100NA to 10A (40A)7

1MV V: 1% + 10MVIE, IF, ID, IT: 1% + 100NAIB, IGT: 1% + 5NA

VGSTH, VGETH .10V to 49.9V ID: 100µA to 3A 1MV 1% + 10MVVO (Regulator) VO: .10V to 20V (50V)3

VIN: .10V to 49.9VLoad: Resistive or Electronic

ID: 1MA to 5A 1MV 1% + 10MV

IIN (Regulator) VIN: .10V to 20V (80V)3

Load: RGK, 1K, 10K,EXT, OPEN, SHORT

IIN: 1MA to 3A 10NA 1% + 5NA

VC .10V to 49.9V (99.9V) 6 10mA to 10A 1mV 1% + 10mV

OFF VGSOFF VO: .10V to 20V (80V) 3 ID: 100NA (20PA)2 to 3AVDS: .10V to 50V

1MV 1% + 10MV

TRIGGER

IGTVGT

VOPER (Relay)

VD: 5V to 49.9VVGT: .10V to 20V (80V) 3

.10V to 50V

IAK: to 3AIGT: 100NA to 3ARL: 12, 30, 100 , EXT

10NA1mV.10V

1% + 5NA1% + 10mV1% + .10V

HOLD

IH

VRELEASE (Relay)

VD: 5V to 49.9V.10V to 50V

IH: 1.5AIGT: 100NA to 3ARL: 12, 30, 100 , EXT(Initial IAK set by RL)

1µA.10V

1% + 2µA1% + .10V

LATCHIL(Tested indirectly, noexact value)

VD: 5V to 49.9V IL: 100µA to 3AIGT: 100NA to 3ARL: 12, 30, 100 , EXT

N/A N/A

BREAKOVER

VBO, IBO (SSOVP)VBO, IBO (STS, DIAC)VBO, IBO (SIDAC)VS, IS (SBS, STS)

0.10 to 400V 1

0.10 to 20V (80V) 3

0.10 to 400V 1

0.10 to 20V (80V) 3

10mA to 900mA1µA to 200µA1µA to 1mA1µA to 200µA

1mV 1% + 100mV1% + 10mV1% + 100mV

Accuracy specifications are in addition to ± 1 digit in readout.

Test Specifications

SCIENTIFIC TEST INC. 5300S/5300HS TEST SPECIFICATIONS GATED DEVICES

TEST SPECIFICATION

PARAMETER V RANGE I RANGE MAXRES. ACCURACY

LEAKAGE IG, IGKS, IGAS, ID, IR .10V to 600V 100NA (20PA)2 to 200MA NA (1PA) 2 1% + 10NA + 20PA/V(1% + 200PA + 2PA/V) 2

ON STATE VF, VT .10V to 5.00Vto 9.99V

10µA to 49.9A derate to 25A

1MV V: 1% + 10MV

TRIGGERIGTVGT

VGG: .10V to 600VVGT: .10V to 20V (80V) 3

1.0µA to 3ARL: 12, 30, 100 , EXT@VGA < 50V, RL=100

10NA1mV

1% + 5NA1% + 10mV

HOLD IH VGA, VGK: .10V to 600V 1MA to 999MAIBO: 10MA to 900MA

.01MA 1% + .05MA

BREAKOVERIBO

VBO

0.10 to 600V to 400V

0.10 to 600V to 400V

VBO: 10mA to 600mAto 900MA

IBO: 10MA to 600MA to 900MA

1mV 2% + .05MA

1% + 100mV

Accuracy specifications are in addition to ± 1 digit in readout.

Model Dimensions (mm) Weight (kg) PowerMODEL 5000 SERIES

Tester Mainframe17”(432)x20”(508)x10.5”(267) 55lbs(25) 120/240VAC(+5%, -15%)

50/60Hz, Fused 2A/1A

MODEL LC-1000Lo Current Deck

16.5”(419)x10.5”(267)x8”(203) 11lbs(5) Powered from 5000 SeriesTester

MODEL HC-500Hi Current Deck

17”(432)x20”(508)x10.5”(267) 35lbs(15.9) Powered from 5000 SeriesTester

MODEL 6010Scanner

17”(432)x20”(508)x10.5(267) 40lbs(18.2) Powered from 5000 SeriesTester

1 2000V Hi Voltage (Anode/Collector) Option2 Lo Current Deck Option – Also adds programmable soak time

from 1 mS to 99 secs. for currents under 1µA.3 80V Lo Source (Gate/Base) Option4 500 Amp Hi Current Deck Option.5 Voltage @ front panel terminals; allow for drop in cables.6 Optional 100V Hi Source7 40A Lo Source option

Gated Device Test Specifications

Weight and Dimensions

17

18

Fastest Datalog 5300HX-OR-

Lowest Cost 5300X2KV Option (1KV standard)100A Option (50A standard)

On-State I > 50A (100A) HC-500 / HC-1000 / HC-1200 (HC-100 not required)

Leakage I < 100nA LC-1000, -L Option (20pA / 1 pA resolution)

Diac / Sidac / OVP ADP-360Multiple Devices (30A/1200V) ADP-401A-8/16 Pin Programmable

Scanner for 8 or 16 pin packages.Opto Coupler / LogicPersonality Modules available with 5V Supply and EN Control

Multiple Devices (50A,100A/2kV) Model 6010 Scanner1 of N (20 Max) for higher currents and voltages

Opto Coupler ADP-3105 Pin Module ADP-340-5Programmable OVP ADP-340-5GMultiplexer (3/4 Output) MUX-3S / MUX-4S

(Prober/Handler or Manual)Bin Display DSP-100 (without start, for Prober/Handler)Multiplex Station MUX-STA (includes DSP-100)Opto Logic ADP-370 (8 pin adaptor with 5V Supply)Relay Adaptor ADP-390 (1-4 Pole, Form A, B or C)Regulator Adaptor ADP-320 (3 pin regulator)

Discrete ________________________________Surface Mount ________________________________Custom ________________________________Multiple Device ________________________________(Select from Price Sheet or Specify Package Required)

DUT Handler/Prober Select from Price Sheet (Ex.: HCB-100)Control HCB-200 (control cable for Handler/prober)Interconnect All other required interconnect cables are

standard with system or option

Configuration Guide

Copy this page Check the desired itemsFax your requirements to (972) 479 1301 -or- E-Mail to info@scitest.com

BasicSystem

RangeExtensionOptions

Adaptors

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Naval

19

Questions To AskIs programming easy? Will vendor give you software to evaluate?

Are current and voltage ranges sufficient?

Can current/voltage ranges be extended later?

Is a wide selection of fixtures available?

Is test/datalog speed adequate?

Will vendor benchmark your samples for speed and correlation?

Is test method “single measure”?

Does it include self-test with convenient troubleshooting guide?

Is auto-calibrate included?

Is vendor experienced? How many installed systems?

Is tester limited to single device type / family? (latent cost)

S.T.I. has the answers for its customers. Contact us.

Call972.479.1300,

Fax 972.479 1301

or E-Mailinfo@scitest.com

Selecting Testers

Scientific Test, Inc. | 1110 E. Collins Blvd., Suite 130, Richardson, Texas 75081972.479.1300 | FAX 972.479.1301 | E-Mail info@scitest.com | Website www.scitest.com

Copyright © 2006 Scientific Test, Inc. All rights reserved. Printed in U.S.A. Scientific Test is covered by U.S. and foreign patents issued andpending. Information in this publication supersedes that in all previously published material. Specifications and price change privileges reserved.

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