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Ref.: DIV.SP.00027.T.ASTR Issue: 03 Rev: 01

Date: 23/06/2009 of 281

The copyright in this document is the property of EADS ASTRIUM SAS and the contents may not be reproduced or revealed to third parties without prior permission of that company in writing. © EADS Astrium

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CONTENTS

1. INTRODUCTION AND SCOPE...................................................................................................................11 1.1 Scope ...................................................................................................................................................11 1.2 Guidelines.............................................................................................................................................11

2. APPLICABLE AND REFERENCE DOCUMENTS. .....................................................................................12

3. GENERAL DESIGN AND INTERFACE REQUIREMENTS ........................................................................13 3.1 General Design Requirements .............................................................................................................13

3.1.1 Lifetime.......................................................................................................................................13 3.1.2 Design Safety .............................................................................................................................13 3.1.3 Dependability and Safety ...........................................................................................................14 3.1.4 Venting .......................................................................................................................................16 3.1.5 Interchangeability .......................................................................................................................16 3.1.6 Identification & Marking..............................................................................................................16 3.1.7 Accessibility/Maintainability........................................................................................................17 3.1.8 Transportation, Handling and Storage .......................................................................................17 3.1.9 Materials.....................................................................................................................................19 3.1.10 Ground Support Equipments....................................................................................................20

3.2 Mechanical Design and Interface Requirements .................................................................................20 3.2.1 Structural Design........................................................................................................................20 3.2.2 Design Requirements.................................................................................................................28 3.2.3 Mechanical Interface Control Documents .................................................................................32 3.2.4 Mechanical Mathematical Model Requirements ........................................................................33 3.2.5 Mechanism Design.....................................................................................................................33

3.3 Thermal Design and Interface Requirements ......................................................................................36 3.3.1 Definition of Temperatures and Terms.......................................................................................36 3.3.2 Thermal Interface Requirements................................................................................................37 3.3.3 Thermal Design Requirements ..................................................................................................38 3.3.4 Thermal Control..........................................................................................................................40 3.3.5 Thermal Interface Control Documents .......................................................................................41 3.3.6 Thermal Mathematical Model Requirements .............................................................................41

3.4 Optical Design and Interface Requirements ........................................................................................41 3.4.1 Optical Design Requirements ....................................................................................................41 3.4.2 Optical Interface Requirements..................................................................................................42 3.4.3 Optical Mathematical Model Requirements ...............................................................................43

3.5 Electrical Design and Interface Requirements .....................................................................................43 3.5.1 General Requirements ...............................................................................................................43 3.5.2 Power Requirements..................................................................................................................44 3.5.3 Standard Signals ........................................................................................................................54 3.5.4 Standard Interfaces....................................................................................................................57 3.5.5 Connectors and Harness General Design Requirements........................................................125 3.5.6 Cross Strapping........................................................................................................................130 3.5.7 Electrical Interface Control Document......................................................................................133 3.5.8 EMC Requirements..................................................................................................................133 3.5.9 Justification of Electrical Design...............................................................................................141

3.6 Operations Design and Interface Requirements ................................................................................141 3.6.1 Introduction...............................................................................................................................141 3.6.2 Bit / Byte Numbering Convention .............................................................................................142 3.6.3 Operational Functions ..............................................................................................................143 3.6.4 Operational Services................................................................................................................158

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3.6.5 Data Interface Protocol Requirements.....................................................................................158 3.6.6 Other Requirements.................................................................................................................158

3.7 deleted................................................................................................................................................159

4. ENVIRONMENT DESIGN REQUIREMENTS ...........................................................................................160 4.1 Atmospheric Conditions .....................................................................................................................160

4.1.1 Humidity ...................................................................................................................................160 4.1.2 Cleanliness...............................................................................................................................160 4.1.3 Storage time .............................................................................................................................160 4.1.4 Pressure Environment..............................................................................................................160 4.1.5 Contamination ..........................................................................................................................160

4.2 Mechanical Environment ....................................................................................................................160 4.2.1 Ground Operations Loads........................................................................................................160 4.2.2 Launch and Early Orbit Phase. ................................................................................................161 4.2.3 In Orbit Phase ..........................................................................................................................165

4.3 Thermal Environment .........................................................................................................................165 4.3.1 On-ground phase .....................................................................................................................165 4.3.2 In-orbit phase ...........................................................................................................................166

4.4 Radiation Environment .......................................................................................................................168 4.4.1 Deleted .....................................................................................................................................168 4.4.2 Deleted .....................................................................................................................................168 4.4.3 Deleted .....................................................................................................................................168 4.4.4 Radiation Requirements applicable to ASTROSAT 250..........................................................168

4.5 EMC Environment ..............................................................................................................................181 4.5.1 Conducted Emissions...............................................................................................................181 4.5.2 Conducted Susceptibility..........................................................................................................185 4.5.3 Radiated Emissions (E field) ....................................................................................................188 4.5.4 Radiated Emissions (H field)....................................................................................................189 4.5.5 Radiated Susceptibility (E field) ...............................................................................................190 4.5.6 Radiated Susceptibility (H field) ...............................................................................................191 4.5.7 DC Magnetic Requirements .....................................................................................................191 4.5.8 ESD Susceptibility ....................................................................................................................192

5. UNIT LEVEL ENVIRONMENT TEST REQUIREMENTS..........................................................................194 5.1 General...............................................................................................................................................194

5.1.1 Test Definition ..........................................................................................................................194 5.1.2 Test Facilities Requirements....................................................................................................195 5.1.3 Test Execution..........................................................................................................................197 5.1.4 Success Criteria .......................................................................................................................198

5.2 Unit Tests ...........................................................................................................................................198 5.2.1 Mechanical Environment Tests ................................................................................................199 5.2.2 Units Thermal Environment Tests............................................................................................201 5.2.3 Radiation Test ..........................................................................................................................206 5.2.4 Electromagnetic Compatibility Tests ........................................................................................206 5.2.5 Life Test....................................................................................................................................229 5.2.6 Space Conditioning ..................................................................................................................230

6. APPENDIX A : MICD.................................................................................................................................231 6.1 Mechanical Interface Datasheet.........................................................................................................231

7. APPENDIX B : TICD..................................................................................................................................238 7.1 Thermal Interface Control Document .................................................................................................238

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8. APPENDIX C : EICD .................................................................................................................................240 8.1 Electrical Interface Datasheets (Format)............................................................................................240

9. APPENDIX D : DOUBLE INSULATION TECHNOLOGICAL GUIDELINE................................................244 9.1 PRINCIPLE.........................................................................................................................................244 9.2 DESIGN RULES.................................................................................................................................244

10. APPENDIX E : FPGA / ASIC DESIGN & VALIDATION REQUIREMENTS............................................250 10.1 Timing DomainS...............................................................................................................................250 10.2 Clocks...............................................................................................................................................250 10.3 Inputs................................................................................................................................................250 10.4 Asynchronous Inputs........................................................................................................................250 10.5 Outputs .............................................................................................................................................251 10.6 Reset ................................................................................................................................................251 10.7 Internal Logic Design........................................................................................................................251 10.8 State Machines and SEU .................................................................................................................252 10.9 Timing...............................................................................................................................................252 10.10 Sensitive Signals ............................................................................................................................253 10.11 Pin and Size Margin .......................................................................................................................253 10.12 Design Database............................................................................................................................253 10.13 Manufacturer’s / Vendor’s Recommendations ...............................................................................254 10.14 FPGA / ASIC Validation .................................................................................................................254

11. APPENDIX F NIEL TABLES FOR PROTONS AND ELECTRONS.......................................................256 11.1 NIEL for protons in SILICON............................................................................................................256 11.2 NIEL for electrons in SILICON .........................................................................................................257 11.3 NIEL for protons in AsGA .................................................................................................................257 11.4 NIEL for electrons in AsGA ..............................................................................................................258

TABLES

Table 3.2-1: Mass Budget Maturity Margins....................................................................................................22 Table 3.2-2: Unit CoG and MoI uncertainty.....................................................................................................22 Table 3.2-3: Design Safety Factors .................................................................................................................26 Table 3.2-4: Additional safety factors ..............................................................................................................26 Table 3.2-5: Unit Interface Dimensions and Tolerances .................................................................................29 Table 3.2-6: Optical Reference Design Requirements....................................................................................31 Table 3.3-1: Unit Temperatures and Limit Definition.......................................................................................38 Table 3.5-1: Standard Interfaces.....................................................................................................................44 Table 3.5-2:LCL classes..................................................................................................................................47 Table 3.5-3:FCL classes..................................................................................................................................50 Table 3.5-4: Qualification Tests.......................................................................................................................62 Table 3.5-5: Acceptance tests .........................................................................................................................62 Table 3.6-1: Meaning of Status Bits ..............................................................................................................159 Table 4.2-1: Limit Accelerations for Ground Operations ...............................................................................161 Table 4.2-2: Unit Transportation Limit Shock Load.......................................................................................161 Table 4.2-3: Sinusoidal Vibration Environment for internal units ..................................................................162 Table 4.2-4:Sinusoidal Vibration environment for external units and/or mounted on secondary structures.162 Table 4.2-5: Unit Random vibration qualification level ..................................................................................163 Table 4.2-6: Unit Random Vibration Qualification level on appendices or on external secondary structures164 Table 4.2-7: Shock Spectrum at Unit/Structure Interface..............................................................................164 Table 4.3-1: Thermal Qualification & Design Levels .....................................................................................166 Table 4.3-2: Solar constant ...........................................................................................................................167

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Table 4.3-3: Fluence in at/cm2/year ..............................................................................................................168 Table 4.4-1: Trapped electron fluxes, AE8max .............................................................................................169 Table 4.4-2: Trapped proton fluxes, , AP8min...............................................................................................170 Table 4.4-3: Solar Proton Fluence, JPL-91 model, Astrosat 250 98° inclination orbit, 7 years ....................172 Table 4.4-4: Integral GCR flux spectrum on Astrosat 250 orbit, Aluminium shielding 1 g/cm2 .....................173 Table 4.4-5: Integral solar flare ion flux spectrum based on October 1989 worst day flare,.........................175 Table 4.4-6: Total Ionising Radiation Dose 7 years Lifetime.........................................................................177 Table 4.5-1: Specific Conducted Susceptibility Transient Levels..................................................................187 Table 4.5-2: Radiated Emissions Notch Limits..............................................................................................188 Table 4.5-3: Launcher Radiated Emissions Limits ........................................................................................189 Table 4.5-4: Specific Radiated Susceptibility Levels.....................................................................................190 Table 4.5-5: Launcher Radiated Susceptibility Levels ..................................................................................191 Table 5.2-1: Unit Level Test and Sequence ..................................................................................................198 Table 5.2-2: Frequency Search Spectrum Definition ....................................................................................200 Table 5.2-3: Test Levels and Durations ........................................................................................................200 Table 5.2-4: TV Qualification Test Sequence................................................................................................203 Table 5.2-5: Thermal Vacuum Qualification Test Parameters ......................................................................204 Table 5.2-6: Nomenclature to Figure 5.2-2 above.........................................................................................205 Table 5.2-7: Receiver Bandwidth Specifications ...........................................................................................209 Table 5.2-8: Life Test Factors........................................................................................................................230 Table 6.1-1: Unit Mechanical Interface Control Document content (1/4) ......................................................231 Table 6.1-2: Unit Mass - CoG - Inertia Data Sheet .......................................................................................232 Table 6.1-3: Unit Mechanical Interface Control Document content (2/4) ......................................................233 Table 6.1-4: Unit Mechanical Interface Control Document content (3/4) ......................................................233 Table 6.1-5: Unit Mechanical Interface Control Document content (4/4) ......................................................233 Table 6.1-6: Unit Mechanical Data Sheet (1/7) .............................................................................................234 Table 6.1-7: Unit Mechanical Data Sheet (2/7) .............................................................................................234 Table 6.1-8: Unit Mechanical Data Sheet (3/7) .............................................................................................235 Table 6.1-9: Unit Mechanical Data Sheet (4/7) .............................................................................................235 Table 6.1-10: Unit Mechanical Data Sheet (5/7) ...........................................................................................236 Table 6.1-11: Unit Mechanical Data Sheet (6/7) ...........................................................................................236 Table 6.1-12: Unit Mechanical Data Sheet (7/7) ...........................................................................................237 Table 7.1-1: TICD content .............................................................................................................................238 Table 7.1-2: Unit Thermal Data Sheet...........................................................................................................239 Table 8.1-1: Electrical Data Sheet n°1: Unit Connector List .........................................................................241 Table 8.1-2: Electrical Data Sheet n°2 : Pin Allocation Data Sheet ..............................................................242 Table 8.1-3: Electrical Data Sheet n°3 : Electrical Interface Data Sheet List................................................242 Table 8.1-4: Electrical Data Sheet 1a/5: Electrical Interface Drawing...........................................................243 Table 8.1-5: Electrical Data Sheet n°4: Internal protections .........................................................................243 Table 8.1-6: Electrical Data Sheet n°5: Inrush profile ...................................................................................243 Table 8.1-7: Electrical Data Sheet n°6: Power consumption ........................................................................243 Table 8.1-8: Electrical Data Sheet n°7: Grounding Diagram.........................................................................243 Table 8.1-9: Electrical Data Sheet n°8: Power Distribution Switching Diagram............................................243 Table 8.1-10: Electrical Data Sheet n°9: Frequency Plan.............................................................................243 Table 8.1-11: Electrical Data Sheet n°10: Static Impedance Curve..............................................................243 Table 9.2-1: Double Insulation Rules ............................................................................................................245 Table 9.2-2: Double Insulation Rules to be used depending on Element Technology .................................246 Table 11.1-1 : NIEL values in SILICON as a function of proton energy......................................................256 Table 11.2-1 : NIEL values in SILICON as a function of electron energy ...................................................257 Table 11.3-1 : NIEL values in AsGa as a function of proton energy ...........................................................257 Table 11.4-1 : NIEL values in AsGa as a function of electrons energy.......................................................258

FIGURES Figure 3.2-1: Definition of loads.......................................................................................................................24

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Figure 3.2-2: Unit Axis Systems ......................................................................................................................32 Figure 3.3-1: Temperature Design, Acceptance and Qualification Levels ......................................................39 Figure 3.5-1: Unregulated Primary Power Lines Source Impedance (measured at PCDU output connector

I/F)............................................................................................................................................................47 Figure 3.5-2: FCL Characteristics....................................................................................................................52 Figure 3.5-3: Typical Link Definition ................................................................................................................54 Figure 3.5-4: Definition of Signal Pulse Width Td............................................................................................55 Figure 3.5-5: Definition of Signal Rise Time Tr and Fall Time Tf ....................................................................56 Figure 3.5-6: Harness Capacitance.................................................................................................................56 Figure 3.5-7: Principle of a RT Address Coding via Connector Pin Functions(Odd Parity) ............................59 Figure 3.5-8: 1553 Bus Nominal and Redundant Relationship .......................................................................59 Figure 3.5-9: Instrument/Unit Interface to MIL-STD 1553B Bus .....................................................................60 Figure 3.5-10: SBDL Link ................................................................................................................................63 Figure 3.5-11: LVSD link .................................................................................................................................66 Figure 3.5-12: LVDS link signal and timing characteristics .............................................................................67 Figure 3.5-13: Driver Configuration .................................................................................................................68 Figure 3.5-14: UART Serial Link......................................................................................................................68 Figure 3.5-15: Example Data Transmission (Input/Output of RS-422) ...........................................................69 Figure 3.5-16: MLC link ...................................................................................................................................70 Figure 3.5-17: MLC timing diagram.................................................................................................................71 Figure 3.5-18: MLC link ...................................................................................................................................71 Figure 3.5-19: SDT timing diagram .................................................................................................................72 Figure 3.5-20: SYNC-Pulse Synchronisation Reference.................................................................................73 Figure 3.5-21: Housekeeping Interface (differential link).................................................................................74 Figure 3.5-22: Conditioned Analogue Interface Schematic Circuitry ..............................................................80 Figure 3.5-23: Relay Command Principle .......................................................................................................86 Figure 3.5-24: Principle of Relay Status Acquisition .......................................................................................92 Figure 3.5-25: S-Band Digital TC Timing Diagram..........................................................................................96 Figure 3.5-26: S-Band Digital TM Timing Diagram .........................................................................................98 Figure 3.5-27: Pyro Electronic Interface and Schematic Circuitry.................................................................100 Figure 3.5-28: SpaceWire Layers..................................................................................................................112 Figure 3.5-29: SpaceWire Cable Construction..............................................................................................112 Figure 3.5-30: Connector Definition and Layout............................................................................................113 Figure 3.5-31: Signal Coding.........................................................................................................................114 Figure 3.5-32: Character Requirements........................................................................................................117 Figure 3.5-33: Parity Coverage .....................................................................................................................117 Figure 3.5-34: First Null Token after Reset or Link Error ..............................................................................118 Figure 3.5-35: Cross Strapping Definition .....................................................................................................130 Figure 3.5-36: Relay Command Cross-strapping principle ...........................................................................132 Figure 3.5-37: Relay Status Acquisition Cross-strapping principle ...............................................................133 Figure 3.5-38: Grounding Concept ................................................................................................................140 Figure 3.6-1: Organisation and links from standards into GDIR ...................................................................142 Figure 3.6-2: Bit / Byte Numbering Convention.............................................................................................142 Figure 4.4-1: Trapped electron fluxes, AE8max............................................................................................170 Figure 4.4-2: Trapped proton fluxes, , AP8min .............................................................................................171 Figure 4.4-3: Solar Proton Fluence, JPL-91 model, Astrosat 250 98° inclination orbit, 7 years ...................172 Figure 4.4-4: Integral GCR flux spectrum on Astrosat 250 orbit, Aluminium shielding 1 g/cm2....................174 Figure 4.4-5:solar flare ion flux spectrum on Astrosat 250 orbits, Aluminium shielding 1 g/cm2 ..................176 Figure 4.4-6: Total Ionising Radiation Dose Depth Curve 7 years Lifetime ..................................................178 Figure 4.4-7: Non Ionising Dose Table for Silicon & GaAs targets 7 years Life time...................................179 Figure 4.4-8: Non Ionising Dose Depthcurve Silicon & GaAs targets 7 years Life time ...............................180 Figure 4.5-1: Voltage Transient Envelope.....................................................................................................182 Figure 4.5-2: Conducted Emission Power Lines, Differential Mode..............................................................183 Figure 4.5-3: Conducted Emission Power Lines, Common Mode ................................................................183 Figure 4.5-4: Conducted Emission on Signal Bundles, Common Mode .......................................................185

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Figure 4.5-5: CS Transient Waveform...........................................................................................................187 Figure 4.5-6: Radiated Emissions E-Field, NB..............................................................................................189 Figure 4.5-7: Radiated Emissions H-Field.....................................................................................................190 Figure 5.2-1: Unit Thermal Test Arrangement - conductively Controlled ......................................................202 Figure 5.2-2: Thermal Vacuum Test Sequence ............................................................................................204 Figure 5.2-3: LISN Impedance for Unregulated and Regulated Primary Power Bus....................................210 Figure 5.2-4: LISN Circuit Diagram ...............................................................................................................210 Figure 5.2-5: Test Set-up for the Isolation Measurement..............................................................................213 Figure 5.2-6: Test Set-up for Conducted Emission on Primary Power Lines, Frequency Domain ...............214 Figure 5.2-7: Test Set-up for Conducted Emission on Primary Power Lines, Time Domain ........................215 Figure 5.2-8: Test Set-up for CE on Secondary Power Lines, Time Domain, and Secondary Power Input.216 Figure 5.2-9: Test Set-up for CE on Secondary Power Lines, Time Domain, and Secondary Power Output217 Figure 5.2-10: Test Set-up for Conducted Emission on Signal Bundles .......................................................218 Figure 5.2-11: Test Set-up for Conducted Susceptibility on Power Lines; CS01; CW 30Hz...50 kHz..........219 Figure 5.2-12: Test Set-up for Conducted Susceptibility on Primary Power Lines, Bulk Current Injection...220 Figure 5.2-13: Test Set-up for Conducted Susceptibility on Primary Power Lines, Common Mode ............221 Figure 5.2-14: Test Set-up for Conducted Susceptibility on Power Lines; CS06; Transient.........................222 Figure 5.2-15: Test Set-up for Conducted Susceptibility on Sec. Power lines, CS01, 30 Hz - 50 kHz.........223 Figure 5.2-16: Test Set-up for Conducted Susceptibility on Sec. Power Lines, CS02, 50 kHz - 50 MHz ....223 Figure 5.2-17: Test Set-up for Radiated Emission, Electric Field .................................................................224 Figure 5.2-18: Test Set-up for Radiated Emission, Magnetic Field...............................................................225 Figure 5.2-19: Test Set-up for Radiated Susceptibility, Electric Field ...........................................................226 Figure 5.2-20: Test Set-up for Radiated Susceptibility, Magnetic Field ........................................................227 Figure 5.2-21: Test Set-up for Radiated ESD test.........................................................................................228 Figure 5.2-22: Test Set-up for Conducted ESD ............................................................................................228 Figure 9.2-1: Printed Circuit Board and Mechanical Case ............................................................................246 Figure 9.2-2: Power Components Mounting..................................................................................................247 Figure 9.2-3: Power Components..................................................................................................................247 Figure 9.2-4: Leads/Structure........................................................................................................................248 Figure 9.2-5: Crimping...................................................................................................................................248 Figure 9.2-6: External Harness / Wiring ........................................................................................................249 Figure 9.2-7: Wire with Shield Bonding .........................................................................................................249

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SUMMARY

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1. INTRODUCTION AND SCOPE

1.1 Scope

This document, designated as General Design and Interface Requirements (specification), constitutes the general requirements for the various elements of the Astrosat 250 spacecraft. It has been prepared in accordance with the requirements of the SOW and the applicable documentation.

The document specifies the contractually relevant requirements as well as assumptions and constraints, which apply to the development, design, manufacturing, assembly, verification and delivery of the Astrosat 250 spacecraft , including spacecraft level, module level, subsystem level, and unit level deliveries, to the extent specified in the governing specification for that deliverable.

In the case of conflicts between this specification and subsystem or unit specifications, this specification is superseded by the lower level specification. The conflict shall be reported to the spacecraft prime.

1.2 Guidelines

Requirements within this document are shown in an italic font. Each requirement is preceded by a summary line that contains the following fields, delimited by "/".

•Doors Requirement Number

•Intended Verification Method

The Doors Requirement Number has the form GDI-xxx where xxx is a unique number assigned consecutively

The Intended Verification Method codes are as follows:

•R - Review

•A - Analysis

•I - Inspection

•T - Test

•S-Similarity

In the absence of code in the concerned column, the Intended Verification Method is R.

The requirement text follows the summary line. If tables are considered as part of requirement they are referenced clearly in the text and inserted after and separated from the requirement and are managed as free text attached to the identifier requirement.

All document elements not presented in the format explained above are not requirements and will not be verified or tracked.

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2. APPLICABLE AND REFERENCE DOCUMENTS.

The requirements in this document shall be called up as applicable to other governing specifications relevant for an Astrosat 250 spacecraft designed and developed according to the Astrosat 250 project standard. Hence the normative and informative documents that apply are those relevant to the appropriate governing specification and the Statement of Work of the Astrosat 250_Project.

Mathematical Model Specifications AD1 Generic Mechanical FEM Specification ADS.E.0787 AD2 Equipment Thermal Model Requirement Specification DIV.SP.00056.T.ASTR Electrical/Mechanical/Thermal Space Engineering AD3 Fracture control ECSS-E-30-01_A AD4 Verification ECSS-E-10-02_A AD5 Testing ECSS-E-10-03_A AD6 Space environment Part 1,2,3 ECSS-E-10-04_A AD7 Structural design of pressurized hardware (to be published) ECSS-E-30-02_draft AD8 Modal survey assessment ECSS-E-30-11_A AD9 Mechanical - Part 1a: Thermal control ECSS-E-30-p1_A AD10 Mechanical - Part 2a: Structural ECSS-E-30-p2_A AD11 Mechanical - Part 3a: Mechanisms ECSS-E-30-p3_A AD12 Mechanical - Part 4a: Environmental control and life support ECSS-E-30-p4_A AD13 Mechanical - Part 5.1a: Liquid and electric propulsion ECSS-E-30-p5.1_A AD14 Mechanical - Part 6a: Pyrotechnics ECSS-E-33-p11_A AD15 Mechanical - Part 7a: Mechanical Parts ECSS-E-30-p7_A AD16 Mechanical - Part 8a: Materials ECSS-E-30-p8_A AD26 Electrical & Electronics ECSS-E-20-B draft8 Structure Handbooks AD17 Structural Materials Handbook ESA-PSS-03-20 AD18 Insert Design Handbook ESA-PSS-03-1202 AD19 Adhesive Bonding Handbook ESA-PSS-03-210 AD20 Test requirements specification for space equipment ESA-PSS-01-802 AD21 Aide Memoire on Structural Materials and Space

Engineering ESA-PSS-03-212

AD22 Structural Acoustic Design Manual ESA-PSS-03-1201 AD23 Guidelines for threaded fasteners ESA-PSS-03-208 AD24 Requirements for FMECA ESA PSS-01-303 AD25 ESA fracture control requirements ESA PSS-01-401 Others AD26 AS250 - MIL-STD-1553 Bus Protocol Specification DIV.SP.00030.T.ASTR

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3. GENERAL DESIGN AND INTERFACE REQUIREMENTS

3.1 General Design Requirements

This section contains requirements relating to:

•Outgassing

•Parts, materials and processes

•Handling, packing and transportation

•Identification and marking

•Workmanship

•Reliability, Availability, Maintainability, Safety (RAMS)

•Engineering standards

Note : Product Assurance (PA) requirements are specified within the PA Requirements for Subcontractors which are applicable to Subcontractors through the Statement of Work (SOW). However, descriptive PA issues can be found within this document.

3.1.1 Lifetime

The on-ground lifetime of flight hardware is defined as the duration between unit delivery and satellite launch.

GDI-135 / 1 / A,R

The Unit shall meet the requirements of its specification after a minimum on-ground lifetime of 8 years including up to 5 years in storage.

The in-orbit lifetime of the satellite is defined as the duration from launch until the end of the mission.

GDI-137 / 1 / A,R

The unit shall be designed to meet the requirements of its specification for a minimum in-orbit lifetime of 7 years.

GDI-138 / 1 / R

Maintenance during storage shall be as limited as possible and, if required, shall be identified by the supplier for approval by the customer.

3.1.2 Design Safety

GDI-140 / 1 / A

The unit shall be designed and fabricated with compatible materials in such a manner that all hazards associated with the unit are eliminated, minimised and controlled.

GDI-141 / 1 / A

General safety requirements for electronic units are as following:

•All guards and covers provided for personal protection shall be clearly marked to indicate the voltage potential.

•Adequate shielding of control equipment and critical equipment is needed to prevent initiation of explosive devices from induced currents.

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GDI-142 / 1 / I

All units that could represent a hazard to personel shall be clearly marked as such

Examples include but are not limited to: RF sources, laser sources, radioactive sources.

3.1.3 Dependability and Safety

3.1.3.1 Failure propagation

Failure propagation definition:

A failure occuring on a function FA propagates on the function FB when the failure on function FA leads:

to stress the function FB permanently with a level higher than the derating level,

to stress the function FB temporarily with a level higher than the manufacturing rating,

to physically damage the function FB (pollution, destruction, ...).

The term permanently means that no action is initiated in order to control (eliminate) the failure. The failure remains active at each switching on of the function.

GDI-145 / 1 / A,R

Failure propagation from a function to another shall be avoided by design:

•from a main function to a redundant one,

•from a function to another,

GDI-4506 / 1 / A,R

Failure propagation to external interfacing function shall be avoided by design

GDI-5535 / 1 / A,R

The unit shall be able to withstand permanently without any internal failure propagation a failure case leading to the up-stream LCL maximum limitation current (without automatic LCL protection triggering).

Identified failure propagation criteria are:

•electrical criteria (the parts of surrounding functions are overstressed)

•physical criteria (the parts of surrounding functions are overheated)

The following design rules shall be followed

3.1.3.2 Disconnection

GDI-149 / 1 / R

The design shall ensure that the failed function can be switched off from the power supply (except cases specified)

3.1.3.3 Segregation

GDI-151 / 1 / A,R

The location within a box shall be such that thermal dissipation due to a failure of the main function shall not propagate to the redundant function.

GDI-4723 / 1 / R

Implementation of redundant functions on the same board shall be avoided to prevent propagation of failure

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GDI-4724 / 1 / R

The redundant parts of the unit functions shall be physically separated and isolated from a thermal point of view

3.1.3.4 Detection

GDI-154 / 1 / R

All failures causing propagation shall be monitored in order to disconnect the failed item before propagation takes place.

GDI-4725 / 1 / T,A,R

The failures which are nevertheless likely to propagate shall be controlled, i.e the unit is placed into a safe state in which the propagation is no longer active:

•by implementing a hardwired automatism if the time for avoiding propagation is less than 10s

•by On-Board Software if the time for avoiding propagation is compliant with the time to react of the On-Board Software (i.e. higher than 10s). The unit shall implement the adequate monitorings in order to allow the detection of the failure. These monitorings and the adequate resources needed to switch the unit in a safe state (i.e. no failure propagation) shall not be affected by the failure.

3.1.3.5 Failure tolerance requirements

GDI-4718 / 1 / A,R

No failure shall lead to both:

•the loss of a functional path, and,

•the loss of its disconnection means.

GDI-4719 / 1 / A,R

No failure shall lead to both :

•the loss of a functional path, and,

•the loss of the instrumentation used for monitoring this functional path.

GDI-4720 / 1 / A,R

No failure shall lead to both:

•the loss of a unit nominal function, and,

•the loss of a unit redundant function.

3.1.3.6 Single Point Failure Tolerance requirements

GDI-4728 / 1 / A,R

The unit shall be Single Point Failure free.

Any unavoidable single point failure shall be identified as critical item and approval shall be obtained from the prime contractor prior to implementation.

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3.1.3.7 Reliability estimation

GDI-5539 / 1 / A

The reliability figure(s) of the unit shall be provided for three skin temperatures: 20°C, 30°C and 40°C.

3.1.4 Venting

Adequate venting is provided to preserve the structural integrity of the S/C, assemblies or units during launch depressurisation.

GDI-159 / 1 / A,R

The unit shall be able to operate within a pressure range of 1 bar to 1E-10 bar. It shall have a suitable venting provision that is ≥ 2mm² venting hole area per litre volume.

Outgassing vents shall be < 5mm diameter and > 1.5mm diameter. They shall be located close to but not within the unit mounting plane.

GDI-160 / 1 / R

For all relevant thermal hardware, explicitly MLI, tapes and heatermats, venting provisions shall be incorporated.

GDI-161 / 1 / R

Unless a cavity is hermetically sealed adequate means of venting shall be provided in the design. The method of venting shall prevent the contamination of the cavity by the external environment and prevent the release of contaminants from the cavity.

GDI-162 / 1 / T,A,R

Structural members (honeycomb panels, in particular) shall include provisions to enable venting of any hermetically sealed volumes during launch ascent and during Thermal Balance/Thermal Vacuum test.

Any items that do not include venting provisions shall be treated as sealed containers, and adequate safety margins shall be demonstrated by analysis or by a 1.5 atm proof test.

3.1.5 Interchangeability

GDI-164 / 1 / R

All spacecraft units of the same part or configuration number shall be interchangeable in terms of form, fit and functions. The units must be of the same qualification status and reliability in order to meet the interchangeability requirement.

3.1.6 Identification & Marking

GDI-166 / 1 / I

The unit hardware shall be identified with a nameplate in order to achieve configuration traceability. The identification shall contain the following information:

•Name Of Manufacturer

•Project Name

•Part Number

•Serial Number

•Date Of Manufacture

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Each Individual unit shall be marked with a serial number. For standard parts and where the physical size of an item precludes identification of the hardware itself, a 'bag and label’ technique shall be used (up to final integration).

GDI-167 / 1 / I

The unit identification nameplate shall be mounted on the connector face, visible when installed on the unit. Its location shall be noted on the ICD. The identification shall be legible with unaided eye from 0.5m distance. The identification label shall meet all the requirements relevant to the unit.

GDI-168 / 1 / I

For the particular case of connector identification, the following requirements shall apply:

•Each unit or bracket is required to bear visible connector labels closely adjacent to the appropriate connector in order to allow a correct mating of the corresponding harness connector.

•For each unit or bracket, the connector identification shall be three alphanumeric characters:

a. The first character is “J” for fixed (hard-mounted) connectors and “P” for mobile connectors.

b. The two last characters consist of a 2 digits sequential number starting from 01.

•The location and content of the above described connector identification labels shall be included in the ICD of the relevant unit.

3.1.7 Accessibility/Maintainability

GDI-170 / 1 / R

The design of the unit, the position of the connectors, grounding studs and of the attachments etc. shall provide sufficient accessibility to enable the mounting and removal of the unit with standard tools.

The unit configuration itself shall not hinder the installation and removal of the attachment bolts.

Where this requirement cannot be applied, the unit supplier shall provide a kit of tools as a part of the unit MGSE such that the mounting bolts can be tightened from an accessible position.

GDI-171 / 1 / R

The equipment shall be designed to require a minimum of special tools and test equipment to maintain calibration, perform adjustments and accomplish fault identification.

GDI-172 / 1 / R

No field maintenance, servicing or adjustment shall be required within the specified in-orbit lifetime.

3.1.8 Transportation, Handling and Storage

3.1.8.1 Transport

GDI-175 / 1 / R

The units shall be transported using a container specifically designed to protect the flight hardware during ground or air transportation.

GDI-176 / 1 / R

The unit containers, covers (for optics and exposed connectors) and packaging shall be environmentally controlled / monitored (vibration, shock, temperature, pressure, humidity, electrical static discharge and contamination) and instrumented to ensure that the environments encountered during shipping and storage do not exceed expected flight (acceptance) levels.

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GDI-177 / 1 / R

The transport container shall ensure that the environment during transportation shall be maintained within the envelope of the defined launch mechanical environment (flight acceptance levels), i.e. transportation shall not drive the design.

GDI-178 / 1 / R

The storage container shall be designed to protect the unit without causing deterioration for the specified storage period. During long term storage the unit shall be stored under the following conditions:

•Pressure: 970 mbar to 1050 mbar

•Temperature: 20°C ± 10°C

•Humidity: 45% ± 15%

•Cleanliness: Class 100,000 or better

3.1.8.2 Unit Packing

GDI-180 / 1 / I

Where applicable blanking caps shall be fitted to any ports. Blanking caps shall be labelled and instructions included in the Handling and Transportation Procedures, to 'Remove Before Flight or Test' as applicable.

GDI-181 / 1 / I

All units shall be packaged to ensure that it is sealed in a dry inert atmosphere using non-contaminating materials. The packing of the units shall be such that:

•The pre-cleaned unit shall first be placed in a bag and sealed within,

•The protected unit shall then be placed in a second bag with a dehydrating agent and a label stating "OPEN IN A CONTAMINATION CONTROLLED ENVIRONMENT",

•The second bag shall also be sealed,

•The sealing of both bags shall be performed in cleanroom conditions (class 100,000 at least for the first bag) and a dry atmosphere.

•The double packaged units shall then be placed in a container that shall protect against all risk of degradation during transport and storage.

3.1.8.3 Container Identification

GDI-183 / 1 / I

Each container shall be labelled, tagged or marked to show at least the following:

•Name Of Manufacturer

•Project Name

•Unit Name / Model

•Part Number

•Serial Number

•Date Of Manufacture

•Astrium Purchase Order Number

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•Contact Number (where applicable)

•Quantity or weight (kg)

GDI-184 / 1 / I

In addition to the above, the container shall also be labelled with:

•The statement "ONLY TO BE OPENED IN CLEANROOM CONDITIONS AFTER TEMPERATURE STABILISATION"

•Any recommendations necessary for the protection of the unit.

3.1.8.4 Handling

GDI-186 / 1 / R

Units weighing more than 10 kg shall be equipped with handling points (e.g. threaded bushes) that will enable the connection of special handles provided by the unit supplier for use during the (de) integration of the unit.

As any other piece of hardware used only during ground operations, such handles shall be clearly identified as non-flight item (red anodised and a red flag carrying the notation "NOT FOR FLIGHT" attached to them).

Such items shall be clearly identified on the relevant Interface Control Drawing.

3.1.9 Materials

3.1.9.1 Magnetic Materials

GDI-190 / 1 / R

Magnetic materials shall only be used where necessary for unit operation. Materials used shall minimise the permanent, induced and transient magnetic fields. Magnetic materials shall be avoided as far as is practical.

GDI-191 / 1 / R

Any magnetic material used within the unit shall be reported to the Customer.

3.1.9.2 Seals and Life limited items

GDI-193 / 1 / R

Any seals used shall comply with all the applicable requirements of this specification, particularly regarding propellant and simulant compatibility and out-gassing.

GDI-194 / 1 / R

Any life limited items requiring periodic replacement during ground activities, and especially prior to launch, shall be identified to the Customer. The Unit supplier shall provide any procedures and special tooling required for replacement of seals.

3.1.9.3 Lubricants and Sealants

GDI-196 / 1 / R

No lubricants shall be used without the prior written agreement of the Customer.

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3.1.9.4 Screw Locking

GDI-198 / 1 / I,R

All fasteners used on the unit shall be locked by adequate measures. This includes fixations of units onto the structure.

3.1.10 Ground Support Equipments

GDI-200 / 1 / I,R

It shall be possible to calibrate every GSE delivered by the supplier.

GDI-201 / 1 / I,R

Any GSE delivered by the supplier shall be compatible for using it with any model of a unit (not a specific GSE for each unit model).

3.2 Mechanical Design and Interface Requirements

GDI-203 / 1 / R

All drawings, specifications and engineering data shall only use the International System of Units (SI units), with the exception of accelerations which may be expressed in terms of multiples of g (gravity) and temperatures which may be expressed in terms of °C.

GDI-204 / 1 / R

Unit design shall be compliant with ECSS-E30 Part 2A, and shall be compatible with unit testing.

3.2.1 Structural Design

3.2.1.1 General Requirements

GDI-207 / 1 / A

The following failure modes, for units at all levels of integration, shall be prevented:

•Permanent deformation,

•Yield,

•Rupture,

•Instability,

•Buckling,

•Gapping of bolted joints,

•Degradation of bonded joints,

•Vibration induced mounting interface slip,

•Loss of alignment of units that are subjected to alignment stability requirements, distortion violating any specified envelope,

•Distortion causing functional failure or short circuit.

GDI-208 / 1 / A,R

The unit shall be designed to withstand the environments it will encounter during its lifetime without degradation of its performance, and without detrimental influence on the spacecraft or any other unit. The following shall be taken into account:

•Fabrication and assembly loads (e.g. welding, interference fitting)

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•Handling and transportation loads,

•Test loads (including thermal stresses),

•Launch loads (vibration (including shock), thermal and depressurisation),

•Operational loads (including thermal, attitude and orbit control induced loads).

•Structural dimensioning of the units shall consider critical combination of simultaneously acting loads (e.g. mechanical and thermal).

GDI-209 / 1 / A

Wherever practical a failsafe design based on redundant structural elements shall be used. A design implementation is considered failsafe if the failure of one structural element in the load path does not affect the stiffness of the structure significantly and does not cause remaining structural elements to fail under the new load distribution. In the event of a redundant attachment failure the remaining structure shall only need to demonstrate the ability to sustain limit loads (i.e. safety factor = 1) without degrading performance.

GDI-210 / 1 / A

In cases where a failsafe design cannot be implemented, the load path shall be verified to be safe life. Corresponding structural elements shall be tracked as Potential Fracture Critical Items (PFCI’s). The following items are considered as PFCI’s as defined in ECSS-E30-01A:

•pressurised systems, vessels and sealed containers;

•rotating machinery;

•Fasteners in safe life design implantation

•Items fabricated using welding, forging or casting used at limit stress levels 25% of the ultimate tensile strength

•Non-metallic fracture sensitive items.

GDI-211 / 1 / A

Fracture control principles as defined in ECSS-E-30-01A shall be applied where equipment structural failure can result in a catastrophic or critical hazard.

Catastrophic hazard: A potential risk situation that can result in:

•loss of life,

•life-threatening or permanently disabling injury,

•occupational illness

•loss of an element of an interfacing manned flight system,

•loss of launch site facilities

•long term detrimental environmental effects.

Critical hazard: A potential risk situation that can result in:

•temporarily disabling but not life-threatening injury, or temporary occupational illness

•loss of, or major damage to, flight systems, major flight system elements or ground facilities;

•loss of, or major damage to, public or private property; or short-term detrimental environmental effects.

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3.2.1.2 Mass properties

GDI-213 / 1 / A

All mass estimations shall be accompanied by the definition of the design maturity of the concerned item (categories as per module or equipment SOW). The margin to be added to each item estimated mass for budget consolidation shall follow the rules expressed in Table 3.2-1.

The mass budget shall be reported to the customer through the datasheet as defined in APPENDIX A: MICD.

CATEGORY DESIGN MATURITY MARGINS A Existing weighed hardware 0% A Build to print from existing hardware 2% B Design based on existing hardware requiring minor modification 5% C Detailed design / Design based on existing H/W requiring major

modification 15%

D Preliminary design / Equipment not yet developed 20%

Table 3.2-1: Mass Budget Maturity Margins

GDI-240 / 1 / T

The mass of an item must be measured with the following accuracy:

•Item mass up to 10Kg: +/- 0.010 Kg

•Item mass from 10 to 20 Kg: +/- 0,020 Kg




GDI-241 / 1 / T

Any deviation between unit MCI measurement test and unit flight configuration shall be identified and reported. Resultant MCI figures for unit flight configuration shall be determined.

3.2.1.3 Centre of Gravity and Moment of Inertia

GDI-243 / 1 / T,A

All COG and MOI estimates shall be accompanied by the definition of the design maturity of the concerned item (categories as per module or equipment SOW). The uncertainty of each item COG and MOI calculation for budget consolidation shall follow the rules expressed in Table 3.2-2.

They shall be reported to the customer through the relevant mass, CoG and inertia properties data sheet defined in APPENDIX A: MICD.

CATEGORY DESIGN MATURITY COG UNCERTAINTY MOI UNCERTAINTY D Preliminary Design 5mm radius sphere ±30% for each axis C Detailed Design 3mm radius sphere ±20% for each axis B Design based on existing H/W 2mm radius sphere ±10% for each axis A Existing Hardware 1mm radius sphere ±5% for each axis

Table 3.2-2: Unit CoG and MoI uncertainty

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GDI-271 / 1 / T

The unit centre of gravity shall be determined with an accuracy of ± 1mm.

GDI-272 / 1 / A

The unit moment of inertia shall be determined with an accuracy of ± 3%.

3.2.1.4 Stiffness requirement

Spacecraft is designed to ensure full decoupling between eigen-frequencies of lower level assemblies and minimize the deformations due to gravity release (1g→0g).

Minimum natural frequency requirements are imposed upon the S/C, assemblies and units for the following reasons:

•To avoid coupling between spacecraft and units,

•To ensure predictable dynamic responses for the design of the structure and units

•To avoid excessive loads and deflections,

•To avoid unacceptable micro-vibration behaviour

GDI-276 / 1 / T,A

Except otherwise specified, units fixed on a rigid interface shall have their first main resonant frequency above 140Hz.

Local modes (effective mass < 10% total rigid mass) between 100Hz and 140Hz might be accepted by the customer after evaluations.

GDI-277 / 1 / T,A

The stiffness requirements shall be demonstrated taking into account definition and analysis uncertainties as follows:

•A margin of 15% shall be taken into account for frequency computation with finite element software (e.g. NASTRAN), and more than 30% for hand calculations. Special care shall be emphasized on the boundary conditions representativity.

•Assumptions shall be presented taking into account the worst cases for material data base characteristics (e.g. Young Modulus or thickness) or proven measurements from the manufacturer.

•Mass figures shall include the actual predicted margins as per Section 3.2.1.2 .

3.2.1.5 Strength Requirements

3.2.1.5.1 Definitions and General Requirements

GDI-280 / 1 / A

The design load factor philosophy of the unit shall be as illustrated in Figure 3.2-1

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Qualification Load (QL)

Design Load (DL)

x Model Factor KM x Project Factor KP

Yield Load

(YL)

Ultimate Load

(UL)

x Yield Load FOSY x Additional Factor of safety Kadd x Local Design factor KLD

x Ultimate Load FOSU x Additional Factor of safety Kadd x Local Design factor KLD

Figure 3.2-1: Definition of loads

Unit Qualification Load, QL is directly defined in this specification, includes already the qualification factor.

Design Load, DL is derived by the multiplication of the Qualification Load (QL) by the relevant factors of safety. These include, where appropriate, a Model Factor, KM to cover mathematical modelling uncertainties. An additional factor, Project Factor KP which considers the maturity of the unit development (stability of mass budget, etc,…) and the qualification approach shall be also considered.

i.e. Design Load = Qualification Load x KM x KP.

Yield Load, YL is derived by the multiplication of the Design Load by the relevant Yield Factor of Safety, FOSY. The loads/stresses resulting from the application of design yield loads shall be compared to the yield or 0.2% proof/stress appropriate to the component.

Ultimate Load, UL is derived by the multiplication of the Design Load by the relevant Ultimate Factor of Safety, FOSU.

Yield Factor of Safety, FOSY ensures that unacceptable risks of yielding during testing to the Design Load are eliminated.

Ultimate Factor of Safety, FOSU ensures that unacceptable risks of ultimate failure during testing to the Design Load are eliminated.

Additional Factor of Safety, KADD are additional factors applied for specific applications.

Local Design Factor, KLD shall be applied when the sizing approach or local modelling are complex. A factor of 1.2 shall be used in the cases of joint and inserts (Joint/fastener/bolt), and bonded joint, insert and sandwich failures.

GDI-290 / 1 / A

Deleted

Deleted

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GDI-292 / 1 / A

Deleted

deleted

GDI-294 / 1 / A

An additional Project Factor, KP will take into account the maturity of the unit development and in particular the risk of mass increase beyond the modelling assumptions. Kp value shall be justified between 1.3 (early stage of new development) down to 1.0 (qualified units or stabilised design).

In case of qualification using a protoflight approach, Kp shall not be reduced below 1.1.

3.2.1.5.2 Margin of Safety & Safety Factors

GDI-296 / 1 / A

Deleted

Deleted

GDI-298 / 1 / A

The safety factor which considers the uncertainties in the mathematical models when predicting dynamic response is KM = 1.1. This value can be progressively reduced to 1.0 when increasing confidence in the mathematical models.

GDI-299 / 1 / A

The unit shall be able to withstand, without failure (including structural collapse, rupture or other inability to sustain ultimate loads, significant permanent deformation or deformation detrimental to the specified performances) the worst case expected combination of the required loads and associated environments encountered during ground and in-orbit operational phases and taking into account all safety factors specified in Table 3.2-3 and Table 3.2-4. These include manufacturing, assembly, testing, transport, launch and in-orbit operations.

Tested Structure

Tested Structure

Verif by analysis

only

Verif by analysis

only

Structure type / sizing case FOSY FOSU FOSY FOSU KLD Conventional Material / Metallic structures 1.1 1.25 1.25 2.0 Composite structure (see note 7) 1.5 2.0 Unconventional structures (see note 2) 1.4 2.0 2.5 Bonded joints, insert and sandwich failures: e.g. adhesive failure, face wrinkling, intracellular buckling, honeycomb shear

- 1.5 2.0 1.2

Bonded joint and insert failure w.r.t. thermal stress load case only (e.g. "in-orbit thermal stress")

- 1.5 2.0

Joint/fastener/bolt failure including Interface gapping and sliding (see note 6)

1.1 1.25 2.0 1.2

Global Buckling (see note 5) - 2.0 2.0 Brittle material, e.g. glass/ceramic - 2.5

(Note 3) 5.0

(Note 3)

Pressurized vessels and containers; launch pressure plus external mechanical loads (see note 4)

- 2.0 2.5

Pressurized lines and fittings smaller than 38mm diameter

- 4.0 5.0

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Tested Structure

Tested Structure

Verif by analysis

only

Verif by analysis

only

Pressurized lines and fittings greater than 38mm diameter

- 2.0 2.5

Valves, filters, regulators, other pressurized components

- 2.5 3.0

Table 3.2-3: Design Safety Factors

Structure type / sizing case FOSADD Handling / Lifting points inside flight hardware 1.2 S/C MGSE; non-flight hardware 1.5

Table 3.2-4: Additional safety factors

Following assumptions shall be taken into account:

1) Applicable failure criteria have to be agreed with the customer; sufficient statistical data shall be available to derive A values.

2) If material and design allowables are statistically fully verified by means of an adequate unit level test program considering also the manufacturing reliability e.g. proof tests, the Factor of Safety (FoS) may be reduced to FoS= 1.5, in agreement with the customer,

3) These materials have strength properties which are highly dependant on the manufacturing process, the size of the part and of the surface quality. Therefore the stress/strength allowables must be derived from representative samples, to be agreed by the customer.

4) This coefficient applies to general stress analysis on internal pressure and external loads. For damage tolerance or safety analysis, refer to ECSS-E30-02.

The performance of evaluation methods as fracture analysis, detection of leaks prior to failure, additional analyses or tests may allow to lower the safety factor for launch and In-orbit load cases, pending on agreement by the customer.

5) For global buckling, the factor of safety does not include any knock down factor, to cover any imperfection sensitivity, which shall be included in the result of the buckling analysis.

6) For Units with no specific alignment requirements sliding under thermal loads only (e.g. "In-Orbit thermal deformation) is acceptable.

7) CFRP, when fully qualified and material characterization is available, may be considered as a conventional material for purposes of defining safety factors.

For combined mechanical, pressure and thermal loads, where L(P) is the load due to maximum expected operating pressure and L(M), L(T) is the non-pressure limit load (mechanical and thermal) , the factored, ultimate load case shall be defined by:

FOSU x L(M) + FOSU x L(T) + FOSU x L(P)

Where pressure and/or temperature relieve the mechanical load, a Factor of safety of 1.0 shall be used for L(T) and L(P), L(P) shall be based on pressure with minimum stress relieve.

GDI-390 / 1 / A

All mechanical elements shall demonstrate positive margins of safety when calculated as follows:-

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( ) 1**FOS factorssafety *sload/stres

sload/stres

N

−=addLD KKDesign

AllowableMoS

Where:

Allowable load is the allowable load (or stress) under specified functional conditions (e.g. yield, ultimate),

Applied load is the computed or measured load (or stress) under defined load conditions plus protoflight/uncertainty factors as appropriate, i.e. the Design Load (DL),

Safety factors (denoted FOSN) are the applicable factors of safety applicable to the specified load condition (e.g. yield (FOSY), ultimate (FOSU)),

GDI-396 / 1 / A

The margins of safety for all elements of the unit to all design loads shall be reported in a single document.

GDI-397 / 1 / A

All bolts shall be sized to prevent sliding under mechanical & thermal environments.

GDI-398 / 1 / A

Conservative friction coefficients regarding minimum and maximum preload versus clamping and bolt allowables shall be considered for preliminary sizing of the bolts, unless an actual friction coefficient has been measured.

GDI-399 / 1 / R

Wherever applicable, rules for general design of bolts, screws and inserts from ESA PSS-01-303, ESA PSS-03-1202 and ESA PSS-03-208 shall be used.

GDI-400 / 1 / A

In addition, in case of combined loads due to thermal differential loading the unit internal allowable loads shall be considered to verify bolts, nuts and inserts strength and evaluated as follows:

2 2 2

1( ) ( ) ( )T

TmS

SmM

Mm+ + ≤

where T, S and M are actual values, and Tm, Sm and Mm are maximum allowable tension, shear and moment respectively. Alternatively to tension (T, Tm), values for compression (C, Cm) shall be applied which ever is the more critical.

GDI-401 / 1 / A

Method for evaluation of dimensioning loads/stresses to be considered to verify mechanical sizing takes into account that applied loads (i.e. design yield/ultimate loads multiplied by additional safety factors) are sum vectors applied along the worst spatial direction at the unit or part of unit CoG.

GDI-402 / 1 / A

The units shall be designed with positive margins of safety under the yield and ultimate load conditions. These loads shall be combined with potential thermal loads deduced by analysis from the environment seen during the entire on-ground and in-orbit life.

The mechanical and thermal environment applicable to the mechanical sizing of the units are defined in Section 4. .

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GDI-403 / 1 / A

The design loads for the structure elements are to be derived by the unit manufacturer according to the loads as defined in Section 4.2.1 and Section 4.2.2 , and the dynamic behaviour of the unit/assembly.

GDI-404 / 1 / A

The internal loads (thermo elastic, pre-stressed mounting,...) shall be defined by the unit manufacturer. The applied loads shall be those imposed by worst-case mass distribution, mass uncertainties and design maturity.

GDI-405 / 1 / A

For the computation of the design and internal loads the maximum margin shall be included in the unit mass and inertia properties as defined in Section 3.2.1.2 and Section 3.2.1.3 .

GDI-406 / 1 / A

For sine and random vibrations, the mechanical sizing shall be performed with peak values. For random vibrations, the peak value is equal to 3 times the rms value unless otherwise specified.

3.2.1.6 Alignment and Stability Requirements

GDI-408 / 1 / T,A

When applicable, the stability of the equipment shall comply with requirements as defined in the unit requirement specification and shall be dimensioned in accordance with the spacecraft pointing requirements.

GDI-409 / 1 / T,A

The following causes of misalignment shall be analysed and quantified :

•Setting due to mounting procedure,

•Setting due to launch distortion,

•Misalignment due to gravity release,

•Thermal deformation under in-orbit temperatures,

•Ageing,

•Composite structure deformation due to moisture release in-orbit.

3.2.2 Design Requirements

3.2.2.1 Attachment Requirements

GDI-412 / 1 / A

For the preliminary determination of the requested number of M4/M5 size bolt for the attachment of a unit, it will be considered that under a 1g environment in any direction, the tensile load per M4/M5 interface bolt of that unit shall not exceed 10N. For interface bolts greater or equal M6, the allowable attachment IF design loads needs to be defined case by case and approved by the customer.

GDI-413 / 1 / I,R

The attachment points shall provide a controlled surface contact between the units and the structure to allow control of thermal conditions on the units as well as electrical bonding. This contact shall be maintained under all operating conditions, taking into account loading resulting from the different thermal coefficient of expansion between dissimilar materials.

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GDI-414 / 1 / I

The interface plane flatness of a unit shall be better than 0.1mm, i.e. all attachment points shall be in a common plane within 0.05mm.

GDI-415 / 1 / R

The mechanical mounting interface shall be consistent with the thermal and EMC design requirements.

In particular, the contact area shall be free of paint.

GDI-416 / 1 / R

The unit bolts type and number shall be defined to withstand the worst-case environmental conditions as defined in Section 4. . Sizing rules of Section 3.2.1 shall be applied.

GDI-417 / 1 / I,R

Unless otherwise specified, the unit shall be through-bolted into threaded inserts. Unit hole dimensions and tolerances shall be as defined in Table 3.2-5.

M4 bolts M5 bolts M6 bolts Hole size 4.5 to 4.6 mm 5.5 to 5.6 mm TBD, case by case Hole positional tolerance (diameter) 0.1mm 0.1mm 0.1mm

Table 3.2-5: Unit Interface Dimensions and Tolerances

GDI-435 / 1 / A,R

For alignment critical units (e.g. accuracy < 0.25degree), the interface design, dimensions and tolerance shall be treated case by case and requires customer acceptance.

GDI-436 / 1 / A

Units which are not compatible with the Aluminium material S/C structure shall provide sufficient flexibility to restrict internal loads, generated due to thermo-elastic deformation, up to a maximum load on any foot of 2000N assuming that the unit is clamped to a the S/C Aluminium structure (i.e. CTE = 24E-6 (1/K)). If it is not possible to achive the required flexibility, the IF design must be defined case by case and approved by the customer considering:

•CTE mismatch between unit baseplate and mounting panel

•Unit IF design and dimenions, foot spacing,

•IF hole clearance and bolt tightening torque

GDI-437 / 1 / I,R

Unless special conditions override, the thickness of the unit mounting feet shall be at least 3.0 mm.

GDI-438 / 1 / I,R

For the unit mounting, provision shall be made for under head flat washers of

•12.0 mm diameter for M6 bolts and above,

•10.0 mm diameter for M5 bolts

•8.0 mm diameter for M4 bolts.

GDI-439 / 1 / I,R

Unit mounting hole/lug requirements shall be as follows:

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•Angle of attachment hole: 90o ±0.5o

•Distance between attachment holes and unit sidewall:

M4 ≥ 8mm

M5 ≥ 9mm

•Free width between webs:

M4 ≥ 16mm

M5 ≥ 18mm

Edge radius 0.5mm

•Spot face of upper lug surface (for washer):

M4 = 11+0.5/-0.1mm

M5 = 13+0.5/-0.1mm

•Spot face parallelism w.r.t mounting plane: = 0.05mm

•Flatness of attachment lugs w.r.t mounting plane: = 0.05mm

•Counterbore depth: 0.2 + 0.1/-0.0 mm

•Surface roughness: = 1.6 microns R.A.

•Torque levels applied to bolts:

M4: 2.3 ± 10% Nm

M5: 5.0 ± 10% Nm

GDI-440 / 1 / I,R

Sufficient clearance shall be allowed between mechanical parts to cover design, manufacturing, assembly tolerances, alignment translation/rotation ranges and environmental displacements.

GDI-441 / 1 / I

Fasteners shall be procured and tested according to approved aerospace standards.

GDI-442 / 1 / A

Fasteners shall comply with the requirements of ECSS-Q-70-46A.

GDI-443 / 1 / A

The Flight equipment shall be able to survive

•2 times all mechanical acceptance tests

•plus 2 times all mechanical qualification tests (to cover System PFM Testing)

•plus one launch.

3.2.2.2 Alignment Requirements

GDI-445 / 1 / R

Units requiring alignment with an accuracy better than ±0.25° shall be equipped with reflecting surfaces as part of the unit. These reflective surfaces constitute the unit optical reference.

The unit shall be delivered with easily mountable/dismountable protective covers on reflective surfaces for AIV activities.

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Fixed reflective surfaces shall be used whenever possible.

Dismountable mirrors shall demonstrate repeatability of their orientation accuracy.

GDI-446 / 1 / R

Optical references are required to withstand all the environments supported by the unit with stability better than ±15 µrad with respect to each of the 3 unit axes.

GDI-447 / 1 / R

Location and orientation with associated tolerances of optical references on units shall be agreed between customer and subcontractor through the MICD. In particular, the useful faces of the optical reference shall be clearly visible at higher-level assembly integration and identified in top assembly drawings that shall form a part of MICD.

GDI-448 / 1 / R

The alignment errors shall be included in pointing and localisation errors as established in the unit alignment and pointing error budget.

GDI-449 / 1 / R

The optical reference design shall comply with Table 3.2-6 requirements.

When the unit alignment is achieved by the use of angled brackets, screw adjusters, and/or shims, they shall be designed and supplied as parts of the unit, unless provided as an integral part of the unit.

When shims have to be machined at end of alignment, 5 sets of spare shims with maximum possible thickness shall be provided to account for possible iteration or mistake.

Finish Optically polished Flatness Within lambda/4 (sodium yellow lambda = 589 mm) Optical reference axes knowledge accuracy w.r.t unit axes

< 50 µrad

Minimum area 10 * 10 mm Minimum thickness 4 mm

Table 3.2-6: Optical Reference Design Requirements

3.2.2.3 Electrical Connectors

GDI-468 / 1 / R

All electrical connectors shall be located at a minimum distance of 25mm from the unit mounting plane in order to avoid problems with cable routing and cable harness support fixation.

When connectors are located above 150mm from the mounting plane, the unit supplier shall provide means to support the harness on the unit. These fixations and the associated harness routing shall be iterated with and approved by the customer, and shall be clearly identified in the unit MICD.

GDI-469 / 1 / I,R

Connectors shall be arranged in such a way that the harness connectors can be mated and demated easily without special tools and without touching any neighbouring connectors.

The minimum free space around each connector shall be 10mm to allow spacers and covers installation.

GDI-470 / 1 / I,R

Mated male and female connectors shall be mechanically locked together.

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3.2.3 Mechanical Interface Control Documents

GDI-472 / 1 / A

The mechanical configuration and its interface requirements and dimensions, shall be fully detailed in one (or more) Interface Control Drawing(s) that shall be fully referenced by the unit subcontractor.

This drawing shall detail all co-ordinate systems utilised and their relationship to each other, together with the principal unit interfaces.

The content of the mechanical ICD shall conform to appendices A.

GDI-473 / 1 / T,R

Interfaces will be subjected to a formal inspection, using interface data sheets in respect to mechanical properties (see appendix A). These data sheets shall be completed by the unit subcontractor and then included in the unit Mechanical ICD.

GDI-474 / 1 / A

The issues of the Mechanical ICD have to be released as defined in the relevant unit Statement of Work.

GDI-475 / 1 / R

One of the attachment holes on a unit shall be specified as the reference hole and must be clearly indicated on the mechanical interface drawings.

The reference hole shall support the Unit Reference Frame.

GDI-476 / 1 / R

The unit reference frame shall have its origin at the unit reference hole (R) and shall be in accordance with Figure 3.2-2

GDI-477 / 1 / R

The unit alignment reference frame shall have its origins at the centre of the optical cube and shall be in accordance with Figure 3.2-2

+X_unit_mP

+Z_unit_aP

O_unit_aP

+X_unit_aP

+Y_unit_aP

O_unit_mP

+Y_unit_mP

+Z_unit_mP

Figure 3.2-2: Unit Axis Systems

GDI-479 / 1 / A

The dimensioning of the attachment hole pattern shall be specified with respect to the Unit Reference Frame.

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GDI-480 / 1 / R

Interface Control Drawings shall be provided to the customer, with the following media and file formats:

•Operating system: HP-UNIX Compatible

•Media type: CD-ROM (other media to be agreed on a case-by-case basis)

•Media format: TAR if DAT

•File format (by order of preference):

a. CATIA EXP

b. STEP

c. 2D DXF

3.2.4 Mechanical Mathematical Model Requirements

This section defines the requirements for the preparation, and the delivery of the Finite Element mathematical models of the assemblies and units in order to incorporate them into the higher-level assembly mathematical model.

GDI-483 / 1 / A

Finite elements models shall be provided for all units which have principal modes of vibration at frequencies less than 140Hz.

GDI-484 / 1 / A

The deliverable unit Finite Element Model shall be compliant with the Generic Mechanical FEM Specification AD1

3.2.5 Mechanism Design

3.2.5.1 General requirements

GDI-487 / 1 / R

All assemblies featuring parts moving under the action of commendable internal force(s) shall be considered as mechanisms. These items shall comply with ECSS-E-30 Part 3A..

GDI-488 / 1 / T,A,R

The functional performance of the mechanisms shall be described with :

•Kinematics variables of the motion, i.e. as acceleration, velocity, displacement ;

•Dynamic variables, i.e. forces and torque applied to the various mobile parts ;

•Steady State parameters of the initial and final status of the motion, i.e. relative position or relative velocity wrt a well identified interface ;

•Physical parameters (e.g. mass, inertia, spring force, friction, hysteresis, adhesion) that entail the kinematic variables.

GDI-489 / 1 / R

All release devices shall be tolerant to single failures.

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GDI-490 / 1 / T,A

Release mechanisms shall be capable of being manually operated for test purposes. In case one-shot initiators are used (e.g. pyrotechnics), simple re-installation of a new device on the spacecraft shall be possible.

GDI-491 / 1 / A

The mechanism design shall be compatible with operations in ambient and thermal vacuum conditions and gravity in any orientation

GDI-492 / 1 / T,I,R

The mechanism shall feature a feed-back technique enabling to unambiguously determine its position

GDI-493 / 1 / T,I,R

The in-orbit deployed configuration of any mobile part shall be secured by an independent latching function.

GDI-494 / 1 / T,A,R

When latching mechanisms rely on a preload to be applied during launch, a method of monitoring (and adjusting if necessary) shall be provided for the spacecraft AIV.

GDI-495 / 1 / R

The use of pyrotechnics shall be avoided as far as practicable

GDI-496 / 1 / R

In case pyrotechnics and other one-shot devices are used, an arm/execute mechanism shall be implemented.

GDI-497 / 1 / A

Mechanisms shall be functionally analysed to determine loads deriving from their activation, both in orbit or on ground, as applicable.

GDI-498 / 1 / T,A,R

Mechanisms shall be designed and analysed to the same criteria as all other structural items taking into account quasi-static, thermo-elastic and pre-stress loads specified for testing, launch and in-orbit events.

They shall be also compliant with the EMC and cleanliness requirements.

GDI-499 / 1 / T,A,R

They shall therefore:

•withstand without degradation all the environments they will be subjected to during their life,

•be designed with the same loads and safety factors as other structural items,

•fulfil the minimum frequency requirement (Section 3.2.1.4 ) in their stowed condition (same margin applicable),

•be subjected to fracture mechanics procedures as required by safety analysis.

Elements to be deployed in orbit (or otherwise showing important changes in their configuration between the launch and the orbital phase) shall also be verified under orbital environmental loads.

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3.2.5.2 Lifetime Requirement

GDI-501 / 1 / T,A

Actuators (electrical, mechanical, thermal and others) shall be sized to provide throughout the operational lifetime and over the full range of travel actuation torques (or forces) which exceed at least two times the combined factored worst case resistive torque or forces in addition to any required deliverable output torque or force (TL or TF):

GDI-502 / 1 / T,A

The lifetime of a mechanism shall be demonstrated by test in the appropriate environment. The requirements of ECSS-E-30 Part 3A are applicable. The adequacy of the lifetime of Commercial Off the Shelf (COTS) items with respect to this requirement shall be demonstrated.

3.2.5.3 Torque Margin Requirements

GDI-504 / 1 / A

In order to derive the factored worst case quasi-static resistive torques (or forces) the components of resistance, considered worst case conditions, shall be multiplied by the following minimum uncertainty factors:-

Inertia, IT or IF: 1.1

Spring, S: 1.2

Friction, FR: 3.0 (*)

Hysteresis, HY: 3.0 (*)

Harness/Other, HA: 3.0 (*)

Adhesion, HD: 3.0

Note: Factors marked (*) may be reduced to 1.5 if the resistive forces/torques can be satisfactorily determined by test

Where the minimum required actuation Torque/Force is given by:

TMIN/FMIN = 2.0 x (1.1xIT/F + 1.2xS + 3x (FR + HY + HA + HD)) + TL/FL

GDI-505 / 1 / T,A

For dynamic torques (or forces) then the following applies:

Torque/Force is given by:

TMIN/FMIN = 2.0 x (1.1xIT/F + 1.2xS + 3x (FR + HY + HA + HD)) + 1.25 x TD/FD

Where TD and FD refer to required deliverable output torque or force.

GDI-506 / 1 / A

The Supplier of recurring units shall provide torques/forces margin and minimum factors requirements used to design its unit.

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3.3 Thermal Design and Interface Requirements

3.3.1 Definition of Temperatures and Terms

3.3.1.1 Radiatively Controlled Unit

GDI-510 / 1 / R

All units shall be conductively controlled units (see Section 3.3.1.2 ) with the exception of low power units.

For low power units i.e. with a power density on the total skin area is less than 70W/m² thermal control which relies on radiative coupling is allowed.

3.3.1.2 Conductively Controlled Unit

GDI-512 / 1 / R

All units with a power density on the total skin higher than 70W/m² shall be mounted so that the base plate is conductively coupled with the spacecraft with a full contact surface.

The unit thermal control shall be designed to dissipate the heat through the baseplate only.

GDI-513 / 1 / R

Power density of highly dissipative units shall be limited to 0.05W/cm² or in SI units: 500W/m²(dissipative power/conductive contact surface).

3.3.1.3 Isothermal Unit

GDI-515 / 1 / A

As far as possible thermal gradients across the baseplate shall be minimised i.e. the unit shall be designed to be isothermal.

GDI-516 / 1 / A

For radiative units the temperature difference between all points of the unit case and baseplate shall be less than 5oC.

GDI-517 / 1 / A

For conductive units the temperature difference between all points of the unit baseplate in unit heating area shall be less than 3oC.

GDI-518 / 1 / R

For units not fulfilling GDI 516/517, the unit shall be considered as non-isothermal. Additional thermal nodes shall be introduced at the baseplate, which represent areas with a temperature derivation < 3°C inside these areas. The temperature difference shall be defined for each thermal node of the unit baseplate.

3.3.1.4 Temperature Reference Point (TRP)

GDI-520 / 1 / R

The Temperature Reference Point (TRP) shall be selected on the unit external surface, preferably close to a mounting bolt, in an area where temperature is the most representative of the average unit housing temperature (no hot or cold spot). The temperature reference point shall be used as reference for the thermal acceptance and qualification tests.

The temperature reference point will be maintained within the specified temperature limits by the S/C thermal control during flight.

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GDI-5476 / 1 / I,R

A circular flat area of 1cm diameter size shall be allocated at the TRP location without black coating.

This area will be used for thermistor bonding by S/C AIT Team.

3.3.2 Thermal Interface Requirements

3.3.2.1 Conductive Interface

GDI-524 / 1 / A

The mounting interface shall comply with the mechanical and EMC requirements.

GDI-525 / 1 / R

Unit mounting areas shall not be painted or anodised, in order to obtain a good conductive thermal contact with the Spacecraft.

GDI-526 / 1 / A

Local heat flux shall not be greater than 1.5x specified base plate average heat flux with an absolute peak local flux of less than 1600 W/m^2. The base plate heat flux is defined as the ratio of the thermal dissipation versus effective contact area when the unit is in the flight configuration.

3.3.2.2 Radiative Interface

The heat exchange and the desired internal unit temperature are achieved by the selection of finishes.

GDI-529 / 1 / R

Units shall be designed with an emittance > 0.8 (black)

GDI-530 / 1 / T,A

Units shall demonstrate compliance to their design/acceptance/qualification temperature range for the radiative and conductive environment of Table 4.3-1.

3.3.2.3 Internal Temperature Monitoring

GDI-532 / 1 / R

Temperature monitoring of selected points within a unit shall be provided by the unit subcontractor to cover the following cases:

•Unit operational health and safety monitoring.

•Unit operational temperature and performance monitoring.

GDI-533 / 1 / R

The location, type and electrical interface of all devices used for unit temperature measurement shall be defined in the ICD.

3.3.2.4 Units Mounted Outside Spacecraft

GDI-535 / 1 / R

The units mounted externally to the spacecraft or providing apertures to space shall be able to withstand the launch and flight environment as defined in the unit specification.

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3.3.3 Thermal Design Requirements

GDI-537 / 1 / R

The units shall take into account the following definitions of Table 3.3-1 and Figure 3.3-1

Radiative Sink Temperature This is the radiative interface temperature experienced by the units.

Operating Temperature (TFO) This temperature shall be maintained at the TRP by S/C thermal control whilst the unit is operating. This temperature shall be independent of unit operating modes

Non-Operating Temperature (TNF) This temperature shall be maintained at the TRP by S/C thermal control when the unit is not operating

Unit Switch-on Temperature (TSU) The unit supplier shall specify if the non-operating temperature range at the TRP can prevail at the time of unit switch-on or if an alternative temperature range must apply at switch-on

Calculated Temperature Limits This is the nominal temperature range the unit

may experience, taking into account the worst case combination of modes, environment and parameter degradation, excluding failure cases

Predicted Temperature Limits This is the extreme temperature range the unit may experience, taking into account in addition uncertainties in parameters (like view factor, surface properties, contamination, radiation environment, conductance, dissipation)

Qualification Temperature Limits This is the extreme worst case temperature range (defined for the operating and non-operating mode of the unit) for which a unit is guaranteed to function nominally, fulfilling all required performances with the required reliability

Acceptance Temperature Limits The acceptance temperature range, defined for the operating and non-operating mode of the unit is obtained from the qualification temperature range after subtraction of suitable qualification margin. This is the extreme temperature range that a unit may be allowed to reach, but not exceed, during all envisaged mission phases (based on worst case assumptions)

Table 3.3-1: Unit Temperatures and Limit Definition

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Maximum Qualification

Maximum Acceptance

Maximum Design Temperature

Max. Guaranteed Temperature

Maximum Predicted Temperature

Minimum Predicted Temperature

Min. Guaranteed Temperature

Minimum Design Temperature

Minimum Acceptance

Minimum Qualification

Predicted Temperature Range

Unit field

Unit field

S/C field

>=5°C

>=5°C10°C

10°C

Margin >= 0°C

Margin >= 0°C

Analytical Uncertainties

Analytical Uncertainties

Maximum Predicted Temperature

Minimum Predicted Temperature

Minimum Calculated Temperature

Maximum Calculated Temperature

5°C

5°C

Calculated Temperature Range

Figure 3.3-1: Temperature Design, Acceptance and Qualification Levels

GDI-568 / 1 / A

The units shall be designed such that all internal heat sources have the required thermal couplings to the external surfaces of the unit to comply with the interface requirements of Section 3.3.2.1 and Section 3.3.2.2 and their own unit requirements in terms of temperature and heat exchange.

GDI-569 / 1 / A,R

Hot spots on the external surface of the unit are to be taken into account at the unit level. In designing the unit and ascertaining the optimum flow paths, the unit design shall take due account of the method of mounting and the relative exchanges with the environment by both conduction and radiation.

The objective of the unit thermal analysis is to demonstrate that internal components have acceptable temperatures when the unit TRP is at its operating temperature limits, with a reasonably representative distribution of the heat flow to the external environment.

GDI-571 / 1 / A

In the absence of any uncertainty analysis an initial uncertainty margin of 10°C shall be retained in general, and 20°C for highly sensitive items, to derive the Predicted Temperature Limits from the Calculated Temperature Limits by analysis. For external units highly dependent and sensitive to material properties the initial uncertainty margin shall be 20°C.

Uncertainty less than 10°C may be proposed if duly justified by uncertainty analysis.

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3.3.4 Thermal Control

3.3.4.1 General

GDI-574 / 1 / T,A,R

The unit thermal control shall comply with ECSS-E-30 part 1A taking into account any project tailoring.

GDI-575 / 1 / R

The unit thermal control shall be achieved primarily by passive means (i.e., coating, MLI, conductive paths, insulating washers, etc.), supplemented by heaters and thermistors.

The use of devices using moving masses or fluids, such as cryo-coolers, heat pipes or fluid loops shall be avoided as far as possible.

GDI-576 / 1 / A

The equipment thermal control design shall permit analysis by mathematical models.

GDI-577 / 1 / T,A

The equipment thermal control must be testable on ground.

GDI-578 / 1 / T,I

If special equipment is delivered by the unit subcontractor to evacuate the heat during the spacecraft functional tests under ambient environment, it shall be compatible with the cleanliness requirements.

GDI-579 / 1 / R

As far as possible, no thermal control item shall prevent the spacecraft from being operated/tested under an attitude required by the thermal environment test.

GDI-580 / 1 / A

Deviations and temporal degradations from the nominal values of external and internal fluxes, thermo-optical properties, heat capacitances, and conductive and radiative couplings shall be taken into account in the thermal analysis.

GDI-581 / 1 / A

The TRP temperature also called "interface temperature" shall be predicted by analysis. The TRP shall therefore be represented in the mathematical models by a thermal node.

It shall be verified by analysis that the TRP is representative of the unit average temperature.

GDI-582 / 1 / T

In addition, the TRP temperature shall be monitored during the thermal test performed at any level.

GDI-583 / 1 / A,R

The equipment thermal control shall include and monitor sufficient flight temperature sensors to evaluate its in-orbit performance.

3.3.4.2 Thermal Analysis

GDI-585 / 1 / A

Mathematical models compatible with THERMICA or ESARAD and with ESATAN shall be prepared to support the thermal analyses.

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GDI-586 / 1 / T,A

The Geometrical and Thermal Mathematical Models (GMMs and TMMs) of the equipment shall be verified by test and correlated against the measured data as per ECSS-E-30 part 1A

3.3.5 Thermal Interface Control Documents

GDI-588 / 1 / R

All thermal hardware mounted on the unit shall be identified in the TICD, for example:

•Heaters

•Temperature Sensors

•Thermo-optical property Tape

•Paint, Coating

•Multi Layer Insulation Blanket

GDI-589 / 1 / R

All unit thermal interfaces shall be described within a unit Thermal Interface Control Document as per APPENDIX B: TICD.

3.3.6 Thermal Mathematical Model Requirements

3.3.6.1 Thermal Interface Modelling

GDI-592 / 1 / A

The Thermal mathematical model shall be provided for non-isothermal units in accordance with the Equipment Thermal Model Requirements Specification (AD 2).

3.4 Optical Design and Interface Requirements

3.4.1 Optical Design Requirements

3.4.1.1 General Optical Design

GDI-596 / 1 / R

For each optical surface, the physical dimension shall be oversized with regard to the useful optical dimension by at least 1mm along both axes.

3.4.1.2 Materials

GDI-598 / 1 / R

Glass types and material quality shall be selected to comply with the performance requirement in term of spectral transmittance and spatial environment. Glass selection and related optical configuration optimisation shall be performed in accordance with the environment requirements (as defined in Section 4. ).

GDI-599 / 1 / R

The use of stain sensitive glasses shall be avoided

GDI-600 / 1 / R

The use of optical cements shall be avoided as far as possible. If their use is nevertheless necessary, the contractor shall demonstrate their qualification to the project requirements (ageing, thermal cycles, radiation dose, etc…). Reference to their use for other space programmes shall also be mentioned.

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3.4.1.3 Coatings

GDI-602 / 1 / T,R

Coating shall be designed such that performance, as measured at ambient conditions on ground, are maintained in the space environment.

GDI-603 / 1 / R

Metallic layers of the coatings, if any, shall be grounded.

GDI-604 / 1 / R

Thermo-optical properties of the coatings shall be compatible with the thermal control design requirements.

GDI-605 / 1 / R

Particular attention shall be paid to the selection of the materials and processes to avoid sensitivity of these coatings to water desorption in vacuum environment, especially for the multi layer coatings, if any.

GDI-606 / 1 / R

High efficiency anti-reflective coatings shall be applied to all free refractive surfaces.

GDI-607 / 1 / T,R

Sensitivity of coatings to polarisation effects associated to the incidence angle shall be determined and validated.

3.4.1.4 Performances

GDI-609 / 1 / T

The optical performance of the unit shall be verifiable on ground under ambient pressure and Earth gravity conditions otherwise explicitly specified in the relevant unit specification.

GDI-610 / 1 / T

Alignment and interface with regard to other optical unit shall be maintained between clean room conditions and space environment. Note that residual defocus or misalignment induced by ambient air or gravity conditions remains acceptable as long as it has been clearly identified and as removable means to compensate it during alignment and test on ground are provided. Compensation means shall not affect performed alignment nor measured performance.

3.4.2 Optical Interface Requirements

GDI-612 / 1 / R

The unit supplier shall provide the optical interface data in the optical data sheet format as provided in APPENDIX G: OICD (TBD)

GDI-613 / 1 / R

The free mechanical aperture of optical surfaces shall be oversized with respect to the minimum clear aperture by at least 2 mm along both axes to avoid any stray reflection on the mechanical parts. The minimum clear aperture is determined according to the input beam characteristics, specified FOV, pupil (dimensions, location and decentering if any), alignment and long term stability.

GDI-614 / 1 / R

In addition to specific requirements mentioned in the relevant unit specification, any unit shall be designed to minimise internal stray light.

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3.4.3 Optical Mathematical Model Requirements

GDI-616 / 1 / A

The unit supplier shall use an optical model for numerical simulation of the unit. This model shall be established using the complete set of latest specifications and tolerances that are available about the unit. The model shall include not only the actual optical elements but also intermediate image planes, intermediate pupil imaging planes wherever applicable.

GDI-617 / 1 / A

The numerical model shall be developed on Code V ® or ZEEMAX ® or using a software providing a simple export capability into one of these two software packages.

GDI-618 / 1 / A

The numerical model shall be used for the evaluation of the unit’s optical performance. Actual glass characteristics as measured by the glass supplier shall be included. Performance analyses shall take into account the diffraction effects, misalignments and manufacturing tolerances.

3.5 Electrical Design and Interface Requirements

The following section defines the general electrical interface requirements for the Units located in the satellite:

3.5.1 General Requirements

GDI-622 / 1 / R

All electrical performances are specified under Worst-Case End-Of-Life conditions, unless otherwise explicitly notified.

GDI-623 / 1 / R

Beginning-Of-Life criteria shall be derived by the Unit Supplier from the specified parameters for testing and acceptance of all on-board units.

GDI-4675 / 1 / R

No electromechanical relays shall be used for switching of primary power lines

All interfaces are referenced by a specific Interface Code. Table 3.5-1 below lists all the standard interfaces:

Interface Code

Interface Designation Current

ULC1 Unregulated Latching Current Limiter class 1 ≤ 2.0Α ULC2 Unregulated Latching Current Limiter class 2 ≤ 4.0Α ULC3 Unregulated Latching Current Limiter class 3 ≤ 6.0Α

ULC4 Unregulated Latching Current Limiter class 4 ≤ 8.0Α

ULC5 Unregulated Latching Current Limiter class 5 ≤10.0Α

ULC6 Unregulated Latching Current Limiter class 6 ≤12.0Α

UFC1 Unregulated Foldback Current class 1 ≤ 2.0 Α UFC2 Unregulated Foldback Current class 2 ≤ 4.0 Α MIL MIL-STD-1553B Interface SBDL Standard Balanced Digital Link USL UART Serial Link Interface MLC Memory Load Command

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Interface Code

Interface Designation Current

SDT Serial Data Transfer PPS Pulse Per Second Interface SY Synchronization Pulse Interface AN1 Analogue TM Acquisition -5V to +5V AN2 Analogue TM Acquisition 0V to +5V AN3 Analogue TM Acquisition -10V to +10V ANY Temperature Acquisition Type 1: YSI 44907/YSI-44908) ANP Temperature Acquisition Type 2: PT-1000 ANF Temperature Acquisition Type 3: Fenwall ANT Temperature Acquisition Type 4: PT-200 SHP Standard High Power On/Off Command EHP Extended High Power On/Off Command SLP Standard Low Power On/Off Command RSA Relay Status Acquisition BLD Digital Bi-Level TM Acquisition RLS Receiver Lock Status IF PYR Pyro Interface SMD Shape Memory Device Interface MDD Motor Actuator Device Interface LVC Latch Valve Command Interface LVS Latch Valve Status Interface FCVC Flow Control Valve Command Interface MEC Main Engine Flow Control Valve Command Interface PTS Pressure Transducer Supply Interface PTA Pressure Transducer Acquisition Interface PBA Battery Power Interface PSA Solar Array Power Interface SCS Solar Cell Sensor Interface (TBC)

Table 3.5-1: Standard Interfaces

3.5.2 Power Requirements

All primary power bus protections are centralised, through the use of a latching current / fold-back current limiters LCL/FCL which are commanded and monitored in PCDU. Each unit ( or each function for units embedding Nominal and Redundant part within a single unit ) draws its power from a dedicated power line including a serial current protection LCL or FCL embedded in the PCDU equipment.

3.5.2.1 Primary Power Bus

3.5.2.1.1 Unregulated Power Requirements

Primary Power is provided from an unregulated DC main bus. The power is distributed via :

•ON/OFF switchable latching current limiters (LCL’s) to Essential and Non-Essential loads

•Non switchable current limiters (FCL’s) for Vital loads

GDI-4839 / 2 / R

The LCL is an ON/OFF commendable solid state switch, which provides at its output over-current limitation (ILIM ) for a definite time (trip-off time).

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If the over-current condition exceeds the trip-off time, the LCL shall be switched off.

The LCL remains latched in this switch-off mode, until an on-command releases the LCL from its latched condition (rearming command)

GDI-4840 / 2 / R

The FCL is a non-commandable automatic power-on solid state switch, which provides at its output over-current limitation (ILIMIT) for an indefinite time.

If the over-current limitation is reached, the FCL limits current at a lower current value (foldback current IF) at a low output voltage.

When the overload condition is eliminated and the load current decreases below IF, the FCL output recovers to nominal output voltage.

GDI-805 / 3 / T,A

All units connected to the unregulated bus shall ensure full performance for a power bus voltage at the unit power input within the following range :

•22 V to 37 V

GDI-4673 / 3 / T,A

Deleted

GDI-4721 / 1 / T,A

Heater lines shall be sized for a minimum primary bus voltage of 27V

GDI-5547 / 1 / R

Heaters shall be sized to not infringe in any voltage conditions the maximum heater power density of 0.54W/cm²

GDI-4674 / 1 / T

All units connected to the unregulated bus shall withstand, without damage or stress, power down and up with dV/dt < 600V/ms (TBC), regardless of the intended configuration of the unit

GDI-806 / 2 / T

If undervoltage protection is implemented by the load, the load shall not switch off its DC/DC converter for voltages in the specified operating range:

•V > minimum specified operating Voltage - 3.5V

Appropriate Hysteresis shall be implemented for switch on.

GDI-4592 / 1 / R

UVD protection thresholds shall be agreed with the customer and reported in the unit Electrical Interface Control Document.

GDI-4590 / 1 / R

Detailed timing of automatic switch-on after under voltage switch-off if implemented shall be defined and agreed via unit Electrical Interface Control Document.

GDI-807 / 3 / T,A

In case of an inductive load, the load shall prevent an over-voltage generation to the power source. The maximum over voltage emission shall not exceed the limits -2 V and 37 V

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GDI-808 / 2 / R

All units connected to the unregulated bus shall withstand without damage or stress any standing or fluctuating voltage in the full range from 0 V to 22 V.

In addition, no spurious command shall be sent by the unit.

Note: If required by the load, primary power under-voltage and over-voltage protection shall be provided by the load.

GDI-809 / 1 / R

Fuses shall not be used.

GDI-810 / 1 / R

No primary current protection shall be implemented on the DC/DC converter of a load, which is connected to an LCL or FCL output.

Note: Exceptions from this requirement may be granted on the basis of unit inrush current measurements even after power loss and recovery.

GDI-811 / 1 / T,R

The contractor shall design the load side of the LCL interface to be compliant to the characteristics as defined in Section 3.5.2.1.1.1 , Section 3.5.2.1.1.2 and Section 3.5.2.1.1.3 .

GDI-4643 / 1 / T,R

The contractor shall design the load side of the FCL interface to be compliant to the characteristics as defined in Section 3.5.2.1.1.4 , Section 3.5.2.1.1.5 and Section 3.5.2.1.1.6 .

GDI-812 / 1 / I,R

All electronic logic units/circuits shall assume a defined and safe configuration upon application of power in nominal conditions.

GDI-813 / 1 / T

All power converters shall work in free-running mode.

GDI-814 / 1 / T

The free-running frequency shall be limited to ± 10% of the nominal frequency.

GDI-815 / 1 / R

The as designed free-running frequency and frequency variations shall be reported in the unit Electrical Interface Control Document.

GDI-816 / 1 / A

Units shall be designed taking into account the source impedance defined in Figure 3.5-1.

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0,1

1

10

100

1000

10 100 1.000 10.000 100.000 1.000.000 10.000.000 100.000.000

Frequency [Hz]

Reg

ulat

ed P

ower

Sou

rce

Impe

danc

e [O

hms]

600 mOhms

Figure 3.5-1: Unregulated Primary Power Lines Source Impedance (measured at PCDU output connector I/F)

3.5.2.1.1.1 LCL Source Circuit Interface Specification

GDI-822 / 3 / R

The choice of the LCL class shall be proposed by the contractor (except PCDU contractor) and subjected to approval.

The LCL classes are defined in the table here below

LCL Class

0 1 2 3 4 5 6 8 10

Maximum nominal current

0.5 A

1A

2 A

3 A

4 A

5 A

6 A

8 A

10 A

Minimum limitation current

(IL)

0.54A 1.08A 2.16A 3.24A 4.32A 5.4A 6.48A 8.64A 10.8A

Maximum limitation current

(iLIM)

0.66A

1.32A

2.64A

3.96A

5.28A

6.6 A

7.92 A

10.56A

13.2 A

Table 3.5-2:LCL classes

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The class of the LCL is defined by maximum nominal current mentioned in the Table 3.5-2.

Minimum limitation current mentioned in the Table 3.5-2 is called IL.

Maximum limitation current mentioned in the Table 3.5-2 is called ILIM=1.22*IL.

Maximum nominal current mentioned in Table 3.5-2 is the maximum current load allowed over the nominal voltage

GDI-823 / 2 / T

The LCL shall limit its output current to trip-off current between minimum and maximum current limitation between IL and ILIM.

GDI-824 / 2 / T

In case the load exceeds its LCL class trip-off point, the latching current limiter shall limit the current to its limitation value and switch off after a delay time (trip-off time) :

•between 10 and 20 ms for LCL class 0 to class 4

•between 4 and 8 ms for LCL class 5 to class 10

GDI-825 / 1 / T

The output current rise rate shall be less than or equal to 1A/μs limited by the LCL during LCL switch On-Off commanding

GDI-4844 / 2 / R

LCL shall be protected against undervoltage at primary power bus voltage (star point).

GDI-4645 / 2 / T

The LCL switch-off response after undervoltage detection shall be higher than 0.5 s and shall not exceed 1s.

GDI-828 / 2 / T

The maximum voltage drop of the LCL from PCDU star point to PCDU output, including all internal wiring and forward and return path shall be :

•≤ 0.25V for LCL class 0 to class 4

•≤ 0.35V for LCL class 5 to class 10

for currents up to maximum nominal current

GDI-4670 / 1 / T

The rise time of the LCL current output with its nominal resistive load (considered as worst case) shall be ≤ 600µs

GDI-4671 / 1 / T

The fall time of the LCL current output with its nominal resistive load (considered as worst case) shall be ≤ 1200µs

GDI-4672 / 1 / T

The LCL voltage output, after LCL ON command, with its TBD load (considered as worst case) shall be :

•60 V/ms ≤ dV/dt ≤ 600 V/ms

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GDI-4646 / 1 / T,A

The LCL shall be unconditionally stable when loaded in parallel with its nominal resistive load by a differential capacitance ≤ 140µF and/or an inductance ≤ 1mH

GDI-829 / 1 / T

The current limitation reaction time shall be lower than 5μs (no active current limitation during this period)

GDI-4679 / 1 / T

Rearming of a LCL shall be performed upon execution of TBD command sequence (TBD by unit supplier, e.g. OFF command followed by an ON command)

GDI-4680 / 1 / R

All individual LCL shall provide the following housekeeping signals :

•ON/OFF status

•Output current telemetry

GDI-830 / 2 / A

Following a single failure the LCL shall not emit a voltage outside the range 0 V to 37 V

GDI-831 / 3 / A

The LCL shall tolerate voltages in the range -2 V to 37 V

3.5.2.1.1.2 LCL Load Circuit Interface Specification

GDI-4648 / 1 / T,A

The effective input inductance shall not exceed 150 µH (TBC)

Following switch ON, if the user current exceeds the LCL current limit defined in user specification, the LCL will enter its current limiting mode and start charging the user's input filter with trip off current.

GDI-4705 / 2 / T,A

The sum of limitation times during the whole power ON sequence (including input filter loading and DC/DC converter start sequence) shall not exceed 80% of the minimum trip-off time.

This requirement shall be demonstrated by test in all conditions (minimum, maximum, average) of voltage and temperature.

GDI-4649 / 1 / T,A

After power ON sequence (including input filter loading and DC/DC converter start sequence), the maximum current load over the nominal input voltage range shall always be lower than the maximum nominal current mentioned in Table 3.5-2.

GDI-836 / 1 / A,R

No active control loop within the load shall limit the load current while the LCL is in its current limiting mode

GDI-837 / 1 / A

Following a single failure the equipment shall not emit a voltage outside the range 0 V to 0.5 V above the maximum specified DC bus voltage

GDI-838 / 3 / A

The equipment shall tolerate voltages in the range 0 V to 37 V

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GDI-4845 / 2 / T,R

If power load consumption per LCL is higher than 20W in less consuming operable mode, the equipment shall include an internal ON/OFF switch function controled by a dedicated external command.

GDI-4846 / 2 / T,R

The internal connection/disconnection function shall be commendable by SHP signal unless otherwise stated in the unit specification.

3.5.2.1.1.3 LCL Harness Interface specification

GDI-840 / 1 / T,R

The wiring type shall be Twisted Pair (TP)

GDI-841 / 1 / T,A

The harness voltage drop shall be less than 0.5V at IL (including forward and return path)

GDI-842 / 1 / A,R

The design current shall be IL

3.5.2.1.1.4 FCL Source Circuit Interface Specification

GDI-4847 / 3 / R

The choice of the FCL class shall be proposed by the contractor (except PCDU contractor) and subjected to approval.

The FCL classes are defined in the table here below

FCL Class

0 1 2

Maximum nominal current

0.5 A

1A

2A

Minimum limitation

point

0.567 A 1.134 A 2.25 A

Maximum limitation

point

0.693 A 1.386 A 2.75 A

Table 3.5-3:FCL classes

The class of the FCL is defined by maximum nominal current mentioned in the Table 3.5-3

Minimum limitation point mentioned in the Table 3.5-3 is called IL.

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Maximum limitation point mentioned in the Table 3.5-3 is called ILIM=1.22*IL.

Maximum nominal current mentioned in Table 3.5-3 is the maximum current load allowed over the nominal voltage

GDI-4613 / 2 / T,A

The overcurrent limitation (Ilimit,knee) shall be between IL and ILIM

GDI-4614 / 1 / T,A

The foldback current IF shall be 0.15 to 0.6 x Ilim,knee

GDI-4615 / 1 / T

The current limitation response time shall be less than 5 μs (no active current limitation during this period)

GDI-4851 / 2 / R

FCL shall be protected against undervoltage at primary power bus voltage (star point).

GDI-4678 / 1 / T

FCL shall be automatically reenabled for bus voltage greater than UVDON

GDI-4653 / 2 / T,A

Switch OFF response time after undervoltage detection shall be higher than 0.5 s and shall not exceed 1s.

GDI-4650 / 1 / T,A

Switch ON response time shall be < 10 ms

GDI-4617 / 2 / T,A

The maximum voltage drop of the FCL from PCDU star point star point to PCDU output, including all internal wiring and forward and return path shall be ≤ 0.25V for currents up to maximum nominal current mentioned in Table 3.5-3.

GDI-4652 / 1 / T,A

The FCL shall be unconditionally stable into any capacitive load and inductive load ≤ 200 µH (TBC)

GDI-4681 / 1 / R

All individual FCL shall provide the following housekeeping signals :

•Output current telemetry

GDI-4618 / 3 / A

Following a single failure the FCL shall not emit a voltage outside the range 0V to 37V

GDI-4619 / 2 / A

The FCL shall tolerate voltages in the range -2V to 37V

3.5.2.1.1.5 FCL Load Circuit Interface Specification

GDI-4655 / 2 / T,A

After power ON sequence (including input filter loading and DC/DC converter start sequence), the maximum current load over the nominal input voltage range shall always be lower than maximum nominal current mentioned in Table 3.5-3.

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GDI-4623 / 1 / A

No active control loop within the load shall limit the load current while the FCL is in its foldback limiting mode

GDI-4624 / 1 / A

Following a single failure the equipment shall not emit a voltage outside the range 0V to 0.5V above the maximum specified DC bus voltage

GDI-4625 / 2 / A

The equipment shall tolerate voltages in the range 0V to 37V

GDI-4626 / 1 / T,R

Following switch-ON, and during input filter charging, the user shall ensure that the instantaneous load characteristic never crosses the foldback region (see Figure 3.5-2):

I F llimit, knee I I

FCL_char.skd

V

Figure 3.5-2: FCL Characteristics

GDI-4628 / 1 / T,A

For Vital functions supplied by a FCL, lock-up phenomenon requiring recovery via the removal of external power shall be prevented.

3.5.2.1.1.6 FCL Harness Interface Specification

GDI-4630 / 1 / R


GDI-4631 / 2 / T,A

The harness voltage drop shall be less than 0.5V for currents up to IL (including forward and return path)

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GDI-4651 / 2 / A,R

The design current shall be IL

3.5.2.2 Power Consumption Requirements

The power allocation for each unit is given in the unit specification, it covers all the operating modes and the mean and peak (long and short) figures. Note that:

•Mean represents the average consumption over 5 minutes (inclusive of heater power)

•Short peak represents the power demand within 1 msec

•Long peak represents the power demand within 100 msec

GDI-918 / 2 / T,A

The compliance versus the power allocations shall be established by taking into account :

• the worst-case conditions within the qualification temperature range,

• the worst case conditions within the voltage range,

• the in-orbit lifetime including radiation effects.

GDI-919 / 2 / T,A

For each power interface circuit, the following consumption shall be calculated:

•Minimum consumption,

•Nominal consumption using nominal component values calculated at the estimated operational temperature and average voltage

•Worst case consumption using worst case component values, voltage and temperature

GDI-920 / 2 / T,R

A power consumption test shall be required during environmental testing on flight equipment with the unit running in operationally representative state :

•for the extremes of temperature

•for the minimum, maximum and average voltage

3.5.2.3 Tolerance to Power Bus Failures

GDI-923 / 1 / T,A

When a unit is internally redundant, and the supply to one of the internal redundant modules fails, the unit shall be able to fulfil all its performances and functionality when switched to the redundant part.

3.5.2.4 Initial Electrical Status

GDI-925 / 1 / T

Upon application of power in nominal conditions all electronic equipment shall have a safe initial configuration and electrical status that is fully defined, reproducible and reported in the ICD’s.

3.5.2.5 Special Case: Secondary Power Supplied Units

The following requirements apply only in the case where an electrical unit supplies secondary power lines to another unit.

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GDI-928 / 1 / T

It shall be possible to switch on the source unit without having to connect an external load to its power outputs. The output voltages shall correspond to their nominal values under these conditions.

GDI-929 / 1 / T

The source unit shall be protected against short-circuits on the secondary power lines (either differential or to the mechanical ground).

GDI-930 / 1 / T,A

The supplied unit and Electrical I/F shall withstand without damage the supply voltages generated in case of source unit failure, as specified in the unit technical specification.

3.5.3 Standard Signals

3.5.3.1 General Conventions

The signal provider is referred to as Driver. In the case where the signal is provided by a passive device, this device is more particularly called Source (see Figure 3.5-3).

The signal user is referred to as Receiver. In the case where the signal is used by a passive device, this device is more particularly called Load (see Figure 3.5-3).

Figure 3.5-3: Typical Link Definition

GDI-936 / 1 / R

Specified driver (or source) characteristics shall be considered at the output of the driver (or source), with the specified load.

GDI-937 / 1 / T,A

All data and signal interface drivers shall survive a short circuit to driver ground, receiver ground or structure without permanent degradation.

GDI-938 / 1 / T,A

The unit shall tolerate active signal I/Fs when unpowered without any stress (derating shall be met) or permanent degradation.

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GDI-939 / 1 / T,R

In case the electrical architecture does foresee cross strapping on interface level the interfaces shall ensure proper function with ‘both interfaces powered’ and ‘one interface unpowered’.

GDI-940 / 1 / R

In case no load is specified, the characteristics are to be considered with the driver output in open circuit.

GDI-941 / 1 / A

Signal interfaces shall withstand without damage positive or negative nominal voltages that are accessible on the same connector or fault voltages emanating from the EGSE.

Timing

Signal duration and rise and fall times are defined as follows:

Signal duration: The signal pulse width is defined as the time between the voltage crossing points of fall and rise time to 50 % of the measured full amplitude. See Figure 3.5-4.

Signal rise and fall time: The rise and fall time of a digital signal are defined as the time duration between 10% and 90% of the nominal voltage swing. See Figure 3.5-5.

The delay between two signals is defined as the time between the voltage crossing points 50% at the full amplitude level.

Figure 3.5-4: Definition of Signal Pulse Width Td

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Figure 3.5-5: Definition of Signal Rise Time Tr and Fall Time Tf

3.5.3.2 Harness Capacitance

GDI-950 / 1 / T,A,R

Interface signal drivers / receivers shall consider the capacitive loading by the harness; the worst-case design performance shall comply with the values as specified in Figure 3.5-6 for a Twisted Shielded Pair.

C1 = 720 pF

C2 = 1750 pF

Core to core cap : CCC = 2

21

CC + = 1595 pF

Core to shield cap : CCS = 21

212 CC

CCC

+⋅

+ = 2260 pF

When return line and shield are grounded, the total differential capacitance is :

CCC = C1 + C2 = 2470 pF

Figure 3.5-6: Harness Capacitance

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3.5.4 Standard Interfaces

3.5.4.1 MIL-STD-1553 Interfaces

The MIL-STD-1553 Bus features 2 different Buses, one Nominal and one Redundant. Only one bus is active at any time. A single Bus Controller (BC) manages each bus. All the other units are connected to the bus as Remote Terminals (RT).

GDI-955 / 1 / R

Data Handling units shall include redundant BC.

GDI-956 / 1 / R

Each data bus subscriber equipment shall comply with MIL-STD-1553 B + Notice 3 standard.

GDI-957 / 1 / R

All units (BC or RT) shall be configured in long stub, transformer-coupled connection.

GDI-958 / 1 / R

The maximum length of the long stub shall be 6 meters.

GDI-959 / 1 / R

Only one RT shall be connected to a stub cable.

GDI-960 / 1 / R

Each RT (N&R) shall be connected to both 1553 buses (N&R).

See Figure 3.5-8.

GDI-4682 / 1 / R

Nominal (resp. redundant) BC shall be connected to 1553 bus N (resp. R).

See Figure 3.5-8

GDI-961 / 1 / R

Each stub shall be grounded inside each RT or BC derivation by a redundant resistor.

GDI-962 / 1 / R

The number of RT connected to a single bus shall be limited to 30.

GDI-963 / 1 / A

In case MIL-STD-1553 architecture is close to the maximum limit in terms of bus length, number of RT, a network simulation shall be run as addressed in MIL-HDBK-1553 section 40.8

GDI-964 / 1 / R

Each RT shall be segregated by an individual RT address, which shall be programmable on an external connector of the units.

GDI-965 / 1 / R

The 1553-bus shall be connected on separate connectors. No other signals shall be on these connectors.

GDI-966 / 1 / R

Unless otherwise agreed with the Prime Contractor, the connection between a remote terminal equipment and the MIL-STD-1553 B bus stubs shall be performed via a Cannon 9P equipment connector, according to the following pin function:

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pin 1 1553 B bus Prime Signal

pin 2 not connected

pin 3 not connected

pin 4 not connected

pin 5 1553 B bus Redundant Signal

pin 6 1553 B bus Prime Return

pin 7 not connected

pin 8 not connected

pin 9 1553 B bus Redundant return

Backshell All cable shields

GDI-967 / 1 / R

Unless otherwise agreed with the Prime Contractor, the remote terminal address definition shall be performed on a dedicated Cannon 9 S equipment connector, according to the following pin functions :

pin 1 remote terminal address bit no. 4 (MSB)

pin 2 remote terminal address bit no. 3



pin 5 remote terminal address bit no. 0 (LSB)

pin 6 remote terminal address parity bit

pin 7 secondary 0V

pin 8 secondary 0V

pin 9 not connected

Concerning remote terminal address definition pins (bits 4 to 0 and parity), a logical << 1 >> level shall be obtained by floating the corresponding pin (no connection at harness connector level) ; adequate filtering shall be provided inside the unit on those signals. A logical <<0>> level shall be obtained by connecting the corresponding pin to the secondary 0V pin at harness level ; the current in each remote terminal address definition pin shall not exceed 10 mA when programmed to logical level <<0>>.

GDI-968 / 1 / R

An implementation example of an address coding connector is shown in Figure 3.5-7. All address and Parity lines have pull-up resistors, so that a '0' on a line is coded by connecting it to a common secondary return (secondary 0 volt), as shown in Figure 3.5-7. The type of Parity is odd.

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Figure 3.5-7: Principle of a RT Address Coding via Connector Pin Functions(Odd Parity)

GDI-970 / 1 / R

The 1553-Bus Protocol shall be compliant to '1553-Bus Protocol Specification' "DIV.SP.00030.T.ASTR"

Unit A(internally redundant)

BusCoupler

A

BusCoupler

B

RemoteTerminal N

BusCoupler

A

BusCoupler

B

RemoteTerminal R

Unit B(not internally

redundant)

BusCoupler

A

BusCoupler

B

RemoteTerminal

BusController N

BusController R

OBC

Figure 3.5-8: 1553 Bus Nominal and Redundant Relationship

GDI-972 / 1 / R

The unit shall be compatible with the setup as defined in Figure 3.5-9

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Notes:

1.) Shown for one of two redundant buses that interface to the RT

2.) Transmitted voltage level on 1553 bus is 6Vp-p min, 7 Vp-p nom, 9 Vp-p max.

3.) Transmitted voltage for the transformer coupled stub is 18 Vp-p min, 27 Vp-p max for MIL-STD-1553

4.) Required tolerance on isolation resistors is 2 %. Instantaneous dissipation (when transmitting) is approximately 0.45 W typ. , 0.8 W (max.) for each isolation resistor

Figure 3.5-9: Instrument/Unit Interface to MIL-STD 1553B Bus

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3.5.4.1.1 BC/RT Test Requirements

3.5.4.1.1.1 Qualification Test

Several levels of 1553-B bus interfaces are considered at this level depending on the level of qualification of each "chip set" implemented in the unit (each 1553 function being split in 3 parts: One ASIC or equivalent in charge of protocol handling, one transceiver in charge of the electrical driver/reception function and one transformer)

•A level: Both ASIC (or equivalent) and transceiver have already been qualified successfully in a space program towards the MIL 1553B standard validation test plan.

•B level: Only the ASIC (or equivalent) has been qualified.

•C level: ASIC has not been qualified.

GDI-977 / 1 / R

For each part assessed as already qualified, the sub contractor shall provide the qualification documentation and shall demonstrate the qualification completeness

GDI-978 / 1 / T

The tests corresponding to MIL-HDBK-1553 section 100 RT validation test plan shall be performed for the unit validation (EQM or PFM), as defined in Table 3.5-4.

GDI-979 / 1 / T

These tests shall be performed in ambient conditions if qualification of the 1553B chip set has been demonstrated in an environment compatible with the project unit one. If not these tests will be performed during temperature qualification tests of the unit itself.

MIL-HDBK-1553 Section 100

Level A Level B Level C

Output Characteristics

5.1.1.1 Amplitude X X X


5.1.1.2 Rise Time / Fall Time X X X


5.1.1.3 Zero crossing stability X X X


5.1.1.4 Distortion, overshoot and ringing X X X


5.1.1.5 Output symmetry X X X


5.1.1.6 Output noise X X X


5.1.1.7 Output isolation X X X


5.1.1.8.1 Power ON/OFF noise X X X


5.1.1.8.2 Power ON Response X


5.1.1.9 Terminal response time (note 2) X X X


5.1.1.10 Frequency stability X

Input characteristics 5.1.2.1.1 Zero crossing distortion X X Input characteristics 5.1.2.1.2 Amplitude variations X X X Input characteristics 5.1.2.1.3.1 Trapezoidal X X

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Level A Level B Level C

Input characteristics 5.1.2.1.3.1 Sinusoidal X X Input characteristics 5.1.2.2 Common mode rejection X X Input characteristics 5.1.2.3 Input impedance X X X Protocole tests 5.2 All tests note 1 note 1 All Noise Test 5.3 Noise rejection test X X Note 1: Functional test through 1553B interface shall be performed.

Note 2: This test is not applicable to BC

Table 3.5-4: Qualification Tests

3.5.4.1.1.2 Acceptance Test

GDI-1123 / 1 / R

For the acceptance test, only tests defined in Table 3.5-5 hereafter shall be applied whatever the heritage level is:


All Levels

Output Characteristics 5.1.1.1 Amplitude X Output Characteristics 5.1.1.2 Rise time / fall time X Output Characteristics 5.1.1.3 Zero crossing stability X Output Characteristics 5.1.1.4 Distortion overshoot and ringing X Output Characteristics 5.1.1.5 Output symmetry X Output Characteristics 5.1.1.6 Output noise X Output Characteristics 5.1.1.8.1 Power ON/OFF noise X Input Characteristics 5.1.2.1.2 Amplitude variations X Input Characteristics 5.1.2.3 Input impedance X Protocole tests 5.2 All tests note 1

Note 1: Functional test through 1553B interface shall be performed

Table 3.5-5: Acceptance tests

3.5.4.2 Standard Balanced Digital link (SBDL)

GDI-1182 / 1 / R

The SBDL link interface is dedicated to serial digital links or synchronisation signals. This link is based on the RS422 standard. The SBDL Link interface is shown in Figure 3.5-10.

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DRIVER RECEIVER

Signal GND Signal GND

TRUE

COMP

Vsupp Vsupp

Ros

Ros

Ris

Ris

Fault Volt. Prot. (as required)

Rp

Cp

Figure 3.5-10: SBDL Link

Although the line is symmetrical the two wires are identified as true line and complementary line.

The true line is the non-inverted output of the driver

The complementary line is the inverted output of the driver.

•Vdiff = Vtrue - Vcomp

The status (Vdiff = Vtrue - Vcomp) of the signal is defined High (Logic “1”) when the true line has a positive « 1 » level w.r.t the ground and the complementary line has a« 0 » level versus the ground.

The low level of the SBDL (logic “0”) is conversely when the true line has a « 0 » level and the complementary line has a « 1 » level.

GDI-1190 / 1 / R

The contractor shall design his side of the Standard balanced Digital Link (SBDL) interface to be compliant to the characteristics as defined in Section 3.5.4.2.1 , Section 3.5.4.2.2 and Section 3.5.4.2.3 below.

3.5.4.2.1 SBDL Driver Inteface specification

GDI-1192 / 1 / R

The circuit type shall be CMOS RS422 line driver (complementary outputs).

HS-26C/CT/CLV31 RH ESD class 1 is recommended

GDI-1193 / 1 / R

The transmission type shall be Differential

GDI-1194 / 1 / T

The differential output voltage for Logic "0" shall be between -5.5V and -1.75V with load 6kOhm

GDI-1195 / 1 / T

The differential output voltage for Logic "1" shall be between +1.75V and +5.5V with load 6kOhm

GDI-1196 / 1 / T

The driver circuit shall provide a minimum of +/-1.8V when loaded with 100Ohms assuming no output series resistors

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GDI-1197 / 1 / T

The source impedance shall be 120Ohm ± 5% including the driver source impedance and series resistors (for 120Ohm line adaption)

GDI-1198 / 1 / T

With a load of 120Ohm, the rise and fall time shall be less than or equal to 20ns for Tb>200ns, otherwise 0.1 x Tb

GDI-1199 / 1 / T

The driver shall be short circuit proof.

GDI-1200 / 1 / T

In short circuit the current shall be 150mA max (each terminal to ground)

GDI-1201 / 1 / T,A

The leakage current shall be less than 100μA

GDI-1202 / 1 / T

The common mode output shall be less than 3V

GDI-1203 / 1 / A

Following a single failure the equipment shall not emit a voltage outside the range 0V to +7V.

Note: Special attention has to be paid to failure modes of the interface circuit power supply

GDI-1205 / 1 / A

The equipment shall tolerate voltages in the range -0.5V to +7V (through 1kOhm) in both ON and OFF state

GDI-1206 / 1 / T,A

OFF transmitter shall withstand an ON receiver even when the ON receiver has failed

GDI-1207 / 1 / T,A

ON transmitter shall withstand an OFF receiver

3.5.4.2.2 SBDL Receiver Interface Specification

GDI-1209 / 1 / R

The circuit type shall be CMOS RS422 line receiver (complementary inputs).

HS-26C/CT/CLV32 RH ESD class 1 is recommended

GDI-1210 / 1 / T

The receiver shall detect a static logic "1" level when inputs are in open circuit condition.

Note : Static logic 0 can be implemented upon Prime approval for specific cases (for example for an interface with an EGSE when this one sends a signal which is active at the level 1).

GDI-1211 / 1 / T

The input impedance shall be:

•DC: Greater than or equal to 6 kOhm including input series resistors

•AC: 120 Ohm in series with 50 pF

Proposed input series resistors (Ris): 1 kOhm ± 1%

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GDI-1213 / 1 / T,A

The differential input level for Logic "0" shall be between -10V and -0.6V

GDI-1214 / 1 / T,A

The differential input level for Logic "1" shall be between +0.6V and +10V

GDI-1215 / 1 / T

The common mode range shall be between -4V and +7V

GDI-1216 / 1 / A

Following a single failure the equipment shall not emit a voltage outside the range -0.5V to +7V (through 1 kOhm).

Note: Special attention has to be paid to failure modes of the interface circuit power supply

GDI-1218 / 1 / A

The equipment shall tolerate voltages in the range -12V to +12V in both ON and OFF state

GDI-1219 / 1 / T,A

OFF receiver shall withstand and ON transmitter even when the ON transmitter has failed

GDI-1220 / 1 / T,A

ON receiver shall withstand an OFF transmitter

3.5.4.2.3 SBDL Harness Interface Specification

GDI-1222 / 1 / R

Wiring type shall be Twisted Shielded Pair (TSP) or TwinAx (TCX) (120 Ohm balanced shielded lines according to ESA/SCC 3902/002)

GDI-1223 / 1 / R

The screen shall be terminated at the backshell on the driver and receiver sides

3.5.4.3 Low Voltage Differential Signalling (LVDS)

3.5.4.3.1 point-to-point LVDS link

GDI-1226 / 1 / R

Low-Voltage Differential Signalling (LVDS) link shown on Figure 3.5-11 shall comply with electrical characteristics as specified in ANSI/TIA/EIA-644

Note: TIA/EIA-644 balanced (differential) interface [LVDS] defines the electrical layer (receiver and Transmitter) only.

GDI-1227 / 1 / T,R

With reference to Figure 3.5-11:

•The A terminal of the generator shall be negative with respect to the B terminal for binary 1.

•The B terminal of the generator shall be negative with respect to the A terminal for binary 0.

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Signal GND Signal GND

Driver Receiver

Rt

A

B

Figure 3.5-11: LVSD link

GDI-1229 / 1 / T

The differential output voltage (VT) shall be between 250mV and 450mV with Rt = 100 Ohm ± 1%

GDI-1230 / 1 / T

The differential output voltage variation (ΔVT) shall be less than or equal to 0.2VSS with Rt = 100 Ohm ± 1%

GDI-1231 / 1 / T

The offset output voltage (Vos) shall be between 1.125V and 1.375V with Rt = 100 Ohm ± 1%

GDI-1232 / 1 / T

The short circuit output current (ISA, ISB) shall be less than 24mA for each output short circuited to circuit common for either binary state

GDI-1233 / 1 / T

The short circuit output current (ISAB) shall be less than 12mA with output terminals shorted to each other

GDI-1234 / 1 / T

The circuit shall be short circuit proof . Its temperature shall be maintained below the absolute maximum temperature

GDI-1235 / 1 / T

Rise and fall time (TBD)

GDI-1236 / 1 / T

The output voltage shall change monotonically between 0.2 and 0.8 of VSS

GDI-1237 / 1 / A

Following a single failure the equipment shall not emit a voltage at the output outside the range 0V to +3.6V including the failure modes of the circuit power supply

GDI-1238 / 1 / A

The equipment shall tolerate voltages at the output between 0V and +3.6V power on or off

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GDI-1239 / 1 / T,R

The input voltage (VIN) shall be between 0V and 2.4V (to circuit common)

GDI-1240 / 1 / T,R

The differential input voltage ( |VIND| ) shall be between 0.4V and 0.6V

GDI-1241 / 1 / T,R

The input voltage threshold (VTH) shall be 100mV with VCM between +0.05V and +2.35mV

GDI-1242 / 1 / T,R

The input termination network (Rt) shall be between 90 Ohm and 132 Ohm

GDI-1243 / 1 / T,R

A high level shall be detected when the generator is not connected or in power off condition or when the interconnecting cable is in short circuit

GDI-1244 / 1 / A

Following a single failure the equipment shall not emit a voltage outside the range 0V to +3.6V including the failure modes of the circuit power supply

GDI-1245 / 1 / A

The equipment shall tolerate voltages (VIN and |VIND|) up to 3.6V without failure propagation on the PCB

GDI-1246 / 1 / A

The equipment shall tolerate voltages (VIN and |VIND|) up to 2.4V without circuit degradation

GDI-1247 / 1 / T,R

LVDS link signal waveform shall comply with Figure 3.5-12

Tui Tr Tf

VSS

VOS

0.8 VSS

0.8 VSS

0.8 VSS

0.2 VSS

VT

0.2 VSS

Figure 3.5-12: LVDS link signal and timing characteristics

3.5.4.3.2 Multi-drop LVDS configuration

GDI-1250 / 1 / R

No LVDS configuration involving more than one (1) LVDS driver should be implemented*. In case this is demonstrated as an inevitable implementation, it shall be done as shown on Figure 3.5-13.

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*: such an implementation caused major link initialisation problems on previous projects.

Figure 3.5-13: Driver Configuration

3.5.4.4 UART Serial Link (USL)

UART’s are used for digital transfer between units through a serial link (see Figure 3.5-14)

GDI-1254 / 1 / R

The UART serial link shall be composed of two signals: One Transmit Data Line (TD) and one Receive Data Line (RD) as seen from the Data-Handling unit (e.g.IU) (see Figure 3.5-14)

DH Unit User

USL-TD (ULT)

USL-RD (ULR)

Figure 3.5-14: UART Serial Link

GDI-1256 / 1 / R

The UART RS-422 Serial Link Interface shall be implemented using Standard Balanced Link (SBDL) interface. The contractor shall design his part of the interface to be compliant to the characteristics as given by the Interface Data Sheet "SBDL"

GDI-1257 / 1 / R

The contractor shall design his part of the UART RS-422 Serial Link interface to be compliant to the following data transmission characteristics:

•Asynchronous protocol (according to RS232 but SBDL signal-levels)

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•Data flow control by software

•1 Start Bit

•8 Data Bits (Least Significant Bit sent first)

•With or without Parity Bit

•Odd or Even Parity Bit

•1 or 2 Stop Bits

•Data Rate (each link): selectable 19.2k / 38.4k / 57.6k / 76.8k / 115.2k Bauds.

GDI-1258 / 1 / R

Figure 3.5-15 shows an example for data transmission via the UART Serial Link :

When no data is being transmitted, the line status shall be "Logical 0".

The line status (TD, RD) of the Asynchronous protocol shall correspond to the SBDL signal levels as follows:

"Logical 0": SBDL true line at high level, comp line at low level.

"Logical 1": SBDL true line at low level, comp line at high level.

0 1 2 3 4 5 6 7 0 1 2 3 4 5 6 7START

START

STOP

STOPByte 1 = 41H Byte 1 = 42H

Figure 3.5-15: Example Data Transmission (Input/Output of RS-422)

Note: Figure 3.5-15 is an example for data transmission (signal level of non-inverting TRUE output/input of the RS-422 transmitter/receiver). The COMP output/input is inverted with respect to the above timing diagrams.

GDI-1261 / 1 / T

The Data-Handling Unit shall be able to send commands on the Transmit Data Line (TD) even during data reception on the Receive data Line (RD).

GDI-1262 / 1 / T

No data repetition mechanism in both directions shall be supported by the Data-Handling Unit and the user, respectively.

GDI-1263 / 1 / T

Command messages sent by the Data-Handling Unit to the user and HK measurement data received by the Data-Handling unit shall be transmitted in continuous blocks without time gaps between the bytes of a block.

3.5.4.5 Memory Load Commands (MLC)

Memory load commands are used for transferring serial 16 bit command data from a Data Handling unit to a user

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GDI-4731 / 1 / R

The MLC serial link shall be composed of three signals, all of them generated by a Data Handling Unit to a User (see Figure 3.5-16) :

•One Data line (serial 16 bit NRZ-L)

•One Clock line (serial data transfer clock)

•One Sampling line DH Unit User

Data

Clock

Sample

Figure 3.5-16: MLC link

GDI-4732 / 1 / T,R

The MLC link shall be implemented using Standard Balanced Link (SBDL) interface. The contractor shall design his part of the interface to be compliant to the characteristics as given by the Interface Data Sheet "SBDL"

GDI-4735 / 1 / T

The MLC data provided to the user shall be a serial NRZ-L signal :

•a bit "1" shall correspond to a positive differential voltage Vdiff

•a bit "0" shall correspond to a negative differential voltage Vdiff

Note : Most Significant Bit shall be sent first

GDI-4736 / 1 / T

Outside the MLC transfer period, the quiescent state of the "true" line shall be the high level for the clock and the sampling lines

GDI-4737 / 1 / T

The phase between the three signals of the MLC shall be as shown in Figure 3.5-17

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T1 ≤ 3.8 µsT2 = 1.4 µs +0.5 µs/ -0.6 µsT3 = 3.8 µs ± 0.1 µsT4 = 26.7 µs ± 1 µsT5 = 1.9 µs ± 0.5 µsT6 ≥ 1.4 µsT7 ≥ 3.8 µsT8 = 32.4 µs ± 1 µs

B0 B1 B2 B4B3 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15

T1

T2

T3T4 T5

T2

T6

T7

T8

Figure 3.5-17: MLC timing diagram

3.5.4.6 Serial Data Transfer (SDT)

Serial Data Transfer are used for transferring serial 16 bit data from a user to a Data Handling unit.

GDI-4740 / 1 / R

The SDT serial link shall be composed of three signals (see Figure 3.5-18) :

•One Data line (serial 16 bit NRZ-L), generated by the user

•One Clock line (serial data transfer clock), generated by the Data Handling Unit

•One Sampling line, generated by the Data Handling Unit DH Unit User

Data

Clock

Sample

Figure 3.5-18: MLC link

GDI-4742 / 1 / T,R

The SDT link shall be implemented using Standard Balanced Link (SBDL) interface. The contractor shall design his part of the interface to be compliant to the characteristics as given by the Interface Data Sheet "SBDL"

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GDI-4743 / 1 / T

The SDT data provided by the user shall be a serial NRZ-L signal :

•a bit "1" shall correspond to a positive differential voltage Vdiff

•a bit "0" shall correspond to a negative differential voltage Vdiff

Note : Most Significant Bit shall be sent first

GDI-4744 / 1 / T

Outside the serial data transfer period, the quiescent state of the "true" lines shall be the high level for the clock and the sampling lines

GDI-4745 / 1 / T

The phase between the three signals of the SDT shall be as shown in Figure 3.5-19

B0 B1 B2 B4B3 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15

T1

T2

T3T4 T5

T2

T6

T1 ≤ 3.8 µsT2 ≤ 1.1µsT3 = 3.8 µs ± 0.1 µsT4 = 26.7 µs ± 1 µsT5 = 1.9 µs ± 0.5 µsT6 ≥ 1.4 µsT7 ≥ 3.8 µsT8 = 32.4 µs ± 1 µs

T7

T8

Figure 3.5-19: SDT timing diagram

3.5.4.7 Timing Pulses

3.5.4.7.1 On-Board Time Synchronisation or Datation Pulses (PPS)

These signals are used for on-board time synchronisation or datation purposes.

GDI-1267 / 1 / R

The Pulse Per Second (PPS) Interface shall be implemented using Standard Balanced Link (SBDL) interface. The contractor shall design his part of the interface to be compliant to the characteristics defined in Section 3.5.4.2

GDI-1268 / 1 / T,A

The driver circuit frequency shall be 1 Hz ± 1%

GDI-1269 / 1 / T

The driver circuit jitter shall be less than 1.3μs including GPS synchronisation signal (1SY) jitter

GDI-1270 / 1 / T

The driver circuit duty cycle shall be 50% ± 5%

GDI-1271 / 1 / R

deleted

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GDI-1272 / 1 / R

The synchronisation edge shall be the falling edge, i.e. the leading edge of the PPS signal shall match to the time data with the accuracy/parameters as given in the Interface Data Sheet "PPS". This point of time defines the time stamp.

GDI-1273 / 1 / R

The synchronisation interface configuration shall be as described in Section 3.5.6 and shown in Figure 3.5-35

The synchronisation reference is the leading edge of the SYNC-pulse as defined in Figure 3.5-20 below. This point of time defines the time stamp.

Figure 3.5-20: SYNC-Pulse Synchronisation Reference

GDI-1276 / 1 / T,R

The contractor shall design the equipment part of the interface to be compliant to the characteristics as defined in Section 3.5.4.2 (SBDL)

3.5.4.7.2 Synchronisation Pulse Interface (SY)

GDI-1278 / 1 / R

The active SY edge shall be the transition from High level to Low level (true signal).

GDI-1279 / 1 / R

The SY Interface shall be implemented using Standard Balanced Link (SBDL) interface. The contractor shall design his part of the interface to be compliant to the characteristics defined in Section 3.5.4.2

The leading edge of the SY shall match to the time data with the accuracy/parameters as follows.

GDI-1281 / 1 / T,A

The driver circuit frequency shall be selectable between 1 Hz, 2Hz, 4Hz, 8Hz, 16Hz and 32 Hz with ± 1% precision.

GDI-1282 / 1 / T

The driver circuit jitter shall be less than 1μs

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GDI-1283 / 1 / T

The driver circuit pulse width (low level) shall be gretaer than or equal to 0.9μs

3.5.4.8 Housekeeping Analog Acquisitions

Analogue acquisition (AN) interfaces are used for the acquisition of information from users in the form of a voltage varying between two defined limits, whereby these voltage limits may vary between -5V to +5V (AN1), 0V and +5V (AN2), and -10V to +10V (AN3). The voltage is sampled on a regular basis, converted from analogue to digital and coded as an 11 or 12 bit digital information (unipolar or bipolar acquisition).

As a rule, the Most Significant Bit (MSB) will be transmitted first.

Three states are defined for the analogue input :

•During acquisition: the receiver input gate is enabled,

•Outside acquisition: the receiver input gate is disabled,

•Switched off receiver: the receiver input gate is not powered.

GDI-1286 / 1 / R

The interface shall consist of a differential link (single ended emitter, differential receiver). See Figure 3.5-21.

Figure 3.5-21: Housekeeping Interface (differential link)

3.5.4.8.1 Analogue Telemetry Acquisition [-5V;+5V] (AN1)

The contractor shall design his side of the interface to be compliant to the characteristics as defined in below.

3.5.4.8.1.1 Driver Circuit Interface Specification

GDI-1291 / 1 / R

The circuit shall be a single ended driver

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GDI-1292 / 1 / R

The transfer shall be DC coupled

GDI-1293 / 1 / R

The zero reference shall be signal ground

GDI-1294 / 1 / R

The signal range shall be -5V to +5V

GDI-1295 / 1 / T,A

The output impedance shall be less than or equal to 1kOhm

GDI-1296 / 1 / A

The driver shall be short circuit proof

GDI-1297 / 1 / A

Following a single failure the driver shall not emit a voltage outside the range -12V to +12V

GDI-1298 / 1 / A

The driver shall tolerate voltages between -16.5V and +16.5V in both ON and OFF state

GDI-1299 / 1 / T,A

An OFF driver shall withstand an ON receiver

GDI-1300 / 1 / T,A

An ON driver shall withstand an OFF receiver

3.5.4.8.1.2 Receiver Circuit Interface Specification

GDI-1302 / 1 / R

The circuit shall be a differential receiver with multiplexed input

GDI-1303 / 1 / R


GDI-1304 / 1 / T,R

The acquisition range shall be -5V to +5V

GDI-1305 / 1 / T,R

The absolute accuracy shall be less than or equal to 1% Full Scale Range (FSR) including offset, gain, non-linearity and drift errors

GDI-1306 / 1 / T,R

The noise shall be less than 8mV rms

GDI-1307 / 1 / T,R

The input differential impedance shall be:

•greater than or equal to 1MOhm during acquisition

•greater than or equal to 1MOhm outside acquisition

•greater than or equal to 1kOhm for switched OFF receiver (unpowered)

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GDI-1308 / 1 / T,R

The input capacitance shall be:

•<250 pF during acquisition

•<180pF otherwise

GDI-1309 / 1 / T,R

The receiver bandwidth shall be less than or equal to 500Hz at 3dB

GDI-1310 / 1 / T,R

The receiver shall perform consecutive and different acquisitions every 128μs with full performance

GDI-1311 / 1 / A

Following a single failure the receiver shall not emit a voltage outside the range -16V to +16V (through 1.5 kOhm)

GDI-1312 / 1 / A

The receiver shall tolerate voltages between -14V and +14V in both ON and OFF state

GDI-1313 / 1 / T,A

An OFF receiver shall tolerate an ON driver

3.5.4.8.1.3 Harness Interface Specification

GDI-1315 / 1 / T,R

The wiring shall be Twisted Shielded Pair (TSP)

GDI-1316 / 1 / T,R


3.5.4.8.2 Analogue Telemetry Acquisition [0;+5V] (AN2)

The contractor shall design his side of the interface to be compliant to the characteristics as defined below.


GDI-1320 / 1 / R


GDI-1321 / 1 / R


GDI-1322 / 1 / R


GDI-1323 / 1 / R

The signal range shall be 0V to +5V

GDI-1324 / 1 / T,A


GDI-1325 / 1 / A


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GDI-1326 / 1 / A


GDI-1327 / 1 / A


GDI-1328 / 1 / T,A


GDI-1329 / 1 / T,A



GDI-1331 / 1 / R


GDI-1332 / 1 / T,R


GDI-1333 / 1 / T,R

The acquisition range shall be 0V to +5V

GDI-1334 / 1 / T,R


GDI-1335 / 1 / T,R


GDI-1336 / 1 / T,R





GDI-1337 / 1 / T,R

The input capacitance shall be less than or equal to 1.2μF

GDI-1338 / 1 / T,R


GDI-1339 / 1 / T,R


GDI-1340 / 1 / A


GDI-1341 / 1 / A


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GDI-1342 / 1 / T,A



GDI-1344 / 1 / T,R


GDI-1345 / 1 / T,R


3.5.4.8.3 Analogue Telemetry Acquisition [-10V;+10V] (AN3)



GDI-1349 / 1 / R


GDI-1350 / 1 / R


GDI-1351 / 1 / R


GDI-1352 / 1 / R

The signal range shall be -10V to +10V

GDI-1353 / 1 / T,A


GDI-1354 / 1 / A


GDI-1355 / 1 / A


GDI-1356 / 1 / A


GDI-1357 / 1 / T,A


GDI-1358 / 1 / T,A



GDI-1360 / 1 / R


GDI-1361 / 1 / T,R


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GDI-1362 / 1 / T,R

The acquisition range shall be -10V to +10V

GDI-1363 / 1 / T,R


GDI-1364 / 1 / T,R


GDI-1365 / 1 / T,R





GDI-1366 / 1 / T,R

The input capacitance shall be less than or equal to 1.2μF

GDI-1367 / 1 / T,R


GDI-1368 / 1 / T,R


GDI-1369 / 1 / A


GDI-1370 / 1 / A


GDI-1371 / 1 / T,A



GDI-1373 / 1 / T,R


GDI-1374 / 1 / T,R


3.5.4.9 Temperature acquisitions (ANY, ANP, ANF, ANT)

These acquisitions are used for thermal control (control and monitoring) and for unit monitoring

There are four options:

•Type 1 (IF-Code "ANY"):

Thermistor type: YSI-44907/-44908 (10KOhm @25°C)

•Type 2 (IF-Code "ANP"):

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Thermistor type: PT-1000 (1000 Ohm @ 0°C)

•Type 3 (IF-Code "ANF"):

Thermistor type: Fenwall/Betatherm (15KOhm @25°C)

•Type 4 (IF-Code "ANT"):

Thermistor type: PT-200 (200 Ohm @ 0°C)

Note: For use with thrusters and main engine only.

GDI-1383 / 1 / R

The temperature acquisition interface circuitry, as well as the interconnecting harness, shall be as shown in Figure 3.5-22.

Figure 3.5-22: Conditioned Analogue Interface Schematic Circuitry

3.5.4.9.1 Thermistor Type1: YSI-44907/-44908 (ANY)



The circuit shall be a Thermistor YSI-44907 or -44908 (10 kOhm at 25 degC), two wire connection

GDI-1389 / 1 / R

The transfer shall be DC Coupled

GDI-1390 / 1 / R

The operating temperature range shall be -55 degC to +70 degC

GDI-1391 / 1 / A

The driver shall tolerate voltages between -16.5V and +16.5V.

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GDI-1393 / 1 / R


GDI-1394 / 1 / T,R

The resolution shall be at least 0.2K/LSB

GDI-1395 / 1 / T

The measurement range shall be -50 degC to +70 degC (equivalent to 441.3 kOhm to 1990 Ohm)

GDI-1396 / 1 / A

The stability shall be ±1K (-50 to +70 degC)

GDI-1397 / 1 / A

The measurement current shall be such that power dissipation in driver circuit is ≤ 1mW

GDI-1399 / 1 / T,A

The measurement chain accuracy shall be:

•better than ± 0.3K between 0 degC and 30 degC

•better than ± 2K between -30 degC and +60 degC


GDI-1400 / 1 / T


GDI-1401 / 1 / A

The receiver bandwidth shall be 50Hz to 1500Hz at 3dB

GDI-1402 / 1 / A


GDI-1403 / 1 / A


GDI-4707 / 1 / R

Option : For unit connectors interfacing with external thermistors, only thermistor signals could be available on connector pins (in this case, the thermistor returns are connected to haloring).


GDI-1405 / 1 / R


3.5.4.9.2 Thermistor Type2: PT-1000 (ANP)



The circuit shall be a Thermistor PT1000 (1 kOhm at 0 degC), two wire connection

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GDI-1411 / 1 / R


GDI-1412 / 1 / R


GDI-1413 / 1 / A



GDI-1415 / 1 / R


GDI-1416 / 1 / T

The measurement range shall be -160 degC to +140 degC (equivalent to 344.6 Ohm to 1542.6 Ohm)

GDI-1417 / 1 / T,R


GDI-1418 / 1 / T,A

The measurement chain accuracy shall be better than ± 3K

GDI-1419 / 1 / A


GDI-4687 / 1 / T

The sampling rate shall be ≤ 1Hz (for one specific channel)

GDI-1420 / 1 / T


GDI-1421 / 1 / A


GDI-1422 / 1 / A


GDI-1423 / 1 / A


GDI-4708 / 1 / R



GDI-1425 / 1 / R


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3.5.4.9.3 Thermistor Type3: Fenwall/Betatherm (ANF)

The contractor shall design his side of the interface to be compliant to the characteristics as defined in below.


The circuit shall be a Thermistor e.g. Fenwall/Betatherm (15 kOhm at 25 degC), two wire connection

GDI-1431 / 1 / R


GDI-1432 / 1 / R


GDI-1433 / 1 / A



GDI-1435 / 1 / R


GDI-1436 / 1 / T,R


GDI-1437 / 1 / T

The measurement range shall be -40 degC to +110 degC (equivalent to 373.7 kOhm to 0.935 kOhm)

GDI-1438 / 1 / A

The stability shall be ±1K over lifetime

GDI-1439 / 1 / A


GDI-1441 / 1 / T,A

The measurement chain accuracy shall be:

•better than ± 0.3K between 0 degC and 30 degC



GDI-1443 / 1 / T


GDI-1444 / 1 / A

The receiver bandwidth shall be 50Hz to 1500Hz at 3dB

GDI-1445 / 1 / A

Following a single failure the receiver shall not emit a voltage outside the range -15.8V to +15.8V

GDI-1446 / 1 / A


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GDI-4706 / 1 / R



GDI-1448 / 1 / T,R


3.5.4.9.4 Thermistor Type4: PT-200 (ANT)



The circuit shall be a Thermistor PT200 (200 Ohm at 0 degC), two wire connection

GDI-1454 / 1 / R


GDI-1455 / 1 / R


GDI-1456 / 1 / A



GDI-1458 / 1 / R


GDI-1459 / 1 / T

The measurement range shall be -200 degC to +850 degC (equivalent to 39 Ohm to 781 Ohm)

GDI-1460 / 1 / T,R


GDI-1461 / 1 / A

The measurement chain accuracy shall be better than ± 5K

GDI-1462 / 1 / A


GDI-4689 / 1 / T

The sampling rate shall be ≤ 1Hz (for one specific channel)

GDI-1463 / 1 / T


GDI-1464 / 1 / A


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GDI-1465 / 1 / A


GDI-1466 / 1 / A


GDI-4709 / 1 / R

Option : For unit connectors interfacing with external therrmistors, only thermistor signals shall be available on connector pins (no connector pins shall be used for thermistor returns)


GDI-1468 / 1 / T,R


GDI-4686 / 1 / T,I

Option : On receiver side, return signal could be directly connected to haloring.

3.5.4.10 Relay Commands (SHP, EHP, SLP)

The purpose of the High Power On/Off Commands interface is to transfer a pulse from the driver to the user, which can be used to switch/drive high power loads such as relays or optocoupler e.g. for decentralised power switching or unit configuration purposes.

GDI-1472 / 1 / R

High Power and low power On/Off Command sources shall be referenced to driver signal ground.

GDI-1473 / 1 / R

High Power and low power On/Off Command receivers shall be isolated from any user electrical reference.

GDI-1474 / 1 / R

High Power and low power On/Off Command receivers shall be equipped with appropriate circuits in order to suppress any switching transients, in particular those due to inductive loads such as relays, which may cause the current drive capability, or the over voltage capability of the source to be exceeded.

GDI-4808 / 1 / R

Appropriate circuits suppressing any switching transients shall be redunded and put in parallel in order to suppress the transients even in case of a single failure.

GDI-1475 / 1 / R

High Power and low power On/Off Command sources shall be short circuit proof for short circuits to source or receiver signal ground and structure.

GDI-1477 / 1 / R

Cross-strapping of redundant commands shall be implemented as required in Section 3.5.6.1 .

3.5.4.10.1 Standard High Power On/Off Command: (SHP)


Relay commands are used for decentralised power switching or unit configuration purposes. See Figure 3.5-23.

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ReceiverDriver A

V+

GND

Driver B

V+

GND

Figure 3.5-23: Relay Command Principle


GDI-1483 / 1 / R

The circuit shall be a single ended driver return over wire

GDI-1484 / 1 / R

The signal transfer shall be DC coupled

GDI-1476 / 1 / R

The Standard High Power On/Off Command interface shall implement diodes at the level of the driver (e.g. by means of 2 serial diodes or equivalent ) to allow unit external Or-ing of commands.

GDI-1486 / 1 / T,A

The output voltage shall be:

•Active level: 22V to 29V

•Quiescent level: 0V to 0.5V with a leakage current of max. 100μA

GDI-1487 / 1 / T

The pulse width shall be between 32ms and 64ms

GDI-1488 / 1 / T,A

When connected to load, the output voltage rise and fall times shall be:

•50 μs ≤ trise ≤ 500μs

•50 μs ≤ tfall ≤ 500μs

GDI-1489 / 1 / T,A

The current drive capability shall be greater than or equal to 180mA

AS250


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GDI-1490 / 1 / T,A

The short circuit output current shall be less than or equal to 400mA during pulse and after that less than or equal to 100μA

GDI-1491 / 1 / T,A

The output impedance shall be 100 kOhm ± 10% (if circuit is powerless or output voltage is off)

GDI-1492 / 1 / A

The driver shall tolerate voltages between -2V and +35V in both ON and OFF state

GDI-1493 / 1 / A

Following a single failure the driver shall not emit a voltage outside the range 0V to +32V

GDI-4809 / 1 / T

The driver shall be equipped with appropriate circuits to suppress negative switching transients (covering the case of failure of the receiver free-wheeling diode)


GDI-1495 / 1 / R

The receiver shall be a relay coil or an optocoupler

GDI-1496 / 1 / R


GDI-4693 / 1 / R

When receiver is a relay, redunded free-wheel diodes shall be implemented in parallel with relay coil. Redunded free-wheel diodes shall be put in parallel (in order to suppress negative transients in case of failure in open circuit of one diode).

GDI-4694 / 1 / A

The relay coil shall be capable of being energised with the maximum relay driver fault voltage for an indefinite duration and resume nominal performances after the fault condition has been removed.

GDI-1497 / 1 / T,A

The receiver shall be:

•activated at less than or equal to 18V and pulse width less than or equal to 30ms (for max current of 180mA)

•not activated for less than or equal to 100μA

GDI-1498 / 1 / T,A

The maximum current shall be less than 180mA

GDI-4696 / 1 / A,R

The input capacitance shall be lower than 300 pF

GDI-1499 / 1 / T,A

If the receiver is an optocoupler then pulses up to 29V, 1ms shall not activate the switch function

GDI-1500 / 1 / A

Following a single failure the receiver shall not emit a voltage outside the range 0V to +32V

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GDI-1501 / 1 / A



GDI-1503 / 1 / T,R

The wiring type shall be Twisted Shielded Pair (TSP)

GDI-1504 / 1 / T,R


GDI-4692 / 1 / T,R

When a user receives several SHP commands from the same output module, only one return line shall be used for all SHP commands and the link shall use a twisted shielded cable including all the positive lines corresponding to one return plus the return itself (between 2 and 4 or 5 core wires). Nominal and redundant branches shall use separate common return lines.

3.5.4.10.2 Extended High Power On/Off Command: (EHP)

The Extended High Power On/Off Command is usually used to command RF switches



GDI-1509 / 1 / R


GDI-1510 / 1 / R


GDI-1512 / 1 / T,A


•Active level: 22V to 29V


GDI-1513 / 1 / T

The pulse width shall be 600ms ± 50ms

GDI-1514 / 1 / T,A

The output voltage rise and fall times shall be:

•trise ≤ 500μs

•tfall ≤ 1000μs when connected to load

GDI-1515 / 1 / T,A


GDI-1516 / 1 / T,A


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GDI-1517 / 1 / T,A

The output impedance shall be 100 kOhm ± 10%, <50pF (if circuit is powerless or output voltage is off)

GDI-1518 / 1 / A


GDI-1519 / 1 / A



GDI-1521 / 1 / R

The receiver shall be a RF switch coil or a relay coil

GDI-1522 / 1 / R


GDI-1523 / 1 / T,A


•activated at less than or equal to 18V and pulse width less than or equal to 500ms (for max current of 360mA)

•no activation for less than or equal to 100μA

GDI-1524 / 1 / T,A


GDI-4697 / 1 / A,R

The input capacitance shall be lower than 300 pF

GDI-1525 / 1 / A


GDI-1526 / 1 / A


GDI-4810 / 1 /

Redunded free-wheel diodes shall be implemented in parallel with RF switch coil or relay coil. Redunded free-wheel diodes shall be put in parallel (in order to suppress negative transients in case of failure in open circuit of one diode).


GDI-1528 / 1 / T,R


GDI-1529 / 1 / T,R


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GDI-4695 / 1 / T,R

When a user receives several relay commands from the same output module, only one return line shall be used for all commands and the link shall use a shielded cable including all the positive lines corresponding to one return plus the return itself (between 2 and 4 or 5 core wires).

3.5.4.10.3 Standard Low Power On/Off Commands (SLP)

The purpose of the Low Power On/Off Commands interface is to transfer a pulse from the driver to the user,

GDI-1536 / 1 /



GDI-1538 / 1 / R


GDI-1539 / 1 / R


GDI-1541 / 1 / T,A


•Active level: 2.5V to 5.1V


GDI-1542 / 1 / T

The pulse width shall be 32ms to 64ms

GDI-1543 / 1 / T,A

The output voltage rise and fall times shall be less than or equal to 500μs

GDI-1544 / 1 / T,A


GDI-1545 / 1 / T,A


GDI-1546 / 1 /

The output impedance shall be 100 kOhm ± 10% (if circuit is powerless or output voltage is off)

GDI-1547 / 1 / A


GDI-1548 / 1 / A



GDI-1550 / 1 / R

The receiver shall be a relay or an optocoupler

AS250


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GDI-1551 / 1 / R


GDI-1552 / 1 / T,A


•activated at greater than 2.5V and pulse width less than or equal to 30ms (for max current of 100mA)

•no activation for less than or equal to 100μA

GDI-1553 / 1 / T,A


GDI-1554 / 1 / T,A

If the receiver is an optocoupler then pulses up to 2V, 1ms shall not activate the switch function

GDI-1555 / 1 / A


GDI-1556 / 1 / A

The receiver shall tolerate voltages between -0.5V and +7V in both ON and OFF state


GDI-1558 / 1 / T,R


3.5.4.10.3.4 Options

3.5.4.10.3.4.1 option 1 Low Power Commands (level)

GDI-5461 / 1 / T,R

Drivers and receivers shall be compatible with the same characteristics as above except that the Active level is permanent and corresponds to Command

3.5.4.10.3.4.2 option 2 SBDL Commands (level)

GDI-5462 / 1 / T,R

Drivers and receivers shall be compatible with SBDL type

GDI-5464 / 1 /

A permanent low level of the SBDL (logic “0”) shall correspond to No Command

GDI-5465 / 1 / T,R

A permanent high level of the SBDL (logic “1”) shall correspond to Command

3.5.4.10.3.4.3 option 3 SBDL Commands (pulse)

GDI-5460 / 1 / T,R


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GDI-5466 / 1 / T,R

The pulse width of high level of the SBDL (logic “1") shall be 32ms to 64ms

3.5.4.11 Relay Status Acquisitions (RSA)

The status is provided by users in the form of a relay dry contact or optocoupler.

GDI-1562 / 1 / R

The open/closed status of a relay/switch contact (or optocoupler) shall be acquired via the Relay Status Acquisition inputs for conversion into one bit being "1" or "0", respectively using a pull-up resistor. The comparing input is referenced to signal ground. A closed contact corresponds to a "0" level and an open contact to a "1" level.

Figure 3.5-24 below presents the principle of relay status acquisitions.

Driver

Receiver A

V+

Receiver B

V+

Figure 3.5-24: Principle of Relay Status Acquisition

The contractor shall design his side of the interface to be compliant to the characteristics as defined below

3.5.4.11.1 Source Circuit Interface Specification

GDI-1567 / 1 / R

The driver shall be a relay contact (floating) or an optocoupler

GDI-1568 / 1 / R


GDI-1569 / 1 / T,R

The "closed" status shall be:

•resistance less than or equal to 50 Ohm (relay type)

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•voltage level less than 1.0V under 2.5 mA (optocoupler type)

GDI-1570 / 1 / T,R

The "open" status shall be:

•resistance greater than or equal to 1 MOhm (relay type)

•leakage current less than 1 uA under 5.5V (optocoupler type)

GDI-1571 / 1 / T,R

The current capability shall be greater than or equal to 10mA

GDI-1572 / 1 / A

The driver shall tolerate voltages between -16.5V to + 16.5V in both ON and OFF state

3.5.4.11.2 Receiver Circuit Interface Specification

GDI-1574 / 1 / R

The receiver circuit shall be single ended with pull-up resistor

GDI-1575 / 1 / R


GDI-1576 / 1 / T,R

deleted

GDI-1577 / 1 / T,R

The receiver shall detect a "closed" status

•for any switch resistance in the range 0 to 50 Ohm (relay contact type)

•for a voltage threshold between 0 and 1.4V (optocoupler type)

GDI-1578 / 1 / T,R

The receiver shall detect an "open" status

•for any switch resistance greater than 1 MOhm (relay contact type)

•for a voltage threshold between 2.2V and 5.5V (optocoupler type)

GDI-1579 / 1 / T,R

The output voltage shall be between 3.7V and 5.5V (open circuit)

GDI-1580 / 1 / T,R

The output current shall be between 0.5mA and 1.0mA

GDI-1581 / 1 / A


GDI-1582 / 1 / A


GDI-4710 / 1 / R

Option : For unit connectors interfacing with external relay status, only relay status signals could be available on connector pins (in this case, the relay status returns are connected to haloring).

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3.5.4.11.3 Harness Interface Specification

GDI-1584 / 1 / T,R


GDI-4690 / 1 / T,I

Option : On receiver side, return signal could be directly connected to haloring.

3.5.4.12 Digital Bi-Level TM Acquisitions (BLD)

GDI-1586 / 1 / R

Each bi-level digital channel shall be used to acquire one of a number of discrete status signals of IU users.

GDI-1587 / 1 / T,R

When used as an ON/OFF state, "ON" state shall be represented by a logical "1" and "OFF" state by logical "0".

GDI-1588 / 1 / T,R

The IU shall acquire via the Bi-Level Digital Acquisition inputs the "High"/"Low" status of a user for conversion into one bit being "1" or "0", respectively.

GDI-1589 / 1 / T,R

Each channel shall be allocated to a specific bit position within an 8-bit telemetry word in such a way, that the channel which has the lowest address number is put at the MSB location (bit 0).


3.5.4.12.1 Driver Circuit Interface Specification

GDI-1592 / 1 / R

The driver circuit shall be single ended

GDI-1593 / 1 / R


GDI-1594 / 1 / T,R

The output voltages shall be:

•Low level: 0V ≤ VOL ≤ 0.5V (Logical "0")

•High Level: 4.5V ≤ VOH ≤ 5.5V (Logical "1")

GDI-1595 / 1 / T,R

The output impedance shall be less than or equal to 7.5 kOhm

GDI-1596 / 1 / A


GDI-1597 / 1 / A


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3.5.4.12.2 Receiver Circuit Interface Specification

GDI-1599 / 1 / R

The circuit shall be a differential receiver

GDI-1600 / 1 / R


GDI-1601 / 1 / T,R

The differential threshold shall be 2.5V ± 0.5V (<2V is logical "0"; >3V is logical "1")

GDI-1602 / 1 / T,R

The nominal differential input range shall be 0V to 5V

GDI-1603 / 1 / T,R

The common mode range shall be 1V to 3.75V

GDI-1604 / 1 / T,R

The input impedance shall be:

•During acquisition: >100 kOhm

•Outside acquisition: ≥20 MOhm

•Switched OFF receiver (unpowered): > 1 kOhm

GDI-1605 / 1 / A


GDI-1606 / 1 / A

The receiver shall tolerate voltages between -15.8V and +15.8V in both ON and OFF state

3.5.4.12.3 Harness Interface Specification

GDI-1608 / 1 / T,R


GDI-1609 / 1 / T,R


3.5.4.12.4 option SBDL status (level)

GDI-5468 / 1 / T,I


GDI-5469 / 1 / T,I

Low level of the SBDL (logic “0”) and High level of the SBDL (logic “1”) shall correspond to the 2 states

AS250


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3.5.4.13 COMMS Interfaces (TT&C)

3.5.4.13.1 S-Band Digital TC Channel Interface

GDI-1612 / 1 / R

The S-Band Digital TC Channel shall consist of 3 signals. (For these signals the following abbreviations shall be used):

•Data (DCD)

•Clock (DCC)

•Data Valid (DCE) [Bit lock status]

GDI-1613 / 1 / T,R

The contractor shall design his part (Driver: Transponder, Receiver: OBC or DCU) of the interface to be compliant with the characteristics of Standard Balanced Digital Link Interfaces (SBDL) as detailed in Section 3.5.4.2 .

GDI-1615 / 2 / T

Figure 3.5-25 shows for information the timing relationship between the Data Valid, Clock and Data signals of the S-Band Digital TC Channel :

Acquisition Sequence Data

Data NRZ-L

Clock

DataValid

Lock Status

CommandData Train

RF-Carrier

T2 T4

Non moduladed

T1T3

Ts Th

Tc

B0 B1 Bn

Figure 3.5-25: S-Band Digital TC Timing Diagram

T1 =< 128 bit (TBC)

T2 between 1 bit and 128 bit (TBC)

T3 =< 500ms

T4 =< 100ms

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Tc = 500µs +/- 5% for a 2kbps uplink; = 62,5µs +/- 5% for a 16kbps uplink; = 15.625µs +/- 5% (for a 64 kbps uplink)

Ts = Tc/2 - Tc/10 min

Th = Tc/2 - Tc/10 min

Note 1: The clock is running as soon as the LOCK STATUS is ”high” and it will run until LOCK STATUS falls to ”low”.

Note 2: The bit clock stability shall be better than +/- 5% as soon as DATA VALID is ”high” and until DATA VALID falls to ”low”.

Note 3: The ESA standard requires an acquisition sequence of 128bits minimum. This value can be increased by adding an idle sequence (min. 8 bits) after the acquisition sequence.

3.5.4.13.2 S-Band Carrier Lock Status Interface

The Carrier Lock Status Signal is issued by the S-Band Transponder and will be acquired by the OBC.

GDI-1620 / 1 / T,R

The contractor shall design his part (Driver: Transponder, Receiver: OBC) of the interface to be compliant to the interface characteristics of Standard Balanced Digital Link Interfaces (SBDL) as detailed in Section 3.5.4.2 .

3.5.4.13.3 S-Band Digital TM Channel Interface

GDI-1623 / 1 / R

The S-Band Digital TM Channel shall consist of 2 signals. (For these signals the following abbreviations shall be used):

•Data (DMD)

•Clock (DMC)

GDI-1624 / 1 / R

The contractor shall design his part (Driver: OBC, Receiver: Transponder) of the interface to be compliant to the interface characteristics of Standard Balanced Digital Link Interfaces (SBDL) as detailed in Section 3.5.4.2 .

The timing relationship between the Data and Clock signals of the S-Band Digital TM Channel is Figure 3.5-26.

AS250


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T1

T2 T3

Tbit

Clock

Data

Tbit : bit period-Tbit/20 = T1 = Tbit/20Tbit/2 - Tbit/10 = T2 = Tbit/2 + Tbit/10Tbit/2 - Tbit/10 = T3 = Tbit/2 + Tbit/10

Figure 3.5-26: S-Band Digital TM Timing Diagram

3.5.4.13.4 S-Band Transponder Uplink Interface

The TRSP to 3dB-Combiner interface is seen as internal interface. The requirements are valid for the S-Band antennae to TRSP interface.

The contractor shall design his part (Driver: S-Band Antennae, Receiver: Transponder) of the interface to be compliant to the interface characteristics as defined below:


GDI-1630 / 1 / T

The output impedance shall be 50 Ohm


GDI-1632 / 1 / T

The input impedance shall be 50 Ohm

GDI-1634 / 1 / T

The uplink frequency shall be 2025 to 2110 MHz

GDI-1635 / 1 / T

The Voltage Standing Wave Ratio (VSWR) for which the circuit can operate correctly shall be less than 1.3 for 10 Mhz bandwidth centred at the nominal uplink frequency with nominal load of 50 Ohm

GDI-1636 / 1 / T

The receiver shall withstand an input level of 0 dBm for 5 minutes without damage

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GDI-1638 / 1 / R

The connector type shall be SMA

GDI-1639 / 1 / R

The wiring type shall be Coax (CX)

3.5.4.13.5 S-Band Transponder Downlink Interface

The TRSP to 3dB-Combiner interface is seen as internal interface. The requirements are valid for the TRSP to S-Band antennae interface.

The contractor shall design his part of the interface to be compliant to the interface characteristics as defined below (Driver: Transponder, Receiver: S-Band Antennae):


GDI-1644 / 1 / T

The downlink frequency shall be 2200 MHz to 2300 MHz

GDI-1646 / 1 / T

The output impedance shall be 50 Ohm

GDI-1647 / 1 / T

The Voltage Standing Wave Ratio (VSWR) for which the circuit can operate correctly shall be less than 1.3 for 10 Mhz bandwidth centred at the nominal uplink frequency with nominal load of 50 Ohm


GDI-1649 / 1 / T

The input impedance shall be 50 Ohm

GDI-1650 / 1 / T

The receiver shall withstand an input level of 20 dBm continuously without damage


GDI-1652 / 1 / R

The connector type shall be SMA

GDI-1653 / 1 / R

The wiring type shall be Coax (CX)

3.5.4.14 Pyrotechnics (PYR)

GDI-1661 / 1 / R

ECSS-E-30 Part 6A Pyrotechnics requirements are applicable.

3.5.4.14.1 General Concept

GDI-1663 / 1 / R

Items which require pyrotechnic release shall incorporate Electro-Explosive Devices (EED's) as an integral part of the item.

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GDI-1664 / 1 / R

All EED's shall be initiated via the spacecraft dedicated pyrotechnic circuitry.

GDI-1665 / 1 / R

Only qualified initiators shall be accepted for use, subject to Prime/ESA approval.

GDI-1666 / 1 / R

Only one firing command to a single filament shall be provided at a time.

GDI-1667 / 1 /

Redundancy shall be provided for each function by duplication up to at least the initiators.

GDI-1668 / 1 / R

The Pyro electronic interface, as well as the interconnecting harness including Antistatic Resistor, shall be as shown in Figure 3.5-27. (The safe plug configuration is indicated by dashed lines.)

GDI-1669 / 1 /

Nominal and redundant pyrotechnic items shall be procured from 2 separate batches

Figure 3.5-27: Pyro Electronic Interface and Schematic Circuitry.

3.5.4.14.1.1 Release Initiator Interface

GDI-1672 / 1 / R

Two independently activated barriers shall safeguard against unintentional ignition (release) of the initiator (actuator), e. g. a commandable arming switch in series with a commandable enable switch.

GDI-1673 / 1 / R

One additional barrier shall be activated by a discrete signal (e.g. separation strap), and not commandable by the on-board SW.

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GDI-1674 / 1 / R

Main and redundant commandable release initiator ignition circuits shall be provided, ganged from 1 main and 1 redundant primary bus power line.

GDI-1675 / 1 / R

Main and redundant ignition power shall be drawn separately from the primary power bus via a redundant daisy-chained power lines, each linked with one (1) arming switch and one (1) enable switch in series.

GDI-1677 / 1 / R

Arming, enable, and ignition switch shall be located in the (positive) power line.

GDI-1678 / 1 / R

Arming and enable, as well as ignition switch actuation shall be performed by separate commands.

GDI-1679 / 1 / R

Relays used for arming and enable switching shall be of the latch type.

GDI-1680 / 1 / R

It shall be possible to ignite main and redundant initiators simultaneously.

GDI-1681 / 1 / R

Status telemetry signals shall indicate the arming status of the power lines of the release initiator circuits.

GDI-1682 / 1 / R

A failsafe signal shall indicate via umbilical the power arm status.

GDI-1683 / 1 / R

Ignition lines of redundant release initiators shall be allocated on separate connectors.

GDI-1684 / 1 / R

Firing circuit harness shall use double shielding configuration that has zero aperture from the circuit driver outlet to the release initiator device. There shall be no gap or discontinuity in the shielding, and no splices within the release initiator cable bundle.

GDI-1685 / 1 / T,R

Each initiator ignition line shall be referenced to chassis ground (structure) via a bleed resistor 100kOhm < R < 1MOhm.

Note: The bleed resistor is needed to protect the circuit against set up of electro-static charge.

GDI-1687 / 1 / T,R

The initiator circuits shall not produce undesirable response, i.e. initiation of an ignition signal caused by radiated E-fields within the electrical system of the S/C.

3.5.4.14.1.2 Safe and Arm Connector

GDI-1689 / 1 / R

A connector shall be provided on the exterior surface of the space vehicle to enable isolation, coupling or testing of any pyrotechnic chain by means of manually inserted plugs.

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GDI-1690 / 1 / R

The safe and arm connector shall be qualified for the number of connection cycles necessary to cover integration, test and use.

GDI-1691 / 1 / R

The safe and arm connector shall be easily accessible.

GDI-1692 / 1 / R

The receptacle shall be a scoop-proof, self-locking bayonet or triple start thread type conforming to ESA SCC 3401/052.

3.5.4.14.1.3 Safe plug

GDI-1694 / 1 / R

The safe plug shall short-circuit and ground each firing circuit through a resistor to provide protection from EMC and ESD as defined in ECSS-E-20.

GDI-1695 / 1 / R

The safe plug shall be compatible with the safe and arm connector receptacle.

GDI-1696 / 1 / R

The safe plug used with the flight space vehicle shall be of a standard suitable for use with flight hardware.

GDI-1697 / 1 / T,R

The safe plug shall be qualified for the number of connection cycles necessary to cover integration, test and use.

3.5.4.14.1.4 Arming plug

GDI-1699 / 1 / T,R

The arming plug shall provide electrical continuity between the supply and firing circuits with the resistance in any line not exceeding the value given in ECSS-E-20.

GDI-1700 / 1 / R

The arming plug shall be compatible with the safe and arm connector and shall meet all the requirements for flight hardware.

GDI-1701 / 1 / R

The plug shall be a scoop-proof, self-locking bayonet or triple-start thread type conforming to ESA SCC 3401/056.

3.5.4.14.2 Detailed Interface Characteristics

GDI-1703 / 1 / R

The electrical design shall allow actuation means of the following release initiator types:

•NSI-type igniter of the so-called 1 A, 1 W, 5 min. - no fire type

•Shape Memory Alloys or equivalent heating devices (thermal knife)

•Low Shock Release Unit (LSRU), either with NSI-type equivalent electrical activation characteristics, or alternative with constant current of 400mA (tbc) over a time of 100......500 ms (tbc).

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GDI-1704 / 1 / R

The selected devices shall be identical to previously flown equipment and used within their domain of qualification.

The contractor shall design his part of the Electro Explosive Device (EED), Shape Memory Device (SMD) or Motor Drive Device (MDD) Interface to be compliant to the characteristics as defined below:

3.5.4.14.2.1 EED Source Circuit Interface Specification

GDI-1707 / 1 / T,A

The firing pulse duration shall be 40ms ± 2ms

GDI-1708 / 1 / T,A

The repetition rate shall be greater than 100ms

GDI-1709 / 1 / T,A

The firing current shall be between 5A and 6.0A

GDI-1710 / 1 / T,A

The circuit shall be connected to structure ground with a 1 MOhm grounding resistor

3.5.4.14.2.2 EED Receiver Circuit Interface Specification

GDI-1712 / 1 / T,A

The initiator shall not fire when supplied with a current of 1A for 5 minutes

GDI-1713 / 1 / T,I,R

The initiator shall fire within 20ms when supplied with a current of 4A

GDI-1714 / 1 / T

The input resistance shall be less than 1.3 Ohm

GDI-1715 / 1 / T

The isolation resistance between the filaments and the EED case before firing shall be greater than 2 MOhm at 250±5 VDC for greater than 15s

3.5.4.14.2.3 EED Harness Interface Specification

GDI-1717 / 1 / T,R


3.5.4.14.2.4 SMD Source Circuit Interface Specification

GDI-1720 / 1 /

The actuation pulse duration is under OBC control

GDI-1721 / 1 / T,A

The actuation current shall be 5.0A max for t > 20 min until OFF command from OBC

GDI-1722 / 1 / T,R

Grounding Resistor TBD

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3.5.4.14.2.5 SMD Receiver Circuit Interface Specification

GDI-1724 / 1 / T,A

Actuation shall not occur when the device is supplied with TBD A for TBD ms

GDI-1725 / 1 / T,A

The actuation current shall be less than 5A for t > 20 min

GDI-1726 / 1 / T,A

The input resistance shall be between 4.1 Ohms and 9 Ohms

GDI-1727 / 1 / T,R

Isolation resistance TBD

3.5.4.14.2.6 SMD Harness Interface Specification

GDI-1729 / 1 / T,R


GDI-1730 / 1 / T,R

Antistatic resistor TBD

3.5.4.14.2.7 MDD Source Circuit Interface Specification

GDI-1732 / 1 / T,A

The actuation pulse duration shall be commandable to a maximum of 2s

GDI-1733 / 1 / T,A

The actuation current shall be between 0.3A and 1A

GDI-1734 / 1 / T,A

Grounding Resistor TBD

3.5.4.14.2.8 MDD Receiver Circuit Interface Specification

GDI-1736 / 1 / T,A

Actuation shall not occur when the device is supplied with TBD A for TBD ms

GDI-1737 / 1 / T,A

The actuation current shall be 1.0A max over 2 sec

GDI-1738 / 1 / T,A

The input resistance shall be between 2 Ohms and 20 Ohms

GDI-1739 / 1 / T,R

Isolation resistance TBD

3.5.4.14.2.9 MDD Harness Interface Specification

GDI-1741 / 1 / T,R


GDI-1742 / 1 / T,R

Antistatic resistor TBD

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3.5.4.15 Propulsion Interfaces

GDI-1744 / 1 / R

The driver function shall implement an arming and firing mechanism to avoid an FCV or LV command activation in case of single failure or inadvertent command.

GDI-1745 / 1 / R

The arming and firing commands shall be implemented by segregated function.

GDI-1746 / 1 / A,R

There shall be no failure propogation from the driver function to any PT, LV or FCV.

GDI-1747 / 1 / T,R

The Driver shall implement free wheeling diodes in the electrical command I/F's with the FCV and LV.

3.5.4.15.1 Latch Valve Interfaces (LVC, LVS)

Each Latch Valve has 2 coils for commanding (LVC) (1 for open command / 1 for close command) and a corresponding status switch (LVS)

GDI-1750 / 1 / T,R

The Latch Valve Command outputs shall provide redundant freewheeling diodes (diodes in parallel) after the commanding switch at the output lines.

GDI-1751 / 1 / R

Each Latch Valve Command interface, main and redundant, shall be able to be cross-strapped with the same Latch Valve coil interface. Therefore protection features shall be implemented to avoid failure propagation between the main and the redundant command type interface respectively..

The contractor shall design his part of the Latch Valve interface to be compliant to the characteristics as defined below:

3.5.4.15.1.1 LVC Driver Circuit Interface Specification

GDI-1754 / 1 / R


GDI-1755 / 1 / R


GDI-1756 / 1 / T

The switching voltage shall be 28V ± 4V

GDI-1757 / 1 / T

The quiescent voltage shall be 0V ± 0.5V

GDI-1758 / 1 / T

The output current capability shall be greater than or equal to 1.1A

GDI-1759 / 1 / T

The pulse duration shall be between 50 and 100ms (to be confirmed by supplier)

GDI-1760 / 1 / A

The driver shall tolerate voltages between 0V and 40V for up to 1 sec (single pulse)

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GDI-1761 / 1 / A

Following a single failure the driver shall not emit a voltage outside the range 0V to 40V

3.5.4.15.1.2 LVC Receiver Circuit Interface Specification

GDI-1763 / 1 / R

The receiver circuit shall be a valve coil (floating)

GDI-1764 / 1 / T

The pull in voltage shall be less than 22VDC. The latch valve shall latch safely for the given pulse

GDI-1765 / 1 / R

The no-command input voltage shall not be less than 0.5VDC.

GDI-1766 / 1 / T

The response time shall be less than or equal to 20ms

GDI-1767 / 1 / T

The open/close coil resistance (DC) shall be between 60 and 380 Ohm

GDI-1768 / 1 / T

The open/close coil inductance shall be between 250 and 750 mH

Supplier will state nominal coil properties and tolerances at ambient conditions

GDI-1770 / 1 / T

The isolation resistance between switching voltage and the structure shall be greater than 1 MOhm

GDI-1771 / 1 / T

The valve shall withstand a voltage of up to 32V for 100μs with no change of state

GDI-1772 / 1 / A

The receiver shall tolerate voltages between 0V and 40V for up to 1 sec

GDI-1773 / 1 / A

Following a single failure the receiver shall not emit a voltage outside the range 0V to 40V

3.5.4.15.1.3 LVC Harness Interface Specification

GDI-1775 / 1 / R

The wiring type shall be Twisted Shielded Pair (TSP). One TSP for OPEN, one TSP for CLOSE on latch valve flying leads of 1m length

GDI-1776 / 1 / R

The screen shall be terminated at the backshell on the driver side and the structure on the receiver side

3.5.4.15.1.4 Latch Valve Status Interface (LVS)

GDI-1778 / 1 / R

The contractor shall design his side of the interface to be compliant to the characteristics as defined in Section 3.5.4.11 .

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3.5.4.15.2 Flow Control Valve Command Interfaces (FCVC)

GDI-1780 / 1 / R

The Flow Control Valve Command outputs shall provide redundant freewheeling diodes (diodes in parallel) after the commanding switch at the output lines.

The contractor shall design his part of the Flow Control Valve Command interface to be compliant to the characteristics as defined below:


GDI-1783 / 1 / R


GDI-1784 / 1 / R


GDI-1785 / 1 / T

The active (on-time) voltage shall be 28V ± 4V

GDI-1786 / 1 / T

The quiescent (off-time) voltage shall be 0V ± 1V

GDI-1787 / 1 / T

The pulse duration shall be programmable in the range 5ms to continuous

GDI-1788 / 1 / T

The rise and fall times (10-90%) shall be less than or equal to 1ms

GDI-1789 / 1 / A

The driver shall tolerate voltages between 0V and 40V

GDI-1790 / 1 / A



GDI-1792 / 1 / R

The receiver circuit shall be a valve coil (floating)

GDI-1793 / 1 / T

The pull in voltage shall be less than or equal to 22VDC. The thruster FCV must be fully open at this voltage

GDI-1794 / 1 / T

The drop out voltage shall be greater than 3VDC. The thruster FCV must remain open down to this voltage

GDI-1795 / 1 / T

The response time shall be less than 20ms

GDI-1796 / 1 / T,A

The FCV shall withstand the on-time voltage for an unlimited duration

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GDI-1797 / 1 / T

The coil resistance shall be between 60 and 380 Ohms

GDI-1798 / 1 / T

The coil inductance shall be between 250 and 750 mH

Supplier will state nominal coil properties and tolerances at ambient conditions

GDI-1800 / 1 / T

The FCV shall withstand a voltage of up to 42V for 100μs with no change of state

GDI-1801 / 1 / T

The insulation resistance (coil to case) shall be greater than 100 MOhm ( at 500V DC ± 10% and 21 degC ± 3 degC )

GDI-1802 / 1 / A

The receiver shall tolerate voltages between 0V and 42V

GDI-1803 / 1 / A

Following a single failure the receiver shall not emit a voltage outside the range 0V to 40V


GDI-1805 / 1 / T,R


GDI-1806 / 1 / T,R


3.5.4.15.3 Pressure Transducer Interface's (PTS, PTA)

GDI-1808 / 1 / R

Internal test acquisitions shall be provided to allow the OBC processor module to check the health of the reference voltages and the good functioning of the analogue/digital-converter.

The contractor shall design his part of the Pressure Transducer Acquisition Interface (PTA) and Pressure Transducer Supply Interface (PTS) to be compliant to the characteristics as defined below:

3.5.4.15.3.1 PTA Driver Circuit Interface Specification

GDI-1811 / 1 / R


GDI-1812 / 1 / R


GDI-1813 / 1 / R


GDI-1814 / 1 / T

The signal range shall be 0V to +5V (±1)

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GDI-1815 / 1 / T

The common mode voltage shall be 0V to +4V

GDI-1816 / 1 / T


GDI-1817 / 1 / T


GDI-1818 / 1 / A


GDI-1819 / 1 / A

The driver shall tolerate voltages between -16.5V and +16.5V

GDI-1820 / 1 / T


GDI-1821 / 1 / T


3.5.4.15.3.2 PTA Receiver Circuit Interface Specification

GDI-1823 / 1 / R

The circuit shall be a differential receiver

GDI-1824 / 1 / R


GDI-1825 / 1 / T

The acquisition range shall be from 0V to +5V

GDI-1826 / 1 / T

The common mode range shall be between 0V and +5V

GDI-1827 / 1 / T,A

The absolute accuracy shall be less than or equal to 0.3% of Full Scale Range (FSR) including offset, gain, nonlinearity and drift errors

GDI-1828 / 1 / T


•During acquisition: ≥ 1 MOhm

•Outside acquisition: ≥ 1 MOhm

•Switched OFF receiver (unpowered): ≥ 100 kOhm

GDI-1829 / 1 / T

The input capacitance shall be less than 1.2μF

GDI-1830 / 1 / T


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GDI-1831 / 1 / T


GDI-1832 / 1 / A


GDI-1833 / 1 / A

The receiver shall tolerate voltages between -14V and +14V

GDI-1834 / 1 / T

An OFF receiver shall withstand an ON driver

3.5.4.15.3.3 PTA Harness Interface Specification

GDI-1836 / 1 / R


GDI-1837 / 1 / R


3.5.4.15.3.4 PTS Driver Circuit Interface Specification

GDI-1839 / 1 / R


GDI-1840 / 1 / R


GDI-1841 / 1 / T

The switching voltage shall be 28V ± 4V

GDI-1842 / 1 / T

The quiescent voltage shall be 0V ± 0.5V

GDI-1843 / 1 / T

The output current capability shall be 1.1A

GDI-1844 / 1 / T

The driver shall be capable of continuous operation

GDI-1845 / 1 / A


GDI-1846 / 1 / A

The driver shall tolerate voltages between 0V and 40V

3.5.4.15.3.5 PTS Receiver Circuit Interface Specification

GDI-1848 / 1 / R

Circuit type TBD

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GDI-1849 / 1 / R

Quiescent input voltage TBD

GDI-1850 / 1 / T

Resistance (DC) TBD

GDI-1851 / 1 / T

Inductance TBD

The supplier will state nominal resistance and inductance values and tolerances at ambient conditions

GDI-1853 / 1 / T

Isolation TBD

GDI-1854 / 1 / A

Following a single failure the receiver shall not emit a voltage outside the range TBD

GDI-1855 / 1 / A

The receiver shall tolerate voltages between TBD

3.5.4.15.3.6 PTS Harness Interface Specification

GDI-1857 / 1 / T,R


GDI-1858 / 1 / T,R


3.5.4.15.4 Main Engine Interface

deleted

3.5.4.16 SpaceWire

This section specifies the physical interconnection and the data communications protocols related to the SpaceWire links.

It specifies the applicability and tailors as required the following protocol layers as specified in the ECSS-E-50-12A:

•Physical layer: defines connectors, cables, cable assemblies, and printed circuit board tracks.

•Signal layer: defines signal encoding, voltage levels, noise margins, and data signalling rates.

•Character layer: defines the data and control characters used to manage the flow of data across a link.

•Exchange layer: defines the protocol for link initialisation, flow control, link error detection and link error recovery.

•Packet layer: defines how data for transmission over a SpaceWire link is split up into packets.

•Network layer: defines the structure of a SpaceWire network and the way in which packets are transferred from a source node to a destination node across a network. It also defines how link errors and network level errors are handled.

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CharacterSignal

Physical

PacketNetwork

Exchange

Space WireLayers

CharacterSignal

Physical

PacketNetwork

Exchange

Space WireLayers

Figure 3.5-28: SpaceWire Layers

GDI-1864 / 1 / R

The applicable version of the ECSS-E-50-12A SpaceWire standard shall be the version dated 24 January 2003

3.5.4.16.1 Terms, Definitions and Abbreviated Terms

The terms, definitions, abbreviated terms and conventions of the ECSS-E-50-12A SpaceWire standard section 3 shall apply

3.5.4.16.2 Physical Layer

3.5.4.16.2.1 Cables

GDI-1869 / 1 / R

The cable definition and construction requirements of the ECSS-E-50-12A SpaceWire standard section 5.2 shall apply

Conductor 28 AWG(7 x 36 AWG)

Insulating layer

Twisted pair

Inner shield aroundtwisted pair (40AWG)

Outer shield (38AWG)

Outer Jacket

Filler

Jacket

Filler

Binder

Conductor 28 AWG(7 x 36 AWG)

Insulating layer

Twisted pair

Inner shield aroundtwisted pair (40AWG)

Outer shield (38AWG)

Outer Jacket

Filler

Jacket

Filler

Binder

Figure 3.5-29: SpaceWire Cable Construction

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3.5.4.16.2.2 Connectors

GDI-1872 / 1 / R

The connector definition and construction requirements of the ECSS-E-50-12A SpaceWire standard paragraph 5.3 shall apply, as shown in Figure 3.5-30

1

2

7

6

5

4

3

8

9

Din+

Din-

Sin+

Sin-

GROUND

Sout+

Sout -

Dout+

Dout-

5

4

8

9

1

2

3

7

6

Dout-

Dout+

Sout-

Sout+

GROUND

Sin-

Sin+

Din-

Din+

Low impedance bond from outer braid to connector shell

Inner shields are isolated from one another.Inner shields around Sout and Dout pairs areconnected together and to pin 3 of connector.

1

2

7

6

5

4

3

8

9

Din+

Din-

Sin+

Sin-

GROUND

Sout+

Sout -

Dout+

Dout-

5

4

8

9

1

2

3

7

6

Dout-

Dout+

Sout-

Sout+

GROUND

Sin-

Sin+

Din-

Din+

Low impedance bond from outer braid to connector shell

Inner shields are isolated from one another.Inner shields around Sout and Dout pairs areconnected together and to pin 3 of connector.

Figure 3.5-30: Connector Definition and Layout

3.5.4.16.2.3 Cable Assembly

GDI-1875 / 1 / R

The cable assembly requirement of the ECSS-E-50-12A SpaceWire standard section 5.4 shall apply.

3.5.4.16.2.4 Printed Circuit Board (PCB) & Backplane Tracking

GDI-1877 / 1 / R

The PCB and backplane tracking requirements of the ECSS-E-50-12A SpaceWire standard section 5.5 shall apply

3.5.4.16.3 Signal Layer

3.5.4.16.3.1 Low Voltage Differential Signalling (LVDS)

GDI-1880 / 1 / R

All the SpaceWire links shall use Low-Voltage Differential Signalling (LVDS) as specified at GDI-1225

3.5.4.16.3.2 Failsafe Operation of LVDS

GDI-1882 / 1 / R

The LVDS failsafe operation requirements of the ECSS-E-50-12A SpaceWire standard section 6.2 shall apply.

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3.5.4.16.3.3 Signal Coding

GDI-1884 / 1 / R

The signal coding requirements of the ECSS-E-50-12A SpaceWire standard sections 6.3, 6.4 and 6.5 shall apply with the precisions shown in Figure 3.5-31.

GDI-1885 / 1 / R

The data-strobe system shall carry an ‘encoded’ clock as shown in Figure 3.5-31 below. The receiving device shall synchronise to the incoming data (asynchronous).

Note: The strobe line shall change state each time when the next bit on the accompanying data line has the same value as its previous one. (Clock recovery by X-ORing)

Figure 3.5-31: Signal Coding

GDI-1887 / 1 / R

A SpaceWire data interface shall consist of a link input (DS-DE-link) and a link output (DS-DE-link), each comprising two differential point-to-point connections issued from the active data source:

•DS_Data (serial bit stream)

•DS_Strobe (decoded strobe)

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Device X Device Y

TxStrobe

TxData

TxStrobe

TxData

RxStrobe

RxData

RxStrobe

RxData

3.5.4.16.3.4 Data Signalling Rate

Definition: The data signalling rate is the rate at which the bits constituting control and data characters are transferred across a link.

GDI-1891 / 1 / T

After a reset or disconnect the SpaceWire link transmitter shall initially commence operating at a data signalling rate of [10 ± 1] Mbps.

GDI-1892 / 1 / T

The lower limit to data signalling rate shall be 2 Mbps.

Note: the standard requires it to be > 1.18 Mbps, i.e., 1/850ns that is the disconnect detection time-out.

GDI-1893 / 1 / T

After the link connection has been established successfully (i.e., the exchange layer state machine is in the Run state, the transmitter operating data signalling rate shall be set to ≥ 100 Mbps for the point-to-point SpaceWire links .

3.5.4.16.3.5 Skew and Jitter

Definitions

•Jitter: random errors in the timing of a signal.

•Skew: difference in time between the edges of two signals which should ideally be concurrent.

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GDI-1896 / 1 / T

In accordance with the definition of skew, jitter and margin as per ECSS-E-50-12A section 6.6.4.1, the total transmitter tmargin shall be ≥ 75 % of the bit period (10 ns @ 100 Mbps => jitter + skew ≤ 2.5ns).

GDI-1897 / 1 / T

In accordance with the definition of skew, jitter and margin as per ECSS-E-50-12A section 6.6.4.1, the total cable assembly tmargin shall be ≥ 80 % of the bit period (10 ns @ 100 Mbps => jitter + skew ≤ 2 ns).

GDI-1898 / 1 / T

In accordance with the definition of skew, jitter and margin as per ECSS-E-50-12A section 6.6.4.1, the total receiver tmargin shall be ≥ 75 % of the bit period (10 ns @ 100 Mbps => jitter + skew ≤ 2.5ns).

3.5.4.16.4 Character Layer

Bits are transmitted as groups called ‘characters’. They represent the smallest usable unit of information.

Characters are used by the higher layers of the protocol to transmit data or to control the transmission of a continuous sequence of characters on the link.

3.5.4.16.4.1 Data Characters, Control Characters and Codes

GDI-1902 / 1 / T,R

The data character, control character and control code requirements of the ECSS-E-50-12A SpaceWire standard sections 7.2 and 7.3 shall apply.

AS250


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P 0

0

X

1

X

2

X

3

X

4

X

5

X

6

X

7

X

Data Characters

Control Characters

P 1 0 0 FCT Flow Control Token

P 1 0 1 EOP Normal End of Packet

P 1 1 0 EEP Error End of Packet

P 1 1 1 ESC Escape

P 1 1 1 NULL0 1 0 0

Parity BitData-Control FlagLSB MSB

LSB transmitted first

P 1 1 1 Time code1 0 T0 T1 T2 T3 T4 T5 T6 T7

Control Codes

LSB MSB

Figure 3.5-32: Character Requirements

GDI-1904 / 1 / R

Each byte shall be transmitted “little endian” ‘i.e. least significant bit LSB first, most significant bit MSB last.

Note: NULL is transmitted whenever a link is not sending data or control tokens, to keep the link active and to support link disconnect.

3.5.4.16.4.2 Parity Coverage

GDI-1907 / 1 / R

The parity bit coverage requirements of the ECSS-E-50-12A SpaceWire standard section 7.4 shall apply.

P 0 X X XXXX XX P 01 1 P 01 0

D ata C haracter E O P FC T

P arityC ov erag e

P arityC ov erag e

Figure 3.5-33: Parity Coverage

3.5.4.16.4.3 First Null Token after Reset or Link Error

GDI-1910 / 1 / R

The first Null Token transmitted after reset or link error shall be as shown in Figure 3.5-34. After Power on, the DS link outputs shall hold both the data and strobe signals at logic ‘0’ (i.e. the reset level) until started/operating. The first bit transmitted after a reset state shall be a zero (which implies that the first transition -low to high - is on the strobe line).

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Figure 3.5-34: First Null Token after Reset or Link Error

3.5.4.16.4.4 Time Interface

GDI-1913 / 1 / T

ECSS-E-50-12A SpaceWire standard time interface provision is imposed. Features specified in sections 7.7 and 8.12 of the standard can be used wherever necessary for synchronisation between modules of an on-board unit.

3.5.4.16.5 Exchange Layer

GDI-1915 / 1 / T

The exchange level is responsible for making a connection across a link and for managing the flow of data across the link.

3.5.4.16.5.1 Link Characters & Nominal Characters

GDI-1917 / 1 / R

The requirements related to the separation of SpaceWire L-Chars and N-Chars as specified in ECSS-E-50-12A section 8.2 shall apply, i.e.,:

•L-Chars = used by exchange layer and not passed to the next layer, "Packet Layer":

•Flow Control Token (FCT)

•Escape (ESC)

•NULL = ESC + FCT

•Time Code = ESC + Data Character

•N-Chars = passed to the "Packet Layer":

•Data Characters

•Normal Enf Of Packet (EOP)

•Error End Of Packet (EEP)

GDI-1918 / 1 / R

Received character shall have parity checked before acted upon.

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3.5.4.16.5.2 Flow Control

GDI-1920 / 1 / R

The requirements related to the SpaceWire link flow control as specified in ECSS-E-50-12A section 8.3 shall apply.

GDI-1921 / 1 / R

Any on-board SpaceWire node shall expand the exchange layer flow control up to the packet layer such that an end-to-end flow control is established.

GDI-1922 / 1 / R

The SpaceWire link interface "Credit Counter" and "Outstanding Counter" as specified in ECSS-E-50-12A section 8.3 shall be accessible to the host system.

GDI-1923 / 1 / R

The highest order of priority for transmission of characters shall be as follows:

•Time Code, whenever SpaceWire is used for synchronising remote nodes from the OBC

•FCTs, otherwise.

3.5.4.16.5.3 State Machine

GDI-1932 / 1 / R

Any on-board SpaceWire node shall provide link management and link data flow control in accordance with the state machine of ECSS-E-50-12A section 8.5.

R ead yR eset Tx

E n ab le R x

S tartedS e n d N u llsE n ab le R x

E rro rR esetR e set TxR e set R x

E rro rW aitR eset Tx

E n ab le R x

R eset

[L in k E n a bled ]

A fte r 6 .4u s

A fte r12 .8us

g o tN u ll

[L in k D isabled ]

R u nS en d F C T s /N C h a rs /N ulls

E n ab le R x

g o tF C T

C o n n ectin gS en d F C T s /N u lls

E n ab le R x

A fter12 .8 u s

A fte r12 .8 u s

R ead yR eset Tx

E n ab le R x

S tartedS e n d N u llsE n ab le R x

E rro rR esetR e set TxR e set R x

E rro rW aitR eset Tx

E n ab le R x

R eset

[L in k E n a bled ]

A fte r 6 .4u s

A fte r12 .8us

g o tN u ll

[L in k D isabled ]

R u nS en d F C T s /N C h a rs /N ulls

E n ab le R x

g o tF C T

C o n n ectin gS en d F C T s /N u lls

E n ab le R x

A fter12 .8 u s

A fte r12 .8 u s

GDI-1934 / 1 / T

Any on-board SpaceWire node shall accept the following types of reset of the SpaceWire link interface state machine and flushing of the associated TX/RX buffers:

•power on reset

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•hardware reset

•software commanded reset

GDI-1935 / 1 / T

The reset of the SpaceWire link interface state machine and flushing of the associated TX/RX buffers shall be accessible through ground TC.

3.5.4.16.5.4 Autostart / Link Initialisation

GDI-1937 / 1 / R

The requirements related to the SpaceWire link autostart / link initialisation as specified in ECSS-E-50-12A sections 8.6 and 8.7 shall apply.

E n d A

E rro rR e s e tR e s e t T x , R e s e t R x

E rro rW a itR e s e t T x , E n a b le R x

E n d B

R e a d yR e s e t T x , E n a b le R x

S ta rte dS e n d N u lls , E n a b le R x



A fte r 6 .4 u s

A fte r 1 2 .8 u s

L in k E n a b le d

A fte r 6 .4 u s

A fte r 1 2 .8 u sS e n d N u lls


E n d A



E n d B


S ta rte dS e n d N u lls , E n a b le R x



A fte r 6 .4 u s

A fte r 1 2 .8 u s

L in k E n a b le d

A fte r 6 .4 u s

A fte r 1 2 .8 u sS e n d N u lls


cont'd

E nd A

S tartedS end N u lls , E nab le R x

R unS end FC Ts/N C hars /N u lls

E nab le R x

C onnectingS end FC Ts/N u lls , E nab le R x


R unS end FC Ts/N C h ars /N u lls

E nable R x


go tN U L L

gotFC T

g otN U LL

gotFC T

L ink E nab led

N U LLs

FC Ts

R ead yR eset Tx , E nab le R x

E nd BE nd A


R unS end FC Ts/N C hars /N u lls

E nab le R x



R unS end FC Ts/N C h ars /N u lls

E nable R x


go tN U L L

gotFC T

g otN U LL

gotFC T

L ink E nab led

N U LLs

FC Ts

R ead yR eset Tx , E nab le R x

E nd B

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GDI-1939 / 1 / T

A SpaceWire link interface shall start

•on command from the host system

•automatically on receipt of a NULL

3.5.4.16.5.5 Normal Operation

GDI-1941 / 1 / R

The requirements related to the SpaceWire link normal operation as specified in ECSS-E-50-12A section 8.8 shall apply.

3.5.4.16.5.6 Error Detection

GDI-1943 / 1 / T

On exchange level, an on-board SpaceWire node shall detect the following errors and react in resetting and re-initialising to recover character synchronisation and flow control:

•Disconnect Error

•No RX clock transition for more that 850 ns

•Parity Error

•Parity bit error

•Escape Error

•ESC character should only be used to form a NULL (ESC, FCT) or time-code (ESC, Data)

•ESC followed by any character other than FCT or data character is an error

•Credit Error

•If there is no room in SpaceWire link interface RX buffer for data received then an error must have occurred which affected the FCTs

•Empty Packet Error

•EOP or EEP followed by another EOP or EEP

•Represents an empty packet

•Not permitted

GDI-1944 / 1 / R

The on-board SpW node full state machine taking into account the errors specified above shall be as shown on figure below:

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ReadyReset Tx

Enable Rx

StartedSend NullsEnable Rx

ErrorResetReset TxReset Rx

ErrorWaitReset Tx

Enable Rx

Reset

[Link Enabled]

After 6.4us

After12.8us

gotNull

RxErr ORCreditErr OR

EmptyPacketErr[Link Disabled]

RunSend FCTs/NChars/Nulls

Enable Rx

RxErr ORgotFCT ORgotNChar

gotFCT

ConnectingSend FCTs/Nulls

Enable Rx


RxErr ORgotFCT OR

gotNChar ORafter 12.8 us

RxErr ORgotNChar ORafter 12.8 us

ReadyReset Tx

Enable Rx

StartedSend NullsEnable Rx

ErrorResetReset TxReset Rx

ErrorWaitReset Tx

Enable Rx

Reset

[Link Enabled]

After 6.4us

After12.8us

gotNull

RxErr ORCreditErr OR

EmptyPacketErr[Link Disabled]

RunSend FCTs/NChars/Nulls

Enable Rx


gotFCT

ConnectingSend FCTs/Nulls

Enable Rx


RxErr ORgotFCT OR

gotNChar ORafter 12.8 us

RxErr ORgotNChar ORafter 12.8 us

GDI-1946 / 1 / R

The "exchange of silence" procedure - upon error detection the initialisation state machine disables the transmitter and receiver therefore causing a disconnection and error recovery at the other end of the SpaceWire link - shall be implemented in accordance with ECSS-E-50-12A section 8.9.4 and its performance made visible to upper SpaceWire protocol layers.

R e s e t T xR e s e t R x

R e s e t T xE n a b le R x

S e n d N u llsE n a b le R x

S e n d F C T sE n a b le R x

N O R M A LO P E R .

E rro r D e te c te d

A fte r 6 .4 u s e c

A fte r 1 2 .8 u s e c

N u ll R e c e ive d






D is c o n n e c t D e te c te d




O n e E n do f L in k

O th e r E n do f L in k

F C T R e c e ive dF C T R e c e ive d

E x c h a n g eo f S ile n c e

N U L L /F C TH a n d s h a k e






E rro r D e te c te d









D is c o n n e c t D e te c te d




O n e E n do f L in k

O th e r E n do f L in k

F C T R e c e ive dF C T R e c e ive d

E x c h a n g eo f S ile n c e

N U L L /F C TH a n d s h a k e

GDI-1948 / 1 / R

The reporting of errors to the upper levels - packet and network layers - shall be done in accordance with ECSS-E-50-12A section 8.9.5.

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GDI-1949 / 1 / R

Errors that can affect the synchronisation on packet level and network level shall be reported to the relevant level.

3.5.4.16.5.7 Exception Conditions

GDI-1951 / 1 / R

The requirements related to the SpaceWire link exception conditions specified in ECSS-E-50-12A section 8.10 shall apply.

3.5.4.16.5.8 Link Timing

GDI-1953 / 1 / R

The requirements related to the SpaceWire link timing specified in ECSS-E-50-12A section 8.11 shall apply with the following time-out specifications:

•disconnect time-out ≤ 1,000 ns

•exchange time-out ≤ values specified in section 8.11.3.

3.5.4.16.5.9 Time Distribution

GDI-1955 / 1 /

N/A

3.5.4.16.6 Packet Layer

3.5.4.16.6.1 SpaceWire Packet Composition

GDI-1958 / 1 / R

The SpaceWire packet format shall be in accordance with section 9.2.1 of ECSS-E-50-12A:

•<DESTINATION><CARGO><END OF PACKET MARKER>

•<DESTINATION>: not required in case of point-to-point SpaceWire links

•Path addressing: specification of physical path, e.g., router port number.

•Logical addressing: specification of the destination node.

•<CARGO>: data transferred from source to destination, i.e., a CCSDS Packet or a Science Packet.

•<END OF PACKET MARKER>: indicates the end of the SpaceWire packet.

GDI-1959 / 1 / R

Whichever SpaceWire supporting device is used, the “cargo area” of a SpaceWire packet as defined in section 9.2.1 of ECSS-E-50-12A shall always consist of an even number of 16-bit words delivered by the successive “data characters”.

Note: this is to allow for SMCS332 packet size restrictions in case it is used in lieu of the SMCS332SpW.

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3.5.4.16.6.2 CCSDS Packet

GDI-1962 / 1 / R

For any on-board SpaceWire node featuring CCSDS packetisation, a SpaceWire packet shall encapsulate one and only one CCSDS packet.

3.5.4.16.6.3 Science Packet

GDI-1964 / 1 / R

For any on-board SpW node featuring science data packetisation, a SpaceWire packet shall encapsulate one and only one science packet.

3.5.4.16.6.4 Maintenance of Synchronisation on SpaceWire Packet Level

GDI-1966 / 1 / R

Any on-board SpaceWire node shall provide means to re-synchronise, on command from the host or automatically, on SpaceWire packet level:

•SpW packet flushing from TX buffer (transmitter may be in the middle of sending a packet), or TX buffer flushing if packet flushing is not possible: in any case, flushing shall be made such as to protect the buffer from host access during flushing.

•Received SpW truncation with EEP (receiver may have been receiving a packet).

3.5.4.16.6.5 Maintenance of Syncronisation on CCSDS Packet Level

GDI-1968 / 1 / R

Any on-board CCSDS-packetised SpaceWire node shall provide means to re-synchronise, on command from the host or automatically, on CCSDS packet level:

•CCSDS packet flushing from TX buffer (transmitter may be in the middle of sending a packet), or TX buffer flushing if packet flushing is not possible: in any case, flushing shall be made such as to protect the buffer from host access during flushing.

Received CCSDS packet discarding, or discarding of a datablock = n x CCSDS packets if not possible. Discarding shall be made such as to protect the RX buffer from other end access during discarding.

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3.5.5 Connectors and Harness General Design Requirements

3.5.5.1 Connector Types

GDI-2099 / 1 / R

The design of electrical connector interfaces shall comply with ESA standard ECSS-E-20A chapter 4.2.3.

GDI-2100 / 1 / R

For the spacecraft cable harness the following connector types shall be used:

•Rectangular connectors D-Sub or High Density in accordance with MIL-C-24308, or with ESA SCC 3401 (ESA 3401-001 for D*M, -002 for D*MA, -009 for MDM connectors)

•Circular connectors in accordance with MIL-C-38999, or with ESA SCC 3401-052.

•Connectors, which interface with release initiators (such as electro-explosive and non-explosive devices) in accordance with MIL-C-26482-2, or with ESA SCC 3401-008.

•Non-magnetic coaxial connectors of the SMA type (3402-001 and 3402-002), or TNC (3402-008 and 3402-009) for RF cables.

•Non-magnetic coaxial connectors of the crimp and solder type per MIL-C-39012.

•Non-magnetic SMA coaxial connectors per MIL-C-83517.

Special connectors, or connectors at of-the-shelf equipment may deviate from the requirement, but the connector counterpart shall be delivered by the manufacturer of the respective unit.

GDI-2101 / 1 / R

All connectors mounted on units shall be D*MA** connectors except for coaxial links which shall use SMA type connectors.

For power lines with currents greater than 15Amps circular connectors e.g. according ESA SCC 3401/056 25-19 (AWG 12) or D-sub 5W5 or 8W8 shall be used.

Exception to this requirement may be granted for High voltage connectors.

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GDI-2102 / 1 / R

The number times flight connectors are mated / demated shall not exceed 5, up to unit delivery and shall be designed to cope with a further 50 mating / demating applications.

GDI-2103 / 1 / R

Different connector classes shall be implemented in order to separate the different type of links: Power, Signal, and Pyros.

Classifications: Power and signal lines shall be gathered into the following EMC classes:

•Class 1 : power (primary / secondary)

•Class 2 : digital signals , high level (non sensitive) analogue signals (except RF)

•Class 3 : pyrotechnics

•Class 4 : low level (sensitive) analogue signals

•Class 5 : RF signals (via coaxial lines , waveguides , microwave transmission lines)

GDI-2104 / 1 / A,R

Signals falling into different EMC classifications shall be assembled to separate connectors and cable bundles.

If not feasible, the separation shall be achieved by a row of grounded pins.

Signal interfaces shall withstand without damage positive or negative nominal voltages that are accessible on the same connector or fault voltages emanating from the EGSE.

GDI-2105 / 1 / R

Sensitive, "High Quality" secondary power shall not be routed together with primary power in the same bundle. In case of such power, a distinction as follows, is recommended:

•Class 1a : Primary Power

•Class 1b : Secondary Power

3.5.5.2 Connector Characteristics

GDI-2107 / 1 / R

Connectors at interfaces shall be clearly identified in particular in the ICD and GA drawing. This applies to equipment connectors as well as to interface brackets connectors.

GDI-2108 / 1 / R

All connectors carrying source power shall be female type.

GDI-2109 / 1 / R

The connector type used for primary power shall not be used for any other signal on the unit

GDI-4768 / 1 / R

Other unit mounted connectors type (male or female) shall be selected in order to avoid mismating.

GDI-2110 / 1 / R

For units or unit assemblies located close to one another, every effort shall be made to minimise the risk of an operator making a wrong connection. This shall be achieved e.g. by attaching the cables to the structure or by carefully choosing the position and orientation of each connector, and by using easily readable labels.

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GDI-4386 / 1 / R

Functional connectors shall not include test points.

GDI-4387 / 1 / R

Coaxial links shall use dedicated coaxial connectors. Test points may, however, be found on coaxial / non-coaxial hybrid connectors.

GDI-2111 / 1 / R

Male and female connectors shall be mechanically locked together to prevent inadvertent disconnection.

GDI-2112 / 1 / I

Active lines together with their return shall be on adjacent contacts to facilitate cable twisting and shielding.

GDI-2113 / 1 / R

Connectors shall be made of Non magnetic material

GDI-4391 / 1 / R

All connector shells shall be made of metallic material.

GDI-2114 / 1 / R

Nominal and redundant lines shall have separate connectors. If not feasible, connector pins carrying redundant functions shall be physically separated and isolated from each other (e.g. by inserting a row of free pins between nominal and redundant signals).

This requirement doesn't apply MIL-STD-1553B bus signals.

Where existing qualified hardware is used that does not comply with the requirement, a Request For Waiver shall be issued and will be treated on a case by case basis taking into account failure propagation effects.

Harness bundles will be split as soon as they exit the connector in all cases.

GDI-2115 / 1 / T,R

In the absence of grounding provision at connector shell level, each connector shall provide one free pin internally connected to the mechanical chassis (ground) of the unit by a resistance lower than 10mΩ measured under 1 Amp.

GDI-4392 / 1 / T,R

Connector pins with the same name shall be interconnected inside the dedicated unit.

GDI-2116 / 1 / R

spare contacts:

For new developments, when the connection is not aligned to a defined standard, 10% spare contacts at unit PDR and at least 5% at CDR shall be achieved with in any case a minimum of two spare contacts available at CDR.

GDI-2117 / 1 / I,R

The following shall be performed for any connector the loss of which can lead to the loss of the mission:

1. Document the connector in the single point failure list.

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2. Verify its integrity up to the highest spacecraft integration level.

GDI-4767 / 1 / A,R

Power bus connector shall implement the number of pins necessary to meet current derating rules.

In addition, in case of failure of a pin, the current in the remaining pins shall remain below maximum rating current.

3.5.5.3 Connector Mounting

GDI-2119 / 1 / R

All electrical connectors shall be located at a minimum distance of 25mm from the unit-mounting plane in order to avoid problems with cable routing and cable harness support fixation.

When connectors are located above 80mm from the unit interface, the equipment supplier shall define tie-wraps on the unit sides to support the harness. The mechanical ICDs shall clearly identify the tie-wraps and the associated harness routings.

GDI-2120 / 1 / R

Connectors shall be arranged in such a way that the harness connectors can be mated and demated easily without special tools and without touching any neighbouring connectors.

The minimum free space around each connector shall be 10mm to allow for installation of spacers and covers.

GDI-2121 / 1 / I,R

Mechanical methods in conjunction with identification markings shall be employed to prevent incorrect mating of connectors.

GDI-2122 / 1 / R

Connector savers shall be utilized on all flight standard connectors to minimize the number of times a flight connector is mated/demated during the unit and subsystem integration activities. The unit manufacturer shall provide these savers.

GDI-2123 / 1 / R

The connection shield ground pin to case shall be as short as possible in order to minimize its effectiveness to act as an antenna, receiving and/or transmitting shield currents. The maximum allowable length is 6 cm.

GDI-2124 / 1 / T,A

The use of a connector saver for ground testing shall not alter the performance of the equipment.

3.5.5.4 Test Connectors

GDI-2126 / 1 / R

Test points on equipment shall :

1. be protected against damage up to the maximum fault voltage present on the connector either coming from the equipment or the EGSE, and

2. be such that unintentional connections of these points to ground does not damage the equipment.

The unit supplier is responsible for the protection provided.

GDI-2127 / 1 / I,R

Test connectors shall be protected by EMC metal covers attached to fixation bolts

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GDI-4388 / 1 / R

All external test connectors on a unit and all structure-mounted test connectors shall be female type.

GDI-2128 / 1 / R

The metallic protection cover shall be capable of flight operation.

GDI-4390 / 1 / R

Metallic protection covers shall be supplied by the Unit supplier.

GDI-2129 / 1 / R

Signals at spacecraft skin connectors interfacing with EGSE shall follow safety rules documented in IEC 60479:1994 “Effects of current on human beings and livestock” when voltages more than 75 V are involved.

3.5.5.5 Harness

GDI-2131 / 1 / I,R

Cables falling into different EMC classifications shall be assembled to different (separate) cable bundles and connectors. If this is not feasible and wires of different classifications use the same connector, the separation shall be implemented by a row of grounded pins in between.

GDI-2132 / 1 / I,R

All cable bundles shall be routed as close as possible to the structure ground plane/ground rail respectively, in order to reduce the common mode noise.

GDI-2133 / 1 / I,R

In wiring through connectors all leads shall be kept as close as possible to their return (i.e. twisted wires shall be routed on adjacent pins), to obtain good self cancellation and to minimize the wire loop.

GDI-2134 / 1 / T

The DC resistance between a single cable shield or a bundle overall shield and the shield ground point (at the connector, unit case, PCB or intermediate points) shall be ≤ 10 mΩ.

GDI-4393 / 1 / A

The inductive term of the shield termination for a single cable shall be lower than 20 nH.

3.5.5.6 Cable and Harness Shields

GDI-2136 / 1 / R

Where shielded wires are used, the shield shall be of a braided construction, selected to provide an optical coverage of at least 85%.

GDI-2137 / 1 / I,R

The structure termination of shields shall be made via connector housing. When multiple shielding is used, each shield shall be grounded separately.

GDI-2138 / 1 / R

The maximum unshielded length of any shielded wire shall not exceed 2.5cm. Cable shields shall be grounded at both ends. Where shielded cable pass through intermediate connectors, the shield shall pass through the interface on dedicated pins.

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GDI-2139 / 1 / R

Daisy chaining of shield terminations shall be avoided. If this is not feasible due to connector limitations, a maximum of three shields of similar electrical interfaces are allowed for daisy chaining.

GDI-2140 / 1 / R

Shields shall not be used as an intentional current carrying conductor and not as return lines for power and signal with the exception of the RF coaxial lines.

GDI-2141 / 1 / R

Overall cable shields shall be made of double wrapped aluminium foil, with an overlap of at least 50%. Overall shields shall be terminated to the connector backshell.

3.5.6 Cross Strapping

GDI-2146 / 1 / R

All equipments including payload equipment shall implement dual redundant TM/TC interfaces.

Note: For example a unique themistor for temperature monitoring is not allowed.

GDI-2148 / 1 / R

For 2 units (UNIT_1 & UNIT_2), which can be used in cold redundancy, the cross strapping of drivers and receivers shall be as defined Figure 3.5-35.

UNIT_1 UNIT_2

UNIT_2_B

R

R

R

R

D

D

D

D

UNIT_2_A

UNIT_1_B

UNIT_1_A

D = R =

Driver Receiver

1_B_B

1_B_A

1_A_A

1_A_B

2_A_A

2_A_B

2_B_B

2_B_A

Figure 3.5-35: Cross Strapping Definition

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GDI-2150 / 1 / R

Number of links:

The UNIT_2_A I/F shall be able to receive:

•A signal from the UNIT_1_A I/F through a dedicated link

•A signal from the UNIT_1_B I/F through a dedicated link

The UNIT_2_B I/F shall be able to receive:

•A signal from the UNIT_1_A I/F through a dedicated link

•A signal from the UNIT_1_B I/F through a dedicated link

The UNIT_1_A I/F shall be able to deliver:

•A signal to the UNIT_2_A I/F through a dedicated link

•A signal to the UNIT_2_B I/F through a dedicated link

The UNIT_1_B I/F shall be able to deliver:

•A signal to the UNIT_2_A I/F through a dedicated link.

•A signal to the UNIT_2_B I/F through a dedicated link.

GDI-2151 / 1 / R

IMMUNITY at UNIT_2 level (Receiver = ON linked to Transmitter = 0FF of UNIT_1):

In the configuration where UNIT_1 driver is OFF and UNIT_2 receiver is ON, the electrical status at receiver output is stable (due to hysteresis) but possibly unknown (logical "1" or "0"). The information received by this receiver shall not disturb the valid information received by the other receiver (linked to a Transmitter ON)

It is recommended to implement a validation / inhibition stage at the receiver output of UNIT_2.

The validation of the path can be made by a dedicated direct command arriving from UNIT_1, which inhibits the UNIT_2 receiver output unused.

GDI-2152 / 1 / R

PROTECTIONS at UNIT_1 Driver level (Transmitter = OFF linked to Receiver = ON of UNIT_2)

Whether powered or not, UNIT_1 Drivers shall withstand any driver characteristics as described in Section 3.5.3 .

GDI-2153 / 1 / R

PROTECTIONS at UNIT_2 receiver level (Receiver = OFF linked to Transmitter = ON of UNIT_1)

Whether powered or not, UNIT_2 Receivers shall withstand any receiver characteristics as described in Section 3.5.3 .

3.5.6.1 Cross-Strapping for Relay Commands

GDI-2155 / 1 / R

For non-redundant relay command receivers, which shall be commanded by redundant relay command drivers, the cross strapping principle as given in Figure 3.5-36 below shall be applied.

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ReceiverDriver A

V+

GND

Driver B

V+

GND

Figure 3.5-36: Relay Command Cross-strapping principle

GDI-2157 / 1 / A

Whether powered or not, Relay Command Driver A shall withstand any characteristics of Driver B and vice versa. Failure on Driver A shall not propagate to Driver B and vice versa.

3.5.6.2 Cross-Strapping for Relay Status Acquisition

GDI-2159 / 1 / R

For non-redundant relay status drivers, which shall be acquired by redundant Relay Status Acquisition receivers, the cross strapping principle as given in Figure 3.5-37 below shall be appllied:

Driver

Receiver A

V+

Receiver B

V+

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Figure 3.5-37: Relay Status Acquisition Cross-strapping principle

GDI-2161 / 1 / A

Whether powered or not, Relay Status Receiver A shall withstand any characteristics of Receiver B and vice versa. Failure on Receiver A shall not propagate to Receiver B and vice versa.

3.5.7 Electrical Interface Control Document

GDI-2163 / 1 / R

Interfaces will be formally controlled within the Electrical Interface Control Documents.

The Electrical Interface Control Document will present all the electrical properties and additional useful details for each unit through the electrical datasheets of APPENDIX C: EICD.

3.5.8 EMC Requirements

3.5.8.1 Bonding

Bonding is the method by which adjacent conductive elements are electrically connected in order to minimise any potential differences and flow of electrical currents. If dissimilar materials are bonded, the relative areas of the anode and the cathodes are important and finishing should be applied on both materials.

GDI-2167 / 1 / R

The bond shall be resistant against corrosion and shall have an adequate cross section to carry fault currents of 1.5 times the unit/circuit protection device for an indefinite time.

GDI-2168 / 1 / T

Metallic parts of each electrical equipment chassis (case) shall be mutually bonded together by direct metal contact (preferred method) or bonding strap. Bonding interfaces shall be designed to achieve a contact resistance of 2.5 mΩ or less measured under 1 Amp. per bonding junction (including strap, if used).

GDI-2169 / 1 / I,R

Joint faces shall be flat and clean before assembly; the only permitted surface finishes for joint faces are (preference order) :

•alodine 1200 for aluminium alloys,

•clean metal except for Aluminium alloys.

GDI-4394 / 1 / I,R

Any other anti-corrosion finish, e.g paint or anodising, shall be removed from the joint faces before bonding and joint faces shall be protected from corrosion.

GDI-2170 / 1 / T

For the purpose of electrostatic protection , all equipment without any electrical function shall be bonded to the structure by direct metallic contact with less than 100kΩ.

GDI-2171 / 1 / T

Each electrical equipment chassis (case) shall be bonded to structure or GRR by means of a bond strap or direct metal contact. The bonding interfaces shall be designed not to exceed a chassis to structure bonding resistance of 5mΩ. The bondstrap shall have a length to width ratio of 5:1 max.

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GDI-2172 / 1 / T

Metallic receptacles of connectors shall be electrically bonded to the equipment case with a DC resistance of 2.5mΩ or less measured under 1 Amp.

3.5.8.1.1 Ground Reference Rail

3.5.8.1.2 Structure Parts

GDI-2179 / 1 / T

The DC resistance between two mating metal parts (including connectors) shall be <2.5mΩ measured under 1 Amp. The minimum size of the contact area shall be 1cm²

GDI-2180 / 1 / T

Across Movable parts, a bond strap shall be applied to ensure an electrical contact is made between those parts, with a DC resistance of <25mΩ.

GDI-2183 / 1 / T

Aluminium honeycomb shall be bonded to the structure with a DC resistance of < 10Ω

GDI-2185 / 1 / T

The DC resistance between any other conductive component that does not perform an electrical function, i.e. CFRP, SiC, CFK, conductive coatings etc. and the spacecraft structure shall be < 100 kΩ

3.5.8.1.3 Mechanical Parts

GDI-2187 / 1 / T,R

Mechanical parts without electrical nor shielding function shall show a bonding resistance of less than 100 kOhm between any adjacent parts and the local GRR / metallic structure.

GDI-2188 / 1 / T,R

Mechanical Parts used for electromagnetic shielding shall show a bonding resistance of less than 2.5 mOhm measured under 1 Amp. between any adjacent parts and the local GRR (or connector bracket) / metallic structure.

3.5.8.2 Grounding and Isolation

3.5.8.2.1 General

GDI-2191 / 1 / I

Each unit shall provide a grounding point, which is easily accessible even when all harness connectors have been installed.

GDI-2192 / 1 / R

CFRP and SiC shall not be used as an electrical bonding path. Grounding rails or metallic structure only shall be used as bonding path.

3.5.8.2.2 Electrical and Electronic unit requirement

GDI-2194 / 1 / T

The structure of electrical and electronic unit shall form a continuous conductive metallic shield for the electronics. Refer to requirement GDI-2168 for bonding within unit cases.

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GDI-2195 / 1 / I

Openings for drainage, ventilation, etc.... shall never exceed 5mm diameter per hole and distances between screws for lids, etc... shall never exceed 30mm for flat mounted lids. Conductive surfaces are required on each bonding surface (each screw). The distance may be enlarged to a maximum of 100 mm if the lids feature an overlap of more than 10 mm.

GDI-2196 / 1 / I

All units shall have a M4 bonding stud

GDI-2197 / 1 / I

This bonding stud shall allow to connect a bonding strap with length to width ratio of less than 5 to 1 with a contact area of more than 1cm2.

GDI-2198 / 1 / T

The resistance between the bonding stud and the unit case shall be < 2.5 mΩ measured under 1 Amp.

GDI-4395 / 1 / T

For units mounted on a conductive structure :

In addition to the nominal bonding path ensured by bonding strap connection, the unit cases shall be bonded to the spacecraft structure via the equipment box feet.

The minimum bonding contact area shall be at least 1 cm².

The resistance between unit case and structure through this bond shall be lower than 10 mΩ

GDI-4396 / 1 / I

For units mounted on CFRP / SiC structure or on non conductive parts (e.g. thermal layer) :

Units shall be bonded to the local GRR by redunded M4 bond studs.

3.5.8.2.3 Insulating materials

GDI-2200 / 1 / R

Space exposed insulating materials having a surface resistivity higher than 1E+9 Ω/square or having a bulk resistivity higher than 1E+13 Ω.m shall not be used.

3.5.8.2.4 Thermal parts

3.5.8.2.4.1 MLI

GDI-2203 / 1 / I

MLI shall carry at least 1 conductive layer and each conductive layer shall be bonded to structure to avoid electrical charge differential.

GDI-2204 / 1 / I,R

The grounding points shall be in a minimum of 2 locations (opposite corners), such that no piece of blanket is >1m away from a grounding point. No blanket shall exceed 2 m2 in size, each blanket shall be individually grounded to the structure. For small MLI pieces below 0.01m2, bonding at one point is sufficient.

GDI-2205 / 1 / T

The resistance between each bonding point and the structure shall be lower than 100mΩ.

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GDI-2206 / 1 / T

The resistance between each bonding point and each point of a conductive layer shall be lower than 100Ω.

3.5.8.2.4.2 Paints

GDI-2208 / 1 / R

Refer to Section 3.5.8.2.3 above.

3.5.8.2.4.3 Heaters and Thermistors

GDI-2210 / 1 / T,R

Heaters, thermistors and other discrete thermal components shall be isolated from structure with a resistance higher than 10 MΩ.

3.5.8.2.5 Primary and Secondary Power Lines

Even if the EGRS (Electrical Ground Reference Structure) impedance is very low, it is better to minimize the currents in the EGRS in order to minimize the common mode voltage. This is also to avoid creating magnetic fields.

3.5.8.2.5.1 Primary Power Lines

Grounding: power buses supplied by the platform PSS (Power Sub-System) are considered as primary power. This power will be referenced to structure at one point only within the PSS. This grounding shall be within the power control unit (PCDU) of the PSS.

GDI-2215 / 1 / T

Applicable for the power control unit (PCDU) of the PSS only :

The primary power starpoint shall be bonded to the ground reference (structure) by a bonding resistance of < 2.5 mΩ measured under 1 Amp.

GDI-2216 / 1 / T,R

Isolation: Within all units (except PCDU) the primary power buses shall be isolated. There shall be no direct connection between the primary power bus zero volt and the unit’s chassis.

GDI-4400 / 1 / T

Isolation performances shall be met whatever the unit mode or configuration.

GDI-2217 / 1 / A,I,R

Any item located upstream of the protection devices and which is set at an electrical potential shall be insulated from the potential reference (either electrical or mechanical) by a double insulation.

This will be performed by using two different insulating materials. A space greater than 1 mm can be considered as an insulating material.

Note: Practical ways to meet this requirement is detailed in Appendix D

GDI-2218 / 1 / T,R

No intentional electrical current, either in a permanent or in a transient way, shall flow through the structure.

In particular, the structure shall not be used as a current return path for primary or secondary power.

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GDI-2219 / 1 / T,R

Isolation: All units (except PCDU) shall maintain a galvanic isolation of at least 1MΩ shunted by not more than 50 nF between:

•Primary power positive and chassis,

•Primary power return and chassis

•Primary power and secondary power (line and return).

GDI-4397 / 1 / T

DC isolation shall be measured under 50V DC.

GDI-4398 / 1 / T

AC isolation shall be measured at 1 kHz.

GDI-4399 / 1 / R

DC and AC isolation values shall be measured with the unit disconnected from any external device.

It is recommended to use static shields between primary and secondary windings of transformers to reduce the capacitive coupling between primary and secondary side. This static shield should be connected to the primary power return line by means of a low inductance strap.

3.5.8.2.5.2 Secondary Power Lines

GDI-2222 / 1 / I,R

Grounding: All secondary power supplies, inside a unit, shall be connected to unit structure. For units providing secondary power to other units, requirements GDI-2224 and GDI-2225 apply

GDI-4402 / 1 / I,R

Redundancy of connection of secondary power supply to unit structure shall be provided ; preferably through multiple connections of the secondary ground reference plane (PCB) to the mechanical structure.

GDI-2223 / 1 / T,R

Isolation: prior to connection of the unit internal starpoint, the isolation between the secondary power return and unit chassis shall be at least 1MΩ in parallel with a capacitance of less than or equal to 50nF.

GDI-2224 / 1 / R

Secondaries distributed between units (1 supplier; 1 receiver): The grounding shall be at ONE point only. In the baseline, the grounding point is located at the supplier. However, Both units (supplier and receiver) shall provide the capability of this grounding point. Implementation of this point will be defined at Project level. Specific care shall be taken to avoid grounding loops between these units (isolation of other interface signals: differential type have to be taken into account)

GDI-2225 / 1 / R

Secondaries distributed between units (1 supplier; several receivers): The distribution shall be a starpoint system for power line and return. Specific care shall be taken to avoid grounding loops between these units (isolation of other interface signals: differential type have to be taken into account)

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GDI-2226 / 1 / T

After grounding, the impedance between the unit secondary zero volts taken at the level of the transformer and the unit structure (bonding stud) shall be less than 5mΩ for its resistive term and less than 50 nH for its inductive term.

To be tested at board level.

The unit supplier will justify the compliance to these values.

GDI-4404 / 1 / A

The current capability of the grounding connection between secondary zero volts and the unit structure shall be larger than 1.5 times the maximum fault current expected to be derived into the unit structure.

GDI-2227 / 1 / I,R

Grounding diagram including zero volts interconnection and detailed physical implementation (with sketches and pictures) shall be described in the EICD

•For each unit,

•For each assembly.

GDI-2228 / 1 / A,R

The symbols below shall be used in the production of grounding diagram in order to obtain unified drawings

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3.5.8.2.5.3 Signal Interfaces

GDI-2231 / 1 / R

Signal circuits interfacing between Satellite equipment shall follow the distributed star point grounding concept, Figure 3.5-38

GDI-2232 / 1 / T,R

Where single-ended signal transmitters are used, independent signal returns are required. Ground reference lines shall not be used as signal returns. The signal receivers shall insulate the signal lines from power ground (differential amplifier, opto-coupler, solid state relay, transformer).

GDI-2233 / 1 / R

The use of common signal return paths is only permitted for groups of signals belonging to the same family (analogue, digital, etc.) and originating from the same unit.

3.5.8.2.5.4 EGSE Grounding and Isolation

GDI-2235 / 1 / R

EGSE signal and power circuits interfacing with flight hardware shall simulate the original flight interfaces w.r.t. Impedance, power and signal characteristics, timing, grounding and isolation and test harness design.

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Figure 3.5-38: Grounding Concept

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3.5.9 Justification of Electrical Design

3.5.9.1 Worst Case Analysis

GDI-2239 / 1 / A

A Worst Case Analysis (WCA) shall be performed to assess the performance of equipment at the end of its planned life (EOL). WCA shall be performed for all electrical design and shall take into account:

•identification of worst case environment/operation/application for each parameter

•tolerance of each parameter from the specified limit under the defined environment condition

•end-of-life drifts in component parameters

•derating requirements as required by ECSS-Q-30-11A

Note : environment includes thermal, electro-magnetic and the effects of radiation (total dose, SEU, SEB, SEGR, ...)

GDI-2240 / 1 / A

Where components are required to operate in a protection mode or in a fail-safe mode in order to prevent failure propagation (e.g. short-circuit protection), the components concerned shall meet the derating requirements and application rules under the worst-case failure conditions.

3.5.9.2 Success Criteria during testing

GDI-2242 / 1 / T,A

During units qualification or acceptance testing, success criteria shall be set to beginning of life (BOL) performance defined by the WCA.

GDI-2243 / 1 / T,A

In case the actual design features better performances than the ones specified, success criteria shall be set to the actual design performance, not to the specified performance.

3.5.9.3 Electrical Schematics

GDI-2245 / 1 / R

All detailed electrical schematics are deliverable and cross-reference between components and Parts List document shall be achieved.

Note : Electrical schems can be gathered in an annex of WCA

3.6 Operations Design and Interface Requirements

3.6.1 Introduction

The GDIR Operational Requirements form one part of the set of operational requirements that are applicable to a unit (see Figure below). The other parts of operational specifications are given by :

•the unit specific requirements document

•the applicable documents referenced in the GDIR and/or the unit specific requirements document. This includes standards as e.g. ECSS standards.

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<Customer>System Requirements

Document

Unit A

Unit C

Unit B

Unit D (Instrument/ Payload)

Astrobus (AB) ProjectSatellite Design

Specification (SDS)

Astrobus ProjectGeneral Design and

Interface Specification(GDIR)

<Project>Packet Utilisation

Standard

<Customer>Operations

RequirementsDocument

<Project>Unit A SpecificRequirementsSpecification

<Project>Unit B SpecificRequirements Specification

<Project>Unit C SpecificRequirementsSpecification

<Project>Instrument/Payload

RequirementsSpecification

<Customer>Standards(e.g. ECSSStandards)

ECSS E70-41A(ECSS PUS)

ProjectSpecificTailoring

Madeapplicable

derive

derive

derive

SCOS2000ICD

<Project>Database ICD MIL-Bus Std

<Project>Protocol Spec.

DCG Ops Manua<Project>

OM RequirementsDefinition Doc.

Madeapplicable

Figure 3.6-1: Organisation and links from standards into GDIR

3.6.2 Bit / Byte Numbering Convention

GDI-2252 / 1 / T

In all project specific documentation including commented code, the following convention shall be applied:

•Bit 0 in a byte shall be the most significant bit and bit 0 shall be transmitted first.

•Byte 0 in data fields shall be the most significant byte, and byte 0 shall be transmitted before byte 1.

Figure 3.6-2 below shall apply

Bit_N-1(LSbit)Bit_0 (MSbit)

transmitted first

Byte_0 (MS byte) Byte_1 (LS byte)

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15

Figure 3.6-2: Bit / Byte Numbering Convention

GDI-2254 / 1 / T

During file transfer, within any data type structure, bytes shall be transmitted in ascending order, i.e. byte 0 before byte 1 etc.

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GDI-2255 / 1 / T

The equipment/instrument bit/byte numbering for any parameter submitted or received shall comply to the Big Endian convention as defined in the <Project PUS>, ECSS PUS ECSS-E-70-41 and CCSDS 102-0-B-5, Packet Telemetry.

Any deviation from Big Endian convention (Little Endian) shall be agreed with the customer

3.6.3 Operational Functions

3.6.3.1 Handling of Operational Configuration, Modes and States

Mode: operational state of a spacecraft, subsystem or payload in which certain functions

can be performed

Mode transition: transition between two operational modes

(Definition from ECSS-E70-11A)

The above definition means in detail:

An operational mode/state represents an operationally well defined and, within certain limitations, a stable configuration as concerns mechanical, thermal, electrical and functional conditions.

Modes/States are defined on satellite, instrument, subsystem and equipment/instrument level as appropriate and form operational entities, which are defined by a list of conditions.

Convention: The terminology “mode” is to be used when mode management is provided by SW, while the terminology “state” is to be used when the functionality is provided by HW.

Mode/State transitions:

Transitions from one mode/state to another are initiated by defined events and depend only on source and destination mode/state and on actual conditions.

The transition time from one mode/state to another is defined by the time triggering the event and the time where all conditions for the new mode/state are fulfilled

For details on the difference of Modes and States the following definition is used.

State (source Wikipedia):

In computer science and automata theory, a state is a unique configuration of information in a program or machine. A state is a particular set of instructions which will be executed in response to the machine's input. The behavior of the system is a function of (a) the definition of the automaton, (b) the input and (c) the current state.

Mode (source Wikipedia):

In user interface design, a mode is a distinct setting within a computer program or any physical machine interface, in which the same user input will produce perceived different results than it would in other settings. The most well-known modal interface components are probably the Caps lock and Insert keys on the standard computer keyboard, both of which put the user's typing into a different mode after being pressed, then return it to the regular mode after being re-pressed.

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Therefore it should be possible to command the equipment into each of its states as required but a related mode may need different commands as input (e.g. arm-fire are separate states but mode "separation" needs the two states arm and fire.

GDI-2262 / 1 / R

The equipment/instrument sub-contractor shall identify appropriate modes/states and transitions between them for the equipment/instrument.

GDI-2263 / 1 / T

The equipment/instruments shall at all times be in a clearly defined and identifiable operational mode/state (of both hardware and software) which is unique and exclusive.

GDI-2264 / 1 / R

The equipment/instrument sub-contractor shall identify all internal and external events triggering a mode/state transition.

GDI-2265 / 1 / T

It shall be possible to transfer the equipment/instrument into each of its operation modes/states by means of a single telecommand.

GDI-2266 / 1 / T

The equipment/instrument shall provide sufficient telemetry to allow unambiguous identification of its mode/state and transitions. This applies for ground commanded transitions as well as for autonomous equipment/instrument triggered transitions.

GDI-2267 / 1 / R

The equipment/instrument sub-contractor shall identify all transition times between modes/states.

GDI-2268 / 1 / T

Completion of any equipment/instrument mode/state transitions shall be indicated in the telemetry.

Note: The completion of the mode/state transition could be done by a specific event.

GDI-2270 / 1 / T

After being powered-up, equipment/instrument shall have a safe and well-defined initial mode/state that is fully reproducible.

3.6.3.1.1 On-Board Software Mode Transition Management

GDI-2272 / 1 / T

In addition, modes and the mode transitions managed by on-board software shall be observable and the necessary data shall be available in the telemetry

GDI-2273 / 1 / R

Mode/State transitions with duration longer than 62 msec shall be indicated in the telemetry.

GDI-2274 / 1 / T

After switch-on of the equipment/instrument, commanding to the equipment/instrument shall be possible within 62 msec.

GDI-2275 / 1 / T

After switch-on of the equipment/instrument, housekeeping data from the equipment/instrument shall be available within 62 msec.

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3.6.3.2 Commandability

3.6.3.2.1 General

Commandability: provision of adequate control functions to configure the on-board systems for the

execution of nominal mission operations, failure detection, identification, isolation,

diagnosis and recovery, and maintenance operations (Definition from ECSS-E70-11A).

The above definition means in detail:

Commandability is characterised by the set of commands to a system, satellite, instrument, subsystem or equipment, which allows modification of its configuration (i.e. status, parameters, settings and/or mode). The correct level of commandability allows the next higher operational level (Ground Segment or Application Software) to set the satellite, instrument, subsystem or equipment in the hardware and software configuration appropriate to fulfil the mission.

GDI-2280 / 1 / T

It shall be possible to command all the equipment/instrument switchable elements (e.g. relays) or equipment/instruments sub-units individually. The on-board equipment/instrument switchable elements / sub-units are to be identified by sub-contractor and agreed with the customer.

GDI-2281 / 1 /

For internally redundant equipment, each redundant part shall be commanded without interruption of the nominal operation of the other part.

Exceptions to this requirement shall be agreed with the customer.

GDI-2282 / 1 / T

Individual switching of switchable elements (e.g. relays) shall be possible even in the case that automatic switching is implemented for nominal operation

GDI-2283 / 1 / T

The on-board reception, processing and execution of telecommands shall not affect the performance of other ongoing equipment/instrument processes.

It is possible that, in contingency actions, execution of a telecommand could affect other on board processes. These cases will have to be clearly identified and documented

Note: It is possible that, in contingency actions, execution of a telecommand could affect other on board processes. These cases will have to be clearly identified and documented.

GDI-2285 / 1 / T

The function of a command shall not change throughout the mission and shall not depend of any previous command history. Flip/flop or toggle commands as well as multi-stable commands (i.e. commands for which effect depends on previous state of the function) are not allowed.

This applies to switchable elements as well as memory/register loads.

GDI-2286 / 1 / T

A single command may be used to initialise a change in configuration via on-board logic only if the individual switching elements are accessible by external commands.

For example: one command can switch two units if the individual unit switches are also commandable from external.

Exceptions to this rule shall be agreed with the customer on a case-by-case basis.

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GDI-2287 / 1 / R

A equipment/instrument telecommand packet shall contain one and only one telecommand function.

Note: a telecommand function is an operationally self-contained control action. A telecommand function may comprise or invoke one or more low-level control actions.

NOTE:

A telecommand that loads or starts an on-board schedule only executes a single function (load or start) irrespective of the number of command functions contained in the load or schedule itself.

GDI-2289 / 1 / R

On-board functions of each equipment/instrument shall have well-defined inputs and outputs that are accessible from the ground for work around solutions in case of contingency operations.

Note:

Whilst inputs to on-board functions can be modified from the ground (e.g. threshold settings), this does not include the manipulation of on-board measurements.

GDI-2291 / 1 / R

Redundant equipment/instrument telecommands shall be differently routed from their corresponding nominal telecommands.

GDI-2292 / 1 / T

The nominal and the redundant functions of a equipment/instrument shall be commanded by the same number, type and format of telecommand.

GDI-2293 / 1 / R

The sending of telecommands from the equipment/instrument to the OBC shall be strictly prohibited.

GDI-2294 / 1 / T

It shall be possible to abort long duration telecommands (i.e. memory patch/dump/check) during execution using a dedicated other telecommand.

GDI-2295 / 1 / T

Changes to equipment/instrument on-board data or software parameters shall be implemented via dedicated equipment/instrument telecommands (general purpose memory load commands shall not be used for this purpose)

GDI-2296 / 1 / T

Readouts of loaded equipment/instrument on-board data or software parameters shall be requested via dedicated telecommands (general purpose memory dump commands shall not be used for this purpose)

GDI-2297 / 1 / T

The equipment/instrument shall provide the capability to execute more than one telecommand (minimum 3 telecommands in parallel).

This is required to enable the execution of a long duration telecommand (e.g. memory dump) in parallel to one short duration command (e.g. request datation report) and still being able to abort the long duration telecommand

GDI-2299 / 1 / R

Commands with variable bit-fields meaning shall not be used.

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GDI-2300 / 1 / T

The equipment/instrument design shall avoid any conflict between a command register update by the S/W and the command acquisition by the equipment/instrument. The register update shall be possible at any time according to the communication protocol.

3.6.3.2.2 Command Acknowledgement and Execution

GDI-2302 / 1 / T

A telecommand that does not conform to the applied telecommand standard as specified in the < Project Packet Utilisation Standard AD-X> or is not recognized as a valid telecommand for the equipment/instrument shall be rejected at the earliest stage of the equipment/instrument telecommand reception, acceptance, execution process

GDI-2303 / 1 / R

The capability shall be provided to perform complete and unambiguous verification of well-defined stages of telecommand execution.

Note: The acknowledgement shall be performed where applicable, e.g.

•On bus protocol level (e.g. MIL-STD 1553B)

•On Packet Utilisation Standard (PUS) level if equipment/instrument SW is involved

Or on a level, where the effect of the command can be identified unambiguously

GDI-2305 / 1 / T

The potential stages of telecommand execution that can be verified shall include acceptance, start of execution, progress of execution and completion of execution.

NOTE These stages of telecommand execution are defined in ECSS--E--70--41A, subclause 4.4.3.

GDI-2307 / 1 / T

Acknowledgement of commands shall be direct (i.e. not relying on the operation of other equipment/instruments or on the previous commanded state) and accurately relevant.

GDI-2308 / 1 / I

The association between implemented equipment/instrument telecommand acknowledgements including the telecommand acknowledge failure identification parameters shall be clearly identified by the equipment/instrument sub-contractor.

GDI-2309 / 1 / T

Failure of telecommand execution at any of the identified stages shall either be explicitly reported or unambiguously observable in the housekeeping telemetry.

NOTE:

ECSS--E--70--41A service 1 can be used for this purpose or could be done on equipment/instrument interface protocol level, where applicable

GDI-2311 / 1 / T

Successful execution of a command to the equipment/instrument shall be notified to the next higher operational level

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GDI-2312 / 1 / T

Failures in the acceptance and/or the execution of commands to the equipment/instrument shall be notified in an unambiguous manner to the next higher operational level

3.6.3.2.3 Conflicting Command Handling

GDI-2314 / 1 / T

The equipment/instrument shall provide means to handle conflicting commanding that may arise from

•protocol transmission errors

•commands received while the execution of an ongoing command is not yet finalised

•incorrect sequencing of commands

GDI-2315 / 1 / R

Any constraints resulting from conflicting command handling shall be identified by the equipment/instrument sub-contractor and documented in its operation manual

3.6.3.3 Observability

3.6.3.3.1 General

Observability (according ECSS-E-70-11A) is the availability to the ground segment and to on-board functions of information on the status, configuration and performance of the space segment.

This means Observability is characterised by the set of telemetry (housekeeping data) that is provided by a system, satellite, instrument, subsystem or equipment, which allows information about its overall status. The correct level of observability allows the next higher operational level (Ground Segment or Application Software) to get the appropriate data for the satellite, instrument, subsystem or equipment for taking any action if required.

GDI-2319 / 1 / T

The equipment/instrument shall provide periodic housekeeping telemetry for all data required for the monitoring and execution of all nominal and foreseen contingency operations throughout the entire mission.

The needed acquisition cycle of monitoring telemetry for savely operating the equipment/instrument is to be described in the equipment/instrument User Manual.

GDI-2321 / 1 / T

The equipment/instrument shall allow for cyclic (regular) and on-request housekeeping data acquisition.

GDI-2322 / 1 / T

The equipment/instrument shall provide the necessary instrumentation, monitoring and telemetry capability to allow the ground or the next higher operational level to determine at any time the precise and current status of the equipment/instrument S/W and H/W (including redundant units, computer, S/W parameter where applicable), without knowing the history of telecommands, history of on-board autonomous actions or information in previous histories.

GDI-2323 / 1 / T

Essential high-priority telemetry enabling a reliable determination of the current H/W and S/W status of the on-board vital equipment shall always be available for real-time downlink.

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GDI-2324 / 1 / A

The availability of equipment/instrument telemetry information shall be compatible with any required response times that have been identified for any equipment/instrument control loops implemented on system level or on ground

GDI-2325 / 1 / T

Telemetry shall always be provided to identify unambiguously the conditions required for execution of all possible configuration dependent telecommands.

Note: A configuration dependent telecommand is defined as a telecommand that should only be executed if a particular subsystem or instrument condition is satisfied.

Note: A configuration dependent telecommand is defined as a telecommand that should only be executed if a particular subsystem or instrument condition is satisfied.

GDI-2327 / 1 / T

Status information in telemetry shall be provided from direct measurements from operating equipment/instruments rather than from secondary effects. This is in particular essential for the status of all on-board relays.

GDI-2328 / 1 / T

Telemetry measurement sensors shall be designed such that they provide the full performance range with a suitable resolution compatible with the parameter to be measured. This resolution shall be determined taking into account the needs for real time control and for performances and lifetime evaluation.

GDI-2329 / 1 / R

All inputs to equipment/instrument autonomous processes shall be visible to the ground via telemetry.

GDI-2330 / 1 / R

Information to indicate all actions of operational significance taken by on-board equipment/instrument autonomous functions shall be visible in the equipment/instrument telemetry

GDI-2331 / 1 /

The equipment/instrument S/W status telemetry shall include all commandable parameters such as monitoring and control thresholds, software tables and flags as well as any global variables.

GDI-2332 / 1 /

The equipment/instrument status telemetry shall include all commandable parameters such as monitoring and control thresholds, tables and flags.

GDI-2333 / 1 / R

Telemetry shall always be available to determine the health status of all equipment/instruments that manage the generation and routing of (other) telemetry data.

GDI-2334 / 1 /

The ground segment shall be provided with all equipment/instrument telemetry data required to verify reception, acceptance and execution of each telecommand unambiguously. This shall include any telecommand sent from ground for immediate, delayed or time-tagged execution, or sent from an on-board application.

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GDI-2335 / 1 / R

Any specific telemetry data processing required at a higher operational level shall be identified and defined by the equipment/instrument sub-contractor and documented in the equipment/instrument user manual.

GDI-2336 / 1 / T

When a key parameter is derived on-board from several inputs, each input shall be available in the telemetry in addition to the parameter itself

GDI-2337 / 1 / T

The equipment/instrument shall provide actual health status information (e.g. processor H/W status, S/W halted/running, watchdogs status, alive flags, alarm status, critical currents/voltages, etc.) of its components via a discrete interface which is independent from the S/W telemetry interface.

The entries provided in this health status shall be guided by the needs for system level FDIR expected for equipment/instrument internal failures.

3.6.3.3.2 Telemetry Acquisition

GDI-2340 / 1 / R

The value of a monitoring (telemetry) parameter shall be transmitted in contiguous bits within one packet.

GDI-2341 / 1 /

The equipment/instrument shall provide telemetry to identify the actual health status of all equipment/instrument hardware components.

GDI-2342 / 1 / T

The TM acquisition process by the data bus shall neither modify the contents of the telemetry H/W register (no status re-initialisation) nor the equipment/instrument configuration; acquisitions with a commanding effect are forbidden.

GDI-2343 / 1 / T

The equipment/instrument design shall avoid any conflict between the acquisition of a telemetry register by the S/W and the register update by the equipment/instrument. The register acquisition shall be possible at any time according to the communication protocol.

GDI-2344 / 1 / R

TM acquisitions with conditional meaning shall not be used.

GDI-2345 / 1 / T

Analogue TM acquisitions shall have a measurement range and an accuracy (w.r.t. time, sampling frequency, resolution, etc.) appropriate to allow handling of nominal operation and detection of anomalies.

GDI-2346 / 1 / R

Acquisition of safety critical analogue parameters of a equipment/instrument shall be possible even when the equipment/instrument is OFF.

GDI-2347 / 1 / R

The values of currents or voltages readings shall be representative and valid irrespective of the status of the equipment/instrument.

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GDI-2348 / 1 / R

The calibration curve of an analogue parameter shall be unique: it shall not depend on the status of the equipment/instrument nor on the value of another parameter.

3.6.3.3.3 Observability of Hardware Configuration

GDI-2350 / 1 / T

At switch on, the configuration of the equipment/instrument at elementary function level shall be clearly defined and observable and available by telemetry, i.e. under a single telemetry identifier.

GDI-2351 / 1 / R

In case a equipment/instrument includes several elementary functions (i.e. converter, bus coupler etc..) the detailed configuration shall be available in a single telemetry identifier.

GDI-2352 / 1 / T

The configuration of any on-board device and any switching element shall be known in a non-ambiguous way, without the need of any older data knowledge.

GDI-2353 / 1 / R

Any configuration command register shall be observable by a corresponding telemetry parameter.

GDI-2354 / 1 / R

The acquisition of the equipment/instrument configuration/state shall be possible irrespective of the equipment/instrument status.

GDI-2355 / 1 / R

The acquisition of an ON/OFF status for a relay shall be independent of the equipment/instrument status.

3.6.3.3.4 Observability of redundancy

GDI-4658 / 1 / T

If the equipment/instrument controls the redundancy configuration or the power of its sub-equipment/instruments, the redundancy setting or power status shall be identified in an unambiguous way in the telemetry.

GDI-4661 / 1 /

Both channels of a internally redundant equipment shall be able to be switched on at the same time without any equipment perfomances degradation in order to check each channel health status.

GDI-4662 / 1 /

It will be possible to monitor the health status telemetries of each nominal and redundant channels in an unambiguous way, without any disturbance.

GDI-4659 / 1 / R

Nominal and redundant functions shall be observable by the same number, type and format of telemetry.

3.6.3.3.5 Converter observability

GDI-4663 / 1 /

Converter telemetry shall provide when applicable:

•secondary voltage

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•primary current

•temperature

3.6.3.4 Mission Critical and Hazardous Functions

Mission-critical function is a function that, when executed at the wrong time, or wrongly executed, or not executed when it should be, can cause permanent mission degradation

This means in detai as follows:

Mission critical functions are those that, if not executed, or wrongly executed, can lead to permanent mission degradation. Permanent mission degradation means, that nominal S/C function or performance can neither be achieved on the nominal nor on any redundant chain for the remainder of the mission lifetime.

Vital functions are those that, if not executed, or wrongly executed, could cause permanent mission degradation. Note that all vital functions are mission critical.

Hazardous functions are those that could cause loss of mission, mission degradation or damage to instrument, equipment, units, facilities or personnel, when being executed at the incorrect time.

Critical commands are defined as commands which invoke mission critical, vital or hazardous functions and for which inadvertent execution (erroneous or inadvertent command transmission), incorrect execution (aborted command transmission or command transmission in wrong order), or loss of function may cause loss of nominal mission or, during the ground phase, presents hazards for personnel.

For instance, critical commands include pyrotechnics firing, propulsion (hydrazine) activation, solar array deployment or other deployment related functions, etc.

GDI-2364 / 1 / A

All critical commands shall be identified for further analyses at system level.

GDI-2365 / 1 / I

All critical commands shall be provided in a Critical Command List.

GDI-2366 / 1 / A

The execution of any command or command sequence shall not lead to permanent equipment/instrument or unit damage. This applies also for incorrect commands or command sequences.

Exceptions to this requirement shall be approved by the Satellite Prime and shall be included in a Critical Command List.

GDI-2367 / 1 / R

Commanding of critical commands shall be implemented by at least two separate and independent commands.

The level of implementation shall be approved by the Satellite Prime

GDI-2368 / 1 / T

The status of inhibition of safety critical functions shall be monitored and readable in a non-ambiguous way even if the function is not powered.

GDI-2369 / 1 / T

Equipment/instruments shall provide an unambiguous health status of potentially hazardous functions in a dedicated TM identifier.

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3.6.3.5 Time Synchronisation & Datation

GDI-2371 / 1 / T

The equipment/instrument shall indicate within the time field (by an added synchronization status field) of its telemetry packet header, whether the equipment/instrument time has been nominally synchronized to the satellite on-board master clock by processing the received spacecraft on-board time packet or not, (e.g. during equipment/instrument switch-on or reset, TM packets may be generated before nominal time synchronization is provided by the equipment/instrument).

In detail, this indication shall flag whether the PPS has been received and whether an Spacecraft On-board Time Tacket has been received and processed by the equipment/instrument. The format of the time synchronization field is specified in the "Project Packet Utilization Standard".

GDI-2372 / 1 / T

Timing information provided in Housekeeping telemetry of the equipment/instrument shall allow the correlation from on-board time to UTC with an accuracy necessary for command & control operations and compliant with any equipment/instrument datation requirements.

GDI-2373 / 1 / T

The equipment/instrument shall time-stamp all its telemetry packets in the data field header time field (acc. to "Project Packet Utilisation Standard") with the unmodified on-board time stamp from the received on-board Time Packet for the corresponding PPS cycle.

In case the equipment/instrument is calculating the time stamping on its own, based on a defined edge of the PPS pulse, additional requirements on deterministic behaviour for the time stamping and failure tolerance for missing PPS signals has to be defined to properly harmonize between equipment/instrument and system level timing and datation.

GDI-2375 / 1 / T

In case the datation of any equipment/instrument telemetry (science TM) is performed using a time source that is not the master clock (e.g. GPS), then a periodic telemetry packet should be provided allowing ground to derive a precise correlation between the two times.

3.6.3.6 Memory Management

GDI-2377 / 1 / T

It shall be possible to upload the complete equipment/instrument application software image via the equipment/instrument specific command interface.

GDI-2378 / 1 / T

It shall be possible to store the uploaded equipment/instrument application software image in a non-volatile memory

GDI-2379 / 1 / T

It shall be possible to perform memory dumps for any equipment/instrument memory type (PROM, EEPROM, RAM, REGISTER)

GDI-2380 / 1 / T

It shall be possible to perform memory checks for any equipment/instrument memory type (PROM, EEPROM, RAM)

GDI-2381 / 1 / T

It shall be possible to perform memory patches for all equipment/instrument EEPROM, RAM and REGISTER memory

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GDI-2382 / 1 / T

Memory patch/dump/check operations shall be possible in at least one stable equipment/instrument mode.

Patch/Dump operations have to be possible at least in a mode which can be reached without the need of a proper functioning of the application software itself. Further, it is recommended to provide memory patch/dump/check capabilities for nominal operational modes in order to check/modify parameter settings during nominal operation.

Memory constraints driven by hardware w.r.t. byte boundaries, alignments, etc. shall be supported by the equipment/instrument application

3.6.3.7 Autonomy

GDI-2385 / 1 / T

The equipment/instrument shall be designed for operating autonomously during nominal conditions to serve

•the overall system autonomy needs

•its designated function

•its mode definitions

During all autonomous operations of the equipment/instrument, the equipment/instrument shall be commandable and shall include nominal data acquisition and data transmission.

GDI-2386 / 1 / T

All parameters used for autonomous operations and processes, including FDIR functions, shall be updateable by command and available in telemetry.

GDI-2387 / 1 / A

Unnecessary equipment/instrument reconfigurations, i.e. reconfigurations not necessary to preserve the health of the equipment/instrument, shall be avoided.

GDI-2388 / 1 / T

It shall be possible to enable/disable and to override all equipment/instrument autonomous functions including equipment/instrument FDIR functions by telecommand. This shall be possible parameter by parameter.

Any inhibition of a protection feature which can lead to the loss of the main primary power bus in case of a single failure at satellite level is strictly forbidden.

Exceptions to be agreed with the customer

GDI-2389 / 1 / T

All parameters used for equipment/instrument autonomous operations (e.g. thresholds for limit checking) including equipment/instrument level FDIR fucntions, shall be updateable by equipment/instrument telecommand and available in equipment/instrument telemetry.

GDI-2390 / 1 / T

Initialisation of a equipment/instrument mode/state shall include configuration of the necessary internal hardware (e.g. sensors), activation of a default periodic telemetry configuration, and all of the automatic processes (e.g. automatic measurement data acquisition) required to achieve the objective of the mode/state.

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GDI-2391 / 1 / T

An equipment/instrument on-board logic shall be available to prevent incorrect commanding of forbidden S/W based mode transitions (triggered by autonomous commanding as well as by ground commanding). The allowed and forbidden mode transitions between all possible pairs of equipment/instrument modes shall be implemented in S/W and thus updateable by means of equipment/instrument memory patch telecommands.

GDI-2392 / 1 / T

Telemetry shall be associated to all equipment/instrument autonomous functions enabling the ground to be informed of all the actions of the equipment/instrument autonomous functions and of their enabled/disableded status.

GDI-2393 / 1 / T

Any input used by the equipment/instrument autonomous functions shall be observable in the equipment/instrument telemetry.

Exceptions to be agreed with the customer.

GDI-2394 / 1 / T

All actions generated by automatic on-board logic (hardware or software) shall be inhibitable, reversible, by command.

Exceptions shall be discussed on a case-by-case basis.

GDI-2395 / 1 / T

For all the automatic logic using several criteria in an “OR” configuration inhibition shall be possible individually and independently for each criteria.

GDI-2396 / 1 / T

The capability to change all on board logic (hardware and software) thresholds at any time shall be provided.

3.6.3.8 Fault Management / FDIR

3.6.3.8.1 Equipment/Instrument Fault Protection

GDI-2399 / 1 / T

Any equipment/instrument shall be able to withstand (i.e. remain in a safe state, without any requirement on performances, and except in case of equipment/instrument failure due to another cause), interruptions of the cyclic management by the OBSW during TBD minutes, regardless of the configuration it was left.

GDI-2400 / 1 / T

Any equipment/instrument shall be able to withstand (i.e. remain in a safe state, without any requirement on performances, and except in case of equipment/instrument failure due to another cause), interruptions of the data bus operation during TBD minutes, regardless of the configuration it was left.

GDI-2401 / 1 / T

It shall be possible to repeat any command several times without disturbing its nominal execution, even in case of timing constraints. No configuration change, no temporary or permanent degradation of the function performance must result from any command repeatability that would respect data bus constraints.

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3.6.3.8.2 Equipment/Instrument Self Checks

GDI-2403 / 1 / T

All equipment/instruments that perform regular self-checks shall report the result regularly in a single TM packet.

GDI-2404 / 1 / T

All equipment/instruments that perform self-tests at start-up shall report the result in a single TM packet.

3.6.3.8.3 Failure Detection, Isolation and Recovery (FDIR) Functions

FDIR functions are those functions, which implement the failure detection, isolation and recovery actions. The FDIR functionality is set up at both equipment/instrument and system levels and is defined within the overall Operations Concept of the spacecraft. The implementation of the FDIR function is based on specific system needs, e.g. the time to react, which is the maximum time to end a recovery action guaranteeing the hardware integrity.

FDIR functions shall be implemented in a hierarchical manner, i.e. failure detection, isolation and recovery shall be implemented to a certain degree on equipment/instrument level.

GDI-2408 / 1 / R

Fault detection, isolation and recovery shall be performed in a hierarchical manner with the aim of isolation and recovering faults as far and as fast as possible.

GDI-2409 / 1 / T

The equipment/instrument shall autonomously detect any equipment/instrument failure which makes it deviate from its nominal configuration and operating status. This includes HW and SW failures.

GDI-2410 / 1 / A

At equipment/instrument level failures shall be detectable by adequate and comprehensive monitoring (e.g. for switchable elements) and the capability for failure isolation and recovery action shall be provided.

GDI-2411 / 1 / T

Equipment/instrument anomalies and the autonomous actions taken to recover from them shall be reported in event telemetry packets.

GDI-2412 / 1 / R

The fault management functions on equipment/instrument level shall carry out consistency verification checks on independent or redundant sensor readings whenever available before starting the recovery actions.

GDI-2413 / 1 / T

Failure detection algorithms shall avoid continuous production of the same anomaly event report packet if the same failure is detected within a specified number of monitoring cycles.

GDI-2414 / 1 / T

In case the specified number of same Warning/Low Severity Events (PUS service (5,2)) have been generated by the equipment/instrument FDIR function, this service shall be disabled and a next higher event shall be generated (service (5,3)) telling the ground that the event report has been disabled

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GDI-2415 / 1 / T

In case the specified number of same Medium Severity Events (PUS service (5,3)) have been generated by the equipment/instrument FDIR function, this service shall be disabled and a next higher event shall be generated (service (5,4)) telling the ground that the event report has been disabled.

GDI-2416 / 1 /

The specified number of occurences for the Lowe Severity events and Medium severity events mentionend in GDI-2414 and GDI5389 shall be programmable.

Please note this is for ground operations in order to be able to alter this parameter throughout the course of the S/C AIT and S/C operations to for implementing optimizations to this event reporting during usage.

GDI-2418 / 1 / R

Failure detection algorithms shall report in event telemetry all parameter values considered necessary for the ground analysis of the failure.

GDI-2419 / 1 / R

Failure isolation shall be performed at switchable items level

GDI-2420 / 1 / T

Any FDIR actions on equipment/instrument level shall be reported to the next higher operations level. This includes in particular redundancy switching.

GDI-2421 / 1 / A

The need for intervention of higher levels to react on failure situations which cannot be handled at equipment/instrument level shall be clearly identified and communicated to the next higher operational control level.

Any need for higher level suppot in failure cases is subject for approval

GDI-2422 / 1 / R

The reaction time for such a higher-level intervention shall be identified.

GDI-2423 / 1 / T

Failures that require a reaction time less than 10 sec shall be monitored through a hardware device (Watchdog, current limiter etc..)

GDI-2424 / 1 / R

Failure which requires a reaction time between 10 sec and 48 hours shall be monitored by on board software implemented in the equipment/instrument or by SW in the higher operational level. The reaction times shall be compatible with the overall system autonomy requirements.

3.6.3.9 Monitoring and Surveillance Requirements

GDI-2426 / 1 /

TBD

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3.6.4 Operational Services

GDI-2428 / 1 / R

The equipment/instrument with software inside, shall comply to the PUS services identified in the Astrosat 250 project - Generic and DMS TM/TC ICD as identified in the PUS service applicability matrix given therein.

GDI-2429 / 1 / R

In case an equipment/instrument (with software inside), would like to use additional services, those services shall be agreed with EADS Astrium.

3.6.5 Data Interface Protocol Requirements

GDI-2431 / 1 / R

The equipment/instrument shall comply to the MIL-Bus protocol requirements identified in the Astrosat 250 project - MIL-STD-1553B Bus Protocol Specification.

3.6.6 Other Requirements

3.6.6.1 Inputs to Design Justification File

GDI-2434 / 1 / R

The equipment/instrument sub-contractor shall provide a design justification for the operations relevant part. For each telemetry/telecommand and their parameters a functional description shall be given with the reason of the choice.

It shall be proved that the location of the acquisition and its characteristics (dynamic, bandwidth, resolution, frequency variation in case of failure) can satisfy the operational requirements and is appropriate for all modes (normal and contingency modes, safe modes..)

3.6.6.2 Inputs to Satellite TM/TC Database

GDI-2436 / 1 / R

The equipment/instrument sub-contractor shall provide inputs to the Satellite TM/TC Database or fill in a customer provided Database. This data shall be provided through a defined and agreed numerical format (based on Excel or ASCII files). The detailed format is to be defined by the Customer in the Astrosat 250 project - Database Input Definition Document .

GDI-2437 / 1 / R

Data to be provided (the list is not exhaustive):

•For TM: Mnemonic, description, addressing, coding, calibration, bandwidth, validity conditions, monitoring limits.

•For TC: Mnemonic, description, addressing, coding, calibration, execution conditions, execution checking.

3.6.6.3 Operation Manual

GDI-2439 / 1 / R

The equipment/instrument sub-contractor shall provide an Operations Manual covering all operational aspects (in-flight and on-ground) for the equipment/instrument in accordance with the equipment/instrument Operations Manual Definition Document issued by the Astrosat 250_Project.

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GDI-2440 / 1 / R

The following standardisation (Table 3.6-1) shall be used for the coding of 2-state status:

Meaning of status bit 0 Meaning of status bit 1 Unit or function OFF

Redundant Disconnected Switch open Faulty status Not selected

Absence Backward

Left Unused

Still Plus

Disarmed Inactive Inhibited

Unit or function ON Nominal

Connected Switch closed Correct status

Selected Presence Forward

Right Used

Moving Minus Armed Active

Enabled

Table 3.6-1: Meaning of Status Bits

3.7 deleted

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4. ENVIRONMENT DESIGN REQUIREMENTS

4.1 Atmospheric Conditions

4.1.1 Humidity

GDI-2455 / 1 / R

The unit shall be designed to withstand a relative humidity of 60% maximum during testing and transport.

4.1.2 Cleanliness

GDI-2457 / 1 / R

The cleanliness design requirements on the unit H/W shall be as defined in the applicable PA requirements for subcontractors

4.1.3 Storage time

GDI-2459 / 1 / R

The S/C units flight H/W shall be designed to withstand a storage duration as specified in Section 3.1.1 .

4.1.4 Pressure Environment

Decreasing atmospheric pressure from launch pad level conditions down to vacuum will occur at a rate dependent on the flight profiles and venting schedule.

GDI-2462 / 1 / T

Units mounted on the S/C shall be designed to withstand without degradation, a de-pressurization rate of 70mbar/s maximum and a Delta-P of 150mbar over ambient.

4.1.5 Contamination

GDI-2464 / 1 / R

Cleanliness requirements shall be as defined in the PA document at delivery. The generic cleanliness requirements applicable is the "visibly clean level 2 " defined in MIL-STD-1246C .

4.2 Mechanical Environment

4.2.1 Ground Operations Loads

This section defines the mechanical environments, which the units and their GSE will be subjected to during normal ground operations.

The ground operation phase begins with the units manufacturing and ends before launch. It includes all the manufacturing, assembly, integration and verification (AIV) and storage activities.

The unit the transportation container and MGSE are exposed to dynamic loads during the required transportation modes (road, air, train…) and handling operations.

GDI-2470 / 1 / T,A

The units and associated transport containers shall be sized to survive transportation and handling loads as defined in Table 4.2-1.

Vertical and horizontal loads shall be considered as acting simultaneously (un-attenuated input to MGSE).

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GROUND EVENT VERTICAL (*) HORIZONTAL Ground Transportation ± 3.0g ± 2.0g

(*) Vertical is the direction parallel to the gravity

Table 4.2-1: Limit Accelerations for Ground Operations

GDI-2481 / 1 / T,A

During ground transportation the units shall withstand without damage the limit shock loads defined in Table 4.2-2.

Mode Direction Amplitude (g)

Half Period (msec)

Pulse Shape

Number of Pulses

Ground general +X +4.0 20 Saw Tooth 1 Transportation +Y +4.0 20 Saw Tooth 1 +Z +4.0 20 Saw Tooth 1

Table 4.2-2: Unit Transportation Limit Shock Load

GDI-2516 / 1 / T,A

All MGSE, containers, transportation and handling methods shall be such that flight hardware for which it is intended, never experience any environmental condition outside the defined envelope above

GDI-2517 / 1 / T,A

Sine and random vibrations: the unit transport container shall be designed to ensure that the loads experienced by the flight unit are limited to the constant acceleration levels defined above

GDI-2518 / 1 / T,A

For containers, the shock requirement is a drop of 100 mm onto concrete of one corner of the container, with another corner of the container lying on the concrete floor.

The transportation containers shall be designed to ensure that the flight unit contained within is protected from and shall be undamaged by shocks.

4.2.2 Launch and Early Orbit Phase.

This section defines the mechanical environments, which the unit will be subjected to during launch and early orbit phase.

It aims at defining the mechanical environments while the launcher is not yet known, and the spacecraft mechanical analyses not yet performed.

When necessary, the approach takes into account the panel mass density where the unit is installed.

4.2.2.1 Unit Quasi-Static Loads

Quasi-static and low frequency flight limit accelerations that the units will encounter during launch and early orbit phase, are covered by sine vibrations loads for units.

4.2.2.2 Dynamic Environment

The Launch will induce dynamic vibration loads at the unit interfaces. The levels of these dynamic excitations depend on both the launcher type and the dynamic couplings between the launcher, the satellite and/or instrument/lower level sub-assemblies on which the units are mounted.

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The dynamic environments that apply at units interface are defined:

•In Section 4.2.2.2.1 for sinusoidal vibration

•In Section 4.2.2.2.2 for random vibration

•In Section 4.2.2.2.3 for shock

Note: Acoustic noise environment is specified in unit specification when appropriate.

4.2.2.2.1 Sinusoidal Environment

GDI-2663 / 1 / T,A

Units mounted on the spacecraft shall be designed to withstand without degradation the sinusoidal environment as defined in Table 4.2-3

Axis Frequency (Hz) level (g) Sweep rate

All axes 5 - 20

20 - 100

Max shaker amplitude

20 g

2 oct/mn

Table 4.2-3: Sinusoidal Vibration Environment for internal units

Any unit located on appendices or on external bus secondary support structure or support bracket shall be designed to withstand without degradation the sinusoidal environment as defined in Table 4.2-4

Axis Frequency (Hz) level (g) Sweep rate

All axes 5 - 20

20 - 100

Max shaker amplitude

30 g

2 oct/mn

Table 4.2-4:Sinusoidal Vibration environment for external units and/or mounted on secondary structures

4.2.2.2.2 Unit Random Vibration Environment

GDI-2742 / 1 / T,A

Units mounted on the spacecraft shall be designed to withstand without degradation the random environment as defined in Table 4.2-5

Notchings based on interface loads may be applied for units with a mass ⟩ 10kg.

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Axis / Unit mass Frequency (Hz) Qualification Level

20 – 100 + 12 dB/oct

100 – 300 1.5 g²/Hz

300 – 2000 -8 dB/oct

Perpendicular to mounting plane Mass < 3kg

(1 axis)

g rms 24.3

20 - 80 + 3 dB/oct

80 - 400 0.5 g²/Hz

400 - 2000 -6 dB/oct

Perpendicular to mounting plane 3kg < Mass < 10 kg

(1 axis)

g rms 18.4

20 - 80 + 3 dB/oct

80 - 200 0.5 g²/Hz

200 - 400 0.3 g²/Hz

400 - 2000 -6 dB/oct

Perpendicular to mounting plane Mass > 10 kg

(1 axis)

g rms 15.4

20 - 80 + 4 dB/oct

80 - 1000 0.1 g²/Hz

1000 - 2000 -3 dB/oct

Parallel to mounting plane

All units

(2 axes) g rms 12.8

Table 4.2-5: Unit Random vibration qualification level

GDI-2785 / 1 / T,A

Any unit located on appendices or on an external bus secondary support structure or support bracket shall be designed to withstand without degradation Random vibration loads as defined in Table 4.2-6

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Axis Frequency (Hz) Qualification Level

20 - 100 + 12 dB/oct

100 - 300 1.5 g²/Hz

300 - 650 -15 dB/oct

650 - 850 0.03 g²/Hz

850 - 2000 -6 dB/oct

All (3 axes)

g rms 21.4

Table 4.2-6: Unit Random Vibration Qualification level on appendices or on external secondary structures

4.2.2.2.3 Shock Environment

The spacecraft units are subjected to shocks, caused by spacecraft separation from the launch vehicle upper stage and from spacecraft appendices deployment.

GDI-2937 / 1 / T,A,R

The unit supplier shall produce a list of the unit shock sensitive components as : relays and switches (sensitive to chatter, transfer or permanent damage), brittle materials (crystals, ceramics, glass, wire leads, brittle epoxies), mechanisms.

GDI-2938 / 1 / T,A,R

The qualification to shock has to be demonstrated through shock testing. Qualification based on heritage based on a very similar unit qualification testing may be proposed and have to be agreed by the customer case by case.

GDI-2939 / 1 / T,A,R

Shock testing shall be performed with a metal-metal or pyro testing device providing the following shock characteristics: absolute positive and negative g-peaks within 20% and attenuation of 90% of the g-levels after 15 ms.

GDI-2940 / 1 / T,A,R

In case that bouncing of relays may lead to interruption of signal or voltage drop during shock event, the electronic unit shall provide tolerance w.r.t. relay bouncing e.g. < 10msec by means of solid state switch or filter capacity.

GDI-2941 / 1 / T,A,R

Units shall be designed and tested to withstand without degradation the following shock specification applicable independently to each axes X,Y and Z:

Frequency 100 Hz 2kHz 10kHz Shock response spectrum (Q=10) at unit interface

20g 2000g 2000g

Table 4.2-7: Shock Spectrum at Unit/Structure Interface

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Units shall not produce or initiate shocks at release, deployment and latching higher than 50% of the SRS defined in table 4.2.8, Case C. Self-induced shocks shall be measured in a frequency band from 100Hz to 5000Hz in the vicinity of the release mechanism.

4.2.3 In Orbit Phase

4.2.3.1 Quasi-static Loads and thermoelastic loads

GDI-2976 / 1 / T,A,R

During orbit and attitude correction manoeuvres, the dynamic environment that applies on the unit (linear acceleration, angular velocity, angular acceleration) is specified in unit specification when appropriate.

GDI-2977 / 1 / A

If potentially mounted on a CFRP panel, the unit shall be compatible with internal loads generated due to thermo-elastic deformation up to a maximum load on any foot of 2000N assuming that it is clamped to a thermally rigid panel (i.e. CTE = 0)..

4.2.3.2 Micro-vibrations

GDI-2979 / 1 / A

The unit shall meet its performance requirements when submitted to an interface acceleration (3-axes) up to 0.1g in the frequency range 0.1 to 1000 Hz. For units potentially sensitive to microvibrations, this immunity shall be demonstrated by test.

GDI-2980 / 1 / T,A

Any microvibration load higher than 0.1N or 0.1 Nm, in the frequency range 0.1 to 1000 Hz, generated by the unit at its baseplate interface shall be declared and characterised for Prime approval. If the load is considered as significant by the prime, it is requested to provide a load measurement for each protoflight and flight model.

4.3 Thermal Environment

For the definition of the unit’s thermal environment, 2 phases of the mission are considered:

•On-ground phase covering all on-ground AIT activities at all level of assembly including pre-launch and launch phases,

•In-orbit phase

4.3.1 On-ground phase

GDI-2987 / 1 / T,A

For AIV and storage, the unit shall withstand temperature conditions as follows:

•Short term Storage(prior or after transportation -40°C to +60°C

•Integration +10°C to +30°C

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•Unit testing Unit non operational and operational temperature requirement ranges as per Table 4.3-1.

GDI-2988 / 1 / I

During transport prior to integration on the spacecraft, the unit shall withstand temperature conditions as follows:

•Transportation -40°C to +60°C

GDI-2989 / 1 / T,A

The flight hardware transportation containers shall be designed to limit the spacecraft and payload transportation environment to less than the values contained in this section, when subjected to the following terrestrial thermal and climatic environment:

•External temperatures - 40°C to + 60°C

4.3.2 In-orbit phase

4.3.2.1 Temperature requirements

GDI-2991 / 1 / T,A

Unless required elsewhere, the unit shall be designed to withstand without degradation the qualification temperature defined in Table 4.3-1

Note: During the In Orbit phase, the spacecraft units will be kept within their design temperature limits. See Table 4.3-1.

°C Min Op Max Op Min Non-Op

Max Non-Op

Min Start up

Design Temperature limits -20 +50 -30 +60 -30 Acceptance Temperature -25 +55 -35 +65 -30 Qualification Temperature -30 +60 -40 +70 -30

Table 4.3-1: Thermal Qualification & Design Levels

4.3.2.2 Thermal radiation

GDI-4775 / 1 / A,R

When accommodated externally and submitted directly to thermal flux radiation, unit shall be designed to withstand the thermal environment encountered in its mission, as described hereafter.

4.3.2.2.1 Solar constant

GDI-4778 / 1 /

The thermal control of any external unit accommodated outside the satellite, shall take into account the Solar flux as defined in Table 4.3-2.

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DATE SOLAR IRRADIANCE (W/m²)

Winter solstice

Summer solstice

Equinox (autumnal)

1423

1321

1357

Table 4.3-2: Solar constant

4.3.2.2.2 Earth albedo

4.3.2.2.3

GDI-4799 / 1 /

The thermal control of any external unit accommodated outside the satellite, shall take into account the Earth albedo. The solar radiation reflected from the Earth is obtained with an average albedo value of 0.30 + 0.05

4.3.2.2.4 Earth emitted radiation

GDI-4800 / 1 /

The thermal control of any external unit accommodated outside the satellite, shall take into account the Earth emitted radiation. The value of infra-red Earth emission is 200W/m2 min (Earth temperature = 244 K) and 275 W/m2 max (Earth temperature = 264 K).

4.3.2.3 Vacuum

GDI-4805 / 1 /

Vacuum is between 0.1 torr inside the satellite and 10-9 torr ( Ultra High Vacuum) in free space. Unit shall be designed to operate in these environments, in particular without any arcing.

4.3.2.4 Atomic Oxygen Environment

GDI-5543 / 1 /

Any external unit shall withstand erosion and oxidation induced by the monoatomic oxygen:

Fluence in at/cm2/year is given in Table 4.3-3.

The nominal environment to be taken into account for external units is an altitude of 500Km and 7 years worst case.

The compatibility with a duration extension to ten years whatever the orbit shall be analysed and presented to Astrium.

Coating thickness (for example MLI) shall present adequate margins.

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Year F10.7 Ap 500 km 600 km 700 km 800 km2012 232 20 2,080E+21 6,205E+20 1,976E+20 6,613E+192013 208 22 1,622E+21 4,620E+20 1,406E+20 4,505E+192014 169 22 9,827E+20 2,517E+20 6,916E+19 2,010E+192015 128 23 4,966E+20 1,086E+20 2,567E+19 6,470E+182016 112 24 3,581E+20 7,238E+19 1,588E+19 3,736E+182017 93 21 2,180E+20 3,887E+19 7,589E+18 1,601E+182018 81 18 1,478E+20 2,384E+19 4,243E+18 8,213E+172019 86 17 1,697E+20 2,830E+19 5,193E+18 1,034E+182020 129 17 4,820E+20 1,041E+20 2,432E+19 6,065E+182021 181 18 1,136E+21 2,993E+20 8,456E+19 2,524E+192022 228 21 2,005E+21 5,947E+20 1,882E+20 6,264E+19

Fluence (/cm2/year)Solar activity indexes

Note: After year 2022, the same motif as 2012 - 2022 can be repeated every 11 years

Table 4.3-3: Fluence in at/cm2/year

4.4 Radiation Environment

4.4.1 Deleted

4.4.2 Deleted

4.4.3 Deleted

4.4.3.1 Deleted

4.4.3.2 Deleted

4.4.3.3 Deleted

4.4.4 Radiation Requirements applicable to ASTROSAT 250

ENVIRONMENT DEFINITION

GDI-4599 / 1 /

•ELECTRONS

Applicable fluxes of electrons are given in Figure 4.4-1

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98° inclination 45° inclination Energy (MeV) Differentia l f lux

(/MeV/cm2/s) Integral flux

(/cm2/s) Differential flux (/MeV/cm2/s)

Integral flux (/cm2/s)

0,04 3,96E+06 5,21E+05 6,07E+06 8,10E+050,1 2,66E+06 3,33E+05 4,37E+06 5,20E+05

0,25 7,54E+05 9,81E+04 1,21E+06 1,31E+050,5 8,53E+04 1,99E+04 8,93E+04 1,31E+04

0,75 2,29E+04 9,11E+03 1,45E+04 4,22E+031 1,02E+04 5,42E+03 4,65E+03 2,17E+03

1,5 3,90E+03 2,30E+03 1,50E+03 9,31E+022 1,63E+03 9,90E+02 6,57E+02 4,27E+02

2,5 8,01E+02 4,43E+02 4,07E+02 2,01E+023 3,27E+02 1,67E+02 1,43E+02 6,28E+01

3,5 1,29E+02 6,27E+01 4,41E+01 2,15E+014 4,83E+01 2,10E+01 1,63E+01 7,59E+00

4,5 1,56E+01 6,19E+00 5,51E+00 2,40E+00 5 4,57E+00 1,69E+00 0,00E+00 0,00E+00

Table 4.4-1: Trapped electron fluxes, AE8max

GDI-4600 / 1 /

1,E+00

1,E+01

1,E+02

1,E+03

1,E+04

1,E+05

1,E+06

0 1 2 3 4 5 6Energy (MeV)

Inte

gral

Flu

x (#

/cm

2 /s)>

E

Trapped electrons, 98°

trapped electrons, 45°

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Figure 4.4-1: Trapped electron fluxes, AE8max

GDI-4601 / 1 /

•PROTONS / Trapped Protons

98° inclination 45° inclination Energy (MeV) Differential flux

(/MeV/cm2/s) Integral flux

(/cm2/s) Differential flux (/MeV/cm2/s)

Integral flux (/cm2/s)

0,1 4,54E+04 6,94E+03 6,12E+03 2,74E+030,5 3,19E+03 1,32E+03 1,62E+03 1,41E+03 1 5,43E+02 6,19E+02 5,30E+02 9,30E+02 2 1,21E+02 3,57E+02 1,76E+02 6,20E+02 3 5,78E+01 2,78E+02 9,40E+01 4,97E+02 4 3,14E+01 2,33E+02 5,47E+01 4,22E+02 5 2,04E+01 2,09E+02 3,69E+01 3,79E+02 6 1,40E+01 1,91E+02 2,60E+01 3,47E+02 8 8,09E+00 1,70E+02 1,55E+01 3,06E+02 10 5,11E+00 1,57E+02 9,85E+00 2,81E+02 15 2,81E+00 1,39E+02 5,35E+00 2,46E+02 20 1,80E+00 1,27E+02 3,35E+00 2,24E+02 25 1,35E+00 1,20E+02 2,45E+00 2,11E+02 30 1,17E+00 1,14E+02 2,12E+00 1,99E+02 35 1,04E+00 1,08E+02 1,89E+00 1,90E+02 40 9,78E-01 1,03E+02 1,77E+00 1,80E+02 45 9,22E-01 9,85E+01 1,67E+00 1,72E+02 50 8,86E-01 9,40E+01 1,60E+00 1,64E+02 60 8,28E-01 8,55E+01 1,49E+00 1,48E+02 70 7,59E-01 7,74E+01 1,37E+00 1,34E+02 80 6,95E-01 7,03E+01 1,25E+00 1,21E+02 90 6,35E-01 6,35E+01 1,14E+00 1,09E+02 100 5,84E-01 5,75E+01 1,03E+00 9,82E+01 125 4,54E-01 4,45E+01 7,94E-01 7,52E+01 150 3,47E-01 3,45E+01 6,00E-01 5,79E+01 175 2,67E-01 2,69E+01 4,57E-01 4,48E+01 200 2,06E-01 2,10E+01 3,48E-01 3,47E+01 300 7,62E-02 7,98E+00 1,26E-01 1,30E+01

Table 4.4-2: Trapped proton fluxes, , AP8min

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GDI-4602 / 1 /

1,E+00

1,E+01

1,E+02

1,E+03

1,E+04

0,1 1 10 100 1000

Energy (MeV)

Inte

gral

Flu

x (#

/cm

2 /s)>

E

trapped protons, 98°trapped protons, 45°

Figure 4.4-2: Trapped proton fluxes, , AP8min

GDI-4603 / 1 /

•PROTONS / Solar Flare Protons

AS250


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Energy (MeV)

Differential fluence

(/MeV/cm2)

Integral fluence (/cm2)

Energy (MeV)Differential

fluence (/MeV/cm2)

Integral fluence (/cm2)

0,5 3,70E+11 2,33E+11 23,9 3,00E+08 6,29E+091 1,08E+11 1,33E+11 27,5 2,19E+08 5,38E+09

1,5 5,09E+10 9,55E+10 31,5 1,55E+08 4,63E+09 2 3,09E+10 7,64E+10 36,2 1,13E+08 4,01E+09

2,6 1,87E+10 6,12E+10 41,6 8,54E+07 3,48E+09 3 1,46E+10 5,48E+10 47,7 6,48E+07 3,03E+09

3,5 1,14E+10 4,90E+10 54,8 5,40E+07 2,61E+09 4 9,90E+09 4,37E+10 62,9 4,72E+07 2,20E+09

4,6 8,56E+09 3,82E+10 72,3 3,87E+07 1,80E+09 5,2 6,50E+09 3,31E+10 83 3,08E+07 1,43E+09 6 4,91E+09 2,87E+10 95,3 2,37E+07 1,10E+09

6,9 3,71E+09 2,49E+10 109,4 1,75E+07 8,11E+08 7,9 2,80E+09 2,16E+10 125,6 1,23E+07 5,71E+08 9,1 2,15E+09 1,88E+10 144,2 8,26E+06 3,82E+08 10,4 1,71E+09 1,62E+10 165,6 5,21E+06 2,41E+08 12 1,32E+09 1,39E+10 190,1 3,07E+06 1,42E+08

13,8 9,83E+08 1,18E+10 218,3 1,67E+06 7,70E+07 15,8 7,31E+08 1,01E+10 250,6 8,31E+05 3,82E+07 18,2 5,43E+08 8,63E+09 287,7 3,72E+05 1,69E+07 20,8 4,04E+08 7,37E+09 330,3 1,48E+05 6,70E+06

Table 4.4-3: Solar Proton Fluence, JPL-91 model, Astrosat 250 98° inclination orbit, 7 years

GDI-4604 / 1 /

1,E+05

1,E+06

1,E+07

1,E+08

1,E+09

1,E+10

1,E+11

1,E+12

0,1 1 10 100 1000

Energy (MeV)

Inte

gral

Flu

ence

(#/c

m2 )>

E flare protons, 98°

Figure 4.4-3: Solar Proton Fluence, JPL-91 model, Astrosat 250 98° inclination orbit, 7 years

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GDI-4605 / 1 /

•HEAVY IONS / Galactic cosmic rays ( GCR)

98° 45° 98° 45° LET

[MeV.cm2/g] Flux

(#/cm2/s) > LET

Flux (#/cm2/s) >

LET

LET [MeV.cm2/g]

Flux (#/cm2/s) >

LET

Flux (#/cm2/s) >

LET

1,00E+00 2,51E+00 7,73E-01 2,42E+04 1,58E-07 2,69E-09 1,01E+01 1,48E-01 1,52E-02 2,60E+04 9,42E-08 1,65E-09 1,01E+02 1,64E-02 5,19E-03 2,70E+04 6,59E-08 1,16E-09 2,52E+02 5,21E-03 1,58E-03 2,79E+04 3,37E-08 6,07E-10 5,03E+02 2,09E-03 6,36E-04 2,90E+04 4,17E-09 9,73E-11 7,55E+02 1,38E-03 4,77E-04 3,00E+04 2,62E-09 6,68E-11 1,00E+03 1,04E-03 3,80E-04 3,19E+04 3,42E-10 2,26E-11 2,01E+03 1,48E-04 9,96E-06 3,50E+04 1,81E-10 1,45E-11 3,01E+03 5,45E-05 1,98E-06 3,76E+04 1,38E-10 1,14E-11 4,00E+03 2,76E-05 6,86E-07 4,00E+04 1,11E-10 9,37E-12 5,02E+03 1,60E-05 3,13E-07 4,50E+04 7,07E-11 6,23E-12 6,01E+03 1,04E-05 1,76E-07 5,01E+04 4,75E-11 4,30E-12

7,99E+03 5,16E-06 7,67E-08 6,06E+04 1,94E-11 1,86E-12 1,00E+04 2,92E-06 4,13E-08 7,00E+04 9,61E-12 9,41E-13 1,20E+04 1,79E-06 2,57E-08 7,98E+04 4,52E-12 4,42E-13 1,50E+04 9,07E-07 1,37E-08 8,99E+04 9,41E-13 9,54E-14 2,00E+04 3,72E-07 5,94E-09 1,00E+05 6,25E-14 6,96E-15 2,20E+04 2,55E-07 4,21E-09

Table 4.4-4: Integral GCR flux spectrum on Astrosat 250 orbit, Aluminium shielding 1 g/cm2

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GDI-4606 / 1 /

1,E-15

1,E-13

1,E-11

1,E-09

1,E-07

1,E-05

1,E-03

1,E-01

1,E-01 1,E+00 1,E+01 1,E+02

LET (MeV.cm2/mg)

Flux

(#/c

m2 /s

)>LE

T

98° inclination45° inclination

Figure 4.4-4: Integral GCR flux spectrum on Astrosat 250 orbit, Aluminium shielding 1 g/cm2

GDI-4607 / 1 /

•HEAVY IONS / Solar Flare

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98° 45° 98° 45° LET

[MeV.cm2/mg] Flux

(#/cm2/s) > LET

Flux (#/cm2/s) >

LET

LET [MeV.cm2/g]

Flux (#/cm2/s) >

LET Flux

(#/cm2/s) > LET

1,01E-01 9,14E+01 3,02E-03 2,49E+01 3,94E-05 6,19E-06 2,50E-01 9,63E+00 2,60E-03 2,61E+01 2,82E-05 4,44E-06 5,01E-01 5,96E-01 1,93E-03 2,70E+01 1,92E-05 3,03E-06 7,51E-01 1,69E-01 1,57E-03 2,80E+01 4,91E-06 8,02E-07 1,00E+00 8,94E-02 1,33E-03 3,00E+01 3,29E-07 6,93E-08 2,01E+00 1,45E-02 8,64E-04 3,22E+01 3,70E-08 1,47E-08 2,99E+00 8,12E-03 6,29E-04 3,41E+01 2,13E-08 1,00E-08 3,99E+00 5,10E-03 4,54E-04 3,61E+01 1,48E-08 7,62E-09 5,03E+00 3,32E-03 3,26E-04 3,83E+01 1,05E-08 5,89E-09 5,99E+00 2,34E-03 2,43E-04 4,01E+01 8,04E-09 4,85E-09 8,00E+00 1,18E-03 1,42E-04 4,25E+01 6,15E-09 3,94E-09 1,01E+01 6,98E-04 8,96E-05 4,50E+01 4,93E-09 3,27E-09 1,20E+01 4,45E-04 6,12E-05 5,00E+01 3,42E-09 2,35E-09 1,40E+01 2,91E-04 4,24E-05 5,49E+01 2,29E-09 1,64E-09 1,60E+01 1,93E-04 2,95E-05 6,02E+01 1,26E-09 9,88E-10 1,80E+01 1,38E-04 2,13E-05 7,00E+01 6,32E-10 5,23E-10 2,00E+01 9,99E-05 1,55E-05 8,04E+01 3,00E-10 2,51E-10 2,19E+01 7,10E-05 1,11E-05 9,03E+01 5,11E-11 4,38E-11 2,41E+01 4,77E-05 7,49E-06 1,00E+02 1,45E-12 1,33E-12

Table 4.4-5: Integral solar flare ion flux spectrum based on October 1989 worst day flare,

Astrosat 250 orbit, Aluminium shielding 1 g/cm2

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GDI-4608 / 1 /

1,E-11

1,E-09

1,E-07

1,E-05

1,E-03

1,E-01

1,E+01

1,E+03

1,E-01 1,E+00 1,E+01 1,E+02

LET (MeV.cm2/mg)

Flux

(#/c

m2 /s

)>LE

T

98° inclination45° inclination

Figure 4.4-5:solar flare ion flux spectrum on Astrosat 250 orbits, Aluminium shielding 1 g/cm2

GDI-3054 / 1 / R

The spacecraft shall be designed to withstand the effects of the varying flux of high energy particles encountered in its mission. These effects can be separated in at least three classes:

1. Radiation / total dose

During its lifetime, the spacecraft and its components will receive an integrated dose that can degrade their performances and possibly cause failures.

2. Radiation background noise

Radiation impinging on a detector and its associated electronics will produce an increase of the background noise.

3. Single event effects

Cosmic rays and heavy ions can provoke single event effects which may disrupt the operation of sensitive electronics.

The results of the radiation effects and environment shall be applied.

The present document is to be read in conjunction with DIV.SP.00034.T.ASTR Radiation Hardness Assurance Requirements for Astrosat 250 program

GDI-3055 / 1 / R

Any internal unit shall take into account the shielding provided by the spacecraft. ( equivalent to 1 mm ).

No shielding shall be considered for external units.

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4.4.4.1 Total Dose

GDI-3057 / 1 / R

The applicable dose depth curve is defined in Table 4.4-6.

98° 45° 98° 45° Shielding thickness

[mm] TID

[rad(Si)] TID

[rad(Si)]

Shielding thickness

[mm] TID

[rad(Si)] TID

[rad(Si)]

1,00E-02 1,10E+07 1,63E+07 7,50E+00 3,82E+03 5,31E+03 1,00E-01 2,78E+06 4,26E+06 8,00E+00 3,68E+03 5,20E+03 5,00E-01 2,60E+05 2,21E+05 8,50E+00 3,56E+03 5,08E+03 1,00E+00 8,83E+04 5,01E+04 9,00E+00 3,43E+03 4,95E+03 1,20E+00 6,81E+04 3,72E+04 9,50E+00 3,34E+03 4,84E+03 1,40E+00 5,47E+04 2,97E+04 1,00E+01 3,30E+03 4,80E+03 1,60E+00 4,53E+04 2,50E+04 1,10E+01 3,13E+03 4,59E+03 1,80E+00 3,79E+04 2,14E+04 1,20E+01 3,02E+03 4,46E+03 2,00E+00 3,22E+04 1,88E+04 1,30E+01 2,87E+03 4,25E+03 2,50E+00 2,22E+04 1,44E+04 1,40E+01 2,74E+03 4,08E+03 3,00E+00 1,60E+04 1,17E+04 1,50E+01 2,74E+03 4,08E+03 3,50E+00 1,20E+04 9,88E+03 1,60E+01 2,57E+03 3,84E+03 4,00E+00 9,33E+03 8,56E+03 1,70E+01 2,53E+03 3,79E+03 4,50E+00 7,52E+03 7,60E+03 1,80E+01 2,40E+03 3,61E+03 5,00E+00 6,20E+03 6,82E+03 1,90E+01 2,34E+03 3,53E+03 5,50E+00 5,37E+03 6,35E+03 2,00E+01 2,31E+03 3,49E+03 6,00E+00 4,81E+03 6,02E+03 3,00E+01 1,74E+03 2,68E+03 6,50E+00 4,36E+03 5,71E+03 4,00E+01 1,38E+03 2,16E+03 7,00E+00 4,11E+03 5,56E+03 5,00E+01 1,15E+03 1,80E+03

Table 4.4-6: Total Ionising Radiation Dose 7 years Lifetime

GDI-3058 / 1 /

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Date: 23/06/2009 of 281


1,E+02

1,E+03

1,E+04

1,E+05

1,E+06

1,E+07

1,E+08

0,00 10,00 20,00 30,00 40,00 50,00

Alu. Solid Sphere thickness (mm)

Tota

l Ion

isin

g D

ose

[rad(

Si)]

800km, 98°800km, 45°

Figure 4.4-6: Total Ionising Radiation Dose Depth Curve 7 years Lifetime

GDI-3059 / 1 / R

Any unit shall withstand without performance degradation a total dose corresponding to its shielding, as defined in Figure 4.4-6.

The margins defined in DIV.SP.00034.T.ASTR Radiation Hardness Assurance Requirements for AS250 Program shall be added to this total dose.

4.4.4.2 Displacement Damage

GDI-3061 / 1 / R

Both protons and electrons can induce displacement damage in semiconductor devices. The part of deposited energy involved in displacement defects creation is called Non Ionising Energy Loss (NIEL).

The particles spectra are converted into a Total Non Ionising Dose (TNID) depth curve thanks to NOVICE code. This curve is calculated for aluminium solid spheres shielding of various thickness.

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The mission TNI Dose-depth curve takes into account the environment defined in previous paragraphs. It is given for GaAs (applicable for example to LED device material) and Silicon (applicable for example to CCD die material) targets in Figure 4.4-7

98° 45° Shielding thickness

[mm] TNID

[MeV/g(GaAs)TNID

[MeV/g(Si)] TNID

[MeV/g(GaAs)TNID

[MeV/g(Si)] 1,00E-02 1,56E+10 1,86E+10 1,16E+10 1,39E+10 1,06E-01 1,17E+09 1,42E+09 1,30E+09 1,61E+09 5,02E-01 2,81E+08 3,68E+08 3,13E+08 4,21E+08 1,06E+00 1,56E+08 2,15E+08 1,81E+08 2,63E+08 1,20E+00 1,41E+08 1,98E+08 1,67E+08 2,45E+08 1,54E+00 1,16E+08 1,62E+08 1,42E+08 2,15E+08 1,97E+00 9,45E+07 1,37E+08 1,21E+08 1,89E+08 2,52E+00 7,74E+07 1,17E+08 1,05E+08 1,69E+08 3,04E+00 6,76E+07 1,07E+08 9,55E+07 1,58E+08 3,24E+00 6,49E+07 1,04E+08 9,27E+07 1,54E+08 3,44E+00 6,21E+07 1,00E+08 9,03E+07 1,51E+08 4,15E+00 5,55E+07 9,17E+07 8,40E+07 1,42E+08 5,00E+00 5,08E+07 8,57E+07 7,99E+07 1,36E+08 6,01E+00 4,59E+07 7,89E+07 7,32E+07 1,28E+08 7,06E+00 4,30E+07 7,46E+07 6,96E+07 1,22E+08 8,11E+00 4,05E+07 7,10E+07 6,60E+07 1,16E+08 9,10E+00 3,84E+07 6,78E+07 6,29E+07 1,11E+08 1,02E+01 3,65E+07 6,50E+07 6,00E+07 1,07E+08 1,05E+01 3,65E+07 6,47E+07 5,98E+07 1,06E+08 1,07E+01 3,62E+07 6,44E+07 5,96E+07 1,06E+08 1,09E+01 3,59E+07 6,39E+07 5,94E+07 1,05E+08 1,20E+01 3,45E+07 6,14E+07 5,67E+07 1,01E+08 1,41E+01 3,17E+07 5,72E+07 5,25E+07 9,47E+07 1,62E+01 2,99E+07 5,39E+07 4,94E+07 8,94E+07 1,82E+01 2,82E+07 5,09E+07 4,66E+07 8,45E+07 1,99E+01 2,69E+07 4,87E+07 4,46E+07 8,10E+07 2,04E+01 2,65E+07 4,80E+07 4,39E+07 7,99E+07 2,51E+01 2,35E+07 4,29E+07 3,91E+07 7,15E+07 3,01E+01 2,08E+07 3,83E+07 3,47E+07 6,38E+07 4,06E+01 1,65E+07 3,07E+07 2,76E+07 5,10E+07 5,00E+01 1,28E+07 2,39E+07 2,13E+07 4,00E+07

Figure 4.4-7: Non Ionising Dose Table for Silicon & GaAs targets 7 years Life time

AS250


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GDI-3062 / 1 /

1,E+06

1,E+07

1,E+08

1,E+09

1,E+10

1,E+11

0 10 20 30 40 50Solid sphere Al. Thickness (mm)

TNID

[MeV

/g(m

ater

ial)]

GaAs, 98°Silicon, 98°Silicon, 45°

Figure 4.4-8: Non Ionising Dose Depthcurve Silicon & GaAs targets 7 years Life time

GDI-3063 / 1 / R

Any unit shall withstand without performance degradation a total dose corresponding to its shielding, as defined in Figure 4.4-8.

The margins defined in DIV.SP.00034.T.ASTR Radiation Hardness Assurance Requirements for AS250 Program shall be added to this proton fluence.

The above figure shall be used with the NIEL tables defined in Appendix F.

4.4.4.3 Single Event Effect

GDI-3065 / 1 / R

Particles that can contribute to Single Event Effects induce those from :

•solar particles events (solar flares ions and protons), Figure 4.4-5 and Figure 4.4-3

•galactic cosmic rays (GCR) in Figure 4.4-4

•trapped particles (primarily protons) Table 4.4-2

GDI-3069 / 1 / R

Any unit shall withstand without performance degradation the cosmic rays , and trapped protons of Figures GDI-4606 Table 4.4-2 and Figure 4.4-3

In addition, during solar flares, the unit shall withstand solar protons and heavy ions.

AS250


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Material shielding has a small consequence on GCR flux. It has been demonstrated on other projects that an increase of the shielding thickness from 4 to 50 mm of aluminium decreases the flux and the error rate only by a factor of 2.

During large solar flares, rich in heavy ions, the heavy ion flux can increase temporarily (typically one day) by three orders of magnitude.

GDI-3072 / 1 / R

Any unit shall withstand without performance degradation the heavy ions and solar particles experienced during large solar flare defined in Figure 4.4-5

GDI-4700 / 1 / A,R

The probability of occurence of Single Event Upset (SEU) or Single Event Transient (SET) when leading to unit reset or functional data corruption shall not exceed 2.10e-5 per day averaged over the mission. The estimation shall take into account a minimum of 8 solar flares days during the in orbit lifetime (7 to 10 years) for heavy ions and the figure 4.4-3 for total solar proton fluence.

GDI-4701 / 1 / A,R

The unit shall not be sensitive to destructive SEE.

Whenever not feasible an analysis shall be performed in order to validate the use of sensible device. The device acceptance criteria is:

Destructive SEE rate < device failure rate / 10

GDI-4712 / 1 / A,R

For Single Event Burnout (SEB) and Single Event Gate Rupture (SEGR), baseline of radiation assurance approach shall be constituted :

- by the application of the derating rules provided here below (numbered 1 to 2), or,

- by SEB and SEGR rate calculation. Methodology used for such a calculation shall be provided to

prime contractor for review and approval prior to use.

1- Acceptable SEGR and SEB data exist

Acceptable evaluation phase data will give drain to source threshold voltages (Vdsth) versus LET and gate to source voltage (Vgs), for static OFF conditions and case temperature. Worst case Vdsth(WC) will be defined.

The derating consists of maintaining Vds within safe operation limits over the full design lifetime as:

•Vds ≤ 0.80*Vdsth(WC), with

|Vgs| < |Vgsmax| used during testing for Vdsth(WC) estimate

and,

•Ttest < Tcase where Ttest is the case temperature used during testing, for Vdsth(WC) estimate.

2. No acceptable SEGR and SEB data exist

In the case that no acceptable SEGR and SEB data exists for the device type under analysis, testing will be required.

4.5 EMC Environment

4.5.1 Conducted Emissions

Deleted

AS250


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4.5.1.1 Inrush Current

GDI-3077 / 1 / T,A

Inrush current at unit switch on shall not exceed the following characteristics:

•dI/dt < 2 A/µs, Maximum 20A

•Q < 0.5 x Ttrip-off x IL (for LCL protected units only)

With : IL = LCL Trip-Off current in [A] and Ttrip-off = minimum specified LCL trip-off duration for IL

This requirement shall be tested at maximum and minimum bus voltage.

4.5.1.2 Voltage Transients

GDI-3079 / 1 / T,A

The transient on the primary power bus distribution during switch-ON/OFF of a unit shall stay within the limits of the voltage transient envelope (see Figure 4.5-1) This requirement is only applicable for units with internal switching devices.

10µs 100µs 1ms0

0V

+2V

+1/2 Unom

U-Ubus

-2V

-1/2 Unom

20µs

Figure 4.5-1: Voltage Transient Envelope

GDI-3081 / 1 / T,A

Conducted voltage transients on the primary power bus, appearing during nominal mode switching (excluding ON / OFF) or appearing during periodic < 1 Hz or aperiodic activities shall be ≤ 1 Vpp when measured with at least 50 MHz bandwidth.

4.5.1.3 Conducted Emissions on Power Leads, Frequency Domain

GDI-3083 / 1 / T,A

Conducted narrow band current emissions (differential mode) in the frequency range 30 Hz - 50 MHz appearing on the unit's primary power lines shall not exceed the limits of Figure 4.5-2 for units up to 30W power consumption.

For units demanding more than 30W power, this figure can be scaled proportionally to the actual power demand over the entire frequency range, with an increase in dB given by 20 log (P/30).

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The emission shall be measured up to 100 MHz (50-100 MHz for information only)

20

30

40

50

60

70

80

90

1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08

Frequency (Hz)

dBµA

(rm

s)

Figure 4.5-2: Conducted Emission Power Lines, Differential Mode

GDI-3085 / 1 / T

Conducted narrow band current emissions (common mode) in the frequency range 10 kHz - 50 MHz appearing on the unit's primary power lines shall not exceed the limits of Figure 4.5-3.

The emissions shall be measured up to 100 MHz (50-100 MHz for information only)

20

25

30

35

40

45

50

55

60

65

1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08

Frequency (Hz)

dBµA

(rm

s)

Figure 4.5-3: Conducted Emission Power Lines, Common Mode

AS250


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GDI-3087 / 1 / T,A

In case of internal redundancy, conducted emission test frequency domain , differential mode and common mode, and time domain emission tests shall be performed in both nominal and redundant configuration of the unit.

4.5.1.4 Conducted Emissions on Power Leads, Time Domain

GDI-3089 / 1 / T,A

Time domain conducted differential mode voltage ripple on the primary power bus distribution outlets, measured between positive and return lines (connected to a representative dummy load when testing at unit level), shall be ≤ 150 mVpp. The voltage ripple shall be measured with at least 50 MHz bandwidth.

GDI-3090 / 1 / T,A

For primary power users, time domain conducted emissions, differential mode (ripple and spikes) shall be ≤300 mVpp.

The voltage ripple shall be measured with at least a 50 MHz bandwidth.

Time domain current emissions shall be < 10% of the units current consumption or < 300 mApp, whatever is less.

GDI-3091 / 1 / T,A

In case of internal redundancy, time domain emission tests shall be performed in both nominal and redundant configurations of the unit

4.5.1.5 Conducted Emissions in case of failure

GDI-3093 / 1 / T,A

In the event of a single failure, the amplitude of the spectral signatures on the primary power lines shall not exceed by more than 6dB the limits required for both differential and common mode emissions.

The analysis is limited to a single failure on the main elements of the primary power interface.

The unit subcontractor will justify by analysis or by breadboard tests the compliance to the present requirement.

4.5.1.6 Conducted Emissions on Secondary Power Lines

The following requirement only applies in the case where an electrical unit supplies secondary power lines to another unit.

4.5.1.6.1 CE for secondary power supply units, Frequency Domain

GDI-3097 / 1 / T,A

The maximum voltage emission levels for secondary power supplies shall be less than:

•10 mVrms from 30 Hz up to 50 MHz in differential mode,

•10 mVrms from 5 kHz up to 50 MHz in common mode.

The secondary supplies will be loaded by the representative (R, L, C) loads specified in the unit interface specifications.

The load networks shall be isolated from ground for these measurements.

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4.5.1.6.2 CE for secondary power supply units, Time Domain

GDI-3099 / 1 / T,A,R

The voltage ripple and spikes on secondary power supplies shall be less than:

•50mVpp in a 50 MHz bandwidth, in differential mode,

•50mVpp in a 50 MHz bandwidth, in common mode.

The secondary supplies will be loaded by the representative (R, L, C) loads specified in the unit interface specifications.

The load networks shall be isolated from ground for these measurements.

4.5.1.7 Conducted Emissions on Signal Bundles, Common Mode

GDI-3101 / 1 / T,A,R

Conducted Narrow band conducted emissions (common mode) in the frequency range 10 kHz - 50 MHz as measured on the unit's signal bundles shall not exceed the limits of Figure 4.5-4.

The emissions shall be measured up to 100 MHz (50 - 100 MHz for information only)

This requirement applies also to secondary power bundles

20

30

40

50

60

70

80

1 10 100 1000 10000 100000

Frequency [kHz]

dBuA

(rm

s)

Figure 4.5-4: Conducted Emission on Signal Bundles, Common Mode

4.5.2 Conducted Susceptibility

4.5.2.1 CS Sine Wave, Differential Mode on power lines

GDI-3105 / 1 / T,A

Primary power bus powered units shall not exhibit any failures, malfunctions or unintended responses when sine wave voltages of 1 Vrms in the frequency range 30 Hz - 50 MHz (modified combination of MIL-STD-461C CS01 and CS02 requirements) are developed across the power input terminals (differential mode).

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The applied sine wave shall be amplitude modulated (50% AM) with a modulation frequency of 1 kHz in the frequency range from 50 kHz - 50 MHz.

The frequency sweep rate shall be adjusted based on the characteristics of each unit’s internal frequencies but shall not be faster than 3 min/decade or not less than 2 spot frequencies per octave.

The requirement shall also be considered met when:

1) Frequency range 30 Hz - 50 kHz:

The specified test voltage levels cannot be generated but the injected current has reached 1 A (rms), and the equipment is still operating nominally

2) Frequency range 50 kHz - 50 MHz:

A 1-watt source of 50Ω impedance cannot develop the required voltage at the unit’s power input terminals, and the unit is still operating nominally.

GDI-4589 / 1 / T,A

If any susceptibility is detected, the modulation shall be cancelled and the unit shall comply with the levels defined in GDI-3105.

4.5.2.2 CS Sine Wave, Common Mode on power lines

GDI-3107 / 1 / T,A

Primary power bus powered units shall not exhibit any failure, malfunction or unintended responses when sine wave voltages of 200 mVrms in the frequency range 10 kHz - 50 MHz are injected between the primary power return and structure (common mode).

GDI-4411 / 1 / T,A

Primary power bus powered units shall not exhibit any failure, malfunction or unintended responses when sine wave currents of 80 dBµArms in the frequency range 50 kHz - 50 MHz are injected on to the bondstrap.

GDI-4413 / 1 / T,A

The applied sine waves shall be amplitude modulated (50% AM) with a modulation frequency of 1 kHz in the frequency range from 50 kHz - 50 MHz.

The frequency sweep rate shall be adjusted based on the characteristics of the units internal frequencies, but not faster than 3min/decade or not less than 2 spot frequencies per octave.

Ihe injected current shall be limited to 1A (rms), if necessary the voltage shall be reduced.

GDI-4414 / 1 / T,A

If any susceptibility is detected, the modulation shall be cancelled and the unit shall comply with the levels defined in GDI-3107, GDI-4411.

4.5.2.3 CS Transient on power lines

GDI-3109 / 1 / T,A

The unit shall not exhibit any failures, malfunctions or unintended responses when the following transient voltages are superimposed on the primary power bus inputs, Figure 4.5-5

The transient voltages to be applied shall be the ones defined in Table 4.5-1.

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VVmax

Time

T 2T 3T 4T 5T

Transient Waveform

Figure 4.5-5: CS Transient Waveform

Injection Mode DM (slow) DM (fast) CM Max. Voltage ± 3Vp ± Vbus ± 12Vp Duration (T) 500µsec 10µsec 10µsec Repetition frequency

10 Hz 10 Hz 10 Hz

Applied time 1 - 5 min 1 - 5 min 1 - 5 min

Table 4.5-1: Specific Conducted Susceptibility Transient Levels

4.5.2.4 CS on secondary power lines

The following requirements only apply in the case where an electrical unit supplies secondary power lines to another unit

GDI-3159 / 1 / T

When secondary lines power a unit, the unit shall be tested with twice the maximum noise (or ripple) identified in the relevant power specification between these 2 units.

GDI-3160 / 1 / T

When a unit delivers secondary lines, the unit shall demonstrate under all EMC susceptibility tests that the maximum noise (or ripple) identified in the relevant power specification between these 2 units is not exceeded.

4.5.2.4.1 CS Sinewave injection for secondary power supply units

GDI-3162 / 1 / T

The conducted susceptibility specification for secondary power supplied units shall be at least:

•50 mV RMS from 30 Hz up to 50 MHz in differential mode,

•50 mV RMS from 10 kHz up to 50 MHz in common mode.

4.5.2.4.2 Requirement at subsystem or system level

GDI-3164 / 1 / T,A,R

In addition, a margin of at least +6dB shall be demonstrated in frequency domain between the supplier highest emission levels and the supplied unit susceptibility level.

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4.5.3 Radiated Emissions (E field)

GDI-3166 / 1 / T,A

The unit shall not exceed the specified limits in the range 2 MHz - 18GHz. For non RF units which do not feature high frequency clocks, the upper frequency can be limited to 1 GHz or the 10th harmonic of the highest clock frequency (whatever is greater), as long as the 5th - 10th Harmonics are at least 10 dB below the limit.

The limits are given in Figure 4.5-6, Table 4.5-2 and Table 4.5-3.

Launcher Radiated Emissions limits Table 4.5-3 only apply to units that are powered at launch.

Frequency Range Field Level for units in direct view of the RF antenna(peak values)

Field Level for units hidden from the RF antenna (see note)

Notes

2.025 - 2.110GHz 0 dBµV/m 15 dBµV/m S-Band TT&C 1.562 - 1.612 GHz 0 dBµV/m 20 dBµV/m GPS receiver TBD TBD TBD Other receiver notches

Table 4.5-2: Radiated Emissions Notch Limits

Note: External units potentially in direct view of an RF antenna should be identified as such in the unit technical specification (default case = hidden). The used case (direct view/hidden) shall be recalled by the supplier in the statement of compliance to GDIR and subject to agreement with Astrium.

Care must be taken to ensure that the resolution bandwidth and sweep time (for the frequency span, dividing the range as required) are correct so that the filter response of the receiver / spectrum analyser can fully resolve any signal that may be present to its maximum amplitude around the emission limit.

Frequency Range E-Field Level (dBµV/m) Notes 2025 - 2110 MHz 25 Soyuz launcher (Arianespace) 5925 - 7075 MHz 35 Soyuz launcher (Arianespace) 14000 - 14800 MHz 45 Soyuz launcher (Arianespace) 1566 - 1623 MHz 10 Soyuz launcher (Baikonour) 2716 - 2734 MHz 37 Soyuz launcher (Baikonour) 5745 - 5765 MHz 38 Soyuz launcher (Baikonour) 2725 +/- 30 MHz 27 Cosmos launcher 416.5 MHz TBD Falcon 1 / 1e launcher 425 MHz TBD Falcon 1 / 1e launcher 5690 MHz TBD Falcon 1 / 1e launcher 420 - 480 MHz 25 Vega launcher (radio destruct Rx) 2025 - 2110 MHz 25 Vega launcher 5450 - 5825 MHz 60 Vega launcher 5925 - 7075 MHz 35 Vega launcher 14000 - 14800 MHz 45 Vega launcher 120 - 130 MHz 70 Rockot launcher 1015 - 1050 MHz 70 Rockot launcher

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Frequency Range E-Field Level (dBµV/m) Notes 1570 - 1640 MHz 35 Rockot launcher 2700 - 2900 MHz 60 Rockot launcher 1570 - 1620 MHz 10 Dnepr launcher TBD MHz TBD PSLV launcher

Table 4.5-3: Launcher Radiated Emissions Limits

40

45

50

55

60

65

70

1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+11

Frequency (Hz)

dBµV

/m (r

ms)

Figure 4.5-6: Radiated Emissions E-Field, NB

4.5.4 Radiated Emissions (H field)

GDI-3227 / 1 / T,A

The Radiated H field generated by Units, shall not exceed the limits specified in Figure 4.5-7

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5060

708090

100

110120

0.01 0.1 1 10 100

Frequency (kHz)

dBpT

Figure 4.5-7: Radiated Emissions H-Field

4.5.5 Radiated Susceptibility (E field)

GDI-3230 / 1 / T,A

The unit shall not show any malfunction or deviation from the specified performance when irradiated with the following E-fields:

•30 MHz to 18 GHz: 2 V/m rms

The radiated E-field shall be amplitude modulated by a sine wave at 1 kHz with a modulation depth of 50 %

For non RF units which do not feature high frequency clocks, the upper frequency may be limited to 10 times its highest frequency or 1 GHz whichever is higher.

GDI-3231 / 1 / T,A

The unit shall not show any malfunction or deviation from the specified performance when irradiated with the E-fields as listed in Table 4.5-4 and Table 4.5-5.

Table 4.5-5 applies only to units powered during launch

Frequency Range E-Field Level Notes 2.0 - 2.3 GHz 20 Vrms/m S-Band Transmitter 7.8 - 8.4 GHz 30 Vrms/m X-band Transmitter

Table 4.5-4: Specific Radiated Susceptibility Levels

Frequency range S/C RS limit (dBµV/m)

Notes

2680 +/- 10 MHz 160 (TBC) Cosmos launcher

1000 - 1500 MHz 145 Vega launcher 2200 - 2290 MHz 145 Vega launcher 2900 - 3400 MHz 145 Vega launcher

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Frequency range S/C RS limit (dBµV/m)

Notes

5400 - 5900 MHz 145 Vega launcher

2213.5 +/- 0.6 MHz TBD Falcon 1/1e launcher 2221.5 +/- 0.3 MHz TBD Falcon 1/1e launcher 2251.5 +/- 4 MHz TBD Falcon 1/1e launcher

5675 TBD Falcon 1/1e launcher

140.4 - 144.4 MHz 137 Dnepr Launcher 1000.5 - 1004.5 MHz 136 Dnepr Launcher

2855 - 2865 MHz 146 Dnepr Launcher

1000 - 1700 MHz 145 Soyuz launcher (Arianespace) 2200 - 2290 MHz 145 Soyuz launcher (Arianespace) 2900 - 3400 MHz 145 Soyuz launcher (Arianespace) 5400 - 5900 MHz 145 Soyuz launcher (Arianespace)

200 - 250 MHz 150 Soyuz launcher (Baikonour) 620 - 650 MHz 140 Soyuz launcher (Baikonour)

970 - 1050 MHz 140 Soyuz launcher (Baikonour) 2700 - 3000 MHz 145 Soyuz launcher (Baikonour) 3300 - 3500 MHz 145 Soyuz launcher (Baikonour)

120 - 130 MHz 119 Rockot launcher (telemetry 1)

1015 - 1025 MHz 112 Rockot launcher (telemetry 3 and 4) 1030 - 1050 MHz 117 Rockot launcher (telemetry 2) 2800 - 2810 MHz 119 Rockot launcher (tracking)

TBD MHz TBD PSLV launcher

Table 4.5-5: Launcher Radiated Susceptibility Levels

4.5.6 Radiated Susceptibility (H field)

GDI-3313 / 1 / T,A

Units shall not show any malfunction or deviation from the specified performance when irradiated along any axis with an H-field of :

•3 mT in the frequency range DC - 10 Hz

•120 dBpT in the frequency range 50 Hz - 50 kHz.

GDI-3314 / 1 / T,A

In the case where a unit uses technologies which are known to be sensitive to AC or DC magnetic fields (e.g. USO's, motors, etc.), this sensitivity shall be reported together with an estimate of the maximum allowed magnetic field.

4.5.7 DC Magnetic Requirements

To reduce the magnetic moment of the spacecraft, it is generally recommended to use non-magnetic materials.

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GDI-3317 / 1 / I,R

The use of ferro-magnetics shall be avoided for parts, components, and equipment structure. Materials shall be used which are non-magnetic or, if magnetic characteristics cannot be avoided, have the lowest residual field. In particular soft magnetic material shall be avoided whenever possible.

Aluminium and its alloys, fibreglass, CFRP, magnesium and its alloys, titanium and its alloys are all non-magnetic. These are among the most desirable materials to be used structurally.

GDI-3319 / 1 / T,I,R

Steel or other magnetic materials shall be avoided for use in the mechanical hardware, and their use shall be minimised in any support equipment. If the use of steel in the mechanical hardware is unavoidable, it shall be stainless steel of proven non-magnetic characteristics.0

It is not intended to use high permeable shielding foil for the harness.

GDI-3321 / 1 / R

The use of relays shall be limited to the most critical functions, which cannot be handled by solid state switching.

GDI-4406 / 1 / R

The use of magnetic materials shall be subject to prior approval. For each mechanical or electrical part made partly or wholly of a magnetic material, the Unit supplier shall compile a file including the following information :

•Type of magnetic material used

•Geometric shape

•Mass and density

•Maximum magnetic permeability (µ)

•Coercitive magnetic field (Hc)

•Location

•Estimated or measured value of part's magnetic moment (amplitude, direction)

This file shall be included within the unit ICD.

GDI-3322 / 1 / T,A

When not explicitely defined in unit specification, the magnetic moment of any unit, when measured along any reference axis, shall be kept lower than 0.1 Am².

GDI-4405 / 1 / T,A

Unit level magnetic moments shall be measured (and / or assessed) using configurations that are extreme as regards consumption (power, current...).

4.5.8 ESD Susceptibility

ESD susceptibility testing is only applicable to Qualification Model, Engineering Model unit builds only. It shall not be performed on Proto Flight or Flight unit builds.

GDI-3325 / 1 / T,A

The unit shall not be susceptible when submitted to the following perturbations:

•Radiated discharges (10 kV, 10 mJ, Test Duration > 3 min, with a repetition rate of 10 arcs/min) at 30 cm

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•Conducted discharges into the ground plane or structure / unit case (10 kV, 10 mJ, Rise time (10%-90%) <10nsec, Duration (half amplitude) 100nsec, Test Duration > 3 min, with a repetition rate of 10 arcs/min).

GDI-4575 / 1 / R

The unit supplier shall define within the EMC documentation in which way compliance to ESD susceptibility requirements will be demonstrated (part selection, analysis, test...)

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5. UNIT LEVEL ENVIRONMENT TEST REQUIREMENTS

5.1 General

5.1.1 Test Definition

5.1.1.1 Qualification tests

GDI-3330 / 1 / T,A

Qualification of the design shall be accomplished using representative flight configuration hardware and software.

The objective of the qualification shall be to demonstrate the capability of all hardware items to provide all specified performances under all environment and interface conditions and to survive their full operational life.

The test specimen shall be subjected to qualification loads. The test conditions shall not exceed design margins of safety nor excite unrealistic failure modes.

Items which can be qualified by an applicable qualification history, by similarity to qualified items, or purely by analysis, may require only limited qualification testing or even none. However, all safety critical items must be fully qualified by test.

Qualification testing shall be conducted at the relevant level according to the requirements defined in this section.

5.1.1.2 Acceptance Tests

GDI-3332 / 1 / T,A,R

Environmental acceptance testing shall be performed on all deliverable flight and flight spare hardware.

The objectives of acceptance testing are:

•Demonstrate freedom from manufacturing and workmanship errors.

•Demonstrate that hardware and software performance comply with design specifications.

During environmental acceptance testing, conditions or effects, similar to the mission environment shall be simulated.

Acceptance testing shall be conducted at the relevant level according to the requirements defined in this section.

5.1.1.3 Functional Performance Tests

GDI-3334 / 1 / T,A

The objective of the test item functional performance test is to verify the performance of the item/unit during the test program.

Satisfactory and un-degraded functional performance before, during and after the specified environmental loads are required prior to approval for qualification or acceptance.

An initial and a final functional performance test shall be conducted at the beginning and at termination of each environmental test.

Intermediate functional performance tests, which may be simplified, may take place in order to show successful test results concerning the previous test step.

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The tests shall be performed in compliance with approved test procedures, which reflect the verification criteria of the unit specification. Beside electrical performance, all mechanical functions operated electrically shall be commanded and shall function.

Failure detection, isolation and recovery functions shall be tested to the maximum extent possible without destroying the test article.

Functional test shall be performed by operating all required operational modes. Unit interface functions shall be simulated. Unit performance shall be checked considering at least:

•All required modes

•Begin/end of life power

•Maximum/minimum load

•Effects of power and subsystem switching

•Redundancies

•Emergency/safety modes

•Power protection

•Variation of input parameters

•Software if applicable

5.1.2 Test Facilities Requirements

GDI-3336 / 1 / A,R

Any test facility to be used within the instrument assembly or unit test programme shall be capable to perform the required test within the specified limits and shall not impact the test objective or degrade the test article performance.

5.1.2.1 Accuracy of Test Instrumentation

GDI-3338 / 1 / A,R

The accuracy of instrument and test equipment used to control or measure the test parameters shall be in general, one order of magnitude better than the tolerance for the variable to be measured

Exceptions shall be specified in the relevant specifications and shall be agreed by the customer.

All instrumentation to be used for qualification and acceptance tests shall be subjected to approved calibration procedures and shall be within the normal calibration periods at the time of test. Instrumentation which will run out of calibration during the planned test time shall be not used.

5.1.2.2 Tolerances of Test Parameters

GDI-3340 / 1 / A,I,R

The allowed test condition tolerances shall be applied to the specified nominal test values. Unless otherwise specified, the maximum allowable tolerances on test conditions or measurements shall be as per the tables in the following subsections. The tolerance on test parameters specifies the maximum allowable range within which the specified test level (input level) or measurement (output) may vary and excludes instrument accuracy.

5.1.2.2.1 Temperature

Temperature Range Minimum Temperature Maximum Temperature -200°C to -50°C -4°C / 0°C 0°C / +4°C

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Temperature Range Minimum Temperature Maximum Temperature -50°C to +100°C -3°C / 0°C 0°C / +3°C

+100°C to +370°C -4°C / 0°C 0°C / +4°C

5.1.2.2.2 Pressure

Pressure Range Pressure Above 1.3x102 Pa (1 Torr) ±15%

1.3x10-1 to 1.3x102 Pa ±30% Less than 1.3x10-1 Pa ±80%

5.1.2.2.3 Relative Humidity

Relative Humidity ±5%

5.1.2.2.4 Acceleration

Acceleration 0 / +10%

5.1.2.2.5 Vibration Frequency

Random ±5% or 1Hz (whichever is greater) Sine ±2% from 10 to 2000Hz

5.1.2.2.6 Vibration Level

Sine Vibration: Amplitude ±10% g peak Sweep Rate ±5%

Random Vibration Acceleration: Power Spectral Density Qualification Acceptance

20 to 500Hz (25Hz or narrower) -1.0dB / +3.0dB -3.0dB / +1.5dB 500 to 2000Hz (50 Hz or narrower) -1.0dB / +3.0dB -3.0dB / +1.5dB

Random Overall g RMS ±10% ±10%

5.1.2.2.7 Acoustic Noise

Range Sound Pressure Level 1/3 octave band (centre frequency) -1.0dB / + 3.0dB

Overall ±1.5dB

5.1.2.2.8 Test Duration Time

Test Duration Time 0 / + 10%

5.1.2.2.9 Shock

Response spectrum amplitude (1/6 octave centre frequency)

±6.0dB (with 30% of the response spectrum centre frequency amplitudes greater than nominal test

specification) Shock duration:

<= 20 ms 0 / +20% > 20 ms 0 / +10%

Shock Level 0 / +20%

5.1.2.2.10 Solar simulation

Solar intensity distribution in reference plane ±4% Solar intensity distribution in reference volume ±6%

Solar intensity stability ±1% Solar intensity stability (absolute) ±3%

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Solar intensity distribution in reference plane ±4% Type Wavelength (Angstrom) Percent of Total Energy

Far Ultraviolet 1 to 2000 0.008 Near Ultraviolet 2000 to 3800 6.995

Visible 3800 to 7000 39.88±TBD% Near Infrared 7000 to 10000 22.59

Infrared 10000 to 20000 24.02 Far Infrared 20000 to 100000 6.45

5.1.2.2.11 Balancing

Static <0.25mm Dynamic <±0.1°

5.1.2.2.12 Others

Force (static) -0 / +3% Centre of Gravity See Section 3.2.1 Moment of Inertia See Section 3.2.1

Forces and Moments (dynamic) -0 / +3% Pressure ±5% of max. specified value Flow Rate ±5% Leakage ±10-4 scc/s He at 1013hPa pressure differential if not

otherwise specified Mass See Section 3.2.1.2

Dimensions (length) < 0.125mm Angular Measurements 0.5 arc min. with respect to each axis of the reference

system of the test facility if not otherwise specified

5.1.2.3 Facility Ambient Condition

GDI-3541 / 1 / A,I,R

Unless otherwise specified herein, all measurements and tests shall be made at room ambient atmospheric pressure, temperature and relative humidity conditions, whereby 22 ± 3°C and 55 % ± 10 % RH shall not be exceeded. Whenever these conditions must be closely controlled in order to obtain reproducible results a reference temperature of 21°C, a relative humidity of 50 % and an atmospheric pressure of 1013 hPa shall be used together with whatever tolerances are required to obtain the desired precision of measurement. Actual ambient test conditions shall be recorded periodically during the test period.

The cleanliness requirements for the test items during assembly, integration, transport and test shall be in accordance with the PA requirements.

5.1.3 Test Execution

GDI-3543 / 1 / A,I,R

Before commencing any formal qualification or acceptance test, a Test Readiness Review meeting shall be convened. At this meeting, the status of the test item and all documentation shall be discussed and any discrepancies shall be assessed as to their effect on the representation of the test. All discrepancies and all decisions shall be minuted and accepted by all participants before permission to commence the test is granted.

Test execution shall be started only if all starting prerequisites have been positively accepted, i.e., if all HW under test and the associated support equipment, SW and documentation is found to be complete and ready for test start.

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Prior to and after every environmental test activity a limited functional test and a through visual inspection are required on the basis of the related approved procedure.

After completion of all formal qualifications or acceptance tests a post-test review shall be convened. All test results shall be presented for review. In the case of any parameter being outside its specified range or any other evidence of failure the review shall take the form of a test failure review board.

In any case the meeting shall consider all the evidence, decide on the degree of success of the test and decide what further action if any is necessary.

5.1.4 Success Criteria

GDI-3545 / 1 / T,A

The test is successfully performed if all measurement results are in accordance with the design requirements as stated in the particular unit design and performance specification and transformed into test criteria listed in the test specification.

Modifications, repair, replacement or refurbishment of an item, which failed an initial test, shall be subject to a retest. When it can be shown that the test interruption was caused by a GSE or software problem the retest shall be started from that point of GSE or software failure after appropriate repair has taken place and positive confirmation can be given for the nominal performance of the GSE item.

Any repetition of qualification or acceptance test needs the prior decision of the MRB responsible.

If not, the corrective action substantially affects the significance of results of previously completed tests in the sequence, such tests shall also be repeated.

5.2 Unit Tests

GDI-3547 / 1 / T,A

The qualification and acceptance tests to be performed shall include the tests as listed in Table 5.2-1. This list may be tailored with the approval of EADS Astrium depending on the category and maturity of each unit.

Sequence Test Refer to GDIR section 1 Pre-test Inspection Section 5.2.4.1.5 2 Initial Functional Performance Test See Equipment Specification 3 Mechanical Tests Section 5.2.1.2 , Section 5.2.1.3 , Section

5.2.1.6 4 Depressurisation/Corona Discharge TBC Corona Discharge is TBC see individual

equipment spec if applicable 5 Thermal Vacuum Section 5.2.2.2 , Section 5.2.2.2.1 , Section

5.2.2.2.2 6 EMC/RF Section 5.2.3 7 Final Functional Performance Test See Equipment Specification 8 Mass Properties Measurement See Equipment Specification 9 Post-test Inspection Section 5.2.4.1.5

Table 5.2-1: Unit Level Test and Sequence

GDI-3590 / 1 / R

The preferred unit level test sequence is as shown in Table 5.2-1

GDI-3591 / 1 /

Variations to this proposed test sequence shall be agreed with the Prime Contractor prior to the start of any unit level test programme

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5.2.1 Mechanical Environment Tests

5.2.1.1 Vibration Test Set Up

GDI-3594 / 1 / T

The unit under test shall be mounted (to a rigid fixture, see below) as in flight configuration. The unit attachment hardware (bracket, cabling, tubing, etc.) shall be included in the tests (to a reasonable extent) to achieve dynamic similarity of the unit to actual installation.

Cabling, tubing etc. shall be attached to the unit as required for operating or monitoring functions; but fixed in such a way to the fixture or auxiliary supports that no higher loads are excited than in actual installation configuration.

GDI-3595 / 1 / T

At least one triaxial sensor shall be mounted on the unit under test to monitor the response on the units.

GDI-3596 / 1 / T

At least two axis aligned sensors shall be mounted on the test fixture adjacent to the unit to monitor the test level input.

GDI-3597 / 1 / T

All units powered on during launch shall be powered on during mechanical equipment testing in the same operational configuration. The unit electrical performance shall be monitored during the test.

5.2.1.2 Test Fixture

For the purposes of this specification a vibration test fixture is defined as a massively stiff structural component of the MGSE which transforms the standard interfaces of the vibration generator, or slip table, to the mounting interface of the test item in the launch configuration and can transmit the vibration inputs faithfully to the test item without introducing significant changes to those inputs.

GDI-3600 / 1 / T

The test item shall be attached to the vibration exciter table by means of a rigid test fixture capable of transmitting the vibration conditions specified herein. The test fixture shall be designed to minimise fixture response at resonance within the test frequency range.

GDI-3601 / 1 / T

The variation of transmissibility between test item mounting points shall not exceed a factor of + 3 dB between 5 and 500 Hz and + 6 dB between 500 and 2000 Hz, provided that the total cumulative bandwidth, which exceeds + 3 dB does not exceed 300 Hz. Cross talk shall not exceed the input.

GDI-3602 / 1 / T

Adequate fixture design and specimen installation are the responsibility of the unit subcontractor as part of the verification activities. The fixture shall be described in the test procedure.

GDI-3603 / 1 / T

A pre-test of the empty fixture shall be performed to verify the correct dynamic behaviour of the fixture and the proper function of the control loop.

5.2.1.3 Frequency Search

GDI-3605 / 1 / T

Frequency search tests shall be conducted In order to:

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•Identify the unit frequency content and correlate results with FEM predictions,

•Estimate the Q_factors associated to the main modes,

•Establish a basis for frequency content comparison between test runs and allow eventual interface settling anomaly evaluation,

In particular, the knowledge of the results of the main unit frequencies and associated Q_factors measured during the first frequency search test along each axis is of prime importance to lead properly higher level tests.

GDI-3607 / 1 / T

Frequency search tests shall be conducted along each of the three mutually perpendicular axes one at a time at least prior to and after performing the tests.

The frequency search tests are defined in Table 5.2-2.

In order to allow better Q_factor estimation, the frequency search test level shall be adjusted in order to avoid notching on the main eigen modes.

Frequency Search Spectrum Frequency

(Hz) Amplitude

(g) Speed

(Oct/min) Direction

5 to 2000 0.2 2 One Sweep up

Table 5.2-2: Frequency Search Spectrum Definition

5.2.1.4 Vibration Tests Level

GDI-3626 / 1 / R

The vibration test levels to be applied at the unit interface, both for acceptance and qualification shall be as:

•In Table 4.2-3 and Table 4.2-4 for sinusoidal vibration

•In Table 4.2-5 for random vibration

•In Table 4.2-7 for shock

GDI-5423 / 1 / T

Sine and random vibration tests shall be performed with the levels and durations defined in Table 5.2-3

Sine vibration test Random vibration test Type of test Levels Sweep rate Levels Duration Qualification Q 2 oct/mn Q 120 s Proto-qualification Q 4 oct/mn Q 60 s Acceptance Q/1.25 4 oct/mn Q (g²/Hz)/1.56 60 s

Q: Qualification levels

Table 5.2-3: Test Levels and Durations

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5.2.1.5 Sine and Random Vibration Test

GDI-3628 / 1 / T

Sine and random vibration tests shall be performed separately on the three axes.

GDI-3629 / 1 / T

Prior and after sine and random vibration qualification and acceptance tests a low level sine frequency search test shall be performed according to requirements GDI-3605 and GDI-3607. Care shall be taken in adjusting the level before test such that resonant modes do not lead to unit overstress or Q-factors erroneous estimation.

GDI-3630 / 1 / T

Before applying full levels, a test at intermediate level shall be applied. For qualification testing, the intermediate levels shall be set as the acceptance (flight limit) levels. For acceptance testing, the intermediate levels shall be the acceptance levels divided by 2 for sine vibrations and the power spectral densities divided by 4 for random vibrations.

GDI-3631 / 1 / T

A notching of sine and random vibrations may be applied to decrease the impact of resonant modes, keeping load below the specified quasistatic qualification load as per Section 4.2.2.1 . The notching shall be justified by the Subcontractor, discussed on a case-by-case basis and submitted to the customer for approval.

GDI-3632 / 1 / T

The vibration facility shall include a shock free abort device mounted onto the shaker to prevent the unit from hazardous over testing potentially induced by facility failure.

5.2.1.6 Shock Tests

GDI-3634 / 1 / T

Units shall demonstrate by test their ability to withstand the shock acceleration levels as defined in Section 4.2.2.2.3 of this document.

GDI-3635 / 1 / T

Prior and after shock tests a low level sine frequency search test shall be perform according to requirements GDI-3605 and GDI-3607. Care shall be taken in adjusting the level before test such that resonant modes do not lead to unit overstress or Q-factors erroneous estimation.

5.2.1.7 Static tests

GDI-3637 / 1 / T

Static tests shall be performed by applying the specified sinusoidal level defined in the low frequency range, whose amplitude generates acceptance/qualification quasi-static loads.

5.2.2 Units Thermal Environment Tests

Unit temperature levels for acceptance and qualification tests are defined in Table 4.3-1. These temperatures refer to the temperature reference point.

5.2.2.1 Thermal Test Setup

GDI-3641 / 1 / R

The temperatures shall be selected and controlled such that the test specimen experiences actual temperatures equal to or beyond the minimum and maximum qualification/acceptance temperatures.

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This shall be guaranteed by temperature monitoring at the temperature reference point and additional points as agreed with the customer.

GDI-3642 / 1 / R

The test arrangement shall be as shown in Figure 5.2-1 (conductively controlled).

GDI-3643 / 1 / R

The unit shall be bolted to a thermally controlled heat sink using the flight design.

GDI-3644 / 1 / R

On all external surfaces flight representative thermal hardware shall be applied.

GDI-3645 / 1 / R

Deleted.

GDI-3646 / 1 / R

The conductive heat sink temperature and the chamber shroud temperature shall be controlled in order to reach as a minimum the qualification/acceptance temperatures at the unit temperature reference point(s).

GDI-3647 / 1 / R

For vacuum tests the pressure inside the chamber shall be less or equal than 0.0013 Pa (1E-5 torr)

MLI

Figure 5.2-1: Unit Thermal Test Arrangement - conductively Controlled

5.2.2.2 Thermal Test Sequences

5.2.2.2.1 Qualification Thermal Vacuum

GDI-3651 / 1 / T

The unit subcontractor shall perform Thermal Vacuum (TV) qualification tests at unit level to demonstrate the performance of the unit in an extreme thermal vacuum environment by simulating minimum and maximum qualification temperatures. (See Table 5.2-5 for test parameters)

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The thermal qualification test shall be used for the unit thermal model verification and correlation purpose.

GDI-3653 / 1 / R

The qualification temperatures for the different units are defined in Table 4.3-1. All temperatures refer to the temperature reference point. All temperatures are qualification temperatures.

GDI-3654 / 1 / T,R

The unit shall be tested following the thermal vacuum test sequence, as defined in Table 5.2-4 and Figure 5.2-2.

TV Qualification Test Sequence 1 Performance test under ambient conditions 2 Unit switch-off 3 Decrease of pressure to 0.013 Pa 4 Decrease of pressure to 0.0013 Pa and increase of temperature to maximum operating

level (TO-MAX) 5 Unit switch-on (a few degrees before temperature stabilisation to avoid temp. overswing) 6 Temperature stabilisation 7 Performance test 8 Unit switch-off 9 Increase of temperature to maximum non-operating level (TNO-MAX) 10 Temperature stabilisation 11 Not applicable 12 Not applicable 13 Decrease of temperature to maximum operating level (TO-MAX) 14 14 bis

Temperature stabilisation Unit switch ON

15 Performance test 16 ±0.5% Bus power variation test/power consumption test 17 Unit switch-off 18 Decrease of temperature to minimum non-operating level (TNO_MIN) 19 Temperature stabilisation 20 Increase of temperature to minimum switch-on level (TSO-MIN) 21 Unit switch-on 22 Increase of temperature to minimum operating level (TO-MIN) 23 Temperature stabilisation 24 Performance test 25 Increase of temperature to maximum operating level (TO_MAX) 26 Temperature stabilisation 27 Performance test 28 Decrease of temperature to minimum operating level (TO_MIN) 29 Temperature stabilisation 30 Performance tests 31 Repeat steps 25, 26, 28, 29 six times 32 Performance test 33 Unit switch-off 34 Increase of pressure and temperature to ambient conditions 35 Unit switch-on 36 Performance test under ambient condition 37 Unit switch-off

Table 5.2-4: TV Qualification Test Sequence

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PARAMETER ABREVIATION VALUE

Number of Cycles n 8

Dwell Time tE (hours) 2

Temperature Rate of change dT/dt (°C/min) <20

Table 5.2-5: Thermal Vacuum Qualification Test Parameters

TEMPERATURE te

TNO max te te

TO max

T Ambient

TO minTSO min te te te

TNO min 1 cycle te

n cycle

P Ambient

PRESSURE (Pa)0.013

0.0013

Figure 5.2-2: Thermal Vacuum Test Sequence

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T Temperature

TNO-MAX Maximum Non-Operating Temperature

TNO-MIN Minimum Non-Operating Temperature

TAMBIENT Ambient temperature

TO-MAX Maximum Operating Temperature

TO-MIN Minimum Operating Temperature

TSO-MAX Maximum Switch-On Temperature = TNO MAX

TSO-MIN Minimum Switch-On Temperature

P Pressure

MODE 1 Functionally Inert (test item not energised) normally

applicable to the non-operating condition

MODE 2 Fully functioning (test item energised and fully stimulated).

Normally applicable to conditions during orbit.

Performance test

Switch-On

Switch-Off

Table 5.2-6: Nomenclature to Figure 5.2-2 above

5.2.2.2.2 Acceptance Thermal Vacuum

GDI-3775 / 1 / T

The unit subcontractor shall perform thermal vacuum (TV) acceptance tests on unit level in order to detect material and workmanship defects prior to unit delivery.

GDI-3776 / 1 / T,R

The thermal vacuum acceptance test shall be performed in the same way as specified above for the thermal vacuum qualification test, with the following modifications:

•Acceptance temperatures shall be applied instead of qualification temperatures. The acceptance temperatures for the different units are defined in Table 4.3-1.

•The number of thermal cycles applicable to the TV acceptance test is n = 4

Step 31 in the test sequence is modified to: "Repeat steps 24 , 26, 28, 29 two times"

On a case-by-case basis, and after approval of the customer, thermal vacuum can be replaced by thermal tests at ambient pressure. This will however be forbidden if calibrations of flight parameters are necessary during thermal tests. In any case, this replacement shall require demonstration of consistency between thermal vacuum measurements and thermal at ambient pressure ones. Specific acceptance criteria for the performance measurements shall be computed.

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5.2.2.2.3 Protoflight Thermal Vacuum

In case qualification is performed on FM the following requirements apply.

GDI-3780 / 1 / T

Unit suppliers shall perform thermal vacuum (TV) protoflight tests on unit level in order to qualify the unit.

GDI-3781 / 1 / T,R

The thermal vacuum protoflight test shall be performed in the same way as specified above for the thermal vacuum qualification test, with the following modifications:

•The number of thermal cycles applicable to the TV protoflight test is n = 4

Step 31 in the test sequence is modified to: "Repeat steps 24, 26, 28, 29 two times"

On a case-by-case basis, and after approval of the customer, thermal vacuum can be replaced by thermal tests at ambient pressure. This will however be forbidden if calibrations of flight parameters are necessary during thermal tests. In any case, this replacement shall require demonstration of consistency between thermal vacuum measurements and thermal at ambient pressure ones. Specific acceptance criteria for the performance measurements shall be computed.

5.2.3 Radiation Test

GDI-3784 / 1 / R

With regard to unit radiation testing the manufacturer shall comply with the PA requirement document, requirements 72g and 72j.

5.2.4 Electromagnetic Compatibility Tests

5.2.4.1 General EMC Test Requirements

5.2.4.1.1 EMC Development Test

GDI-3788 / 1 / T,R

Development tests may be performed to evaluate the design approach, indicate critical areas where design improvement is required, assure compliance with the design requirements, confirm and support analytical methods or generate essential design data at an early stage.

5.2.4.1.2 EMC Qualification Test

GDI-3790 / 1 / T,R

Qualification tests for PFM shall be performed as specified in the applicable equipment SOW.

5.2.4.1.3 EMC Acceptance Test

GDI-3792 / 1 / T,R

Acceptance tests for FM shall be performed as specified in the applicable equipment SOW.

5.2.4.1.4 EMC Integration Test

GDI-3794 / 1 / T,R

In order to ensure the proper grounding of the secondary power to the unit structure (refer to Section 3.5.8.2.5.2 ) a bonding test shall be performed during unit assembly.

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5.2.4.1.5 Retest Criteria

GDI-3796 / 1 / R

A retest may be required in case a test result is not as expected resulting in an NCR. The retest of the test article shall be defined by the Non-conformance Review Board (NRB) in accordance with the Non-conformance Control Procedure as defined in the PA requirements.

5.2.4.1.6 Pre and Post Test Inspection

GDI-3798 / 1 / R

The pre- and post-test inspection is specified in the Product Assurance Requirements

5.2.4.1.7 Test Sequence

GDI-3800 / 1 / R

The EMC test sequence shall be defined in the EMC/ESD test plan.

The following test sequence is recommended, but not mandatory. It can be changed to fulfil schedule or cost requirements if it does not affect the overall validity of the EMC test program.

Recommended EMC test sequence:

•Bonding and grounding

•Isolation

•Conducted emission

•Conducted susceptibility

•Radiated emission

•Radiated susceptibility

•Radiated ESD

•Conducted ESD

5.2.4.2 Test Facility

5.2.4.2.1 EMC Test Environment

GDI-3803 / 1 / R

All EMC tests shall be conducted at standard ambient conditions as specified in GDI-3541.

5.2.4.2.2 Capabilities

GDI-3805 / 1 / R

The test facilities used for the EMC test program shall be capable to perform the required tests within the specified limits and shall not impact the test objectives or degrade the performance of the test specimen.

For the radiated EMC tests the terrestrial electromagnetic noise shall be at least 6dB lower than those needed for the specified levels to be measured.

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5.2.4.3 Test Instrumentation

5.2.4.3.1 General Tolerances and Test Parameters

GDI-3808 / 1 / R

The maximum allowable tolerance for the test parameters shall be as follows unless otherwise specified within this specification or the applicable equipment specification.

•Voltage magnitude: ± 5 % of peak value

•Current magnitude: ± 5 % of peak value

•RF amplitude: ± 2 dB

•Frequency: ± 0.05 %

•Distances: ± 5 % or ± 5 cm, whichever is greater

•Test time: 0 - 10 %

The tolerance specifies the allowable range within which the specified test parameter / level may vary and is exclusive of measurement equipment accuracy.

5.2.4.3.2 Accuracy of the Test Measurement Equipment

GDI-3810 / 1 / R

The accuracy of measurement equipment and test equipment used to control or measure the EMC test parameters shall be

•± 2 dB for levels

•± 0.05 % for frequencies.

All instrumentation to be used for qualification and acceptance tests shall be subjected to approve calibration procedures and shall be within the normal calibration periods at the time of test.

5.2.4.3.3 Special Requirements on the Test Equipment

GDI-3812 / 1 / R

Grounding of Test Equipment:

Measurement equipment shall use an isolation transformer on the AC power lines and a separate ground cable to the central ground point. The ground cable shall consist of braided cable.

GDI-4583 / 1 / R

The following items shall be forwarded to prime contractor prior to EMC test completion and annexed to the test procedure :

•Earthing of EGSE, test intrumentation and test facilities

•Grounding diagram of EGSE

GDI-4576 / 1 / R

Protections shall be implemented at secondary side of the isolation transformer in order to detect any fault current due to lack of isolation on EMC instrumentation.

GDI-3813 / 1 / R

Antenna Placement:

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For radiated emission measurements no part of the measuring antenna shall be less than 1 m from any obstructions.

For radiated susceptibility tests no parts of the field generating and field-measuring antenna (for calibration purposes) shall be less than 1 m from any obstructions.

GDI-3814 / 1 / R

Receiver Bandwidth:

The following receiver bandwidth shall be used if not otherwise specified (Table 5.2-7):

Any deviation from the proposed frequency range respective bandwidth shall be recorded in the test report.

Frequency Range Bandwidth NB

20 Hz - 1 kHz 10 Hz 1 kHz - 10 kHz 100 Hz 10 kHz - 3 MHz 1 kHz 3 MHz - 30 MHz 10 kHz 30 MHz - 1 GHz 100 kHz 1 GHz - 40 GHz 300 kHz

Table 5.2-7: Receiver Bandwidth Specifications

GDI-3841 / 1 / R

Test voltage definition :

The unregulated primary power for unit level tests shall be adjusted to :

•28V for CE, RE(E), RS(E), RS(H) tests

•Vmin for CS sine wave injection, RE(H) tests

•both Vmin and Vmax for CS transient tests

5.2.4.3.4 Line Impedance Stabilisation Network (LISN):

GDI-3843 / 1 / R

For the conducted emission and susceptibility tests on unit level a LISN, simulating the primary power bus impedance, shall be used as shown in the relevant test set-up.

Figure 5.2-4 shows the circuit diagram of the LISN.

The pre-charge resistor has to be selected in accordance with the corresponding protection devices of the Unit Tester.

The corresponding bus impedance is shown in Figure 5.2-3.

GDI-3846 / 1 / T

The LISN has to be designed and provided by the company responsible for the test. Prior to test the network impedance shall be measured in the relevant frequency range and attached to the test report.

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0 . 1 0

1 . 0 0

1 0 . 0 0

1 0 0 . 0 0

1 0 E + 0 1 0 0 E + 0 1 E + 3 1 0 E + 3 1 0 0 E + 3 1 E + 6 1 0 E + 6 1 0 0 E + 6

F r e q u e n c y ( H z )

LIS

N I

mp

ed

an

ce

(

Figure 5.2-3: LISN Impedance for Unregulated and Regulated Primary Power Bus

Precharge resistor value is TBC by contractor

Figure 5.2-4: LISN Circuit Diagram

5.2.4.3.5 Test Conditions

GDI-3850 / 1 / R

These particular tests shall demonstrate the compliance with the EMC performance requirements of Section 4.4.4.3 of this document.

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GDI-3851 / 1 / R

The equipment under test shall be switched on in the normal switch-on sequence and shall operate in suitable operational modes w.r.t. the particular EMC test purpose.

GDI-3852 / 1 / R

For conducted and radiated emission testing the unit shall operate within a mode, which allows the maximum amount of generated interferences (voltage, current, field).

GDI-3853 / 1 / R

For conducted and radiated susceptibility testing the suitable operational mode shall be that mode which maximises the response of the equipment under test to the particular environment being created.

GDI-3854 / 1 / R

After testing the equipment shall be switched off using the normal switch-off sequence.

GDI-3855 / 1 / R

Both operational modes shall provide operational conditions, which result in an adequate test data profile of the generated interference and susceptibility of unwanted signal outputs or degradation of equipment performance that could exist during unit functional operation.

GDI-3856 / 1 / R

The particular test set-up shall represent the flight configuration as close as possible.Power, signal and other circuits grounding shall be in compliance with the grounding requirements as described in Section 3.5.8.2 of this document.

The prime contractor will define to the subcontractor the flight harness configuration interfacing with the unit under test.

GDI-4577 / 1 / I,R

The harness used for all EMC tests shall be identical to the flight harness (cable type, topology, AWG, shielding terminations).

GDI-4579 / 1 / R

Any non conformity with regards to these harness items shall be raised prior to test completion in test procedure and discussed with the prime contractor.

GDI-4580 / 1 / T,R

The lengths of the various cables from the UUT to the EGSE shall be measured and indicated in the final test report.

GDI-4581 / 1 / R

The electrical interfaces used in the EGSE for all EMC tests shall be identical to the real flight conditions in terms of load and grounding.

GDI-4582 / 1 / R

A description of the design and grounding of the electrical interfaces connected to the UUT shall be forwarded to prime contractor and aneexed to test procedure.

5.2.4.3.6 Susceptibility Testing

General Aspects:

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Each item (unit to satellite) which is subjected to EMC/RFC tests, shall provide for susceptibility tests, provisions to monitor the item under test (voltage, current...) for malfunctions/degradation of performance or occurrence of possible resonances.

In particular all EGSE (including unit tester), shall provide quick look capabilities. The "quick look" capabilities shall allow during testing, possibility of verifying whether the item under test shows any malfunction.

A detailed data evaluation may be performed off-line.

The applicable pass/fail criteria for susceptibility tests shall be identified in the test procedure.

Data Acquisition:

The item under test shall be monitored for any indication of malfunction or degradation of performance.

In the event any out of tolerance conditions are encountered during susceptibility testing, the following information is to be recorded:

•test signal level and frequency

•parameters exceeded

•out of tolerance levels

•allowable limits

•interference threshold ( the level of test signal at which the exceeded parameter returns to "within allowable tolerance").

5.2.4.4 Specific EMC Test Requirement

5.2.4.4.1 Electrical Bonding

GDI-3862 / 1 / R

This test shall demonstrate the compliance of the DC resistance of bonding interfaces with the requirements specified in Section 3.5.8.1

GDI-3863 / 1 / R

The bonding test shall be performed with the unit under test (UUT or EUT) switched off. The measurements shall be done with the four-wire method and with both directions of polarity.

GDI-3864 / 1 / R

The bonding test shall be performed without any harness connection.

5.2.4.4.2 Isolation

GDI-3866 / 1 / R

This test shall demonstrate the compliance of isolation of primary and secondary power lines from ground with the the requirements of Section 3.5.8.2

GDI-3867 / 1 / R

The isolation test shall be performed with the UUT switched off, but all interfaces connected (i.e. EGSE, unit interconnection for subsystem level). The measurement shall be done with both directions of polarity.

Figure 5.2-5 shows the principle test set-up for isolation measurements.

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Ground Plane

Signal Lines

Resistance orCapacitance

Meter

EGSE

28 V DC Primary Power

Signal I/ F's

pos ret LISN

Break out Box

EUT

Signal I/ F's

Figure 5.2-5: Test Set-up for the Isolation Measurement

5.2.4.4.3 Conducted Emissions on Power Lines

5.2.4.4.3.1 CE on Primary Power Lines

GDI-3871 / 1 / R

This test shall demonstrate the compliance of the differential and common mode conducted emissions on primary power lines with the requirements defined Section 4.5

GDI-3872 / 1 / R

UUT operation shall be selected in order to maximise the level of conducted interference appearing on the power lines, while remaining within the normally expected operating range.

The test set-ups are shown in Figure 5.2-6 (frequency domain) and Figure 5.2-7 (time domain).

GDI-3874 / 1 / R

Ripple and transient interference tests on the power lines shall be performed using standard current probe measurement techniques for each DC power lead.

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Ground Plane

EUT

Signal I/F's

IsolationTransformer

EGSE

Signal I/F's

Primary Power28 V DC

pos

ret

Break out Box

ReceiverEMI

LISN

Signal Lines

DM, pos

DM, ret

CM

Figure 5.2-6: Test Set-up for Conducted Emission on Primary Power Lines, Frequency Domain

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Ground Plane

CurrentAmplifier

EUT

Signal I/F's

Transformer

EGSE

Oscilloscope

Signal I/F's


Isolation

pos

ret

CM

Break out Box

DM, pos

DM, ret

Ocilloscope

CM

Signal Lines

LISN

DM

Figure 5.2-7: Test Set-up for Conducted Emission on Primary Power Lines, Time Domain

5.2.4.4.3.2 CE on Secondary Power Lines

GDI-3878 / 1 / R

This test shall measure the conducted emissions (ripple)

•On the secondary power input of a unit.

•On the secondary power output of a unit providing power to another unit.

and demonstrate the compliance with the requirements defined in Section 4.5.1.5

GDI-3879 / 1 / R

UUT operation shall be selected in order to maximise the level of conducted interference appearing on the power lines, while remaining within the normally expected operating range.

GDI-3880 / 1 / R

When the secondary power provider and user need to be tested individually, the secondary power output shall be terminated with a load, representing the load impedance of the nominal secondary power user.

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Alternatively the test can be performed when the secondary power provider and user are connected together and operating.

The test set-ups are shown in Figure 5.2-8 (unit secondary power input) and Figure 5.2-9 (unit secondary power output).

Figure 5.2-8: Test Set-up for CE on Secondary Power Lines, Time Domain, and Secondary Power Input

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Figure 5.2-9: Test Set-up for CE on Secondary Power Lines, Time Domain, and Secondary Power Output

5.2.4.4.4 Conducted Emissions on Signal Bundles

The purpose of this test is to measure the common mode conductive emissions on signal bundles and to verify the compliance with the requirement defined in Section 4.5.1.6.2

GDI-3885 / 1 / R

UUT operation shall be selected in order to maximise the level of conducted interference appearing on the signal bundles, while remaining within the normally expected operating range.

Figure 5.2-10 shows the principle test set-up for CE measurements on signal bundles.

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Ground Plane

Receiver

EUT

Signal I/F's

EGSE

Signal I/F's

Primary Power


28 V DC

EMI

pos

ret

Break out Box

Signal Lines Bundle

CM

LISN

Figure 5.2-10: Test Set-up for Conducted Emission on Signal Bundles

5.2.4.4.5 Conducted Susceptibility on Power Lines

GDI-3888 / 1 / R

This test shall demonstrate the noise immunity of primary power lines to the specified interference levels of Section 4.5.6

GDI-3889 / 1 / R

The mode selection for susceptibility testing shall be such as to maximise the response of the UUT to the particular environment being created.

GDI-4585 / 1 / A,R

The unit subcontractor will assess and justify, prior to conducted susceptibility sinewave tests :

•the maximum RMS current value allowable by the unit on the primary lines

•the maximum current level expected during sinewave injections required in GDI-3107 (common mode) and GDI-4411 (bondstrap)

•the corresponding injected voltage value and frequency

These values will be submitted to prime contractor agreement in the frame of EMC test procedure review.

GDI-4587 / 1 / A,R

The unit subcontractor will assess and justify, prior to conducted susceptibility transient tests :

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•the maximum peak current value allowable by the unit on the primary lines


The test set-ups are shown in

Figure 5.2-11 (CS01; Continuous Wave 30Hz...50 kHz),

Figure 5.2-12 (CS02; Modulated, 50 kHz...50 MHz)

Figure 5.2-13 (CS Modulated, common mode)

Figure 5.2-14 (CS06; Transients).

Ground Plane

Current ProbeAmplifier or

Current Meter

Oscilloscope

EUT

Signal I/F's

EGSE

Signal I/F's

Primary Power

Generator

28 V DC

Amplifier

pos

ret


Oscilloscope

Signal Lines

LISN

DM

2 ohms

Figure 5.2-11: Test Set-up for Conducted Susceptibility on Power Lines; CS01; CW 30Hz...50 kHz

Deleted

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Ground Plane

Current Probe Amplifier or

Current Meter

Oscilloscope

EUT

Signal I/ F's

EGSE

Signal I/ F's

Primary Power

Generator

28 V DC

Amplifier

pos ret


Oscilloscope

Signal Lines

LISN

DM

Figure 5.2-12: Test Set-up for Conducted Susceptibility on Primary Power Lines, Bulk Current Injection

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EGSE

LISN

EUT

Ground Plane

SignalI/F's

28V DCPrim. Pwr

pos

RTN

Signal Lines

Breakout Box

SCOPEIsol.Transf.

13.12.2004Ky/AOE51cs_cm_10k_50M

AmplifierSignalGenerator

<5cm

Figure 5.2-13: Test Set-up for Conducted Susceptibility on Primary Power Lines, Common Mode

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Ground Plane

Current ProbeAmplifier or

Current Meter

Oscilloscope

EUT

Signal I/F's

EGSE

Signal I/F's


Spike Generator

pos

ret


Oscilloscope

Signal Lines

LISN

DM

2 ohms

Calibration Set-upIsolation

Transformer

5 ohmGeneratorSpike Oscilloscope

Figure 5.2-14: Test Set-up for Conducted Susceptibility on Power Lines; CS06; Transient

5.2.4.4.6 Conducted Susceptibility on Secondary Power Lines

GDI-3897 / 1 / R

This test shall demonstrate the noise immunity of secondary power lines to the specified interference levels of Section 4.5.2.3

GDI-3898 / 1 / R

The mode selection for susceptibility testing shall be such as to maximise the response of the UUT to the particular environment being created.

GDI-4588 / 1 / A,R

The unit subcontractor will assess and justify, prior to conducted susceptibility tests on secondary power lines :

•the maximum RMS current value allowable by the unit on the secondary lines

•the maximum current level expected during sinewave injections required in GDI-3162

•the corresponding injected voltage value and frequency

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The test set-ups are shown in Figure 5.2-15 (CS01; Continuous Wave 30Hz...50 kHz), Figure 5.2-16 (CS02; Continuous Wave 50 kHz... 50 MHz).An alternative/preferred test method is the use of bulk current injection.

Figure 5.2-15: Test Set-up for Conducted Susceptibility on Sec. Power lines, CS01, 30 Hz - 50 kHz

Figure 5.2-16: Test Set-up for Conducted Susceptibility on Sec. Power Lines, CS02, 50 kHz - 50 MHz

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5.2.4.4.7 Radiated Emission, Electric Field

This test is to be used to measure the E-field radiated emission of the test specimen to demonstrate the compliance with the requirements of Section 4.5.2.4.2

GDI-3904 / 1 / R

UUT operation shall be selected in order to maximise the level of radiated interference appearing on the power lines, while remaining within the normally expected operating range.

The test set-up is shown in Figure 5.2-17.

Antenna axis shall be placed 20 cm above ground plane (not at the same height) and pointed to UUT. The antenna elements shall be at a minimum distance of 30 cm of any

chamber walls including floor.

Figure 5.2-17: Test Set-up for Radiated Emission, Electric Field

5.2.4.4.8 Radiated Emission, Magnetic Field

This test is to be used to measure the H-field radiated emission of the test specimen to demonstrate the compliance with the requirements of Section 4.5.3

GDI-3908 / 1 / R

UUT operation shall be selected in order to maximise the level of radiated interference appearing on the power lines, while remaining within the normally expected operating range. The test set-up is shown in Figure 5.2-18.

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Figure 5.2-18: Test Set-up for Radiated Emission, Magnetic Field

5.2.4.4.9 Radiated Susceptibility, Electric Field

GDI-3911 / 1 / R

This test shall demonstrate the immunity of the test specimen to incident electric fields, when irradiated with field strength specified in Section 4.5.4

GDI-3912 / 1 / R

UUT operation shall be selected in order to maximise the response of the test specimen to the particular environment being created. The test set-up is shown in Figure 5.2-19.

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Notes: Field Strength Meter or Calibration Antenna used

Antenna axis shall be placed 20 cm above ground plane (not at the same height) and pointed to UUT. The antenna elements shall be at a minimum distance of 30 cm of any chamber walls including floor.

Figure 5.2-19: Test Set-up for Radiated Susceptibility, Electric Field

5.2.4.4.10 Radiated Susceptibility, Magnetic Field

GDI-3915 / 1 / R

This test shall demonstrate the immunity of the test specimen to incident magnetic fields, when irradiated with field strength specified in Section 4.5.5

GDI-3916 / 1 / R

UUT operation shall be selected in order to maximise the response of the test specimen to the particular environment being created. The test set-up is shown in Figure 5.2-20.

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> 1 m

1 m

EUT

Magnetic FieldGeneration Coil

Coil distance to unit surface 5cm

to be placed on all 5 sides of the unit

*

EGSE

Control Instrument

Signal Generator

and

Signal

Power

Test Bench

*

Figure 5.2-20: Test Set-up for Radiated Susceptibility, Magnetic Field

5.2.4.4.11 Electrostatic Discharge (ESD)

GDI-3919 / 1 / R

The ESD test, radiated discharges, shall demonstrate the compliance of the test specimen with the requirements of Section 4.5.5

GDI-3920 / 1 / R

UUT operation shall be selected in order to maximise the response of the test specimen to the particular environment being created. Figure 5.2-21 shows principle test set-up for radiated ESD test and Figure 5.2-22 for conducted ESD test.

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Figure 5.2-21: Test Set-up for Radiated ESD test

Figure 5.2-22: Test Set-up for Conducted ESD

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5.2.4.4.12 Magnetic Moment

GDI-3924 / 1 / T,R

This test shall be used in order to show the compliance of the test specimen with the referring magnetic requirement as given in the equipment specification.

If accepted by the customer, verification by similarity is possible. It is recommended to measure the test specimen in a magnetic coil facility or to use other adequate test methods in order to show compliance with the requirement. The selected test method has to be accepted by the customer.

GDI-3926 / 1 / A,R

Verification by similarity may be applied to equipment or subsystems coming from other programs, where re-use as it is or re-use with only little modification is proposed. An analysis of the test results of the previous programme shall be carried out against the unit requirement.

For information the following evaluations are given:

A mean magnetic field will be derived for each measurement axes according to the equation

B B B B B B B B Bx

x xy

y yz

z z=

−=

−=

−+ − + − + −( ) ( ) , ( ) ( ) , ( ) ( )2 2 2

The total magnetic field (magnitude of magnetic field vector) can be calculated according to the equation

B B B Bx y z= + +2 2 2

For comparison with the specified limit the result shall be referred to 1 m using the equation

3)()1( rratBmatB ⋅=

, where r = measurement distance in meters.

The magnetic moment vector shall be derived from the following equations:

M r BM r BM r B

M M M M

x x

y y

z z

x y z

= ⋅ ⋅

= ⋅ ⋅

= ⋅ ⋅

= + +

555

3

3

3

2 2 2

5.2.5 Life Test

GDI-3938 / 1 / T,R

A life test shall be performed on all units subject to life time constraints (radiations, power source, mechanism, cycling, ...). This includes on-ground and on board constraints.

GDI-3939 / 1 /

All powered equipment shall be operated for a minimum of 300h cumulated on-time prior to delivery

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GDI-3940 / 1 /

All powered equipment shall have been operated for a minimum of 72h continuous on-time prior to delivery

GDI-3941 / 1 /

The lifetime qualification shall be demonstrated using the factored sum of the predicted nominal ground test cycles and the in-orbit operation cycles. For the test demonstration, the number of predicted cycles shall be multiplied by the following factors:

Type Number of predicted cycles Factor Ground testing Number of on-ground test cycles

(minimum 10) 4

In-Orbit 1 to 10 cycles 10 11 to 1000 cycles 4 1001 to 100000 cycles 2 > 100000 cycles 1.25

Table 5.2-8: Life Test Factors

5.2.6 Space Conditioning

GDI-3969 / 1 / T,R

Space conditioning shall be performed whenever design choices for a unit or an assembly induce behaviour differences between in flight environment and on-ground environment.

GDI-3970 / 1 / R

The contractors shall propose the corresponding tests program, submitted to customer approval.

GDI-3971 / 1 / T

For example, but without limitation to, materials moisture release, off gazing & strain releases shall be conducted whenever necessary

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6. APPENDIX A : MICD

6.1 Mechanical Interface Datasheet

GDI-3974 / 1 /

The mechanical and optical configuration and its interface requirements and dimensions, shall be fully detailed in one (or more) Interface Control Drawing(s) that will be fully referenced by the unit supplier.

The unit Interface Control Document shall precise at least the items described in Table 6.1-1, Table 6.1-2, Table A-3, Table A-4 and Table A-5.

These drawings shall detail all co-ordinate systems used and their relationship to each other, together with the principal unit interfaces.

MICD reference, issue, revision, date and configuration stamp Reference frame axes Overall envelope (outline dimensions and relative tolerances) Mobile Parts (if any) in the different configurations Outline dimensions and relative tolerances Type of mobile part, dimensions, location and attachment

Clearance envelope Viewing aperture (location, orientation, FOV dimension and tolerance) Alignment reference (location, orientation, FOV dimension and tolerances)

Mass properties Mass Centre of mass (nominal location and in different configurations (stowed, deployed… in case of mobile parts) Inertia (for unit of mass > 10 kg)

Table 6.1-1: Unit Mechanical Interface Control Document content (1/4)

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UNIT MASS - CoG - INERTIA PROPERTIES DATA SHEET

Ref UNIT or ASSEMBLY Uncert %

Current MASS per UNIT(Kg)

UNIT size (1) Height , Width, Length

(m)

UNIT moments of INERTIA through unit CoG (2)

(Kg m²)

UNIT moments of INERTIA through unit CoG (2)

(Kg m²)

UNIT CoG position wrt unit Mechanical Frame (3)

(m)Remarks

X Y Z IXX IYY IZZ IXY IXZ IYZ XCG YCG ZCG

123

Overall

(1) : Unit overall size in an axis system parallel to unit mechanical frame Ounit_mf, relative dimensions from unit mechanical frame to be provided

(2) : Unit Inertias in the mechanical frame but with the origin translated to the unit CoGMoments and products of inert ia are defined as follows:

IXX = ∫M (Y²+Z²) dm IYY = ∫M (X²+Z²) dm IZZ = ∫M (X²+Y²) dm

IXY = ∫M X Y dm IXZ = ∫M X Z dm IYZ = ∫M Y Z dm

(3) : CoG co-ordinates are given wrt Instrument Mechancical Frame RF (Ou, Xu, Yu, Zu)

I

YZ

MOUNTING FACE (X x Y)

I

CoG

YY XX

ZZ

O

Y

Z

X

unit_mf

unit_mfunit_mf

unit_mf

X

I

Table 6.1-2: Unit Mass - CoG - Inertia Data Sheet

Attachment bolt type Tightening torque Number of attachment holes Reference hole location Attachment hole location (w.r.t reference) Attachment hole location tolerances Holes dimensions and tolerances Screw head or washer surface dimension and tolerance Attachment point thickness Attachment point dimension Clearance for mounting hardware Contact surface area Contact surface flatness Contact surface roughness Edge radius Minimum distance between attachment holes Distance between attachment holes and unit side wall Angle of attachment hole to attachment surface Free width between webs

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Attachment bolt type

Attachment holediameter

Attachment pointhickness

Screw head or washer surfaceconcentric with bolt centre

Washer

Distance betweenattachment holesand unit side wall

Edge radius



Electrical connectors Identification label Location Pin 1 location

Minimum distance between adjacent connectors Number of unit connector face Grounding device Bonding stud or hole location Tightening torque

Harness (where applicable, i.e. for piggy tail harness) Output Location Length Diameter (when greater than 15mm)


Bonding strap (location, dimensions, tolerances...) Thermal blanket attachment points (location, dimensions, tolerances...) if any Harness tyrap attachment points (location, dimensions, tolerances...) if any Fluid gas connection (type, definition, location, dimensions, tolerances...) if any Venting provisions (type, number, location, dimensions...) if any MGSE Interface (I/F area characteristics, location, dimension, tolerances...) if any

In addition to the drawing file the MICD shall contain the mechanical data sheets as per table A-6 to table A-12.

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Requirement> 140 Hz

NOTCHING

SAFETY MARGIN (w .r.t Design Loads = 1.5*flight)ComputedRequirementItem (1)

Yield stress of metallic partsUltimate stress (except composite) (3)First ply failure of composite parts (3)

Elastic buckling

Mechanical Analysis Report:

STIFFNESSMeasuredComputedItem

1st Frequency (2)

Thermal capacity, dissipation, op/funct temperatures

I.C.D.'s MATRIX OF COMPLIANCE

MECHANICAL DESIGN REQUIREMENT

shielding thicknessConnectors type, orientation, positions

Grounding point(s), positions + necessity of strapsPositions of the mirror cubes (if any)

"Dimensioned" views, including footprintFott thickness + washers if any

IRD in dot linesViewing aperture and field of viewUnit Size (Length, W idth, Height)

Mounting surface + material + flatness + surface finishSurface treatment

Bolts / washers types and torque

On Drawings Compliance / NCCompliance / NC

Comments (if any)

Tolerence of DataAlignment Requirements + Tolerences

Environmental StabilityTolerences between faces of each mirror

Mass change per UnitCentre of Gravity Location

Momentum of InertiaData Source (computed/measured)

On Text and TablesICD Reference Number / Issue

Identification of the UnitCurrent Mass per Unit

Unit Name ICD Reference Unit Number Location in S/C

Table 6.1-6: Unit Mechanical Data Sheet (1/7)

ESTLTD class: (4)Test As Requested As Tested

Items Requirement As Design As Tested Assembly mounting RepresentativeRedundancy Loads applied W orst Case

Actuation Factor (5) Test conditions At ambientNo of Cycles (6) (6) Test conditions At Tmin life -20oCLubrication (7) (7) Test conditions At Tmax life +20oC

End stops Test conditions W orst TgradientLatching / locking

Release devices (8)Pre_loaded ball bearings

Flushing Tested as design (see the note, and also GDIR ???)

DESIGN RULESQUALIFICATION (before LIFE TEST)

EQUIPMENT SUBJECT TO LIFE TIME DEGRADATION

ACCEPTANCE

LIFE TEST (6)As qualification test, without life test

kg +/- kg +/- kg +/-mm +/- mm +/- mm +/-mm +/- mm +/- mm +/-mm +/- mm +/- mm +/-

kg.m2 +/- kg.m2 +/- kg.m2 +/-kg.m2 +/- kg.m2 +/- kg.m2 +/-kg.m2 +/- kg.m2 +/- kg.m2 +/-

LENGTH mm + Remarks:W IDTH mm +HEIGHT mm +

MEASURED

Number of Bolts:

Inertia IyyInertia Izz

Centre of Gravity a long ZeqInertia Ixx

INTERFACE INFORMATION

MassCentre of Gravity a long XeqCentre of Gravity a long Yeq

REQUESTED COMPUTED


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Requirement

NOTCHING

SAFETY MARGINComputedRequirementItem (1)

Yield stress of metallic partsUltimate stress (except composite)First ply failure of composite parts

Elastic buckling

Mechanica l Analysis Report:

STIFFNESSMeasuredComputedItem

1st Frequency

Thermal capacity, dissipation, op/funct temperatures

I.C.D.'s MATRIX OF COMPLIANCE

MECHANICAL DESIGN REQUIREMENT

shielding thicknessConnectors type, orientation, positions

Grounding point(s), positions + necessity of strapsPositions of the mirror cubes (if any)

"Dimensioned" views, including footprintFott thickness + washers if any

IRD in dot linesViewing aperture and field of viewUnit Size (Length, W idth, Height)

Mounting surface + material + flatness + surface finishSurface treatment

Bolts / washers types and torque

On Drawings Compliance / NCCompliance / NC

Comments (if any)

Tolerence of DataAlignment Requirements + Tolerences

Environmental StabilityTolerences between faces of each mirror

Mass change per UnitCentre of Gravity Location

Momentum of InertiaData Source (computed/measured)

On Text and TablesICD Reference Number / Issue

Identification of the UnitCurrent Mass per Unit

Unit Name ICD Reference Unit Number Location in S/C


Freq range Spectral Density Freq range Spectral Density Freq range Spectral Density Freq range Spectral DensitydB/Oct

Overall Level gRMS Overall Level Overall Level gRMS Overall LevelDuration Q 120s Duration Q Duration Q 120s Duration Q

Duration PQ 60s Duration PQ Duration PQ 60s Duration PQUnit ON/OFF Unit ON/OFFUnit tested Unit tested

Freq range Spectral Density Freq range Spectral Density Freq range Spectral Density Freq range Spectral DensitydB/Oct

Overall Level gRMS Overall Level Overall Level gRMS Overall LevelDuration Q 120s Duration Q Duration Q 120s Duration Q

Duration PQ 60s Duration PQ Duration PQ 60s Duration PQUnit ON/OFF Unit ON/OFFUnit tested Unit tested

Commentary:

QUALIFICATION / PROTOQUALIFICATION

As requested As testedPerpendicular to I/F plane At I/F plane (Equipment lateral axis)

As requested As tested

ACCEPTANCEPerpendicular to I/F plane At I/F plane (Equipment lateral axis)

As requested As tested As requested As tested

Test report STATUSRandom

Requirement Spec


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Freq range Acceleration Freq range Acceleration Axis Acceleration Axis AccelerationX-Axis X-AxisY-Axis Y-AxisZ-Axis Z-Axis

Sweep Rates Q 2 octaves/min Sweep Rates Q Duration Q 60s Duration QSweep Rates PQ 4 octaves/min Sweep Rates PQ Duration PQ 60s Duration PQ

Unit ON/OFF Unit ON/OFFUnit tested Unit tested

SINUS CONSTANT ACCELERATION

Seperatly a long 3 axis Seperatly a long 3 axisAs tested

QUALIFICATION / PROTOQUALIFICATION QUALIFICATION / PROTOQUALIFICATION

ACCEPTANCE: not applicable (Qualif./ Protoqualification only) ACCEPTANCE: not applicable (Qualif./ Protoqualification only)

As requested As tested As requested

Constant Acceleration

StatusTest Report

Commentary:

Requirement SpecificationSinus


Freq SRS acceleration Freq SRS accelerationArea D Unit ON/OFF

Unit tested

Freq SRS acceleration Freq SRS acceleration

Area S Unit ON/OFFArea C Unit ON/OFF Unit tested

Unit tested

Deployable antenna re lease

Perpendicular to mounting plate Perpendicular to mounting plate

Solar array re leaseAll three axis

As requested As Tested

Paralle l to mounting plate Para lle l to mounting plate

Commentary:Constant Acceleration

Sinus

ACCEPTANCE: not applicable (Qualif./ Protoqualification only)

As requested As Tested

Test Report Status

SHOCK

Requirement Specification

QUALIFICATION / PROTOQUALIFICATION

All three ax isS/C clampband release

As requested As TestedAll three ax is


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Location(1)(2)(3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17)(18)(19)(20)(21)(22)(23)

TextNOTES


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7. APPENDIX B : TICD

7.1 Thermal Interface Control Document

GDI-4108 / 1 /

All unit thermal interfaces shall be described within a unit thermal interface control document, clearly indicating information of table B-1.

The unit supplier shall provide a summary of unit thermal characteristics as per Table B-2.

The equipment supplier shall prepare and supply Thermal Interface Control Drawings, which shall define the complete thermal interfaces. These drawings and their issue shall be included in the ICD. The interface requirements given below may be defined either in the ICD or in this Thermal Interface Control Drawing. It shall, at least, contain the following data:

•overall layout,

•dimensions - overall size including thickness and their attachment,

•nominal base contact area,

•Temperature Reference Point (TRP),

•internal temperature measurement points (if applicable),

•thermal capacity and tolerance,

•power dissipation and tolerance for each operating mode, including significant transient cases,

•operating and non-operating temperature ranges including minimum start-up temperatures,

•radiator areas,

•external surface optical properties,

•apertures (position and size),

•blankets (if applicable),

•blanket performance (if applicable),

•optical properties of box in/outside and protruding parts, apertures, lenses... (BOL, EOL if applicable), and compliance to ESD requirements,

•non operational heater location,

•grounding of MLI (if applicable),

•temperature increment or correction relating locally measured temperatures to average case or baseplate temperature.

Table 7.1-1: TICD content

Thermal control type (Conduction / Radiation / Mixed) Temperature reference point (TRP) location Temperature distribution for non-isothermal unit (one TRP per node) Internal temperature measurement points (if any) Thermal capacity and tolerance Power dissipation and tolerance, for each operating modes, including significant transient cases and failure cases when necessary

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Thermal control type (Conduction / Radiation / Mixed) Operating and non-operating temperature ranges, including minimum start-up temperature

Temperature increment or correction relating local measured temperatures to average case or baseplate.

Finish (material and treatment) including percentage of unit total area for each finish type

Absorbance (for external unit), BOL & EOL Hemispherical emittance, BOL & EOL MLI Absorbance (for external unit), BOL & EOL Hemispherical emittance, BOL & EOL Paint free areas (tyrap, heaters...) Special thermal provisions Alternate finishes (local emittance tape, insulation blanket...) Alternate finishes properties Thermal interface filler or gaskets Low conductance stand off mounts Thermistors Heaters

UNIT: DATE:

SUBSYSTEM : ISSUE:

Ope rating: TFO M in: M in (W) M ax (W)TFO M ax:

Acceptance : TFA M in:TFA M ax:

Qualification: TFQ M in: In Orbit Sun:TFQ M ax: Eclips e :

Non Functioning TNF M in:TNF M ax:

Star t up Tem pe rature (oC) M in:

Ground Storage Tem pe rature (oC) M in:M ax:

Safe M ode :

Dis s ipation pe r w ork ing unit

Launch:

Functioning Te m perature (oC) M is s ion Phase No of Work ing Units

Non Functioning Tem pe rature (oC)

Unit w all s izing L(m m )*W(m m )*H(m m ):

Durat ion shall be g iven if ap p licab leW hen app licab le, heat d issipat ion p ro f ile shall b e p ro vid ed o n a separate sheet .Unit d issip at io n values o f t he d if f erent mod es to be p rovided in add it ion o f M in & M ax f ig ures.

C o mment s:

Unit radiative are a (cm 2):Unit em ittance :

Unit s olar abs orbivity:

Unit ind ividual ho t f ailure d issip at io n shall b e co mputed f o r maximum f igure

Unit the rm al capacitance (J/oC):

Unit contavt are a (cm 2):Unit base plate s izing L(m m )*W(m m ):

Rem arks : (to prec ise dissipations in all the existing modes and measured values)

M iss io n P hase d e scr ip t i o n:Launch: From lif t -o f f t o seperat ion f rom launcher.

Unit Individual Cold/Hot Failure :

Table 7.1-2: Unit Thermal Data Sheet

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8. APPENDIX C : EICD

8.1 Electrical Interface Datasheets (Format)

The EICD contains 9 type of datasheets:

•The Electrical datasheet n°1: " Unit Connector List " which is used for Harness definition (unit-side connectors), see Table 8.1-1. The ‘Unit Connector List’ shall be provided in the form of the filled MS-Excel spreadsheet (an empty sheet will be given to supplier in electronic form). One copy shall be attached to the Unit EICD in paper form the second copy shall be provided as MS-Excel spreadsheet in electronic form.

•The Electrical datasheet n°2: " Pin Allocation Data Sheet " which is used for Harness definition, see Table 8.1-2. The ‘Electrical Interconnection Sheet’ shall be provided in the form of the attached and filled MS-Excel spreadsheets (an empty sheet will be given to supplier in electronic form, a paper copy is in the annex). One copy shall be attached to the Unit EICD in paper form the second copy shall be provided as MS-Excel spreadsheet in electronic form. The syntax of the Signal Designation (see table below) will be consolidated at system level. Thereafter the unit EICD shall be updated to implement the changed syntax.

•The Electrical datasheet n°3: " Electrical Interface Data Sheet List ", see table GD64702. The ‘Electrical Interface Data Sheet List’ shall be provided in the form of the filled MS-Excel spreadsheet (an empty sheet will be given to supplier in electronic form). One copy shall be attached to the Unit EICD in paper form the second copy shall be provided as MS-Excel spreadsheet in electronic form. The "Electrical Interface Data Sheets " themselves shall be provided in MS-Visio format (an empty sheet will be given to supplier in electronic form). One copy of each Electrical Interface Drawing shall be attached to the Unit EICD in paper form the second copy shall be provided as MS-Visio shape in electronic form.

•The Electrical datasheet n°4: " Internal protections "which provides a description of the electrical characteristics of all the internal active and passive protections of the unit w.r.t to primary power or w.r.t secondary power lines, see Table 8.1-5

•The Electrical datasheet n°5: " Inrush profile " which provides the inrush profile (voltage / current) of the unit primary or secondary supplied, see Table 8.1-6.

•The Electrical datasheet n°6: " Power consumption " which provides the power consumption performances of the unit, see Table 8.1-7. It indicates for each unit mode and each input power line (primary or secondary) :

•Mean, min and max power(BOL)

•Short and long peak power, duration and duty cycle

•Worst case EOL power

•Power in failure case

•The Electrical datasheet n°7: " Grounding Diagram ", see Table 8.1-8.

•The Electrical datasheet n°8: " Power distribution Switching Diagram " which provides a description of all primary and secondary switched power lines, see Table 8.1-9.

•The Electrical datasheet n°9: " Frequency Plan " see Table 8.1-10.

•The Electrical datasheet n°10: " Static impedance curve " which provides for each power line the I = f (Vin) characteristic curve for Vin ranging from 0V to maximum primary bus voltage and from maximum primary bus voltage to 0V, see Table 8.1-11.

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Iss/ Rev

Unit-Name Unit- Con

Connector Function Connector Type EMC-Code

Specific Requirements

With :

4 = low level analogue ; 5= RF signals)

Connector Type : Type designation of unit connector acc. ESA SCC MIL Std or basic type (eg. "DEMA-9P")EMC-Code : Identif ier representing EMC class: 1=Pow er ; 2=Digital signals + high level analogue ; 3=Pyro ;

Iss/Rev : Issue of unit-EICD w hen record w as updated (new /Change/deleted)

Unit-Name : Short name of the unit(s), max 22 characters. (Example CDMU)Unit-Con : Unit connectors shall be named as Jxx (max 4 characters); xx: example J01, J02, … ., J99)Connector Function : Description (max. 26 characters) of function or signals at connector. (eg. Pow er Bus A)

Table 8.1-1: Electrical Data Sheet n°1: Unit Connector List

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SUB-SYSTEM : PROGRAM : REF :MO DEL : ISSUE : DATE :

CO NNECTO R NO :CO NNECTOR TYPE : EQUIPMENT :

CO NNECTO R REFERENCE : EQ UIPMENT INFO RMATIO N :S P EC .C UR R EN T S P EC IF .R ES IS TOR S P EC IF .VOLTA GE R A N GE S P EC IF .C A P A C ITA N C E

SOURCE LOAD TOTA L TYP E M OD IF

P IN S IGN A L F UN C TION N A M ESOURCE MAX(A)

LOAD MAX(A)

SOURCE (OHM)

LOAD (OHM)

FREQ. (HZ)

MIN (V)

MAX (V)

MIN (V)

MAX (V)

SOURCE (p F)

LOAD (pF)

INTERF (p F) I/F

Table 8.1-2: Electrical Data Sheet n°2 : Pin Allocation Data Sheet

Type Function

With :

Type : Interface drawings type shall be named Ixx for Input signals and Oxx for output signals (eg : I12, O23)

Function : Synthetic description of interface drawing function (eg : thermistor acquisition, differential digital input…)

Table 8.1-3: Electrical Data Sheet n°3 : Electrical Interface Data Sheet List

TBD

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Table 8.1-4: Electrical Data Sheet 1a/5: Electrical Interface Drawing

TBD

Table 8.1-5: Electrical Data Sheet n°4: Internal protections

TBD (Use LPF format)

Table 8.1-6: Electrical Data Sheet n°5: Inrush profile

TBD

Table 8.1-7: Electrical Data Sheet n°6: Power consumption

TBD

Table 8.1-8: Electrical Data Sheet n°7: Grounding Diagram

TBD

Table 8.1-9: Electrical Data Sheet n°8: Power Distribution Switching Diagram

Signal name Signal type Nominal frequency Rise time Fall time Input / Output Remarks

Table 8.1-10: Electrical Data Sheet n°9: Frequency Plan

TBD

Table 8.1-11: Electrical Data Sheet n°10: Static Impedance Curve

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9. APPENDIX D : DOUBLE INSULATION TECHNOLOGICAL GUIDELINE

9.1 PRINCIPLE

This appendix is a technological guide to be used by the electrical equipment contractors. It aims at explaining, from a technological point of view, the design rules related to the double insulation requirement.

In a centralised power distribution architecture the protection device is located in the PCDU, so that no single failure downstreams of a protection may lead to a permanent primary power bus degradation, in either ground or flight conditions.

The double insulation requirement is applicable to any section located upstreams of the protection device (LCL, FCL, ...), including the protection device itself.

In addition to the harness itself (including dismountability sections), the double insulation requirement is thus applicable to the following electrical units :

- PCDU

- batteries

- Solar array

Each contractor shall comply to the requirement GDI-2217

«Any item located upstream of the protection devices and which is set at an electrical potential shall be insulated from the potential reference (either electrical or mechanical) by a double insulation.

This will be performed by using two different insulating materials. A space greater than 1 mm can be considered as an insulating material.»

However, in some cases where there exists a justified impossibility to comply with the requirement, it will be admitted that such cases be studied in order to state whether they can be accepted or not. A Request For Waiver (RFW) shall be raised in order to trace all non-compliances to the double insulation requirement.

Concerning the particular case of EEE and non-EEE power components concerned by the requirement, compliance to the requirement implies that the internal insulation technology between elements set at a given voltage and the component external case be well known. A risk analysis will allow to conclude whether it is needed or not electrically to insulate the component from the mechanical ground in the case of a single insulation not dealt with through the following rules. EEE components which do not feature double internal protection and the external case of which shall be mandatorily connected to a mechanical or electrical ground (EMI filters, including filter connectors etc.) will be subject to Request For Waivers.

9.2 DESIGN RULES

The use of this guide is based on the following :

•precise identification of the insulation (material, thickness, etc.) between two elements set at different voltages,

•possible variations of the insulation thickness,

•risks of insulation failures linked to an external cause (e.g. pollution).

An insulation will be said to be invariable if the physical distance between two elements set at given potentials will not be subject to any significant variation whatever the constraints applied on any part of the equipment or on the whole equipment.

On the opposite, an insulation will be said to be variable whenever the physical distance between two elements set at given potentials can be subject to modifications as a function of constraints applied to any

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part of the equipment or on the whole equipment during environmental testing activities, AIT activities, flight operation (e.g. wear-out) or in the case where fragile materials are used.

Depending on the technological configuration of the insulation, the rules in Table 9.2-1 will have to be respected.

The rules to be observed can be summarised in Table 9.2-2, as a function of the technology or of the element to be insulated.

The environmental vibration tests shall verify there is no short-circuit of the power supply, which shall be applied in any case, at least up to the first protection device.

Those technological solutions do not prevent from the need for a visual inspection and an electrical test if needed.

Pollution Risk Yes No Invariable Insulation

E Use of one insulating material

(Case A*) Respect of Emini=0.4mm

(Case B*) Variable

Insulation e>= 1mm Use of one non-deformable insulating material

(Case C*) 0mm <= e <= 1mm Use of two insulating materials, one among which being non-

deformable (Case D)

* Cases B and possibly A (air spacing less than 1 mm) are not compliant to the double insulation requirement. In this case, a Request For Waiver shall be raised.

E is the distance between two conducting materials set at a voltage (Case A) or is the minimal insulating material thickness (Case B). An air spacing (vacuum) cannot be considered as a invariable insulation.

e is the distance after deformation or wear-out between two conducting materials set at a voltage.

Non-deformable insulating materials : resistant, non-porous (epoxy, beryllium oxyde, etc.). On the opposite, flexible, porous, fragile or very low thickness elements (air, kapton, choterm, glue, etc.) are deformable insulating materials.

Table 9.2-1: Double Insulation Rules

Element Technology Insulation Rule Remark Figure PCB •Stiffener •Housing Case •Internal Tracks

A C or D B (N?A)

E= 0.8mm + surface coating Opposite insulating material(s) Qualified technology Remark: caution with implementation

Figure 9.2-1

PCB •External Tracks

A

E := qualified functuional rules + surface coating (caution with wetability, welding protection, leads etc.) Remark: caution with implementation

Figure 9.2-1

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Element Technology Insulation Rule Remark Figure Wrapping Bus Bar / Shunt •Mounting •Environment

A B A, C or D

Difficulty for insulating material implementation. Technology not advised in this field of application Minimal non-deformable insulating material thickness with respect to structure (bush, washer etc) A: use of coating C: opposit insulating materials or Kynar sheath

Figure 9.2-2 Figure 9.2-2 Figure 9.2-3

Power Component •Mounting •Environment

B A,C or D

Ditto Bus Bar mounting A: use of coating C: opposite insulating materials or sheath

Figure 9.2-2 Figure 9.2-2 Figure 9.2-3 Figure 9.2-4

Connector A Use of a sheath Figure 9.2-5 Crimping External Harness

A B or D

Use of a sheath Figure 9.2-5 Figure 9.2-6

Wiring B or D Figure 9.2-6 Shield Bonding •Conductor Core •Environment

D A,C or D

Use of a sheath

Figure 9.2-7

Rigid Flex A, C or D Ditto PCB

Table 9.2-2: Double Insulation Rules to be used depending on Element Technology

Figure 9.2-1: Printed Circuit Board and Mechanical Case

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Figure 9.2-2: Power Components Mounting

Figure 9.2-3: Power Components

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Figure 9.2-4: Leads/Structure

Figure 9.2-5: Crimping

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Figure 9.2-6: External Harness / Wiring

Figure 9.2-7: Wire with Shield Bonding

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10. APPENDIX E : FPGA / ASIC DESIGN & VALIDATION REQUIREMENTS

This appendix defines the design and validation requirements applicable to units embedding FPGA or ASIC devices.

10.1 Timing DomainS

[Rule 4.1.1] All non-clock signals, processes and other functions (such as registers and combinatorial logic) within an ASIC or FPGA (whether internal or visible on its external pins) shall be separated into a number of distinct timing domains.

[Rule 4.1.2] All (internal or external) signals that are synchronised to the same common timing reference (or clock) shall form a single timing domain.

[Rule 4.1.3] Asynchronous inputs (defined as those not synchronised to a timing reference) shall occupy a separate timing domain.

[Rule 4.1.4] Outputs shall be considered to form part to the timing domain in which they are generated.

[Rule 4.1.5] The number of timing domains shall be reduced as far as reasonably possible (e.g. by the adoption of a synchronous design style). Therefore, it is envisaged that for most FPGA applications there will be a single internal timing domain and (optionally) a single asynchronous input timing domain. Where IEEE1149.1 Boundary Scan is used to support board-level testing, there will be an additional timing domain for the entire device.

[Rule 4.1.6] The connection of any input signal to multiple internal timing domains (with the exception of an IEEE1149.1 Boundary Scan timing domain) is strongly discouraged and shall be submitted to prime contractor approval. In such cases, the inputs shall occupy multiple input timing domains.

[Rule 4.1.7] It is permissible for timing domains to straddle the board-device boundary provided they are well controlled (e.g. this might apply to the selection between redundant clocks directly by a control input).

10.2 Clocks

[Rule 4.2.1] Within each timing domain, the ASIC or FPGA shall be designed with a single master clock for the entire domain, which shall be implemented using one clock plane/buffer/tree with controlled skew.

[Rule 4.2.2] An external oscillator should be used rather than internal logic to generate the master clock; any deviation to this requirement shall be submitted to prime contractor approval.

[Rule 4.2.3] Within each timing domain, a synchronous design style shall be used, while using one or both master clock transitions (rising/falling edges).

10.3 Inputs

[Rule 4.3.1] Within each timing domain, all synchronous input signals shall be synchronized by the domain’s master clock in order to control the spread of setup and hold times.

[Rule 4.3.2] Within each timing domain, the synchronization of any input signal shall always be performed using a single storage element (e.g. a D-type flip-flop). (The connection of an input signal to more than one storage element is forbidden).

10.4 Asynchronous Inputs

[Rule 4.4.1] Signals crossing between timing domains (including asynchronous input signals being captured at the input to a synchronous timing domain) shall be protected against metastability. Preference to double-rank synchronisation shall be given, but single-rank synchronisation may be suitable for slow-speed/rare-occurrence applications.

[Rule 4.4.2] An MTBF of >= 100 years due to the misinterpretation of all signals that cross any timing domain(s) within a single device shall be provided. Where a supplier expects to provide many identical

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devices for use within the same equipment or (sub)system, an MTBF of >= 100 years due to the misinterpretation of all signals that cross any timing domain(s) within (larger of) the equipment or the (sub)system shall be provided.

[Rule 4.4.3] Buses crossing between timing domains shall be synchronised either by an accompanying control signal or by synchronously detecting a change in the value on the bus. In either case, sufficient delay shall be provided for the effects of metastability to flush through the synchronising logic before a reliable value is captured. (Simply sampling an apparently asynchronous bus with an unrelated clock will potentially give the old value of the bus, the new value or any combination of the two).

[Rule 4.4.4] State information crossing between timing domains shall be treated in the same way as buses. Independent re-synchronisation will suffice in the case where only one of the signals representing the state variables can change before they have all been re-synchronised).

10.5 Outputs

[Rule 4.5.1] In order to avoid glitches, all output signals shall be synchronized by the master clock within the associated timing domain.

[Rule 4.5.2] During the ASIC/FPGA power-on ramp, transients can occur on the outputs: outputs for which electrical transients could, might or would (either individually or in combination) lead to unacceptable functional effects (e.g. spurious command generation, digital data bus disruption, shutdown, protection triggering, pyrotechnic activation, etc.). The ASIC/FPGA design shall implement adequate inhibition/protection features to preclude any transient on such outputs.

[Rule 4.5.3] If output glitches are unavoidable and could lead to functional effects, they must be filtered externally to the FPGA/ASIC.

[Rule 4.5.4] Where possible, the direction (i.e. drive state) of all bi-directional pins should be a combinatorial function of some of the device’s input pins. Where the drive state depends on internal flip-flop(s), these shall be affected by reset and cause the bidirectional pin to assume a safe direction (an input is suggested).

[Rule 4.5.5] Where possible, the output enable control signal(s) for all tri-state or bi-directional outputs shall be presented as separate output signals so as to permit board-level debugging. The timing characteristics of such output signal(s) shall be sufficient to adequately control any necessary external bus transceiver(s).

10.6 Reset

[Rule 4.6.1] Within each timing domain, the ASIC or FPGA shall provide a single reset signal, to be implemented on a separate (or spare) clock plane/buffer/tree.

[Rule 4.6.2] The external reset input shall be considered asynchronous in nature, but shall be applied internally as soon as the input is activated.

[Rule 4.6.3] Preference should be given to a circuit design that maintains the internal reset until the clock is established. In all cases, however, if the clock signal can be established before deactivation (end) of the external reset input, then removal of the internal reset shall be synchronized to the active edge of the clock and shall provide sufficient metastability protection.

10.7 Internal Logic Design

[Rule 4.7.1] Upon reset, the ASIC or FPGA shall exhibit deterministic behaviour. At the simplest, it is envisaged that all internal flip-flops will be set to a deterministic state either by the internal reset itself (or if necessary, within a few cycles after removal of reset). It shall be possible to predict the state of all outputs immediately after activation of the external reset input. It shall be permissible for the results of lengthy/complex internal operations to be masked (forced) to a known value until they become valid instead of resetting extensive internal logic that generates them.

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[Rule 4.7.2] Proper functional operation of internal combinatorial logic shall not be based on or depend on propagation delay times.

[Rule 4.7.3] In order to prevent glitch-induced errors, the asynchronous set and/or reset inputs of flip-flops shall not be controlled by combinatorial logic functions. Instead, such internal control signals shall be generated in a synchronous manner using the timing domain’s master clock. This requirement shall not apply to flip-flops synchronizing an external reset input.

[Rule 4.7.4] FPGA manufacturer requirements concerning the limited fan-out of FPGA gates shall be met.

[Rule 4.7.5] In the case of counter value comparisons with a fixed value, the comparison shall be performed with a “greater than or equal to” rather than an “equal to” operator.

[Rule 4.7.6] FPGA internal tri-states shall preferably be avoided; if unavoidable, floating nodes shall be prohibited (a buffer shall be added to get a controlled level when all buffers are tri-state). Any manufacturers recommendations regarding contention between the various drivers and/or for guard times between them shall be met.

[Rule 4.7.7] It shall not be possible for unsafe/dangerous/hazardous combinations of output signals (e.g. driving a data bus while generating a read strobe that also causes an external memory to drive the bus) to occur through activation/use of internal test features (e.g. by inadvertent triggering of state machines) once it is located within the target system. (The same considerations as for the power-on ramp apply).

[Rule 4.7.8] Consideration shall be given to the need for sufficient test signals (both inputs and outputs) to support board testing and related activities.

10.8 State Machines and SEU

[Rule 4.8.1] State machines shall not remain improperly locked in any state whatever signal/protocol anomalies occur at the device interface.

[Rule 4.8.2] The FPGA design shall be robust to SEU effects, so that nominal unit performance is maintained in the presence of SEP; in particular state machines shall not remain improperly locked in any state as a result of SEU.

[Rule 4.8.3] State machines shall contain no unused states even after the coding scheme for their implementation has been considered, in order to ensure that they cannot become locked. (For all coding schemes, all 2**n states are still possible as the result of SEU and the logic must eventually map all of them back into the state diagram. “Transitioning through all unused states directly after reset” and “explicit mapping of unused states” are two useful design options.)

10.9 Timing

[Rule 4.9.1] ASIC/FPGA designs shall include timing margins on top of best-case to worst-case timing variations due to temperature, radiation, ageing, and manufacturing processes variations: a 10% margin on the clock frequency, and a 10% margin on all propagation delay times (PSS-01-301), setup times and hold times shall be provided.

[Rule 4.9.2] The ASIC/FPGA design shall be clock skew tolerant (clock skew is the maximum delay from the clock input of one flip-flop to the clock input of another flip-flop within the same timing domain: the use of opposite edge clocking can be a solution to make circuits skew-tolerant). Clock jitter (internal and external) shall be considered a source of clock skew.

[Rule 4.9.3] Variation in the duty cycle of all external clock inputs by at least +10% to -10% beyond their nominal operating range shall be accommodated (e.g. slow variation from a nominal 48-%-to-52% duty cycle to 38% and 62% shall be considered).

[Rule 4.9.4] The propagation delay from the active edge of a clock through the output(s) of any flip-flop shall be long enough to respect the hold time from the same active clock edge to the input of any other flip-flop within the same timing domain under all environmental conditions (short path static timing analysis).

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[Rule 4.9.5] The propagation delay from the active edge of a clock through the output(s) of any flip-flop shall be short enough to respect the setup time from the next active clock edge to the input of any other flip-flop within the same timing domain under all environmental conditions (long path static timing analysis).

[Rule 4.9.6] It shall not be assumed that all parts of the same device operate under the same environmental conditions. Some variation between input delay chains and their associated clock buffer/plane/tree shall be considered. Where there are multiple internal clock buffers/planes/trees, some variation between them shall be considered.

[Rule 4.9.7] Within each clocked timing domain, the fastest and slowest possible glitch edge propagation delays shall be considered during short path and long path static timing analyses, respectively.

[Rule 4.9.8] In completely asynchronous timing domains (i.e. those where no internal clock can be used to achieve the desired output timing), internal logic shall be constructed to minimize glitches.

[Rule 4.9.9] During the removal of reset, the local reset signal for each flip-flop shall be removed before arrival of the next active clock edge within the same timing domain.

[Rule 4.9.10] Input signal rise and fall times shall strictly meet the FPGA / ASIC manufacturer requirements. In the case of “slow” input signals, a Schmitt-trigger buffer shall be implemented at the ASIC/FPGA interface. Preference shall be given to the use of an internal Schmitt-trigger buffer, but where this is unavailable, an external fast Schmitt-trigger buffer shall be provided.

[Rule 4.9.11] For input signals that can significantly change the internal logic state (like external oscillator clocks and reset), the external circuitry shall provide a sufficiently low source impedance and sufficiently fast transition times to avoid ground bounce (or perhaps SEU-induced) effects that could otherwise lead to multiple detections or false activation. If necessary, an internal Schmitt-trigger buffer shall be implemented or an external fast Schmitt-trigger buffer shall be provided at the device interface.

[Rule 4.9.12] Device vendor/manufacturer requirements concerning the limited number of simultaneous switching outputs shall be met.

10.10 Sensitive Signals

[Rule 4.10.1] The input pin for sensitive input signals shall not be placed near or in the middle of a group of signals (e.g. a data bus) switching simultaneously (ground bounce). Device vendor/manufacturer requirements concerning sensitive inputs shall be met. Sensitive inputs should normally include all clock, reset and bi-directional control pins as well as any other signals that are not immediately registered.

[Rule 4.10.2] Where output signals are used asynchronously (e.g. where they are used as clock or reset signals for other devices), consideration shall be given to internal and external cross-coupling with nearby groups of signals (e.g. a data bus) to maintain signal integrity. In effect, such signals could be considered sensitive outputs.

10.11 Pin and Size Margin

[Rule 4.11.1] FPGA designs shall provide sufficient pin and size margins to enable designs to be maintained at each stage of their foreseen life-cycle. Pin and size margins shall be re-evaluated (perhaps reduced) at various stages within the design life-cycle. Modification to accommodate future products/designs need not be considered. Working pin and size margins of 10% are suggested once the design is considered stable.

10.12 Design Database

[Rule 4.12.1] An effective design environment for simulation, synthesis, layout, timing analysis and other related tools shall be maintained until the completion of design, equipment or (sub)system acceptance tests. During this time, it shall be possible to investigate design characteristics and make modifications to the design implementation at short notice. The configuration of the associated tools shall be well controlled. Changes between the available releases, revisions, etc. shall also be well controlled (e.g. with changes to later versions normally being made only in support of key stages of the design cycle).

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[Rule 4.12.2] An effective design maintenance/revision environment for simulation, synthesis, layout, timing analysis and other related tools shall be maintained from completion of design, equipment or (sub)system acceptance tests until launch. During this time, it is permissible to archive the design database and associated tools but it must be possible to investigate design characteristics or re-work the design implementation using the final design database and the revision of tools used to validate it. Availability of later versions of the same tools is desirable, but may not be preferable.

[Rule 4.12.3] The design database shall be maintained for a sufficient duration after launch to permit the investigation of in-orbit anomalies. Archiving of and/or changes to simulation and timing analysis tools within this time-frame are permissible but it must be possible to investigate design characteristics using the final design database in order to assess any anomaly that is reported. Synthesis and layout tools do not need to be available unless the design can be changed in-orbit (as could be the case for some types of FPGA configured by an on-board computer).

10.13 Manufacturer’s / Vendor’s Recommendations

[Rule 4.13.1] All FPGA manufacturer’s/vendor’s design, programming, pin-configuration and test requirements shall be met.

[Rule 4.13.2] Any specific FPGA manufacturer’s/vendor’s design, programming, pin-configuration and test guidelines should be met.

[Rule 4.13.3] All ASIC manufacturer’s/vendor’s design, layout, pin-configuration and test requirements shall be met.

[Rule 4.13.4] Any specific FPGA manufacturer’s/vendor’s design, layout, pin-configuration and test guidelines should be met.

Note: See also rules 4.7.4, 4.7.6, 4.9.10, 4.9.12 and 4.10.1 above

10.14 FPGA / ASIC Validation

[Rule 4.14.1] A statement of compliance and design verification matrix with respect to the FPGA/ASIC design rules shall be generated and documented with appropriate comments indicating why each rule is met, and how it is verified; this document, and associated compliance with FPGA/ASIC manufacturer's/vendor's requirements/recommendations, shall be deliverable and submitted to contractor approval.

[Rule 4.14.2] A Statement of Compliance with respect to the FPGA/ASIC specification shall be generated.

[Rule 4.14.3] Compliance with FPGA/ASIC manufacturer’s / vendor’s requirements shall be documented.

[Rule 4.14.4] Compliance with FPGA/ASIC manufacturer’s / vendor’s other guidelines shall be determined.

[Rule 4.14.5] Compliance with any vendor’s / manufacturer’s pin-programming requirements shall be documented.

[Rule 4.14.6] An issued specification shall be available which shall include all environmental, technology, timing, functional, pin-out, test and associated requirements

[Rule 4.14.7] A definition of the expected timing domains within the device shall be documented.

[Rule 4.14.8] Simulations shall be performed to show proper/expected/specified logic functionality in all specified modes of operation. It shall be shown that all aspects of logic functionality are correct for the final layout. Regression testing against RTL models, pre-layout simulations and/or pre-layout schematics/netlists is recommended (depending on complexity and design flow) if they exist.

[Rule 4.14.9] It shall be shown that serial data patterns are not bit-reversed.

[Rule 4.14.10] It shall be shown that parallel buses (both input and output) are not bit-reversed.

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[Rule 4.14.11] The proper operation of interface protocols shall be shown, including tolerance/rejection of and/or graceful degradation due to misuse under such conditions as missing strobes, bad addresses, bad parity, invalid data formats, poor data alignment, etc.

[Rule 4.14.12] Proper operation over the complete range of all pin-programmable and register-programmable parameter values shall be shown.

[Rule 4.14.13] Proper operation over the complete range of dependent/acceptable/unacceptable data values shall be shown.

[Rule 4.14.14] Gate-level post-layout simulations shall be performed with full best case-to-worst case timing variation (derived from the layout and to include voltage, temperature, process, radiation dose, ageing, etc.). There shall be no change in functionality across the entire range of possible timing variations and all environmental conditions shall be considered (not necessarily simulated), not just the corner cases (which must be simulated). Regression testing against RTL models, pre-layout simulations and/or pre-layout schematics/netlists is recommended (depending on complexity and design flow) if they exist. Gate-level post-layout simulations must cover the full range of timing variation on all external interfaces in all operating modes and must also cover the full range of timing of all inter-related signals. Post-layout simulations should also fully prove internal logic functionality. Where post-layout simulations to fully prove internal logic functionality are not considered practicable (e.g. because back-annotated simulations would take many months to run) then, subject to explicit prime contractor approval, they may be replaced by verification using other methods (such as RTL simulation combined with functional verification and static timing analysis).

[Rule 4.14.15] The set-up and hold times of all synchronous input signals against the relevant clock and their compliance with the specification shall be determined. Preferably, the set-up and hold times of asynchronous inputs being synchronised should also be determined.

[Rule 4.14.16] Where metastability information is not available, calculations for an older/similar technology may be used to determine an upper/approximate limit for the MTBF.

[Rule 4.14.17] The propagation delays of all output signals against the relevant clock and their compliance with the specification shall be determined.

[Rule 4.14.18] Internal reset arrangements shall be verified.

[Rule 4.14.19] It shall be shown that there are no dangling internal inputs.

[Rule 4.14.20] The absence of missing states in state machines shall be verified.

[Rule 4.14.21] Freedom from internal hold time violations shall be shown for all flip-flops within the design. Static Timing Analysis is heavily preferred since it is otherwise difficult to ensure that the shortest internal timing paths are exercised.

[Rule 4.14.22] Freedom from internal set-up time violations shall be shown for all flip-flops within the design. Static Timing Analysis is heavily preferred since it is otherwise difficult to ensure that the longest internal timing paths are exercised.

[Rule 4.14.23] Libraries used for simulation and/or timing analysis shall be qualified/certified by the FPGA/ASIC vendor/manufacturer. Preferably, tool versions shall be similarly qualified.

[Rule 4.14.24] All vendor’s / manufacturer’s test requirements shall be met.

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11. APPENDIX F NIEL TABLES FOR PROTONS AND ELECTRONS

NIEL values provided in the following tables are extracted from Summers et al. publication except the one used for protons in GaAs that comes from Barry's work

Ref. 1 : “Damage correlations in semiconductors exposed to gamma, electron and proton radiations", G.P. Summers et al, IEEE Trans. Nuc. Sc. Vol 40, n°6, Dec. 1993

Ref. 2: “The Energy Dependence of Lifetime Damage Constants in GaAs LEDs for 1 to 500 MeV Protons”, A. L. Barry et al., IEEE Trans. Nuc. Sc. Vol 42, n°6, Dec. 1995

11.1 NIEL for protons in SILICON

GDI-4759 / 1 /

Energy [MeV]

200 100 70 50 30 20 10

NIEL [MeV.cm2/g]

1.94 10-3 2.6 10-3 3.16 10-3 3.88 10-3 4.78 10-3 5.36 10-3 7.86 10-3

Energy [MeV]

7 5 3 2 1 0.7 0.5

NIEL [MeV.cm2/g]

1.05 10-2

1.38 10-2 2.24 10-2 3.30 10-2 6.38 10-2 8.77 10-2 1.19 10-1

Energy [MeV]

0.3 0.2 0.1 0.07 0.05 0.03 0.02

NIEL [MeV.cm2/g]

1.9 10-1 2.72 10-1 5 10-1 6.8 10-1 9.06 10-1 1.39 1.94

Table 11.1-1 : NIEL values in SILICON as a function of proton energy

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11.2 NIEL for electrons in SILICON

GDI-4761 / 1 /

Energy [MeV]

200 100 70 50 30 20 10

NIEL [MeV.cm2/g]

1.65 10-4

1.6 10-

4 1.56 10-4

1.5 10-4

1.38 10-4

1.27 10-4

1.05 10-4

Energy [MeV]

7 5 3 2 1 0.7 0.5

NIEL [MeV.cm2/g]

9.28 10-5

8.11 10-5

6.37 10-5

5.07 10-5

3.14 10-5

2.32 10-5

1.63 10-5

Energy [MeV]

0.3 0.2

NIEL [MeV.cm2/g]

6.48 10-6

6.48 10-9

Table 11.2-1 : NIEL values in SILICON as a function of electron energy

11.3 NIEL for protons in AsGA

GDI-4766 / 1 /

Energy [MeV]

200 100 70 50 30 20 10

NIEL

[MeV.cm2/g]8.5 10-4 1.25 10-3 1.5 10-3 2 10-3 3 10-3 4 10-3 6.59 10-3

Energy [MeV]

7 5 3 2 1 0.7 0.5

NIEL

[MeV.cm2/g]9.16 10-3 1.25 10-2 1.99 10-2 2.89 10-2 5.4 10-2 7.44 10-2 1.01 10-1

Energy [MeV]

0.3 0.2 0.1 0.07 0.05 0.03 0.02

NIEL

[MeV.cm2/g]1.58 10-1 2.25 10-1 4.09 10-1 5.54 10-1 7.34 10-1 1.12 1.55

Table 11.3-1 : NIEL values in AsGa as a function of proton energy

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11.4 NIEL for electrons in AsGA

GDI-4765 / 1 /

Energy [MeV]

200 100 70 50 30 20 10

NIEL

[MeV.cm2

/g]

1.75 10-4 1.66 10-4 1.6 10-4 1.48 10-4 1.37 10-4 1.15 10-4 1.03 10-4

Energy [MeV]

7 5 3 2 1 0.7 0.5

NIEL

[MeV.cm2

/g]

9.15 10-5 7.42 10-5 6.14 10-

5 4.25 10-5 3.45 10-5 2.97 10-5 1.85 10-5

Energy [MeV]

0.3 0.2

NIEL

[MeV.cm2

/g] 9.74 10-6 9.74 10-9

Table 11.4-1 : NIEL values in AsGa as a function of electrons energy

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CHANGE LOG

Note: This log is autogenerated from Doors. Special symbols may not be rendered correctly and hence the main body of the document shall always take precedence for requirements. Thus it should only be used as a guide to the modifications in the document and not as a substitute. Modified Objects In the following table modifications to the Object Text attribute are shown using red line markup. For other attributes the new value and the old value are shown in separate columns. The codes used in the object type (OT) column are: Rq = Requirement, Inf = Information, Hd = Heading, Ah = Applicability Matrix Heading, Ar = Applicability Matrix Requirement Identifier Attribute OT New Text Old Text GDI-15 section 2

Object Text Inf The requirements in this document shall be called up as applicable to other governing specifications relevant for an Astrosat 250 spacecraft designed and developed according to the Astrosat 250 project standard. Hence the normative and informative documents that apply are those relevant to the appropriate governing specification and the Statement of Work of the Astrosat 250_Project.

GDI-178 section 3.1.8.1

Object Text Rq The storage container shall be designed to protect the unit without causing deterioration for the specified storage period. During long term storage the unit shall be stored under the following conditions: Pressure: 970 mbar to 1050 mbar Temperature: 20°C ± 10°C Humidity: 45% ± 15% Cleanliness: Class 100,000 or better

GDI-281 section 3.2.1.5.1

OLE Inf Figure/Table modified


Object Text Inf The Flight or Ground Limit Load, LL, is the load that can be encountered during the life of the structure that results from the flight or ground environments. These are expected to be during the launch phase but also include combinations of thermally induced loads, preloads, inertia loads (e.g. for mechanisms).deleted


Object Text Inf Unit Qualification Load, QL is equaldirectly todefined thein Limitthis Loadspecification, multipliedincludes byalready the qualification factor, FOSQ.

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Identifier Attribute OT New Text Old Text GDI-284 section 3.2.1.5.1

Object Text Inf Design Load, DL is derived by the multiplication of the (Flight) LimitQualification Load (QL) by the relevant factors of safety. These include the Design Factor, FOSD and where appropriate, ana UncertaintyModel Factor, FOSUN where design loadsKM areto generatedcover usingmathematical FEmodelling analysesuncertainties. For equipments/assemblies following a protoflight development philosophy, anAn additional Protoflight Factor of Safetyfactor, FOSPFProject shallFactor beKP appliedwhich toconsiders the LL to cover additional risks for equipments/assembliesmaturity followingof athe protoflightunit development philosophy. (stability of mass budget, etc,…) and the qualification approach shall be also considered. i.e. Design Load = LimitQualification Load x FOSD x (FOSUNKM x FOSPF where applicable)KP. When Design Loads are not measured by FE analysis and when a protoflight qualification approach is not applied, then the Qualification Load is equal to the Design Load.


Object Text Rq Unit mechanical testing shall take into account an Acceptance Factor, KA of 1.0 applied to the Limit Loads.Deleted


Object Text Inf Note: Unit acceptance loads directly defined in this specification include already the acceptance factor.Deleted


Object Text Rq Unit mechanical testing shall take into account a Qualification Factor, KQ of 1.5 for ground events and of 1.3 for flight events applied to the Limit Loads.Deleted


Object Text Inf Note: Unit qualification loads directly defined in this specification, include already the qualification factor.deleted


Object Text Rq An additional ProtoflightProject Factor, ofKP Safety,will FOSPFtake into ofaccount 1.1,the tomaturity beof appliedthe onunit designdevelopment and testin loads,particular the risk of mass increase beyond the modelling assumptions. Kp value shall be takenjustified intobetween account1.3 when(early itemsstage areof new development) down to be1.0 (qualified units or stabilised design). In case of qualification using a protoflight approach, Kp shall not be reduced below 1.1.


Object Text Rq The Design Factor, FOSD = 1.5 shall be appliedDeleted


Object Text Inf Note: Unit design loads directly defined in this specification, include already the design factor.Deleted


Object Text Rq WhereThe designsafety loadsfactor arewhich generatedconsiders usingthe FEuncertainties analyses,in thenthe anmathematical additionalmodels Uncertaintywhen Factor,predicting FOSUNdynamic shallresponse beis addedKM to= the1.1. DesignThis Factor,value wherecan FOSUNbe =1.progressively reduced to 1.0 when increasing confidence in the mathematical models.


Object Text Conventional structures,Material including/ compositeMetallic structures (sufficient statistical data are available to derive A-values)

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Object Text 1.525


Object Text UnconventionalComposite structuresstructure (see note 27)


Object Text 2.0


Object Text Bonded joints, insert and sandwichUnconventional failures:structures (see note 2) e.g. adhesive failure, face wrinkling, intracellular buckling, honeycomb shear


Object Text -1.4


Object Text 1.41


Object Text 21.025


Object Text 2.5 (Note 3)


Object Text Inf Following assumptions shall be taken into account: 1) Applicable failure criteria have to be agreed with the customer; sufficient statistical data shall be available to derive A values. 2) If material and design allowables are statistically fully verified by means of an adequate unit level test program considering also the manufacturing reliability e.g. proof tests, the Factor of Safety (FoS) may be reduced to FoS= 1.5, in agreement with the customer, 3) These materials have strength properties which are highly dependant on the manufacturing process, the size of the part and of the surface quality. Therefore the stress/strength allowables must be derived from representative samples, to be agreed by the customer. 4) This coefficient applies to general stress analysis on internal pressure and external loads. For damage tolerance or safety analysis, refer to ECSS-E30-02. The performance of evaluation methods as fracture analysis, detection of leaks prior to failure, additional analyses or tests may allow to lower the safety factor for launch and In-orbit load cases, pending on agreement by the customer. 5) For global buckling, the factor of safety does not include any knock down factor, to cover any imperfection sensitivity, which shall be included in the result of the buckling analysis. 6) For Units with no specific alignment requirements sliding under thermal loads only (e.g. "In-Orbit thermal deformation) is acceptable. 7) CFRP, when fully qualified and material characterization is available, may be considered as a conventional material for purposes of defining safety factors.

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Object Text Inf Applied load is the computed or measured load (or stress) under defined load conditions plus design/protoflight/uncertainty factors as appropriate, i.e. the Design Load (DL),

GDI-540 section 3.3.3

Object Text EnvironmentalRadiative Sink Temperature


Object Text Inf Figure 3.3-1: Temperature Design, Acceptance and Qualification Levels

GDI-822 section 3.5.2.1.1.1

Object Text Rq The choice of the LCL class shall be proposed by the contractor (except PCDU contractor) and subjected to approval. The LCL classes are defined in the table here below Table 3.5-2:LCL classes The different LCL classes will be confirmed when the PCDU design will be frozen.

GDI-823 section 3.5.2.1.1.1

Object Text Rq The LCL shall limit its output current to trip-off current between minimum and maximum current limitation between IL and (iLIM=1.15 X IL)ILIM.

GDI-824 section 3.5.2.1.1.1

Object Text Rq In case the load exceeds its LCL class trip-off point, the latching current limiter shall limit the current to its limitation value and switch off after a delay time (trip-off time) : between 810 and 1620 ms for LCL class 10 to class 34 between 54 and 8 ms for LCL class 45 to class 610

GDI-828 section 3.5.2.1.1.1

Object Text Rq The maximum voltage drop of the LCL from PCDU inputstar point to PCDU output, including all internal wiring and forward and return path shall be : £ 0.25V for LCL class 10 to class 34 £ 0.35V for LCL class 45 to class 610 for currents up to 0.9 x IL (maximum nominal current)

GDI-842 section 3.5.2.1.1.3

Object Text Rq The design current shall be 1.15*IL


Object Text Rq The 1553-Bus Protocol shall be compliant to '1553-Bus Protocol Specification' TBC"DIV.SP.00030.T.ASTR"


Object Text Rq Cross-strapping of redundant commands shall be implemented as required in GDI-2154{Section 3.5.6.1}.

GDI-1481 section 3.5.4.10.1




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Object Text Rq The receiver shall detect a "closed" status for any switch resistance in the range 0 to 100050 Ohm (relay contact type) for a voltage threshold between 0 and 1.4V (optocoupler type)

GDI-1578 section 3.5.4.11.2

Object Text Rq The receiver shall detect an "open" status for any switch resistance in the range 0greater tothan 10001 OhmMOhm (relay contact type) for a voltage threshold between 2.2V and 5.5V (optocoupler type)

GDI-1612 section 3.5.4.13.1

Object Text Rq The S-Band Digital TC Channel shall consist of 3 signals. (For these signals the following abbreviations shall be used): Data (DCD) Clock (DCC) Data Valid (DCE) [Enable/ChannelBit Activelock status]

GDI-1615 section 3.5.4.13.1

Object Text Rq Figure 3.5-25 shows for information the timing relationship between the Data Valid, Clock and Data signals of the S-Band Digital TC Channel for a 4 kbps uplink:

GDI-1617 section 3.5.4.13.1

Object Text Inf T1 =< 128 bit (TBC) T2 between 1 bit and 128 bit (TBC) T3 =< 500ms T4 =< 100ms Tc = 500µs +/- 5% (for a 2kbps uplink); and= 10062,5µs +/- 5% for a 16kbps uplink; = 15.625µs +/- 5% (for a 10kbps64 kbps uplink) Ts = Tc/2 - Tc/10µs min Th = 20µsTc/2 - Tc/10 min Note 1: The clock is running as soon as the LOCK STATUS is ”high” and it will run until LOCK STATUS falls to ”low”. Note 2: The bit clock stability shall be better than +/- 5% as soon as DATA VALID is ”high” and until DATA VALID falls to ”low”. Note 3: The ESA standard requires an acquisition sequence of 128bits minimum. This value can be increased by adding an idle sequence (min. 8 bits) after the acquisition sequence.

GDI-1618 section 3.5.4.13.2

Object Heading

Hd S-Band Carrier Lock Status Interface

S-Band Receiver Lock Status Interface

GDI-1619 section 3.5.4.13.2

Object Text Inf The ReceiverCarrier Lock Status Signal is issued by the S-Band Transponder and will be acquired by the OBC.

GDI-1673 section 3.5.4.14.1.1

Object Text Rq One of the bothadditional barrier switches shall be activated by a discrete signal (e.g. separation strap), and not commandable by the on-board S/W generated commandSW.

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Identifier Attribute OT New Text Old Text GDI-2100 section 3.5.5.1

Object Text Rq For the spacecraft cable harness the following connector types shall be used: Rectangular connectors D-Sub or High Density in accordance with MIL-C-24308, or with ESA SCC 3401. (ESA 3401-001 for D*M, -002 for D*MA, -009 for MDM connectors) Circular connectors in accordance with MIL-C-38999, or with ESA SCC 3401-052. Connectors, which interface with release initiators (such as electro-explosive and non-explosive devices) in accordance with MIL-C-26482-2, or with ESA SCC 3401-008. Non-magnetic coaxial connectors of the SMA type (3402-001 and 3402-002), or TNC (3402-008 and 3402-009) for RF cables. Non-magnetic coaxial connectors of the crimp and solder type per MIL-C-39012. Non-magnetic SMA coaxial connectors per MIL-C-83517. Special connectors, or connectors at of-the-shelf equipment may deviate from the requirement, but the connector counterpart shall be delivered by the manufacturer of the respective unit.


Object Text Rq For AIV and storage, the unit shall withstand temperature conditions as follows: Short term Storage(prior or after transportation -40°C to +60°C Integration +10°C to +30°C Unit testing Unit non operational and operational temperature requirement ranges as per Table 4.3-1.


Object Text Field Level for units in direct view of the RF antenna(peak values)


Object Text 0 dBuVdBµV/m

GDI-3891 section 5.2.4.4.5


GDI-3894 section 5.2.4.4.5


GDI-3895 section 5.2.4.4.5


GDI-3905 section 5.2.4.4.7


GDI-3913 section 5.2.4.4.9



Object Text Rq HEAVY IONS / Solar Flare Table 4.4-5: Integral solar flare ion flux spectrum based on October 1989 worst day flare, Astrosat 250 orbit, Aluminium shielding 1 g/cm2

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Identifier Attribute OT New Text Old Text GDI-4613 section 3.5.2.1.1.4

Object Text Rq The overcurrent limitation (Ilimit,knee) shall be between IL and 1.15 x ILILIM

GDI-4614 section 3.5.2.1.1.4

Object Text Rq The foldback current IF shall be 0.15 to 0.6 (TBC) x Ilim,knee

GDI-4617 section 3.5.2.1.1.4

Object Text Rq The maximum voltage drop of the FCL from PCDU input to PCDU output, including all internal wiring and forward and return path shall be £ 0.25V for currents up to 0.9maximum xnominal Ilim,kneecurrent mentioned in Table 3.5-3.

GDI-4631 section 3.5.2.1.1.6

Object Text Rq The harness voltage drop shall be less than 0.5V for currents up to 0.9 x IL (including forward and return path)

GDI-4645 section 3.5.2.1.1.1

Object Text Rq The LCL switch-off response after undervoltage detection shall be higher than 0.5 s and shall not exceed 1s.

GDI-4649 section 3.5.2.1.1.2

Object Text Rq After power ON sequence (including input filter loading and DC/DC converter start sequence), the maximum current load over the nominal input voltage range shall always be lower than 0.9the xmaximum ILnominal current mentioned in Table 3.5-2.

GDI-4651 section 3.5.2.1.1.6

Object Text Rq The design current shall be 1.15*IL

GDI-4653 section 3.5.2.1.1.4

Object Text Rq Switch OFF response time after undervoltage detection shall be higher than 0.5 s and shall not exceed 1s.

GDI-4655 section 3.5.2.1.1.5

Object Text Rq After power ON sequence (including input filter loading and DC/DC converter start sequence), the maximum current load over the nominal input voltage range shall always be lower than 0.9maximum xnominal ILcurrent mentioned in Table 3.5-3.


Object Text Rq The probability of occurence of Single Event Upset (SEU) or Single Event Transient (SET) when leading to unit reset or functional data corruption shall not exceed 2.10e-5 per day averaged over the mission. The estimation shall take into account a minimum of 8 solar flares days during the in orbit lifetime (7 yearsto in10 orbityears) for heavy ions and the figure 4.4-3 for total solar proton fluence.

GDI-4809 section 3.5.4.10.1.1

Object Text Rq The driver shall be equipped with appropriate circuits to suppress negative switching transients. (covering the case of failure of the receiver free-wheeling diode)

GDI-4841 section 3.5.2.1.1.1

Object Text Inf Trip-off currentThe mentionedclass inof the Table 3.5-2LCL is called IL.defined Theby classmaximum ofnominal thecurrent LCLmentioned isin definedthe byTable IL3. 5-2.

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Identifier Attribute OT New Text Old Text GDI-4842 section 3.5.2.1.1.1

Object Text Inf Minimum limitation current mentioned in the Table 3.5-2 is called IL. Maximum limitation current mentioned in the Table 3.5-2 is called iLIMILIM=1.22*IL.

GDI-4847 section 3.5.2.1.1.4

Object Text Rq The choice of the FCL class shall be proposed by the contractor (except PCDU contractor) and subjected to approval. The FCL classes are defined in the table here below Table 3.5-3:FCL classes The different FCL classes will be confirmed when the PCDU design will be frozen.

GDI-4848 section 3.5.2.1.1.4

Object Text Inf Trip-off currentThe mentionedclass inof the Table 3.5-3FCL is called IL.defined Theby classmaximum ofnominal thecurrent FCLmentioned isin definedthe byTable IL3. 5-3

GDI-4849 section 3.5.2.1.1.4

Object Text Inf Minimum limitation point mentioned in the Table 3.5-3 is called IL. Maximum limitation point mentioned in the Table 3.5-3 is called (Ilimit,knee)ILIM=1.22*IL.

GDI-4903 section 12.2


GDI-4904 section 12.2


Inserted Objects Identifier Object Type Text GDI-5542 section 4.3.2.4

Heading Atomic Oxygen Environment


Requirement Any external unit shall withstand erosion and oxidation induced by the monoatomic oxygen:Fluence in at/cm2/year is given in Table 4.3-3.The nominal environment to be taken into account for external units is an altitude of 500Km and 7 years worst case. The compatibility with a duration extension to ten years whatever the orbit shall be analysed and presented to Astrium.Coating thickness (for example MLI) shall present adequate margins.


Information


Information Table 4.3-3: Fluence in at/cm2/year


Information Table 4.4-5: Integral solar flare ion flux spectrum based on October 1989 worst day flare,Astrosat 250 orbit, Aluminium shielding 1 g/cm2

GDI-5547 section 3.5.2.1.1

Requirement Heaters shall be sized to not infringe in any voltage conditions the maximum heater power density of 0.54W/cm²

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Identifier Object Type Text GDI-5557 section 3.2.1.5.1

Information Local Design Factor, KLD shall be applied when the sizing approach or local modelling are complex. A factor of 1.2 shall be used in the cases of joint and inserts (Joint/fastener/bolt), and bonded joint, insert and sandwich failures.

GDI-5559 section 3.2.1.5.2

TBD Bonded joints, insert and sandwich failures:e.g. adhesive failure, face wrinkling, intracellular buckling, honeycomb shear

GDI-5560 section 3.2.1.5.2

TBD -

GDI-5561 section 3.2.1.5.2

TBD 1.5

GDI-5562 section 3.2.1.5.2

TBD 1.5


TBD Field Level for units hidden from the RF antenna (see note)


TBD 15 dBµV/m


TBD 20 dBµV/m


TBD TBD


Information Note: External units potentially in direct view of an RF antenna should be identified as such in the unit technical specification (default case = hidden). The used case (direct view/hidden) shall be recalled by the supplier in the statement of compliance to GDIR and subject to agreement with Astrium.

GDI-5577 section 2

TBD

GDI-5578 section 2

TBD Others

GDI-5579 section 2

TBD

GDI-5581 section 2

TBD AD26

GDI-5582 section 2

TBD AS250 - MIL-STD-1553 Bus Protocol Specification

GDI-5583 section 2

TBD DIV.SP.00030.T.ASTR

GDI-5584 section 3.2.1.5.2

TBD FOSY

GDI-5585 section 3.2.1.5.2

TBD 1.25

GDI-5586 section 3.2.1.5.2

TBD

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TBD

GDI-5588 section 3.2.1.5.2

TBD

GDI-5589 section 3.2.1.5.2

TBD

GDI-5590 section 3.2.1.5.2

TBD

GDI-5591 section 3.2.1.5.2

TBD

GDI-5592 section 3.2.1.5.2

TBD

GDI-5593 section 3.2.1.5.2

TBD

GDI-5594 section 3.2.1.5.2

TBD

GDI-5595 section 3.2.1.5.2

TBD

GDI-5596 section 3.2.1.5.2

TBD

GDI-5597 section 3.2.1.5.2

TBD FOSU

GDI-5598 section 3.2.1.5.2

TBD 2.0

GDI-5599 section 3.2.1.5.2

TBD 2.0

GDI-5600 section 3.2.1.5.2

TBD 2.5

GDI-5601 section 3.2.1.5.2

TBD 2.0

GDI-5602 section 3.2.1.5.2

TBD 2.0

GDI-5603 section 3.2.1.5.2

TBD 2.0

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TBD 2.0

GDI-5605 section 3.2.1.5.2

TBD 5.0(Note 3)

GDI-5606 section 3.2.1.5.2

TBD 2.5

GDI-5607 section 3.2.1.5.2

TBD 5.0

GDI-5608 section 3.2.1.5.2

TBD 2.5

GDI-5609 section 3.2.1.5.2

TBD 3.0

GDI-5610 section 3.2.1.5.2

TBD KLD

GDI-5611 section 3.2.1.5.2

TBD

GDI-5612 section 3.2.1.5.2

TBD

GDI-5613 section 3.2.1.5.2

TBD

GDI-5614 section 3.2.1.5.2

TBD 1.2

GDI-5615 section 3.2.1.5.2

TBD

GDI-5616 section 3.2.1.5.2

TBD 1.2

GDI-5617 section 3.2.1.5.2

TBD

GDI-5618 section 3.2.1.5.2

TBD

GDI-5619 section 3.2.1.5.2

TBD

GDI-5620 section 3.2.1.5.2

TBD

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TBD

GDI-5622 section 3.2.1.5.2

TBD

GDI-5624 section 3.2.1.5.2

TBD

GDI-5625 section 3.2.1.5.2

TBD Tested Structure

GDI-5626 section 3.2.1.5.2

TBD Tested Structure

GDI-5627 section 3.2.1.5.2

TBD Verif by analysis only

GDI-5628 section 3.2.1.5.2

TBD Verif by analysis only

GDI-5629 section 3.2.1.5.2

TBD

Deleted Objects GDI-317 section 3.2.1.5.2 : TBD GDI-1621 section 3.5.4.13.2 : Information 142 differences found

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Requirement/Section Cross Reference Page numbers are the pages where the sections start

GDI-135.............. 3.1.1.................13 GDI-137.............. 3.1.1.................13 GDI-138.............. 3.1.1.................13 GDI-140.............. 3.1.2.................13 GDI-141.............. 3.1.2.................13 GDI-142.............. 3.1.2.................13 GDI-145.............. 3.1.3.1..............14 GDI-149.............. 3.1.3.2..............14 GDI-151.............. 3.1.3.3..............14 GDI-154.............. 3.1.3.4..............15 GDI-159.............. 3.1.4.................16 GDI-160.............. 3.1.4.................16 GDI-161.............. 3.1.4.................16 GDI-162.............. 3.1.4.................16 GDI-164.............. 3.1.5.................16 GDI-166.............. 3.1.6.................16 GDI-167.............. 3.1.6.................16 GDI-168.............. 3.1.6.................16 GDI-170.............. 3.1.7.................17 GDI-171.............. 3.1.7.................17 GDI-172.............. 3.1.7.................17 GDI-175.............. 3.1.8.1..............17 GDI-176.............. 3.1.8.1..............17 GDI-177.............. 3.1.8.1..............17 GDI-178.............. 3.1.8.1..............17 GDI-180.............. 3.1.8.2..............18 GDI-181.............. 3.1.8.2..............18 GDI-183.............. 3.1.8.3..............18 GDI-184.............. 3.1.8.3..............18 GDI-186.............. 3.1.8.4..............19 GDI-190.............. 3.1.9.1..............19 GDI-191.............. 3.1.9.1..............19 GDI-193.............. 3.1.9.2..............19 GDI-194.............. 3.1.9.2..............19 GDI-196.............. 3.1.9.3..............19 GDI-198.............. 3.1.9.4..............20 GDI-200.............. 3.1.10...............20 GDI-201.............. 3.1.10...............20 GDI-203.............. 3.2....................20 GDI-204.............. 3.2....................20 GDI-207.............. 3.2.1.1..............20 GDI-208.............. 3.2.1.1..............20 GDI-209.............. 3.2.1.1..............20 GDI-210.............. 3.2.1.1..............20 GDI-211.............. 3.2.1.1..............20 GDI-213.............. 3.2.1.2..............22 GDI-240.............. 3.2.1.2..............22 GDI-241.............. 3.2.1.2..............22 GDI-243.............. 3.2.1.3..............22 GDI-271.............. 3.2.1.3..............22 GDI-272.............. 3.2.1.3..............22 GDI-276.............. 3.2.1.4..............23 GDI-277.............. 3.2.1.4..............23 GDI-280.............. 3.2.1.5.1...........23

GDI-290 ..............3.2.1.5.1 .......... 23 GDI-292 ..............3.2.1.5.1 .......... 23 GDI-294 ..............3.2.1.5.1 .......... 23 GDI-296 ..............3.2.1.5.2 .......... 25 GDI-298 ..............3.2.1.5.2 .......... 25 GDI-299 ..............3.2.1.5.2 .......... 25 GDI-390 ..............3.2.1.5.2 .......... 25 GDI-396 ..............3.2.1.5.2 .......... 25 GDI-397 ..............3.2.1.5.2 .......... 25 GDI-398 ..............3.2.1.5.2 .......... 25 GDI-399 ..............3.2.1.5.2 .......... 25 GDI-400 ..............3.2.1.5.2 .......... 25 GDI-401 ..............3.2.1.5.2 .......... 25 GDI-402 ..............3.2.1.5.2 .......... 25 GDI-403 ..............3.2.1.5.2 .......... 25 GDI-404 ..............3.2.1.5.2 .......... 25 GDI-405 ..............3.2.1.5.2 .......... 25 GDI-406 ..............3.2.1.5.2 .......... 25 GDI-408 ..............3.2.1.6 ............. 28 GDI-409 ..............3.2.1.6 ............. 28 GDI-412 ..............3.2.2.1 ............. 28 GDI-413 ..............3.2.2.1 ............. 28 GDI-414 ..............3.2.2.1 ............. 28 GDI-415 ..............3.2.2.1 ............. 28 GDI-416 ..............3.2.2.1 ............. 28 GDI-417 ..............3.2.2.1 ............. 28 GDI-435 ..............3.2.2.1 ............. 28 GDI-436 ..............3.2.2.1 ............. 28 GDI-437 ..............3.2.2.1 ............. 28 GDI-438 ..............3.2.2.1 ............. 28 GDI-439 ..............3.2.2.1 ............. 28 GDI-440 ..............3.2.2.1 ............. 28 GDI-441 ..............3.2.2.1 ............. 28 GDI-442 ..............3.2.2.1 ............. 28 GDI-443 ..............3.2.2.1 ............. 28 GDI-445 ..............3.2.2.2 ............. 30 GDI-446 ..............3.2.2.2 ............. 30 GDI-447 ..............3.2.2.2 ............. 30 GDI-448 ..............3.2.2.2 ............. 30 GDI-449 ..............3.2.2.2 ............. 30 GDI-468 ..............3.2.2.3 ............. 31 GDI-469 ..............3.2.2.3 ............. 31 GDI-470 ..............3.2.2.3 ............. 31 GDI-472 ..............3.2.3 ................ 32 GDI-473 ..............3.2.3 ................ 32 GDI-474 ..............3.2.3 ................ 32 GDI-475 ..............3.2.3 ................ 32 GDI-476 ..............3.2.3 ................ 32 GDI-477 ..............3.2.3 ................ 32 GDI-479 ..............3.2.3 ................ 32 GDI-480 ..............3.2.3 ................ 32 GDI-483 ..............3.2.4 ................ 33 GDI-484 ..............3.2.4 ................ 33 GDI-487 ..............3.2.5.1 ............. 33

GDI-488 .............. 3.2.5.1 ..............33 GDI-489 .............. 3.2.5.1 ..............33 GDI-490 .............. 3.2.5.1 ..............33 GDI-491 .............. 3.2.5.1 ..............33 GDI-492 .............. 3.2.5.1 ..............33 GDI-493 .............. 3.2.5.1 ..............33 GDI-494 .............. 3.2.5.1 ..............33 GDI-495 .............. 3.2.5.1 ..............33 GDI-496 .............. 3.2.5.1 ..............33 GDI-497 .............. 3.2.5.1 ..............33 GDI-498 .............. 3.2.5.1 ..............33 GDI-499 .............. 3.2.5.1 ..............33 GDI-501 .............. 3.2.5.2 ..............35 GDI-502 .............. 3.2.5.2 ..............35 GDI-504 .............. 3.2.5.3 ..............35 GDI-505 .............. 3.2.5.3 ..............35 GDI-506 .............. 3.2.5.3 ..............35 GDI-510 .............. 3.3.1.1 ..............36 GDI-512 .............. 3.3.1.2 ..............36 GDI-513 .............. 3.3.1.2 ..............36 GDI-515 .............. 3.3.1.3 ..............36 GDI-516 .............. 3.3.1.3 ..............36 GDI-517 .............. 3.3.1.3 ..............36 GDI-518 .............. 3.3.1.3 ..............36 GDI-520 .............. 3.3.1.4 ..............36 GDI-524 .............. 3.3.2.1 ..............37 GDI-525 .............. 3.3.2.1 ..............37 GDI-526 .............. 3.3.2.1 ..............37 GDI-529 .............. 3.3.2.2 ..............37 GDI-530 .............. 3.3.2.2 ..............37 GDI-532 .............. 3.3.2.3 ..............37 GDI-533 .............. 3.3.2.3 ..............37 GDI-535 .............. 3.3.2.4 ..............37 GDI-537 .............. 3.3.3 .................38 GDI-568 .............. 3.3.3 .................38 GDI-569 .............. 3.3.3 .................38 GDI-571 .............. 3.3.3 .................38 GDI-574 .............. 3.3.4.1 ..............40 GDI-575 .............. 3.3.4.1 ..............40 GDI-576 .............. 3.3.4.1 ..............40 GDI-577 .............. 3.3.4.1 ..............40 GDI-578 .............. 3.3.4.1 ..............40 GDI-579 .............. 3.3.4.1 ..............40 GDI-580 .............. 3.3.4.1 ..............40 GDI-581 .............. 3.3.4.1 ..............40 GDI-582 .............. 3.3.4.1 ..............40 GDI-583 .............. 3.3.4.1 ..............40 GDI-585 .............. 3.3.4.2 ..............40 GDI-586 .............. 3.3.4.2 ..............40 GDI-588 .............. 3.3.5 .................41 GDI-589 .............. 3.3.5 .................41 GDI-592 .............. 3.3.6.1 ..............41 GDI-596 .............. 3.4.1.1 ..............41 GDI-598 .............. 3.4.1.2 ..............41

AS250


Date: 23/06/2009 of 281


GDI-599.............. 3.4.1.2..............41 GDI-600.............. 3.4.1.2..............41 GDI-602.............. 3.4.1.3..............42 GDI-603.............. 3.4.1.3..............42 GDI-604.............. 3.4.1.3..............42 GDI-605.............. 3.4.1.3..............42 GDI-606.............. 3.4.1.3..............42 GDI-607.............. 3.4.1.3..............42 GDI-609.............. 3.4.1.4..............42 GDI-610.............. 3.4.1.4..............42 GDI-612.............. 3.4.2.................42 GDI-613.............. 3.4.2.................42 GDI-614.............. 3.4.2.................42 GDI-616.............. 3.4.3.................43 GDI-617.............. 3.4.3.................43 GDI-618.............. 3.4.3.................43 GDI-622.............. 3.5.1.................43 GDI-623.............. 3.5.1.................43 GDI-805.............. 3.5.2.1.1...........44 GDI-806.............. 3.5.2.1.1...........44 GDI-807.............. 3.5.2.1.1...........44 GDI-808.............. 3.5.2.1.1...........44 GDI-809.............. 3.5.2.1.1...........44 GDI-810.............. 3.5.2.1.1...........44 GDI-811.............. 3.5.2.1.1...........44 GDI-812.............. 3.5.2.1.1...........44 GDI-813.............. 3.5.2.1.1...........44 GDI-814.............. 3.5.2.1.1...........44 GDI-815.............. 3.5.2.1.1...........44 GDI-816.............. 3.5.2.1.1...........44 GDI-822.............. 3.5.2.1.1.1........47 GDI-823.............. 3.5.2.1.1.1........47 GDI-824.............. 3.5.2.1.1.1........47 GDI-825.............. 3.5.2.1.1.1........47 GDI-828.............. 3.5.2.1.1.1........47 GDI-829.............. 3.5.2.1.1.1........47 GDI-830.............. 3.5.2.1.1.1........47 GDI-831.............. 3.5.2.1.1.1........47 GDI-836.............. 3.5.2.1.1.2........49 GDI-837.............. 3.5.2.1.1.2........49 GDI-838.............. 3.5.2.1.1.2........49 GDI-840.............. 3.5.2.1.1.3........50 GDI-841.............. 3.5.2.1.1.3........50 GDI-842.............. 3.5.2.1.1.3........50 GDI-918.............. 3.5.2.2..............53 GDI-919.............. 3.5.2.2..............53 GDI-920.............. 3.5.2.2..............53 GDI-923.............. 3.5.2.3..............53 GDI-925.............. 3.5.2.4..............53 GDI-928.............. 3.5.2.5..............53 GDI-929.............. 3.5.2.5..............53 GDI-930.............. 3.5.2.5..............53 GDI-936.............. 3.5.3.1..............54 GDI-937.............. 3.5.3.1..............54 GDI-938.............. 3.5.3.1..............54 GDI-939.............. 3.5.3.1..............54 GDI-940.............. 3.5.3.1..............54

GDI-941 ..............3.5.3.1 ............. 54 GDI-950 ..............3.5.3.2 ............. 56 GDI-955 ..............3.5.4.1 ............. 57 GDI-956 ..............3.5.4.1 ............. 57 GDI-957 ..............3.5.4.1 ............. 57 GDI-958 ..............3.5.4.1 ............. 57 GDI-959 ..............3.5.4.1 ............. 57 GDI-960 ..............3.5.4.1 ............. 57 GDI-961 ..............3.5.4.1 ............. 57 GDI-962 ..............3.5.4.1 ............. 57 GDI-963 ..............3.5.4.1 ............. 57 GDI-964 ..............3.5.4.1 ............. 57 GDI-965 ..............3.5.4.1 ............. 57 GDI-966 ..............3.5.4.1 ............. 57 GDI-967 ..............3.5.4.1 ............. 57 GDI-968 ..............3.5.4.1 ............. 57 GDI-970 ..............3.5.4.1 ............. 57 GDI-972 ..............3.5.4.1 ............. 57 GDI-977 ..............3.5.4.1.1.1 ....... 61 GDI-978 ..............3.5.4.1.1.1 ....... 61 GDI-979 ..............3.5.4.1.1.1 ....... 61 GDI-1123 ............3.5.4.1.1.2 ....... 62 GDI-1182 ............3.5.4.2 ............. 62 GDI-1190 ............3.5.4.2 ............. 62 GDI-1192 ............3.5.4.2.1 .......... 63 GDI-1193 ............3.5.4.2.1 .......... 63 GDI-1194 ............3.5.4.2.1 .......... 63 GDI-1195 ............3.5.4.2.1 .......... 63 GDI-1196 ............3.5.4.2.1 .......... 63 GDI-1197 ............3.5.4.2.1 .......... 63 GDI-1198 ............3.5.4.2.1 .......... 63 GDI-1199 ............3.5.4.2.1 .......... 63 GDI-1200 ............3.5.4.2.1 .......... 63 GDI-1201 ............3.5.4.2.1 .......... 63 GDI-1202 ............3.5.4.2.1 .......... 63 GDI-1203 ............3.5.4.2.1 .......... 63 GDI-1205 ............3.5.4.2.1 .......... 63 GDI-1206 ............3.5.4.2.1 .......... 63 GDI-1207 ............3.5.4.2.1 .......... 63 GDI-1209 ............3.5.4.2.2 .......... 64 GDI-1210 ............3.5.4.2.2 .......... 64 GDI-1211 ............3.5.4.2.2 .......... 64 GDI-1213 ............3.5.4.2.2 .......... 64 GDI-1214 ............3.5.4.2.2 .......... 64 GDI-1215 ............3.5.4.2.2 .......... 64 GDI-1216 ............3.5.4.2.2 .......... 64 GDI-1218 ............3.5.4.2.2 .......... 64 GDI-1219 ............3.5.4.2.2 .......... 64 GDI-1220 ............3.5.4.2.2 .......... 64 GDI-1222 ............3.5.4.2.3 .......... 65 GDI-1223 ............3.5.4.2.3 .......... 65 GDI-1226 ............3.5.4.3.1 .......... 65 GDI-1227 ............3.5.4.3.1 .......... 65 GDI-1229 ............3.5.4.3.1 .......... 65 GDI-1230 ............3.5.4.3.1 .......... 65 GDI-1231 ............3.5.4.3.1 .......... 65 GDI-1232 ............3.5.4.3.1 .......... 65

GDI-1233 ............ 3.5.4.3.1 ...........65 GDI-1234 ............ 3.5.4.3.1 ...........65 GDI-1235 ............ 3.5.4.3.1 ...........65 GDI-1236 ............ 3.5.4.3.1 ...........65 GDI-1237 ............ 3.5.4.3.1 ...........65 GDI-1238 ............ 3.5.4.3.1 ...........65 GDI-1239 ............ 3.5.4.3.1 ...........65 GDI-1240 ............ 3.5.4.3.1 ...........65 GDI-1241 ............ 3.5.4.3.1 ...........65 GDI-1242 ............ 3.5.4.3.1 ...........65 GDI-1243 ............ 3.5.4.3.1 ...........65 GDI-1244 ............ 3.5.4.3.1 ...........65 GDI-1245 ............ 3.5.4.3.1 ...........65 GDI-1246 ............ 3.5.4.3.1 ...........65 GDI-1247 ............ 3.5.4.3.1 ...........65 GDI-1250 ............ 3.5.4.3.2 ...........67 GDI-1254 ............ 3.5.4.4 ..............68 GDI-1256 ............ 3.5.4.4 ..............68 GDI-1257 ............ 3.5.4.4 ..............68 GDI-1258 ............ 3.5.4.4 ..............68 GDI-1261 ............ 3.5.4.4 ..............68 GDI-1262 ............ 3.5.4.4 ..............68 GDI-1263 ............ 3.5.4.4 ..............68 GDI-1267 ............ 3.5.4.7.1 ...........72 GDI-1268 ............ 3.5.4.7.1 ...........72 GDI-1269 ............ 3.5.4.7.1 ...........72 GDI-1270 ............ 3.5.4.7.1 ...........72 GDI-1271 ............ 3.5.4.7.1 ...........72 GDI-1272 ............ 3.5.4.7.1 ...........72 GDI-1273 ............ 3.5.4.7.1 ...........72 GDI-1276 ............ 3.5.4.7.1 ...........72 GDI-1278 ............ 3.5.4.7.2 ...........73 GDI-1279 ............ 3.5.4.7.2 ...........73 GDI-1281 ............ 3.5.4.7.2 ...........73 GDI-1282 ............ 3.5.4.7.2 ...........73 GDI-1283 ............ 3.5.4.7.2 ...........73 GDI-1286 ............ 3.5.4.8 ..............74 GDI-1291 ............ 3.5.4.8.1.1 ........74 GDI-1292 ............ 3.5.4.8.1.1 ........74 GDI-1293 ............ 3.5.4.8.1.1 ........74 GDI-1294 ............ 3.5.4.8.1.1 ........74 GDI-1295 ............ 3.5.4.8.1.1 ........74 GDI-1296 ............ 3.5.4.8.1.1 ........74 GDI-1297 ............ 3.5.4.8.1.1 ........74 GDI-1298 ............ 3.5.4.8.1.1 ........74 GDI-1299 ............ 3.5.4.8.1.1 ........74 GDI-1300 ............ 3.5.4.8.1.1 ........74 GDI-1302 ............ 3.5.4.8.1.2 ........75 GDI-1303 ............ 3.5.4.8.1.2 ........75 GDI-1304 ............ 3.5.4.8.1.2 ........75 GDI-1305 ............ 3.5.4.8.1.2 ........75 GDI-1306 ............ 3.5.4.8.1.2 ........75 GDI-1307 ............ 3.5.4.8.1.2 ........75 GDI-1308 ............ 3.5.4.8.1.2 ........75 GDI-1309 ............ 3.5.4.8.1.2 ........75 GDI-1310 ............ 3.5.4.8.1.2 ........75 GDI-1311 ............ 3.5.4.8.1.2 ........75

AS250


Date: 23/06/2009 of 281


GDI-1312............ 3.5.4.8.1.2........75 GDI-1313............ 3.5.4.8.1.2........75 GDI-1315............ 3.5.4.8.1.3........76 GDI-1316............ 3.5.4.8.1.3........76 GDI-1320............ 3.5.4.8.2.1........76 GDI-1321............ 3.5.4.8.2.1........76 GDI-1322............ 3.5.4.8.2.1........76 GDI-1323............ 3.5.4.8.2.1........76 GDI-1324............ 3.5.4.8.2.1........76 GDI-1325............ 3.5.4.8.2.1........76 GDI-1326............ 3.5.4.8.2.1........76 GDI-1327............ 3.5.4.8.2.1........76 GDI-1328............ 3.5.4.8.2.1........76 GDI-1329............ 3.5.4.8.2.1........76 GDI-1331............ 3.5.4.8.2.2........77 GDI-1332............ 3.5.4.8.2.2........77 GDI-1333............ 3.5.4.8.2.2........77 GDI-1334............ 3.5.4.8.2.2........77 GDI-1335............ 3.5.4.8.2.2........77 GDI-1336............ 3.5.4.8.2.2........77 GDI-1337............ 3.5.4.8.2.2........77 GDI-1338............ 3.5.4.8.2.2........77 GDI-1339............ 3.5.4.8.2.2........77 GDI-1340............ 3.5.4.8.2.2........77 GDI-1341............ 3.5.4.8.2.2........77 GDI-1342............ 3.5.4.8.2.2........77 GDI-1344............ 3.5.4.8.2.3........78 GDI-1345............ 3.5.4.8.2.3........78 GDI-1349............ 3.5.4.8.3.1........78 GDI-1350............ 3.5.4.8.3.1........78 GDI-1351............ 3.5.4.8.3.1........78 GDI-1352............ 3.5.4.8.3.1........78 GDI-1353............ 3.5.4.8.3.1........78 GDI-1354............ 3.5.4.8.3.1........78 GDI-1355............ 3.5.4.8.3.1........78 GDI-1356............ 3.5.4.8.3.1........78 GDI-1357............ 3.5.4.8.3.1........78 GDI-1358............ 3.5.4.8.3.1........78 GDI-1360............ 3.5.4.8.3.2........78 GDI-1361............ 3.5.4.8.3.2........78 GDI-1362............ 3.5.4.8.3.2........78 GDI-1363............ 3.5.4.8.3.2........78 GDI-1364............ 3.5.4.8.3.2........78 GDI-1365............ 3.5.4.8.3.2........78 GDI-1366............ 3.5.4.8.3.2........78 GDI-1367............ 3.5.4.8.3.2........78 GDI-1368............ 3.5.4.8.3.2........78 GDI-1369............ 3.5.4.8.3.2........78 GDI-1370............ 3.5.4.8.3.2........78 GDI-1371............ 3.5.4.8.3.2........78 GDI-1373............ 3.5.4.8.3.3........79 GDI-1374............ 3.5.4.8.3.3........79 GDI-1383............ 3.5.4.9..............79 GDI-1389............ 3.5.4.9.1.1........80 GDI-1390............ 3.5.4.9.1.1........80 GDI-1391............ 3.5.4.9.1.1........80 GDI-1393............ 3.5.4.9.1.2........81

GDI-1394 ............3.5.4.9.1.2 ....... 81 GDI-1395 ............3.5.4.9.1.2 ....... 81 GDI-1396 ............3.5.4.9.1.2 ....... 81 GDI-1397 ............3.5.4.9.1.2 ....... 81 GDI-1399 ............3.5.4.9.1.2 ....... 81 GDI-1400 ............3.5.4.9.1.2 ....... 81 GDI-1401 ............3.5.4.9.1.2 ....... 81 GDI-1402 ............3.5.4.9.1.2 ....... 81 GDI-1403 ............3.5.4.9.1.2 ....... 81 GDI-1405 ............3.5.4.9.1.3 ....... 81 GDI-1411 ............3.5.4.9.2.1 ....... 81 GDI-1412 ............3.5.4.9.2.1 ....... 81 GDI-1413 ............3.5.4.9.2.1 ....... 81 GDI-1415 ............3.5.4.9.2.2 ....... 82 GDI-1416 ............3.5.4.9.2.2 ....... 82 GDI-1417 ............3.5.4.9.2.2 ....... 82 GDI-1418 ............3.5.4.9.2.2 ....... 82 GDI-1419 ............3.5.4.9.2.2 ....... 82 GDI-1420 ............3.5.4.9.2.2 ....... 82 GDI-1421 ............3.5.4.9.2.2 ....... 82 GDI-1422 ............3.5.4.9.2.2 ....... 82 GDI-1423 ............3.5.4.9.2.2 ....... 82 GDI-1425 ............3.5.4.9.2.3 ....... 82 GDI-1431 ............3.5.4.9.3.1 ....... 83 GDI-1432 ............3.5.4.9.3.1 ....... 83 GDI-1433 ............3.5.4.9.3.1 ....... 83 GDI-1435 ............3.5.4.9.3.2 ....... 83 GDI-1436 ............3.5.4.9.3.2 ....... 83 GDI-1437 ............3.5.4.9.3.2 ....... 83 GDI-1438 ............3.5.4.9.3.2 ....... 83 GDI-1439 ............3.5.4.9.3.2 ....... 83 GDI-1441 ............3.5.4.9.3.2 ....... 83 GDI-1443 ............3.5.4.9.3.2 ....... 83 GDI-1444 ............3.5.4.9.3.2 ....... 83 GDI-1445 ............3.5.4.9.3.2 ....... 83 GDI-1446 ............3.5.4.9.3.2 ....... 83 GDI-1448 ............3.5.4.9.3.3 ....... 84 GDI-1454 ............3.5.4.9.4.1 ....... 84 GDI-1455 ............3.5.4.9.4.1 ....... 84 GDI-1456 ............3.5.4.9.4.1 ....... 84 GDI-1458 ............3.5.4.9.4.2 ....... 84 GDI-1459 ............3.5.4.9.4.2 ....... 84 GDI-1460 ............3.5.4.9.4.2 ....... 84 GDI-1461 ............3.5.4.9.4.2 ....... 84 GDI-1462 ............3.5.4.9.4.2 ....... 84 GDI-1463 ............3.5.4.9.4.2 ....... 84 GDI-1464 ............3.5.4.9.4.2 ....... 84 GDI-1465 ............3.5.4.9.4.2 ....... 84 GDI-1466 ............3.5.4.9.4.2 ....... 84 GDI-1468 ............3.5.4.9.4.3 ....... 85 GDI-1472 ............3.5.4.10 ........... 85 GDI-1473 ............3.5.4.10 ........... 85 GDI-1474 ............3.5.4.10 ........... 85 GDI-1475 ............3.5.4.10 ........... 85 GDI-1476 ............3.5.4.10.1.1 ..... 86 GDI-1477 ............3.5.4.10 ........... 85 GDI-1483 ............3.5.4.10.1.1 ..... 86

GDI-1484 ............ 3.5.4.10.1.1 ......86 GDI-1486 ............ 3.5.4.10.1.1 ......86 GDI-1487 ............ 3.5.4.10.1.1 ......86 GDI-1488 ............ 3.5.4.10.1.1 ......86 GDI-1489 ............ 3.5.4.10.1.1 ......86 GDI-1490 ............ 3.5.4.10.1.1 ......86 GDI-1491 ............ 3.5.4.10.1.1 ......86 GDI-1492 ............ 3.5.4.10.1.1 ......86 GDI-1493 ............ 3.5.4.10.1.1 ......86 GDI-1495 ............ 3.5.4.10.1.2 ......87 GDI-1496 ............ 3.5.4.10.1.2 ......87 GDI-1497 ............ 3.5.4.10.1.2 ......87 GDI-1498 ............ 3.5.4.10.1.2 ......87 GDI-1499 ............ 3.5.4.10.1.2 ......87 GDI-1500 ............ 3.5.4.10.1.2 ......87 GDI-1501 ............ 3.5.4.10.1.2 ......87 GDI-1503 ............ 3.5.4.10.1.3 ......88 GDI-1504 ............ 3.5.4.10.1.3 ......88 GDI-1509 ............ 3.5.4.10.2.1 ......88 GDI-1510 ............ 3.5.4.10.2.1 ......88 GDI-1512 ............ 3.5.4.10.2.1 ......88 GDI-1513 ............ 3.5.4.10.2.1 ......88 GDI-1514 ............ 3.5.4.10.2.1 ......88 GDI-1515 ............ 3.5.4.10.2.1 ......88 GDI-1516 ............ 3.5.4.10.2.1 ......88 GDI-1517 ............ 3.5.4.10.2.1 ......88 GDI-1518 ............ 3.5.4.10.2.1 ......88 GDI-1519 ............ 3.5.4.10.2.1 ......88 GDI-1521 ............ 3.5.4.10.2.2 ......89 GDI-1522 ............ 3.5.4.10.2.2 ......89 GDI-1523 ............ 3.5.4.10.2.2 ......89 GDI-1524 ............ 3.5.4.10.2.2 ......89 GDI-1525 ............ 3.5.4.10.2.2 ......89 GDI-1526 ............ 3.5.4.10.2.2 ......89 GDI-1528 ............ 3.5.4.10.2.3 ......89 GDI-1529 ............ 3.5.4.10.2.3 ......89 GDI-1536 ............ 3.5.4.10.3 .........90 GDI-1538 ............ 3.5.4.10.3.1 ......90 GDI-1539 ............ 3.5.4.10.3.1 ......90 GDI-1541 ............ 3.5.4.10.3.1 ......90 GDI-1542 ............ 3.5.4.10.3.1 ......90 GDI-1543 ............ 3.5.4.10.3.1 ......90 GDI-1544 ............ 3.5.4.10.3.1 ......90 GDI-1545 ............ 3.5.4.10.3.1 ......90 GDI-1546 ............ 3.5.4.10.3.1 ......90 GDI-1547 ............ 3.5.4.10.3.1 ......90 GDI-1548 ............ 3.5.4.10.3.1 ......90 GDI-1550 ............ 3.5.4.10.3.2 ......90 GDI-1551 ............ 3.5.4.10.3.2 ......90 GDI-1552 ............ 3.5.4.10.3.2 ......90 GDI-1553 ............ 3.5.4.10.3.2 ......90 GDI-1554 ............ 3.5.4.10.3.2 ......90 GDI-1555 ............ 3.5.4.10.3.2 ......90 GDI-1556 ............ 3.5.4.10.3.2 ......90 GDI-1558 ............ 3.5.4.10.3.3 ......91 GDI-1562 ............ 3.5.4.11 ............92 GDI-1567 ............ 3.5.4.11.1 .........92

AS250


Date: 23/06/2009 of 281


GDI-1568............ 3.5.4.11.1.........92 GDI-1569............ 3.5.4.11.1.........92 GDI-1570............ 3.5.4.11.1.........92 GDI-1571............ 3.5.4.11.1.........92 GDI-1572............ 3.5.4.11.1.........92 GDI-1574............ 3.5.4.11.2.........93 GDI-1575............ 3.5.4.11.2.........93 GDI-1576............ 3.5.4.11.2.........93 GDI-1577............ 3.5.4.11.2.........93 GDI-1578............ 3.5.4.11.2.........93 GDI-1579............ 3.5.4.11.2.........93 GDI-1580............ 3.5.4.11.2.........93 GDI-1581............ 3.5.4.11.2.........93 GDI-1582............ 3.5.4.11.2.........93 GDI-1584............ 3.5.4.11.3.........94 GDI-1586............ 3.5.4.12............94 GDI-1587............ 3.5.4.12............94 GDI-1588............ 3.5.4.12............94 GDI-1589............ 3.5.4.12............94 GDI-1592............ 3.5.4.12.1.........94 GDI-1593............ 3.5.4.12.1.........94 GDI-1594............ 3.5.4.12.1.........94 GDI-1595............ 3.5.4.12.1.........94 GDI-1596............ 3.5.4.12.1.........94 GDI-1597............ 3.5.4.12.1.........94 GDI-1599............ 3.5.4.12.2.........95 GDI-1600............ 3.5.4.12.2.........95 GDI-1601............ 3.5.4.12.2.........95 GDI-1602............ 3.5.4.12.2.........95 GDI-1603............ 3.5.4.12.2.........95 GDI-1604............ 3.5.4.12.2.........95 GDI-1605............ 3.5.4.12.2.........95 GDI-1606............ 3.5.4.12.2.........95 GDI-1608............ 3.5.4.12.3.........95 GDI-1609............ 3.5.4.12.3.........95 GDI-1612............ 3.5.4.13.1.........96 GDI-1613............ 3.5.4.13.1.........96 GDI-1615............ 3.5.4.13.1.........96 GDI-1620............ 3.5.4.13.2.........97 GDI-1623............ 3.5.4.13.3.........97 GDI-1624............ 3.5.4.13.3.........97 GDI-1630............ 3.5.4.13.4.1......98 GDI-1632............ 3.5.4.13.4.2......98 GDI-1634............ 3.5.4.13.4.2......98 GDI-1635............ 3.5.4.13.4.2......98 GDI-1636............ 3.5.4.13.4.2......98 GDI-1638............ 3.5.4.13.4.3......99 GDI-1639............ 3.5.4.13.4.3......99 GDI-1644............ 3.5.4.13.5.1......99 GDI-1646............ 3.5.4.13.5.1......99 GDI-1647............ 3.5.4.13.5.1......99 GDI-1649............ 3.5.4.13.5.2......99 GDI-1650............ 3.5.4.13.5.2......99 GDI-1652............ 3.5.4.13.5.3......99 GDI-1653............ 3.5.4.13.5.3......99 GDI-1661............ 3.5.4.14............99 GDI-1663............ 3.5.4.14.1.........99

GDI-1664 ............3.5.4.14.1 ........ 99 GDI-1665 ............3.5.4.14.1 ........ 99 GDI-1666 ............3.5.4.14.1 ........ 99 GDI-1667 ............3.5.4.14.1 ........ 99 GDI-1668 ............3.5.4.14.1 ........ 99 GDI-1669 ............3.5.4.14.1 ........ 99 GDI-1672 ............3.5.4.14.1.1 ..... 100 GDI-1673 ............3.5.4.14.1.1 ..... 100 GDI-1674 ............3.5.4.14.1.1 ..... 100 GDI-1675 ............3.5.4.14.1.1 ..... 100 GDI-1677 ............3.5.4.14.1.1 ..... 100 GDI-1678 ............3.5.4.14.1.1 ..... 100 GDI-1679 ............3.5.4.14.1.1 ..... 100 GDI-1680 ............3.5.4.14.1.1 ..... 100 GDI-1681 ............3.5.4.14.1.1 ..... 100 GDI-1682 ............3.5.4.14.1.1 ..... 100 GDI-1683 ............3.5.4.14.1.1 ..... 100 GDI-1684 ............3.5.4.14.1.1 ..... 100 GDI-1685 ............3.5.4.14.1.1 ..... 100 GDI-1687 ............3.5.4.14.1.1 ..... 100 GDI-1689 ............3.5.4.14.1.2 ..... 101 GDI-1690 ............3.5.4.14.1.2 ..... 101 GDI-1691 ............3.5.4.14.1.2 ..... 101 GDI-1692 ............3.5.4.14.1.2 ..... 101 GDI-1694 ............3.5.4.14.1.3 ..... 102 GDI-1695 ............3.5.4.14.1.3 ..... 102 GDI-1696 ............3.5.4.14.1.3 ..... 102 GDI-1697 ............3.5.4.14.1.3 ..... 102 GDI-1699 ............3.5.4.14.1.4 ..... 102 GDI-1700 ............3.5.4.14.1.4 ..... 102 GDI-1701 ............3.5.4.14.1.4 ..... 102 GDI-1703 ............3.5.4.14.2 ........ 102 GDI-1704 ............3.5.4.14.2 ........ 102 GDI-1707 ............3.5.4.14.2.1 ..... 103 GDI-1708 ............3.5.4.14.2.1 ..... 103 GDI-1709 ............3.5.4.14.2.1 ..... 103 GDI-1710 ............3.5.4.14.2.1 ..... 103 GDI-1712 ............3.5.4.14.2.2 ..... 103 GDI-1713 ............3.5.4.14.2.2 ..... 103 GDI-1714 ............3.5.4.14.2.2 ..... 103 GDI-1715 ............3.5.4.14.2.2 ..... 103 GDI-1717 ............3.5.4.14.2.3 ..... 103 GDI-1720 ............3.5.4.14.2.4 ..... 103 GDI-1721 ............3.5.4.14.2.4 ..... 103 GDI-1722 ............3.5.4.14.2.4 ..... 103 GDI-1724 ............3.5.4.14.2.5 ..... 104 GDI-1725 ............3.5.4.14.2.5 ..... 104 GDI-1726 ............3.5.4.14.2.5 ..... 104 GDI-1727 ............3.5.4.14.2.5 ..... 104 GDI-1729 ............3.5.4.14.2.6 ..... 104 GDI-1730 ............3.5.4.14.2.6 ..... 104 GDI-1732 ............3.5.4.14.2.7 ..... 104 GDI-1733 ............3.5.4.14.2.7 ..... 104 GDI-1734 ............3.5.4.14.2.7 ..... 104 GDI-1736 ............3.5.4.14.2.8 ..... 104 GDI-1737 ............3.5.4.14.2.8 ..... 104 GDI-1738 ............3.5.4.14.2.8 ..... 104

GDI-1739 ............ 3.5.4.14.2.8 ......104 GDI-1741 ............ 3.5.4.14.2.9 ......104 GDI-1742 ............ 3.5.4.14.2.9 ......104 GDI-1744 ............ 3.5.4.15 ............105 GDI-1745 ............ 3.5.4.15 ............105 GDI-1746 ............ 3.5.4.15 ............105 GDI-1747 ............ 3.5.4.15 ............105 GDI-1750 ............ 3.5.4.15.1 .........105 GDI-1751 ............ 3.5.4.15.1 .........105 GDI-1754 ............ 3.5.4.15.1.1 ......105 GDI-1755 ............ 3.5.4.15.1.1 ......105 GDI-1756 ............ 3.5.4.15.1.1 ......105 GDI-1757 ............ 3.5.4.15.1.1 ......105 GDI-1758 ............ 3.5.4.15.1.1 ......105 GDI-1759 ............ 3.5.4.15.1.1 ......105 GDI-1760 ............ 3.5.4.15.1.1 ......105 GDI-1761 ............ 3.5.4.15.1.1 ......105 GDI-1763 ............ 3.5.4.15.1.2 ......106 GDI-1764 ............ 3.5.4.15.1.2 ......106 GDI-1765 ............ 3.5.4.15.1.2 ......106 GDI-1766 ............ 3.5.4.15.1.2 ......106 GDI-1767 ............ 3.5.4.15.1.2 ......106 GDI-1768 ............ 3.5.4.15.1.2 ......106 GDI-1770 ............ 3.5.4.15.1.2 ......106 GDI-1771 ............ 3.5.4.15.1.2 ......106 GDI-1772 ............ 3.5.4.15.1.2 ......106 GDI-1773 ............ 3.5.4.15.1.2 ......106 GDI-1775 ............ 3.5.4.15.1.3 ......106 GDI-1776 ............ 3.5.4.15.1.3 ......106 GDI-1778 ............ 3.5.4.15.1.4 ......106 GDI-1780 ............ 3.5.4.15.2 .........107 GDI-1783 ............ 3.5.4.15.2.1 ......107 GDI-1784 ............ 3.5.4.15.2.1 ......107 GDI-1785 ............ 3.5.4.15.2.1 ......107 GDI-1786 ............ 3.5.4.15.2.1 ......107 GDI-1787 ............ 3.5.4.15.2.1 ......107 GDI-1788 ............ 3.5.4.15.2.1 ......107 GDI-1789 ............ 3.5.4.15.2.1 ......107 GDI-1790 ............ 3.5.4.15.2.1 ......107 GDI-1792 ............ 3.5.4.15.2.2 ......107 GDI-1793 ............ 3.5.4.15.2.2 ......107 GDI-1794 ............ 3.5.4.15.2.2 ......107 GDI-1795 ............ 3.5.4.15.2.2 ......107 GDI-1796 ............ 3.5.4.15.2.2 ......107 GDI-1797 ............ 3.5.4.15.2.2 ......107 GDI-1798 ............ 3.5.4.15.2.2 ......107 GDI-1800 ............ 3.5.4.15.2.2 ......107 GDI-1801 ............ 3.5.4.15.2.2 ......107 GDI-1802 ............ 3.5.4.15.2.2 ......107 GDI-1803 ............ 3.5.4.15.2.2 ......107 GDI-1805 ............ 3.5.4.15.2.3 ......108 GDI-1806 ............ 3.5.4.15.2.3 ......108 GDI-1808 ............ 3.5.4.15.3 .........108 GDI-1811 ............ 3.5.4.15.3.1 ......108 GDI-1812 ............ 3.5.4.15.3.1 ......108 GDI-1813 ............ 3.5.4.15.3.1 ......108 GDI-1814 ............ 3.5.4.15.3.1 ......108

AS250


Date: 23/06/2009 of 281


GDI-1815............ 3.5.4.15.3.1......108 GDI-1816............ 3.5.4.15.3.1......108 GDI-1817............ 3.5.4.15.3.1......108 GDI-1818............ 3.5.4.15.3.1......108 GDI-1819............ 3.5.4.15.3.1......108 GDI-1820............ 3.5.4.15.3.1......108 GDI-1821............ 3.5.4.15.3.1......108 GDI-1823............ 3.5.4.15.3.2......109 GDI-1824............ 3.5.4.15.3.2......109 GDI-1825............ 3.5.4.15.3.2......109 GDI-1826............ 3.5.4.15.3.2......109 GDI-1827............ 3.5.4.15.3.2......109 GDI-1828............ 3.5.4.15.3.2......109 GDI-1829............ 3.5.4.15.3.2......109 GDI-1830............ 3.5.4.15.3.2......109 GDI-1831............ 3.5.4.15.3.2......109 GDI-1832............ 3.5.4.15.3.2......109 GDI-1833............ 3.5.4.15.3.2......109 GDI-1834............ 3.5.4.15.3.2......109 GDI-1836............ 3.5.4.15.3.3......110 GDI-1837............ 3.5.4.15.3.3......110 GDI-1839............ 3.5.4.15.3.4......110 GDI-1840............ 3.5.4.15.3.4......110 GDI-1841............ 3.5.4.15.3.4......110 GDI-1842............ 3.5.4.15.3.4......110 GDI-1843............ 3.5.4.15.3.4......110 GDI-1844............ 3.5.4.15.3.4......110 GDI-1845............ 3.5.4.15.3.4......110 GDI-1846............ 3.5.4.15.3.4......110 GDI-1848............ 3.5.4.15.3.5......110 GDI-1849............ 3.5.4.15.3.5......110 GDI-1850............ 3.5.4.15.3.5......110 GDI-1851............ 3.5.4.15.3.5......110 GDI-1853............ 3.5.4.15.3.5......110 GDI-1854............ 3.5.4.15.3.5......110 GDI-1855............ 3.5.4.15.3.5......110 GDI-1857............ 3.5.4.15.3.6......111 GDI-1858............ 3.5.4.15.3.6......111 GDI-1864............ 3.5.4.16............111 GDI-1869............ 3.5.4.16.2.1......112 GDI-1872............ 3.5.4.16.2.2......113 GDI-1875............ 3.5.4.16.2.3......113 GDI-1877............ 3.5.4.16.2.4......113 GDI-1880............ 3.5.4.16.3.1......113 GDI-1882............ 3.5.4.16.3.2......113 GDI-1884............ 3.5.4.16.3.3......114 GDI-1885............ 3.5.4.16.3.3......114 GDI-1887............ 3.5.4.16.3.3......114 GDI-1891............ 3.5.4.16.3.4......115 GDI-1892............ 3.5.4.16.3.4......115 GDI-1893............ 3.5.4.16.3.4......115 GDI-1896............ 3.5.4.16.3.5......115 GDI-1897............ 3.5.4.16.3.5......115 GDI-1898............ 3.5.4.16.3.5......115 GDI-1902............ 3.5.4.16.4.1......116 GDI-1904............ 3.5.4.16.4.1......116 GDI-1907............ 3.5.4.16.4.2......117

GDI-1910 ............3.5.4.16.4.3 ..... 117 GDI-1913 ............3.5.4.16.4.4 ..... 118 GDI-1915 ............3.5.4.16.5 ........ 118 GDI-1917 ............3.5.4.16.5.1 ..... 118 GDI-1918 ............3.5.4.16.5.1 ..... 118 GDI-1920 ............3.5.4.16.5.2 ..... 119 GDI-1921 ............3.5.4.16.5.2 ..... 119 GDI-1922 ............3.5.4.16.5.2 ..... 119 GDI-1923 ............3.5.4.16.5.2 ..... 119 GDI-1932 ............3.5.4.16.5.3 ..... 119 GDI-1934 ............3.5.4.16.5.3 ..... 119 GDI-1935 ............3.5.4.16.5.3 ..... 119 GDI-1937 ............3.5.4.16.5.4 ..... 120 GDI-1939 ............3.5.4.16.5.4 ..... 120 GDI-1941 ............3.5.4.16.5.5 ..... 121 GDI-1943 ............3.5.4.16.5.6 ..... 121 GDI-1944 ............3.5.4.16.5.6 ..... 121 GDI-1946 ............3.5.4.16.5.6 ..... 121 GDI-1948 ............3.5.4.16.5.6 ..... 121 GDI-1949 ............3.5.4.16.5.6 ..... 121 GDI-1951 ............3.5.4.16.5.7 ..... 123 GDI-1953 ............3.5.4.16.5.8 ..... 123 GDI-1955 ............3.5.4.16.5.9 ..... 123 GDI-1958 ............3.5.4.16.6.1 ..... 123 GDI-1959 ............3.5.4.16.6.1 ..... 123 GDI-1962 ............3.5.4.16.6.2 ..... 124 GDI-1964 ............3.5.4.16.6.3 ..... 124 GDI-1966 ............3.5.4.16.6.4 ..... 124 GDI-1968 ............3.5.4.16.6.5 ..... 124 GDI-2099 ............3.5.5.1 ............. 125 GDI-2100 ............3.5.5.1 ............. 125 GDI-2101 ............3.5.5.1 ............. 125 GDI-2102 ............3.5.5.1 ............. 125 GDI-2103 ............3.5.5.1 ............. 125 GDI-2104 ............3.5.5.1 ............. 125 GDI-2105 ............3.5.5.1 ............. 125 GDI-2107 ............3.5.5.2 ............. 126 GDI-2108 ............3.5.5.2 ............. 126 GDI-2109 ............3.5.5.2 ............. 126 GDI-2110 ............3.5.5.2 ............. 126 GDI-2111 ............3.5.5.2 ............. 126 GDI-2112 ............3.5.5.2 ............. 126 GDI-2113 ............3.5.5.2 ............. 126 GDI-2114 ............3.5.5.2 ............. 126 GDI-2115 ............3.5.5.2 ............. 126 GDI-2116 ............3.5.5.2 ............. 126 GDI-2117 ............3.5.5.2 ............. 126 GDI-2119 ............3.5.5.3 ............. 128 GDI-2120 ............3.5.5.3 ............. 128 GDI-2121 ............3.5.5.3 ............. 128 GDI-2122 ............3.5.5.3 ............. 128 GDI-2123 ............3.5.5.3 ............. 128 GDI-2124 ............3.5.5.3 ............. 128 GDI-2126 ............3.5.5.4 ............. 128 GDI-2127 ............3.5.5.4 ............. 128 GDI-2128 ............3.5.5.4 ............. 128 GDI-2129 ............3.5.5.4 ............. 128

GDI-2131 ............ 3.5.5.5 ..............129 GDI-2132 ............ 3.5.5.5 ..............129 GDI-2133 ............ 3.5.5.5 ..............129 GDI-2134 ............ 3.5.5.5 ..............129 GDI-2136 ............ 3.5.5.6 ..............129 GDI-2137 ............ 3.5.5.6 ..............129 GDI-2138 ............ 3.5.5.6 ..............129 GDI-2139 ............ 3.5.5.6 ..............129 GDI-2140 ............ 3.5.5.6 ..............129 GDI-2141 ............ 3.5.5.6 ..............129 GDI-2146 ............ 3.5.6 .................130 GDI-2148 ............ 3.5.6 .................130 GDI-2150 ............ 3.5.6 .................130 GDI-2151 ............ 3.5.6 .................130 GDI-2152 ............ 3.5.6 .................130 GDI-2153 ............ 3.5.6 .................130 GDI-2155 ............ 3.5.6.1 ..............131 GDI-2157 ............ 3.5.6.1 ..............131 GDI-2159 ............ 3.5.6.2 ..............132 GDI-2161 ............ 3.5.6.2 ..............132 GDI-2163 ............ 3.5.7 .................133 GDI-2167 ............ 3.5.8.1 ..............133 GDI-2168 ............ 3.5.8.1 ..............133 GDI-2169 ............ 3.5.8.1 ..............133 GDI-2170 ............ 3.5.8.1 ..............133 GDI-2171 ............ 3.5.8.1 ..............133 GDI-2172 ............ 3.5.8.1 ..............133 GDI-2179 ............ 3.5.8.1.2 ...........134 GDI-2180 ............ 3.5.8.1.2 ...........134 GDI-2183 ............ 3.5.8.1.2 ...........134 GDI-2185 ............ 3.5.8.1.2 ...........134 GDI-2187 ............ 3.5.8.1.3 ...........134 GDI-2188 ............ 3.5.8.1.3 ...........134 GDI-2191 ............ 3.5.8.2.1 ...........134 GDI-2192 ............ 3.5.8.2.1 ...........134 GDI-2194 ............ 3.5.8.2.2 ...........134 GDI-2195 ............ 3.5.8.2.2 ...........134 GDI-2196 ............ 3.5.8.2.2 ...........134 GDI-2197 ............ 3.5.8.2.2 ...........134 GDI-2198 ............ 3.5.8.2.2 ...........134 GDI-2200 ............ 3.5.8.2.3 ...........135 GDI-2203 ............ 3.5.8.2.4.1 ........135 GDI-2204 ............ 3.5.8.2.4.1 ........135 GDI-2205 ............ 3.5.8.2.4.1 ........135 GDI-2206 ............ 3.5.8.2.4.1 ........135 GDI-2208 ............ 3.5.8.2.4.2 ........136 GDI-2210 ............ 3.5.8.2.4.3 ........136 GDI-2215 ............ 3.5.8.2.5.1 ........136 GDI-2216 ............ 3.5.8.2.5.1 ........136 GDI-2217 ............ 3.5.8.2.5.1 ........136 GDI-2218 ............ 3.5.8.2.5.1 ........136 GDI-2219 ............ 3.5.8.2.5.1 ........136 GDI-2222 ............ 3.5.8.2.5.2 ........137 GDI-2223 ............ 3.5.8.2.5.2 ........137 GDI-2224 ............ 3.5.8.2.5.2 ........137 GDI-2225 ............ 3.5.8.2.5.2 ........137 GDI-2226 ............ 3.5.8.2.5.2 ........137

AS250


Date: 23/06/2009 of 281


GDI-2227............ 3.5.8.2.5.2........137 GDI-2228............ 3.5.8.2.5.2........137 GDI-2231............ 3.5.8.2.5.3........139 GDI-2232............ 3.5.8.2.5.3........139 GDI-2233............ 3.5.8.2.5.3........139 GDI-2235............ 3.5.8.2.5.4........139 GDI-2239............ 3.5.9.1..............141 GDI-2240............ 3.5.9.1..............141 GDI-2242............ 3.5.9.2..............141 GDI-2243............ 3.5.9.2..............141 GDI-2245............ 3.5.9.3..............141 GDI-2252............ 3.6.2.................142 GDI-2254............ 3.6.2.................142 GDI-2255............ 3.6.2.................142 GDI-2262............ 3.6.3.1..............143 GDI-2263............ 3.6.3.1..............143 GDI-2264............ 3.6.3.1..............143 GDI-2265............ 3.6.3.1..............143 GDI-2266............ 3.6.3.1..............143 GDI-2267............ 3.6.3.1..............143 GDI-2268............ 3.6.3.1..............143 GDI-2270............ 3.6.3.1..............143 GDI-2272............ 3.6.3.1.1...........144 GDI-2273............ 3.6.3.1.1...........144 GDI-2274............ 3.6.3.1.1...........144 GDI-2275............ 3.6.3.1.1...........144 GDI-2280............ 3.6.3.2.1...........145 GDI-2281............ 3.6.3.2.1...........145 GDI-2282............ 3.6.3.2.1...........145 GDI-2283............ 3.6.3.2.1...........145 GDI-2285............ 3.6.3.2.1...........145 GDI-2286............ 3.6.3.2.1...........145 GDI-2287............ 3.6.3.2.1...........145 GDI-2289............ 3.6.3.2.1...........145 GDI-2291............ 3.6.3.2.1...........145 GDI-2292............ 3.6.3.2.1...........145 GDI-2293............ 3.6.3.2.1...........145 GDI-2294............ 3.6.3.2.1...........145 GDI-2295............ 3.6.3.2.1...........145 GDI-2296............ 3.6.3.2.1...........145 GDI-2297............ 3.6.3.2.1...........145 GDI-2299............ 3.6.3.2.1...........145 GDI-2300............ 3.6.3.2.1...........145 GDI-2302............ 3.6.3.2.2...........147 GDI-2303............ 3.6.3.2.2...........147 GDI-2305............ 3.6.3.2.2...........147 GDI-2307............ 3.6.3.2.2...........147 GDI-2308............ 3.6.3.2.2...........147 GDI-2309............ 3.6.3.2.2...........147 GDI-2311............ 3.6.3.2.2...........147 GDI-2312............ 3.6.3.2.2...........147 GDI-2314............ 3.6.3.2.3...........148 GDI-2315............ 3.6.3.2.3...........148 GDI-2319............ 3.6.3.3.1...........148 GDI-2321............ 3.6.3.3.1...........148 GDI-2322............ 3.6.3.3.1...........148 GDI-2323............ 3.6.3.3.1...........148

GDI-2324 ............3.6.3.3.1 .......... 148 GDI-2325 ............3.6.3.3.1 .......... 148 GDI-2327 ............3.6.3.3.1 .......... 148 GDI-2328 ............3.6.3.3.1 .......... 148 GDI-2329 ............3.6.3.3.1 .......... 148 GDI-2330 ............3.6.3.3.1 .......... 148 GDI-2331 ............3.6.3.3.1 .......... 148 GDI-2332 ............3.6.3.3.1 .......... 148 GDI-2333 ............3.6.3.3.1 .......... 148 GDI-2334 ............3.6.3.3.1 .......... 148 GDI-2335 ............3.6.3.3.1 .......... 148 GDI-2336 ............3.6.3.3.1 .......... 148 GDI-2337 ............3.6.3.3.1 .......... 148 GDI-2340 ............3.6.3.3.2 .......... 150 GDI-2341 ............3.6.3.3.2 .......... 150 GDI-2342 ............3.6.3.3.2 .......... 150 GDI-2343 ............3.6.3.3.2 .......... 150 GDI-2344 ............3.6.3.3.2 .......... 150 GDI-2345 ............3.6.3.3.2 .......... 150 GDI-2346 ............3.6.3.3.2 .......... 150 GDI-2347 ............3.6.3.3.2 .......... 150 GDI-2348 ............3.6.3.3.2 .......... 150 GDI-2350 ............3.6.3.3.3 .......... 151 GDI-2351 ............3.6.3.3.3 .......... 151 GDI-2352 ............3.6.3.3.3 .......... 151 GDI-2353 ............3.6.3.3.3 .......... 151 GDI-2354 ............3.6.3.3.3 .......... 151 GDI-2355 ............3.6.3.3.3 .......... 151 GDI-2364 ............3.6.3.4 ............. 152 GDI-2365 ............3.6.3.4 ............. 152 GDI-2366 ............3.6.3.4 ............. 152 GDI-2367 ............3.6.3.4 ............. 152 GDI-2368 ............3.6.3.4 ............. 152 GDI-2369 ............3.6.3.4 ............. 152 GDI-2371 ............3.6.3.5 ............. 153 GDI-2372 ............3.6.3.5 ............. 153 GDI-2373 ............3.6.3.5 ............. 153 GDI-2375 ............3.6.3.5 ............. 153 GDI-2377 ............3.6.3.6 ............. 153 GDI-2378 ............3.6.3.6 ............. 153 GDI-2379 ............3.6.3.6 ............. 153 GDI-2380 ............3.6.3.6 ............. 153 GDI-2381 ............3.6.3.6 ............. 153 GDI-2382 ............3.6.3.6 ............. 153 GDI-2385 ............3.6.3.7 ............. 154 GDI-2386 ............3.6.3.7 ............. 154 GDI-2387 ............3.6.3.7 ............. 154 GDI-2388 ............3.6.3.7 ............. 154 GDI-2389 ............3.6.3.7 ............. 154 GDI-2390 ............3.6.3.7 ............. 154 GDI-2391 ............3.6.3.7 ............. 154 GDI-2392 ............3.6.3.7 ............. 154 GDI-2393 ............3.6.3.7 ............. 154 GDI-2394 ............3.6.3.7 ............. 154 GDI-2395 ............3.6.3.7 ............. 154 GDI-2396 ............3.6.3.7 ............. 154 GDI-2399 ............3.6.3.8.1 .......... 155

GDI-2400 ............ 3.6.3.8.1 ...........155 GDI-2401 ............ 3.6.3.8.1 ...........155 GDI-2403 ............ 3.6.3.8.2 ...........156 GDI-2404 ............ 3.6.3.8.2 ...........156 GDI-2408 ............ 3.6.3.8.3 ...........156 GDI-2409 ............ 3.6.3.8.3 ...........156 GDI-2410 ............ 3.6.3.8.3 ...........156 GDI-2411 ............ 3.6.3.8.3 ...........156 GDI-2412 ............ 3.6.3.8.3 ...........156 GDI-2413 ............ 3.6.3.8.3 ...........156 GDI-2414 ............ 3.6.3.8.3 ...........156 GDI-2415 ............ 3.6.3.8.3 ...........156 GDI-2416 ............ 3.6.3.8.3 ...........156 GDI-2418 ............ 3.6.3.8.3 ...........156 GDI-2419 ............ 3.6.3.8.3 ...........156 GDI-2420 ............ 3.6.3.8.3 ...........156 GDI-2421 ............ 3.6.3.8.3 ...........156 GDI-2422 ............ 3.6.3.8.3 ...........156 GDI-2423 ............ 3.6.3.8.3 ...........156 GDI-2424 ............ 3.6.3.8.3 ...........156 GDI-2426 ............ 3.6.3.9 ..............157 GDI-2428 ............ 3.6.4 .................158 GDI-2429 ............ 3.6.4 .................158 GDI-2431 ............ 3.6.5 .................158 GDI-2434 ............ 3.6.6.1 ..............158 GDI-2436 ............ 3.6.6.2 ..............158 GDI-2437 ............ 3.6.6.2 ..............158 GDI-2439 ............ 3.6.6.3 ..............158 GDI-2440 ............ 3.6.6.3 ..............158 GDI-2455 ............ 4.1.1 .................160 GDI-2457 ............ 4.1.2 .................160 GDI-2459 ............ 4.1.3 .................160 GDI-2462 ............ 4.1.4 .................160 GDI-2464 ............ 4.1.5 .................160 GDI-2470 ............ 4.2.1 .................160 GDI-2481 ............ 4.2.1 .................160 GDI-2516 ............ 4.2.1 .................160 GDI-2517 ............ 4.2.1 .................160 GDI-2518 ............ 4.2.1 .................160 GDI-2663 ............ 4.2.2.2.1 ...........162 GDI-2742 ............ 4.2.2.2.2 ...........162 GDI-2785 ............ 4.2.2.2.2 ...........162 GDI-2937 ............ 4.2.2.2.3 ...........164 GDI-2938 ............ 4.2.2.2.3 ...........164 GDI-2939 ............ 4.2.2.2.3 ...........164 GDI-2940 ............ 4.2.2.2.3 ...........164 GDI-2941 ............ 4.2.2.2.3 ...........164 GDI-2976 ............ 4.2.3.1 ..............165 GDI-2977 ............ 4.2.3.1 ..............165 GDI-2979 ............ 4.2.3.2 ..............165 GDI-2980 ............ 4.2.3.2 ..............165 GDI-2987 ............ 4.3.1 .................165 GDI-2988 ............ 4.3.1 .................165 GDI-2989 ............ 4.3.1 .................165 GDI-2991 ............ 4.3.2.1 ..............166 GDI-3054 ............ 4.4.4 .................168 GDI-3055 ............ 4.4.4 .................168

AS250


Date: 23/06/2009 of 281


GDI-3057............ 4.4.4.1..............168 GDI-3058............ 4.4.4.1..............168 GDI-3059............ 4.4.4.1..............168 GDI-3061............ 4.4.4.2..............177 GDI-3062............ 4.4.4.2..............177 GDI-3063............ 4.4.4.2..............177 GDI-3065............ 4.4.4.3..............178 GDI-3069............ 4.4.4.3..............178 GDI-3072............ 4.4.4.3..............178 GDI-3077............ 4.5.1.1..............181 GDI-3079............ 4.5.1.2..............182 GDI-3081............ 4.5.1.2..............182 GDI-3083............ 4.5.1.3..............182 GDI-3085............ 4.5.1.3..............182 GDI-3087............ 4.5.1.3..............182 GDI-3089............ 4.5.1.4..............182 GDI-3090............ 4.5.1.4..............182 GDI-3091............ 4.5.1.4..............182 GDI-3093............ 4.5.1.5..............184 GDI-3097............ 4.5.1.6.1...........184 GDI-3099............ 4.5.1.6.2...........184 GDI-3101............ 4.5.1.7..............185 GDI-3105............ 4.5.2.1..............185 GDI-3107............ 4.5.2.2..............185 GDI-3109............ 4.5.2.3..............186 GDI-3159............ 4.5.2.4..............186 GDI-3160............ 4.5.2.4..............186 GDI-3162............ 4.5.2.4.1...........187 GDI-3164............ 4.5.2.4.2...........187 GDI-3166............ 4.5.3.................187 GDI-3227............ 4.5.4.................188 GDI-3230............ 4.5.5.................189 GDI-3231............ 4.5.5.................189 GDI-3313............ 4.5.6.................190 GDI-3314............ 4.5.6.................190 GDI-3317............ 4.5.7.................191 GDI-3319............ 4.5.7.................191 GDI-3321............ 4.5.7.................191 GDI-3322............ 4.5.7.................191 GDI-3325............ 4.5.8.................191 GDI-3330............ 5.1.1.1..............194 GDI-3332............ 5.1.1.2..............194 GDI-3334............ 5.1.1.3..............194 GDI-3336............ 5.1.2.................194 GDI-3338............ 5.1.2.1..............195 GDI-3340............ 5.1.2.2..............195 GDI-3541............ 5.1.2.3..............197 GDI-3543............ 5.1.3.................197 GDI-3545............ 5.1.4.................197 GDI-3547............ 5.2....................198 GDI-3590............ 5.2....................198 GDI-3591............ 5.2....................198 GDI-3594............ 5.2.1.1..............199 GDI-3595............ 5.2.1.1..............199 GDI-3596............ 5.2.1.1..............199 GDI-3597............ 5.2.1.1..............199 GDI-3600............ 5.2.1.2..............199

GDI-3601 ............5.2.1.2 ............. 199 GDI-3602 ............5.2.1.2 ............. 199 GDI-3603 ............5.2.1.2 ............. 199 GDI-3605 ............5.2.1.3 ............. 199 GDI-3607 ............5.2.1.3 ............. 199 GDI-3626 ............5.2.1.4 ............. 199 GDI-3628 ............5.2.1.5 ............. 200 GDI-3629 ............5.2.1.5 ............. 200 GDI-3630 ............5.2.1.5 ............. 200 GDI-3631 ............5.2.1.5 ............. 200 GDI-3632 ............5.2.1.5 ............. 200 GDI-3634 ............5.2.1.6 ............. 201 GDI-3635 ............5.2.1.6 ............. 201 GDI-3637 ............5.2.1.7 ............. 201 GDI-3641 ............5.2.2.1 ............. 201 GDI-3642 ............5.2.2.1 ............. 201 GDI-3643 ............5.2.2.1 ............. 201 GDI-3644 ............5.2.2.1 ............. 201 GDI-3645 ............5.2.2.1 ............. 201 GDI-3646 ............5.2.2.1 ............. 201 GDI-3647 ............5.2.2.1 ............. 201 GDI-3651 ............5.2.2.2.1 .......... 202 GDI-3653 ............5.2.2.2.1 .......... 202 GDI-3654 ............5.2.2.2.1 .......... 202 GDI-3775 ............5.2.2.2.2 .......... 202 GDI-3776 ............5.2.2.2.2 .......... 202 GDI-3780 ............5.2.2.2.3 .......... 205 GDI-3781 ............5.2.2.2.3 .......... 205 GDI-3784 ............5.2.3 ................ 206 GDI-3788 ............5.2.4.1.1 .......... 206 GDI-3790 ............5.2.4.1.2 .......... 206 GDI-3792 ............5.2.4.1.3 .......... 206 GDI-3794 ............5.2.4.1.4 .......... 206 GDI-3796 ............5.2.4.1.5 .......... 206 GDI-3798 ............5.2.4.1.6 .......... 207 GDI-3800 ............5.2.4.1.7 .......... 207 GDI-3803 ............5.2.4.2.1 .......... 207 GDI-3805 ............5.2.4.2.2 .......... 207 GDI-3808 ............5.2.4.3.1 .......... 208 GDI-3810 ............5.2.4.3.2 .......... 208 GDI-3812 ............5.2.4.3.3 .......... 208 GDI-3813 ............5.2.4.3.3 .......... 208 GDI-3814 ............5.2.4.3.3 .......... 208 GDI-3841 ............5.2.4.3.3 .......... 208 GDI-3843 ............5.2.4.3.4 .......... 208 GDI-3846 ............5.2.4.3.4 .......... 208 GDI-3850 ............5.2.4.3.5 .......... 209 GDI-3851 ............5.2.4.3.5 .......... 209 GDI-3852 ............5.2.4.3.5 .......... 209 GDI-3853 ............5.2.4.3.5 .......... 209 GDI-3854 ............5.2.4.3.5 .......... 209 GDI-3855 ............5.2.4.3.5 .......... 209 GDI-3856 ............5.2.4.3.5 .......... 209 GDI-3862 ............5.2.4.4.1 .......... 212 GDI-3863 ............5.2.4.4.1 .......... 212 GDI-3864 ............5.2.4.4.1 .......... 212 GDI-3866 ............5.2.4.4.2 .......... 212

GDI-3867 ............ 5.2.4.4.2 ...........212 GDI-3871 ............ 5.2.4.4.3.1 ........213 GDI-3872 ............ 5.2.4.4.3.1 ........213 GDI-3874 ............ 5.2.4.4.3.1 ........213 GDI-3878 ............ 5.2.4.4.3.2 ........213 GDI-3879 ............ 5.2.4.4.3.2 ........213 GDI-3880 ............ 5.2.4.4.3.2 ........213 GDI-3885 ............ 5.2.4.4.4 ...........215 GDI-3888 ............ 5.2.4.4.5 ...........217 GDI-3889 ............ 5.2.4.4.5 ...........217 GDI-3897 ............ 5.2.4.4.6 ...........218 GDI-3898 ............ 5.2.4.4.6 ...........218 GDI-3904 ............ 5.2.4.4.7 ...........222 GDI-3908 ............ 5.2.4.4.8 ...........224 GDI-3911 ............ 5.2.4.4.9 ...........224 GDI-3912 ............ 5.2.4.4.9 ...........224 GDI-3915 ............ 5.2.4.4.10 .........225 GDI-3916 ............ 5.2.4.4.10 .........225 GDI-3919 ............ 5.2.4.4.11 .........226 GDI-3920 ............ 5.2.4.4.11 .........226 GDI-3924 ............ 5.2.4.4.12 .........227 GDI-3926 ............ 5.2.4.4.12 .........227 GDI-3938 ............ 5.2.5 .................229 GDI-3939 ............ 5.2.5 .................229 GDI-3940 ............ 5.2.5 .................229 GDI-3941 ............ 5.2.5 .................229 GDI-3969 ............ 5.2.6 .................229 GDI-3970 ............ 5.2.6 .................229 GDI-3971 ............ 5.2.6 .................229 GDI-3974 ............ 6.1 ....................231 GDI-4108 ............ 7.1 ....................238 GDI-4386 ............ 3.5.5.2 ..............126 GDI-4387 ............ 3.5.5.2 ..............126 GDI-4388 ............ 3.5.5.4 ..............128 GDI-4390 ............ 3.5.5.4 ..............128 GDI-4391 ............ 3.5.5.2 ..............126 GDI-4392 ............ 3.5.5.2 ..............126 GDI-4393 ............ 3.5.5.5 ..............129 GDI-4394 ............ 3.5.8.1 ..............133 GDI-4395 ............ 3.5.8.2.2 ...........134 GDI-4396 ............ 3.5.8.2.2 ...........134 GDI-4397 ............ 3.5.8.2.5.1 ........136 GDI-4398 ............ 3.5.8.2.5.1 ........136 GDI-4399 ............ 3.5.8.2.5.1 ........136 GDI-4400 ............ 3.5.8.2.5.1 ........136 GDI-4402 ............ 3.5.8.2.5.2 ........137 GDI-4404 ............ 3.5.8.2.5.2 ........137 GDI-4405 ............ 4.5.7 .................191 GDI-4406 ............ 4.5.7 .................191 GDI-4411 ............ 4.5.2.2 ..............185 GDI-4413 ............ 4.5.2.2 ..............185 GDI-4414 ............ 4.5.2.2 ..............185 GDI-4506 ............ 3.1.3.1 ..............14 GDI-4575 ............ 4.5.8 .................191 GDI-4576 ............ 5.2.4.3.3 ...........208 GDI-4577 ............ 5.2.4.3.5 ...........209 GDI-4579 ............ 5.2.4.3.5 ...........209

AS250


Date: 23/06/2009 of 281


GDI-4580............ 5.2.4.3.5...........209 GDI-4581............ 5.2.4.3.5...........209 GDI-4582............ 5.2.4.3.5...........209 GDI-4583............ 5.2.4.3.3...........208 GDI-4585............ 5.2.4.4.5...........217 GDI-4587............ 5.2.4.4.5...........217 GDI-4588............ 5.2.4.4.6...........218 GDI-4589............ 4.5.2.1..............185 GDI-4590............ 3.5.2.1.1...........44 GDI-4592............ 3.5.2.1.1...........44 GDI-4599............ 4.4.4.................168 GDI-4600............ 4.4.4.................168 GDI-4601............ 4.4.4.................168 GDI-4602............ 4.4.4.................168 GDI-4603............ 4.4.4.................168 GDI-4604............ 4.4.4.................168 GDI-4605............ 4.4.4.................168 GDI-4606............ 4.4.4.................168 GDI-4607............ 4.4.4.................168 GDI-4608............ 4.4.4.................168 GDI-4613............ 3.5.2.1.1.4........50 GDI-4614............ 3.5.2.1.1.4........50 GDI-4615............ 3.5.2.1.1.4........50 GDI-4617............ 3.5.2.1.1.4........50 GDI-4618............ 3.5.2.1.1.4........50 GDI-4619............ 3.5.2.1.1.4........50 GDI-4623............ 3.5.2.1.1.5........51 GDI-4624............ 3.5.2.1.1.5........51 GDI-4625............ 3.5.2.1.1.5........51 GDI-4626............ 3.5.2.1.1.5........51 GDI-4628............ 3.5.2.1.1.5........51 GDI-4630............ 3.5.2.1.1.6........52 GDI-4631............ 3.5.2.1.1.6........52 GDI-4643............ 3.5.2.1.1...........44 GDI-4645............ 3.5.2.1.1.1........47 GDI-4646............ 3.5.2.1.1.1........47 GDI-4648............ 3.5.2.1.1.2........49 GDI-4649............ 3.5.2.1.1.2........49 GDI-4650............ 3.5.2.1.1.4........50 GDI-4651............ 3.5.2.1.1.6........52 GDI-4652............ 3.5.2.1.1.4........50 GDI-4653............ 3.5.2.1.1.4........50 GDI-4655............ 3.5.2.1.1.5........51 GDI-4658............ 3.6.3.3.4...........151 GDI-4659............ 3.6.3.3.4...........151 GDI-4661............ 3.6.3.3.4...........151 GDI-4662............ 3.6.3.3.4...........151 GDI-4663............ 3.6.3.3.5...........151 GDI-4670............ 3.5.2.1.1.1........47 GDI-4671............ 3.5.2.1.1.1........47 GDI-4672............ 3.5.2.1.1.1........47 GDI-4673............ 3.5.2.1.1...........44 GDI-4674............ 3.5.2.1.1...........44 GDI-4675............ 3.5.1.................43 GDI-4678............ 3.5.2.1.1.4........50 GDI-4679............ 3.5.2.1.1.1........47 GDI-4680............ 3.5.2.1.1.1........47

GDI-4681 ............3.5.2.1.1.4 ....... 50 GDI-4682 ............3.5.4.1 ............. 57 GDI-4686 ............3.5.4.9.4.3 ....... 85 GDI-4687 ............3.5.4.9.2.2 ....... 82 GDI-4689 ............3.5.4.9.4.2 ....... 84 GDI-4690 ............3.5.4.11.3 ........ 94 GDI-4692 ............3.5.4.10.1.3 ..... 88 GDI-4693 ............3.5.4.10.1.2 ..... 87 GDI-4694 ............3.5.4.10.1.2 ..... 87 GDI-4695 ............3.5.4.10.2.3 ..... 89 GDI-4696 ............3.5.4.10.1.2 ..... 87 GDI-4697 ............3.5.4.10.2.2 ..... 89 GDI-4700 ............4.4.4.3 ............. 178 GDI-4701 ............4.4.4.3 ............. 178 GDI-4705 ............3.5.2.1.1.2 ....... 49 GDI-4706 ............3.5.4.9.3.2 ....... 83 GDI-4707 ............3.5.4.9.1.2 ....... 81 GDI-4708 ............3.5.4.9.2.2 ....... 82 GDI-4709 ............3.5.4.9.4.2 ....... 84 GDI-4710 ............3.5.4.11.2 ........ 93 GDI-4712 ............4.4.4.3 ............. 178 GDI-4718 ............3.1.3.5 ............. 15 GDI-4719 ............3.1.3.5 ............. 15 GDI-4720 ............3.1.3.5 ............. 15 GDI-4721 ............3.5.2.1.1 .......... 44 GDI-4723 ............3.1.3.3 ............. 14 GDI-4724 ............3.1.3.3 ............. 14 GDI-4725 ............3.1.3.4 ............. 15 GDI-4728 ............3.1.3.6 ............. 15 GDI-4731 ............3.5.4.5 ............. 69 GDI-4732 ............3.5.4.5 ............. 69 GDI-4735 ............3.5.4.5 ............. 69 GDI-4736 ............3.5.4.5 ............. 69 GDI-4737 ............3.5.4.5 ............. 69 GDI-4740 ............3.5.4.6 ............. 71 GDI-4742 ............3.5.4.6 ............. 71 GDI-4743 ............3.5.4.6 ............. 71 GDI-4744 ............3.5.4.6 ............. 71 GDI-4745 ............3.5.4.6 ............. 71 GDI-4759 ............11.1 ................. 256 GDI-4761 ............11.2 ................. 256 GDI-4765 ............11.4 ................. 257 GDI-4766 ............11.3 ................. 257 GDI-4767 ............3.5.5.2 ............. 126 GDI-4768 ............3.5.5.2 ............. 126 GDI-4775 ............4.3.2.2 ............. 166 GDI-4778 ............4.3.2.2.1 .......... 166 GDI-4799 ............4.3.2.2.2 .......... 167 GDI-4800 ............4.3.2.2.3 .......... GDI-4805 ............4.3.2.3 ............. 167 GDI-4808 ............3.5.4.10 ........... 85 GDI-4809 ............3.5.4.10.1.1 ..... 86 GDI-4810 ............3.5.4.10.2.2 ..... 89 GDI-4839 ............3.5.2.1.1 .......... 44 GDI-4840 ............3.5.2.1.1 .......... 44 GDI-4844 ............3.5.2.1.1.1 ....... 47 GDI-4845 ............3.5.2.1.1.2 ....... 49

GDI-4846 ............ 3.5.2.1.1.2 ........49 GDI-4847 ............ 3.5.2.1.1.4 ........50 GDI-4851 ............ 3.5.2.1.1.4 ........50 GDI-5423 ............ 5.2.1.4 ..............199 GDI-5460 ............ 3.5.4.10.3.4.3 ...91 GDI-5461 ............ 3.5.4.10.3.4.1 ...91 GDI-5462 ............ 3.5.4.10.3.4.2 ...91 GDI-5464 ............ 3.5.4.10.3.4.2 ...91 GDI-5465 ............ 3.5.4.10.3.4.2 ...91 GDI-5466 ............ 3.5.4.10.3.4.3 ...91 GDI-5468 ............ 3.5.4.12.4 .........95 GDI-5469 ............ 3.5.4.12.4 .........95 GDI-5476 ............ 3.3.1.4 ..............36 GDI-5535 ............ 3.1.3.1 ..............14 GDI-5539 ............ 3.1.3.7 ..............16 GDI-5543 ............ 4.3.2.4 ..............167 GDI-5547 ............ 3.5.2.1.1 ...........44

AS250


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DOCUMENT CHANGE DETAILS

ISSUE CHANGE AUTHORITY CLASS RELEVANT INFORMATION/INSTRUCTIONS 01 DIVAS / AS250 First issue 02 AS250 GDIR Update after Internal Review

AS250


Date: 23/06/2009 of 281


DISTRIBUTION LIST

Astrium AS250 Avionics Distribution Astrium AS250 Avionics DistributionBARADAT Pierre LEBREDONCHEL Jerome X

BISCARROS Didier MARCILLE Herve X

BONNEAU Celine MARTINEZ Alain

CAZALS Serge X CHUPIN Stephane X

COSCULLUELA Valerie X PALOUS Jean-Claude X

DEFENDINI Ange X POQUET GOURDON X

FOURNE Brigitte X PREVOT Sylvain X

GALLAND Philippe X TABOUELLE Alain X

GENTY Patrick X TEOFILI Fabrice

GILLOT Bernard X THIBAUD Pierre X

GUIONNET Pascal X JOUFFROY Frederic X

FAVREAU Michel X AS250 Documentation X

LEBLOND Philippe AS250 Configuration X

Astrium Product Policy Distribution Astrium AstroTerra DistributionBARABOTTI Laurent X ALARY Sébastien X

LEMERCIER Christophe X BELLEAU Patrick

PITZ Wolfgang BORDE Jacques

BOUSQUET Christophe X

Astrium MPC DAREL Anthony X

ALCINDOR Peter HAMEURY Olivier X

BALDWIN Robert PONCIN Thierry X

BARRIERE Jacques SIGUIER Michel

BERTHELIER David VIVIER Jean Maurice

CAMILLERI Stephane ASTROTERRA Documentation X

DEBUS Volker ASTROTERRA Configuration X

JANVIER Michel

OESTERLE Eduard

SCHWAB Armin

Corporate use Project Limited Controlled Configured

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X X

AS250


Date: 23/06/2009 of 281


ECE Seosat Project Distribution Astrium CSO Project DistributionBORGES ALEJO Andrés X CORREGE Alain

SANZ CUESTA Juan Andrés X GARCES Sylvain

CORTES David X JACOMOND Alain

LOPEZ Amador LOCHE Didier

BOURGEAL Silvia X LUZURIER Jérôme

GIL Miguel Angel X MONTEIL Denis

LIZONDO Jose Luis SIBILLA Christian

DE MIGUEL Elena Diana TOURNIER Thierry X

PALACIOS Cristina VILLEFRANCHE Patrice X

SEOSAT Documentation X CSO Documentation

SEOSAT Configuration X