c5545 boosterpack schematic - texas instruments translated to 3.3v and connected to clr# pin of u27...

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5 5 4 4 3 3 2 2 1 1 D D C C B B A A PAGE CONTENTS POWER FLOW DIAGRAM TABLE OF CONTENTS 01 REVISION HISTORY 02 03 04 REV C VER 1.4 C5545 BoosterPack TABLE OF CONTENTS BLOCK DIAGRAM POWER ANALYSIS I2C TREE 06 05 POWER UP SEQUENCE 07 08 C5545 PART A C5545 POWER 09 10 11 OLED , uSD CARD & SPI FLASH AUDIO CODEC CC2650 MCU FT2232 13 14 POWER 15 LAUCHPAD HEADERS 12 Title Size Document Number Rev Date: Sheet of Project : Designed for TI by Mistral Solutions Pvt Ltd BOOST5545ULP MS_TI_C5545BP_SCH_REVC_PRODUCTION C TABLE OF CONTENTS C Friday, September 16, 2016 15 1 Title Size Document Number Rev Date: Sheet of Project : Designed for TI by Mistral Solutions Pvt Ltd BOOST5545ULP MS_TI_C5545BP_SCH_REVC_PRODUCTION C TABLE OF CONTENTS C Friday, September 16, 2016 15 1 Title Size Document Number Rev Date: Sheet of Project : Designed for TI by Mistral Solutions Pvt Ltd BOOST5545ULP MS_TI_C5545BP_SCH_REVC_PRODUCTION C TABLE OF CONTENTS C Friday, September 16, 2016 15 1

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5

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1

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C C

B B

A A

PAGE CONTENTS

POWER FLOW DIAGRAM

TABLE OF CONTENTS01

REVISION HISTORY02

03

04

REV C

VER 1.4

C5545 BoosterPack

TABLE OF CONTENTS

BLOCK DIAGRAM

POWER ANALYSIS

I2C TREE

06

05

POWER UP SEQUENCE

07

08 C5545 PART A

C5545 POWER09

10

11

OLED , uSD CARD & SPI FLASH

AUDIO CODEC

CC2650 MCU

FT223213

14

POWER15

LAUCHPAD HEADERS12

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

TABLE OF CONTENTS

C

Friday, September 16, 2016 151

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

TABLE OF CONTENTS

C

Friday, September 16, 2016 151

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

TABLE OF CONTENTS

C

Friday, September 16, 2016 151

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C C

B B

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INITIAL DRAFT Mistral Design Team

AUTHORDATEVER # DESCRIPTION OF CHANGES

0.1

REVISION HISTORY

27th APR 2016

0.2 3rd MAY 2016

APPROVED BY

AJIT MB

U19 changed to 4 bit Level translator, RESET_ANDlevel translated to 3.3V and connected to CLR# pin of U27 Mistral Design Team AJIT MB

Mistral Design Team AJIT MBREVIEWED & BASELINED 6th MAY 20161.0

Boosterpack Pin Map Diagram added & Launchpad Header section moved to new sheet

Mistral Design Team AJIT MB1.1 25th AUG 2016

REVIEWED & BASELINED Mistral Design Team AJIT MB1.2 25th AUG 2016

1.4REVIEWED & BASELINED Mistral Design Team AJIT MB

1.3 16th SEP 2016 BoosterPack Pin Map Color code updated as per the customer review comments

Mistral Design Team AJIT MB

16th SEP 2016

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

REVISION HISTORY

C

Friday, September 16, 2016 152

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

REVISION HISTORY

C

Friday, September 16, 2016 152

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

REVISION HISTORY

C

Friday, September 16, 2016 152

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4

3

3

2

2

1

1

D D

C C

B B

A A

BLOCK DIAGRAM

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

BLOCK DIAGRAM

C

Friday, September 16, 2016 153

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

BLOCK DIAGRAM

C

Friday, September 16, 2016 153

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

BLOCK DIAGRAM

C

Friday, September 16, 2016 153

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4

3

3

2

2

1

1

D D

C C

B B

A A

POWER DISTRIBUTION DIAGRAM

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

POWER DISTRIBUTION DIAGRAM

C

Friday, September 16, 2016 154

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

POWER DISTRIBUTION DIAGRAM

C

Friday, September 16, 2016 154

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

POWER DISTRIBUTION DIAGRAM

C

Friday, September 16, 2016 154

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5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

POWER ANALYSIS

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

POWER ANALYSIS

C

Friday, September 16, 2016 155

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

POWER ANALYSIS

C

Friday, September 16, 2016 155

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

POWER ANALYSIS

C

Friday, September 16, 2016 155

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4

3

3

2

2

1

1

D D

C C

B B

A A

POWER UP SEQUENCE

Note:-180ms delay added for OLED Reset to meet the specifications

USB POWER SEQUENCE

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

POWER UP SEQUENCE

C

Friday, September 16, 2016 156

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

POWER UP SEQUENCE

C

Friday, September 16, 2016 156

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

POWER UP SEQUENCE

C

Friday, September 16, 2016 156

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

I2C TREE

Audio Codec 0x18

I2C DEVICES 7 BIT ADDRESS

OLED Display

0x40 ,0x41, 0x44, 0x48INA Devices

I2C ADDRESS TABLE

0x3C

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

I2C TREE

C

Friday, September 16, 2016 157

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

I2C TREE

C

Friday, September 16, 2016 157

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

I2C TREE

C

Friday, September 16, 2016 157

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

RESET CIRCUIT

Micro USB Device

C5545 PART A

RTC POWERDSP CLOCK SELECTION

USB POWER LOAD SWITCH

Jumper

Internal

External ClockNo Jumper

Jumper

CLOCK Selection

RESET#_AND

PWRST

DSP_USB_DMDSP_USB_DP

LDO_EN

BG_CAP

CONN_USB_VBUS

DSP_RTC_XO

DSP_RTC_XIDSP_RTC_XO

DSP_RTC_XI

CVDDRTC

USB_MXI

DSP_USB_DPDSP_USB_DM

DSP_USB_VBUS

USB_R1USB_VSSREF

USB_VDDOSCUSB_VDDOSC

USB_VDDOSCINT0#INT1#

DSP_EMU1DSP_EMU0

CLKOUTDSP_CLKSEL

DSP_I2C_SCLDSP_I2C_SDA

DSP_SPI_CS3

DSP_SPI_CS3

CVDDRTC

CVDDRTC

DSP_CLKSEL

DSP_USB_VBUSCONN_USB_VBUS

GPAIN3GPAIN2GPAIN1

DSP_SD0_CMD

USB_MXI

USB_MXO

USB_MXO

DGND

VCC1V8VCC1V8

DGND

DGND

DGNDDGND

DGND GNDUSB1

DGND

DGND GNDUSB1

DGND

DC_5V_IN

VCC1V8

DGND

DGND

VCC1V8VCC1V8

AGND

VCC1V8

DGND

DGNDDGND

VCC3V3_USB

DGND

VCC1V8VCC1V3

VCC1V8

DGND

DGNDDGND

DGND DGND

VCC3V3_USB_LDSWVCC3V3VCC3V3_USB

DGND

DGND

AGND

VCC1V3_USB_EN

VCC1V8

DGND

DGND

DGND

VCC1V8

VSSRTC

VSSRTC

USB_VSSOSC

USB_VSSOSC

USB_VSSOSC

LP_RSTOUT 12

DSP_I2C_SCL 9,10,14

DSP_I2C_SDA 9,10,14

DSP_SPI_TX 11,14DSP_SPI_RX 11,14

DSP_SPI_CS2 11DSP_SPI_CS0 14

DSP_UART_TX 9DSP_SPI_CLK 11,14

DSP_UART_RX 9DSP_SDCD 14

LED3 10

DSP_I2S2_CLK 10DSP_I2S2_FS 10

DSP_I2S2_RX 10DSP_I2S2_DX 10

SWITCH2 10SWITCH3 10SWITCH4 10

LED1 10LED2 10

DSP_TRSTN13DSP_TCK13DSP_TMS13

DSP_TDI13

DSP_12MHz10

DSP_SD0_DAT014DSP_SD0_DAT114DSP_SD0_DAT214DSP_SD0_DAT314DSP_SD0_CMD14DSP_SD0_CLK14

DSP_I2S1_CLK12

DSP_I2S1_FS12

DSP_I2S1_RX12

DSP_I2S1_DX12

CC2650_PWRMGT111CC2650_PWRMGT211

LP_BUFF_SOFT_RST 121V3_PWRGD 15

VCC_SEL_LDOI9

DSP_TDO13

CC2650_RESET# 11

RESET#_AND10,11,13,14

FT2232_RTS_RESET 13

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

C5545 PART A

C

Friday, September 16, 2016 158

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

C5545 PART A

C

Friday, September 16, 2016 158

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

C5545 PART A

C

Friday, September 16, 2016 158

R14 0E_1%

R118 0E_1%

R94 10K_1%

R142

6.2K_1%

DNI

C145

1uF

FL5

600E

1 2

D11SS416

2 1

C47

0.1uF

R123 0EDNI

C310.1uF

R20

4.7K

D9

TPD1E10B06DPY

21

C10.01uF

R124 0E

C51

10uF

R147 0E_1%DNI

R21

4.7K

R18

10K_1%

R134

10K_1%

R11 0E_1%

U25

TPS22913BYZVT

VOUTA1

VINA2

GND

B1

ONB2

C60

0.1uF

R1484.7K

R4100K

C30.1uF

R135

10K_1%

R5100K

R23

10K_1%

R17 10K_1%DNI

U24

TPS22913BYZVT

VOUTA1

VINA2

GND

B1

ONB2

C8 22pF

C156

22pF

U143

SN74LVC1G08

1

24

35

U1A

TMS320C5545AZQW 10

INT0B12

INT1C11

TDIB4

TDOD1

SCLB11

SDAD11

CLKINE12

CLKOUTC12

CLK_SELD12

RTC_XIF11

RTC_XOE11

RESETA11

TMSD3

TCKC1

TRSTF2

USB_MXIL9

USB_MXOK9

SD0_D0/I2S0_DX/GP[2]D5

SD0_D1/I2S0_RX/GP[3]G2

SD0_D2/GP[4]M3

SD0_D3/GP[5]G3

SD0_CMD/I2S0_FS/GP[1]J2

SD0_CLK/I2S0_CLK/GP[0]E5

SD1_D0/I2S1_DX/GP[8]L3

SD1_D1/I2S1_RX/GP[9]H3

SD1_D2/GP[10]M4

SD1_D3/GP[11]G5

SD1_CMD/I2S1_FS/GP[7]L4

SD1_CLK/I2S1_CLK/GP[6]H5

CVDDRTCD10

BG_CAPJ11

DSP_LDO_ENM12

USB_VBUSK5

USB_DPL6

USB_R1K7USB_DMM6

LCD_D[2]/GP[12]E2

LCD_D[3]/GP[13]E1

LCD_D[4]/GP[14]F1

LCD_D[5]/GP[15]G1

LCD_D[6]/GP[16]E3

LCD_D[7]/GP[17]J1

LCD_D[8]/I2S2_CLK/GP[18]/SPI_CLKH1

LCD_D[9]/I2S2_FS/GP[19]/SPI_CS0K1

LCD_D[10]/I2S2_RX/GP[20]/SPI_RXF5

LCD_D[11]/I2S2_DX/GP[27]/SPI_TXK2

LCD_D[12]/UART_RTS/GP[28]/I2S3_CLKJ3

LCD_D[13]/UART_CTS/GP[29]/I2S3_FSM1

LCD_D[14]/UART_RXD/GP[30]/I2S3_RXL1

LCD_D[15]/UART_TXD/GP[31]/I2S3_DXL2

LCD_EN_RDB/SPI_CLKA1

LCD_CS0_E0/SPI_CS0A2

LCD_RW_WRB_SPI_CS2B2

LCD_RS/SPI_CS3A3

LCD_D[0]/SPI_RXA4

LCD_D[1]/SPI_TXC2

GPAIN1F8

GPAIN2F10

GPAIN3J12

RSV0L12

RSV4H10

RSV5J10

RSV3K11

RSV17M5

EMU0B3

EMU1B1

USB_VSSREFH8

USB_VSSOSCM9

USB_VDDOSCK8

VSSRTCG12

DVDDRTCF12

D2

RB578VAM100TR

21

Y612.000MHz

1

42

3

R74.7K

C7 22pF

R117

10K_1%

R13 0E_1%

R84.7K

R10 0E_1%

R136

10K_1%

Y1

32.768 Khz

12

J1

CON_MUSB-B_5_F

VBUS1

D+3 D-2

ID4

SH1

6

GND5

SH49

SH38

SH2

7SH6

11

SH5

10

C157

22pF

J2

HDR_1X2

12

TP1SMD

R15 0E_1%

C4

0.1uF

R1100K

R371K

D-

D+

D8

TPD2EUSB30DRTR

3

21

R9210K_1%

C23 0.01uF

SW1

PTS820 J20M SMTR LFS

1 23 4

5 6

R16 0E_1%

R98 47E_1%

C48

0.1uF

R2100KC1580.01uF

R2220K_1%

R6710K_1%

C2

0.1uF

R12 0E_1%

R9 8.06K_1%

C5

10uF

C6

0.1uF

U26

SN74LVC1G11DCKR

1

2

34

5

6

FB1

120E

R196.8K_1%

C141

1uF

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

C5545 POWER

I2C LEVEL TRANSLATOR

UART JUMPER SELECTION

Launch Pad & CC2650

B/W Pin 1 & 3 FT2232 & C5545

Jumper Connected Devices

UART JUMPER SELECTION

B/W Pin 2 & 4

B/W Pin 1 & 2FT2232 & CC2650

B/W Pin 3 & 4Launch Pad & C5545

Header

JP2 & JP3

JP2 & JP3

JP2

JP3

JP2

JP3

B/W Pin 3 & 4

B/W Pin 1 & 2

I2C Address : 0x40

I2C Address : 0x48 I2C Address : 0x44

I2C Address : 0x41

USB_VDDA1P3

USB_VDD1P3

USB_VDDA3P3

USB_VDDPLL

I2C_LVL_EN

USB_VDD1P3

ANA_1V3

USB_VDDA3P3

USB_VDDPLLUSB_VDDA1P3

LDOI

3V3_I2C1_SDA

DGND

DGND

DSP_LDOOUSB_LDOO

ANA_LDOO

CVDD

DGND

CVDD

USB_LDOO

DGND

DSP_LDOO

DGND

ANA_1V3

DGNDDGND

DGND

DGND

DGND

VCC1V8 VCC3V3

VCC3V3

VCC3V3

DGND

DGND

CVDD

VCC3V3

DGND

DGND

DSP_DVDDIO

DSP_DVDDIO VCC1V8

DSP_DVDDIO

AGNDAGND

AGND

AGND

AGND

DGNDAGND

AGND

VCC1V3

DSP_LDOO

VCC1V3

USB_LDOO

ANA_LDOO

VCC1V3

VCC3V3_USB

VCC1V3_USB_EN

VCC1V8 VCC1V8

VCC1V8 VCC1V8

VCC3V3

DGND

DGND

VCC3V3_USB VCC3V3_USB_LDSW

VCC3V3

DGND

DGND

VCC1V8

VCC3V3

DGNDDGND

VCC3V3

DSP_I2C_SCL8,10,14

DSP_I2C_SDA8,10,14 3V3_I2C1_SDA 9,12

3V3_I2C1_SCL 9,12

FT2232_BUFF_UART_TX13

DSP_UART_RX8 LP_BUFF_UART_TX 12

LP_BUFF_UART_RX 12DSP_UART_TX8

FT2232_BUFF_UART_RX13

3V3_I2C1_SDA9,123V3_I2C1_SCL9,12 3V3_I2C1_SDA9,12

3V3_I2C1_SCL9,12

CC2650_UART_TX 11

CC2650_UART_RX 11

3V3_I2C1_SDA9,123V3_I2C1_SCL9,12

3V3_I2C1_SCL 9,123V3_I2C1_SDA 9,12

VCC_SEL_LDOI8

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

C5545 POWER

C

Friday, September 16, 2016 159

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

C5545 POWER

C

Friday, September 16, 2016 159

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

C5545 POWER

C

Friday, September 16, 2016 159

C17

0.1uF

C52

0.1uFC18

0.1uF

C10

0.01uF

JP3

HDR_2X2

1 23 4

C37

0.1uF

C35

1uF

R27

4.7K

C32

1uF

C9

1uF

R133 0E

C540.01uF

C26

0.01uF

C25

1uF

C20

10uF

C38

0.1uF

C22

10uF

FL6

600E

1 2

C12

0.01uF

R139

1E_1%

C28

0.01uF

FL4

600E

1 2

U30

INA219AIDCNR

VIN+

1

VIN-

2

GND3

VS4

SCL

5

SDA

6

A0

7

A1

8

C44

1uF

C49

0.1uF

C13

0.01uF

FL3

600E

1 2

FL1

600E

1 2

C29

0.01uF

C41

10uF

C45

0.1uF

C33

0.01uF

U4

INA219AIDCNR

VIN+

1VIN-

2

GND3

VS4

SCL

5SDA

6

A0

7A1

8

C46

0.1uF

U23

INA219AIDCNR

VIN+

1VIN-

2

GND3

VS4

SCL

5SDA

6

A0

7A1

8

FL2

600E

1 2

C530.01uF

C14

0.01uF

R128 0E

DNI

R137

1E_1%R1300E

DNI

C24

0.1uFC148

0.1uF

U5

INA219AIDCNR

VIN+

1VIN-

2

GND3

VS4

SCL

5SDA

6

A0

7A1

8

R129 0ER25

1E_1%

R24

1E_1%

C15

0.01uF

R38100K

R1310ER29 0E

R121100K

R36100K

C42

0.1uF

C36

0.1uF

U1B

TMS320C5545AZQW 10

CVDDA9

CVDDB5

CVDDB8

CVDDC6

CVDDE6

CVDDG7

CVDDJ9

DVDDIOB10

DVDDIOD2

DVDDIOH2

DVDDIOM2

VDDA_PLLE10

VDDA_ANAG11

USB_VDDPLLM7

USB_VDDA1P3K6

USB_VDDA3P3L7

USB_VDD1P3L5

USB_VDD1P3M8

LDOIG10

LDOIL10

LDOIL11

DSP_LDOOM11

USB_LDOOM10

ANA_LDOOH11

VSSA5

VSSA6

VSSA7

VSSA8

VSSA10

VSSA12

VSSB6

VSSB7

VSSB9

VSSC4

VSSC7

VSSC9

VSSF3

VSSF7

VSSG6

VSSG8

VSSK4

VSSA_PLLE8

VSSA_ANAH12

VSSA_ANAK12

USB_VSSA3P3H7

USB_VSS1P3H6

USB_VSSPLLL8

C16

0.01uF

R59100K

C43

0.1uF

C34

0.01uF

R132 0E

DNI

C11

0.01uF

JP2

HDR_2X2

1 23 4

C39

1uF

C30

0.1uF

R28

10K_1%

R350E

DNI

U6

TCA9517DGKR

VCCA

1

SCLA2

SDAA3

GND

4

EN5

SDAB6

SCLB7

VCCB

8

R26

4.7K

C27

0.01uF

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

AUDIO CODEC

Head phone

Stereo Line IN

Mic

SWITCHES & LEDs

GREEN GREENGREEN

I2C Address : 0x18

12MHz_AUD_MCLK

FLY_NFLY_P

VNEG

REF

IN3_RHP_MIC GPIO_AUD

IN1_LIN1_R

AVDD_1V8

MICBIAS_RMICBIAS

IN1_L

IN1_R

HPLHPR

GND_SENSE

GND_SENSE

MICBIAS

MIC

MIC

SWITCH2

12MHz_AUD_MCLKSTDBY_OSC1V8

SWITCH4SWITCH3

MICBIAS_R

MICBIAS_R

HPR

HPL

HP_MICMICBIAS

GND_SENSE

DGND DGND AUD_AGNDAUD_AGND

AUD_AGND DGND

VCC1V8

DGNDDGNDAUD_AGND

AUD_AGND

AUD_AGNDAUD_AGND

DGND DGND DGND

VCC1V8 VCC1V8 VCC1V8

DGND

VCC1V8

DGND

VCC1V8VCC1V8

VCC1V8

VCC3V3 VCC3V3 VCC3V3

AUD_AGND

DGND

AUD_AGND

DSP_I2S2_RX 8DSP_I2S2_DX 8

DSP_I2S2_CLK8DSP_I2S2_FS8

DSP_I2C_SDA8,9,14

RESET#_AND8,11,13,14

DSP_12MHz 8

SWITCH2 8SWITCH3 8SWITCH4 8

LED18 LED28 LED38

DSP_I2C_SCL8,9,14

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

AUDIO CODEC , SWITCHES & LEDs

C

Friday, September 16, 2016 1510

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

AUDIO CODEC , SWITCHES & LEDs

C

Friday, September 16, 2016 1510

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

AUDIO CODEC , SWITCHES & LEDs

C

Friday, September 16, 2016 1510

U9

TLV320AIC3206IRSBT

DVSS

1

DVSS

2

IOVSS

11

AVSS

21

EP

41

IOVDD

10

AVDD

29

DRVDD_HP

32

DVDD_CP

39

DVDD

40

RESET3

GPIO/MFP54

MCLK5

BCLK6

WCLK7

DIN/MFP18

DOUT/MFP29

SCLK/MFP312

MISO/MFP415

GND_SENSE28

DVSS_CP

37

SPI/SELECT16

IN1_L17

IN1_R18

IN2_L19

IN2_R20

REF22

MICBIAS23

IN3_L24

IN3_R25

VSYS

30

MICDET34

VNEG35

FLY_N36

FLY_P38

SDA/MOSI14 SCL/SSZ13

LOL26

LOR27

HPL31

HPR33

R5810K_1%

R138 2.7K

C76

0.1uF

C74

0.1uF

R47

10K_1%

C79 2.2uF

Q3

BSS138

3

1

2

R41 0E_1%

SW4

PTS820 J20M SMTR LFS

1 23 4

5 6

FB4

220E

12

R491K

C82

2.2uF

C96

0.1uF

R44 2.7K

R43 0E_1%

R5610K_1%

FB5

120E

LD1

SML-P11MTT86

2 1

Q2

BSS138

3

1

2

R501K

FB8

120E

SW2

PTS820 J20M SMTR LFS

1 23 4

5 6

LD2

SML-P11MTT86

2 1

R511K

C1500.1uF

LD3

SML-P11MTT86

2 1

R48 0E_1%

C75

10uF

R5410K_1%

MK1

CMC-2242PBL-A

12

Q1

BSS138

3

1

2 R5710K_1%

J6

CON_AUDIOJACK4_SJ-43514

4

3

2

1

R39 2.7K

C143 0.47uF

R5310K_1%

C132

0.1uF

C71 0.1uF

C73 0.1uF

C144 0.47uF

C69

10uF

C70

0.1uF

C830.1uF

R42 0E_1%

R46 0E_1%

SW3

PTS820 J20M SMTR LFS

1 23 4

5 6

C800.01uF

TP2SMD

C78

0.1uF

U10

12.00MHz

STANDBY1

GND

2

OUTPUT3V

DD

4

R5210K_1%

C81 10uF

J5

CON_AUDIOJACK4_SJ-43514

4

3

2

1

R451K

R40 0E_1%

C149 0.1uF

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

R91 and C140 forantenna matching

CC2650 MCU

JTAG HEADER

2.4GHz

X24M_P

X24M_N

X32K_Q1

X32K_Q2

CC2650_TDOCC2650_TDI

DCOUPL

X24M_NX24M_P

X32K_Q1X32K_Q2

CC2650_TMSCC2650_TCK

RF_PRF_N

RF_P

RF_N

CC2650_SPI_TX

CC2650_SPI_CS

CC2650_SPI_RXCC2650_SPI_SCK

CC2650_TMSCC2650_TCK

CC2650_TDICC2650_TDO

RESET_JTAG

RESET_NRESET_JTAG

DGND DGND

DGND

VCC1V8

DGND

VCC1V8_CC2650

DGND

VCC1V8_CC2650

DGND DGND

DGND DGND DGND

DGND

VCC1V8

DGND

VCC1V8

DGND

VCC1V8

CC2650_PWRMGT1 8CC2650_PWRMGT2 8

CC2650_UART_RX 9

CC2650_UART_TX 9

DSP_SPI_CS2 8DSP_SPI_CLK 8,14DSP_SPI_TX 8,14DSP_SPI_RX 8,14

RESET#_AND8,10,13,14CC2650_RESET#8

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

CC2650 MCU

C

Friday, September 16, 2016 1511

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

CC2650 MCU

C

Friday, September 16, 2016 1511

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

CC2650 MCU

C

Friday, September 16, 2016 1511

C85

0.1uF

C140

DNI

J12

HDR_2X5

246810

13579

R91 0E

C840.01uF

R14110K_1%

Y2

24.0000MHz

1

4 2

3

C87

0.1uF

C1371.2pF

Y3

32.768KHz

12

C95

1uF

C88

10uF

L315nH

R85 100E

C1461.2pF

C89

0.1uF

R65

10K_1%

C93 15pF

U11

CC2650F128RHBT

EP

33

DIO_06

DIO_17

DIO_28

DIO_39

DIO_410

DIO_515

DIO_616

DIO_720

DIO_821

DIO_922

DIO_1023

DIO_1124

DIO_1225

DIO_1326

DIO_1427

VDDS2

11

DCOUPL12

DCDC_SW

17

VDDS_DCDC

18

VDDS

28

VDDR

29

VDDR_RF

32

RF_P1

RF_N2

RX_TX3

X32K_Q14

X32K_Q25

JTAG_TMSC13

JTAG_TCKC14

RESET_N19

X24M_N30

X24M_P31

C94 15pF

U31

SN74LVC1G11DCKR

1

2

3 4

5

6

C139 12pFL4

2nH

C86

0.1uF

FL7

1.5KE

1 2

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

LAUNCH PAD HEADERS

SIGNAL DIRECTION SIGNAL DIRECTION

1A ------> 1B

2A <------ 2B

1A <------ 1B

2A <------ 2B

I2S1_BUFF_1DIR

LP_AUD_DINLP_AUD_DOUTLP_AUD_CLKLP_AUD_SYNC

LP_UART_TXLP_AUD_DOUTLP_UART_RXLP_AUD_DIN

I2S1_BUFF_1DIRI2S1_BUFF_2DIR

LP_3V3

LP_AUD_CLKLP_AUD_SYNC

I2S1_BUFF_2DIR

LP_SOFT_RST

LP_5V

LP_SOFT_RST

LP_GND

LP_UART_RXLP_UART_TX

LP_I2C_SDALP_I2C_SCL

LP_GND

DC_5V_IN

DGNDDGND

DGND DGND

DGND

VCC1V8 VCC3V3_LP

DGND

VCC1V8 VCC3V3_LPVCC1V8

DGNDDGND

VCC3V3_LP

DGND

VCC1V8

VCC3V3_LP

VCC3V3_LP

DGND

VCC1V8

DGND

DGND LP_GND

LP_BUFF_UART_TX 9DSP_I2S1_FS8

DSP_I2S1_CLK8DSP_I2S1_RX 8

3V3_I2C1_SDA93V3_I2C1_SCL9

LP_BUFF_SOFT_RST8

LP_RSTOUT 8

LP_BUFF_UART_RX 9DSP_I2S1_DX 8

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

LAUNCHPAD HEADERS

C

Friday, September 16, 2016 1512

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

LAUNCHPAD HEADERS

C

Friday, September 16, 2016 1512

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

LAUNCHPAD HEADERS

C

Friday, September 16, 2016 1512

R126

10K_1%

DNI

J8

RECP_2X10

135791113151719

2468101214161820

R127

10K_1%

R63 0E_1%

U12

SN74AVC4T245RSVR

VCCA

3

VCCB

2

GND1

10

GND2

11

1DIR4

2DIR5

1A16

1A27

2A18

2A29

1OE1

2OE16

1B115

1B214

2B113

2B212

FB6

120E

R6110K_1%

R6010K_1%

R6410K_1%

R6610K_1%

U13

SN74AVC4T245RSVR

VCCA

3

VCCB

2

GND1

10

GND2

11

1DIR4

2DIR5

1A16

1A27

2A18

2A29

1OE1

2OE16

1B115

1B214

2B113

2B212

D3

RB578VAM100TR

2 1

C99

0.1uF

R140100K

J7

RECP_2X10

135791113151719

2468101214161820

C100

0.1uFC97

0.1uF

C98

0.1uF

R62 0E_1%

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

Micro USB DEBUG

FT2232 JTAG/DEBUG

LEVEL TRANSLATOR

GREEN

SIGNAL DIRECTION SIGNAL DIRECTION

A ------> B 1A <------ 1B2A <------ 2B

TCKTDI

TMSTRSTN

TDO

12MHz_FT2232STDBY_OSC3V3

12MHz_FT2232

FT2232_USB_DPFT2232_USB_DM

FT2232_USB_VBUS

FT2232_REF

FT2232_EECSFT2232_EEDATA

FT2232_EECLK

RTCK FT2232_TCK

FT2232_TRSTN

DIS

SRST_N_OUT

PWR_DETSRST_N_IN

FT2232_RESET

FT2232_RESETPWR_RST

FT2232_EECSFT2232_EECLK

FT2232_DOFT2232_EEDATA

PWR_DET

PWR_RST

FT2232_USB_DPFT2232_USB_DM

PWRSAV#

FT2232_USB_VBUS

PWRSAV#

UNUSED_2B2

UNUSED_2B2

DGND

DGND

VCC3V3

DGND

DGND

DGND

DGNDGNDUSB2

DGND GNDUSB2

DGND

VCC1V8_FT2232

VCC1V8_FT2232

DGND

VPHY_FT2232

VPLL_FT2232

VPHY_FT2232VPLL_FT2232

DGND

DGND

VCC1V8_FT2232

DGND

DGND

DGND DGND

DGNDDGND

VCC1V8

DC_5V_IN

VCC1V8

DGND

DGND

VCC3V3VCC3V3

VCC3V3

VCC3V3

VCC3V3

VCC3V3

VCC3V3

VCC3V3

VCC3V3

DGND

DGND

VCC3V3

DGND

VCC3V3

DGND

VCC3V3

DGND

DGND

VCC3V3

DGND

DGND

DGND

VCC3V3

DGND

DGND

DGND

FT2232_TCK 13

FT2232_TMS 13FT2232_TRSTN 13

FT2232_TCK13

FT2232_TMS13FT2232_TRSTN13

DSP_TCK 8DSP_TDI 8DSP_TMS 8DSP_TRSTN 8

FT2232_UART_RX 13

FT2232_UART_TX 13

FT2232_UART_TX13 FT2232_BUFF_UART_TX 9 FT2232_UART_RX13 FT2232_BUFF_UART_RX 9DSP_TDO 8

FT2232_TDI 13FT2232_TDO 13

FT2232_TDI13

FT2232_TDO13

RESET#_AND_CLR#13

FT2232_RTS 13

FT2232_RTS13 FT2232_RTS_RESET 8 RESET#_AND 8,10,11,14RESET#_AND_CLR#13

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

FT2232 JTAG & UART

C

Friday, September 16, 2016 1513

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

FT2232 JTAG & UART

C

Friday, September 16, 2016 1513

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

FT2232 JTAG & UART

C

Friday, September 16, 2016 1513

C115

0.1uF

C131

0.1uF

C104

0.1uF

U19

SN74AVC4T245RSVR

VCCA

3

VCCB

2

GND1

10

GND2

11

1DIR4

2DIR5

1A16

1A27

2A18

2A29

1OE1

2OE16

1B115

1B214

2B113

2B212

C118 0.1uF

C130

0.1uF

R82 0E_1%

C107

0.1uF

FL9

220E

1 2

U18

SN74AVC8T245RHL

VCCA

1

DIR2

A13

A24

A35

A46

A57

A68

A79

A810

OE22

VCCB1

23

VCCB2

24

B121

B220

B319

B418

B517

B616

B715

B814

GND1

11

GND2

12

GND3

13

EP

25

R7447E_1%DNI

R99 10K_1%

R79

10K_1%

FL10

220E

1 2D4

RB578VAM100TR

2 1

C133 0.1uF

R7147E_1%

C119

0.1uF

U17

12.00MHz

STANDBY1

GND

2

OUTPUT3V

DD

4

C1513.3uF

C116 0.1uF

U16

AT93C46DY6-YH-T

CS1 SK2

DI3

DO4

ORG6

NC7

VCC

8GND

5

EP

9

R7547E_1%DNI

R8710K_1%

R89

47E_1%

R111

10K_1%

C112

0.1uF

R7810K_1%

R83

10K_1%

R144

10K_1%

R104

10K_1%

FB7

120E

R7710K_1%

C120 0.1uF

C113

0.1uF

R1434.7K

D-

D+

D7

TPD2EUSB30DRTR

3

21

R6947E_1%

U15

FT2232HL

OSCI2

OSCO3

VPHY

4

VPLL

9

VCORE

12

TEST13

RESET#14

SUSPEND#36

VCORE

37

VREGOUT

49

VREGIN

50

PWREN#60

EEDATA61

EECLK62

EECS63

VCCIO

20

VCCIO

31

VCCIO

42

VCCIO

56

VCORE

64

GND

1

GND

5

GND

11

GND

15

GND

25

GND

35

GND

47

GND

51

AGND

10

REF6

DM7

DP8

ADBUS016

ADBUS117

ADBUS218

ADBUS319

ADBUS421

ADBUS522

ADBUS623

ADBUS724

ACBUS026

ACBUS127

ACBUS228

ACBUS329

ACBUS430

ACBUS532

ACBUS633

ACBUS734

BDBUS038

BDBUS139

BDBUS240

BDBUS341

BDBUS443

BDBUS544

BDBUS645

BDBUS746

BCBUS048

BCBUS152

BCBUS253

BCBUS354

BCBUS455

BCBUS557

BCBUS658

BCBUS759

R76 12K_1%

RA9 0E1234 5

678

R80

10K_1%

C103

4.7uF

R7047E_1%

U27

SN74AUP1G74RSER

PRE1

CLR2

Q3

GND

4

Q5

D6

CLK7 V

CC

8

C1210.1uF

C114

0.1uF

R10110K_1%

R8810K_1%

J9

CON_MUSB-B_5_F

VBUS1

D+3D-2

ID4

SH1

6

GND5

SH49

SH38

SH2

7

SH6

11

SH5

10

C102

0.1uF

D10

TPD1E10B06DPY

21

C105

4.7uF

C108

0.1uF

R7247E_1%

LD4

SML-P11MTT86

21

C101

10uF

C1170.01uF

R7347E_1%

C106

0.1uF

R90 0E_1%

DNI

C109

0.1uF

R681K

R81 2.2K_1%

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

MICRO SD CARD & LEVEL TRANSLATOR

SPI FLASH

OLED DISPLAY

OSD9616P0992-10

Note:-Supervisory Circuit added for meeting OLED specificationsCheck power up sequence shown in page 6

I2C Address : 0x3C

C2PC2NC1PC1N

IREFVCOMH

VCC

SD0_DAT2SD0_DAT3SD0_CMD

SD0_CLK

SD0_DAT0SD0_DAT1

RESET#_OLED

SD0_DAT3SD0_DAT2

SD0_CMDSD0_CLK

SD0_DAT1SD0_DAT0

SD_TLR_EN

GND_SDCDDGND

GND_SDCD

DGND

DGND

VCC3V3

DGND

VCC3V3

DGND

DGND DGND DGND

VCC1V8

VCC1V8

DGND

DGND

VCC1V8

DGND

VCC1V8

VCC1V8

DGNDDGND

VCC1V8

DGND

DGNDDGNDDGND

VCC3V3VCC1V8

DGND DGND

VCC1V8

DSP_I2C_SCL8,9,10DSP_I2C_SDA8,9,10

DSP_SPI_TX8,11

DSP_SPI_CLK8,11

DSP_SPI_RX8,11

DSP_SPI_CS08

RESET#_AND 8,10,11,13

DSP_SDCD8

DSP_SD0_DAT28DSP_SD0_DAT38DSP_SD0_CMD8DSP_SD0_CLK8

DSP_SD0_DAT08DSP_SD0_DAT18

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

OLED, MICROSD CARD & SPI FLASH

C

Friday, September 16, 2016 1514

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

OLED, MICROSD CARD & SPI FLASH

C

Friday, September 16, 2016 1514

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

OLED, MICROSD CARD & SPI FLASH

C

Friday, September 16, 2016 1514

C66

1uF

R34

100K

DNI

D6

TPD1E10B06DPY

21

R9710K_1%

R116820K_1%

C64

0.1uF

R105

10K_1%

U8

MX25R1635FM1IL0

CS1

SO/SIO12

WP/SIO23

GND

4

SI/SIO05

SCLK6 RESET/SIO3/HOLD/SIO3

7

VCC

8

C650.1uF

R109 10K_1%

C147

0.1uF

C57

4.7uF

C63

1uF

C56

0.1uF

U29

TPS3125J18DBVT

RESET1

GND

2

RESET3

MR4

VDD

5

C135 1uF

C72 0.1uF

J11

CON_FLEX_1X14_10051922

11

22

33

44

55

66

77

88

99

1010

1111

1212

1313

1414

C59 0.1uF

J3

CON_SDCARD_8_DM3AT-SF-PEJM5

CMD3

VDD4

CLK5

VSS6

DAT07

DAT18

DAT21

CD/DAT32

CD19

CD212

1010

1111

1313

1414

R119

10K_1%

R321K

R107

10K_1%

FB3

120E

R10810K_1%

U142

TXS0108EPWR

VCCA

2

OE10

GND

11

VCCB

19

A11

A23

A34

A45

A56

A67

A78

A89

B120

B218

B317

B416

B515

B614

B713

B812

C68

2.2uF

R31100K

C67

0.1uF

R30100K

C136

4.7uF

C134 1uF

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

5V TO 1.8V SUPPLY

5V TO 3.3V SUPPLY

ON / OFF Switch

3.3V TO 1.3V SUPPLY

GREEN

PG_3P3

SW_LC_3V3

EN_1P8

SW_LC_1V8

PG_1P8

FB_1P3

PG_1P8

VCC3V3

VCC1V8VCC5V0

DGNDDGNDDGNDDGND DGND DGND

DGNDDGNDDGNDDGNDDGNDDGND

DC_5V_IN

VCC5V0

VCC5V0

DGNDDGND DGND

VCC3V3VCC1V3

DGNDDGNDDGND

VCC1V8

DGND

1V3_PWRGD 8

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

POWER SUPPLY

C

Friday, September 16, 2016 1515

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

POWER SUPPLY

C

Friday, September 16, 2016 1515

Title

Size Document Number Rev

Date: Sheet of

Project : Designed for TI by Mistral Solutions Pvt Ltd

BOOST5545ULPMS_TI_C5545BP_SCH_REVC_PRODUCTION C

POWER SUPPLY

C

Friday, September 16, 2016 1515

L12.2uH

R125

100K

SW6

EG-1218

31 2

TP5

U21

TPS62161DSGT

PGND

1

VIN2

EN3

AGND

4

FB5

VOS6

SW7

PG8

EP

9

R1451K

TP9SMD

C142

0.1uF

C125

0.1uF

C123

0.1uF

LD5

SML-P11MTT86

21

TP3

TP7

TP8

R120169K_1%

L22.2uH

TP4

C122

10uF

C127

0.1uF

TP6

U20

TPS62162DSGT

PGND

1

VIN2

EN3

AGND

4

FB5

VOS6

SW7

PG8

EP

9

R12210.7K_1%

C126

10uF

C129

0.1uF

C124

22uF

C128

22uF

R112 100K

U22

TPS76601DGND

3

EN4

IN15

IN26

OUT17

OUT28

PG2

NC/FB1

C62

4.7uF R9510K_1%

R110 100K

C61

4.7uF

R113

10K_1%

STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES1. Delivery: TI delivers TI evaluation boards, kits, or modules, including demonstration software, components, and/or documentation

which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the termsand conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions.1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. Forclarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditionsset forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or productionsystem.

2 Limited Warranty and Related Remedies/Disclaimers:2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software

License Agreement.2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatmentby an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in anyway by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications orinstructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or asmandated by government requirements. TI does not test all parameters of each EVM.

2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during thewarranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects torepair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shallbe warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) daywarranty period.

3 Regulatory Notices:3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kitto determine whether to incorporate such items in a finished product and software developers to write software applications foruse with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unlessall required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not causeharmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit isdesigned to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority ofan FCC license holder or must secure an experimental authorization under part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTIONThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may causeundesired operation.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.

FCC Interference Statement for Class A EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.

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FCC Interference Statement for Class B EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, whichcan be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210

Concerning EVMs Including Radio Transmitters:This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that maycause undesired operation of the device.

Concernant les EVMs avec appareils radio:Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationest autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doitaccepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna typeslisted in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.

Concernant les EVMs avec antennes détachablesConformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotroperayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Leprésent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antennenon inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur

3.3 Japan3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certifiedby TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law ofJapan to follow the instructions below with respect to EVMs:1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japanwith respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けていないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ

ンスツルメンツ株式会社東京都新宿区西新宿6丁目24番1号西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

SPACER4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOTLIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handlingor using the EVM, including without limitation any warning or restriction notices. The notices contain important safety informationrelated to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user

guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to inputand output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TIfield representative prior to connecting interface electronics including input power and intended loads. Any loads appliedoutside of the specified output range may also result in unintended and/or inaccurate operation and/or possiblepermanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting anyload to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may becomevery warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronicand/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safelylimit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes allresponsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and localrequirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurateas possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites asaccurate, complete, reliable, current, or error-free.

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6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THEDESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANYTHIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS ANDCONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANYOTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRDPARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANYINVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OFTHE EVM.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATIONSHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANYOTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HASBEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITEDTO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODSOR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALLBE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATIONARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVMPROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDERTHESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCEOF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS ANDCONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2016, Texas Instruments Incorporated

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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products ApplicationsAudio www.ti.com/audio Automotive and Transportation www.ti.com/automotiveAmplifiers amplifier.ti.com Communications and Telecom www.ti.com/communicationsData Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computersDLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-appsDSP dsp.ti.com Energy and Lighting www.ti.com/energyClocks and Timers www.ti.com/clocks Industrial www.ti.com/industrialInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Security www.ti.com/securityPower Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defenseMicrocontrollers microcontroller.ti.com Video and Imaging www.ti.com/videoRFID www.ti-rfid.comOMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.comWireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2016, Texas Instruments Incorporated