CCPD/HVCMOS status

CCPD/HVCMOS status Mathieu Benoit, Dominik DannheimSummary CCPD PCB was produced by Ivan Peric and assembled here at CERN Card digital and analog part have been tested and work correctly One card got broken after a repair, we plan to cable one more to fit with the two assemblies we have

Special Timepix card to couple to the CCPD card is being design and should soon go into production

Timepix ASICCCPD ASIC

Detector Assembly

CCPD_Timepix Card

Wire BondingCCPD CardTimepix CardSide ViewTimepixHV-CMOS

Pad connected to InjectionTimepix PadsDetector Assembly

CCPD Coupling to Timepix Chip

Issue encountered2 Chip glued to Timepix were provided by Ivan PericFirst chip presented weird power consumption and has shown to be unprogrammableSecond chip worked as expected, Pulse injection and stimulation by Sr90 source could be seen in the Timepix Was working fine before our departure for DESY , wire-bonds were damaged at our returnChip was rebonded but acording to Ian, the bonding pad on chip are not suitable for rebonding After rebonding , a shortcut seems to exist within the chip

Next plan is to procure more chip from Ivans other partner (ATLAS) to glue on the same Timepix assembliesMechanical stability and length of the bonding seems to be an issue, we could modify a bit the single chip card design to get the board closer to the chip Grounding in between the board could shared in the next version