CANON ANELVA PVD Equipments

Packaging PVD Equipment

Semiconductor PVD Equipment

Low Resistivity W metalwith VHF ionized PVD

— Deposition on Resin and Glass

— High Adhesive and High Reliable

— Board Cooling function

DRAM

PVD Cu seed process for WLP/PLP and Interposer

Resin

Low temp degas Ti/Cu metal deposition EL3400

Resin

Surface Treatment

Resin

Plasma Sputtering particles

Cluster PVD equipment for Semiconductor industry

Process ModulesMagnetron PVD (CAELA)

VHF ionized PVD (PCM)

Long Throw PVD

Collimate PVD

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ApplicationsW stacked DRAM conductive wire

Ti/TiN, Al/Ti, Co Silicide

TiN Hard Mask

UBM for Package

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CANON ANELVA CORPORATION

13.4

8.3

6

8

10

12

14

16

18

20

STD PVDMagnetron PVD

PCMVHF ionized PVD

Resi

stiv

ity [

cm]

38% reduction200nm

19.3g/cm3

Larger W Grain Size

1

4

2’

3

2