cedm activities
TRANSCRIPT
CEDM ACTIVITIESIMPROVING THE RELIABILITY OF ELECTRONICS
GEERT WILLEMS
CEDM EVENT 2014
2
© IMEC 2014
CONTENT
1. cEDM: “The State of the Center”
2. Collective R&D: VIS-traject Prosperita
3. Improving Electronics’ Reliability
3
© IMEC 2014
CEDM EXPERTISE
▸ PBA – PCB – Packaging technology & reliability
▸ Design-for-Excellence: Manufacturability, Reliability, Test, Cost,...
▸ Over a century of electronics industry experience
Design – Industrialization – Production – Quality
▸ More than 50 years of electronics research expertise
4
© IMEC 2014
To support industry in the development of high quality, reliable
and cost-effective electronic modules (PBA) by means of knowledge
creation and sharing, scientifically sound methodologies and
collaboration throughout the electronic supply chain.
Collective
•Awareness creation
• Design Guidelines
• PBA development tools
• Seminars - training
Bilateral
• Consultancy
• Knowledge transfer
• Implementation
•Training
Better electronics at reduced cost through
science based design & production methodologies.
THE CEDM MISSION
4
5
© IMEC 2014
1. CEDM: “STATE OF THE CENTER”
cEDM is doing well!New members
Expanded offering
International collaboration
New projects
A larger team
6
© IMEC 2014
19 cEDM partners
I. CEDM PARTNERS
7
© IMEC 2014
1. MEMBERS
Over 130 companies
& organizations in
cEDM community
42 members
61 ass. MembersAnritsu A/S Lego System A/S
Asetek A/S Lodam electronics a/s
Bang & Olufsen A/S Lyngsø Marine A/S
Bang & Olufsen Medicom A/S MAN Diesel & Turbo
bb electronics A/S Micronsult
B-K Medical A/S Motorola Solutions A/S
Bolls Rådgivning NKT Photonics A/S
BOMBERG & CO. APS Novo Nordisk A/S
Brüel & Kjær Sound & vibration
measurement A/SO.J. Electronics A/S
Contex A/S Oticon A/S
Cryptera A/S PR Electronics A/S
Danfoss A/S Qualcon
Danfoss Power Electronics A/S Radiometer Medical A/S
Dansensor A/S Schneider Electric IT Denmark ApS
DEIF A/S Selektro A/S
DELTA Dansk Elektronik, Lys & Akustik Skaanning Quality & Certification
Emerson Climate TechnologiesSP Sveriges Tekniske
Forskningsinstitut A/S
Flextronics International Denmark A/S TDC A/S
Focon Electronic Systems A/S TERMA A/S
Foss Analytical A/S Thrane & Thrane A/S
Glunz & Jensen A/S UL International Demko A/S
GN A/S Unomedical A/S
GN Netcom A/S VELUX A/S
GN ReSound as Vestas Wind Systems A/S
Grundfos A/S Vestas Control Systems A/S
Gåsdal Bygningsindustri A/S Widex A/S
HIN Horsens A/S Ørsted-DTU (Associeret medlem)
Hybrico A/S Kongsberg Defence & Aerospace
Kamstrup A/S Secop GmbH
DeLaval International AB LaboTest AB
Gambro Lundia AB Tetra Pak Packaging Solutions AB
ADB airfield solutions
Adeon Software House (NL)
Agfa Gevaert
AimValley BV (NL)
Alcatel Lucent
Atlas Copco
ATOS Worldline
Autojet Technologies
AW Europe
Barco Kortrijk
Barco Silex
Benchmark (NL)
Cassidian
C-MAC
Dekimo
EnergyICT
ETAP
FEI (NL)
Grammer EiA Electronics
Halliburton
HMC International
Jabil Hasselt
Melexis Tessenderlo
Nexans
Niko
Ninix Technologies
OIP
OneAccess
OSRAM (I)
Prodrive (NL)
Protonic (NL)
Quad Industries
Septentrio
Renson Ventilation
Roam Chemie
SABCA
Solumatics
Taipro Engineering
Thales Belgium
TP Vision
Tremec
Tyco Electronics Oostkamp
© IMEC 2014
1. CEDM’S CROSS-DISCIPLINARY TEAM
Geert Willems – Group leader (1/7/2005)
- Dr. ir. Electronics Engineering - PhD
- 10 years research in micro-electronics: SOI, Integrated Ferro-electrics
- 10 years industrial experience: PBA technology, assembly, NPI
- 10 years of Design-for-Excellence consultancy
Alain Carton – Technical and Operations support (15/1/2008)
- Ing. Electronics Engineering
- >15 years of industrial PCB/PBA design experience
- IPC certified: CID – IPC-A-600 & IPC-A-610 inspector
Wesley Van Meensel – PBA information engineering (26/4/2010)
- ir. Chemical Engineering
- >3 years experience in PBA industrialisation and related automation
- Our IT & software wizard
Filip Ponsaerts – cEDM operations (18/7/2011)
- Ing. Electronics Engineering – Computer Science
- Master in Multi-Media Technology and Virtual Reality
- 10 years experience in electronics design
- 10 years experience in design, R&D and Q management in large and small enterprises.
8
© IMEC 2014
Boris Leekens – PCB/PBA DfX – Industrial projects (14/9/2011)
- Ing. Electronics engineering - MBA
- 20 years industrial experience in electronic assembly:
Functional test engineering, NPI project management and account management.
Bart Vandevelde – R&D project leader (1/4/2013)
- Dr. ir. Mechanical Engineering – PhD
- Package and PBA Reliability & Thermal Management of Electronic Systems
- Thermo-mechanical modeling and simulation
Riet Labie – R&D project leader (1/2/2014)
- Dr. ir. Material Science – PhD
- > 15 years research experience: Materials, Process Technology, Reliability, Failure
Analysis, Photo-Voltaics
Jan Bienstman – R&D project leader (10/3/2014)
- Dr. ir. Electronics engineering – PhD
- > 20 years experience in electromechanical micro systems design and modeling
- Multi-physics modeling and simulation - Packaging
Bridging the gap between research and industry
9
1. CEDM’S CROSS-DISCIPLINARY TEAM
10
© IMEC 2014
1. NEW WEBSITE
11
© IMEC 2014
1. SPM COLLABORATION
For cEDM partners & members:
Free access to SPM reports and
SPM member webpages.
SPM is an association with
focus on electronics design,
production and testing that
establishes and maintains
professional networks,
disseminates information
and knowledge, and looks at
future technologies.
2. COLLECTIVE R&DVIS TRAJECT PROSPERITA 2011-2014
PBA realization: DfM-DfT
D0: Good Design-for-X Practice
D1: PCB Specification
D2: Component Specification
D3: Assembly material
D4: Design-for-Assembly
D5: PCB density classes
D6: PCB Layout
D7: Design-for-Test
D8: PBA Passport
D9: Signal Integrity
D10: Power integrity
PBA integration
I1: Mechanical interaction
I2: Thermal interaction
I3: EMC interaction
12
Free accessible for
cEDM partners and members
13
© IMEC 2014
2. COLLECTIVE R&DVIS TRAJECT PROSPERITA: LAST QUARTER FOCUS
PCB thermal resistance model
- Fast evaluation of component T and ΔT
- Connectable to component thermal resistance model
Q
3D model2D 2D1D 1D
f(Sh
ape)
PCB
Environment
14
© IMEC 2014
71.6
16.9
6.9
0.5 4.00.1
PBA flow distribution
First Pass Yield
2 pass Manu. T./1 pass Func. T.
1 pass Manu. T./2 pass Func. T.
2 pass Manu. T./2 pass Func. T.
Unpredictableoutcome
Scrap
2. COLLECTIVE R&DVIS TRAJECT PROSPERITA: LAST QUARTER FOCUS
Assembly model and DfA evaluator
- Design impact on assembly flow and efficiency
- Integration in Bill of Materials
Product Input
Process Parameters
Virtual Assembly Line
31.7
73.3
20.27
95.9
95.8
96.8
34.3
58.2
75.0
80.0
50.00
98.0
83.3
95.2
70.0
75.0
SMD assemblyratio
Assemblyproductivity
Trouble-shootburden
Loss riskfraction
Assemblyoverhead
SMD lineoverhead
SMD line eff.top
SMD line eff.bottom
PBA Design KPI KPITarget
15
© IMEC 2014
2. COLLECTIVE R&DVIS TRAJECT PROSPERITA: LAST QUARTER FOCUS
Lay-up Load Lamin. Un-load De-stack
𝑡𝑙𝑎𝑚𝑖𝑛 = 3(𝑡𝑝𝑙𝑎𝑐𝑒+𝑡𝑐𝑜𝑙𝑙𝑒𝑐𝑡) + 𝑡𝑃_𝑝𝑢𝑛𝑐ℎ + 𝑡𝑃_𝑡𝑟𝑒𝑎𝑡 +𝑡𝑃_𝑙𝑎𝑦𝑢𝑝
#𝑝𝑎𝑛𝑒𝑙𝑠/𝑠𝑡𝑎𝑐𝑘+
𝑡𝑙𝑜𝑎𝑑_𝑙𝑎𝑚𝑖𝑛
#𝑝𝑎𝑛𝑒𝑙𝑠/𝑐𝑦𝑐𝑙𝑒
+𝑡𝑃_𝑙𝑎𝑚𝑖𝑛
#𝑝𝑎𝑛𝑒𝑙𝑠/𝑐𝑦𝑐𝑙𝑒+
𝑡𝑢𝑛𝑙𝑜𝑎𝑑_𝑙𝑎𝑚𝑖𝑛
#𝑝𝑎𝑛𝑒𝑙𝑠/𝑐𝑦𝑐𝑙𝑒+
𝑡𝑃_𝑑𝑒𝑠𝑡𝑎𝑐𝑘
#𝑝𝑎𝑛𝑒𝑙𝑠/𝑠𝑡𝑎𝑐𝑘+ 𝑡𝑃_𝑐𝑢𝑡
Place
panelCut edge
Collect
panel
𝑡𝑃_𝑙𝑎𝑚𝑖𝑛 =f(material)
Stack name Process step
Stack 1A & 1B Image - top
Image - bottom
Etch Cu
Strip image
Stack 2 Lamination prepreg (1)
Stack 3 Mechanical drill
Electroless plate + flash
Image - top
Image - bottom
Plating Cu
Strip image
Stack 4 Lamination buildup
Stack 5 Laser drill (top)
Laser drill (bottom)
Mechanical drill
Etc...
PCB manuf. model & DfM evaluator• Design impact on PCB manufacturing
• PCB module
Lamination model
16
© IMEC 2014
2. COLLECTIVE R&DAFTER VIS TRAJECT PROSPERITA
cEDM will keep on updating and
disseminating guidelines and tools▸ Free access for partners and members
▸ Accessible through www.cedm.be
▸ Offline tool availability
▸
▸ Consultancy and training
17
© IMEC 2014
2. COLLECTIVE R&DAFTER VIS TRAJECT PROSPERITA
VIS-traject Prosperita+ - 2 year extension▸ High density - high power/current – high speed PCB
▸ Flex and Flex-Rigid PCB
▸ Material identification on PBA (GreenElec)
▸ Coating and potting
▸ EMC/SI cabling
▸ System integration of electronics
18
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
Reliability challenge!
19
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
Why is reliability going down?- Dominating consumer oriented supply chain focused on
performance at lowest cost, not quality nor reliability.
- Highly complex, fragmented supply chain.
- New materials that have negative reliability impact: lead-free solder
and finishes, low CTE mold compounds, halogen-free,...
- Historical failure data is obsolete. Experienced based lifetime
prediction is flawed. Constant failure rate based reliability
assessment is obsolete (useful life MTTF/MTBF).
- Knowledge of Physics-of-Failure and the impact of design is missing.
- More and more electronics in “less benign” operational conditions.
20
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
Is automotive doing better?
21
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
Impact of material changes: lead-free solder
- Lead-free terminal finishes:
- Higher soldering temperatures
- Higher stress on solder joint surroundings
- More brittle PCB
Pad crateringTrack failureNiAu interface failureVia cracking
whiskers
22
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
Impact of material changes: low CTE mold compounds
Si die: ~ 3 ppm/KCu leadframe: ~ 17 ppm/K
PCB: ~ 15 - 17 ppm/K
Mold
compound
15 ppm/K
7ppm/K
>85% silica
23
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
Drivers:
Green: halogen-free & flame retardant
Lead-free: low MSL
Low cost
- High penetration level of highly filled MC
- All plastic components: SOIC, TSOP, QFN, BGA,...
- Customer notification is MISLEADING!
Solder joint reliability was not considered!?
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
Q1
2005
Q3
2005
Q1
2006
Q3
2006
Q1
2007
Q3
2007
Q1
2008
Q3
2008
Q1
2009
Q3
2009
(from a leading semiconductor supplier)
50%
24
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
Impact of mold CTE: Life time (11ppm BGA) ~ 2.2 * Life time (8.5ppm BGA)
Impact of mold CTE is far greater than the chosen solder composition
2.4 mm PCB
BGA225
12x12 mm
0.5 mm pitch
25
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
Heavily damaged solder joint especially at the corner/edge
area indicative for a large mismatch
2.4 mm PCB
0°C 100°C
2.4 mm PCB
26
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
QFN’s with 7ppm/°C: (almost) all failed after 2000 cycles
QFN’s with 12 ppm/°C: no failures after 2000 cycles
QFN64
9x9 mm
0.5 mm pitch
27
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
QFN64
9x9 mm
0.5 mm pitch
28
© IMEC 2014
0
1000
2000
3000
4000
5000
6000
5 10 15 20
MT
TF
(cycle
s)
CTE of mould compound (ppm/°C)
0.8 mm
1.6 mm
2.4 mm
No PCBflexing
Low CTE
0 to 100˚C
cycling
PBGA 27x27 area array
1.27mm pitch
SAC
Solder
3. IMPROVING ELECTRONICS RELIABILITY
29
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
Conclusion:
Without proper Design-for-Reliability you cannot
assume that electronics will exceed consumer grade
lifetimes (2-3y) and have lower than consumer grade
failure rates (>>10%).
Unacceptable reliability for professional, industrial,
automotive and other high reliability applications.
30
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
What to do?▸ Understand the Physics-of-Failure
▸ Identify the failure determining factors:
- The stressors e.g. thermal mismatch
- The failure mechanism: fatigue, brittle fracture,...
- The resistance to failure: material properties
▸ Quantification of the stress as a function of:
- Materials
- Dimensions & configuration
- Environmental and operational conditions
31
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
What to do? Quantifying stress levels
0.33%SAC
1.37%SnPb
BGA: same conditions
J.-P. Clech
32
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
What to do? Quantifying stress levels▸ Proper calculation of induced solder strain
▸ Taking into account package and PCB flexibility
▸ Analyticaly: f(design parameters, oper. conditions)
33
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
Understanding Physics-of-Failure: a major opportunity
for faster and lower cost product development
34
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
cEDM actions▸ Research partner in IWT O&O Rev-Up (started)
Review and Upgrading Reliability Testing
▸ Research partner in ICON Compact (submitted)Failure modeling and PoF integration in automotive product
development. (with SOC Maakindustrie: Flanders Drive + FMTC)
▸ Re-submission of VIS-traject InProVoLIntelligente Producten met Voorspelbare Levensduur
DfR Guidelines, tools, workshops, training,...
You can join the consortium – more info at cEDM
35
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
Bringing WW know-how to your doorstep
iNEMI (www.inemi.org)
▸ Project lead
“Low CTE Mold Compound”
Alcatel-Lucent, Delphi, DfR Solutions,
Flextronics, Fraunhofer, imec, Sagem,
Winstron
▸ New project on
Automotive Electronic Material Challenges
36
© IMEC 2014
3. IMPROVING ELECTRONICS RELIABILITY
Bringing WW know-how to your doorstep
Collaboration with SPM
Member of IPC
Member of PLOT
Member of iMAPS